Inspection device

Abstract

An inspection device according to one aspect of the present invention comprises: a first substrate; a second substrate arranged on the side of the inspection substrate surface so as to surround the inspection substrate; an irradiation element arranged on the first substrate for irradiating light of a first color toward the inspection substrate surface; two irradiation elements arranged on the second substrate for irradiating light of a different color from the first color toward the inspection substrate surface; a light projection portion for irradiating a specified pattern light from the first substrate located in an inclined direction relative to the inspection substrate surface toward the inspection substrate surface; a first camera for focusing the pattern light reflected near the inspection substrate surface and outputting an image reflecting the inspection substrate surface, and for focusing the light reflected at the solder and outputting an image reflecting the shape of the solder; and a second camera for focusing the light reflected at the solder and outputting an image reflecting the shape of the solder.

Description

Technical Field

[0001] The present invention relates to an inspection device. Background Art

[0002] In the past, a lattice pattern of light was irradiated from an illumination device onto the object to be inspected, and the object to be inspected was photographed by a photographing device (for example, Patent Documents 1-2). More specifically, the illumination device is arranged obliquely above the object to be inspected. Furthermore, a photographing device that measures the pattern of reflected light after being reflected on the surface of the object to be inspected is arranged above the object to be inspected. In the case of such a structure, a pattern of reflected light associated with the height of the object to be inspected is reflected in the image captured by the photographing device. Therefore, the height of the components mounted on the substrate can be analyzed based on the pattern, and the welding status of the components can be inspected.

[0003] In addition, in the past, a plurality of lighting devices were used to illuminate the surface of a substrate on which components were mounted with light of different colors, and the shape of the solder fillet at the root of the component was photographed (for example, Patent Document 3). More specifically, the lighting device was arranged above the surface of the substrate. Moreover, the photographing device for photographing the solder fillet portion was also arranged above the surface of the substrate. In the case of such a structure, the distribution of colors corresponding to the shape of the solder fillet is reflected in the image captured by the photographing device. Therefore, by comparing the obtained color distribution with the color distribution serving as the inspection reference, it is possible to inspect for solder defects.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 5847568

[0007] Patent Document 2: Japanese Patent No. 5948496

[0008] Patent Document 3: Japanese Patent Application Publication No. 2019-144209 Summary of the Invention

[0009] Problems to be solved by the invention

[0010] For example, one could consider combining patent documents 1-3 to inspect the soldering condition by analyzing the height of the component soldered to the substrate surface and the shape of the component's solder legs. In the techniques disclosed in patent documents 1-2, a camera is positioned above the object being inspected. Therefore, it can be considered that it would be difficult to install a lighting device that illuminates a specified color in a location where the camera is positioned. Therefore, when photographing the solder legs of a component, it is possible to consider the color loss that may appear in the captured image. Consequently, it can be considered that the accuracy of solder defect inspection is reduced.

[0011] Furthermore, when an illumination device is placed above the subject, the distance from the illumination device to the subject is long, which may reduce the amount of light of each color reaching the subject from the illumination device. This may result in reduced illumination efficiency or uneven illumination in the captured image.

[0012] Furthermore, it is conceivable that the size, number, or placement location of the imaging device and the lighting device are limited, which may reduce the freedom of design changes in the inspection device and the scalability of the inspection device.

[0013] One aspect of the present invention has been made in view of such actual circumstances, and an object of the present invention is to provide a technology that suppresses a decrease in inspection accuracy while being configured to simultaneously inspect the dimensions of a component soldered to a substrate surface and the shape of the solder.

[0014] Means for solving problems

[0015] In order to solve the above-mentioned problems, the present invention adopts the following configuration.

[0016] That is, an inspection device according to one aspect of the present invention comprises: a first substrate, which is arranged in a manner that the first mounting surface faces the inspection substrate surface, and the shape of the first mounting surface is symmetrical about a central axis orthogonal to the first mounting surface; a second substrate, which is arranged on the side of the inspection substrate surface in a manner that surrounds the inspection substrate, the second substrate extends from the edge of the first mounting surface in a direction orthogonal to the first mounting surface, and is arranged in a manner that the second mounting surface faces the inspection substrate surface; a first illuminating element, which is arranged on the first mounting surface and irradiates light of a first color toward the inspection substrate surface; a second illuminating element, which is arranged in a region of the second mounting surface that is closer to the first mounting surface than the center in a manner that surrounds the inspection substrate surface, and irradiates light of a second color toward the inspection substrate surface; a third illuminating element, which is arranged in a region of the second mounting surface that is farther from the first mounting surface than the location where the second illuminating element is arranged in a manner that surrounds the inspection substrate surface, and irradiates light of a third color toward the inspection substrate surface; a light portion, which irradiates a prescribed pattern light toward the inspection substrate surface from near the first mounting surface located in an inclined direction relative to the inspection substrate surface; a first camera, which is arranged near the first mounting surface opposite to the inspection substrate surface in a manner capable of focusing the pattern light irradiated from the light projection portion and reflected near the inspection substrate surface, and outputs an image reflecting the inspection substrate surface, and the first camera is arranged to focus the light irradiated from the first irradiation element, the second irradiation element, and the third irradiation element and reflected from the solder attached to the component mounted on the inspection substrate surface, and outputs an image reflecting the shape of the solder; and a second camera, which is arranged near the first mounting surface located in an inclined direction relative to the inspection substrate surface, and is arranged to focus the light irradiated from the first irradiation element, the second irradiation element, and the third irradiation element and reflected from the solder attached to the component mounted on the inspection substrate surface, and outputs an image reflecting the shape of the solder.

