Micromechanical speed sensor assembly, speed sensor array and corresponding manufacturing method

Abstract

The present invention realizes a micromechanical rotation speed sensor assembly, a rotation speed sensor array and a corresponding manufacturing method. The micromechanical rotation speed sensor assembly comprises: a first rotation speed sensor device (100) which can be driven by a drive device (AT1, AT2) via a drive frame device (RA1a, RA1b, RA2a, RA2b) to rotate and oscillate around a first axis (z), and is used to sense a first external rotation speed around a second axis (y) and a second external rotation speed around a third axis (x), wherein the first, second and third axes (z, y, x) are arranged perpendicular to each other; and a second rotation speed sensor device (200) which can be driven by the drive device (AT1, AT2) via the drive frame device (RA1a, RA1b, RA2a, RA2b) to linearly oscillate along the second axis (y), and is used to sense a third external rotation speed around the first axis (z). The first rotation speed sensor device (100) is connected to the second rotation speed sensor device (200) via the drive frame device (RA1a, RA1b, RA2a, RA2b). The drive frame device (RA1a, RA1b, RA2a, RA2b) has a first drive frame (RA1a, RA1b) and a second drive frame (RA2a, RA2b), which can be driven by the drive device (AT1, AT2) to oscillate in anti-phase along the third axis (x). The rocker connects the first and second rotor devices and the first and second drive frames.

Description

Technical Field

[0001] The invention relates to a micromechanical rotation speed sensor component, a rotation speed sensor array and a corresponding manufacturing method. Background Art

[0002] DE 10 2017 / 216010 A1 and US 2019 / 0078887 A1 disclose a micromechanical rotational speed sensor assembly. The micromechanical rotational speed sensor assembly has a first rotational speed sensor device that can be driven in a rotational manner and a second rotational speed sensor device that can be driven in a linear oscillating manner. Other rotational speed sensors are disclosed in DE 10 2010 062 095 A1, WO 96 / 39615 A1, DE 10 2010 061755 A1 and DE 10 2011 006 394 A1. Summary of the invention

[0003] The invention realizes a micromechanical rotational speed sensor component according to claim 1 , a micromechanical rotational speed sensor array according to claim 12 , and a corresponding production method according to claim 13 .

[0004] Preferred embodiments are the subject matter of the respective dependent claims.

[0005] Therefore, the present invention realizes a micromechanical rotational speed sensor assembly, which has: a first rotational speed sensor device that can be driven by a drive device via a drive frame device to rotate and oscillate around a first axis, for sensing a first external rotational speed around a second axis and a second external rotational speed around a third axis, wherein the first, second and third axes are arranged perpendicular to each other; and a second rotational speed sensor device that can be driven by a drive device via a drive frame device to linearly oscillate along the third axis, for sensing the third external rotational speed around the first axis. The first rotational speed sensor device is connected to the second rotational speed sensor device via the drive frame device. The drive frame device has a first drive frame and a second drive frame, which can be driven by the drive device to oscillate in anti-phase along the third axis. The first rotational speed sensor device that can be driven by rotation has a first rotor device and a second rotor device, the first rotor device can be driven to oscillate around the first axis, and the second rotor device can be driven to oscillate in anti-phase relative to the first rotor device around the first axis. The first rotor device can be tilted by the first external rotational speed around the second axis and by the second external rotational speed around the third axis, wherein the second rotor device can be tilted anti-parallel relative to the first rotor device by the first external rotational speed around the second axis and the second external rotational speed around the third axis. Furthermore, the first rotational speed sensor device that can be driven in rotation has a first coupling device and a second coupling device, the first coupling device having a first spring device, by which the first rotor device and the second rotor device are coupled in such a way that parallel tilting about the second axis is suppressed and anti-parallel tilting about the second axis is possible, and the second coupling device, by which the first rotor device and the second rotor device are coupled in such a way that parallel tilting about the third axis is suppressed and anti-parallel tilting about the third axis is possible. The first sensing device is used to sense anti-parallel tilting of the first and second rotor devices about the second axis, and the second sensing device is used to sense anti-parallel tilting of the first and second rotor devices about the third axis. The second coupling device has first to third rockers, wherein the first rocker is connected to the first rotor device and the first drive frame by the spring device, the second rocker is connected to the second rotor device and the second drive frame by the spring device, and the first and second rockers are respectively connected to the third rocker by the spring device. The second coupling device has fourth to sixth rocker arms, wherein the fourth rocker arm is connected to the first rotor device and the first drive frame via a spring device, the fifth rocker arm is connected to the second rotor device and the second drive frame via a spring device, and the fourth and fifth rocker arms are respectively connected to the sixth rocker arm via a spring device.

[0006] Advantages of the present invention

[0007] The invention is based on the idea of ​​connecting a uniaxial rotational speed sensor and a biaxial rotational speed sensor via a common drive. The resulting triaxial rotational speed sensor is robust against external linear and rotational accelerations, so that it meets the requirements for safety-related applications in the automotive environment in particular.

