Method for manufacturing a conductive element

Abstract

The present invention designs a method for manufacturing a conductive element, which includes the following steps: a. providing a conductive substrate; b. coating the outer surface of the conductive substrate with an insulating layer, the insulating layer including an elimination portion and a retention portion, the base portion is covered by the retention portion, and the upper welding portion is covered by the elimination portion; c. providing a positioning jig, placing the conductive substrate in the positioning jig; d. retaining the retention portion, removing the elimination portion, and then using the exposed upper welding portion to weld a first electronic element. When the conductive element manufactured by this method is welded to the first electronic element, the solder will be blocked by the retention portion and will not climb onto the base portion, thereby avoiding the harm caused by the tin creeping effect.

Description

[Technical field]

[0001] The invention relates to a method for manufacturing a conductive element, in particular to a method for manufacturing a conductive element for welding to an electronic element. [Background technology]

[0002] In the connector field, the terminals in the connector are usually used to electrically connect electronic components, such as chip modules. The terminals have a base and a welding part. When the chip module and the terminals are welded at high temperature, the solder is disposed between the pad of the chip module and the welding part. The solder will easily climb from the welding part to the base, which is commonly known in the industry as the "tin creeping effect", also called the SMT wick effect, which is a common welding defect.

[0003] The solder that should have fixed the welding part and the welding pad flows from the welding part toward the base due to the tin creeping phenomenon, so that the solder between the welding part and the welding pad becomes less, and of course the fixing will be unstable, which will cause the problem of poor welding. At the same time, the solder is attached to a large area of ​​the base, and the solder can easily form an oxide layer on the outer surface. The dielectric constant of the oxide layer is greater than the dielectric constant of the air, which will increase the capacitance of the terminal and require a corresponding high-voltage motor. Not only will the cost increase, but the lifespan will also be reduced, which will affect the conductive performance of the terminal and the appearance will also be ugly. At the same time, under the premise that the chip module needs to run at high speed, the terminals are becoming more and more dense, which can easily lead to short circuits between adjacent terminals.

[0004] Therefore, it is necessary to design a method for manufacturing a conductive element to overcome the above problems. [Summary of the invention]

[0005] The purpose of the invention is to provide a method for manufacturing a conductive element, wherein the base of the conductive substrate is covered by a retained portion, and when the conductive element is soldered to a first electronic element, the solder will be blocked by the retained portion and will not climb onto the base, thereby avoiding the harm caused by the tin creeping effect.

[0006] In order to achieve the above object, the present invention adopts the following technical solution:

[0007] A method for making a conductive element, wherein the conductive element is used to be welded to a first electronic element, comprising the following steps: a. providing a conductive substrate, wherein the conductive substrate is made of a conductive material or the outer surface of the conductive substrate is covered with a layer of conductive material, wherein the conductive substrate has a base and an upper welding portion, wherein the upper welding portion is connected to one end of the base; b. coating the outer surface of the conductive substrate with an insulating layer, wherein the insulating layer comprises an elimination portion and a retention portion, wherein the base is covered by the retention portion, and the upper welding portion is covered by the elimination portion; c. providing a positioning jig, and placing the conductive substrate in the positioning jig; d. retaining the retention portion, removing the elimination portion, and then using the exposed upper welding portion to weld the first electronic element.

[0008] Furthermore, in step c, the positioning jig includes a receiving hole, and the positioning jig fixes the retention portion and the base covered by the retention portion in the receiving hole by vacuum adsorption; in step d, the elimination portion is removed by laser or mechanical removal to expose the upper welding portion outside the positioning jig, and then the base is fixed by the positioning jig to weld the upper welding portion to the first electronic component.

[0009] Further, in step d, after removing the elimination portion, a layer of conductive metal is plated on the upper welding portion, and the physical properties of the conductive metal are higher than the physical properties of the conductive substrate, or in step a, a layer of conductive metal is plated on the upper welding portion, and the physical properties of the conductive metal are higher than the physical properties of the conductive substrate, and the elimination portion is covered on the outer surface of the conductive metal.

[0010] Further, in step d, after removing the elimination portion, solder is arranged between the pad of the first electronic component and the upper soldering portion, and the retained portion is close to the edge of the upper soldering portion to stop the solder from moving, wherein the soldering method is mechanical press-fitting low-temperature local soldering or SMT or laser welding.

