Controller

Abstract

In a controller that uses a connector to connect a substrate equipped with a heating element, plastic deformation or poor contact of pins provided on the connector is suppressed, and the heat dissipation of heat generated by the substrate is improved. The controller (1) includes a drive circuit substrate (7) equipped with a heating element (10), and a control circuit substrate (4) having a second connector (12) that engages with a first connector (11) arranged on the drive circuit substrate in a first direction (Z). The drive circuit substrate is arranged perpendicular to the control circuit substrate. A heat dissipation component (9) fixed to each drive circuit substrate abuts a receiving portion (87) provided on a substrate holder (8) directly or via a position adjustment component (16) in the first direction, which is the connector engagement direction. Therefore, a large amount of heat can be dissipated from the substrate holder. In addition, since over-insertion of the first connector and the second connector can be prevented, plastic deformation or poor contact of the pins can be suppressed.

Description

Technical Field

[0001] The present invention relates to a controller having a substrate on which electronic components and connectors generating a large amount of heat are mounted. Background Art

[0002] Patent Document 1 describes a controller for controlling a robot that includes a control circuit board and multiple drive circuit boards connected to the control circuit board. Each drive circuit board is arranged perpendicular to the control circuit board, and connectors provided at the ends of the drive circuit boards mate with connectors provided on the surface of the control circuit boards. A power module is arranged on the board surface of each drive circuit board, and a metal heat sink is mounted to cover the power module.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 5803213 Summary of the Invention

[0006] Connectors that handle multiple signal input and output have many pins. To avoid connector enlargement, connectors with narrow pin pitches are required. However, connectors with narrow pin pitches have the problem of plastic deformation of pins and poor contact due to low positioning accuracy.

[0007] Furthermore, since heat-generating electronic components (heat-generating elements) such as power modules are arranged on the driver circuit substrate, heat dissipation measures are required. Patent Document 1 discloses a metal heat sink (heat dissipation component) arranged to cover the power modules arranged on the substrate surface, with air from a fan passing along the heat sink. However, there is a demand for further improvement in heat dissipation.

[0008] In view of the above problems, the present invention aims to improve the heat dissipation of the substrate while suppressing plastic deformation and contact failure of the pins provided on the connector in a controller in which a substrate on which a heat generating element is arranged is connected via a connector.

[0009] In order to solve the above-mentioned problems, the present invention is characterized in that it has: a first substrate provided with a heating element and a first connector; a heat dissipation component fixed to the first substrate; a second substrate having a second connector engaged with the first connector and intersecting with the first substrate; a substrate holder supporting the first substrate; and a supporting component supporting the second substrate and the substrate holder, and when the engagement direction of the first connector relative to the second connector is set to a first direction, the substrate holder has a supporting portion for the heat dissipation component to abut in the first direction directly or via a position adjustment component.

[0010] According to the present invention, the first substrate intersects with the second substrate, and the substrate holder supporting the first substrate has a receiving portion that supports a heat dissipation component fixed to the first substrate. Therefore, since the heat of the heat dissipation component is easily transferred to the substrate holder, it can also be dissipated from the substrate holder. Therefore, the heat dissipation of the heat generated on the first substrate can be improved. In addition, since the abutment direction of the receiving portion and the heat dissipation component is consistent with the connector mating direction (first direction) of the first substrate and the second substrate, it is possible to prevent the connector from being inserted beyond the specified size (over-insertion). Therefore, it is possible to suppress plastic deformation or poor contact of the pins provided on the connector.

[0011] In the present invention, preferably, when a direction intersecting the first direction and along the surface direction of the first substrate is defined as the second direction, and a direction intersecting the first direction and intersecting the second direction is defined as the third direction, the substrate holder preferably includes a pair of first frames extending parallel to the third direction on either side of the first substrate in the second direction, and the receiving portion protrudes from each of the pair of first frames toward the center of the substrate holder in the second direction. In this manner, the first substrate and the heat dissipation component are supported from both sides in the second direction. Therefore, since the first substrate can be positioned with high precision, plastic deformation or poor contact of the pins provided on the connector can be suppressed. Furthermore, since multiple receiving portions are in contact with the heat dissipation component, heat dissipation can be improved.