[0008] A micromechanical rotational speed sensor assembly with a common drive mechanism for all three measuring axes offers several advantages over three separate rotational speed sensors. Since only one drive mechanism is present, a drive structure as well as connection pads and associated wiring can be omitted in the sensor core. The ASIC can therefore also be designed compactly, since only one drive control circuit has to be provided. It is particularly advantageous to avoid different drive frequencies for different rotational speed sensors, so that mutual influences due to parasitic crosstalk of the drive forces, for example, can be avoided. In addition, packaging becomes simpler and possible misalignment of the individual rotational speed sensors relative to one another is excluded by the design of the rotational speed sensor assembly according to the invention.

[0009] Interference modes can be avoided, which can lead to false signals in a three-axis rotational speed sensor in various ways, for example by (resonant) excitations caused by external forces (vibrations) or by nonlinear crosstalk that can occur in the mechanics or electrostatics of the system. If, on the other hand, three identical single-axis rotational speed sensors are used, all of them have the same interference modes, which are at different frequencies due to the process, so that the number of interference modes in the observed frequency range is tripled overall. It is therefore possible in a multi-axis rotational speed sensor to also reduce the interference modes by having the same detection structure be sensitively designed for more than just one measuring axis.

[0010] According to the invention, three rockers are provided twice, which together connect the first rotor device, the second rotor device, the first drive frame and the second drive frame. The rockers can rotate about parallel axes, wherein the middle rocker tilts in an antiparallel manner relative to the outer rockers. This type of construction can be achieved with a small number of spring devices. The construction with a less meandering structure allows the rotational speed sensor assembly to be configured smaller. In addition, the frequency of the tilting can be better adjusted.

[0011] According to a preferred extension, the second rotational speed sensor device that can be driven linearly has a frame device with a first partial frame and a second partial frame, wherein the first partial frame and the second partial frame can be driven in an oscillating manner along a third axis. Therefore, the second rotational speed sensor device includes only one detection frame, which is divided into a first partial frame and a second partial frame. The detection frame moves together during the drive movement. The first and second partial frames can be deflected in an anti-phase oscillating manner along the second axis by a third external rotation speed about the first axis. Preferably, the frame device consists of exactly two partial frames. By reducing the mechanically movable structures, the number of modes that can be excited at low frequencies can be reduced in an advantageous manner.

[0012] According to another preferred embodiment, the linearly drivable second rotational speed sensor device has a frame device with a first frame and a second frame, wherein the second frame is at least partially surrounded by the first frame, wherein the first frame can be driven in an oscillatory manner along a third axis, and wherein the second frame can be driven in an oscillatory manner in antiphase relative to the first frame along the third axis, wherein the first and second frames can be displaced in an antiphase oscillatory manner along the second axis by a third external rotational speed about the first axis, and wherein the first frame has a first subframe and a second subframe, and the second frame has a third subframe and a fourth subframe. A third coupling device and a fourth coupling device are provided, by which the first subframe and the third subframe are coupled in such a way that an in-phase displacement of the first and third subframes along the third axis is suppressed and an anti-phase displacement of the first and third subframes along the third axis is achieved, and by which the second subframe and the fourth subframe are coupled in such a way that an in-phase displacement of the second and fourth subframes along the third axis is suppressed and an anti-phase displacement of the second and fourth subframes along the third axis is achieved. The third sensing device is used to sense an anti-phase displacement of the first and second frames along the second axis. A rotational speed sensor device of this type can be coupled well to a first rotational speed sensor device which can be driven in rotation.

[0013] According to another preferred embodiment, a coupling device is provided for connecting the first drive frame section to the third drive frame section and a coupling device is provided for connecting the second drive frame section to the fourth drive frame section. This allows effective linear coupling of the further drive frames.

[0014] According to another preferred embodiment, the drive device has a first drive part for driving the first drive frame and a second drive part for driving the second drive frame. This enables symmetrical driving.

[0015] According to another preferred embodiment, the drive device has a single common drive for driving the first drive frame and for driving the second drive frame. This saves space in terms of design.

[0016] According to another preferred embodiment, the first and / or the second rotor arrangement has one or more orthogonal electrodes which are designed to interact with orthogonal electrodes located below them. This increases the driving accuracy.

[0017] According to another preferred embodiment, further electrodes are arranged below the first and / or second rotor arrangement, by means of which orthogonal movements can be compensated and / or test signals can be applied. This type of arrangement can be provided in particular in the case of open-loop control. Furthermore, electrodes can be provided for frequency tuning and for detecting drive movements.

[0018] According to another preferred embodiment, the first sensor device and the second sensor device each have a plurality of capacitive plate electrodes, which are arranged below the first and second rotor devices. In this way, the tilting can be reliably detected.

[0019] According to another preferred embodiment, the third sensor device has a plurality of capacitive comb electrodes, which are arranged within the first and second frames. In this way, antisymmetric deviations can be reliably detected.

