Graphene-like heat dissipation film applied to heat dissipation structure of camera internal chip

Abstract

The application discloses a graphene-like heat dissipation film applied to a camera internal chip heat dissipation structure and relates to the technical field of graphene heat dissipation films.The graphene-like heat dissipation film applied to the camera internal chip heat dissipation structure comprises a graphene-like heat dissipation film body, and a protection structure is arranged on the graphene-like heat dissipation film body.The graphene-like heat dissipation film body has a long service life, the upper heat conduction plate and the lower heat conduction plate are arranged on the upper surface and the lower surface of the graphene-like heat dissipation film body respectively, the lower surface of the upper heat conduction plate is fixedly provided with an upper magnetic sheet, the upper surface of the lower heat conduction plate is fixedly provided with a lower magnetic sheet, the upper magnetic sheet and the lower magnetic sheet repel each other to keep a protection gap between the upper magnetic sheet and the lower magnetic sheet, the graphene-like heat dissipation film body is prevented from being excessively compressed and damaged, the graphene-like heat dissipation film body is prevented from being compressed flat, and therefore the graphene-like heat dissipation film body can keep a long-time use effect.

Description

Technical Field

[0001] This invention relates to the field of graphene heat dissipation film technology, and in particular to a graphene-like heat dissipation film applied to the heat dissipation structure of internal chips in cameras. Background Technology

[0002] Graphene heat dissipation film can be used as a thermal conductive material and an electromagnetic shielding material. It is particularly suitable for use in the heat dissipation structure of internal chips in cameras. It is thin overall and has good thermal conductivity, which allows the heat generated on the internal chips of cameras to be dissipated quickly. In addition, the electromagnetic shielding effect of graphene heat dissipation film also reduces the impact of external electromagnetic interference on the chips.

[0003] However, graphene heat dissipation films have relatively low overall strength and are easily damaged by pressure when installed between the chip and the camera's internal housing, resulting in a relatively short lifespan. Furthermore, due to their contact-based heat conduction principle, there is no gap between the bottom of the chip and the camera's internal housing, and heat conduction relies entirely on contact. This leads to poor thermal conductivity when the surrounding area of ​​the chip is hot. Therefore, it is necessary to invent a graphene-like heat dissipation film for use in the heat dissipation structure of chips inside cameras to solve these problems. Summary of the Invention

[0004] The purpose of this invention is to provide a graphene-like heat dissipation film for use in the heat dissipation structure of internal chips in cameras, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a graphene-like heat dissipation film applied to the heat dissipation structure of a chip inside a camera, comprising a graphene-like heat dissipation film body, wherein a protective structure is provided on the graphene-like heat dissipation film body, the protective structure comprising an upper heat-conducting plate and a lower heat-conducting plate, the upper heat-conducting plate being fixedly installed on the upper surface of the graphene-like heat dissipation film body, and the lower heat-conducting plate being fixedly installed on the lower surface of the graphene-like heat dissipation film body, both the upper and lower surfaces of the graphene-like heat dissipation film body having mating grooves, the mating grooves being provided in multiple sets, the multiple sets of mating grooves being equally spaced, an upper magnetic sheet being fixedly provided on the lower surface of the upper heat-conducting plate, and a lower magnetic sheet being fixedly provided on the upper surface of the lower heat-conducting plate, the lower magnetic sheet engaging in the corresponding mating groove on the lower surface of the graphene-like heat dissipation film body, the upper magnetic sheet engaging in the corresponding mating groove on the upper surface of the graphene-like heat dissipation film body, the upper and lower corresponding upper and lower magnetic sheets repelling each other and moving away from each other, and a protective gap being formed between them, and a chip being installed above the upper heat-conducting plate.

[0006] Preferably, the lower surface of the lower heat-conducting plate is provided with a heat dissipation groove, and a plurality of heat dissipation holes penetrating from the inside and outside are provided around the heat dissipation groove. The lower surface of the lower heat-conducting plate is mounted on the inner wall of the camera housing.

[0007] This invention extends the service life of the graphene-like heat dissipation film. An upper heat-conducting plate and a lower heat-conducting plate protect the upper and lower surfaces of the graphene-like heat dissipation film, respectively. An upper magnetic sheet is fixedly mounted on the lower surface of the upper heat-conducting plate, and a lower magnetic sheet is fixedly mounted on the upper surface of the lower heat-conducting plate. The upper and lower magnetic sheets repel each other, maintaining a protective gap between them to prevent excessive compression and damage to the graphene-like heat dissipation film. This also prevents the graphene-like heat dissipation film from being flattened, thus enabling the graphene-like heat dissipation film to maintain its performance for a long time.

