A circuit board and a detection method thereof for convenient detection of lamination correctness

Abstract

The present invention discloses a circuit board and a detection method thereof for convenient detection of lamination correctness. The circuit board is formed by laminating an upper core board, a lower core board, and N inner core boards located between the upper core board and the lower core board. An insulating dielectric layer is provided between upper and lower adjacent inner core boards. The circuit board is provided with 2N+1 metallized through holes arranged in sequence and passing through the circuit board from top to bottom. The upper surface of the upper core board is provided with a first conductive area that is convenient for connecting to an external circuit and electrically connected to the first metallized through hole. The lower surface of the lower core board is provided with a second conductive area that is convenient for connecting to an external circuit and electrically connected to the 2N+1 metallized through hole. The upper and lower surfaces of the inner core board are correspondingly provided with a third conductive area and a fourth conductive area that can connect the metallized through hole. The detection method comprises providing a detection circuit, connecting the detection circuit with the first conductive area and the second conductive area to form a loop, and judging whether the loop is connected by checking whether the first conductive area and the second conductive area are connected, thereby judging the correctness of the lamination.

Description

Technical Field

[0001] The present invention relates to a circuit board and a detection method thereof for convenient detection of lamination correctness. Background Art

[0002] Currently, common circuit boards are generally made of multiple layers of core boards pressed together. The circuits on each layer of core boards are different. Therefore, during lamination, it is necessary to ensure that the types of core boards laminated together are correct, otherwise the circuit board will be unusable. Therefore, after the circuit board is pressed together, the circuit board must be quality inspected to check whether the laminated core boards in the circuit board are correct. A common method is to make identification patterns on the side of each core board. After lamination is completed, the correctness of the stacking is judged by visual confirmation. This type of identification method often requires manual judgment, and due to the size limitation of the circuit board, the identification pattern is often not too large. Quality inspectors will inevitably experience visual fatigue after a long period of judgment, which will greatly increase the possibility of false detection.

[0003] Therefore, how to overcome the above-mentioned defects has become an important issue to be solved urgently by those skilled in the art. Summary of the Invention

[0004] The present invention overcomes the shortcomings of the above-mentioned technology and provides a circuit board and a detection method thereof for conveniently detecting the correctness of lamination.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A circuit board that is convenient for detecting the correctness of lamination, wherein the circuit board 1 is laminated by an upper core board 11 located at the top, a lower core board 12 located at the bottom, and N layers of inner core boards 13 located between the upper core board 11 and the lower core board 12, an insulating dielectric layer 14 is provided between the upper and lower adjacent inner core boards 13, the circuit board 1 is provided with 2N+1 metallized through holes 15 arranged in sequence and passing through the circuit board 1 up and down, the upper surface of the upper core board 11 is provided with a first conductive area 111 that is convenient for connecting to an external circuit and is electrically connected to the first metallized through hole 15, The lower surface of the lower core board 12 is provided with a second conductive area 121 which is convenient for connecting to an external circuit and electrically connected to the 2N+1th metallized through-hole 15. The upper surface of the inner core board 13 is provided with a third conductive area 131 and the lower surface is provided with a fourth conductive area 132. The third conductive area 131 of the nth layer inner core board 13 can and can only electrically connect the 2n-1th metallized through-hole 15 with the 2nth metallized through-hole 15, and the fourth conductive area 132 can and can only electrically connect the 2nth metallized through-hole 15 with the 2n+1th metallized through-hole 15, where n≤N.

[0007] Preferably, the metallized through holes 15 are arranged from the upper left to the lower right direction of the circuit board 1 surface, and the third conductive area 131 is respectively provided with two first connection ends 1311, and the two first connection ends 1311 are respectively located at the two metallized through holes 15 that are conductive to the third conductive area 131, and the fourth conductive area 132 is respectively provided with two second connection ends 1321, and the two second connection ends are respectively located at the two metallized through holes 15 that are conductive to the fourth conductive area 132.

[0008] Preferably, the first conductive area 111, the second conductive area 121, the first connection end 1311, and the second connection end 1321 are all circular areas, and the centers of the first conductive area 111, the second conductive area 121, the first connection end 1311, and the second connection end 1321 are respectively located on the axes of their corresponding metallized through holes 15.

[0009] Preferably, the diameters of the first conductive area 111 , the second conductive area 121 , the first connection end 1311 , and the second connection end 1321 are all A, the diameter of the metallized through hole 15 is B, and B<A.

