A PCB board lamination process

Abstract

The present invention discloses a PCB lamination process, belonging to the technical field of PCB processing, which includes the following steps: S1. Blanking: cutting the raw materials according to the required dimensions; S2. PCB board lamination: sequentially placing the upper copper foil, core board layer and lower copper foil from top to bottom on the PCB board raw materials; S3. Lamination: laminating the PCB stack obtained in step S2 through a working box to obtain a PCB stack board; S4. Inner layer pattern: performing ultraviolet exposure and development on the PCB stack board to form circuits; S5. Inner layer line inspection: optically inspecting the inner layer circuits on the core board; S6. Drilling; S8. Resin plugging holes: filling the holes with resin; S9. Final inspection: performing final inspection on the products. The device for the PCB lamination process can clean and recycle PP in a timely manner and can cool down faster to improve processing efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB processing, and in particular to a PCB board pressing process. Background Art

[0002] Currently, with the upgrading of industries, the trend of independent research and development is gradually rising. When customers independently develop and design PCB boards, they generally consider product performance more. However, the processability of the designed PCB boards may be difficult. In order to process the PCB boards, a dedicated pressing device is required to use heat and pressure to bond the PP with different inner core layers and outer copper foil.

[0003] For example, a pressing device for PCB board production with Chinese invention application number CN202023144332.7 includes a base, a fixed pressing plate is provided at the center of the top surface of the base, and a left vertical plate and a right vertical plate are provided on the left and right sides of the top surface of the base, respectively, including a pressing mechanism; a first strip through hole and a second strip through hole are vertically provided in the middle of the left vertical plate and the right vertical plate, respectively; the pressing mechanism includes a left pressing mechanism and a right pressing mechanism of the same structure and size, the left pressing mechanism and the right pressing mechanism are respectively provided on the right side of the left vertical plate and the left side of the right vertical plate, and are in a left-right symmetrical state, and the left pressing mechanism includes a bearing plate and a movable plate. In order to solve the problem of uneven pressure exerted by the pressing plate on the copper clad laminate on the pressing device, the present invention provides a pressing device for PCB board production to ensure that the pressure of the pressing plate on the pressing device on the copper clad laminate is uniform.

[0004] However, the existing device has the problem of not being able to clean and recycle PP in time. Summary of the Invention

[0005] The object of the present invention is to provide a PCB board pressing process to solve the problems raised in the background technology.

[0006] Technical solution: A PCB board pressing process includes the following steps:

[0007] S1. Cutting: Cut the raw materials to the required size; S2. PCB board lamination: Place the upper copper foil, core board layer and lower copper foil on the PCB board raw materials from top to bottom in sequence; S3. Lamination: The PCB lamination obtained in step S2 is pressed through a work box to obtain a PCB laminate; S4. Inner layer patterning: The PCB laminate is exposed to ultraviolet light and developed to form circuits; S5. Inner layer line inspection: Optical inspection of the inner layer circuits on the core board; S6. Punching; S8. Resin plugging: Filling the holes with resin; S9. Production inspection: Perform final product inspection.

[0008] A pressing assembly is provided inside the working box, a recovery assembly is provided below the pressing assembly, and a cooling assembly is provided inside the working box;

[0009] The pressing assembly includes a hydraulic rod installed in the middle of the inner cavity of the working box through a mounting plate and a support plate located below the hydraulic rod, and the support plate is horizontally inserted into the lower part of the inner cavity of the working box. The recycling assembly includes a recycling housing supported on the bottom of the inner cavity of the working box and a linear guide motor installed on the rear inner wall of the working box. A connecting piece is installed at the bottom of the output end of the linear guide motor, and brush hairs supported on the top of the support plate are evenly adhered to the bottom of the connecting piece. Two rows of leakage holes are symmetrically formed at the top of the support plate.

[0010] In a further embodiment, the pressing assembly further includes a pressing plate installed at the bottom of the output end of the hydraulic rod. An electric heating plate is arranged below the support plate, and a plurality of heat conducting plates are evenly connected between the electric heating plate and the support plate, and a plurality of heat dissipation holes are evenly formed on the surface of the heat conducting plates.

[0011] In a further embodiment, the cooling assembly includes mounting grooves corresponding to the heat conducting plates symmetrically formed on both side walls of the working box and a plurality of first heat dissipation fans arranged side by side and nested in the mounting grooves. A plurality of second heat dissipation fans are horizontally inserted side by side in the upper part of the inner cavity of the working box.