[0020] According to another preferred extension, the micromechanical rotational speed sensor assembly has an additional second rotational speed sensor device, wherein the first rotational speed sensor device is connected to the additional second rotational speed sensor device via a drive frame device. The second rotational speed sensor device and the additional second rotational speed sensor device can be constructed identically. In particular, the additional second rotational speed sensor device can also be driven by the drive device via the drive frame device in a linear oscillating manner along a third axis for sensing a third external rotational speed around the first axis. The second rotational speed sensor device and the additional second rotational speed sensor device are preferably mounted symmetrically relative to the first rotational speed sensor device. By improving the symmetry, the influence of production tolerances can be reduced. The entire rotational speed sensor device is symmetrical about two perpendicular axes, the intersection of the axes being located at the center point of the rotational speed sensor device.

[0021] Particularly advantageously, the micromechanical rotational speed sensor array has a plurality of micromechanical rotational speed sensor components arranged in an array and connected to one another, each of which has a second rotational speed sensor device and a further second rotational speed sensor device, thereby making the overall design more symmetrical. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In the following, other features and advantages of the present invention are explained based on embodiments with reference to the accompanying drawings.

[0023] The accompanying drawings show:

[0024] Figure 1 A schematic plan view for explaining a micromechanical rotational rate sensor assembly according to a first specific embodiment of the present invention;

[0025] Figure 2 A schematic plan view for illustrating an alternative second rotational speed sensor arrangement;

[0026] Figure 3 A schematic plan view for explaining a micromechanical rotational rate sensor assembly according to a second specific embodiment of the present invention;

[0027] Figure 4 An enlarged partial view of a first alternative coupling type of the first and second drive frames of the rotational speed sensor assembly according to the first embodiment of the present invention;

[0028] Figure 5 An enlarged partial view of a second alternative coupling type of the first and second drive frames of the rotational speed sensor assembly according to the first embodiment of the present invention;

[0029] Figure 6 A schematic plan view for explaining a micromechanical rotational rate sensor assembly according to a third specific embodiment of the present invention;

[0030] Figure 7 a)-c) schematic plan views for explaining different spring suspension arrangements for a micromechanical rotational speed sensor assembly according to the invention;

[0031] Figure 8 A schematic plan view for explaining a micromechanical rotational rate sensor assembly according to a fourth specific embodiment of the present invention;

[0032] Fig. 9 a schematic plan view for explaining a micromechanical rotational rate sensor assembly according to a fifth specific embodiment of the present invention; and

[0033] Fig.10 A schematic plan view for explaining a rotational rate sensor array according to one specific embodiment of the present invention. DETAILED DESCRIPTION

[0034] In the figures, the same reference symbols denote the same elements or elements having the same function.

[0035] Figure 1 A schematic plan view is shown to illustrate a micromechanical rotational rate sensor arrangement according to a first specific embodiment of the present invention.

[0036] exist Figure 1 1 , reference numeral 100 denotes a first rotational speed sensor device that can be driven in a rotational oscillating manner around a first axis (z-axis) for sensing a first external rotational speed around a second axis (y-axis) and a second external rotational speed around a third axis (x-axis). The first, second and third axes (z, y, x) are arranged perpendicularly relative to each other.

[0037] First rotatably driven rotational speed sensor device 100 has a first rotor device 1a which can be driven in an oscillating manner about a first axis (z-axis) and a second rotor device 1b which can be driven in an oscillating manner about the first axis (z-axis) in antiphase with respect to first rotor device 1a.

[0038] In the present first embodiment, the first rotor arrangement 1 a and the second rotor arrangement 1 b are designed in the form of a square disk, wherein the associated first or second suspension device A1 a , A1 b is arranged and anchored in the respective central recess.

[0039] The first rotor arrangement 1a can be tilted at a first external rotational speed about a second axis (y-axis) and a second external rotational speed about a third axis (x-axis). The second rotor arrangement 1b can be tilted antiparallel to the first rotor arrangement 1a at a first external rotational speed about the second axis (y-axis) and a second external rotational speed about the third axis (x-axis).

[0040] The first and second rotor devices 1a, 1b are coupled via a first spring device F13 as a first coupling device in such a way that parallel tilting about the second axis (y-axis) is suppressed and antiparallel tilting about the second axis (y-axis) is possible, ie due to anisotropic spring constants.

[0041] In addition, a second coupling device K1, K2 is provided, by which the first rotor device 1a and the second rotor device 1b are coupled in such a way that parallel tilting about the third axis (x-axis) is suppressed and anti-parallel tilting about the third axis (x-axis) is possible, that is, also based on the anisotropic spring constant of the second coupling devices K1, K2.

[0042] The second coupling device K1, K2 has a first part K1 with a first swing rod 3a1, which is connected to the first rotor device 1a via a first spring device y3 and a connecting element 3d. The second swing rod 3a2 is connected to the second rotor device 1b via a second spring device y4 and a connecting element 3c2. The first and second swing rods 3a1, 3a2 are connected to the third swing rod 3a via a third or fourth spring device y4, y6 respectively. The third swing rod 3a is fastened to the substrate (not shown) via a first elastic suspension part A1.

