OLED display panel and manufacturing method thereof

Abstract

The present invention relates to the technical field of display devices, and more specifically, to an OLED display panel and a method for manufacturing the same. The OLED display panel includes a display area defined on a substrate and a blind hole area located in the display area, wherein the display area includes: a driving circuit arranged on the substrate; a light-emitting layer arranged above the driving circuit; the blind hole area includes: an opening; a wiring arranged on the substrate and surrounding the opening; a light-shielding layer arranged above the wiring, wherein the wiring and the light-shielding layer are respectively located in the same film layer as part of the driving circuit. The present invention achieves a complete blocking effect on external stray light by arranging the light-shielding layer above the wiring in the blind hole area; and by arranging the wiring and the light-shielding layer in the same film layer as part of the driving circuit, the light-shielding layer is simultaneously manufactured during the manufacturing process of the driving circuit on the substrate, i.e., by utilizing the array substrate manufacturing process, thereby simplifying the manufacturing process of the OLED display panel.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to an OLED display panel and a manufacturing method thereof. Background Art

[0002] In an OLED (Organic Light-Emitting Diode) display panel, a camera is accommodated through a blind hole opened in the display area. A wiring area is set around the blind hole; a light-shielding metal layer is set on the surface of the encapsulation glass used to encapsulate the display module, corresponding to the position of the wiring area; the light-shielding metal layer is used to prevent external light from affecting the lighting of the camera.

[0003] However, it was found in actual use that some external light still bypasses the light-shielding metal layer and shines onto the wiring area, and then scatters into the camera, interfering with the camera's lighting. In addition, a touch film layer needs to be set above the surface of the encapsulation glass, so the compatibility of the light-shielding metal layer and the touch film layer needs to be considered, which increases the difficulty of the OLED display panel manufacturing process.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of this, the present invention provides an OLED display panel and a manufacturing method thereof, which can achieve a complete blocking effect on external stray light and simplify the manufacturing process of the OLED display panel.

[0006] One aspect of the present invention provides an OLED display panel, comprising a display area defined on a substrate and a blind hole area located in the display area, wherein the display area comprises: a driving circuit arranged on the substrate; a light-emitting layer arranged above the driving circuit; the blind hole area comprises: an opening; a wiring arranged on the substrate and surrounding the opening; a shading layer arranged above the wiring, wherein the wiring and the shading layer are respectively located on the same film layer as part of the driving circuit.

[0007] In some embodiments, the blind hole region further includes: a photoresist, which is disposed between the light shielding layer and the wiring, on the upper surface of the light shielding layer, and on the side surfaces of the light shielding layer and the wiring.

[0008] In some embodiments, the blind hole area is flush with the display area in a height direction; the OLED display panel further includes: encapsulation glass covering the display area and the blind hole area.

[0009] In some embodiments, the OLED display panel further includes: a touch layer disposed on the upper surface of the encapsulation glass.

[0010] In some embodiments, the OLED display panel also includes: a polarizing layer, which is arranged on the upper surface of the touch layer, and the touch layer and the polarizing layer are provided with hollow structures at positions corresponding to the openings, and the hollow structures are filled with transparent optical glue; and a cover glass, which is bonded to the upper surface of the polarizing layer by transparent optical glue.

[0011] In some embodiments, the OLED display panel further includes: a camera, corresponding to the blind hole area, disposed on a side of the substrate away from the display area, and the lens group of the camera is in the light-transmitting area of ​​the opening.

[0012] In some embodiments, the light shielding layer is formed as an indium tin oxide-silver-indium tin oxide composite film.

[0013] In some embodiments, the substrate is formed as a low temperature polysilicon thin film transistor array substrate.

[0014] Another aspect of the present invention provides a method for manufacturing an OLED display panel, comprising: providing a substrate, on which a display area and a blind hole area located in the display area are defined, and the blind hole area is formed with an opening; performing a patterning process on the substrate to form a driving circuit located in the display area, a wiring located in the blind hole area and surrounding the opening, and a shading layer located above the wiring, and the wiring and the shading layer are respectively formed in the same film layer as part of the driving circuit; and forming a light-emitting layer above the driving circuit.

[0015] In some embodiments, the patterning process includes multiple photolithography steps; the formation of the routing is earlier than the formation of the driving circuit; in a photolithography step after the routing is formed, the driving circuit continues to be formed in the display area, and the shading layer is formed in the blind hole area at the same time.