[0008] Preferably, a heat dissipation column is fixedly welded to the top of the heat dissipation groove, and multiple sets of heat dissipation columns are distributed at equal intervals. The lower surface of the heat dissipation column is flush with the lower surface of the lower heat conduction plate.

[0009] During operation, the chip is mounted on the upper surface of the upper heat-conducting plate, and the lower heat-conducting plate is mounted on the inner wall of the camera housing. The heat generated by the chip can be transferred to the inner wall of the camera housing in sequence through the upper heat-conducting plate, the graphene-like heat dissipation film, and the lower heat-conducting plate via contact transfer, thereby allowing the heat to be dissipated quickly.

[0010] Preferably, an edge fixing plate is fixedly welded around the lower heat-conducting plate. The edge fixing plate is disposed on the upper surface of the lower heat-conducting plate, and a heat dissipation distance is left between the lower part of the edge fixing plate and the bottom surface of the lower heat-conducting plate. Fixing screws are provided on the edge fixing plate.

[0011] Furthermore, to enhance heat dissipation, a heat dissipation groove is provided on the lower surface of the lower heat-conducting plate, and multiple sets of heat dissipation holes are provided around the heat dissipation groove. Air can also enter and exit the heat dissipation groove through the heat dissipation holes, thereby quickly removing the heat between the bottom of the graphene-like heat dissipation film and the inner wall of the camera housing, effectively combining air heat dissipation and contact heat dissipation.

[0012] Preferably, a screw is fixedly welded to the upper surface of the lower heat-conducting plate, and a nut is connected to the upper end of the screw through a threaded connection. Multiple sets of screws are provided.

[0013] In order to maintain the heat dissipation effect of contact heat dissipation, heat dissipation columns are fixedly installed on the upper inner wall of the heat dissipation tank. The heat dissipation columns maintain a sufficient contact area between the bottom of the lower heat conduction plate and the inner wall of the camera housing. Since multiple sets of heat dissipation columns are installed, the contact area between the inside of the heat dissipation tank and the air is large, which also plays a role in promoting each other and increasing the heat dissipation effect.

[0014] Preferably, the upper surface of the upper heat-conducting plate is provided with fixing grooves at both ends, the fixing grooves are rectangular groove structures, the bottom of the fixing grooves are provided with a second through hole, and the graphene-like heat dissipation film body is provided with a first through hole running vertically through it.

[0015] In practical use, the nut restricts the upper heat-conducting plate from moving away from the graphene-like heat dissipation film body, thereby allowing the graphene-like heat dissipation film body to be stably installed between the upper and lower heat-conducting plates. Adjusting the distance of the nut so that the upper heat-conducting plate has a certain upward distance can increase the buffering capacity of the overall structure.

[0016] Preferably, the upper end of the screw passes through the corresponding first through hole and second through hole in sequence and extends into the fixing groove, the nut is set in the fixing groove, and the upper surface of the screw is lower than the upper surface of the upper heat-conducting plate.

[0017] It should be noted that the nuts and screws also serve to securely connect the upper heat-conducting plate, the graphene-like heat dissipation film body, and the lower heat-conducting plate. The structure is reasonably designed and easy to assemble and disassemble.

[0018] Preferably, the upper heat-conducting plate is provided with a fixing component for fixing the chip. There are two sets of fixing components, which are respectively located on both sides of the upper heat-conducting plate and simultaneously located on both sides of the chip.

[0019] Furthermore, the edge fixing plate is fixed to the inner wall of the camera housing with fixing screws, and a heat dissipation gap is maintained between the edge fixing plate and the inner wall of the camera housing, so that the air around the heat dissipation slot can circulate smoothly.

[0020] Preferably, the fixing component includes a side positioning plate fixedly welded to the upper surface of the upper heat-conducting plate. A pull plate is provided on the side of the side positioning plate away from the chip. A spring is fixedly welded to the side of the side positioning plate near the pull plate. The end of the spring away from the side positioning plate is fixedly welded to the pull plate. A telescopic groove is provided on the side positioning plate, extending from left to right. A telescopic plate is fixedly welded to the pull plate. One end of the telescopic plate moves through the telescopic groove and engages with the upper surface of the chip at the edge. Both the upper and lower edges of the end of the telescopic plate passing through the telescopic groove are provided with rounded chamfers.