[0043] In addition, the second coupling device K1, K2 has fourth to sixth swing rods 3b, 3b1, 3b2, wherein the fourth swing rod 3b1 is connected to the first rotor device 1a via a fifth spring device y9 and a connecting element 3d1. The fifth swing rod 3a2 is connected to the second rotor device 1b via a sixth spring device y10 and a connecting element 3d2. The fourth and fifth swing rods 3b1, 3b2 are connected to the sixth swing rod 3b via a seventh or eighth spring device y11, y12, respectively. The sixth swing rod 3b is fastened to the substrate via a second elastic suspension portion A2.

[0044] Furthermore, the first and second rocker 3a1, 3a2 are connected to the first and second drive frame sections RA1a, RA1b via ninth and tenth spring devices y1 and y2, wherein the first and second drive frame sections RA1a, RA1b are part of the first drive frames RA1a, RA1b.

[0045] Finally, the fourth rocker 3b1 and the fifth rocker 3b2 are connected to the third and fourth partial drive frames RA2a and RA2b via the eleventh and twelfth spring devices y7 and y8 respectively, wherein the third and fourth partial drive frames RA2a and RA2b are part of the second drive frames RA2a, RA2b.

[0046] The first sensing means CPY, CNY, CPY', CNY' are used to sense the antiparallel tilting of the first and second rotor means 1a, 1b around the second axis (y-axis). The second sensing means CPX, CNX, CPX', CNX' are used to sense the antiparallel tilting of the first and second rotor means 1a, 1b around the third axis (x-axis).

[0047] The first sensing device CPY, CNY, CPY', CNY' and the second sensing device CPX, CNX, CPX', CNX' each have, for example, a plurality of capacitive plate electrodes or further electrodes, by means of which orthogonal movements can be compensated and / or test signals can be applied, and which are arranged below the first and second rotor devices 1a, 1b, such as at Figure 1 As schematically indicated by the circles in FIG.

[0048] A drive device AT1 , AT2 with a first drive part AT1 and a second drive part AT2 , for example a comb drive (shown only schematically), is provided for linear oscillatory drive along a third axis (x axis).

[0049] The first driving unit AT1 is connected to the first driving frames RA1a and RA1b.

[0050] The second driving unit AT2 is connected to the second driving frames RA2a and RA2b.

[0051] The first drive frame RA1a, RA1b and the second drive frame RA2a, RA2b are angularly designed and extend laterally on the first rotor arrangement 1a in the plane of the first rotor arrangement 1a.

[0052] The first partial drive frame RA1a is connected to the substrate (not shown) via springs F1, F2. The second partial drive frame RA1b is connected to the substrate via springs F3, F4. Furthermore, the first partial drive frame RA1a and the second partial drive frame RA1b are connected to each other via springs F5. The springs F1 to F5 are configured such that an oscillating motion along the third axis (x-axis) is preferred.

[0053] The third partial drive frame RA2a is connected to the substrate (not shown) via springs F6, F7. The fourth partial drive frame RA2b is connected to the substrate via springs F8, F9. Furthermore, the third partial drive frame RA2a and the fourth partial drive frame RA2b are connected to each other via spring F10. The springs F6 to F10 are also configured such that an oscillating motion along the third axis (x axis) is preferred.

[0054] Springs F10, F14 connect the third and fourth partial drive frames RA2a, RA2b.

[0055] The third partial drive frame RA2a and the fourth partial drive frame RA2b surround the second rotor device 1b and a second rotational speed sensor device 200 which can be driven in a linear oscillating manner along a third axis (x axis) for sensing a third external rotational speed about the first axis (z axis), which second rotational speed sensor device is explained in more detail below.

[0056] Furthermore, third and fourth drive frame sections RA2a and RA2b extend in the intermediate space between first and second rotational speed sensor device 100 and 200 , where they are connected to one another via springs F14 .

[0057] Furthermore, the first partial drive frame RA1a and the third partial drive frame RA2a are connected via springs F11, and the second partial drive frame RA1b and the fourth partial drive frame RA2b are connected to each other via springs F12. The springs F11, F12 are configured such that anti-phase oscillating motions along the third axis (x axis) are preferred and in-phase motions are suppressed. The respective directions of the drive motions AB of the first and second drive frames RA1a, RA1b, RA2a, RA2b are indicated by corresponding arrows.

[0058] Second rotational speed sensor device 200 has a frame device with a first frame R1a, R1b and a second frame R2a, R2b, wherein the first frame R1a, R1b has a first partial frame R1a and a second partial frame R1b and the second frame R2a, R2b has a third partial frame R2a and a fourth partial frame R2b. The second frame R2a, R2b is surrounded by the first frame R1a, R1b on three adjacent sides.

[0059] The first frame R1a, R1b can be driven oscillatingly along the third axis x by the second drive part AT2 via the third and fourth partial drive frames RA2a, RA2b and the spring devices F20-F23, F30-F33.

