High quality inp processing apparatus
By designing a double-sided processing equipment for INP wafers, simultaneous processing and waste liquid recovery were achieved, solving the problems of low space utilization and manual labor dependence of existing equipment, and improving the degree of automation and processing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-16
- Publication Date
- 2026-03-24
AI Technical Summary
Existing grinding and polishing equipment can usually only polish and grind one crystal at a time, resulting in low space utilization and reliance on manual positioning, which reduces the degree of automation and practicality.
A high-quality INP processing equipment was designed, which uses a grinding device to process two INP wafers simultaneously. Combined with the linkage of cooling components and pre-installation components, it realizes centralized recycling of waste liquid and pre-installation of INP wafers, thereby improving the environmental friendliness and practicality of the equipment.
It improves the space utilization of the equipment, reduces manual operation, enhances processing efficiency and environmental friendliness, and saves working time.
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Figure CN115229589B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of INP processing, and more particularly, to a high-quality INP processing equipment. BACKGROUND
[0002] Indium phosphide (InP) crystal is an important semiconductor material. Compared with gallium arsenide (GaAs) material, it has the characteristics of high electron limit drift speed, good radiation resistance, high thermal conductivity, and high breakdown electric field. Therefore, InP material is the first choice of substrate material in the preparation of microwave, millimeter wave circuit and high-speed digital integrated circuit. An ultra-precision grinding and polishing equipment is used in the processing of indium phosphide wafer. The wafer is placed on the surface of the workbench, and then the polishing device is used to rotate and polish the surface. In addition, a corresponding water outlet mechanism is provided to clean and cool the wafer, so that the whole processing process is more accurate and perfect.
[0003] Most of the existing grinding and polishing equipment can only polish one crystal at a time, which reduces the practicability of the whole processing device, wastes the rotation space of the other half of the polishing device, and reduces the space utilization. Secondly, professional workers are often needed to position the wafer during placement. This positioning process requires the operator to be skilled, so the device is highly dependent on people, reducing the automation of the device itself and increasing the use threshold.
[0004] Therefore, the inventor has improved the existing structure and deficiencies based on years of experience in design, development, and actual production in the relevant industry, and provided a high-quality INP processing equipment, in order to achieve a more practical and highly automated purpose. SUMMARY
[0005] In order to overcome the above-mentioned defects of the prior art, the embodiments of the present application provide a high-quality INP processing equipment. The use of the grinding device for processing two INP wafers can further improve the practicability of the whole device, and improve the processing efficiency of the whole device. The setting of the exclusion assembly can effectively link the cooling assembly and the reserved assembly, so that it can cooperate with the reserved assembly to complete the preparation of the setting action, and cooperate with the cooling assembly to promote the centralized recovery process of the waste liquid, thereby further improving the environmental protection and practicability of the whole device. The use of the reserved assembly can arrange the setting action of the INP wafer in advance, so as to effectively save the working time of the whole device, thereby improving the processing efficiency, so as to solve the problems in the above background art.
[0006] To achieve the above object, the application provides the following technical scheme: a high-quality INP processing equipment, comprising a workbench, a grinding device movably mounted on the back of the workbench, a cooling assembly movably mounted on the left and right sides of the workbench, an exclusion assembly movably mounted on the front of the workbench, and a reservation assembly movably mounted on the top end of the exclusion assembly.
[0007] The side of the workbench is fixedly connected with a water inlet pipe, the top of the workbench is fixedly installed with a placement table, the top of the workbench is provided with a drainage groove, the front of the workbench is fixedly installed with a guide rail, the bottom of the workbench is fixedly installed with a receiving box, the side of the receiving box is provided with a drainage groove, the bottom of the receiving box and the inside of the workbench are both provided with an oblique square groove, the side of the workbench is fixedly installed with a wastewater collection box, and the bottom end of the wastewater collection box is fixedly connected with a guide-out pipe.
[0008] In a preferred embodiment, the shape of the drainage groove is matched with the shape of the placement table, the drainage groove and the drainage groove are connected with each other, and one end of the water inlet pipe is fixedly connected with a water conveying device.