[0017] Specifically, the present invention mounts the first illuminating element on the first substrate, and the second and third illuminating elements are mounted on the second substrate. Furthermore, the present invention allows the light projector and the second camera to be positioned in the same direction. Furthermore, the present invention allows the first mounting surface of the first substrate to be polygonal in shape, allowing for arbitrary changes in the number and placement of the light projectors and second cameras.

[0018] Here, the inspection substrate surface includes an inspection target surface in the inspection target object.

[0019] This configuration allows the shape of the solder on components mounted on the inspection substrate surface to be inspected based on the images output by the first and second cameras, and the height of the components from the inspection substrate surface to be inspected based on the patterned light reflected in the image output by the first camera. This configuration thus enables simultaneous inspection of both the dimensions of components soldered to the substrate surface and the shape of the solder.

[0020] Furthermore, with this configuration, the second camera is positioned obliquely relative to the inspection substrate surface. Therefore, even if the inspection object is covered by a covering member, and the amount of light reaching the first camera's condenser lens is reduced by reflection from solder attached to the component mounted on the inspection substrate surface, the second camera can still focus the light reflected from the solder attached to the component mounted on the inspection substrate surface. Consequently, the second camera can output an image reflecting the solder shape, enabling inspection.

[0021] Furthermore, according to this configuration, the first, second, and third illuminating elements are not all mounted on the first substrate facing the inspection substrate. Instead, the second and third illuminating elements are mounted on the second substrate disposed to the side of the inspection substrate. Therefore, compared to a case where the first, second, and third illuminating elements are all mounted on the first substrate, a decrease in the amount of light emitted from the illuminating elements and reaching the inspection substrate surface can be suppressed. This prevents a decrease in illumination efficiency and the occurrence of uneven illumination in the captured image.

[0022] Furthermore, even when the mounting area on the first substrate is limited by enabling the first camera to be positioned near the first substrate, the use of the second substrate allows any of the first, second, and third illumination elements to be positioned within this configuration. This prevents partial color loss when the images output by the first and second cameras show a distribution of colors corresponding to the shape of solder attached to a component. This prevents a decrease in solder shape inspection accuracy.

[0023] Furthermore, according to this structure, when the shape of the first substrate is polygonal, the number of second substrates increases according to the number of edges of the first substrate. Therefore, the second substrate can be used to change the sizes of the first illuminating element, the second illuminating element, and the third illuminating element according to the inspection. Such a structure can increase the degree of freedom in design changes and improve the expandability of the device. Therefore, it is easy to cope with different inspections. In addition, according to such a structure, the number or location of the light-emitting unit and the second camera can be arbitrarily changed. Based on this point, it can be said that the degree of freedom in design changes can be increased and the expandability of the device can be improved. Therefore, based on this point, it can be said that it is easy to cope with different inspections.

[0024] In the inspection device of one aspect mentioned above, it may also be provided with a diffusion component, which diffuses the respective lights irradiated from the first irradiation element, the second irradiation element and the third irradiation element, and the diffusion component is arranged so as not to overlap with the straight line connecting the light-projecting portion and the inspection substrate surface and the straight line connecting the first camera and the inspection substrate surface.

[0025] With this configuration, the provision of a diffusion component prevents the light emitted from the first, second, and third illuminating elements from directly impinging on the inspection substrate surface. This prevents the images of the solder shape output by the first and second cameras from becoming blurred due to direct light. Consequently, a decrease in the accuracy of solder defect inspection can be minimized.

[0026] Furthermore, according to this configuration, the diffusion component is positioned so as not to overlap with the straight line connecting the light projector and the inspection substrate surface, or the straight line connecting the first camera and the inspection substrate surface. Therefore, the patterned light emitted from the light projector and reflected from the inspection substrate is focused onto the condenser lens of the first camera without passing through the diffusion component. Consequently, the patterned light reflected in the image output by the first camera is sharper. Therefore, the provision of the diffusion component can suppress a decrease in inspection accuracy due to the height of the component above the inspection substrate surface.

[0027] In the inspection device of one aspect above, the diffusion component may also be a dome-shaped diffusion plate arranged in a manner covering the inspection substrate surface, and the diffusion plate has holes passing through along the directions of the respective straight lines in the portion overlapping with the straight line connecting the light-projecting portion and the inspection substrate surface and the portion overlapping with the straight line connecting the first camera and the inspection substrate surface.

[0028] This configuration, by providing a dome-shaped diffuser, easily prevents the light emitted from the first, second, and third illuminating elements from directly striking the inspection substrate surface. This effectively prevents the images output by the first and second cameras from becoming blurred due to direct light. This also minimizes any reduction in solder defect inspection accuracy.

[0029] Furthermore, according to this configuration, the diffuser plate is positioned so as not to overlap with the straight line connecting the light projector and the inspection substrate surface, or the straight line connecting the first camera and the inspection substrate surface. Therefore, the patterned light emitted from the light projector and reflected from the inspection substrate is focused onto the condenser lens of the first camera without passing through the diffuser plate. Consequently, the patterned light reflected in the image output by the first camera is sharper. Therefore, by providing a dome-shaped diffuser plate, it is possible to easily suppress a decrease in inspection accuracy due to the height of the component above the inspection substrate surface.