[0060] The second frame R2a, R2b can be driven indirectly via the first frame R1a, R1b in an oscillating manner in antiphase relative to the first frame R1a, R1b along the third axis x, because a spring device F71-F74 is provided, by which the first partial frame R1a and the third partial frame R2a are coupled in such a way that an in-phase deflection of the first and third partial frames R1a, R2a along the third axis x is suppressed and an anti-phase deflection of the first and third partial frames R1a, R2a along the third axis x is enabled. The second partial frame R1b and the fourth partial frame R2b are coupled via similar spring devices F81-F84 in such a way that an in-phase deflection of the second and fourth partial frames R1b, R2b along the third axis x is suppressed and an anti-phase deflection of the second and fourth partial frames R1b, R2b along the third axis x is enabled.

[0061] Anisotropic spring devices F24, F25, F91, and F92 connect the third partial frame 35R2a to the substrate, anisotropic spring devices F26, F27, F93, and F94 connect the fourth partial frame R2b to the substrate, and anisotropic spring device F15 connects the substrate to the third partial frame R2a and the fourth partial frame R2b and connects the third partial frame R2a and the fourth partial frame R2b to each other.

[0062] The first and second frames R1a, R1b, R2a, R2b can be displaced in antiphase oscillations along the second axis y by a third external rotation speed about the first axis z. The direction of the drive movement AB and the direction of the detection movement DB are indicated by corresponding arrows.

[0063] The third sensing device EK1, EK2, for example a capacitive comb structure, is used to sense anti-phase displacements of the first and second frames R1a, R1b, R2a, R2b along the second axis y, wherein in the present example only the anti-phase displacements of the third partial frame R2a and the fourth partial frame R2b are sensed by the third sensing device EK1, EK2.

[0064] Figure 2 A schematic plan view is shown for illustrating an alternative second rotational speed sensor device 200'. The second rotational speed sensor device comprises a frame device R1a', R1b' having a first partial frame R1a', R1b' and a second partial frame R1b', wherein the first partial frame R1a', R1b' and the second partial frame R1b' can be driven in an oscillating manner along a third axis x. The first and second partial frames R1a', R1b' can be displaced in an anti-phase oscillating manner along a second axis y by a third external rotational speed about a first axis z. In particular, the frame device R1a', R1b' consists of exactly two partial frames R1a', R1b', instead of consisting of Figure 1 The four partial frames R1a, R1b, R2a, R2b shown are composed.

[0065] Figure 3 A schematic plan view is shown to illustrate a micromechanical rotational rate sensor arrangement according to a second specific embodiment of the present invention.

[0066] The second embodiment is similar to the one described above according to Figure 1 The first embodiment is constructed in the same manner as the first embodiment of the present invention and differs only in that the first partial drive frame RA1a and the third partial drive frame RA2a are not directly connected to each other and the second partial drive frame RA1b and the fourth partial drive frame RA2b are not directly connected to each other. The first partial drive frame RA1a is connected to the substrate via springs F2a, the second partial drive frame RA1b is connected to the substrate via springs F4a, the third partial drive frame RA2a is connected to the substrate via springs F7a, and the fourth partial drive frame is connected to the substrate via springs F9a.

[0067] In the second embodiment, the indirect connection of the first drive frame RA1a, RA1b and the second drive frame RA2a, RA2b is set by the components y1-y6, 3a, 3a1, F3a2 described above on one side of the first rotational speed sensing device 100 and by the components y7-y12, 3b, 3b1, 3b2 described above on the opposite side.

[0068] Figure 4 An enlarged partial view showing a first alternative coupling type of the first and second drive frames of the rotational speed sensor assembly according to the first embodiment of the present invention is shown.

[0069] In a first alternative coupling type, the first drive frame section RA1a and the third drive frame section RA2a each have an angled end E1 or E2, wherein a square spring F12b is inserted between the ends E1, E2 and anchored in the substrate.

[0070] Figure 5An enlarged partial view showing a second alternative coupling type of the first and second drive frames of the rotational speed sensor assembly according to the first specific embodiment of the present invention.

[0071] In a second alternative coupling type, the first drive frame section RA1a and the second drive frame section RA2a also have an angled end E1 or E2, respectively, wherein a U-shaped spring F12c is inserted between the ends E1, E2 and anchored in the substrate. In addition, a spring F1c anchored in the substrate at the first end E1 and a spring F2c anchored in the substrate at the second end are provided in the substrate.

[0072] Figure 6 A schematic plan view is shown to illustrate a micromechanical rotational rate sensor arrangement according to a third specific embodiment of the present invention.

[0073] In the third embodiment, the first drive frame section RA1a' and the second drive frame section RA1b' are not angular but linear and are not connected to one another because the spring F5 is omitted.

[0074] In particular, in this third embodiment only one drive is provided, here the second drive AT2, which has already been described above.

[0075] In addition, the first driving portion AT1 may be omitted in an embodiment in which all of the first driving frames RA1a, RA1b and the second driving frames RA2a, RA2b are linearly coupled to each other.