[0009] In a preferred embodiment, the cooling assembly comprises a cooling pipe, a mounting ring fixedly installed on the surface of the cooling pipe, a straight rod fixedly installed on the side of the mounting ring, a fixed plate fixedly installed on the bottom end of the straight rod, a transmission plate movably sleeved in the inside of the fixed plate, a cleaning pad fixedly installed on the right end of the transmission plate, and a screw rod threadedly installed on the bottom end of the fixed plate.
[0010] In a preferred embodiment, the material of the cleaning pad is set as water-absorbing sponge material, the right end of the screw rod is rotatably installed in the inside of the workbench, the left end of the screw rod is fixedly sleeved with a driving device, the bottom end of the cooling pipe is fixedly connected with the side of the workbench and is connected with the water inlet pipe.
[0011] In a preferred embodiment, the exclusion assembly comprises a mounting pipe, a sliding groove formed on the surface of the mounting pipe, a T-shaped connecting shaft fixedly installed on the inside of the mounting pipe, a limiting column fixedly installed on the bottom end of the T-shaped connecting shaft, a straight plate fixedly installed on the bottom end of the limiting column, and a push plate integrally formed on the bottom end of the straight plate.
[0012] In a preferred embodiment, the left and right ends of the limiting column are slidably installed in the inside of the guide rail, the left and right sides of the push plate are attached to the left and right sides of the inner wall of the receiving box, the number of the sliding grooves is four, the number of the mounting pipes is two, and the size of the two mounting pipes is matched with the size of the placement table.
[0013] In a preferred implementation form, the reserving assembly comprises a gasket ring, a U-shaped pipe is fixedly installed on the side surface of the gasket ring, a connecting disc is integrally formed at one end of the U-shaped pipe, a spring is fixedly connected to the inner wall of the connecting disc, a threaded ring is fixedly installed on the side surface of the connecting disc, a double-threaded screw is threadedly installed in the threaded ring, a mounting box is movably sleeved on the surface of the U-shaped pipe, and a connecting column is fixedly installed on the side surface of the mounting box.
[0014] In a preferred implementation form, the size of the gasket ring is matched with the size of the sliding groove, one end of the connecting column is fixedly installed on the front surface of the mounting pipe, and a square groove is formed on the left surface of the mounting box, and the shape of the square groove is matched with the shape of the spring.
[0015] Technical effects and advantages of the present application:
[0016] 1、The present application drives the screw to rotate through the driving device after the processing of two INP wafers is completed, drives the cleaning pad to clean the surface of the INP, and the waste liquid enters the inside of the receiving box through the drainage groove and the drainage channel, and is pushed by the excluding assembly, so that the waste liquid flows into the inside of the waste water collecting box from the bottom end of the oblique square groove, so that the environmental protection effect of the overall device is further improved, the processing efficiency of the overall device is improved, and the practicality effect of the overall device is further improved.
[0017] 2、The present application can effectively link the cooling assembly and the reserving assembly through the setting of the excluding assembly, so that the reserving assembly can complete the preparation and installation action, and the cooling assembly can promote the centralized recovery process of the waste liquid, so that the environmental protection and practicality of the overall device are further improved.
[0018] 3、When the grinding device processes the INP in the installation table, the next group of INP is placed on the top surface of the gasket ring, and finally the installation is completed, the double-threaded screw is rotated to the initial position after installation, and then the last two INP are placed on the top surface of the gasket ring for the next processing preparation action, and the installation action of the INP wafer can be arranged in advance by the reserving assembly, so that the working time of the whole is effectively saved, and the processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is the overall structure diagram of the present application.
[0020] Figure 2 It is the three-dimensional assembly structure diagram of the present application.
[0021] Figure 3 It is the mounting box connecting structure diagram of the present application.
[0022] Figure 4 It is the schematic view of the installation box structure of the application.
[0023] Figure 5 It is the schematic view of the buffer assembly structure of the application.
[0024] Figure 6 It is the schematic view of the buckle assembly structure of the application.
[0025] Figure 7 It is the schematic view of the sealing assembly structure of the application.