[0030] In the inspection device of one aspect mentioned above, it may also be provided with: a first partition component which separates the configuration portion of the first irradiation element from the space in a direction perpendicular to the irradiation direction of the first irradiation element; and a second partition component which separates the configuration portion of the second irradiation element from the configuration portion of the third irradiation element.

[0031] This configuration prevents light emitted from one of the first, second, and third illuminating elements from mixing with light emitted from the other of the first, second, and third illuminating elements. This prevents the images output from the first and second cameras from becoming blurred. Consequently, a decrease in the accuracy of solder defect inspection can be minimized.

[0032] In the inspection device of one aspect above, the shape of the first mounting surface of the first substrate may be an octagon, the second substrate may extend from eight sides of the edge of the first mounting surface in a direction perpendicular to the first mounting surface, the first substrate may have a first cutout portion arranged at the center of each of every four sides in the circumferential direction among the eight sides, the second substrate may have a second cutout portion capable of communicating with the first cutout portion in a portion close to the first cutout portion, and the light projection portion and the second camera may be arranged at the first hole formed by the first cutout portion and the second cutout portion.

[0033] According to this configuration, four light projectors can be provided. Therefore, due to the large number of light projectors, shadows can be suppressed in the image output by the first camera. Consequently, a decrease in the inspection accuracy of the component height from the inspection substrate surface can be suppressed.

[0034] In addition, according to this structure, the light projecting unit and the second camera can be arranged in the first hole. In other words, compared with the case where the light projecting unit and the second camera are arranged in separate holes, the area of ​​the first substrate that is cut away is reduced. Therefore, the rigidity of the first substrate is improved. In addition, it is possible to suppress light from leaking to the outside through the cutout of the first substrate. In addition, the area of ​​the dome-shaped diffuser plate that is cut away is reduced. Therefore, it is possible to suppress the shadow corresponding to the cutout portion from appearing in the image output from the first camera and the second camera. Therefore, the color information data of the first illumination element, the second illumination element, and the third illumination element that are illuminated on the substrate inspection surface are less defective, which helps to improve the inspection performance.

[0035] In the inspection device of one aspect above, the first substrate may also have a third cutout portion provided at the center of each of the four sides among the eight sides on which the first cutout portion is not provided, and the second substrate may have a fourth cutout portion provided at the center of each of the four sides parallel to and close to the eight sides of the first substrate and on which the second cutout portion is not provided, the third cutout portion being provided so as to form a third hole connected to the second cutout portion and capable of configuring the second camera by rotating the first substrate around a central axis orthogonal to the first mounting surface, and the fourth cutout portion being provided so as to form a fourth hole connected to the first cutout portion and capable of configuring the light-projecting portion when the first substrate is rotated.

[0036] According to this structure, by rotating the first substrate around a central axis perpendicular to the first mounting surface, the light projecting unit can be set in the fourth hole and the second camera can be set in the third hole. That is, the light projecting unit and the second camera can be arranged in different locations. Therefore, for example, when two light projecting units are provided, it is possible to suppress the projection of shadows in the image output by the second camera. Therefore, it is possible to suppress the reduction in the inspection accuracy of the solder shape of the components mounted on the inspection substrate surface. In addition, whether the number of light projecting units is 4 or 2, the first substrate can be used in both cases by rotating the first substrate around a central axis perpendicular to the first mounting surface. Such a structure is highly adaptable and convenient.

[0037] Effects of the Invention

[0038] According to the present invention, it is possible to provide a technique for suppressing a decrease in inspection accuracy when a configuration is made capable of simultaneously inspecting the dimensions of a component soldered to a substrate surface and the shape of the solder. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] [ Figure 1 ] Figure 1 An overview of an inspection device according to an embodiment is shown.

[0040] [ Figure 2 ] Figure 2 An example of a cross-sectional view of an inspection device is shown.

[0041] [ Figure 3 ] Figure 3 An overview of an inspection device according to a modified example is shown. DETAILED DESCRIPTION

[0042] An embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") is described below with reference to the accompanying drawings. However, the embodiment described below is merely illustrative of the present invention in all respects. Various improvements and modifications are naturally possible without departing from the scope of the present invention. Specifically, specific structures corresponding to the embodiment may be appropriately adopted when implementing the present invention.

[0043] §1 Structure Example

[0044] [Hardware structure]

[0045] Figure 1 The overview of the inspection apparatus 100 of this embodiment is shown. Figure 2 express Figure 1 An example of a cross-sectional view in . The inspection device 100 irradiates red, blue, and green light toward the component welded on the surface of the inspection substrate 4. Then, by focusing the light reflected at the solder leg at the root of the component, an image of the solder leg is obtained to inspect the state of the welding. In addition, the inspection device 100 irradiates stripe-patterned light from the projector 7 toward the surface direction of the inspection substrate 4 including the component. Furthermore, by focusing the light reflected on the surface of the inspection substrate 4 including the component, a pattern of reflected light associated with the height of the component can be obtained. Then, the height of the component is inspected by analyzing the obtained reflected light pattern. In addition, in the following description, the up and down directions and the left and right directions represent Figure 2 direction in.

