A photosensitive coating for Mini LED board and its preparation method

Abstract

The present invention relates to the field of G03F7 technology, and more specifically, to a photosensitive coating for Mini LED panels and a preparation method thereof. The photosensitive coating for Mini LED panels, in parts by weight, comprises 10-30 parts of photosensitive reaction resin, 10-15 parts of photosensitive reaction monomer, 20-40 parts of inorganic aggregate, 10-30 parts of reaction accelerator, 1-15 parts of titanium dioxide, and 10-30 parts of diluent. The present application increases the chemical stability and weather resistance of the photosensitive coating by adopting a specific content of titanium dioxide; the present application adopts a specific trifunctional acrylic monomer and monoclinic talc to promote each other, thereby solving the phenomenon of film embrittlement caused by anatase titanium dioxide; in addition, the photosensitive coating for Mini LED panels obtained in the present application has excellent flexibility, solder resistance, and bending resistance.

Description

Technical Field

[0001] The present invention relates to the field of G03F7 technology, and more specifically, to a photosensitive coating for a Mini LED board and a preparation method thereof. Background Art

[0002] Currently, market demand for LED panels continues to increase, and accordingly, coatings used for LED panels have become a hot research topic. CN201410128205 provides a solder mask ink using β-hydroxyethyl acrylate-modified melamine formaldehyde resin, a reactive diluent, a polysilazane resin, an epoxy resin, a photoinitiator, a pigment, a filler, and additives. The ink exhibits good heat resistance and yellowing resistance, but it does not address the film embrittlement caused by anatase titanium dioxide, and the resulting film exhibits poor flexibility. CN201310587025 provides a photosensitive resin that can be developed in alkaline water when used in photosensitive inks. However, this also does not address the film embrittlement issue during application. Summary of the Invention

[0003] In response to some problems existing in the prior art, the first aspect of the present invention provides a photosensitive coating for Mini LED boards. The raw materials for preparation include 10-30 parts of photosensitive reaction resin, 10-15 parts of photosensitive reaction monomer, 20-40 parts of inorganic aggregate, 10-30 parts of reaction accelerator, 1-15 parts of titanium dioxide, and 10-30 parts of diluent, calculated by weight.

[0004] In one embodiment, the raw materials for preparing the photosensitive coating for the Mini LED board further include 1-10 parts of auxiliary agents.

[0005] In one embodiment, the raw materials for preparing the photosensitive coating for the Mini LED board include, by weight, 28 parts of photosensitive reaction resin, 13 parts of photosensitive reaction monomer, 25 parts of inorganic aggregate, 20 parts of reaction accelerator, 10 parts of titanium dioxide, 20 parts of diluent, and 8 parts of additives.

[0006] In one embodiment, the photosensitive reactive resin is an acrylic resin containing epoxy groups.

[0007] Preferably, the epoxy group-containing acrylic resin is obtained by reacting an epoxy group-containing acrylic resin, maleic anhydride, triphenylphosphine and hydroquinone.

[0008] The epoxy group-containing acrylic resin has a model number of kpl-12365 and is purchased from Shandong Kepler Biotechnology Co., Ltd.

[0009] Those skilled in the art may make routine selections for the undisclosed parts of the preparation method of the epoxy group-containing acrylic resin described in this application.

[0010] In one embodiment, the photosensitive reactive monomer is a trifunctional acrylic monomer.

[0011] Preferably, the trifunctional acrylic monomer includes trimethylolpropane triacrylate.

[0012] Preferably, the viscosity of the trimethylolpropane triacrylate at 25° C. is 80-120 cps.

[0013] The trimethylolpropane triacrylate described in this application was purchased from Kain Chemical, MIWON brand, model number MIRAMER M300.

[0014] In one embodiment, the trifunctional acrylic monomer further comprises an acrylic monomer having an acid value of 120-180 mg KOH / g, preferably an acid value of 152 mg KOH / g.

[0015] Preferably, the weight ratio of the acrylic acid monomer having an acid value of 120-180 mg KOH / g to trimethylolpropane triacrylate is (5-8):1, more preferably 7:1.

[0016] The acrylic acid monomer with an acid value of 152 mg KOH / g described in this application was purchased from Shanghai Kaiyin Chemical Co., Ltd., model number SR9051 NS.