[0026] The figure marks are: 1, workbench; 2, grinding device; 3, cooling assembly; 4, removal assembly; 5, reservation assembly; 11, water inlet pipe; 12, installation table; 13, drainage groove; 14, guide rail; 15, receiving box; 16, drainage groove; 17, oblique square groove; 18, waste water collection box; 31, cooling pipe; 32, installation ring; 33, fixed plate; 34, transmission plate; 35, cleaning pad; 36, screw rod; 41, installation pipe; 42, sliding groove; 43, T-shaped connecting shaft; 44, limiting column; 45, straight plate; 46, push plate; 51, gasket ring; 52, U-shaped pipe; 53, connecting disc; 54, spring; 55, threaded ring; 56, double thread screw rod; 57, installation box; 58, connecting column. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the application.
[0028] As shown in the accompanying drawings, Figures 1-7 a high-quality INP processing equipment, comprising a workbench 1, the back of the workbench 1 is movably installed with a grinding device 2, the left and right sides of the workbench 1 are movably installed with cooling assemblies 3, the front of the workbench 1 is movably installed with a removal assembly 4, and the top end of the removal assembly 4 is movably installed with a reservation assembly 5.
[0029] The side of table 1 is fixedly communicated with water inlet pipe 11, the top of table 1 is fixedly installed with installation table 12, the top of table 1 is provided with drain groove 13, the front of table 1 is fixedly installed with guide rail 14, the bottom of table 1 is fixedly installed with receiving box 15, the side of receiving box 15 is provided with drainage groove 16, the bottom of receiving box 15 and the inside of table 1 are both provided with oblique square groove 17, the side of table 1 is fixedly installed with waste water collecting box 18, the bottom end of waste water collecting box 18 is fixedly communicated with leading-out pipe.
[0030] As shown in the accompanying drawings Figure 3 and the accompanying drawings Figure 4 , the shape of drain groove 13 is matched with the shape of installation table 12, drain groove 13 and drainage groove 16 are communicated with each other, one end of water inlet pipe 11 is fixedly communicated with water conveying device, cooling assembly 3 includes cooling pipe 31, the surface of cooling pipe 31 is fixedly installed with mounting ring 32, the side of mounting ring 32 is fixedly installed with straight rod, the bottom end of straight rod is fixedly installed with fixed plate 33, the inside of fixed plate 33 is movably sleeved with transmission plate 34, the right end of transmission plate 34 is fixedly installed with cleaning pad 35, the bottom end of fixed plate 33 is threadedly installed with screw rod 36, the material of cleaning pad 35 is set as water-absorbing sponge material, the right end of screw rod 36 is rotatably installed in the inside of table 1, the left end of screw rod 36 is fixedly sleeved with driving device, the bottom end of cooling pipe 31 is fixedly communicated with the side of table 1 and communicated with water inlet pipe 11.
[0031] Specifically, by setting table 1 into the structure shown in the drawings, there are two installation tables 12, so that polishing device 2 can process two INP wafers at the same time when polishing, abandoning the working limitations of the previous table 1, in the process of processing, the upper end of cooling pipe 31 sprays liquid to condense and clean, after the processing of two INP wafers is completed, the screw rod 36 is driven to rotate by the driving device, and the cleaning pad 35 is driven to clean the surface of INP, the waste liquid enters the inside of receiving box 15 through drainage groove 16, and is pushed by excluding assembly 4 to flow into the inside of waste water collecting box 18 from the bottom end of oblique square groove 17, so the overall device environmental protection effect can be further improved, the polishing device 2 is used to process two INP wafers, so the overall device practicality effect can be further improved, and the processing efficiency of the overall equipment is improved.
[0032] As shown in the accompanying drawings Figure 5 to the accompanying drawings Figure 6The excluding assembly 4 comprises a mounting pipe 41, the surface of the mounting pipe 41 is provided with sliding grooves 42, the inner side of the mounting pipe 41 is fixedly installed with a T-shaped connecting shaft 43, the bottom end of the T-shaped connecting shaft 43 is fixedly installed with a limiting column 44, the bottom end of the limiting column 44 is fixedly installed with a straight plate 45, the bottom end of the straight plate 45 is integrally formed with a push plate 46, the left and right ends of the limiting column 44 are slidably installed in the inner side of the guide rail 14, the left and right sides of the push plate 46 are attached to the left and right sides of the inner wall of the receiving box 15, the number of the sliding grooves 42 is four, and the number of the mounting pipe 41 is two.