[0046] More specifically, the inspection device 100 includes an imaging main substrate 1 and an illumination LED substrate 2. The imaging main substrate 1 is shaped like an octagon that is symmetrical about a central axis perpendicular to itself. The illumination LED substrate 2 is arranged so that the mounting surface thereof is located perpendicular to the mounting surface of the imaging main substrate 1 from each of the eight sides of the imaging main substrate 1. Then, an inspection substrate 4 ( Figure 2 ). In the following description, the surface of the imaging main substrate 1 exposed to the internal space is referred to as the mounting surface of the imaging main substrate 1. Similarly, the surface of the lighting LED substrate 2 exposed to the internal space is referred to as the mounting surface of the lighting LED substrate 2. In addition, soldered components are provided on the mounting surface of the inspection substrate 4. In addition, the imaging main substrate 1 is an example of the "first substrate" of the present invention. In addition, the lighting LED substrate 2 is an example of the "second substrate" of the present invention.

[0047] In addition, the inspection device 100 includes LED 3A. Figure 2As shown, LED 3A is provided on the mounting surface of imaging main substrate 1. LED 3A emits red light toward inspection substrate 4. LED 3A is an example of the "first illuminating element" of the present invention. Red is an example of the "first color" of the present invention.

[0048] In addition, the inspection device 100 includes LED 3B. Figure 2 As shown, LED 3B is positioned above the internal space of the illumination LED substrate 2, on the mounting surface thereof. LED 3B emits green light toward the inspection substrate 4. LED 3B is an example of the "second illuminating element" of the present invention. Green is also an example of the "second color" of the present invention.

[0049] In addition, the inspection device 100 includes LED 3C. Figure 2 As shown, LED 3C is positioned on the mounting surface of illumination LED substrate 2 and in the lower portion of the internal space. LED 3C emits blue light toward inspection substrate 4. LED 3C is an example of the "third illuminating element" of the present invention. Blue is also an example of the "third color" of the present invention.

[0050] In addition, the inspection device 100 includes partitions 13A and 10B. The partition 13A is provided orthogonally to the mounting surface of the imaging main substrate 1 in a manner that surrounds the location where the LED 3A is mounted on the imaging main substrate 1. In addition, the partition 13B is provided orthogonally to the mounting surface of the lighting LED substrate 2 in a manner that separates the locations where the LEDs 3B and LEDs 3C are mounted, respectively. By using such partitions 13A and 10B, it is possible to prevent light irradiated from one of the LEDs 3A, 3B, and 3C from mixing with light irradiated from the other LEDs 3A, 3B, and 3C. In addition, the partition 13A is an example of the "first partition member" of the present invention. In addition, the partition 13B is an example of the "second partition member" of the present invention.

[0051] In addition, the inspection device 100 includes a diffuser plate 5. Figure 2 As shown, the diffuser plate 5 is dome-shaped and is arranged to cover the inspection substrate 4. The diffuser plate 5 diffuses the light emitted from the LEDs 3A, 3B, and 3C. Therefore, the light emitted from the LEDs 3A, 3B, and 3C reaches the inspection substrate 4 from multiple directions without omission.

[0052] In addition, the inspection device 100 is equipped with a LED / projector camera 6. Figure 1 and Figure 2As shown, the LED / projector camera 6 is arranged in the center of the imaging main substrate 1, with the condenser lens facing the inspection substrate 4. Moreover, the light emitted from the LEDs 3A, 3B, and 3C, respectively, and reflected from the solder legs at the base of the components mounted on the inspection substrate 4, enters the condenser lens of the LED / projector camera 6. In addition, a hole 11 is provided in the center of the imaging main substrate 1 for allowing the light reflected from the inspection substrate 4 to pass through. In addition, the patterned light emitted from the four projectors 7 (described later) and reflected from the inspection substrate 4 and the components mounted on the inspection substrate 4 enters the condenser lens of the LED / projector camera 6. The LED / projector camera 6 is an example of the "first camera" of the present invention.

[0053] In addition, the inspection device 100 includes a projector 7. Figure 1 As shown, projectors 7 are positioned obliquely above the inspection substrate 4 and capture the edge of the main substrate 1. Four projectors 7 are arranged at 90-degree intervals around a central axis perpendicular to the mounting surface for capturing the main substrate 1. Light is emitted from each of the four projectors 7 toward the inspection substrate 4. The emitted light is generated within the projectors 7, for example, in a striped pattern on a surface perpendicular to the irradiation direction. Slits 8 are provided from each side of the octagonal main substrate 1 toward the center, allowing light emitted from the projectors 7 to pass through. To allow the irradiated light that passes through the slits 8 to pass through, four holes 15 are provided in the oblique upper portion of the dome-shaped diffuser plate 5, extending along the line connecting the individual light irradiation sections of the projectors 7 with the inspection substrate 4. Furthermore, a hole is provided in the upper portion of the diffuser plate 5, connecting to the hole 11 for capturing the main substrate 1 and extending along the line connecting the LED / projector camera 6 with the inspection substrate 4. The projector 7 is an example of the "light projecting portion" of the present invention. The cutout 8 is an example of the "first cutout portion" of the present invention.

