Mobile phone motherboard with good heat dissipation effect based on graphene conduction

Abstract

The present invention relates to the technical field of mobile phone motherboards, and in particular, to a mobile phone motherboard with good heat dissipation effect based on graphene conduction. It includes a frame, a screen assembly, a motherboard component and a graphene layer arranged in sequence, and positioning components are arranged on both sides of the motherboard component, the positioning component includes a screw rod rotatably arranged on the motherboard component, and screw nuts are threadedly connected to the two ends close to the screw rod, and a positioning column is installed at one end of the screw nut. A contact lifting component is arranged on the motherboard component, and the contact lifting component includes a compression block, and a connecting rod is connected to the bottom of the compression block, and a spring lifting component is arranged between the connecting rod and the compression block. The present invention locks the frame by the positioning column to fix the motherboard component, and squeezes the compression block movement by the movement of the positioning column, forming a reverse force on the positioning column, pressing the positioning column, and the movement of the compression block causes the spring lifting component to store elastic compression force, and the elasticity of the spring lifting component can quickly lift the motherboard component, thereby improving the maintenance efficiency of the maintenance personnel.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile phone mainboards, and in particular to a mobile phone mainboard with good heat dissipation effect based on graphene conduction. Background Art

[0002] Mobile phones are composed of screen assemblies, motherboards, and batteries. However, with the rapid development of current technology and program systems, the consumption and load of mobile phones have increased during use, causing the motherboard of current mobile phones to have a higher temperature when playing games or processing complex software or programs. Therefore, a graphene heat dissipation layer will be installed on the motherboard to dissipate heat for the motherboard. However, the current motherboard still has certain problems when in use, as follows:

[0003] When a mobile phone has an abnormal fault during use, maintenance personnel usually open the back cover of the mobile phone to disassemble the main board, but the main board is respectively arranged at the corner ends (the corner ends refer to the corner positions of the main board) by multiple bolts, which makes it more cumbersome for personnel to dismantle the main board, affecting the efficiency of maintenance personnel in repairing the main board or mobile phone;

[0004] Among them, after the bolts on the motherboard are removed, because the motherboard is installed in the screen assembly and the frame for a long time, and the surface of the motherboard is mostly at the same level as the frame, after the bolts are removed, the motherboard also needs to be moved with a thinner paddle or directly swung downward by the mobile phone motherboard before the motherboard can be removed. These two methods are not only inconvenient, but also make the motherboard easy to be damaged;

[0005] In addition, because the motherboard and the screen assembly are in contact and connected, when some unskilled maintenance personnel install the motherboard after maintenance, due to improper operation, the force or depth of the bolts penetrating the motherboard and squeezing the screen assembly is too great. The pressure from the bolts contacting the screen assembly will crush the screen assembly, causing damage to the phone. Summary of the invention

[0006] The purpose of the present invention is to provide a mobile phone motherboard with good heat dissipation effect based on graphene conduction, so as to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention aims to provide a mobile phone motherboard with good heat dissipation effect based on graphene conduction, comprising a frame, a screen assembly, a motherboard component and a graphene layer arranged in sequence from bottom to top, positioning components are arranged on both sides of the motherboard component, the positioning component comprises a screw rod rotatably arranged on the motherboard component, screw nuts are threadedly connected near both ends of the screw rod, one end of the screw rod nut is installed with a positioning column for penetrating the motherboard component and contacting the frame for compression, a contact lifting component is arranged on the motherboard component, the contact lifting component comprises a compression block slidably arranged on the motherboard component, the compression block is located below the positioning column, the bottom of the compression block is connected to a connecting rod for contacting the screen assembly, when the positioning column moves and compresses the compression block to move downward, a reverse compression force is formed to compress the positioning column, and the positioning column moves and compresses the connecting rod to contact the screen assembly to position the motherboard component, a spring-lifting component is arranged between the connecting rod and the compression block, and the spring-lifting component is arranged on the motherboard component, and when the compression block moves downward, the spring-lifting component also stores elastic compression force.

