Electronic device bracket, electronic device, and method for manufacturing the electronic device bracket

Abstract

The present application discloses an electronic device bracket, an electronic device and a method for manufacturing the electronic device bracket. The electronic device bracket comprises: a main body; a colloid, wherein the colloid and the main body are an integral structure; wherein the colloid is located at at least one position on the main body corresponding to a part to be sealed, a buffer area and a part to be pre-pressed in the electronic device, so as to form one or more of a sealing structure, a buffer structure and a pre-pressing structure.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment bracket, an electronic equipment, and a manufacturing method of the electronic equipment bracket. Background Art

[0002] In the related art, a motherboard bracket is installed inside the electronic device to fix and protect the motherboard and the electronic devices on the motherboard. In addition, auxiliary materials such as sealing foam, pre-compression foam, conductive foam, and buffer foam need to be installed on the motherboard bracket, and the cost of auxiliary materials is high. Moreover, various auxiliary materials need to be installed one by one, and there are many installation steps, which leads to low installation efficiency. Because different auxiliary materials are installed in different positions, the position needs to be adjusted during installation or a positioning structure needs to be set on the motherboard bracket, which affects the installation efficiency and has high manufacturing costs. Summary of the invention

[0003] The present application aims to provide an electronic device bracket, an electronic device and a method for manufacturing the electronic device bracket, so as to solve the problems of low installation efficiency and high installation cost of auxiliary materials in electronic devices.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, an embodiment of the present application provides an electronic device bracket, comprising:

[0006] main body;

[0007] A colloid, wherein the colloid and the main body are an integral structure;

[0008] The colloid is located at at least one position on the main body corresponding to a part to be sealed, a buffer area and a part to be pre-pressed in the electronic device to form one or more of a sealing structure, a buffer structure and a pre-pressing structure.

[0009] In a second aspect, an embodiment of the present application proposes a method for manufacturing an electronic device bracket, comprising: the electronic device bracket is the electronic device bracket as described in the first aspect, wherein liquid glue is directly molded on the main body through a mold to form the colloid.

[0010] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0011] case;

[0012] An electronic device bracket, wherein the electronic device bracket is the electronic device bracket as described in the first aspect; the electronic device bracket is installed in the shell.

[0013] In the embodiments of the present application, compared with the traditional assembly method that requires installing the mainboard bracket, buffer foam, pre-pressed foam, conductive foam and sealing foam one by one, the electronic device bracket provided by the present application has a colloid integrally formed with the mainboard at the positions corresponding to the parts to be sealed, the buffer area and the parts to be pre-pressed on the mainboard. Only one structural part needs to be installed during assembly, and the installation efficiency is high. There is no need for multiple auxiliary materials, and there is no need to align the installation position multiple times or add alignment structures. The installation consistency is good, which reduces the assembly cost of the electronic device.

[0014] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic structural diagram of an electronic device bracket according to an embodiment of the present application;

[0017] Figure 2 is a structural schematic diagram of an electronic device support according to an embodiment of the present application from another viewing angle;

[0018] Figure 3 yes Figure 2 A cross-sectional view of the grounding structure and pre-stressing structure shown;

[0019] Figure 4 yes Figure 2 a cross-sectional view of the sealing structure shown;

[0020] Figure 5 is a schematic diagram of the application of an electronic device bracket according to an embodiment of the present application.

[0021] Reference numerals:

[0022] 10. Main body; 20. Colloid; 21. Sealing structure; 22. Pre-pressing structure; 23. Grounding structure; 24. Shielding structure; 201. Connecting part; 202. Protruding part; 30. Conductor; 40. Main board. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0024] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0025] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "clockwise", "counterclockwise", "circumferential", etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Combine the following Figure 1-Figure 5 An electronic device bracket according to an embodiment of the present application is described.

[0028] The present application embodiment provides an electronic device bracket, such as Figure 1 and Figure 2 As shown, it includes a main body 10 and a colloid 20, and the colloid 20 is an integral structure with the main body 10. The colloid 20 is located on the main body 10 at least one position corresponding to the part to be sealed, the buffer area and the part to be pre-pressed in the electronic device, so as to form one or more of a sealing structure 21, a buffer structure and a pre-pressing structure 22.