[0054] In addition, the inspection device 100 includes an LED camera 9. Figure 1 and Figure 2 As shown, the LED camera 9 is arranged obliquely above the inspection substrate 4 and near each of the four projectors 7. Light emitted from the LEDs 3A, 3B, and 3C and reflected from the solder pins at the base of the components mounted on the inspection substrate 4 enters the condenser lenses of the four LED cameras 9. Figure 1As shown, a notch 10 connected to notch 8 is provided at the edge of the illumination LED substrate 2 near notch 8. This reflected light passes through the hole formed by notch 8 and notch 10 and enters the respective condenser lenses of the LED camera 9. Furthermore, a notch 10A having the same shape as notch 10 is provided at the edge of the illumination LED substrate 2 not adjacent to notch 8. Furthermore, a notch 12 connected to notch 10A is provided at the edge of the imaging main substrate 1 near notch 10A. In other words, even when the LED camera 9 is positioned near the hole formed by notch 12 and notch 10A, the condenser lens of the LED camera 9 can still condense the light emitted from the LEDs 3A, 3B, and 3C and reflected from the solder fillets at the base of the components mounted on the inspection substrate 4. Furthermore, the dimensions of the notches (10, 10A) and notch 12 are smaller than those of the notch 8, through which the light emitted from the projector 7 passes. LED camera 9 is an example of the "second camera" of the present invention. Notch 10 is an example of the "second notch portion" of the present invention. Notch 12 is an example of the "third notch portion" of the present invention. Notch 10A is an example of the "fourth notch portion" of the present invention.

[0055] [Function / Effect]

[0056] Furthermore, according to the inspection device 100 described above, the height of the component from the mounting surface of the inspection substrate 4 can be inspected based on the patterned light reflected in the image output by the LED / projector camera 6. Furthermore, based on the images output by the LED / projector camera 6 and the LED camera 9, the state of the solder fillets of the component mounted on the inspection substrate 4 can be inspected. Therefore, such an inspection device 100 can simultaneously inspect the height of the component soldered to the mounting surface of the inspection substrate 4 and the shape of the solder fillets of the component.

[0057] Furthermore, according to the inspection device 100 described above, the LEDs 3A, 3B, and 3C are not all mounted on the imaging main substrate 1 that faces the inspection substrate 4. Instead, the LEDs 3B and 3C are mounted on the illumination LED substrate 2 that is disposed to the side of the mounting surface of the inspection substrate 4. Therefore, compared to a case where the LEDs 3A, 3B, and 3C are all mounted on the imaging main substrate 1, a decrease in the amount of light emitted from the LEDs 3A, 3B, and 3C and reaching the mounting surface of the inspection substrate 4 is suppressed. Consequently, a decrease in illumination efficiency or the occurrence of uneven illumination in the captured image is suppressed.

[0058] Furthermore, according to the inspection device 100 described above, a hole 11 is provided in the central portion of the imaging main substrate 1 for allowing light reflected from the inspection substrate 4 to pass through. Therefore, the mounting area of ​​the imaging main substrate 1 is limited to locations other than where the hole 11 is located. However, according to the inspection device 100 described above, LEDs 3B and 3C are mounted on the illumination LED substrate 2. Therefore, even if the mounting area of ​​the imaging main substrate 1 is limited by the hole 11, any of LEDs 3A, 3B, and 3C can be installed. Therefore, the images output by the LED / projector camera 6 and the LED camera 9 reflect a color distribution corresponding to the shape of the component's solder fillet, suppressing color loss in a portion of the light emitted from the LEDs 3A, 3B, and 3C. Consequently, a decrease in the accuracy of solder defect inspection can be suppressed.

[0059] Furthermore, according to the inspection apparatus 100 described above, the light emitted from the LEDs 3A, 3B, and 3C is diffused by the diffuser plate 5. Therefore, it is possible to easily prevent these lights from directly impinging on the mounting surface of the inspection substrate 4. Consequently, it is possible to easily prevent unevenness, lumps, and the like from appearing in the images output from the LED / projector camera 6 and the LED camera 9. Consequently, it is possible to easily prevent a decrease in the accuracy of solder defect inspections.

[0060] Furthermore, according to the inspection apparatus 100 described above, the patterned light emitted from the projector 7 passes through the holes 15 in the diffuser plate 5 and is incident on the inspection substrate 4. Furthermore, the patterned light reflected by the inspection substrate 4 is focused by the condenser lens of the LED / projector camera 6 through the holes provided in the upper portion of the diffuser plate 5 and the holes 11 provided in the imaging main substrate 1. As a result, the patterned light appears clearly in the image output by the LED / projector camera 6. Therefore, by providing the diffuser plate 5, it is possible to easily suppress a decrease in the inspection accuracy of the component height from the mounting surface of the inspection substrate 4.

[0061] Furthermore, according to the inspection apparatus 100 described above, partition plates 13A and 10B can prevent light emitted from one of LEDs 3A, 3B, and 3C from mixing with light emitted from the other of LEDs 3A, 3B, and 3C. Consequently, it is possible to prevent the images output from LED / projector camera 6 and LED camera 9 from becoming blurred. Consequently, it is possible to prevent a decrease in the accuracy of solder defect inspections.

[0062] Furthermore, according to the inspection apparatus 100 described above, four projectors 7 are provided. Therefore, the large number of projectors 7 can suppress shadows from being reflected in the image output by the LED / projector camera 6. Consequently, a decrease in the inspection accuracy of the component height from the mounting surface of the inspection substrate 4 can be suppressed.

[0063] Furthermore, according to the inspection device 100 described above, the projector 7 and the LED camera 9 are arranged in the hole formed by the cutout 8 and the cutout 10. In other words, compared to a case where the projector 7 and the LED camera 9 are arranged in separate holes, the area of ​​the imaging main substrate 1 that is cut away is reduced. Therefore, the rigidity of the imaging main substrate 1 is improved. Furthermore, it is possible to suppress light leakage to the outside through the cutout of the imaging main substrate 1. Furthermore, since the cutout area of ​​the diffuser plate 5 is reduced, it is possible to suppress the shadow corresponding to the cutout portion from appearing in the image output from the LED / projector camera 6 and the LED camera 9. Consequently, the color information data of the LEDs 3A, 3B, and 3C that illuminate the inspection substrate 4 is reduced in size, thereby improving inspection performance.