[0011] Further, comprising step e 1 After the upper soldering portion is soldered to the first electronic component, the positioning jig is removed, the remaining portion is removed, and a plurality of terminals are provided, each of the terminals having two clamping portions, and the base is clamped by the two clamping portions.

[0012] Further, step e 1In the embodiment, each of the terminals further includes a base and two supporting parts, wherein the base is fixed to a second electronic component, the two supporting parts are connected to the base, and two clamping parts extend from the two supporting parts away from the base. The base, the two supporting parts, and the two clamping parts together form a receiving cavity, and the receiving cavity has an opening, and the conductive substrate enters the receiving cavity from the opening.

[0013] Furthermore, the distance between the two supporting parts gradually increases from bottom to top, the distance between the two clamping parts gradually decreases from bottom to top, and the positions where the two clamping parts clamp the conductive substrate are higher than the horizontal center line of the conductive substrate.

[0014] Furthermore, the two clamping parts are symmetrically arranged, and have two contact points A with the conductive substrate, and the contact point A is above the horizontal center line of the conductive substrate. The two supporting parts are symmetrically arranged, and have two contact points B with the conductive substrate, and the contact point B is below the horizontal center line of the conductive substrate. The supporting part and the clamping part have an intersection C, and the lines connecting the contact point A, the contact point B and the intersection C form a triangle, and there is a gap between the intersection C and the conductive substrate, and there is a gap between the conductive substrate and the base.

[0015] Further, comprising step e 2 The conductive substrate also has a lower welding portion, the lower welding portion and the upper welding portion are located at both ends of the conductive substrate and are connected by the base, the lower welding portion is covered by the elimination portion, the elimination portion covering the lower welding portion is removed, and the exposed lower welding portion is welded to a second electronic component.

[0016] Furthermore, the elimination portion covering the outer surface of the lower welding portion can be removed in step d. In step f, after the lower welding portion is welded to the second electronic component, the remaining portion is removed by laser or mechanical removal.

[0017] Compared with the prior art, the manufacturing method of the conductive element designed by the present invention has the following beneficial effects:

[0018] During the manufacturing process of the conductive element, the outer surface of the conductive substrate is covered with an insulating layer, the base is covered by the retained portion, and the upper welding portion is covered by the eliminated portion. When the conductive element is welded to the electronic component, the retained portion is still retained on the base, and only the eliminated portion is removed. The first electronic component is welded through the exposed upper welding portion. In this way, even during high-temperature welding, the solder will be blocked by the retained portion, thereby avoiding the tin creeping phenomenon, and the base will be cleaner and more beautiful, the capacitance will not be increased, and its conductive performance will not change. At the same time, the retention of the retained portion can also prevent short circuits between adjacent conductive elements.

Brief Description of the Drawings

[0019] Figure 1 The present invention is a flow chart for manufacturing the conductive element;

[0020] Figure 2 A flow chart for soldering a conductive element to a first electronic element;

[0021] Figure 3 For step e 1 Schematic diagram of the middle terminal clamping the conductive substrate;

[0022] Figure 4 For step e 2 A schematic diagram of the lower middle welding portion after being welded to the second electronic component;

[0023] Figure 5 for Figure 4 Schematic diagram of the conductive element after removing the remaining portion.

[0024] Description of the accompanying drawings for the specific implementation:

[0025] Conductive element 100 Conductive substrate 1 Base 11 Upper welding part 12 Lower welding part 13 Insulation layer 2 Elimination unit 21 Retention section 22 Positioning fixture 3 Receiving hole 31 First electronic component 4 Terminal 5 Clamping portion 51 Base 52 Supporting portion 53 Accommodation chamber 54 Opening 541 Second electronic component 6 Horizontal center line L [Specific implementation method]

[0026] In order to facilitate a better understanding of the purpose, structure, characteristics and effects of the present invention, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods.

[0027] like Figures 1 to 3 This is the first embodiment of the manufacturing method of the conductive element 100 of the present invention. In this embodiment, the conductive substrate 1 is a copper ball, the first electronic component 4 is a chip module, and the chip module has a plurality of pads (not numbered, the same below). The second electronic component 6 is a circuit board, and specifically includes the following steps:

[0028] Step a, such as Figure 1 As shown, a plurality of conductive substrates 1 are provided. Each of the conductive substrates 1 has a base 11 and an upper welding portion 12 . The upper welding portion 12 is located at one end of the base 11 and connected to the base 11 .