[0012] In a further embodiment, a first dust-proof net is further nested in the mounting groove, and the first dust-proof net is supported on the side of the first heat dissipation fan close to the heat conducting plate.

[0013] In a further embodiment, a first dust-proof net is further nested in the mounting groove, and the first dust-proof net is supported on the side of the first heat dissipation fan close to the heat conducting plate.

[0014] The technical effects and advantages of the present invention: For the device for the PCB board pressing process, after the processing is completed and the finished product is taken out, a small amount of PP will flow onto the top of the support plate. At this time, the support plate is reheated to melt the PP, and then the linear guide motor drives the brush hairs to sweep back and forth, so that the PP can be swept from the leakage holes into the recycling housing for collection, and the PP can be cleaned and recycled in time;

[0015] After the pressing is completed, the first heat dissipation fans cooperate to quickly cool the bottom of the heat conducting plates and the support plate, and the second heat dissipation fans can quickly cool the top of the support plate, so that the temperature can be reduced faster to improve the processing efficiency;

[0016] The device for the PCB board pressing process can clean and recycle the PP in time and can reduce the temperature faster to improve the processing efficiency. Description of the Drawings

[0017] Figure 1 is a structural schematic diagram of the present invention;

[0018] Figure 2 is a cross-sectional view of the present invention;

[0019] Figure 3 For the present invention Figure 2 an enlarged view of location A in the present invention.

[0020] In the figure: 1, working box; 2, support plate; 3, hydraulic rod; 4, pressing plate; 5, first blocking plate; 6, electric heating plate; 7, heat conducting plate; 8, recovery housing; 9, linear guide motor; 10, brush bristles; 11, first cooling fan; 12, second cooling fan; 13, first dust-proof net; 14, second dust-proof net; 15, second blocking plate; 16, support leg. Specific embodiments

[0021] In the following description, numerous specific details are given to provide a more thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that the present invention may be practiced without one or more of these details. In other instances, well-known features of the art are not described to avoid obscuring the present invention.

[0022] A PCB board pressing process includes the following steps: S1, blanking: cutting the raw material to the required size; S2, PCB board lamination: placing the PCB board raw materials in sequence from top to bottom with upper copper foil, core board layer, and lower copper foil; S3, pressing: pressing the PCB lamination obtained in step S2 through the working box 1 to obtain a PCB laminated board; S4, inner layer pattern: performing ultraviolet exposure and development on the PCB laminated board to form circuits; S5, inner layer line inspection: optically inspecting the inner layer circuits on the core board; S6, drilling; S8, resin plugging holes: filling resin in the holes; S9, final inspection: performing final inspection on the product.

[0023] A pressing assembly is provided inside the working box 1. The pressing assembly includes a hydraulic rod 3 installed in the middle of the inner cavity of the working box 1 through a mounting plate. The mounting plate is connected between the front and rear inner side walls of the working box 1 through multiple bolts. The bottom of the output end of the hydraulic rod 3 is connected with a pressing plate 4 through bolts. A support plate 2 is horizontally and fixedly inserted in the lower part of the inner cavity of the working box 1 through multiple bolts. An electric heating plate 6 is arranged below the support plate 2. A plurality of heat conducting plates 7 are evenly connected between the electric heating plate 6 and the support plate 2. The electric heating plate 6 can ensure that the support plate 2 is evenly heated through the plurality of heat conducting plates 7;

[0024] In order to clean and recycle PP in a timely manner, as Figure 2 and Figure 3 , a recovery assembly is arranged below the pressing assembly. The recovery assembly includes a recovery housing 8 supported on the bottom of the inner cavity of the working box 1. A linear guide motor 9 is installed on the rear inner side wall of the working box 1 through multiple bolts. The bottom of the output end of the linear guide motor 9 is installed with a connecting piece through screws. The bottom of the connecting piece is evenly adhered with brush bristles 10 supported on the top of the support plate 2. Two rows of leakage holes are symmetrically opened on the top of the support plate 2;

[0025] As shown in Figure 1 , on the front side wall of the working box 1, a first slot and a second slot corresponding to the support plate 2 and the recycling housing 8 are respectively opened. The bottoms of the first slot and the second slot are respectively connected with a first blocking plate 5 and a second blocking plate 15 through hinges. The processed PCB board can be taken out by opening the first blocking plate 5, and the recycling housing 8 can be taken out by opening the second blocking plate 15. Legs 16 are welded to the four corners of the bottom of the working box 1;