[0029] Among them, the main body 10 is a steel plate or other metal plate. The colloid 20 is a structure with flexibility and insulation, for example, the colloid 20 is a silicone member. For another example, the colloid 20 includes silicone and metal powder, and the metal powder is mixed in the colloid 20. The electronic device bracket is used to protect the mainboard 40 and various electronic devices arranged on the mainboard 40. In some optional embodiments, some electronic devices arranged on the mainboard 40 are easy to fall off, and a pre-pressing structure 22 needs to be set for pressing. To this end, the colloid 20 is set at the position corresponding to the pre-pressed parts on the mainboard 40 to form a pre-pressing structure 22, which is pressed on the electronic device to prevent the electronic device from falling off. For example, to prevent the BTB connector on the mainboard 40 from falling off, the colloid 20 is set at the position corresponding to the BTB connector on the main body 10 to form a pre-pressing structure 22. In some other optional embodiments, there is an installation gap between the mainboard 40 and other structures of the electronic device, or there is a gap between the electronic devices on the mainboard 40, which is easy to move or deform during use. For this reason, a buffer structure needs to be set corresponding to the gap. For example, a colloid 20 is set in the area where a buffer structure is required on the main board 40 to prevent abnormal noise or virtual position of the electronic device. In some optional embodiments, the sound pickup hole, camera, etc. on the electronic device need to be waterproof and dustproof, and these sealed parts need to be sealed with a sealing structure 21. To this end, a colloid 20 is set on the main board 40 corresponding to the sealed part to form a sealing structure 21. For example, the camera in the electronic device needs to be dustproof and waterproof, and the position corresponding to the camera on the main body 10 is integrally formed with a colloid 20 to form a sealing structure 21. It can be understood that among the three positions on the main body 10 corresponding to the sealed parts, buffer areas and pre-pressed parts in the electronic device, the colloid 20 can be set only in one of them, or the colloid 20 can be set separately in three positions. For example, a plurality of colloids 20 are set on the main body 10, some of the colloids 20 are set corresponding to the sealed parts to form a sealing structure 21, some of the colloids 20 are set corresponding to the buffer area to form a buffer structure, and some of the colloids 20 are set corresponding to the pre-pressed parts to form a pre-pressing structure 22, which is specifically set according to the assembly needs of the electronic device.

[0030] When assembling traditional electronic devices, after the mainboard in the electronic device is installed in place, it is necessary to install the mainboard bracket, buffer foam, pre-pressed foam, conductive foam and sealing foam, etc. one by one. The electronic device bracket provided in the present application has a colloid 20 integrally formed with the mainboard 40 at positions corresponding to the parts to be sealed, the buffer area and the parts to be pre-pressed on the mainboard 40. Only one structural part needs to be installed during assembly, and the installation efficiency is high. There is no need to align the installation position multiple times or add a positioning structure, and the installation consistency is good, thereby reducing the assembly cost of the electronic device.

[0031] Based on the above embodiments, Figure 3 As shown, the electronic device bracket further includes a conductor 30 integrally formed with the colloid 20 , and the conductor 30 is embedded in the colloid 20 .

[0032] During molding, conductive powder is mixed into the liquid glue, and a magnetic body is set in the mold. With the help of the adsorption effect of the magnetic body, the conductor 30 is formed in the magnetic body. Depending on the different embedding methods, the magnetic body can be set only in the upper mold or the lower mold, or in both the upper mold and the lower mold.

[0033] In some optional embodiments, such as Figure 3 As shown, one end of the conductor 30 is embedded in the colloid 20, and the other end of the conductor 30 is protruding from the surface of the colloid 20. Thus, the conductor 30 is partially embedded in the colloid 20, and the end of the conductor 30 contacts the electronic device to be grounded to achieve grounding. At this time, the colloid 20 with the embedded conductor 30 constitutes a grounding structure 23.

[0034] In some other optional embodiments, the conductor 30 passes through the colloid 20, and the end of the conductor 30 is flush with the surface of the colloid 20 or protrudes from the surface of the colloid 20. For example, one end of the conductor 30 is flush with the first plane of the colloid 20, and the other end of the conductor 30 is flush with the second surface of the colloid 20, and the first surface is opposite to the second surface. As a result, the conductor 30 forms a conductive channel in the colloid 20, which can electrically connect the electronic devices on opposite sides of the colloid 20. For another example, one end of the conductor 30 is flush with the first surface of the colloid 20, and the other end protrudes from the second surface of the colloid 20 or is flush with the second surface of the colloid 20, and the first surface is opposite to the second surface. Taking a mobile phone as an example, in a traditional mobile phone, in order to realize the conduction between the flexible circuit board and the main board 40, a spring is provided on the main board 40, and a through hole is provided on the main board bracket to ensure that the spring on the main board 40 passes through the through hole and conducts with the flexible circuit board.