[0076] Furthermore, an orthogonal electrode Q1 mounted on the first rotor device 1a is schematically shown, which interacts capacitively with the orthogonal electrode Q2 located below it to prevent movement outside the xy plane by applying a corresponding voltage. Of course, orthogonal electrodes of this type can be arranged at different locations of the two rotor devices 1a, 1b in order to stabilize the operation of the first rotation speed sensing device.

[0077] Figure 7 a)-c) show schematic plan views for explaining different spring suspension arrangements for the micromechanical rotational rate sensor assembly according to the invention.

[0078] exist Figure 7 In particular, three different configurations A′, A″ and A″ of the first and second suspension arrangements A1a , A1b of the first and second rotor arrangements 1a , 1b are shown in a) to c).

[0079] The first configuration has a first folding spring L1 which is rotatable about a first axis (z-axis) and can be tilted about a second axis (y-axis) and a third axis (x-axis).

[0080] The second configuration has a different folding spring L2 that has the same mechanical properties.

[0081] The third configuration A1"' has a combination of elastic springs L3a, L3b, L3c, which are connected to each other via rigid curved arc elements RK1, RK2. The third configuration A1"' can also be rotated about a first axis (z axis) and tilted about a second axis (y axis) and a third axis (x axis).

[0082] The suspension devices A', A", and A'" are each anchored centrally on a substrate (not shown).

[0083] Figure 8 A schematic plan view is shown to illustrate a micromechanical rotational rate sensor arrangement according to a fourth specific embodiment of the present invention.

[0084] The fourth embodiment corresponds to the first embodiment, wherein the second driving portion AT2' is not arranged outside the second driving frames RA2a', RA2b' but inside the second driving frames RA2a', RA2b'.

[0085] Furthermore, the second drive frame is interrupted, wherein the edge regions RA2a", RA2b" are connected to the substrate only via the springs F7, F9 but are not directly connected to the second driver AT2'.

[0086] Fig. 9 A schematic plan view is shown for explaining a micromechanical rotational speed sensor assembly according to a fifth specific embodiment of the present invention. The micromechanical rotational speed sensor assembly has two second rotational speed sensor devices 200, wherein the first rotational speed sensor device 100 is connected to the second rotational speed sensor devices 200 via drive frame devices RA1', RA2'. The two second rotational speed sensor devices 200 are arranged symmetrically with respect to the rotor devices 1a', 1b' of the first rotational speed sensor device 100.

[0087] This illustration is to be understood as schematic. In particular, first and second rotational speed sensor devices 100 , 200 and drive frame devices RA1 ′, RA2 ′ may be any of the embodiments shown above.

[0088] Fig.10 A schematic plan view for explaining a rotation speed sensor array according to an embodiment of the present invention is shown. The micromechanical rotation speed sensor array has a plurality of micromechanical rotation speed sensor components arranged in an array shape and connected to each other, such as Fig. 9 The rotation speed sensor components are connected to each other via rigid connecting parts V1 and V2.

[0089] Although the invention has been described with reference to preferred embodiments, it is not limited thereto. In particular the materials and arrangements mentioned are exemplary only and are not limited to the illustrated examples.

[0090] The geometry and symmetry of the first and second rotational rate sensor devices shown in the above specific embodiments are merely exemplary and can be varied as required.

Claims

1. A micromechanical rotation speed sensor assembly, the micromechanical rotation speed sensor assembly comprising: A first rotational speed sensor device (100) which can be driven in a rotationally oscillating manner about a first axis (z) by a drive device (AT1, AT2; AT2; AT1', AT2') via a drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2') for sensing a first external rotational speed about a second axis (y) and a second external rotational speed about a third axis (x), wherein The first, second and third axes (z, y, x) are arranged perpendicularly relative to each other; and a second rotational speed sensor device (200) which can be driven in a linear oscillating manner along the third axis (x) by the drive device (AT1, AT2; AT2; AT1', AT2') via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'; RA1', RA2') for sensing a third external rotational speed about the first axis (z); wherein the first rotation speed sensor device (100) is connected to the second rotation speed sensor device (200) via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'); wherein the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'; RA1', RA2') comprises a first drive frame (RA1a, RA1b; RA1') and a second drive frame (RA2a, RA2b; RA2'), the first drive frame and the second drive frame being drivable in anti-phase oscillation along the third axis (x) by the drive device (AT1, AT2; AT2; AT1', AT2'), The first rotation speed sensor device (100) capable of being driven to rotate comprises: a first rotor device (1a; 1a') which is drivable in an oscillating manner about the first axis (z); a second rotor device (1b; 1b') which can be driven in an oscillating manner in antiphase with respect to the first rotor device (1a; 1a') about the first axis (z); wherein the first rotor arrangement (1a; 1a') is tiltable by a first external rotational speed about the second axis (y) and by a second external rotational speed about the third axis (x), and wherein the second rotor arrangement (1b; 1b') is tiltable in an antiparallel manner relative to the first rotor arrangement (1a; 1a') by a first external rotational speed about the second axis (y) and a second external rotational speed about the third axis (x); a first coupling device (F5; F6; SA, SB, F12), the first coupling device having a first spring device (F13), by means of which the first rotor device (1a; 1a') and the second rotor device (1b; 1b') are coupled in such a way that parallel tilting about the second axis (y) is suppressed and anti-parallel tilting about the second axis (y) is possible; a second coupling device (K1, K2), by means of which the first rotor device (1a; 1a') and the second rotor device (1b; 1b') are coupled in such a way that parallel tilting about the third axis (x) is suppressed and anti-parallel tilting about the third axis (x) is possible; first sensing means (CPY, CNY; CPY', CNY') for sensing antiparallel tilting of said first and second rotor means (1a; 1a'; 1b; 1b') about said second axis (y); and second sensing means (CPX, CNX; CPX', CNX') for sensing antiparallel tilting of said first and second rotor means (1a; 1a'; 1b; 1b') about said third axis (x), It is characterized in that The second coupling device (K1, K2) has first to third rocker arms (3a, 3a1, 3a2), wherein the first rocker arm (3a1) is connected to the first rotor device (1a) and the first drive frame (RA1a) via a spring device (y3, y5), the second rocker arm (3a2) is connected to the second rotor device (1b) and the second drive frame (RA2a) via a spring device, and the first and second rocker arms (3a1, 3a2) are respectively connected to the third rocker arm (3a) via a spring device; and The second coupling device (K1, K2) has fourth to sixth rocker arms (3b, 3b1, 3b2), wherein the fourth rocker arm (3b1) is connected to the first rotor device (1a) and the first drive frame (RA1b) via a spring device (y7), the fifth rocker arm (3b2) is connected to the second rotor device (1b) and the second drive frame (RA2b) via a spring device (y8, y10), and the fourth and fifth rocker arms (3b1, 3b2) are respectively connected to the sixth rocker arm (3b) via spring devices (y11, y12).