[0021] When the pull plate is pulled away from the side positioning plate, the chip can be inserted between the two sets of side positioning plates. When the pull plate is released, the spring pulls the pull plate back to its original position, so that the telescopic plate fits and restricts the chip on the upper surface, which can quickly fix the chip.

[0022] Preferably, the telescopic plates are provided in multiple sets, and the multiple sets of telescopic plates are distributed at equal distances above and below. The side positioning plate is provided with multiple sets of telescopic grooves corresponding to the multiple sets of telescopic plates.

[0023] In this structure, multiple sets of chips can be set up, and the multiple sets of chips are locked between corresponding telescopic plates, which facilitates reasonable and full utilization. Moreover, the multiple sets of chips do not contact each other, ensuring that there is sufficient heat dissipation space around the chips.

[0024] The technical effects and advantages of this invention are as follows:

[0025] 1. The present invention relates to a graphene-like heat dissipation film applied to the heat dissipation structure of an internal chip in a camera. The graphene-like heat dissipation film body includes a graphene-like heat dissipation film body with a protective structure. The protective structure includes an upper heat-conducting plate and a lower heat-conducting plate. The upper heat-conducting plate is fixedly installed on the upper surface of the graphene-like heat dissipation film body. The present invention extends the service life of the graphene-like heat dissipation film body. The upper and lower heat-conducting plates respectively protect the upper and lower surfaces of the graphene-like heat dissipation film body. An upper magnetic sheet is fixedly disposed on the lower surface of the upper heat-conducting plate, and a lower magnetic sheet is fixedly disposed on the upper surface of the lower heat-conducting plate. The upper and lower magnetic sheets repel each other, thus maintaining a protective gap between them. This prevents the graphene-like heat dissipation film body from being excessively compressed and damaged, and avoids the graphene-like heat dissipation film body from being flattened, thereby enabling the graphene-like heat dissipation film body to maintain its long-term performance.

[0026] 2. In this invention, the chip is installed on the upper surface of the upper heat-conducting plate, and the lower heat-conducting plate is installed on the inner wall of the camera housing. The heat generated by the chip can be transferred to the inner wall of the camera housing in sequence through the upper heat-conducting plate, the graphene-like heat dissipation film body, and the lower heat-conducting plate by contact transfer, so that the heat is quickly dissipated.

[0027] 3. In order to increase the heat dissipation effect, a heat dissipation groove is provided on the lower surface of the lower heat conduction plate in this invention. Multiple sets of heat dissipation holes are provided around the heat dissipation groove. Air can also enter and exit the heat dissipation groove through the heat dissipation holes, thereby quickly removing the heat between the bottom of the graphene-like heat dissipation film body and the inner wall of the camera housing, which effectively combines air heat dissipation and contact heat dissipation.

[0028] 4. In order to maintain the heat dissipation effect of contact heat dissipation in this invention, a heat dissipation column is fixedly installed on the upper inner wall of the heat dissipation groove. The heat dissipation column maintains a sufficient contact area between the bottom of the lower heat conduction plate and the inner wall of the camera housing. Since multiple sets of heat dissipation columns are installed, the contact area between the inside of the heat dissipation groove and the air is large, which also plays the role of mutually promoting and increasing the heat dissipation effect.

[0029] 5. In this invention, the nut restricts the upper heat-conducting plate from moving away from the graphene-like heat dissipation film body, thereby allowing the graphene-like heat dissipation film body to be stably installed between the upper and lower heat-conducting plates. Adjusting the distance of the nut so that the upper heat-conducting plate has a certain upward distance can increase the buffering capacity of the overall structure. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the present invention.

[0031] Figure 2 For the present invention Figure 1 Enlarged schematic diagram of the structure at point A in the middle.

[0032] Figure 3 This is a top view of the heat-conducting plate of the present invention.

[0033] Figure 4 This is a top view of the graphene heat dissipation film body of the present invention.

[0034] Figure 5 This is a top view of the heat-conducting plate of the present invention.

[0035] Figure 6 This is a bottom view of the heat-conducting plate of the present invention.