[0035] The electronic device bracket provided by the present application has a conductor 30 embedded in the colloid 20, one end of the conductor 30 is in electrical contact with the flexible circuit board, and the other end of the conductor 30 is electrically connected to the main board 40, without the need to set a spring on the main board 40. Moreover, compared with the traditional method of setting a through hole on the main board bracket, the conductor 30 embedded in the colloid 20 in the present application can be sealed with the help of the colloid 20 while achieving electrical connection, and the dustproof and waterproof performance is better. At the same time, the first surface of the colloid 20 is a flat surface, which is pressed on the flexible circuit board to play a protective role.

[0036] like Figure 3 and Figure 4 As shown, according to some embodiments provided by the present application, the main body 10 is provided with a connecting hole, and the colloid 20 includes a connecting portion 201 and a protruding portion 202 connected to each other, the connecting portion 201 is filled in the connecting hole, and the protruding portion 202 is protruded from the surface of the main body 10 .

[0037] Optionally, the connection hole is a through hole. During integral molding, liquid glue is filled in the connection hole and protrudes on one side of the main body 10 to form a protrusion 202. The protrusion 202 is used to provide elastic support or buffering. For example, the protrusion 202 is a square flat structure, which serves as a buffer structure or a pre-pressing structure 22 and is set against the buffer area or the pre-pressing area. For another example, the protrusion 202 is in the shape of a convex ridge, which cooperates with the side sealing groove of the sealed component to achieve a sealing operation.

[0038] Wherein, when the protrusion 202 is annular, the connection hole is an annular hole or a plurality of connection holes are provided, and the plurality of connection holes all correspond to the protrusion 202 and are arranged in an annular shape. When the end surface of the protrusion 202 is a plane, preferably, a plurality of connection holes are provided, and the plurality of connection holes are arranged at intervals along the length direction of the protrusion 202 to improve the connection strength between the main body 10 and the colloid 20.

[0039] In the electronic device bracket provided in the embodiment of the present application, the colloid 20 includes a connecting portion 201 filled in the connecting hole and a protruding portion 202 protruding from the surface of the main body 10 to improve the bonding force between the colloid 20 and the main body 10 .

[0040] In some embodiments provided in this application, Figure 1 and Figure 5 As shown, the colloid 20 is also used to form a shielding structure 24 , wherein the protrusion 202 is annular and the colloid 20 is doped with conductive powder.

[0041] In a conventional electronic device, a shielding cover is required for the mainboard 40, and then a mainboard bracket is provided to support the mainboard 40 and the back cover. The electronic device bracket provided in the present application has an annular protrusion 202 and the main body 10 to form an open space, which can be covered on the mainboard 40, such as Figure 5 As shown, the colloid 20 contains conductive powder, and the main board 40 is shielded from the circumference by means of the annular protrusion 202, and the main body 10 shields the main board 40 from the top, so that there is no need to set a shielding cover on the main board 40, which reduces the manufacturing cost of the electronic device and the thickness of the electronic device. At the same time, the flexibility of the colloid 20 can also provide a buffer when the back of the electronic device is subjected to force.

[0042] The conductive powder is metal powder or other conductive particles. The conductive powder can be in powder or granular form.

[0043] In the electronic equipment bracket provided in the present application, the annular protrusion 202 and the main body 10 cooperate to form a relatively closed space, and the colloid 20 is doped with conductive powder, which can realize the supporting and protective functions and also serve as a shielding structure 24.

[0044] In some embodiments provided in this application, Figure 4As shown, the hole diameter of the end of the connection hole away from the protruding portion 202 is larger than the hole diameter of the end of the connection hole close to the protruding portion 202 .

[0045] In some optional embodiments, the connection hole includes a straight hole section and a tapered hole section, and the small diameter end of the tapered hole section is connected to one end of the straight hole section. In some other optional embodiments, the connection hole is a tapered hole. In some other optional embodiments, a notch is provided on the hole wall at one end of the connection hole away from the protrusion 202, and a liquid glue fills the notch to form a limit hook, thereby improving the bonding force and sealing performance between the main body 10 and the colloid 20.

[0046] The electronic device bracket provided in the present application has a connection hole with a larger diameter at one end and a smaller diameter at the other end, and the diameter of the end away from the protrusion 202 is larger, so that the colloid 20 is firmly fixed on the main body 10 to avoid loosening.

[0047] In some other embodiments provided in the present application, the connection hole is a threaded hole, and after the liquid glue is filled in the threaded hole, a strong connection force can be formed between the threaded hole and the liquid glue.