[0012] In the present invention, a pair of sliders extending in the first direction on either side of the first substrate in the second direction are preferably provided. The sliders have slots for inserting the ends of the first substrate. The substrate holder preferably includes a pair of second frames extending parallel to the third direction at positions spaced apart from the pair of first frames in the first direction; and a connecting frame connecting the pair of first frames and the pair of second frames. The sliders are fixed to the first and second frames. In this manner, by assembling the frames and sliders in a lattice pattern to form a substrate holder, a substrate holder having a structure with numerous gaps is formed. Therefore, heat dissipation can be improved by dissipating heat through the gaps between the frames.

[0013] In the present invention, a conductive member is preferably provided fixed to the pair of second frames, and abuts the heat sink from the side opposite the receiving portion. This prevents the heat sink from floating from the receiving portion due to vibration, while maintaining contact with the conductive member. Consequently, reliable electrical conduction between the first substrate and the substrate holder is achieved via the heat sink.

[0014] In the present invention, the heat dissipation component preferably includes a planar portion that faces the first substrate and the heat-generating element; and a heat sink that protrudes from the planar portion in the third direction and extends in the second direction, with the receiving portion abutting the heat sink. This increases the contact area between the receiving portion and the heat dissipation component. Consequently, a greater amount of heat can be transferred from the heat dissipation component to the substrate holder, thereby improving heat dissipation.

[0015] In the present invention, the edge of the first substrate in the first direction preferably includes a first portion for arranging the first connector and a second portion that protrudes further toward the second substrate than the first portion, with the second portion contacting the second substrate before the first connector is over-inserted into the second connector. This more reliably prevents over-insertion of the connectors, thereby suppressing plastic deformation and poor contact of the connector pins.

[0016] (Effects of the Invention)

[0017] According to the present invention, the first substrate intersects with the second substrate, and the substrate holder supporting the first substrate has a receiving portion that supports a heat dissipation component fixed to the first substrate. Therefore, since the heat of the heat dissipation component is easily transferred to the substrate holder, it can also be dissipated from the substrate holder. Therefore, the heat dissipation of the heat generated on the first substrate can be improved. In addition, since the abutment direction of the receiving portion and the heat dissipation component is consistent with the connector mating direction (first direction) of the first substrate and the second substrate, it is possible to prevent the connector from being inserted beyond the specified size (over-insertion). Therefore, it is possible to suppress plastic deformation or poor contact of the pins provided on the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a partially omitted top view of a controller to which the present invention is applied.

[0019] Figure 2 This is a perspective view of a substrate unit in which a drive circuit substrate, a heat dissipation component, and a substrate holder are assembled.

[0020] Figure 3 yes Figure 1 Partial cross-sectional view of the controller (in Figure 1 sectional view cut at position AA).

[0021] Figure 4 Cutting with XZ plane Figure 2 Cross-sectional view of the substrate unit (in Figure 2 BB position cut off).

[0022] Figure 5 Cutting with XZ plane Figure 2 Cross-sectional view of the substrate unit (in Figure 2 sectional view cut at CC position).

[0023] Figure 6 Cutting with YZ plane Figure 2 Cross-sectional view of the substrate unit (in Figure 2 DD position cut off).

[0024] Figure 7 This is an exploded perspective view of the substrate holder, the drive circuit substrate, and the first heat dissipation component.

[0025] Figure 8 This is an exploded perspective view of the substrate holder, the drive circuit substrate, and the second heat dissipation component. DETAILED DESCRIPTION

[0026] Hereinafter, an embodiment of a controller to which the present invention is applied will be described with reference to the drawings. A controller 1 of this embodiment is a device that supplies power to a robot including actuators such as motors.

[0027] Figure 1 It is a partially omitted side view of the controller 1 to which the present invention is applied. Figure 2 It is a three-dimensional view of the substrate unit 5 assembled with the drive circuit substrate 7, the heat dissipation component 9, and the substrate holder 8. In this specification, the three directions XYZ are mutually orthogonal directions. In this specification, for convenience, the first direction Z is set as the up and down direction of the controller 1. The Z1 direction is upward, and the Z2 direction is downward. The second direction X is the front and back direction of the controller 1. The X1 direction is the front, and the X2 direction is the rear. The third direction Y is the width direction of the controller 1. The Y1 direction and the Y2 direction are one side and the other side of the third direction Y. In addition, in the actual use of the controller 1, the first direction Z may also be inconsistent with the up and down direction (vertical direction).