[0036] In the diagram: 1. Upper heat-conducting plate; 2. Graphene-like heat dissipation film body; 3. Lower heat-conducting plate; 4. Chip; 5. Fixing component; 6. Upper magnetic sheet; 7. Lower magnetic sheet; 8. Protective gap; 9. Fixing groove; 10. Edge fixing plate; 11. Fixing screw; 12. Heat dissipation groove; 13. Heat dissipation column; 14. Heat dissipation hole; 15. Nut; 16. Screw; 17. Mating groove; 18. First through hole; 19. Spring; 20. Pull plate; 21. Side positioning plate; 22. Telescopic groove; 23. Telescopic plate; 24. Circular chamfer; 25. Second through hole. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] This invention provides, for example Figure 1-6 The graphene-like heat dissipation film shown is used in the heat dissipation structure of the internal chip of a camera. It includes a graphene-like heat dissipation film body 2, and a protective structure on the graphene-like heat dissipation film body 2. The protective structure includes an upper heat-conducting plate 1 and a lower heat-conducting plate 3. The upper heat-conducting plate 1 is fixedly installed on the upper surface of the graphene-like heat dissipation film body 2, and the lower heat-conducting plate 3 is fixedly installed on the lower surface of the graphene-like heat dissipation film body 2. Both the upper and lower surfaces of the graphene-like heat dissipation film body 2 have mating grooves 17. Multiple sets of mating grooves 17 are provided and are distributed at equal intervals. An upper magnetic sheet 6 is fixedly installed on the lower surface of the upper heat-conducting plate 1, and a lower magnetic sheet 7 is fixedly installed on the upper surface of the lower heat-conducting plate 3. The lower magnetic sheet 7 is engaged in the corresponding mating groove 17 on the lower surface of the graphene-like heat dissipation film body 2, and the upper magnetic sheet 6 is engaged in the corresponding mating groove 17 on the upper surface of the graphene-like heat dissipation film body 2. The upper magnetic sheet 6 and the lower magnetic sheet 7 are repelled and moved away from each other, and a protective gap 8 is formed between them. A chip 4 is installed above the upper heat-conducting plate 1.

[0039] The lower surface of the lower heat-conducting plate 3 is provided with a heat dissipation groove 12, and a number of heat dissipation holes 14 with internal and external penetration are provided around the heat dissipation groove 12. The lower surface of the lower heat-conducting plate 3 is installed on the inner wall of the camera housing.

[0040] This invention extends the service life of the graphene-like heat dissipation film body 2. The upper heat-conducting plate 1 and the lower heat-conducting plate 3 protect the upper and lower surfaces of the graphene-like heat dissipation film body 2, respectively. An upper magnetic sheet 6 is fixedly disposed on the lower surface of the upper heat-conducting plate 1, and a lower magnetic sheet 7 is fixedly disposed on the upper surface of the lower heat-conducting plate 3. The upper magnetic sheet 6 and the lower magnetic sheet 7 repel each other and keep away from each other, thus maintaining a protective gap 8 between them. This prevents the graphene-like heat dissipation film body 2 from being over-pressed and damaged, and prevents the graphene-like heat dissipation film body 2 from being flattened, thereby enabling the graphene-like heat dissipation film body 2 to maintain its long-term use effect.

[0041] The top of the heat sink 12 is fixedly welded with heat dissipation columns 13. Multiple sets of heat dissipation columns 13 are distributed at equal intervals. The lower surface of the heat dissipation columns 13 is flush with the lower surface of the lower heat conduction plate 3.

[0042] During operation, chip 4 is mounted on the upper surface of the upper heat-conducting plate 1, and the lower heat-conducting plate 3 is mounted on the inner wall of the camera housing. The heat generated by chip 4 can be transferred to the inner wall of the camera housing in sequence through the upper heat-conducting plate 1, the graphene-like heat dissipation film body 2, and the lower heat-conducting plate 3 via contact transfer, thereby allowing the heat to be dissipated quickly.

[0043] An edge fixing plate 10 is fixedly welded around the lower heat conduction plate 3. The edge fixing plate 10 is set on the upper surface of the lower heat conduction plate 3. A heat dissipation distance is left between the bottom of the edge fixing plate 10 and the bottom surface of the lower heat conduction plate 3. A fixing screw 11 is provided on the edge fixing plate 10.