[0016] In some embodiments, a light resist is retained between the light shielding layer and the wiring; and a light resist is formed on an upper surface of the light shielding layer and on sides of the light shielding layer and the wiring.

[0017] In some embodiments, each of the photolithography steps includes: depositing a thin film in a preset area; coating a photoresist on the upper surface of the thin film, exposing and developing the photoresist through a mask with a preset pattern to form a photoresist layer with the preset pattern; etching the thin film not covered by the photoresist layer; and peeling off the photoresist layer to form a thin film layer with the preset pattern.

[0018] In some embodiments, after the light-emitting layer is formed, the display area is flush with the blind hole area in the height direction; the manufacturing method further includes: forming encapsulation glass above the display area and the blind hole area.

[0019] The beneficial effects of the present invention compared with the prior art include at least:

[0020] The light shielding layer is set above the wiring in the blind hole area to completely block the external stray light. The external stray light cannot bypass the light shielding layer to illuminate the wiring, so the hole is opened without light leakage, avoiding interference with the camera lighting.

[0021] By locating the wiring and the shading layer in the same film layer as part of the driving circuit, the shading layer can be manufactured simultaneously during the process of manufacturing the driving circuit on the substrate, that is, by utilizing the array substrate manufacturing process, thereby simplifying the manufacturing process of the OLED display panel; and the array substrate manufacturing process and the touch control design are independent of each other, which is conducive to the diversity of the touch control design.

[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present invention, and together with the specification are used to explain the principles of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0024] Figure 1 A schematic diagram showing the structure of an OLED display panel in one embodiment of the present invention is shown;

[0025] Figure 2 A schematic diagram showing a partial enlarged structure of a blind hole area in one embodiment of the present invention is shown;

[0026] Figure 3 A schematic diagram showing the structure of an OLED display panel in another embodiment of the present invention is shown;

[0027] Figure 4 A schematic diagram showing the steps of a method for manufacturing an OLED display panel in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein. Instead, these embodiments are provided to make the present invention comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art.

[0029] The accompanying drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated description will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0030] In addition, the processes shown in the accompanying drawings are only exemplary and do not necessarily include all the steps. For example, some steps can be decomposed, some steps can be combined or partially combined, and the actual execution order may change according to the actual situation. It should be noted that the embodiments of the present invention and the features in different embodiments can be combined with each other without conflict.

[0031] Figure 1 The main structure of an OLED display panel in an embodiment is shown, referring to Figure 1 As shown, the OLED display panel in this embodiment includes a display area 100 defined on a substrate 1 and a blind hole area 200 located in the display area 100, and the display area 100 includes: a driving circuit 11, which is arranged on the substrate 1; a light-emitting layer 12, which is arranged above the driving circuit 11; the blind hole area 200 includes: an opening 21; a wiring 22, which is arranged on the substrate 1 and surrounds the opening 21; a shading layer 23, which is arranged above the wiring 22, and the wiring 22 and the shading layer 23 are respectively located in the same film layer as part of the driving circuit 11.

[0032] The driving circuit 11 is manufactured through the array substrate process technology. The wiring 22 and the shading layer 23 are respectively located in the same film layer as part of the driving circuit 11. The structural design can realize the process of manufacturing the driving circuit 11 on the substrate 1, that is, using the array substrate process technology, and simultaneously completing the manufacturing of the shading layer 23, thereby simplifying the process of the OLED display panel.

[0033] The array substrate manufacturing process specifically includes multiple photolithography steps, and the driving circuit 11 is formed by stacking multiple layers, which will be specifically described below in conjunction with the manufacturing method of the OLED display panel. The formation of the light shielding layer 23 only requires adding a pattern corresponding to the blind hole area 200 suitable for forming the light shielding layer 23 to the mask design in a certain photolithography step of the array substrate manufacturing process. That is, the wiring 22 and the light shielding layer 23 are respectively located in the same film layer as part of the driving circuit 11, specifically referring to the formation of the wiring 22 and the formation of part of the driving circuit 11, and the formation of the light shielding layer 23 and the formation of part of the driving circuit 11, using the same-pass photolithography process, and the same-pass photolithography process may include one or more photolithography steps.