[0033] Specifically, when the INP is placed in the inner side of the mounting pipe 41 through the reservation assembly 5, after the processing of the two INP wafers is completed, and after the two INP wafers in the inner side of the mounting table 12 are cleaned by the cooling assembly 3, the two INP wafers in the inner side of the mounting table 12 are taken out, then the straight plate 45 is pushed, so that the limiting column 44 enters the bottom end of the guide rail 14, at this time, the mounting pipe 41 is aligned at the top end of the mounting table 12, and the two reserved INPs can be directly placed in the inner side of the mounting table 12 from the inner side of the mounting pipe 41 by operating the reservation assembly 5. In addition, in the process of pushing the straight plate 45, the push plate 46 pushes the waste liquid in the inner side of the receiving box 15, so that the waste liquid enters the inner side of the oblique square groove 17, thereby promoting the development of the waste liquid recycling process. When the mounting table 12 is properly arranged, the straight plate 45 is pulled out to the original position, the excluding assembly 4 can effectively link the cooling assembly 3 and the reservation assembly 5, so that the excluding assembly 4 can complete the preparation arrangement action in cooperation with the reservation assembly 5, and the cooling assembly 3 can promote the concentrated recycling process of the waste liquid, thereby further improving the environmental protection and practicality of the whole device.
[0034] As shown in the accompanying drawings Figure 7 The reservation assembly 5 comprises a grommet 51, the side surface of the grommet 51 is fixedly installed with a U-shaped pipe 52, one end of the U-shaped pipe 52 is integrally formed with a connecting disc 53, the inner wall of the connecting disc 53 is fixedly connected with a spring 54, the side surface of the connecting disc 53 is fixedly installed with a threaded ring 55, the inner side of the threaded ring 55 is threadedly installed with a double-threaded screw rod 56, the surface of the U-shaped pipe 52 is movably sleeved with a mounting box 57, the side surface of the mounting box 57 is fixedly installed with a connecting column 58, the number of the reservation assembly 5 is two, the size of the grommet 51 is matched with the size of the sliding groove 42, one end of the connecting column 58 is fixedly installed on the front surface of the mounting pipe 41, and the left side surface of the mounting box 57 is provided with a square groove, the shape of the square groove is matched with the shape of the spring 54.
[0035] Specifically, when the grinding device 2 processes the INP inside the installation table 12, the next group of INP is placed on the top surface of the gasket ring 51, and is installed inside the installation pipe 41. When the installation pipe 41 is aligned with the installation table 12, the double-threaded screw rod 56 drives the two threaded rings 55 to move outward at the same time. During the movement, the U-shaped pipe 52 drives the two gasket rings 51 to move outward at the same time, and slides out from the inside of the sliding groove 42. At this time, the INP falls along the inner wall of the installation pipe 41 to the surface of the installation table 12, and finally completes the installation. After installation, the double-threaded screw rod 56 is rotated to the initial position, and then the last two INP are placed on the top surface of the gasket ring 51 for the next processing preparation action. The reserved assembly 5 can arrange the installation action of the INP wafer in advance, so that the overall working time can be effectively saved, and the processing efficiency can be improved.
[0036] The working principle of the present application is as follows: after the processing of two INP wafers is completed, the screw rod 36 is driven to rotate by the driving device, and the cleaning pad 35 is driven to clean the surface of the INP. The waste liquid flows into the receiving box 15 through the drainage groove 16, and is pushed by the exclusion assembly 4 to flow into the waste water collecting box 18 from the bottom end of the oblique groove 17. Therefore, the environmental protection effect of the overall device can be further improved. The grinding device 2 can further improve the practicability of the overall device, and improve the processing efficiency of the overall equipment.
[0037] The exclusion assembly 4 can effectively link the cooling assembly 3 and the reserved assembly 5, so that it can cooperate with the reserved assembly 5 to complete the preparation installation action, and cooperate with the cooling assembly 3 to promote the centralized recovery process of the waste liquid. Therefore, the environmental protection and practicability of the overall device are further improved.