[0010] Preferably, A=0.4±0.01 mm, B=0.3±0.01 mm.

[0011] Preferably, the minimum distance between the two first connection ends 1311 is C, the minimum distance between the two second connection ends 1321 is also C, and C is ≥ 0.4 mm.

[0012] Preferably, the inner core board 13 has at least one layer, that is, N≥1.

[0013] A method for detecting the lamination correctness of the circuit board 1 includes the following steps:

[0014] Step 1: Provide a powered detection circuit 2, wherein the detection circuit 2 is provided with two electrical test pins 21 for connecting to the circuit board 1 to form a circuit between the detection circuit 2 and the circuit board 1, and an indicator 22 for indicating whether the detection circuit 2 is connected;

[0015] Step 2: connect one of the electrical test pins 21 of the detection circuit 2 to the first conductive area 111 and connect the other electrical test pin 21 to the second conductive area 121;

[0016] Step 3: Check whether the detection circuit 2 is connected through the indicator 22. If the detection circuit 2 is connected, it means that the types of core boards laminated on the circuit board 1 are correct. If the detection circuit 2 cannot be connected, it means that the core boards laminated on the circuit board 1 are abnormal.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The circuit board in this case is provided with a number of metallized through-holes passing through the circuit board. The upper surface of the upper core board is provided with a first conductive area electrically connected to the first metallized through-hole, and the lower surface of the lower core board is provided with a second conductive area electrically connected to the last metallized through-hole. The n-th layer of the inner core board in the circuit board is provided with a third conductive area that can and can only electrically connect the 2n-1th and 2nth metallized through-holes, and a fourth conductive area that can and can only electrically connect the 2nth and 2n+1th metallized through-holes. In this way, a path can be formed between the first conductive area and the second conductive area only when the types of laminated inner core boards in the circuit board are correct. In this way, whether the inner core boards stacked in the circuit board are incorrect can be judged by detecting the on-off status of the first conductive area and the second conductive area, without the need for quality inspectors to make visual judgments, thereby greatly improving the efficiency and accuracy of quality inspection.

[0019] 2. The detection method in this case forms a loop between the detection circuit and the circuit board by connecting the two electrical test pins of the detection circuit to the first conductive area and the second conductive area respectively. In this way, it can be judged by the indicator result whether there is a path between the first conductive area and the second conductive area. If there is a path, it means that the core boards laminated in the circuit board are correct. If there is no path, it means that there is an abnormality in the core boards laminated in the circuit board. In this way, by connecting the detection circuit to the circuit board, it is possible to quickly detect whether the core board in the circuit board is incorrect without relying on visual confirmation by quality inspectors, which greatly improves the efficiency and accuracy of detection and can also greatly reduce the workload of personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the circuit board schematic diagram of this case.

[0021] Figure 2 This is a cross-sectional diagram of the circuit board in this case.

[0022] Figure 3 This is a top view of the circuit board in this case.

[0023] Figure 4 This is a schematic diagram of the upper core board, lower core board and inner core board before lamination.

[0024] Figure 5 This is a schematic diagram of the circuit board and detection circuit in this case. DETAILED DESCRIPTION

[0025] The following examples further illustrate the features of the present invention and other related features to facilitate understanding by those skilled in the art:

[0026] like Figures 1 to 4As shown, a circuit board for convenient detection of lamination correctness is shown. The circuit board 1 is laminated by an upper core board 11 located at the top, a lower core board 12 located at the bottom, and N layers of inner core boards 13 located between the upper core board 11 and the lower core board 12. An insulating dielectric layer 14 is provided between the upper and lower adjacent inner core boards 13. The circuit board 1 is provided with 2N+1 metallized through holes 15 arranged in sequence and passing through the circuit board 1 from top to bottom. The upper surface of the upper core board 11 is provided with a first conductive area 111 that is convenient for connecting to an external circuit and is electrically connected to the first metallized through hole 15. The lower surface of the lower core board 12 is provided with a second conductive area 121 which is convenient for connecting to an external circuit and electrically connected to the 2N+1th metallized through-hole 15. The upper surface of the inner core board 13 is provided with a third conductive area 131, and the lower surface is provided with a fourth conductive area 132. The third conductive area 131 of the nth layer inner core board 13 can and can only electrically connect the 2n-1th metallized through-hole 15 with the 2nth metallized through-hole 15, and the fourth conductive area 132 can and can only electrically connect the 2nth metallized through-hole 15 with the 2n+1th metallized through-hole 15, where n≤N.