[0044] Furthermore, in order to increase the heat dissipation effect, a heat dissipation groove 12 is provided on the lower surface of the lower heat conduction plate 3. Multiple sets of heat dissipation holes 14 are provided around the heat dissipation groove 12. Air can also enter and exit the heat dissipation groove 12 through the heat dissipation holes 14, thereby quickly removing the heat between the bottom of the graphene-like heat dissipation film body 2 and the inner wall of the camera housing, effectively combining air heat dissipation and contact heat dissipation.

[0045] A screw 16 is fixedly welded to the upper surface of the lower heat-conducting plate 3. A nut 15 is connected to the upper end of the screw 16 by thread engagement. Multiple sets of screws 16 are provided.

[0046] In order to maintain the heat dissipation effect of contact heat dissipation, a heat dissipation column 13 is fixedly installed on the upper inner wall of the heat dissipation groove 12. The heat dissipation column 13 maintains a sufficient contact area between the bottom of the lower heat conduction plate 3 and the inner wall of the camera housing. Since multiple sets of heat dissipation columns 13 are installed, the contact area between the inside of the heat dissipation groove 12 and the air is large, which also plays a role in promoting each other to increase the heat dissipation effect.

[0047] The upper surface of the upper heat-conducting plate 1 is provided with fixing grooves 9 at both ends. The fixing grooves 9 are rectangular groove structures. The bottom of the fixing grooves 9 is provided with a second through hole 25. The graphene-like heat dissipation film body 2 is provided with a first through hole 18 that runs through the top and bottom.

[0048] In actual use, the nut 15 restricts the upper heat-conducting plate 1 from moving away from the graphene-like heat dissipation film body 2, so that the graphene-like heat dissipation film body 2 can be stably installed between the upper heat-conducting plate 1 and the lower heat-conducting plate 3. Adjusting the distance of the nut 15 so that the upper heat-conducting plate 1 has a certain upward distance can increase the buffering of the overall structure.

[0049] The upper end of the screw 16 passes through the corresponding first through hole 18 and second through hole 25 in sequence and extends into the fixing groove 9. The nut 15 is set in the fixing groove 9. The upper surface of the screw 16 is lower than the upper surface of the upper heat-conducting plate 1.

[0050] It should be noted that the nut 15 and screw 16 also serve to fix the upper heat-conducting plate 1, the graphene-like heat dissipation film body 2, and the lower heat-conducting plate 3. The structure is reasonably designed and easy to disassemble and assemble.

[0051] The upper heat-conducting plate 1 is provided with a fixing component 5 for fixing the chip 4. There are two sets of fixing components 5, which are respectively located on both sides of the upper heat-conducting plate 1 and simultaneously located on both sides of the chip 4.

[0052] Furthermore, the edge fixing plate 10 is fixed to the inner wall of the camera housing by fixing screws 11, and a heat dissipation gap is maintained between the edge fixing plate 10 and the inner wall of the camera housing, so that the air around the heat dissipation groove 12 can circulate smoothly.

[0053] The fixing component 5 includes a side positioning plate 21 fixedly welded to the upper surface of the upper heat-conducting plate 1. A pull plate 20 is provided on the side of the side positioning plate 21 away from the chip 4. A spring 19 is fixedly welded to the side of the side positioning plate 21 near the pull plate 20. The end of the spring 19 away from the side positioning plate 21 is fixedly welded to the pull plate 20. A telescopic groove 22 that runs through the left and right sides is provided on the side positioning plate 21. A telescopic plate 23 is fixedly welded to the pull plate 20. One end of the telescopic plate 23 moves through the telescopic groove 22 and engages with the upper surface of the edge of the chip 4. The upper and lower edges of the end of the telescopic plate 23 that passes through the telescopic groove 22 are provided with rounded chamfers 24.

[0054] When the pull plate 20 is pulled away from the side positioning plate 21, the chip 4 can be inserted between the two sets of side positioning plates 21. When the pull plate 20 is relaxed, the spring 19 pulls the pull plate 20 back to its original position, so that the telescopic plate 23 fits and restricts the chip 4 on the upper surface, which can quickly fix the chip 4.

[0055] Multiple sets of telescopic plates 23 are provided, and the multiple sets of telescopic plates 23 are distributed at equal distances above and below. Multiple sets of telescopic grooves 22 are provided on the side positioning plate 21 corresponding to the multiple sets of telescopic plates 23.

[0056] In this structure, multiple sets of chips 4 can be set, and the multiple sets of chips 4 are engaged between the corresponding telescopic plates 23, which facilitates reasonable and full utilization. Moreover, the multiple sets of chips 4 do not contact each other, ensuring that there is sufficient heat dissipation space around the chips 4.