[0038] When the grinding device 2 processes the INP inside the installation table 12, the next group of INP is placed on the top surface of the gasket ring 51, and finally completes the installation. After installation, the double-threaded screw rod 56 is rotated to the initial position, and then the last two INP are placed on the top surface of the gasket ring 51 for the next processing preparation action. The reserved assembly 5 can arrange the installation action of the INP wafer in advance, so that the overall working time can be effectively saved, and the processing efficiency can be improved.
[0039] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.
[0040] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.
[0041] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A high-quality INP processing device, comprising a worktable (1), characterized in that, A grinding device (2) is movably installed on the back of the workbench (1), and cooling components (3) are movably installed on both the left and right sides of the workbench (1). An exhaust component (4) is movably installed on the front of the workbench (1), and a reserved component (5) is movably installed on the top of the exhaust component (4). A water inlet pipe (11) is fixedly connected to the side of the workbench (1), a mounting platform (12) is fixedly installed on the top surface of the workbench (1), a drainage groove (13) is opened on the top surface of the workbench (1), a guide rail (14) is fixedly installed on the front of the workbench (1), a receiving box (15) is fixedly installed at the bottom of the workbench (1), a drainage groove (16) is opened on the side of the receiving box (15), a slanted groove (17) is opened on the bottom surface of the receiving box (15) and the interior of the workbench (1), a wastewater collection box (18) is fixedly installed on the side of the workbench (1), and an outlet pipe is fixedly connected to the bottom end of the wastewater collection box (18). The cooling assembly (3) includes a cooling pipe (31), a mounting ring (32) is fixedly installed on the surface of the cooling pipe (31), a straight rod is fixedly installed on the side of the mounting ring (32), a fixing plate (33) is fixedly installed at the bottom end of the straight rod, a transmission plate (34) is movably sleeved inside the fixing plate (33), a cleaning pad (35) is fixedly installed at the right end of the transmission plate (34), and a screw (36) is threadedly installed at the bottom end of the fixing plate (33). The exclusion component (4) includes an installation tube (41), the surface of which is provided with a sliding groove (42), a T-shaped connecting shaft (43) is fixedly installed on the inner side of the installation tube (41), a limiting post (44) is fixedly installed at the bottom end of the T-shaped connecting shaft (43), a straight plate (45) is fixedly installed at the bottom end of the limiting post (44), and a push plate (46) is integrally formed at the bottom end of the straight plate (45). The reserved component (5) includes a washer (51), a U-shaped tube (52) is fixedly installed on the side of the washer (51), a connecting plate (53) is integrally formed at one end of the U-shaped tube (52), a spring (54) is fixedly connected to the inner wall of the connecting plate (53), a threaded ring (55) is fixedly installed on the side of the connecting plate (53), a double-threaded screw (56) is installed in the internal thread of the threaded ring (55), an installation box (57) is movably sleeved on the surface of the U-shaped tube (52), and a connecting post (58) is fixedly installed on the side of the installation box (57). The number of the reserved components (5) is two. The left and right ends of the limiting post (44) are slidably installed inside the guide rail (14), the left and right sides of the push plate (46) are attached to the left and right sides of the inner wall of the receiving box (15), the number of the sliding groove (42) is four, the number of the mounting tube (41) is two, and the size of the two mounting tubes (41) is adapted to the size of the mounting platform (12). The size of the washer (51) is adapted to the size of the sliding groove (42). One end of the connecting post (58) is fixedly installed on the front of the mounting tube (41). A square groove is provided on the left side surface of the mounting box (57). The shape of the square groove is adapted to the shape of the spring (54).
2. The high-quality INP processing equipment according to claim 1, characterized in that: The shape of the drainage trough (13) is adapted to the shape of the mounting platform (12). The drainage trough (13) and the diversion trough (16) are interconnected. One end of the water inlet pipe (11) is fixedly connected to a water conveying device.
3. The high-quality INP processing equipment according to claim 1, characterized in that: The cleaning pad (35) is made of absorbent sponge material. The right end of the screw (36) is rotatably installed inside the workbench (1). The left end of the screw (36) is fixedly sleeved with a drive device. The bottom end of the cooling pipe (31) is fixedly connected to the side of the workbench (1) and is connected to the water inlet pipe (11).
Citation Information
Patent Citations
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