[0026] In order to cool down faster to improve the processing efficiency, a cooling component is provided in the working box 1. The cooling component includes installation slots symmetrically opened on both side walls of the working box 1 corresponding to the heat conduction plate 7 and a plurality of first cooling fans 11 nested side by side in the installation slots. The air directions of the two rows of first cooling fans 11 are the same. A first dust-proof net 13 is also nested in the installation slot, and the first dust-proof net 13 is supported on the side of the first cooling fan 11 close to the heat conduction plate 7 to prevent dust from entering the working box 1. A plurality of heat dissipation holes are evenly opened on the surface of the heat conduction plate 7 to ensure that the heat conduction plate 7 can dissipate heat faster. A plurality of second cooling fans 12 are horizontally inserted side by side in the upper part of the inner cavity of the working box 1. The uppermost second cooling fan 12 is nested in the bottom of the working box 1, and a second dust-proof net 14 is connected to the bottom of the second cooling fan 12 to prevent dust from entering the working box 1.

[0027] Working principle: For the device used in the PCB board lamination process, connect the device to an external power supply. Place the PCB board workpiece to be laminated on the top of the support plate 2, then close the first blocking plate 5. Start the electric heating plate 6 to heat by the existing principle and conduct heat to the support plate 2 through a plurality of heat conduction plates 7 to melt the PP. Then start the hydraulic rod 3 to push the pressing plate 4 down to cooperate with the support plate 2 to complete the lamination of the PCB board workpiece. After the lamination is completed, the plurality of first cooling fans 11 can be used to quickly cool the bottom of the heat conduction plate 7 and the support plate 2, and the plurality of second cooling fans 12 can be used to quickly cool the top of the support plate 2, so as to cool down faster to improve the processing efficiency. After the heat dissipation is completed, open the first blocking plate 5 to take out the PCB board finished product. During lamination, a small amount of PP will flow to the top of the support plate 2. At this time, heat the support plate 2 again through the electric heating plate 6 to melt the PP, and then drive the brush 10 to sweep back and forth through the linear guide motor 9 to sweep the PP from the leakage hole into the recycling housing 8 for collection.

[0028] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCB board lamination process, comprising the following steps: S1. Blanking: Cutting the raw material according to the required size; S2. PCB board stacking: Placing the copper foil, core board layer, and lower copper foil on the PCB board raw material in sequence from top to bottom; S3. Lamination: Laminating the PCB stack obtained in step S2 through the working box (1) to obtain a PCB stack board; S4. Inner layer pattern: Performing ultraviolet exposure and development on the PCB stack board to form circuits; S5. Inner layer line inspection: Optically inspecting the inner layer circuits on the core board; S6. Drilling; S8. Resin plugging holes: Filling the holes with resin; S9. Final inspection: Conducting final inspection of the product; A lamination component is arranged inside the working box (1), a recycling component is arranged below the lamination component, and a temperature reduction component is arranged inside the working box (1); the lamination component includes a hydraulic rod (3) installed in the middle of the inner cavity of the working box (1) through a mounting plate and a support plate (2) located below the hydraulic rod (3), and the support plate (2) is horizontally inserted into the lower part of the inner cavity of the working box (1). The recycling component includes a recycling housing (8) supported on the bottom of the inner cavity of the working box (1) and a linear guide motor (9) installed on the rear inner wall of the working box (1). A connecting piece is installed at the bottom of the output end of the linear guide motor (9), and bristles (10) supported on the top of the support plate (2) are evenly bonded to the bottom of the connecting piece. Two rows of leakage holes are symmetrically formed at the top of the support plate (2); The lamination component further includes a pressing plate (4) installed at the bottom of the output end of the hydraulic rod (3). An electric heating plate (6) is arranged below the support plate (2), and a plurality of heat conducting plates (7) are evenly connected between the electric heating plate (6) and the support plate (2), and a plurality of heat dissipation holes are evenly formed on the surface of the heat conducting plate (7).

2. The PCB board lamination process according to claim 1, wherein: The temperature reduction component includes mounting grooves corresponding to the heat conducting plates (7) symmetrically formed on both side walls of the working box (1) and a plurality of first heat dissipation fans (11) arranged side by side and nested in the mounting grooves. A plurality of second heat dissipation fans (12) are horizontally inserted side by side in the upper part of the inner cavity of the working box (1).

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