[0057] Working principle: This invention extends the service life of the graphene-like heat dissipation film body 2. The upper heat-conducting plate 1 and the lower heat-conducting plate 3 protect the upper and lower surfaces of the graphene-like heat dissipation film body 2, respectively. An upper magnetic sheet 6 is fixedly installed on the lower surface of the upper heat-conducting plate 1, and a lower magnetic sheet 7 is fixedly installed on the upper surface of the lower heat-conducting plate 3. The upper magnetic sheet 6 and the lower magnetic sheet 7 repel each other and keep away from each other, thus maintaining a protective gap 8 between them. This prevents the graphene-like heat dissipation film body 2 from being over-pressed and damaged, and prevents the graphene-like heat dissipation film body 2 from being flattened, thereby enabling the graphene-like heat dissipation film body 2 to maintain its long-term use effect.

[0058] During operation, chip 4 is mounted on the upper surface of the upper heat-conducting plate 1, and the lower heat-conducting plate 3 is mounted on the inner wall of the camera housing. The heat generated by chip 4 can be transferred to the inner wall of the camera housing in sequence through the upper heat-conducting plate 1, the graphene-like heat dissipation film body 2, and the lower heat-conducting plate 3 via contact transfer, thereby allowing the heat to be dissipated quickly.

[0059] To enhance heat dissipation, a heat dissipation groove 12 is provided on the lower surface of the lower heat conduction plate 3. Multiple sets of heat dissipation holes 14 are provided around the heat dissipation groove 12. Air can also enter and exit the heat dissipation groove 12 through the heat dissipation holes 14, thereby quickly removing the heat between the bottom of the graphene-like heat dissipation film body 2 and the inner wall of the camera housing, effectively combining air heat dissipation and contact heat dissipation.

[0060] In order to maintain the heat dissipation effect of contact heat dissipation, a heat dissipation column 13 is fixedly installed on the upper inner wall of the heat dissipation groove 12. The heat dissipation column 13 maintains a sufficient contact area between the bottom of the lower heat conduction plate 3 and the inner wall of the camera housing. Since multiple sets of heat dissipation columns 13 are installed, the contact area between the inside of the heat dissipation groove 12 and the air is large, which also plays a role in promoting each other to increase the heat dissipation effect.

[0061] In actual use, the nut 15 restricts the upper heat-conducting plate 1 from moving away from the graphene-like heat dissipation film body 2, so that the graphene-like heat dissipation film body 2 can be stably installed between the upper heat-conducting plate 1 and the lower heat-conducting plate 3. Adjusting the distance of the nut 15 so that the upper heat-conducting plate 1 has a certain upward distance can increase the buffering of the overall structure.

[0062] Nut 15 and screw 16 also serve to fix the upper heat-conducting plate 1, the graphene-like heat dissipation film body 2, and the lower heat-conducting plate 3. The structure is reasonably designed and easy to disassemble and assemble. The edge fixing plate 10 is fixed to the inner wall of the camera housing by fixing screws 11. There is a heat dissipation gap between the edge fixing plate 10 and the inner wall of the camera housing, so that the air around the heat dissipation groove 12 can circulate smoothly.

[0063] When the pull plate 20 is pulled away from the side positioning plate 21, the chip 4 can be inserted between the two sets of side positioning plates 21. When the pull plate 20 is released, the spring 19 pulls the pull plate 20 back to its original position, so that the telescopic plate 23 fits and restricts the chip 4 on the upper surface, which can quickly fix the chip 4. Multiple sets of chips 4 can be set, and multiple sets of chips 4 are inserted between the corresponding telescopic plates 23, which is convenient for reasonable and full utilization. Moreover, the multiple sets of chips 4 do not contact each other, ensuring that there is sufficient heat dissipation space around the chip 4.