[0064] Furthermore, according to the inspection apparatus 100 described above, by utilizing eight illumination LED substrates 2, the sizes of the LEDs 3A, 3B, and 3C can be changed according to the inspection. This inspection apparatus 100 can increase the degree of freedom in design changes and improve the scalability of the inspection apparatus 100. Therefore, it can easily cope with various inspections.

[0065] Furthermore, according to the inspection apparatus 100 described above, the LED camera 9 is arranged at an angle relative to the inspection substrate 4. Therefore, even if the amount of light reflected from solder attached to a component mounted on the inspection substrate 4 and reaching the condenser lens of the LED / projector camera 6 is reduced, the LED camera 9 can still condense the light reflected from the solder attached to the component mounted on the inspection substrate 4. Consequently, the LED camera 9 can output an image reflecting the shape of the solder, enabling inspection.

[0066] §2 Variations

[0067] While the embodiments of the present invention have been described in detail above, the above descriptions are merely illustrative of the present invention in all respects. Various improvements and modifications can, of course, be made without departing from the scope of the present invention. For example, the following modifications can be made. Furthermore, the same reference numerals will be used for the same components as those in the above embodiments, and descriptions of aspects common to the above embodiments will be omitted as appropriate. The following modifications can be appropriately combined.

[0068] Figure 3 FIG. 1 is a diagram showing an overview of an inspection apparatus 100A according to a modified example. Figure 3As shown, inspection apparatus 100A rotates imaging master substrate 1 45 degrees about a central axis perpendicular to the mounting surface of imaging master substrate 1. That is, in inspection apparatus 100, notches 8 and 10 form a single hole, but in inspection apparatus 100A, notches 8 and 10A form a single hole. Furthermore, in inspection apparatus 100, notches 12 and 10A form a single hole, but in inspection apparatus 100A, notches 12 and 10 form a single hole.

[0069] In addition, the inspection device 100A has two projectors 7. The two projectors 7 are located obliquely above the inspection substrate 4 and are symmetrically arranged about the central axis orthogonal to the mounting surface of the main substrate 1 for imaging. Moreover, the light irradiated from the projector 7 passes through the hole formed by the cutout 8 and the cutout 10A. In addition, the inspection device 100A has four LED cameras 9. The LED cameras 9 are arranged obliquely above the inspection substrate 4 and in the hole formed by the cutout 12 and the cutout 10. That is, the LED cameras 9 are offset from the projector 7 in optical axis and are symmetrically arranged about the central axis orthogonal to the mounting surface of the main substrate 1 for imaging. The light reflected from the inspection substrate 4 and the components mounted on the inspection substrate 4 is converged at the focusing lens of each LED camera 9 arranged in this way.

[0070] [Function / Effect]

[0071] In the case where two projectors 7 are configured, if an LED camera 9 is set near the configuration location of the projector 7, it is considered that a shadow will appear in the captured image captured and output by the LED camera 9. However, according to the inspection device 100A as described above, the projector 7 and the LED camera 9 are configured in different locations. Therefore, it is possible to suppress the shadow from appearing in the image output by the LED camera 9. Therefore, it is possible to suppress the reduction in the inspection accuracy of the height from the mounting surface of the inspection substrate 4. In addition, the shooting main substrate 1 in which the projector 7 and the LED camera 9 can be configured at the same position (inspection device 100) or different positions (inspection device 100A) can be said to be a substrate with a high degree of freedom in design changes. Such a shooting main substrate 1 can improve the scalability of the inspection device 100A. Therefore, it is possible to easily cope with different inspections.

[0072] Furthermore, according to the inspection apparatus 100A described above, the imaging main substrate 1 of the inspection apparatus 100 is rotated 45 degrees about a central axis perpendicular to the mounting surface of the imaging main substrate 1. In other words, the imaging main substrate 1 can be used regardless of whether the number of projectors 7 is four or two. The imaging main substrate 1 included in the inspection apparatus 100A is highly versatile and convenient.

[0073] Furthermore, by rotating and imaging the main substrate 1 as described above, it is possible to easily cope with a need to change the number or arrangement of the projectors 7 or LED cameras 9 depending on the inspection. Such an inspection apparatus 100 has high scalability and can easily cope with various inspections.

[0074] Other Modifications

[0075] The imaging main substrate 1 of the inspection device 100 described above is provided with the cutouts 12 and 10A, but these cutouts do not need to be provided. In this case, the only holes provided in the imaging main substrate 1 are those formed by the cutouts 8 and 10, so there are only four of them. This improves the rigidity of the imaging main substrate 1. Furthermore, it is possible to prevent light emitted from the LEDs 3A, 3B, and 3C, and light emitted from the projector 7, from leaking outside the inspection device 100 through these holes.

[0076] Furthermore, while the dome-shaped diffuser plate 5 is illustrated as an example of a diffuser member in this embodiment, the form of the diffuser member is not limited to the diffuser plate 5. The diffuser member only needs to be arranged so as to diffuse the light emitted from the LEDs 3A, 3B, and 3C so as not to overlap with the line connecting the projector 7 and the inspection substrate 4, or the line connecting the LED / projector camera 6 and the inspection substrate 4. Furthermore, the diffuser plate 5 may not be provided. Furthermore, the partition plates 13A and 13B may not be provided. Furthermore, the color of the light emitted from the LEDs 3A, 3B, and 3C is not limited to that in the above embodiment.