[0028] (Overall structure)

[0029] like Figure 1 As shown, the controller 1 includes a metal housing 2. The housing 2 is a rectangular parallelepiped and includes a front panel 2a facing in the X1 direction, a back panel 2b facing in the X2 direction, side panels 2c facing in the Y1 direction, side panels 2d facing in the Y2 direction, a bottom panel 2e facing in the Z2 direction, and a top panel 2f facing in the Z1 direction (see FIG. Figure 3 ). Figure 1 It is a plan view of the controller 1 in a state where the top plate 2f of the housing 2 is removed.

[0030] like Figure 1 As shown, the controller 1 includes a housing 2, a communication board unit 3, a control circuit board 4, a board unit 5, and a fan 6 arranged inside the housing 2. Figure 1In the figure, the components other than those mentioned above in the internal structure of the controller 1 are omitted. The substrate unit 5 includes a drive circuit substrate 7, a substrate holder 8 and a heat dissipation component 9. Figure 2 As shown, the substrate unit 5 is constructed by fixing a heat dissipation member 9 to each of the plurality of drive circuit substrates 7 and assembling the substrates to the substrate holder 8 .

[0031] The controller 1 supplies power to the plurality of actuators. The drive circuit substrate 7 (first substrate) is a substrate that supplies power to the actuators and is supported by a substrate holder 8. Figure 1 、 Figure 2 As shown, the substrate unit 5 includes multiple drive circuit substrates 7. The control circuit substrate 4 (second substrate) is connected to the drive circuit substrates 7 via a connector. The substrate holder 8 and the control circuit substrates 4 are fixed to the bottom plate 2e of the housing 2. Therefore, the bottom plate 2e serves as a support member for the substrate holder 8 and the control circuit substrates 4.

[0032] The communication substrate unit 3 is arranged at the corner where the front panel 2a and the side panel 2d intersect. On the X1 side of the back panel 2b, two fans 6 are arranged along the third direction Y. On the X1 side of the two fans 6, a control circuit substrate 4 parallel to the bottom plate 2e and four drive circuit substrates 7 perpendicular to the control circuit substrate 4 are arranged. The drive circuit substrates 7 are arranged at certain intervals in the third direction Y in a posture parallel to the XZ plane in the Z1 direction (above) of the control circuit substrate 4. The two fans 6 are opposite to the four control circuit substrates 4 in the second direction X. Therefore, when the fans 6 are driven, air is blown into the gaps between the drive circuit substrates 7, and the drive circuit substrates 7 and the heat dissipation components 9 fixed to the drive circuit substrates 7 are cooled.

[0033] The electronic components mounted on the drive circuit substrate 7 include a heating element 10 (see Figure 6 、 Figure 7 ). The heating element 10 is, for example, a power module such as an IGBT module. A heat dissipation component 9 is fixed to the drive circuit substrate 7. The heat dissipation component 9 includes: a planar portion 90, which is opposite to the heating element 10 and the drive circuit substrate 7 from the Y1 side; and a heat dissipation fin 91, which protrudes from the planar portion 90 in the Y1 direction (the side opposite to the heating element 10). The heat dissipation component 9 has a plurality of heat dissipation fins 91 arranged at regular intervals along the first direction Z. The plurality of heat dissipation fins 91 extend parallel to the second direction X.

[0034] In this embodiment, the heat sink 9 comprises a first heat sink 9A fixed to the two drive circuit boards 7 arranged on the Y1 side of the four drive circuit boards 7; and a second heat sink 9B fixed to the two drive circuit boards 7 arranged on the Y2 side. The second heat sink 9B is designed to dissipate heat more easily than the first heat sink 9A. Specifically, the second heat sink 9B has a greater number of heat sink fins 91 than the first heat sink 9A, and each heat sink fin 91 protrudes more significantly in the third direction Y.