[0034] In one embodiment, the driving circuit 11 may use a low temperature polysilicon (LTPS) type thin film transistor (TFT), so that the substrate 1 is formed as a low temperature polysilicon thin film transistor (LTPS-TFT) array substrate.

[0035] The light-emitting layer 12 specifically includes a light-emitting material layer, an auxiliary light-emitting layer (such as a hole transport layer, an electron transport layer, etc.) and a cathode material layer. The light-emitting layer 12 and the driving circuit 11 form a light-emitting device.

[0036] The blind hole area 200 is used to set the camera 3. Specifically, the camera 3 corresponds to the blind hole area 200, and is set on the side of the substrate 1 away from the display area 100, that is, below the substrate 1, and the lens group of the camera 3 (not specifically shown in the figure) is in the light-transmitting area of ​​the opening 21. The structural design that the light shielding layer 23 is set above the wiring 22 in the blind hole area 200 can achieve a complete blocking effect on external stray light; external stray light cannot bypass the light shielding layer 23 to irradiate the wiring 22, thereby avoiding interference with the lighting of the camera 3 and achieving no light leakage in the opening 21 area.

[0037] Below the substrate 1 , a foam structure 31 is disposed around the blind hole area 200 , and the pore size of the foam structure 31 is slightly larger than that of the blind hole area 200 .

[0038] The wiring 22 is also formed by the array substrate manufacturing process. In fact, the wiring 22 is also a part of the driving circuit structure of the OLED display panel, that is, the driving circuit 11 arranged in the display area 100 and the wiring 22 arranged in the blind hole area 200 are formed on the substrate 1 by the array substrate manufacturing process. The specific circuit structures of the driving circuit 11 and the wiring 22 are different, and the required photolithography steps are also different, which will be specifically described in conjunction with the manufacturing method of the OLED display panel below. Generally, the specific circuit structure of the wiring 22 is simpler than the specific circuit structure of the driving circuit 11, so the photolithography steps required to make the wiring 22 are less than the photolithography steps required to make the driving circuit 11; thus, by using the photolithography steps of continuing to make the driving circuit 11 after making the wiring 22, the production of the light shielding layer 23 can be achieved simultaneously.

[0039] Figure 2 FIG. 2 shows a partially enlarged structure of the blind hole region 200 in one embodiment, specifically: Figure 1 The enlarged structure of the 200a region is shown in the dotted box. Figure 2As shown, the blind hole area also includes: a photoresist 24, which is arranged between the light shielding layer 23 and the wiring 22, on the upper surface of the light shielding layer 23, and on the side surfaces of the light shielding layer 23 and the wiring 22. The light shielding layer 23 is specifically formed as an indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO) composite film.

[0040] In other embodiments, the light shielding layer 23 may also be formed as other metal material layers as long as the light shielding effect can be achieved.

[0041] Further, continue to refer to Figure 1 , the blind hole area 200 is flush with the display area 100 in the height direction; the OLED display panel further includes: an encapsulation glass 4, covering the display area 100 and the blind hole area 200. In this embodiment, the light shielding metal layer design on the surface of the encapsulation glass 4 is reduced, so there is no need to consider the compatibility with the touch design on the surface of the encapsulation glass 4, which can simplify the manufacturing process of the OLED panel, and realize the independence of the array substrate manufacturing process and the touch design, which is conducive to the diversity of touch design.

[0042] Figure 3 The main structure of the OLED display panel in another embodiment is shown, referring to Figure 3 As shown, in this embodiment, the OLED display panel further includes:

[0043] The touch layer 5 is disposed on the upper surface of the packaging glass 4 .

[0044] The polarizing layer 6 is disposed on the upper surface of the touch layer 5 . A hollow structure is disposed at the position of the touch layer 5 and the polarizing layer 6 corresponding to the opening 21 . The hollow structure is filled with a transparent optical adhesive 7 .

[0045] The cover glass 8 is bonded to the upper surface of the polarizing layer 6 by transparent optical adhesive 7 .

[0046] Of course, the structure of OLED display panels is not limited to Figure 3 As shown, for example, in one embodiment, the structure and position of the touch layer 5 can be adjusted as needed.

[0047] The embodiment of the present invention also provides a method for manufacturing an OLED display panel, which can be used to manufacture the OLED display panel of any of the above embodiments. The features and principles of the OLED display panel described in any of the above embodiments can be applied to the following manufacturing method embodiments. In the following manufacturing method embodiments, the features and principles of the OLED display panel that have been explained will not be repeated.