[0017] The inorganic aggregates mentioned in this application may include talc, calcium carbonate, barium sulfate, bentonite, etc.

[0018] Preferably, the particle size of the inorganic aggregate is 500-800 mesh, more preferably 600 mesh.

[0019] In one embodiment, the inorganic aggregate is a monoclinic inorganic aggregate.

[0020] Preferably, the monoclinic inorganic aggregate is talc.

[0021] The applicant unexpectedly discovered in the experiment that the chemical stability and weather resistance of the photosensitive coating can be increased by adding a specific content of titanium dioxide. However, the applicant found that the photosensitive coating obtained by adding titanium dioxide, especially anatase titanium dioxide, becomes brittle after a period of time during use. The applicant unexpectedly found that when the photosensitive reaction monomer is a trifunctional acrylic monomer, and the trifunctional acrylic monomer includes trimethylolpropane triacrylate with a viscosity of 80-120cps at 25°C and an acrylic monomer with an acid value of 120-180mg KOH / g, especially when the weight ratio of the two is 1:(5-8), the embrittlement of the coating caused by anatase titanium dioxide is avoided during use. The applicant believes that the possible reason is that the talc molecules with no high-order axis, and smaller secondary symmetry axis and symmetry plane, make the trimethylolpropane triacrylate with a specific viscosity and an acid value of 152mg KOH / g brittle during the mixing and hardening of the raw materials. The acrylic monomers with a specific and different dendritic distribution state between KOH / g can avoid the reduction of titanium ions in anatase titanium dioxide with a relatively loose structure and large lattice after subsequent exposure and cross-linking, thereby avoiding molecular chain breakage.

[0022] In one embodiment, the reaction accelerator includes 1-hydroxycyclohexyl phenyl ketone and T31 epoxy resin curing agent.

[0023] Preferably, the weight ratio of the 1-hydroxycyclohexyl phenyl ketone to the T31 epoxy resin curing agent is 1:(2-4), more preferably 1:3.

[0024] Preferably, the T31 epoxy resin curing agent is purchased from Jinan Linhai Chemical Co., Ltd.

[0025] Preferably, the crystal form of the titanium dioxide includes tetragonal crystal form; further preferably, the titanium dioxide is anatase titanium dioxide.

[0026] The anatase titanium dioxide described in this application was purchased from Langfang Lanke Chemical Co., Ltd., model BA01-2.

[0027] In one embodiment, the reaction diluent is No. 200 solvent oil.

[0028] The auxiliary agent described in this application is not particularly limited and can be routinely selected by those skilled in the art.

[0029] The auxiliary agents mentioned in this application may include dispersants, wetting agents, leveling agents, etc.

[0030] The second aspect of the present invention provides a method for preparing the photosensitive coating for the Mini LED board, comprising: mixing and stirring the raw materials for preparing the photosensitive coating for the Mini LED board, coating and hardening the coating on a base material, and obtaining the obtained product.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] This application increases the chemical stability and weather resistance of the photosensitive coating by using a specific content of titanium dioxide. This application also uses a specific trifunctional acrylic monomer and monoclinic talc to promote each other, solving the problem of coating embrittlement caused by anatase titanium dioxide. Furthermore, the photosensitive coating for Mini LED boards obtained in this application has excellent flexibility, solder resistance, and bending resistance. Furthermore, the photosensitive coating obtained in this application has no cracks after reflow soldering, no yellowing at high temperatures, good color stability, and a reflectivity greater than 85% after reflow soldering. DETAILED DESCRIPTION

[0033] The present invention is described below by way of specific embodiments, but is not limited to the specific embodiments given below.

[0034] Example

[0035] Example 1

[0036] Embodiment 1 of the present invention provides a photosensitive coating for a Mini LED board. The raw materials for preparation are as follows, in parts by weight: 10 parts of photosensitive reaction resin, 10 parts of photosensitive reaction monomer, 20 parts of inorganic aggregate, 10 parts of reaction accelerator, 5 parts of titanium dioxide, and 10 parts of diluent.

[0037] The photosensitive reaction resin has an acid value of 100 mg KOH / g and is obtained by reacting an epoxy-containing acrylic resin, maleic anhydride, triphenylphosphine, and hydroquinone. The epoxy-containing acrylic resin is model kpl-12365 and was purchased from Shandong Kepler Biotechnology Co., Ltd.