[0035] The heating element 10 mounted on the drive circuit board 7 is a heating element 10A for controlling the supply of electric power to the motor for normal power (see Figure 6 ) and the heating element 10B for controlling the power supply to the high-power motor (refer to Figure 7 ). Heat-generating elements 10A are mounted on the two drive circuit substrates 7 arranged on the Y1 side of the four drive circuit substrates 7. On the other hand, heat-generating elements 10B are mounted on the two drive circuit substrates 7 arranged on the Y2 side. Therefore, the heat generated by the two drive circuit substrates 7 arranged on the Y2 side is greater than the heat generated by the two drive circuit substrates 7 arranged on the Y1 side. Therefore, first heat-dissipating components 9A are fixed to the two drive circuit substrates 7 arranged on the Y1 side, and second heat-dissipating components 9B are fixed to the two drive circuit substrates 7 arranged on the Y2 side.

[0036] Figure 3 yes Figure 1 A partial cross-sectional view of the controller 1 (in Figure 1 AA position cut off the cross-sectional view). Figure 3 As shown, the frame 2 has stepped pins 2g protruding from the bottom plate 2e toward the Z1 direction. The control circuit board 4 is screwed onto the tips of the stepped pins 2g. Furthermore, the frame 2 has stepped pins 2h protruding from the bottom plate 2e on both sides of the control circuit board 4 in the second direction X. The board holder 8 is screwed onto the tips of the stepped pins 2h. Thus, the control circuit board 4 and the board holder 8 are supported by the bottom plate 2e.

[0037] A first connector 11 is disposed on the Z2-side edge 70 of the drive circuit board 7. The first connector 11 mates with a second connector 12 disposed on the control circuit board 4 in the first direction Z. Furthermore, a third connector 13 is disposed on the X1-side of the first connector 11 on the edge 70 of the drive circuit board 7. The third connector 13 mates with a fourth connector 14 disposed on the control circuit board 4 in the first direction Z. For example, the third connector 13 and the fourth connector 14 are connectors for power supply, while the first connector 11 and the second connector 12 are connectors for communication.

[0038] On the control circuit board 4, the second connectors 12 are arranged at regular intervals in the third direction, and the fourth connectors 14 are arranged at regular intervals in the third direction on the X1 side of the second connectors 12. The arrangement intervals of the four drive circuit boards 7 are the same as the arrangement intervals of the second connectors 12 and the fourth connectors 14. Therefore, after the substrate holder 8 is fixed to the bottom plate 2e, if the drive circuit board 7 is inserted from the Z1 side into the groove 80a of the slider 80 fixed to the substrate holder 8 (see Figure 6 ), the drive circuit board 7 is inserted in a direction perpendicular to the control circuit board 4. As a result, the first connector 11 is fitted with the second connector 12, and the third connector 13 is fitted with the fourth connector 14.

[0039] The Z2-side edge 70 of the driver circuit board 7 includes a first portion 71 on which the first connector 11 is positioned, and a second portion 72 that protrudes further toward the Z2 side (i.e., the side on which the control circuit board 4 is positioned) than the first portion 71. The second portion 72 is shaped to prevent over-insertion of the connectors. The protrusion of the second portion 72 toward the Z2 side is set so that, when the driver circuit board 7 is inserted perpendicularly to the control circuit board 4 to engage the first connector 11 and the second connector 12, the second portion 72 abuts the control circuit board 4 before the first connector 11 is inserted beyond a specified distance into the second connector 12.

[0040] In this embodiment, in addition to the second portion 72 (over-insertion prevention shape) of the drive circuit board 7, a structure for preventing over-insertion of the connector is also provided on the board holder 8. As will be described later, when the drive circuit board 7 is inserted into the board holder 8, before the second portion 72 comes into contact with the control circuit board 4, the heat dissipation member 9 fixed to the drive circuit board 7 is disengaged from the Z1 side directly or via the position adjustment member 16 (see FIG. Figure 6 、 Figure 8 ) abuts against the substrate holder 8, limiting further insertion. Figure 3 As shown in the partially enlarged view of FIG, a predetermined gap is formed between the front end of the second portion 72 and the control circuit substrate 4.