[0048] Figure 4 The main steps of a method for manufacturing an OLED display panel in an embodiment are shown. The manufacturing method of this embodiment can be used to form Figure 1 The OLED display panel shown, combined with Figure 1 and Figure 4 As shown, the manufacturing method of the OLED display panel in this embodiment includes:

[0049] In step S410 , a substrate 1 is provided. A display area 100 and a blind hole area 200 located in the display area 100 are defined on the substrate 1 . An opening 21 is formed in the blind hole area 200 .

[0050] In step S420, a patterning process is performed on the substrate 1 to form a driving circuit 11 located in the display area 100, a wiring 22 located in the blind hole area 200 and surrounding the opening 21, and a shading layer 23 located above the wiring 22, and the wiring 22 and the shading layer 23 are respectively formed in the same film layer as part of the driving circuit 11.

[0051] In step S430 , a light emitting layer 12 is formed above the driving circuit 11 .

[0052] Thus, by utilizing the array substrate manufacturing process, that is, the patterning process performed on the substrate 1, a driving circuit 11 located in the display area 100 and a wiring 22 and a light shielding layer 23 located in the blind hole area 200 are formed, thereby simplifying the manufacturing process of the OLED display panel and achieving a complete blocking effect of external stray light.

[0053] In one embodiment, the patterning process specifically includes multiple photolithography steps; the specific circuit structure of the wiring 22 is simpler than the specific circuit structure of the driving circuit 11, so the wiring 22 is formed earlier than the driving circuit 11; thus, in a photolithography step after the wiring 22 is formed, the driving circuit 11 can continue to be formed in the display area 100, and the light shielding layer 23 can be formed in the blind hole area 200 at the same time.

[0054] Each photolithography step specifically includes: depositing a thin film in a preset area; coating a photoresist on the upper surface of the thin film, exposing and developing the photoresist through a mask with a preset pattern, and forming a photoresist layer with a preset pattern; wherein the preset patterns corresponding to the display area 100 and the blind hole area 200 are different according to their specific circuit structures; etching the thin film not covered by the photoresist layer; and stripping the photoresist layer to form a thin film layer with a preset pattern.

[0055] Further, refer to Figure 2As shown, a photoresist 24 is reserved between the light shielding layer 23 and the wiring 22 in the blind hole area 200 ; and a photoresist 24 is formed on the upper surface of the light shielding layer 23 and the side surfaces of the light shielding layer 23 and the wiring 22 . For example, the photoresist 24 can be formed in the following manner: eight photolithography steps are required to form the driving circuit 11, three photolithography steps are required to form the wiring 22, and one photolithography step is required to form the light shielding layer 23; then, through the first three photolithography steps, part of the driving circuit 11 can be formed in the display area 100 and the wiring 22 can be formed in the blind hole area 200; in the process of stripping the photoresist layer in the third photolithography step, the photoresist 24 between the patterns of the wiring 22, on the side of the wiring 22 and on the upper surface of the wiring 22 is retained; continuing through the fourth photolithography step, part of the driving circuit 11 is formed in the display area 100 and the light shielding layer 23 is formed in the blind hole area 200; in the process of stripping the photoresist layer in the fourth photolithography step, the photoresist 24 on the side and upper surface of the light shielding layer 23 is retained; subsequently, continuing through the last four photolithography steps to form a complete driving circuit 11 in the display area 100, the blind hole area 200 uses the photoresist 24 to protect the already formed wiring 22 and light shielding layer 23.

[0056] Of course, the above examples are only for schematic illustration. In different embodiments, the patterning process performed on the substrate 1 can be flexibly adjusted depending on the specific circuit structure of the driving circuit 11 and the wiring 22. The formation of the light-shielding layer 23 only requires adding a pattern corresponding to the blind hole area 200 suitable for forming the light-shielding layer 23 to the mask design in a photolithography step after the wiring 22 is formed.

[0057] Continue to refer to Figure 1 After forming the driving circuit 11, a light-emitting layer 12 is formed by evaporating a light-emitting material on the driving circuit 11. After forming the light-emitting layer 12, the display area 100 and the blind hole area 200 are flush with each other in the height direction; the method for manufacturing an OLED display panel further includes: forming an encapsulation glass 4 on the display area 100 and the blind hole area 200.