[0027] As described above, the circuit board 1 in this case is provided with a number of metallized through-holes 15 passing through the circuit board 1, the upper surface of the upper core board 11 is provided with a first conductive area 111 electrically connected to the first metallized through-hole 15, and the lower surface of the lower core board 12 is provided with a second conductive area 121 electrically connected to the last metallized through-hole 15, and the nth layer inner core board 13 in the circuit board 1 is provided with a third conductive area 131 that can and can only electrically connect the 2n-1th and 2nth metallized through-holes 15, and a fourth conductive area that can and can only electrically connect the 2nth and 2n+1th metallized through-holes 15. In this way, only when the types of laminated inner core boards 13 in the circuit board 1 are correct can a path be formed between the first conductive area 111 and the second conductive area 121. In this way, whether the stacked inner core boards 13 in the circuit board 1 are incorrect can be judged by detecting the on-off status of the first conductive area 111 and the second conductive area 121, without the need for quality inspectors to make visual judgments, thereby greatly improving the efficiency and accuracy of quality inspection.

[0028] like Figures 1 to 4 As shown, preferably, the metallized through holes 15 are arranged from the upper left to the lower right direction of the circuit board 1, the third conductive area 131 is respectively provided with two first connection ends 1311, and the two first connection ends 1311 are respectively located at the two metallized through holes 15 that are conductive to the third conductive area 131, and the fourth conductive area 132 is respectively provided with two second connection ends 1321, and the two second connection ends are respectively located at the two metallized through holes 15 that are conductive to the fourth conductive area 132.

[0029] As described above, since the metallized through-holes 15 are arranged obliquely on the circuit board 1, the predetermined positions of the third conductive area 131 and the fourth conductive area 132 on the inner core board 13 are asymmetric, that is, when the inner core board 13 is flipped upside down, the third conductive area 131 and the fourth conductive area 132 cannot replace each other. At the same time, since the metallized through-holes 15 are arranged obliquely, if the inner core board 13 is flipped upside down when stacked, the third conductive area 131 and the fourth conductive area 132 will deviate from the predetermined positions and no metallized through-hole 15 will be conductive.

[0030] like Figures 1 to 4 As shown, preferably, the first conductive area 111, the second conductive area 121, the first connection end 1311, and the second connection end 1321 are all circular areas, and the centers of the first conductive area 111, the second conductive area 121, the first connection end 1311, and the second connection end 1321 are respectively located on the axis of their corresponding metallized through holes 15. In this way, each conductive area can serve as a connection between the metallized through holes 15.

[0031] like Figures 1 to 4 As shown, preferably, the diameters of the first conductive area 111 , the second conductive area 121 , the first connection end 1311 , and the second connection end 1321 are all A, the diameter of the metallized through hole 15 is B, and B<A.

[0032] like Figures 1 to 4 As shown, preferably, A = 0.4 ± 0.01 mm, B = 0.3 ± 0.01 mm.

[0033] like Figures 1 to 4 As shown, preferably, the minimum distance between the two first connection ends 1311 is C, the minimum distance between the two second connection ends 1321 is also C, and C≥0.4 mm.

[0034] like Figures 1 to 4 As shown, preferably, the inner core board 13 has at least one layer, that is, N≥1.

[0035] like Figures 1 to 5 As shown, a lamination correctness detection method applicable to the above-mentioned circuit board 1 includes the following steps:

[0036] Step 1: Provide a powered detection circuit 2, wherein the detection circuit 2 is provided with two electrical test pins 21 for connecting to the circuit board 1 to form a circuit between the detection circuit 2 and the circuit board 1, and an indicator 22 for indicating whether the detection circuit 2 is connected;

[0037] Step 2: connect one of the electrical test pins 21 of the detection circuit 2 to the first conductive area 111 and connect the other electrical test pin 21 to the second conductive area 121;

[0038] Step 3: Check whether the detection circuit 2 is connected through the indicator 22. If the detection circuit 2 is connected, it means that the types of core boards laminated on the circuit board 1 are correct. If the detection circuit 2 cannot be connected, it means that the core boards laminated on the circuit board 1 are abnormal.