[0041] (Substrate Holder)

[0042] Figure 4 、 Figure 5 Cutting with XZ plane Figure 2 sectional view of the substrate unit 5. Figure 4 is Figure 2 The cross-sectional view cut at the BB position, Figure 5 is Figure 2 Cross-sectional view cut at the CC position. Figure 6 Cutting with YZ plane Figure 2 The cross-sectional view of the substrate unit 5 is Figure 2 Cross-sectional view cut at the DD position. Figure 7 It is an exploded perspective view of the substrate holder 8 , the drive circuit substrate 7 , and the first heat sink 9A. Figure 8 It is an exploded perspective view of the substrate holder 8 , the drive circuit substrate 7 , and the second heat sink 9B.

[0043] like Figure 2 、 Figures 4 to 8 As shown, the substrate holder 8 is constructed by assembling multiple metal frames into a frame shape. Specifically, the substrate holder 8 includes a pair of first frames 81 extending parallel to the third direction Y, and a pair of second frames 82 extending parallel to the third direction Y on the Z1 side (upper side) of the first frames 81. Furthermore, the substrate holder 8 includes a third frame 83 connected to the ends of the first frame 81 on the X1 side and the second frame 82 on the X1 side, extending in the first direction Z; and a fourth frame 84 connected to the ends of the first frame 81 on the X2 side and the second frame 82 on the X2 side, extending in the first direction Z. The ends of the third and fourth frames 83 and 84 in the Z2 direction are fixed to the bottom plate 2e of the frame body 2.

[0044] Furthermore, the substrate holder 8 includes a fifth frame 85 fixed to the third frame 83 and the fourth frame 84 on the Y1 side, and a sixth frame 86 fixed to the third frame 83 and the fourth frame 84 on the Y2 side. The fifth frame 85 and the sixth frame 86 are connecting frames that connect the pair of first frames 81 via the third frame 83 and the fourth frame 84, and connect the pair of second frames 82 via the third frame 83 and the fourth frame 84. Figure 2 As shown, the fifth frame 85 includes a pair of longitudinal frame portions extending parallel to the first direction Z, and a transverse frame portion connecting the Z2-side ends of the pair of longitudinal frame portions and extending in the second direction X. The longitudinal frame portion on the X1 side is fixed to the third frame 83 at two locations separated in the first direction Z, while the longitudinal frame portion on the X2 side is fixed to the fourth frame 84 at two locations separated in the first direction Z. The fourth frame 84 has protrusions projecting toward the X1 side at two locations separated in the first direction Z. The protrusion on the Z2 side is connected to the first frame 81, and the protrusion on the Z1 side is connected to the second frame 82. The longitudinal frame portion of the fifth frame 85 is fixed to these two protrusions. By joining the fifth frame 85 at four locations in this way, the rigidity of the substrate holder 8 can be improved.

[0045] (Positioning Structure of Driving Circuit Substrate 7)

[0046] Four pairs of sliders 80 are fixed to the substrate holder 8, each pair opposing each other in the second direction X. The four sliders are spaced apart in the third direction Y. Each slider 80 extends in the first direction Z and has a slot 80a that opens toward the center of the substrate holder 8 in the second direction X. The upper end of each slider 80 is fixed to the second frame 82, and the lower end is fixed to the first frame 81. The two ends of the drive circuit substrate 7 in the second direction X are inserted into the slots 80a of the opposing sliders 80 from the Z1 direction.

[0047] like Figure 7 、 Figure 8 As shown, the heat sink 9 is fixed to the drive circuit board 7 via a spacer 15 with a threaded hole. The heating element 10 is in contact with the flat surface 90 of the heat sink 9 or faces the heating element 10 with a small gap therebetween.

[0048] The substrate holder 8 has a receiving portion 87 that contacts the heat dissipation component 9 fixed to the drive circuit substrate 7 from the Z2 side. Figure 4 、 Figure 5 As shown, the receiving portion 87 is bent at a substantially right angle from each end portion of the pair of first frames 81 in the Z2 direction and projects toward the center of the substrate holder 8 in the second direction X. The receiving portion 87 projecting from the first frame 81 on the X1 side toward the X2 side and the receiving portion 87 projecting from the first frame 81 on the X2 side toward the X1 side are arranged at opposing positions in the second direction X.