2. The micromechanical rotation speed sensor assembly according to claim 1, wherein: The second rotation speed sensor device (200) capable of being driven linearly has: a frame arrangement (R1a', R1b') having a first partial frame (R1a') and a second partial frame (R1b'), wherein the first partial frame (R1a', R1b') and the second partial frame (R1b') are drivable in an oscillating manner along the third axis (x), In this case, the first and second frame parts (R1a', R1b') can be displaced in an anti-phase oscillating manner along the second axis (y) by a third external rotational speed about the first axis (z).

3. The micromechanical rotation speed sensor assembly according to claim 1, wherein: The second rotation speed sensor device (200) capable of being driven linearly has: A frame device (R1a, R1b; R2a, R2b) having a first frame (R1a, R1b) and a second frame (R2a, R2b); wherein the second frame (R2a, R2b) is at least partially surrounded by the first frame (R1a, R1b); wherein the first frame (R1a, R1b) is drivable in an oscillatory manner along the third axis (x), and wherein the second frame (R2a, R2b) is drivable in an oscillatory manner in anti-phase relative to the first frame (R1a, R1b) along the third axis (x); wherein the first and second frames (R1a, R1b; R2a, R2b) are displaceable along the second axis (y) in an anti-phase oscillating manner by a third external rotation speed about the first axis (z); wherein the first frame (R1a, R1b) comprises a first partial frame (R1a) and a second partial frame (R1b), and the second frame (R2a, R2b) comprises a third partial frame (R2a) and a fourth partial frame (R2b); a third coupling device (F71-F74), by which the first partial frame (R1a) and the third partial frame (R2a) are coupled in such a way that an in-phase shift of the first and third partial frames (R1a; R2a) along the third axis (x) is suppressed and an anti-phase shift of the first and third partial frames (R1a; R2a) along the third axis (x) is enabled; a fourth coupling device (F81-F84), by which the second partial frame (R1b) and the fourth partial frame (R2b) are coupled in such a way that an in-phase shift of the second and fourth partial frames (R1b; R2b) along the third axis (x) is suppressed and an anti-phase shift of the second and fourth partial frames (R1b; R2b) along the third axis (x) is enabled; and Third sensing means (EK1, EK2) for sensing anti-phase displacement of said first and second frames (R1a, R1b; R2a, R2b) along said second axis (y).

4. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: A coupling device (F11) is provided for connecting the first partial drive frame of the first drive frame with the third partial drive frame of the second drive frame, and a coupling device (F12) is provided for connecting the second partial drive frame of the first drive frame with the fourth partial drive frame of the second drive frame.

5. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: The driving device (AT1, AT2; AT2; AT1', AT2') has a first driving part (AT1; AT1') for driving the first driving frame (RA1a, RA1b; RA1') and a second driving part (AT2; AT2') for driving the second driving frame (RA2a, RA2b; RA2').

6. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: The drive device (AT1, AT2; AT2; AT1', AT2') has a single common drive (AT2) for driving the first drive frame (RA1a, RA1b; RA1') and for driving the second drive frame (RA2a, RA2b; RA2').

7. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: One or more test signal electrodes are arranged below the first and / or second rotor device (1a; 1b; 1a'; 1b').

8. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: The first and / or second rotor device (1a; 1b; 1a'; 1b') has one or more orthogonal electrodes (Q1) which are configured to cooperate with an orthogonal electrode (Q2) located therebelow.

9. The micromechanical rotation speed sensor assembly according to any one of claims 1 to 3, wherein: The first sensing device (CPY, CNY; CPY', CNY') and the second sensing device (CPX, CNX; CPX', CNX') respectively have a plurality of capacitive plate electrodes, which are arranged below the first and second rotor devices (1a; 1b; 1a'; 1b').

10. The micromechanical rotation speed sensor assembly according to claim 3, wherein: The third sensing device (EK1, EK2, EK3) has a plurality of capacitive comb electrodes, which are arranged inside the first and second frames (R1, R2; R1', R2'; R1", R2").

11. The micromechanical rotational speed sensor assembly according to claim 1, comprising a second additional rotational speed sensor device (200), wherein: The first rotational speed sensor device (100) is connected to the further second rotational speed sensor device (200) via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'; RA1', RA2'). 12 . A micromechanical rotational speed sensor array, comprising a plurality of micromechanical rotational speed sensor components according to claim 1 , wherein the micromechanical rotational speed sensor components are arranged in an array and connected to one another.

13. A method for manufacturing a micromechanical rotation speed sensor assembly, the method comprising the following steps: forming a drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'; RA1', RA2'), the drive frame device having a first drive frame (RA1a, RA1b; RA1') and a second drive frame (RA2a, RA2b; RA2'), the first drive frame and the second drive frame being drivable in anti-phase oscillation along a third axis (x) by a drive device (AT1, AT2; AT2; AT1', AT2'); A first rotation speed sensor device (100) is formed which can be driven by the drive device (AT1, AT2; AT2; AT1', AT2') via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2') to rotate and oscillate around a first axis (z) for sensing a first external rotation speed around a second axis (y) and a second external rotation speed around a third axis (x), wherein The first, second and third axes (z, y, x) are arranged perpendicularly relative to each other; and, A second rotation speed sensor device (200) is formed which can be driven in a linear oscillating manner along the third axis (x) by the drive device (AT1, AT2; AT2; AT1', AT2') via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'; RA1', RA2') for sensing a third external rotation speed around the first axis (z); and The first rotation speed sensor device (100) is connected to the second rotation speed sensor device (200) via the drive frame device (RA1a, RA1b, RA2a, RA2b; RA1a', RA1b', RA2a, RA2b; RA1', RA2'), The first rotation speed sensor device (100) capable of being driven to rotate comprises: a first rotor device (1a; 1a') which is drivable in an oscillating manner about the first axis (z); a second rotor device (1b; 1b') which can be driven in an anti-phase oscillating manner about the first axis (z) relative to the first rotor device (1a; 1a'); wherein the first rotor arrangement (1a; 1a') is tiltable by a first external rotational speed about the second axis (y) and by a second external rotational speed about the third axis (x), and wherein the second rotor arrangement (1b; 1b') is tiltable in an antiparallel manner relative to the first rotor arrangement (1a; 1a') by a first external rotational speed about the second axis (y) and a second external rotational speed about the third axis (x); a first coupling device (F5, F6; SA, SB, F12), the first coupling device having a first spring device (F13), by means of which the first rotor device (1a; 1a') and the second rotor device (1b; 1b') are coupled in such a way that parallel tilting about the second axis (y) is suppressed and anti-parallel tilting about the second axis (y) is possible; a second coupling device (K1, K2), by means of which the first rotor device (1a; 1a') and the second rotor device (1b; 1b') are coupled in such a way that parallel tilting about the third axis (x) is suppressed and anti-parallel tilting about the third axis (x) is possible; first sensing means (CPY, CNY; CPY', CNY') for sensing antiparallel tilting of said first and second rotor means (1a; 1a'; 1b; 1b') about said second axis (y); and second sensing means (CPX, CNX; CPX', CNX') for sensing antiparallel tilting of said first and second rotor means (1a; 1a'; 1b; 1b') about said third axis (x), It is characterized in that The second coupling device (K1, K2) has first to third rocker arms (3a, 3a1, 3a2), wherein the first rocker arm (3a1) is connected to the first rotor device (1a) and the first drive frame (RA1a) via a spring device (y3, y5), the second rocker arm (3a2) is connected to the second rotor device (1b) and the second drive frame (RA2a) via a spring device, and the first and second rocker arms (3a1, 3a2) are respectively connected to the third rocker arm (3a) via a spring device; and The second coupling device (K1, K2) has fourth to sixth rocker arms (3b, 3b1, 3b2), wherein the fourth rocker arm (3b1) is connected to the first rotor device (1a) and the first drive frame (RA1b) via a spring device (y7), the fifth rocker arm (3b2) is connected to the second rotor device (1b) and the second drive frame (RA2b) via a spring device (y8, y10), and the fourth and fifth rocker arms (3b1, 3b2) are respectively connected to the sixth rocker arm (3b) via spring devices (y11, y12).

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