[0029] Step b, such as Figure 1 As shown, an insulating layer 2 is coated on the outer surface of the conductive substrate 1 , and the insulating layer 2 includes an elimination portion 21 and a retention portion 22 . The base 11 is covered by the retention portion 22 , and the upper welding portion 12 is covered by the elimination portion 21 .

[0030] The insulating layer 2 is made of one or more insulating materials such as polytetrafluoroethylene, metal oxide, ceramic, silicone rubber, epoxy resin, etc.

[0031] Step c, such as Figure 1 As shown, a positioning jig 3 is provided, and the positioning jig 3 includes a receiving hole 31. The positioning jig 3 fixes the retaining portion 22 and the base 11 covered by the retaining portion 22 in the receiving hole 31 by vacuum adsorption.

[0032] Step d, such as Figure 1 , Figure 2 As shown, the retaining portion 22 is retained, and the eliminating portion 21 is removed by laser, so that the upper soldering portion 12 is exposed outside the positioning jig 3, and then a layer of conductive metal such as gold or palladium is plated on the upper soldering portion 12, and then the solder is arranged between the pad of the first electronic component 4 and the upper soldering portion 12, and the retaining portion 22 is close to the edge of the upper soldering portion 12 to stop the solder displacement, and then the positioning jig 3 is used to fix the base 11, and the upper soldering portion 12 is soldered to the first electronic component 4, wherein the welding method is mechanical press-fitting low-temperature local welding or SMT or laser welding.

[0033] In other embodiments, the elimination portion 21 can be removed by mechanical means such as brushing, and the step of plating a layer of conductive metal on the upper welding portion 12 can also be completed in step a. At the same time, the conductive metal plated on the upper welding portion 12 can be a metal other than gold and palladium, as long as the overall physical properties of the conductive metal, especially corrosion resistance, oxidation resistance and weldability, are better than the physical properties of the conductive substrate 1.

[0034] Step e 1 ,like Figure 3As shown, after the upper welding portion 12 is welded to the first electronic component 4, the positioning jig 3 is removed, and the remaining portion 22 is removed by removing the elimination portion 21, and a plurality of terminals 5 are provided, each of which includes a base 52, two clamping portions 51 and two supporting portions 53. The base 52 is welded to a second electronic component 6, and the two supporting portions 53 are connected to the base 52. Two clamping portions 51 extend from the two supporting portions 53 away from the base 52, wherein the two supporting portions 53 are symmetrically arranged, and the distance between the two gradually increases from the bottom to the top. The two clamping portions 51 are also symmetrically arranged, and the distance between the two gradually decreases from the bottom to the top. The base 52, the two supporting portions 53 and the two clamping portions 51 together form a receiving cavity 54, and the receiving cavity 54 has an opening 541. The conductive substrate 1 enters the receiving cavity 54 from the opening 541 to form the conductive element 100. After entering the receiving cavity 54, the conductive substrate 1 has two contact points A with the two clamping parts 51. The positions where the two clamping parts 51 clamp the conductive substrate 1 are higher than the horizontal center line L of the conductive substrate 1. The conductive substrate 1 has two contact points B with the two supporting parts 53. The contact point B is below the horizontal center line L of the conductive substrate 1. The supporting part 53 and the clamping part 51 have an intersection point C. The lines connecting the contact point A, the contact point B and the intersection point C form a triangle. There is a gap between the intersection point C and the conductive substrate 1, and there is a gap between the conductive substrate 1 and the base 52.

[0035] like Figure 1 , Figure 2 , Figure 4 , Figure 5 This is a second embodiment of the method for manufacturing the conductive element 100 of the present invention. In this embodiment, the conductive substrate 1 is a copper ball, the first electronic component 4 is a chip module, and the second electronic component 6 is a circuit board. The method specifically includes the following steps:

[0036] Step a, such as Figure 1 As shown, a plurality of conductive substrates 1 are provided, each of the conductive substrates 1 having a base 11 , an upper welding portion 12 and a lower welding portion 13 , wherein the lower welding portion 13 and the upper welding portion 12 are located at two ends of the conductive substrate 1 and connected by the base 11 .

[0037] Step b, such as Figure 1 As shown, an insulating layer 2 is coated on the outer surface of the conductive substrate 1, and the insulating layer 2 includes an elimination portion 21 and a retention portion 22, the base 11 is covered by the retention portion 22, and the upper welding portion 12 and the lower welding portion 13 are both covered by the elimination portion 21.