[0049] like Figure 6 As shown, pairs of receiving portions 87 protruding toward the X2 side and receiving portions 87 protruding toward the X1 side are arranged at regular intervals in the third direction Y. In the two drive circuit boards 7 arranged on the Y1 side, the heat sink 91 of the heat sink member 9 fixed to the drive circuit board 7 abuts the receiving portions 87 from the Z1 side. Similarly, in the two drive circuit boards 7 arranged on the Y2 side, the heat sink 91 of the second heat sink member 9B fixed to the drive circuit board 7 abuts the receiving portions 87 from the Z1 side via the metal position adjustment member 16. As a result, the drive circuit boards 7 are positioned so that the first connector 11 and the second connector 12, as well as the third connector 13 and the fourth connector 14, fit together without over-insertion.

[0050] like Figure 6 、 Figure 8 As shown, the position adjustment member 16 is a plate-shaped member extending in the third direction Y, and includes: a linear contact portion 16a that contacts the second heat dissipation member 9B; and a cutout portion 16b formed by cutting away the edge on the opposite side of the contact portion 16a. Figure 7 、 Figure 8As shown, the position adjustment member 16 is fixed to the first frame 81 such that two adjacent receiving portions 87 are arranged in the notch portion 16b and abut against the two adjacent receiving portions 87 from the Z1 side. The two drive circuit boards 7 arranged on the Y2 side are supported by the receiving portions 87 from the Z2 side via the second heat sink 9B and the position adjustment member 16.

[0051] (Conductive parts)

[0052] A conductive member 17 is fixed to the substrate holder so as to contact the heat dissipation member 9 from the Z1 side. Figure 2 、 Figure 7 、 Figure 8 As shown, the conductive member 17 is a metal member extending in the second direction X. It includes a first bent portion 18 having a stepped shape, located near the end on the X2 side, and a second bent portion 19, which bends the end on the X1 side at a substantially right angle toward the Z2 side. The first bent portion 18 is a stepped shape that bends toward the Z1 side and then toward the X2 side at a substantially right angle.

[0053] The X1-side end of the conductive member 17 is fixed to the second frame 82 located on the X1 side, while the X2-side end of the conductive member 17 is fixed to the second frame 82 located on the X2 side. The second frame 82 located on the X2 side comprises a first plate portion 821 extending along the YZ plane and a second plate portion 822 bent from the Z1-side edge of the first plate portion 821 toward the X2 side. The X2-side end of the conductive member 17 is screwed to the second plate portion 822 from the Z1 side. Meanwhile, the X1-side second frame 82 comprises a third plate portion 823 extending along the XY plane and a fourth plate portion 824 bent at a substantially right angle from the X2-side edge of the third plate portion 823 and rising toward the Z1 side. The X1-side end of the conductive member 17 extends toward the X1 side of the fourth plate portion 824 via a notch 825 provided in the Z1-side edge of the fourth plate portion 824. The lower end of the second bent portion 19 is fixed to the third plate portion 823 by welding or other means.

[0054] By attaching the conductive member 17 to the pair of second frames from the Z1 side, the heat sink 9 and the drive circuit board 7 are prevented from dislodging toward the Z1 side. Furthermore, since the conductive member 17 includes the second curved portion 19, it functions as a leaf spring and elastically contacts the heat sink 9. This prevents the heat sink 9 from floating from the receiving portion 87 due to vibration, etc., and even if it does float, the conductive member 17 remains in reliable contact with the heat sink 9. In this embodiment, since the heat sink 9 includes the first heat sink 9A and the second heat sink 9B, the conductive member 17 includes the first conductive member 17A that contacts the first heat sink 9A from the Z1 side and the second conductive member 17B that contacts the second heat sink 9B from the Z1 side. The first curved portions 18 of the first and second conductive members 17A, 17B, have different heights in the first direction Z to correspond to the dimensions (heights) of the first and second heat sinks 9A, 9B in the first direction Z.