[0038] The photosensitive monomers are trimethylolpropane triacrylate and an acrylic acid monomer with an acid value of 152 mg KOH / g, in a weight ratio of 1:5. The trimethylolpropane triacrylate was purchased from Kain Chemical, MIWON brand, model MIRAMER M300, with a viscosity of 80-120 cps at 25°C. The acrylic acid monomer with an acid value of 152 mg KOH / g was purchased from Shanghai Kain Chemical Co., Ltd., model SR9051NS. The inorganic aggregate, talc powder with a particle size of 500 mesh, was purchased from Lingshou Yongshun Mineral Products Processing Plant. The reaction accelerators are 1-hydroxycyclohexyl phenyl ketone and T31 epoxy resin curing agent, in a weight ratio of 1:2; the T31 epoxy resin curing agent was purchased from Jinan Linhai Chemical Co., Ltd. The titanium dioxide is anatase titanium dioxide, purchased from Langfang Lanke Chemical Co., Ltd., model BA01-2. The diluent is No. 200 solvent oil.

[0039] The preparation method of the photosensitive coating for Mini LED boards is as follows: mixing and stirring the raw materials for preparing the photosensitive coating for Mini LED boards, coating and hardening the coating on a base material, and then obtaining the coating.

[0040] Example 2

[0041] Embodiment 2 of the present invention provides a photosensitive coating for a Mini LED board. The raw materials for preparation are as follows, in parts by weight: 30 parts of photosensitive reaction resin, 15 parts of photosensitive reaction monomer, 40 parts of inorganic aggregate, 30 parts of reaction accelerator, 15 parts of titanium dioxide, and 30 parts of diluent.

[0042] The photosensitive reaction resin has an acid value of 100 mg KOH / g and is obtained by reacting an epoxy-containing acrylic resin, maleic anhydride, triphenylphosphine, and hydroquinone. The epoxy-containing acrylic resin is model kpl-12365 and was purchased from Shandong Kepler Biotechnology Co., Ltd.

[0043] The photosensitive monomers are trimethylolpropane triacrylate and an acrylic acid monomer with an acid value of 152 mg KOH / g, in a weight ratio of 1:8. The trimethylolpropane triacrylate was purchased from Kain Chemical, MIWON brand, model MIRAMER M300, with a viscosity of 80-120 cps at 25°C. The acrylic acid monomer with an acid value of 152 mg KOH / g was purchased from Shanghai Kain Chemical Co., Ltd., model SR9051NS. The inorganic aggregate, talc powder with an 800-mesh particle size, was purchased from Lingshou Yongshun Mineral Products Processing Plant. The reaction accelerator is 1-hydroxycyclohexyl phenyl ketone and T31 epoxy resin curing agent, in a weight ratio of 1:4. The T31 epoxy resin curing agent was purchased from Jinan Linhai Chemical Co., Ltd. The titanium dioxide is anatase titanium dioxide, purchased from Langfang Lanke Chemical Co., Ltd., model BA01-2. The diluent is No. 200 solvent oil.

[0044] The preparation method of the photosensitive coating for Mini LED boards is as follows: mixing and stirring the raw materials for preparing the photosensitive coating for Mini LED boards, coating and hardening the coating on a base material, and then obtaining the coating.

[0045] Example 3

[0046] Example 3 of the present invention provides a photosensitive coating for a Mini LED board. The raw materials for preparation are as follows, in parts by weight: 28 parts of photosensitive reaction resin, 13 parts of photosensitive reaction monomer, 25 parts of inorganic aggregate, 20 parts of reaction accelerator, 10 parts of titanium dioxide, and 20 parts of diluent.

[0047] The photosensitive reaction resin has an acid value of 100 mg KOH / g and is obtained by reacting an epoxy-containing acrylic resin, maleic anhydride, triphenylphosphine, and hydroquinone. The epoxy-containing acrylic resin is model kpl-12365 and was purchased from Shandong Kepler Biotechnology Co., Ltd.

