Substrate clamping device

Abstract

The invention discloses a substrate clamp device, which comprises: a body for clamping a substrate; and a support structure, which contacts part of the body and comprises a first extension part connected to the body and extending laterally in the same direction; wherein the first extension part and the support part form a first acute angle.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a substrate clamp device. Background Art

[0002] In the substrate electroplating operation, refer to Figure 1A As shown in FIG. 1 , the substrate 20 is clamped by the front clamping portion 12 and the rear clamping portion 14 and then vertically enters the electroplating tank for electroplating circuit operation. After the operation, the substrate 20 is taken out of the electroplating solution. However, after each electroplating operation, residual electroplating solution 16 begins to adhere to the clamping portion, such as Figure 1B As shown, the peripheral area of ​​the subsequent substrate (the area not requiring electroplating) will be burned during electroplating due to contact with the residual electroplating liquid in the clamping part. This problem will become more and more serious as the number of electroplated substrates increases. Summary of the invention

[0003] In view of the above problems in the related art, the present invention provides a substrate clamp device and an operating method thereof.

[0004] The technical solution of the present invention is achieved in this way:

[0005] According to one aspect of the present invention, there is provided a substrate clamp device, comprising:

[0006] A body for holding a substrate; and

[0007] A support structure is in contact with the body portion, and the support structure includes a first extension portion connected to the body and extending laterally in the same direction;

[0008] Wherein, the first extension portion and the support portion form a first acute angle.

[0009] In some embodiments, the support structure further includes a second extension portion, and the support portion is located between the first extension portion and the second extension portion.

[0010] In some embodiments, the second extension portion forms a second acute angle with the support portion.

[0011] In some embodiments, the first acute angle is the same as the second acute angle.

[0012] In some embodiments, the first acute angle is different from the second acute angle.

[0013] In some embodiments, the support portion partially contacts the body, and a gap is provided between the first extension portion and the body.

[0014] In some embodiments, the intervals gradually increase in size.

[0015] In some embodiments, an open area is formed between the contact portion of the support portion and the body.

[0016] In some embodiments, a region of the support portion away from the contact portion with the body has a plurality of through holes.

[0017] In some embodiments, the size of each through hole is smaller than the size of the open area.

[0018] In some embodiments, the first extension has an arc shape.

[0019] According to another aspect of the present invention, there is provided a method for operating a substrate clamping device, characterized in that it comprises: clamping a substrate by a body of the substrate clamping device, and immersing the substrate in a chemical solution;

[0020] removing the substrate from the chemical solution;

[0021] The substrate clamp device has a support structure that contacts the body portion, and the support structure includes a support portion connected to the body, and a first extension portion extending laterally above the body in the same direction as the body, the first extension portion and the support portion forming a first acute angle,

[0022] After the substrate is taken out from the chemical solution, the remaining chemical solution is removed through the first extension portion.

[0023] In some embodiments, after taking out the substrate from the chemical solution, the method further includes: changing a direction of the substrate clamping device to remove the remaining chemical solution through the first extension portion.

[0024] In some embodiments, the support portion partially contacts the body, and a gap is provided between the first extension portion and the body.

[0025] In some embodiments, an open area is formed between the contact portion of the support portion and the body. The area of ​​the support portion away from the contact portion with the body has a plurality of through holes, wherein after the substrate is removed from the chemical solution, the remaining chemical solution is removed through the plurality of through holes.

[0026] In some embodiments, the size of each through hole is smaller than the size of the open area.

[0027] In some embodiments, the support structure further includes a second extension portion, the support portion is located between the first extension portion and the second extension portion, and a width direction of the second extension portion forms a second acute angle with the support portion.

[0028] In some embodiments, the first extension has an arc shape.

[0029] In some embodiments, the support portion partially contacts the body, a gap is provided between the first extension portion and the body, and a dimension of the gap gradually increases in a lateral extension direction of the body. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1A and Figure 1B Schematic diagram of an existing substrate clamping device.

[0032] Figure 2A and Figure 2B 3D are a perspective view and a side view of a substrate clamping device according to an embodiment of the present invention.

[0033] Figure 3 is a schematic diagram of a substrate clamping device according to another embodiment of the present invention.

[0034] Figure 4A and Figure 4B They are schematic diagrams of through-hole layouts according to embodiments of the present invention.

[0035] FIG. 5A to FIG. 5D It is a flow chart of a method for processing a substrate using the substrate clamping device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0037] Figure 2A and Figure 2B They are respectively a front view and a side view of a substrate clamping device according to an embodiment of the present invention. Figure 2A and Figure 2B As shown, the substrate clamp device includes a body 110 for clamping a substrate. A support structure 120 contacts a portion of the body 110. The support structure 120 has a first extension portion 128, which is connected to the body 110 and extends laterally above the body 110 in the same direction as the body 110. The first extension portion 128 and the support portion 122 form a first acute angle, that is, the first extension portion 128 is inclined. And a gap is set between the first extension portion 128 and the body 110. Since the first extension portion 128 is inclined, the size of the gap between the first extension portion 128 and the body 110 gradually increases.