[0055] (Main Effects of This Embodiment)

[0056] As described above, in the controller 1 of this embodiment, the drive circuit board 7 intersects the control circuit board 4, and the substrate holder 8 includes a plurality of receiving portions 87 that support the drive circuit board 7 via the heat sinks 9 (first heat sink 9A and second heat sink 9B) fixed to the drive circuit board 7. In this embodiment, the substrate holder 8 supports the drive circuit board 7 to which the first heat sink 9A is fixed, and the drive circuit board 7 to which the second heat sink 9B is fixed. Some of the receiving portions 87 provided on the substrate holder 8 abut against the first heat sink 9A in the first direction Z. Furthermore, other receiving portions 87 abut against the second heat sink 9B in the first direction Z via the metal position adjustment member 16.

[0057] Since the substrate holder 8 is made of metal, the heat of the heat dissipation component 9 is easily transferred to the substrate holder 8, and a large amount of heat can be dissipated not only from the heat dissipation component 9 but also from the substrate holder 8. Therefore, the heat dissipation of the heat generated by the drive circuit substrate 7 is high. In addition, since the abutment direction of the supporting portion 87 and the heat dissipation component 9 is consistent with the connector mating direction (first direction Z) of the first connector 11 and the second connector 12, it is possible to limit the insertion of the first connector 11 and the second connector 12 beyond the specified size, and to prevent the first connector 11 and the second connector 12 from being over-inserted. In addition, over-insertion can also be prevented for the third connector 13 and the fourth connector 14. Therefore, plastic deformation or poor contact of the pins provided on the first connector 11 and the second connector 12 and the third connector 13 and the fourth connector 14 can be suppressed.

[0058] In this embodiment, the substrate holder 8 includes a pair of first frames 81 extending parallel to the third direction Y on either side of the drive circuit board 7 in the second direction X. A receiving portion 87 projects from each of the first frames 81 toward the center of the substrate holder 8 in the second direction X. This allows the drive circuit board 7 to be supported by receiving portions at two locations, enabling high-precision positioning of the drive circuit board 7. This prevents plastic deformation of the pins and contact failure. Furthermore, since the multiple receiving portions 87 contact the heat sink 9, heat dissipation is enhanced.

[0059] In this embodiment, four drive circuit boards 7 are mounted on a board holder 8. The board holder 8 can be provided with a receiving portion 87 in a manner that can accommodate changes in the number and arrangement of the drive circuit boards 7. For example, the frame and receiving portion 87 can be separated, and the mounting position of the receiving portion 87 can be changed according to the number and arrangement of the drive circuit boards 7.

[0060] In this embodiment, the substrate holder 8 includes a pair of second frames 82 extending parallel to the third direction Y at positions spaced apart in the first direction Z relative to the pair of first frames 81. Sliders 80 extending in the first direction are fixed to the first and second frames 81, 82. Thus, by assembling the frames in a lattice pattern to form the substrate holder 8, the substrate holder 8 has a structure with many gaps. Therefore, since heat can be dissipated through the gaps between the frames, heat dissipation can be improved. Furthermore, when assembling the substrate unit 5, the ends of the drive circuit substrate 7 are simply inserted into the grooves 80a of the slides 80 and inserted until the heat dissipation member 9 abuts the receiving portion 87. This facilitates assembly of the substrate unit 5 and positioning of the drive circuit substrate 7 in the first direction Z.

[0061] In this embodiment, the conductive member 17, whose ends are fixed to the pair of second frames 82, contacts the heat sink 9 from the Z1 side (the side opposite to the receiving portion 87). This prevents the heat sink 9 from floating from the receiving portion 87 due to vibration, etc., while the heat sink 9 and the conductive member 17 are in contact. Consequently, electrical conduction between the drive circuit board 7 and the board holder 8 can be reliably achieved via the heat sink 9.

[0062] In this embodiment, the heat dissipation member 9 includes a heat sink 91 that protrudes from a flat surface portion 90 facing the drive circuit substrate 7 in the third direction Y and extends in the second direction X. The heat sink 91 abuts the receiving portion 87 from the Z1 side. Consequently, the contact area between the receiving portion 87 and the heat dissipation member 9 is large, allowing a large amount of heat to be transferred to the substrate holder 8. This allows a large amount of heat to be dissipated from the substrate holder 8, improving heat dissipation.