[0077] Furthermore, in the above embodiment, an octagonal shape is illustrated as the shape of the imaging main substrate 1. However, this is not limited to an octagon. Any shape may be symmetrical about a rotational axis perpendicular to itself. For example, a polygonal shape such as a pentagon or hexagon, or a disk-shaped substrate may also be used. With this shape of the imaging main substrate 1, the number of illuminated LED substrates 2 can be, for example, five or sixteen. This allows the size of the LEDs 3A, 3B, and 3C to be changed based on the inspection, utilizing the illuminated LED substrates 2. Furthermore, the number or placement of the projectors 7 or LED cameras 9 can be changed based on the inspection. This inspection device 100 increases the flexibility of design changes and improves its scalability. Consequently, it can easily accommodate various inspections.

[0078] Since it is highly expandable, it can be said to be a highly convenient structure.

[0079] The embodiments and modifications disclosed above can be combined.

[0080] In order to enable comparison between the components of the present invention and the configurations of the embodiments, the components of the present invention are described below with reference numerals of the drawings.

[0081] Note 1

[0082] An inspection device (100, 100A) comprising:

[0083] A first substrate (1) is arranged with a first mounting surface facing the inspection substrate (4), wherein the shape of the first mounting surface is symmetrical about a central axis orthogonal to the first mounting surface;

[0084] a second substrate (2) disposed on the side of the inspection substrate (4) in a manner surrounding the inspection substrate (4), extending from the edge of the first mounting surface in a direction perpendicular to the first mounting surface, and arranged in a manner such that the second mounting surface faces the inspection substrate (4);

[0085] a first irradiation element (3A) disposed on the first mounting surface and irradiating light of a first color toward the inspection substrate (4);

[0086] a second irradiation element (3B) arranged in a region of the second mounting surface closer to the first mounting surface than the center so as to surround the inspection substrate (4) surface, and irradiating light of a second color toward the inspection substrate (4) surface;

[0087] a third irradiation element (3C) arranged in a region of the second mounting surface that is farther from the first mounting surface than the location where the second irradiation element (3B) is arranged, so as to surround the inspection substrate (4) surface, and irradiates the inspection substrate (4) surface with light of a third color;

[0088] a light projecting section (7) for irradiating a predetermined pattern of light toward the surface of the inspection substrate (4) from the vicinity of the first mounting surface located in an oblique direction relative to the surface of the inspection substrate (4);

[0089] a first camera (6) arranged near the first mounting surface facing the inspection substrate (4) in a manner capable of focusing pattern light irradiated from the light projecting portion (7) and reflected near the surface of the inspection substrate (4), and outputting an image reflecting the surface of the inspection substrate (4); and the first camera (6) is arranged so as to focus light irradiated from the first irradiating element (3A), the second irradiating element (3B), and the third irradiating element (3C) and reflected at solder attached to a component mounted on the surface of the inspection substrate (4), and outputting an image reflecting the shape of the solder;

[0090] The second camera (9) is arranged near the first mounting surface in an inclined direction relative to the inspection substrate (4) surface, and is configured to focus the light irradiated from the first irradiation element (3A), the second irradiation element (3B) and the third irradiation element (3C) and reflected from the solder attached to the component mounted on the inspection substrate (4) surface, and output an image reflecting the shape of the solder.

[0091] Note 2

[0092] The inspection device (100, 100A) according to Supplementary Note 1, wherein:

[0093] The inspection device (100, 100A) further includes a diffusion member (5) for diffusing each light irradiated from the first irradiation element (3A), the second irradiation element (3B), and the third irradiation element (3C).

[0094] The diffusion component (5) is arranged so as not to overlap with a straight line connecting the light projecting portion (7) and the surface of the inspection substrate (4) and a straight line connecting the first camera (6) and the surface of the inspection substrate (4).

[0095] Note 3

[0096] The inspection device (100, 100A) according to Supplementary Note 2, wherein:

[0097] The diffusion component (5) is a dome-shaped diffusion plate (5) provided in a manner covering the surface of the inspection substrate (4).

[0098] The diffuser (5) has holes passing through along the directions of the respective straight lines at a portion overlapping with a straight line connecting the light-projecting portion (7) and the surface of the inspection substrate (4) and a portion overlapping with a straight line connecting the first camera (6) and the surface of the inspection substrate (4).

[0099] Note 4

[0100] The inspection device (100, 100A) according to any one of Supplementary Notes 1 to 3, wherein:

[0101] The inspection device (100, 100A) further comprises:

[0102] a first partition member (13A) that partitions the arrangement portion of the first irradiating element (3A) from the space in a direction perpendicular to the irradiation direction of the first irradiating element (3A); and

[0103] A second partition member (13B) is provided to separate a portion where the second irradiating element (3B) is disposed from a portion where the third irradiating element (3C) is disposed.

[0104] Note 5

[0105] The inspection device (100, 100A) according to any one of Supplementary Notes 1 to 4, wherein:

[0106] The shape of the first mounting surface of the first substrate (1) is an octagon,

[0107] The second substrate (2) extends from eight sides of the edge of the first mounting surface in a direction perpendicular to the first mounting surface.

[0108] The first substrate (1) has a first notch portion (8) provided at the center of each of every other four sides in the circumferential direction among the eight sides.