[0038] The support structure 120 further includes a second extension portion 129, and the support portion 122 is located between the first extension portion 128 and the second extension portion 129. The second extension portion 129 forms a second acute angle with the support portion 122. In some embodiments, the first acute angle is the same as the second acute angle, that is, the first extension portion 128 and the second extension portion 129 may have different degrees of inclination. In other embodiments, the first acute angle is different from the second acute angle, that is, the first extension portion 128 and the second extension portion 129 may have the same degree of inclination.

[0039] By arranging an inclined first extension portion 128 and / or a second extension portion 129 above the main body 110, when the substrate is removed from the chemical solution after being processed by the chemical solution (electroplating solution), the residual chemical solution can be discharged through the first extension portion 128, thereby alleviating the problem of residual chemical solution accumulation.

[0040] exist Figure 2A In the illustrated embodiment, both the first extension portion 128 and the second extension portion 129 extend horizontally along the width direction of the body 110 . Figure 3 is a schematic diagram of a substrate clamping device according to another embodiment of the present invention. Figure 3 In the embodiment of the present invention, the first extension portion 128 and the second extension portion 129 may also have an arc shape.

[0041] On the other hand, Figure 2A As shown, an opening area 132 is formed between the contact portion of the support portion 122 and the body 110. The area of ​​the support portion 122 away from the contact portion with the body 110 has a plurality of through holes 140. In some embodiments, the size of each through hole 140 is smaller than the size of the opening area 132. The formed plurality of through holes 140 can also be used to discharge residual plating solution.

[0042] Specifically, Figure 4A As shown, the plurality of through holes 140 may be arranged alternately with each other in the lateral direction. Figure 4B As shown, the plurality of through holes 140 may also be arranged side by side in the transverse direction. In a specific embodiment, the width of the support portion 122 is 10 cm and the height is 20 cm. In such an embodiment, Figure 4A In the embodiment, the width of the through hole 140 can be about 30 mm. In addition, if the diameter of the through hole 140 is designed to be too large, it will affect the application of the support portion 122; if the diameter of the through hole 140 is designed to be too small, there will not be enough space to drain the residual liquid. The center lines of the three adjacent through holes form an equilateral triangle. The spacing between the through holes 140 (that is, the distance between the centers of the two through holes 140) is about 50 mm, which makes it more likely that the liquid will flow through the through hole 140. If the spacing between the through holes 140 is too large, the probability of the liquid flowing through the through hole 140 will be smaller. In Figure 4B In the embodiment, the width of the through hole 140 can be about 30 mm. The center line of three adjacent through holes forms a right triangle. The spacing between the through holes 140 is about 50 mm.

[0043] FIG. 5A to FIG. 5D The method of processing a substrate using the substrate clamping device 100 according to the embodiment of the present invention is shown. The substrate can be clamped by the body 110 of the substrate clamping device 100 and immersed in a chemical solution such as an electroplating solution. Figure 5A As shown in FIG. 1 , after the substrate is taken out of the solution, the chemical solution 155 will remain on the first extension portion 128. Figure 5B As shown, the substrate clamp device 100 is placed vertically. Due to the inclined first extension portion 128, part of the chemical solution 155 can be discharged through the first extension portion 128. Figure 5C As shown, the substrate clamping device 100 is placed horizontally, and the main bodies 110 for clamping the substrate are separated from each other. At this time, part of the remaining chemical solution 155 flows to the first extension portion 128. Figure 5D As shown, the inclined first extension portion 128 can be used to further remove the remaining chemical solution 155. In addition, at this step, the body 110 for clamping the substrate can be closed.

[0044] On the other hand, FIG. 5A to FIG. 5D In the embodiment, after the substrate is taken out from the chemical solution, since the support portion 122 also has a through hole 140 ( Figure 2A ), and thus the remaining chemical solution is further removed through the plurality of through holes 140.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A substrate clamp device, characterized in that: include: A body, used for clamping the substrate; as well as A support structure, which contacts the body portion, and includes a first extension portion connected to the body and extending laterally in the same direction, and a support portion connected to the body; Wherein, the first extension portion and the support portion form a first acute angle.

2. The substrate clamp device according to claim 1, characterized in that: The support structure further includes a second extension portion, wherein the support portion is located between the first extension portion and the second extension portion.

3. The substrate clamp device according to claim 2, characterized in that: The second extending portion and the supporting portion form a second acute angle.

4. The substrate clamp device according to claim 3, characterized in that: The first acute angle is the same as the second acute angle.

5. The substrate clamp device according to claim 3, characterized in that: The first acute angle is different from the second acute angle.

6. The substrate clamp device according to claim 1, characterized in that: The support portion partially contacts the body, and a gap is provided between the first extension portion and the body.

7. The substrate clamp device according to claim 6, characterized in that: The sizes of the intervals gradually increase.

8. The substrate clamp device according to claim 6, characterized in that: An opening area is formed between the supporting portion and the contact portion of the body.

9. The substrate clamp device according to claim 8, characterized in that: The support portion has a plurality of through holes in an area away from the contact portion with the body.

10. The substrate clamp device according to claim 9, characterized in that: The size of each through hole is smaller than the size of the opening area.

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