[0063] In this embodiment, the Z2-side edge 70 of the driver circuit board 7 includes a first portion 71 where the first connector 11 is located, and a second portion 72 that protrudes further toward the control circuit board 4 than the first portion 71. The second portion 72 is dimensioned to abut against the control circuit board 4 before the first connector 11 is over-inserted into the second connector 12. This more reliably prevents over-insertion of the connectors. Alternatively, a configuration may be employed where the second portion 72 is omitted.

[0064] Reference numerals

[0065] 1…controller; 2…housing; 2a…front panel; 2b…back panel; 2c…side panel; 2d…side panel; 2e…bottom panel; 2f…top panel; 2g…stepped pin; 2h…stepped pin; 3…communication board unit; 4…control circuit board; 5…board unit; 6…fan; 7…drive circuit board; 8…board holder; 9…heat sink; 9A…first heat sink; 9B…second heat sink; 10…heating element; 10A…first heat sink; 10B…second heat sink; 11…first connector; 12…second connector; 13…third connector; 14…fourth connector; 15…gasket; 16…position adjustment Whole component; 16a…abutting portion; 16b…cut-out portion; 17…conductive component; 17A…first conductive component; 17B…second conductive component; 18…first bent portion; 19…second bent portion; 70…edge portion; 71…first portion; 72…second portion; 80…slider; 80a…groove; 81…first frame; 82…second frame; 83…third frame; 84…fourth frame; 85…fifth frame; 86…sixth frame; 87…supporting portion; 90…flat portion; 91…heat sink; 821…first plate portion; 822…second plate portion; 823…third plate portion; 824…fourth plate portion; 825…cut-out portion.

Claims

1. A controller, characterized in that: have: a first substrate, the first substrate being provided with a heating element and a first connector; a heat dissipation component fixed to the first substrate; a second substrate having a second connector engaged with the first connector and intersecting the first substrate; a substrate holder, the substrate holder supporting the first substrate; as well as a supporting member that supports the second substrate and the substrate holder, The mating direction of the first connector relative to the second connector is set as a first direction, A direction intersecting the first direction and along the surface direction of the first substrate is defined as a second direction. When a direction intersecting the first direction and the second direction is defined as a third direction, A pair of sliders extending along the first direction on both sides of the first substrate in the second direction are provided. The substrate holder includes: a pair of first frames extending parallel to the third direction on both sides of the first substrate in the second direction; a pair of second frames extending parallel to the third direction at positions spaced apart from the pair of first frames in the first direction; and a connecting frame connecting the pair of first frames and the pair of second frames. The first frame, the second frame, and the connecting frame are assembled into a frame shape, and are separately formed from a frame body serving as an exterior of the controller. The substrate holder has a receiving portion, and the heat dissipation component abuts against the receiving portion in the first direction directly or via a position adjustment component to transfer heat of the heat dissipation component. The slider includes a groove into which the end portion of the first substrate is inserted, and is fixed to the first frame and the second frame.

2. The controller according to claim 1, characterized in that The receiving portion protrudes from the pair of first frames toward the center of the substrate holder in the second direction.

3. The controller according to claim 1, wherein: A conductive member fixed to the pair of second frames, The conductive member contacts the heat dissipating member from a side opposite to the receiving portion.

4. The controller according to any one of claims 1 to 3, characterized in that The heat dissipation component includes: a planar portion facing the first substrate and the heat generating element; and a heat dissipation fin protruding from the planar portion along the third direction and extending along the second direction. The receiving portion abuts against the heat sink.

5. The controller according to any one of claims 1 to 3, characterized in that: The edge portion of the first substrate in the first direction includes: a first portion where the first connector is arranged; and a second portion that protrudes further toward the second substrate than the first portion. The second portion abuts the second substrate before the first connector is over-inserted relative to the second connector.

6. The controller according to claim 4, characterized in that The edge portion of the first substrate in the first direction includes: a first portion where the first connector is arranged; and a second portion that protrudes further toward the second substrate than the first portion. The second portion abuts the second substrate before the first connector is over-inserted relative to the second connector.

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