[0039] As described above, the detection method of this case forms a loop between the detection circuit 2 and the circuit board 1 by connecting the two electrical test pins 21 of the detection circuit 2 to the first conductive area 111 and the second conductive area 121 respectively. In this way, the indicator 22 can be used to indicate the result to determine whether there is a path between the first conductive area 111 and the second conductive area 121. If there is a path, it means that the core boards laminated in the circuit board 1 are correct. If there is no path, it means that the core boards laminated in the circuit board 1 are abnormal. In this way, by connecting the detection circuit 2 to the circuit board 1, it is possible to quickly detect whether the core board in the circuit board 1 is incorrect without relying on visual confirmation by quality inspectors, which greatly improves the efficiency and accuracy of the detection and can also greatly reduce the workload of the personnel.

[0040] As mentioned above, this case protects a circuit board and its detection method that facilitates the detection of lamination correctness. All technical solutions that are the same or similar to those in this case should be deemed to fall within the scope of protection of this case.

Claims

1. A circuit board that is convenient for detecting the correctness of lamination, characterized in that The circuit board (1) is formed by laminating an upper core board (11) located at the top, a lower core board (12) located at the bottom, and N layers of inner core boards (13) located between the upper core board (11) and the lower core board (12). An insulating dielectric layer (14) is provided between the upper and lower adjacent inner core boards (13). The circuit board (1) is provided with 2N+1 metallized through holes (15) arranged in sequence and passing through the circuit board (1) from top to bottom. The upper surface of the upper core board (11) is provided with a first conductive area (111) that is convenient for connecting to an external circuit and is electrically connected to the first metallized through hole (15). The lower core board (12 ) is provided with a second conductive area (121) on the lower surface thereof for facilitating connection to an external circuit and electrically connected to the 2N+1th metallized through hole (15), the upper surface of the inner core board (13) is provided with a third conductive area (131), and the lower surface is provided with a fourth conductive area (132), the third conductive area (131) of the nth layer inner core board (13) can and can only electrically connect the 2n-1th metallized through hole (15) with the 2nth metallized through hole (15), and the fourth conductive area (132) can and can only electrically connect the 2nth metallized through hole (15) with the 2n+1th metallized through hole (15), wherein n≤N.

2. A circuit board for conveniently detecting lamination correctness according to claim 1, characterized in that The metallized through holes (15) are arranged from the upper left to the lower right of the circuit board (1); the third conductive area (131) is provided with two first connection ends (1311), and the two first connection ends (1311) are respectively located at the two metallized through holes (15) connected to the third conductive area (131); the fourth conductive area (132) is provided with two second connection ends (1321), and the two second connection ends are respectively located at the two metallized through holes (15) connected to the fourth conductive area (132).

3. A circuit board for conveniently detecting lamination correctness according to claim 2, characterized in that The first conductive area (111), the second conductive area (121), the first connection end (1311), and the second connection end (1321) are all circular areas, and the centers of the first conductive area (111), the second conductive area (121), the first connection end (1311), and the second connection end (1321) are respectively located on the axes of the corresponding metallized through holes (15).

4. A circuit board for conveniently detecting lamination correctness according to claim 3, characterized in that The diameters of the first conductive area (111), the second conductive area (121), the first connection end (1311), and the second connection end (1321) are all A, and the diameter of the metallized through hole (15) is B, and B<A.

5. A circuit board for conveniently detecting lamination correctness according to claim 4, characterized in that A=0.4±0.01mm, B=0.3±0.01mm.

6. A circuit board for conveniently detecting lamination correctness according to claim 2, characterized in that The minimum distance between the two first connection ends (1311) is C, the minimum distance between the two second connection ends (1321) is also C, and C is ≥ 0.4 mm.

7. A method for detecting the lamination correctness of a circuit board according to any one of claims 1 to 6, characterized in that The following steps are involved: Step 1: providing a powered detection circuit (2), wherein the detection circuit (2) is provided with two electrical test pins (21) that are convenient for connection with the circuit board (1) so that the detection circuit (2) and the circuit board (1) form a loop, and the detection circuit (2) is also provided with an indicator (22) for indicating whether the detection circuit (2) is connected; Step 2: one of the electrical test needles (21) of the detection circuit (2) is brought into contact with the first conductive area (111) and the other electrical test needle (21) is brought into contact with the second conductive area (121); Step 3: Check whether the detection circuit (2) is connected through the indicator (22). If the detection circuit (2) is connected, it means that the types of core boards laminated on the circuit board (1) are correct. If the detection circuit (2) cannot be connected, it means that the core boards laminated on the circuit board (1) are abnormal.

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