[0038] Step c and step d are consistent with the first embodiment.

[0039] Step e 2 ,like Figure 4 As shown, the eliminating portion 21 covering the lower soldering portion 13 is removed, and the exposed lower soldering portion 13 is soldered to the second electronic component 6 .

[0040] In other embodiments, the eliminated portion 21 covering the outer surface of the lower welding portion 13 may be removed together with the eliminated portion 21 covering the upper welding portion 12 in step d.

[0041] Step f, such as Figure 5 As shown, after the lower welding portion 13 is welded to the second electronic component 6 , the remaining portion 22 is removed by laser or mechanical removal.

[0042] In summary, the present invention has the following beneficial effects:

[0043] 1. The outer surface of the conductive substrate 1 is covered with an insulating layer 2, the base 11 is covered by the retained portion 22, the upper soldering portion 12 and the lower soldering portion 13 are covered by the eliminated portion 21, the retained portion 22 is retained, and the eliminated portion 21 is removed, and then the exposed upper soldering portion 12 is used to solder the first electronic component 4, and the exposed lower soldering portion 13 is used to solder the second electronic component 6, the solder is arranged between the solder pad of the first electronic component 4 and the upper soldering portion 12, and the retained portion 22 is close to the edge of the upper soldering portion 12 to block the displacement of the solder, so that when the conductive element 100 is soldered to the electronic component, the solder will be blocked by the retained portion 22 and cannot flow around, thereby avoiding the tin creeping phenomenon, the base 11 will also be cleaner and more beautiful, the capacitance will not be increased, and the conductive performance of the conductive element 100 will not change, and the retention of the retained portion 22 can also prevent short circuits between adjacent conductive elements 100.

[0044] 2. The vacuum adsorption method mainly utilizes the pressure difference between atmospheric pressure and vacuum to generate huge pressure to fix the conductive substrate 1 on the positioning jig 3. This method will not cause damage to the conductive substrate 1. After air is input into the vacuum, the pressure can be eliminated immediately, which makes it easy to take out the conductive substrate 1. At the same time, the base 11 is fixed with the positioning jig 3, leaving only the upper welding part 12 exposed, so as to facilitate the determination of the range of the upper welding part 12 and facilitate the welding of the upper welding part 12 with the first electronic component 4.

[0045] 3. After removing the elimination portion 21, a layer of conductive metal is plated on the upper welding portion 12. The physical properties of the conductive metal, especially the corrosion resistance, oxidation resistance and weldability, are higher than those of the conductive substrate 1. The higher weldability and oxidation resistance increase the bonding force between the upper welding portion 12 and the solder, thereby improving the welding strength between the upper welding portion 12 and the first electronic component 4. The stronger corrosion resistance makes the upper welding portion 12 less likely to be corroded by the outside world, the physical properties are less likely to change, and the stability is stronger.

[0046] 4. The conductive substrate 1 is clamped by the terminal 5 to connect the first electronic component 4 and the second electronic component 6. Compared with directly connecting the first electronic component 4 and the second electronic component 6 by the terminal 5, the connection method is more flexible, and the two electronic components can be disassembled and assembled more conveniently. There is a gap between the conductive substrate 1 and the base 52, so that after the conductive substrate 1 is inserted into the receiving cavity 54, the conductive substrate 1 has space to move up and down. There is a gap between the intersection C and the conductive substrate 1, so that the clamping part 51, the supporting part 53 and the intersection C form an elastically changeable angle, which increases the space for the conductive substrate 1 to move left and right, thereby facilitating fine-tuning of certain incoordinated positions in the electronic component after assembly is completed.

[0047] The conductive substrate 1 enters the receiving cavity 54 from the opening 541. This plug-in method allows the height of the conductive substrate 1 to overlap with that of the terminal 5, thereby reducing the overall height of the conductive element 100. The distance between the two supporting portions 53 gradually increases from bottom to top, and the distance between the two clamping portions 51 gradually decreases from bottom to top, thereby forming the receiving cavity 54 which is wide in the middle and narrow at both ends. At the four contact points, the four force directions of the terminal 5 on the conductive substrate 1 intersect at the center of the receiving cavity 54, which can better fix the conductive substrate 1; the position of the clamping portion 51 clamping the conductive substrate 1 is higher than the horizontal center line L of the conductive substrate 1, so that the clamping portion 51 forms a downward pressure on the conductive substrate 1, thereby preventing the conductive substrate 1 from being pushed upward and causing the first electronic component 4 to move upward.