[0109] The second substrate (2) has a second cutout (10) at a portion close to the first cutout (8) that is communicable with the first cutout (8).

[0110] The light projecting unit (7) and the second camera (9) can be arranged at the first hole formed by the first cutout (8) and the second cutout (10).

[0111] <Note 6>

[0112] The inspection device (100, 100A) according to Supplementary Note 5, wherein:

[0113] The first substrate (1) has a third cutout portion (12) provided at the center of each of the four sides of the eight sides on which the first cutout portion (8) is not provided.

[0114] The second substrate (2) has a fourth cutout portion (10A) at the center of each of the four sides parallel to and close to the eight sides of the first substrate (1) and not provided with the second cutout portion (10).

[0115] The third cutout portion (12) is configured to form a third hole that is connected to the second cutout portion (10) and capable of arranging the second camera (9) by rotating the first substrate (1) around a central axis orthogonal to the first mounting surface.

[0116] The fourth cutout portion (10A) is provided so as to form a fourth hole communicating with the first cutout portion (8) and capable of arranging the light projecting portion (7) when the first substrate (1) is rotated.

[0117] Description of labels

[0118] 1: Photographing main substrate; 2: Illuminating LED substrate; 3A, 3B, 3C: LED; 4: Inspection substrate; 5: Diffuser; 6: Camera for LED / projector; 7: Projector; 8: Cutout; 9: Camera for LED; 10, 10A: Cutout; 11: Hole; 12: Cutout; 13A, 13B: Partition plate; 15: Hole; 100, 100A: Inspection device.

Claims

1. An inspection device comprising: a first substrate arranged with a first mounting surface facing the inspection substrate surface, wherein the first mounting surface is symmetrical about a central axis orthogonal to the first mounting surface; a second substrate disposed on the side of the inspection substrate surface so as to surround the inspection substrate, the second substrate extending from an edge of the first mounting surface in a direction perpendicular to the first mounting surface and arranged with the second mounting surface facing the inspection substrate surface; a first irradiating element, disposed on the first mounting surface and irradiating light of a first color toward the inspection substrate surface; a second irradiating element disposed in a region of the second mounting surface closer to the first mounting surface than the center thereof so as to surround the inspection substrate surface and irradiating light of a second color toward the inspection substrate surface; a third illuminating element disposed in a region of the second mounting surface that is farther from the first mounting surface than the location where the second illuminating element is disposed so as to surround the inspection substrate surface, and irradiating light of a third color toward the inspection substrate surface; a light projecting unit configured to irradiate a predetermined pattern of light toward the inspection substrate surface from the vicinity of the first mounting surface located in an oblique direction relative to the inspection substrate surface; a first camera disposed near the first mounting surface opposite to the inspection substrate surface in a manner capable of focusing patterned light irradiated from the light projecting portion and reflected near the inspection substrate surface, and outputting an image reflecting the inspection substrate surface; and the first camera is configured to focus light irradiated from the first irradiating element, the second irradiating element, and the third irradiating element and reflected from solder attached to a component mounted on the inspection substrate surface, and outputting an image reflecting the shape of the solder; as well as a second camera, disposed near the first mounting surface in an oblique direction relative to the inspection substrate surface, configured to focus light irradiated from the first irradiating element, the second irradiating element, and the third irradiating element and reflected from solder attached to a component mounted on the inspection substrate surface, and output an image reflecting the shape of the solder; The first mounting surface of the first substrate is in the shape of an octagon. The second substrate extends from eight sides of the edge of the first mounting surface in a direction perpendicular to the first mounting surface. The first substrate has a first notch portion provided at the center of each of every other four sides in the circumferential direction among the eight sides, and a third notch portion provided at the center of each of the four sides among the eight sides on which the first notch portion is not provided. The second substrate has a second cutout portion in a portion close to the first cutout portion, which is communicable with the first cutout portion, and a fourth cutout portion in the center of each of four sides that are parallel to the eight sides of the first substrate and close to the second cutout portion. The light projecting unit and the second camera can be arranged at the first hole formed by the first cutout and the second cutout. The third cutout is provided so that the first substrate is rotated about a central axis perpendicular to the first mounting surface to form a third hole communicating with the second cutout and capable of arranging the second camera. The fourth cutout portion is provided so as to form a fourth hole communicating with the first cutout portion and capable of arranging the light projecting portion when the first substrate is rotated.

2. The inspection device according to claim 1, wherein: The inspection device further includes a diffusion member that diffuses the light emitted from the first irradiation element, the second irradiation element, and the third irradiation element. The diffusion member is provided so as not to overlap with a straight line connecting the light projecting unit and the inspection substrate surface and a straight line connecting the first camera and the inspection substrate surface.

3. The inspection device according to claim 2, wherein: The diffusion component is a dome-shaped diffusion plate provided to cover the inspection substrate surface. The diffusion plate has holes penetrating along the directions of the respective straight lines in a portion overlapping with a straight line connecting the light projecting unit and the inspection substrate surface and a portion overlapping with a straight line connecting the first camera and the inspection substrate surface.

4. The inspection device according to any one of claims 1 to 3, wherein: The inspection device further comprises: a first partition member that partitions a portion where the first illuminating element is disposed from a space in a direction perpendicular to an illuminating direction of the first illuminating element; and The second partition member partitions the portion where the second irradiating element is disposed from the portion where the third irradiating element is disposed.

Images