[0048] In some specific embodiments provided in this application, Figure 4 As shown, when the colloid 20 forms the sealing structure 21 , the protrusion 202 is conical, and the end of the protrusion 202 close to the connecting portion 201 is larger than the end of the protrusion 202 away from the connecting portion 201 .

[0049] In some optional embodiments, the protrusion 202 is conical, and after being pressed against the structure on the circumference of the sealed part, it is easy to be compressed and deformed to form a sealing structure 21. In some other optional embodiments, the protrusion 202 is conical, and a sealing groove is set circumferentially with the sealed part. The conical protrusion 202 is easy to insert into the sealing groove and can be deformed under extrusion to achieve sealing. Taking the camera as an example, the conical protrusion 202 is annular, which provides sealing in the circumference of the camera and prevents the colloid 20 from crushing the camera. It should be noted that the protrusion 202 is annular, and surrounds the sealed part from the circumference to provide a strong sealing effect.

[0050] In the case where the colloid 20 constitutes the sealing structure 21, the colloid 20 may be doped with conductive powder or not. In the case of doping with conductive powder, the mold does not need to be provided with a magnetic body. Preferably, in the case where the colloid 20 constitutes the sealing structure 21, the aperture of the end of the connection hole away from the protrusion 202 is larger than the aperture of the end of the connection hole close to the protrusion 202, so that the bonding force between the connection part 201 and the body is greater, avoiding the sealing effect affected by the movement of the colloid 20, and ensuring the stability of the seal.

[0051] In the electronic device bracket provided in the embodiment of the present application, the protrusion 202 is tapered, so as to form a good sealing effect with other structures.

[0052] In some embodiments provided in this application, Figure 3 As shown, when the colloid 20 forms a pre-compression structure 22 or a buffer structure, the end of the protrusion 202 away from the connecting portion 201 is a plane.

[0053] The protrusion 202 is in a square shape, and its end is in a plane shape so as to provide support and protection against other structures. For example, the colloid 20 is in a convex shape, with its small end inserted into the connecting hole, and its large end protruding from the surface of the main body to form the protrusion 202. The flat end of the protrusion 202 is pressed on the pre-pressed part or against the buffer area to provide support. Optionally, the connecting hole is a straight through hole. Of course, the aperture of the end of the connecting hole away from the protrusion 202 can also be larger than the aperture of the end of the connecting hole close to the protrusion 202 to improve the bonding force between the colloid 20 and the main body, which is not specifically limited in this application.

[0054] It is understandable that, when the colloid 20 forms the pre-pressing structure 22 or the buffer structure, the colloid 20 may or may not be doped with conductive powder. When the conductive powder is doped, the mold does not need to be provided with a magnetic body.

[0055] In the electronic device bracket provided in the present application, the end of the protrusion 202 away from the connecting portion 201 is flat, providing a larger working surface, which is convenient for contacting with the surface of other structures to provide support and protection.

[0056] The present application also provides a method for preparing an electronic device bracket, wherein the electronic device bracket is the electronic device bracket as described above, wherein the liquid glue is directly molded on the main body 10 through a mold to form a colloid 20.

[0057] In order to improve the bonding force between the colloid 20 and the main body 10 , a connecting hole is provided on the main body 10 , and the liquid glue is injected into the connecting hole and forms a protrusion 202 on the surface of the main body 10 under the action of the mold.

[0058] According to the requirements of the electronic device, the colloid 20 can be arranged on the main body 10 to form a sealing structure 21, a pre-pressing structure 22 and a buffer structure, etc., which are arranged at positions of the main body 10 corresponding to the electronic devices to be protected.

[0059] In the preparation method of the electronic device bracket provided in the present application, the liquid glue is directly molded on the main body 10, so that the main body 10 and the glue 20 form an integrated structure, which is convenient for assembly and can improve the connection and sealing effect.

[0060] In a specific embodiment of the present application, conductive powder is added into the liquid glue, a magnetic body is disposed in the mold, and the magnetic body absorbs the conductive powder to form the conductor 30 .

[0061] Optionally, the mold includes an upper mold and a lower mold, the upper mold and the lower mold are arranged opposite to each other, and magnetic bodies are respectively arranged in the upper mold and the lower mold, and the conductive powder is gathered together to form a conductive column by the adsorption effect of the magnetic body, thereby meeting the electrical connection requirements of the electronic device. Optionally, a magnetic body is arranged in the upper mold or the lower mold, and the conductive powder is concentrated on one side of the colloid 20 by the magnetic body, thereby meeting the grounding requirements of the electronic device.