[0048] The above detailed description is only an explanation of the preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and illustrations of this creation are included in the patent scope of this creation.

Claims

1. A method for manufacturing a conductive element, wherein the conductive element is used to be soldered to a first electronic element, characterized in that: The following steps are involved: a. Providing a conductive substrate, the conductive substrate is made of a conductive material or the outer surface of the conductive substrate is covered with a layer of conductive material, the conductive substrate having a base and an upper welding portion, the upper welding portion connected to one end of the base; b. Coating an insulating layer on the outer surface of the conductive substrate, the insulating layer comprising an elimination portion and a retention portion, the base portion is covered by the retention portion, and the upper welding portion is covered by the elimination portion; c. Providing a positioning tool, placing the conductive substrate in the positioning tool; d. retain the retained portion, remove the eliminated portion, and then use the exposed upper soldering portion to solder the first electronic component.

2. The method for manufacturing a conductive element according to claim 1, wherein: In step c, the positioning jig includes a receiving hole, and the positioning jig fixes the retention portion and the base covered by the retention portion in the receiving hole by vacuum adsorption; in step d, the elimination portion is removed by laser or mechanical removal to expose the upper welding portion outside the positioning jig, and then the base is fixed by the positioning jig to weld the upper welding portion to the first electronic component.

3. The method for manufacturing a conductive element according to claim 1, wherein: In step d, after removing the elimination portion, a layer of conductive metal is plated on the upper welding portion, and the physical properties of the conductive metal are higher than the physical properties of the conductive substrate, or in step a, a layer of conductive metal is plated on the upper welding portion, and the physical properties of the conductive metal are higher than the physical properties of the conductive substrate, and the elimination portion is covered on the outer surface of the conductive metal.

4. The method for manufacturing a conductive element according to claim 1, wherein: In step d, after removing the elimination portion, solder is arranged between the pad of the first electronic component and the upper soldering portion, and the retained portion is close to the edge of the upper soldering portion to stop the solder from moving, wherein the soldering method is mechanical press-fitting, low-temperature local soldering, SMT or laser welding.

5. The method for manufacturing a conductive element according to claim 1, wherein: The method further comprises step e1, after welding the upper welding part to the first electronic component, removing the positioning jig, removing the remaining part, providing a plurality of terminals, each of the terminals having two clamping parts, and clamping the base with the two clamping parts.

6. The method for manufacturing a conductive element according to claim 5, wherein: In step e1, the terminal also includes a base and two supporting parts, the base is fixed to a second electronic component, the two supporting parts are connected to the base, and two clamping parts extend from the two supporting parts away from the base. The base, the two supporting parts and the two clamping parts together constitute a receiving cavity, and the receiving cavity has an opening, and the conductive substrate enters the receiving cavity from the opening.

7. The method for manufacturing a conductive element according to claim 6, wherein: The distance between the two supporting parts gradually increases from bottom to top, the distance between the two clamping parts gradually decreases from bottom to top, and the positions where the two clamping parts clamp the conductive substrate are higher than the horizontal center line of the conductive substrate.

8. The method for manufacturing a conductive element according to claim 6, wherein: The two clamping parts are symmetrically arranged, and have two contact points A with the conductive substrate, and the contact point A is above the horizontal center line of the conductive substrate. The two supporting parts are symmetrically arranged, and have two contact points B with the conductive substrate, and the contact point B is below the horizontal center line of the conductive substrate. The supporting part and the clamping part have an intersection C, and the lines connecting the contact points A, B and the intersection C form a triangle, and there is a gap between the intersection C and the conductive substrate, and there is a gap between the conductive substrate and the base.

9. The method for manufacturing a conductive element according to claim 1, wherein: The method further includes step e2, wherein the conductive substrate also has a lower welding portion, the lower welding portion and the upper welding portion are located at two ends of the conductive substrate and are connected by the base, the lower welding portion is covered by the elimination portion, the elimination portion covering the lower welding portion is removed, and the exposed lower welding portion is welded to a second electronic component.

10. The method for manufacturing a conductive element according to claim 9, wherein: The elimination portion covering the outer surface of the lower welding portion can be removed in step d. In step f, after the lower welding portion is welded to the second electronic component, the remaining portion is removed by laser or mechanical removal.

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