Claims

1. A graphene-like heat dissipation film applied to the heat dissipation structure of a chip inside a camera, comprising a graphene-like heat dissipation film body (2), characterized in that: The graphene-like heat dissipation film body (2) is provided with a protective structure, which includes an upper heat-conducting plate (1) and a lower heat-conducting plate (3). The upper heat-conducting plate (1) is fixedly installed on the upper surface of the graphene-like heat dissipation film body (2), and the lower heat-conducting plate (3) is fixedly installed on the lower surface of the graphene-like heat dissipation film body (2). A set of mating grooves (17) is provided on the upper and lower surfaces of the graphene-like heat dissipation film body (2). There are multiple sets of mating grooves (17), and the multiple sets of mating grooves (17) are distributed at equal distances. The lower surface of the upper heat-conducting plate (1) is provided with a set of mating grooves (17). An upper magnetic sheet (6) is fixedly disposed on the upper surface of the lower heat-conducting plate (3), and a lower magnetic sheet (7) is fixedly disposed on the upper surface of the lower heat-conducting plate (3). The lower magnetic sheet (7) is engaged in the corresponding matching groove (17) on the lower surface of the graphene heat dissipation film body (2), and the upper magnetic sheet (6) is engaged in the corresponding matching groove (17) on the upper surface of the graphene heat dissipation film body (2). The upper magnetic sheet (6) and the lower magnetic sheet (7) are repelled and moved away from each other, and a protective gap (8) is formed between them. A chip (4) is installed above the upper heat-conducting plate (1).

2. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 1, characterized in that: The lower surface of the lower heat-conducting plate (3) is provided with a heat dissipation groove (12), and a plurality of heat dissipation holes (14) with internal and external penetration are provided around the heat dissipation groove (12). The lower surface of the lower heat-conducting plate (3) is installed on the inner wall of the camera housing.

3. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera's internal chip according to claim 2, characterized in that: The top of the heat dissipation groove (12) is fixedly welded with heat dissipation columns (13), and the heat dissipation columns (13) are distributed in multiple groups at equal intervals. The lower surface of the heat dissipation columns (13) is flush with the lower surface of the lower heat conduction plate (3).

4. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera's internal chip according to claim 3, characterized in that: An edge fixing plate (10) is fixedly welded around the lower heat-conducting plate (3). The edge fixing plate (10) is disposed on the upper surface of the lower heat-conducting plate (3). A heat dissipation distance is left between the lower part of the edge fixing plate (10) and the bottom surface of the lower heat-conducting plate (3). A fixing screw (11) is provided on the edge fixing plate (10).

5. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 4, characterized in that: The upper surface of the lower heat-conducting plate (3) is fixedly welded with a screw (16), and the upper end of the screw (16) is connected to a nut (15) by threaded connection. The screw (16) is provided with multiple sets.

6. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 5, characterized in that: The upper heat-conducting plate (1) has a fixing groove (9) at both ends on its upper surface. The fixing groove (9) has a rectangular groove structure. The bottom of the fixing groove (9) has a second through hole (25). The graphene-like heat dissipation film body (2) has a first through hole (18) that runs through the top and bottom.

7. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 6, characterized in that: The upper end of the screw (16) passes through the corresponding first through hole (18) and second through hole (25) in sequence and extends into the fixing groove (9). The nut (15) is set in the fixing groove (9). The upper surface of the screw (16) is lower than the upper surface of the upper heat-conducting plate (1).

8. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 7, characterized in that: The upper heat-conducting plate (1) is provided with a fixing component (5) for fixing the chip (4). There are two sets of fixing components (5), which are respectively located on both sides of the upper heat-conducting plate (1) and the fixing components (5) are located on both sides of the chip (4).

9. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 8, characterized in that: The fixing component (5) includes a side positioning plate (21) fixedly welded to the upper surface of the upper heat-conducting plate (1). A pull plate (20) is provided on the side of the side positioning plate (21) away from the chip (4). A spring (19) is fixedly welded to the side of the side positioning plate (21) near the pull plate (20). The end of the spring (19) away from the side positioning plate (21) is fixedly welded to the pull plate (20). A telescopic groove (22) is provided on the side positioning plate (21) that runs through the left and right. A telescopic plate (23) is fixedly welded to the pull plate (20). One end of the telescopic plate (23) moves through the telescopic groove (22) and engages with the upper surface of the edge of the chip (4). Circular chamfers (24) are provided at the upper and lower edges of the end of the telescopic plate (23) that passes through the telescopic groove (22).

10. The graphene-like heat dissipation film applied to the heat dissipation structure of a camera internal chip according to claim 9, characterized in that: The telescopic plate (23) is provided in multiple sets, and the multiple sets of telescopic plates (23) are distributed at equal distances above and below. The side positioning plate (21) is provided with multiple sets of telescopic grooves (22) corresponding to the multiple sets of telescopic plates (23).

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