[0062] When there are multiple conductors, there are correspondingly multiple magnetic bodies.

[0063] It can be understood that when the colloid 20 forms the sealing structure 21, the pre-pressing structure 22 or the buffer structure, there is no need to add conductive powder into the liquid colloid to reduce the manufacturing cost.

[0064] If the colloid 20 cooperates with the main body 10 to serve as the sealing structure 21 and also needs to be used as the shielding structure 24, conductive powder is added to the liquid colloid during preparation, but there is no need to set a magnetic body in the mold.

[0065] The method for preparing the electronic device bracket provided in the embodiment of the present application includes adding conductive powder into the liquid glue, setting a magnetic body in the mold, and the magnetic body adsorbs the conductive powder to form a conductor 30 to meet the electrical connection or grounding requirements of the electronic device.

[0066] The present application also provides an electronic device, comprising:

[0067] case;

[0068] The electronic equipment bracket is the electronic equipment bracket as described above; the electronic equipment bracket is installed in the shell.

[0069] Specifically, a mainboard 40 is installed in the housing, and the housing includes a front housing and a rear cover, and the rear cover is arranged on the front housing. An electronic device bracket is arranged on the side of the mainboard 40 facing the rear cover, and the electronic device bracket includes a main body 10 and a colloid 20 of an integrated structure. The colloid 20 is used to provide sealing, buffering and pre-pressing for the electronic devices on the mainboard 40, so that the installation is convenient and the installation efficiency is improved.

[0070] The electronic device provided in the present application forms a sealing structure 21, a buffer structure and a pre-pressing structure 22 by means of a colloid 20 disposed on a main body 10, thereby reducing the number of installation times and improving the installation efficiency.

[0071] The electronic devices in the embodiments of the present application refer to electronic devices such as mobile phones, laptop computers, and tablet computers.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic equipment bracket, It is characterized in that include: main body; A colloid, wherein the colloid and the main body are an integral structure; The colloid is located at at least one position on the main body corresponding to a part to be sealed, a buffer area, and a part to be pre-pressed in the electronic device, so as to form one or more of a sealing structure, a buffer structure, and a pre-pressing structure; It also includes a conductor that is integrally formed with the colloid, the conductor is embedded in the colloid, the electronic device bracket is used to protect the mainboard and various electronic devices arranged on the mainboard, one end of the conductor is flush with the first surface of the colloid and is used to make electrical contact with the flexible circuit board, the other end of the conductor is used to be electrically connected to the mainboard, the first surface is a flat surface, and the first surface is pressed onto the flexible circuit board; wherein, during molding, conductive powder is mixed into the liquid glue, a magnetic body is arranged in the mold, and the conductor is formed by means of the adsorption effect of the magnetic body.

2. The electronic device support according to claim 1, It is characterized in that One end of the conductor is embedded in the colloid, and the other end of the conductor protrudes out of the colloid.

3. The electronic device support according to claim 1, It is characterized in that The conductor passes through the colloid, the other end of the conductor is flush with or protrudes from the second surface of the colloid, and the first surface is opposite to the second surface.

4. The electronic device support according to claim 1, It is characterized in that The main body is provided with a connecting hole, and the colloid comprises a connecting portion and a protruding portion connected to each other, the connecting portion is filled in the connecting hole, and the protruding portion is protruding from the surface of the main body.

5. The electronic equipment stand according to claim 4, It is characterized in that The colloid is also used to form a shielding structure. The protrusion is annular and the colloid contains conductive powder.

6. The electronic equipment stand according to claim 4, It is characterized in that The hole diameter of one end of the connection hole away from the protruding portion is larger than the hole diameter of one end of the connection hole close to the protruding portion.

7. The electronic equipment stand according to claim 4, It is characterized in that In the case where the colloid forms a sealing structure, the protrusion is conical, and an end of the protrusion close to the connecting portion is larger than an end of the protrusion far from the connecting portion.

8. A method for preparing an electronic device bracket, It is characterized in that The electronic device bracket is an electronic device bracket as described in any one of claims 1 to 7, wherein liquid glue is directly molded on the main body through a mold to form the colloid; conductive powder is added to the liquid glue, a magnetic body is arranged in the mold, and the magnetic body absorbs the conductive powder to form a conductor.

9. An electronic device, It is characterized in that include: case; An electronic device bracket, wherein the electronic device bracket is an electronic device bracket according to any one of claims 1 to 7; The electronic equipment bracket is installed in the shell.

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