[0058] Further, refer to Figure 3 As shown, the method for manufacturing an OLED display panel may further include: continuing to form a touch layer 5, a polarizing layer 6, a cover glass 8 and other structures on the packaging glass 4 according to specific needs, which will not be repeated here.

[0059] In summary, the OLED display panel and its manufacturing method described in the embodiments of the present invention achieve the effect of completely blocking external stray light by arranging a shading layer above the wiring in the blind hole area; external stray light cannot bypass the shading layer to illuminate the wiring, thereby avoiding interference with the camera lighting and achieving no light leakage in the opening area; the wiring and the shading layer are respectively located in the same film layer as part of the driving circuit, so that the shading layer can be manufactured synchronously during the process of manufacturing the driving circuit on the substrate, that is, using the array substrate process technology, thereby simplifying the process of the OLED display panel; and the array substrate process technology and the touch control design are independent of each other, which is conducive to the diversity of touch control design.

[0060] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An OLED display panel, comprising a display area defined on a substrate and a blind hole area located in the display area, characterized in that: The display area includes: A driving circuit is arranged on the substrate; A light-emitting layer is disposed above the driving circuit; The blind hole area comprises: Openings; A wiring is arranged on the substrate and surrounds the opening; A light shielding layer is arranged above the wiring, and the wiring and the light shielding layer are respectively located in the same film layer as part of the driving circuit; A photoresist is arranged between the light shielding layer and the wiring, on the upper surface of the light shielding layer, and on the side surfaces of the light shielding layer and the wiring. The wiring, the light shielding layer and part of the driving circuit are formed in the same photolithography process. The photoresist is used to protect the already formed wiring and the light shielding layer during the formation of the driving circuit. The blind hole area is flush with the display area in a height direction, and the OLED display panel further includes an encapsulation glass covering the display area and the blind hole area.

2. The OLED display panel according to claim 1, wherein: Also includes: The touch layer is arranged on the upper surface of the packaging glass.

3. The OLED display panel according to claim 2, wherein: Also includes: A polarizing layer is disposed on the upper surface of the touch layer, and a hollow structure is disposed at positions of the touch layer and the polarizing layer corresponding to the openings, and the hollow structure is filled with transparent optical glue; The cover glass is bonded to the upper surface of the polarizing layer by transparent optical adhesive.

4. The OLED display panel according to claim 1, wherein: Also includes: The camera is arranged on a side of the substrate away from the display area, corresponding to the blind hole area, and the lens group of the camera is in the light-transmitting area of ​​the opening.

5. The OLED display panel according to claim 1, wherein: The light shielding layer is formed as an indium tin oxide-silver-indium tin oxide composite film.

6. The OLED display panel according to claim 1, wherein: The substrate is formed as a low temperature polysilicon thin film transistor array substrate.

7. A method for manufacturing an OLED display panel, characterized in that: include: A substrate is provided, wherein a display area and a blind hole area located in the display area are defined on the substrate, and an opening is formed in the blind hole area; Performing a patterning process on the substrate to form a driving circuit located in the display area, a wiring located in the blind hole area and surrounding the opening, and a light shielding layer located above the wiring, wherein the wiring and the light shielding layer are respectively formed in the same film layer as a part of the driving circuit; The patterning process includes multiple photolithography steps, the formation of the routing line is earlier than the formation of the driving circuit, and in a photolithography step after the routing line is formed, the driving circuit is continuously formed in the display area while the light shielding layer is formed in the blind hole area; Wherein, a light resistor is reserved between the light shielding layer and the wiring, and a light resistor is formed on the upper surface of the light shielding layer and the side surfaces of the light shielding layer and the wiring, and the light resistor is used to protect the wiring and the light shielding layer that have been formed during the formation of the driving circuit; forming a light-emitting layer above the driving circuit; After the light-emitting layer is formed, the display area is flush with the blind hole area in the height direction, and the manufacturing method further includes forming encapsulation glass above the display area and the blind hole area.

8. The method according to claim 7, characterized in that: Each of the photolithography steps comprises: Depositing thin films in pre-set areas; Coating a photoresist on the upper surface of the film, exposing and developing the photoresist through a photomask with a preset pattern to form a photoresist layer with the preset pattern; etching the thin film not covered by the photoresist layer; The photoresist layer is peeled off to form a thin film layer with the preset pattern.

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