[0048] The photosensitive monomers are trimethylolpropane triacrylate and an acrylic acid monomer with an acid value of 152 mg KOH / g, in a weight ratio of 1:7. The trimethylolpropane triacrylate was purchased from Kain Chemical, MIWON brand, model MIRAMER M300, with a viscosity of 80-120 cps at 25°C. The acrylic acid monomer with an acid value of 152 mg KOH / g was purchased from Shanghai Kain Chemical Co., Ltd., model SR9051NS. The inorganic aggregate, talc powder with a particle size of 600 mesh, was purchased from Lingshou Yongshun Mineral Products Processing Plant. The reaction accelerators are 1-hydroxycyclohexyl phenyl ketone and T31 epoxy resin curing agent, in a weight ratio of 1:3. The T31 epoxy resin curing agent was purchased from Jinan Linhai Chemical Co., Ltd. The titanium dioxide is anatase titanium dioxide, purchased from Langfang Lanke Chemical Co., Ltd., model BA01-2. The diluent is No. 200 solvent oil.

[0049] The preparation method of the photosensitive coating for Mini LED boards is as follows: mixing and stirring the raw materials for preparing the photosensitive coating for Mini LED boards, coating and hardening the coating on a base material, and then obtaining the coating.

[0050] Example 4

[0051] Example 4 of the present invention provides a photosensitive coating for a Mini LED board. Its specific implementation is the same as that of Example 3, except that the inorganic aggregate is calcium carbonate with a particle size of 600 mesh, purchased from Lingshou County Guanghui Mineral Products Processing Co., Ltd.

[0052] The specific implementation method of the preparation method of the photosensitive coating for the Mini LED board is the same as that of Example 3.

[0053] Example 5

[0054] Example 5 of the present invention provides a photosensitive coating for a Mini LED board, and its specific implementation is the same as that of Example 3, except that the photosensitive reaction monomer is neopentyl glycol diacrylate and 2-hydroxyethyl acrylate, with a weight ratio of 1:7.

[0055] The specific implementation method of the preparation method of the photosensitive coating for the Mini LED board is the same as that of Example 3.

[0056] Performance Evaluation

[0057] The photosensitive coatings obtained in Examples 1-5 were respectively laminated on the Mini LED board, exposed, developed in a 1 wt % sodium carbonate aqueous solution for 60 seconds, and then cured at 150° C. for 60 minutes.

[0058] 1. Yellowing resistance: The photosensitive coatings obtained in Examples 1 to 3 were observed to see if they turned yellow after the curing treatment. If they did not turn yellow, they were considered qualified; otherwise, they were considered unqualified.

[0059] 2. Strength stability: The photosensitive coatings obtained in Examples 1-5 were placed at 40° C. for 10 days after the above-mentioned curing treatment, and the surfaces were observed for cracks.

[0060] 3. Bending resistance: The photosensitive coatings obtained in Examples 1-5 after the above curing treatment were folded in half 20 times at an angle of 180°, and the presence of cracks was recorded.

[0061] Table 1

[0062]

Claims

1. A photosensitive coating for a Mini LED board, characterized in that: The raw materials for the preparation include, by weight, 10-30 parts of photosensitive reaction resin, 10-15 parts of photosensitive reaction monomer, 20-40 parts of inorganic aggregate, 10-30 parts of reaction accelerator, 1-15 parts of titanium dioxide, and 10-30 parts of diluent; The crystal form of the titanium dioxide is tetragonal; The photosensitive reaction monomer is a trifunctional acrylic monomer, including trimethylolpropane triacrylate; The trimethylolpropane triacrylate has a viscosity of 80-120 cps at 25°C; The trifunctional acrylic monomer further comprises an acrylic monomer having an acid value of 120-180 mg KOH / g, and the weight ratio of the acrylic monomer having an acid value of 120-180 mg KOH / g to trimethylolpropane triacrylate is (5-8):

1.

2. According to the photosensitive coating for Mini LED boards according to claim 1, the acid value of the acrylic monomer is 152 mg KOH / g.

3. The photosensitive coating for Mini LED board according to claim 1, characterized in that: The particle size of the inorganic aggregate is 500-800 meshes.

4. The photosensitive coating for Mini LED board according to claim 3, characterized in that: The inorganic aggregate is a monoclinic inorganic aggregate.

5. The photosensitive coating for Mini LED board according to claim 4, characterized in that: The reaction accelerator includes 1-hydroxycyclohexyl phenyl ketone and T31 epoxy resin curing agent.

6. A method for preparing a photosensitive coating for a Mini LED board according to any one of claims 1 to 5, characterized in that: include: The Mini LED board is obtained by mixing and stirring the raw materials for the photosensitive coating, coating it on the base material and curing it.

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