[0008] As a further improvement of the technical solution, a groove for installing a screw rod is provided on the main board component, the screw rod and the groove are connected by a connecting block, and the screw rod is rotatably arranged in the connecting block.

[0009] As a further improvement of the technical solution, a roller handle with an anti-slip layer embedded on the surface is installed on the screw rod. The roller handle and the anti-slip layer are an integrated structure. The roller handle is provided with multiple connection ports in different directions, and a locking rod is connected to one of the connection ports.

[0010] As a further improvement of the technical solution, sliding blocks are slidably provided on both sides of the mainboard component, and the sliding blocks are slidably connected to the inner wall of the frame.

[0011] As a further improvement of the technical solution, a protrusion is provided on the inner side of the frame, the positioning column is a tubular hollow structure, and the positioning column is slidably connected to the protrusion.

[0012] As a further improvement of the technical solution, a sliding opening slidably connected to the compression block is provided on the main board component, sliding arms are installed on both sides of the compression block, and sliding cavities slidably connected to the sliding arms are symmetrically provided on the inner wall of the sliding opening.

[0013] As a further improvement of the technical solution, a positioning shaft is also installed on the screw nut, and a through hole slidably connected to the positioning shaft is opened on the compression block, and the length of the positioning shaft is smaller than the positioning column.

[0014] As a further improvement of the technical solution, a rubber block is installed on the bottom surface of the connecting rod.

[0015] As a further improvement of the technical solution, the lifting assembly includes a mounting plate installed in the sliding opening, and the mounting plate and the compression block are connected by a lifting spring, and the connecting rod passes through the surface of the mounting plate and extends downward.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. In the mobile phone motherboard with good heat dissipation effect based on graphene conduction, the two positioning columns are driven to move relative to each other by the screw nut, so that the positioning columns penetrate the motherboard component outward and contact the inner wall of the frame, which not only quickly fixes the motherboard component on the frame, but also enables motherboard components with different sizes to be fixed on the frame, thereby increasing the use scenarios of the motherboard component.

[0018] 2. In the mobile phone motherboard with good heat dissipation effect based on graphene conduction, through the transmission displacement of the screw nut, the positioning column will compress the compression block downward in the process of penetrating the mainboard component, so that the compression block compresses the connecting rod downward to make the spring-lift component store elastic compression force, and the connecting rod contacts the surface of the screen assembly for compression, so that the mainboard component is laterally fixed. The mainboard component is installed, and the positioning column also forms a bottom reverse compression, which improves the stability of the mainboard component, and stores elastic force through the contact of the connecting rod and the spring-lift component, avoiding direct pressure on the connecting rod, solving the problem of damage to the screen assembly caused by direct connection by bolts by maintenance personnel, and making the connecting rod fit on the screen assembly, which greatly improves the convenience of the current mainboard component during installation and reduces the damage to the mainboard component during installation.

[0019] 3. In the mobile phone motherboard with good heat dissipation effect based on graphene conduction, when the motherboard component needs to be removed for inspection, the positioning column is driven to move inward by the reverse rotation of the screw rod, and the motherboard component is no longer locked on the frame. When the positioning column moves out of the compression block, the compression block bounces upward under the elastic force of the spring-lifting component. At this time, the motherboard component bounces up, and the motherboard components on the frame and the screen assembly are quickly detached, which speeds up the efficiency of personnel repairing the screen assembly or the motherboard component. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a disassembled diagram of the overall structure of the present invention;

[0022] Figure 3 It is a cross-sectional view of the main board component structure of the present invention;

[0023] Figure 4 For the present invention Figure 3 A schematic diagram of the structure at A;

[0024] Figure 5 For the present invention Figure 3 Schematic diagram of the structure at B;

[0025] Figure 6 For the present invention Figure 3 Schematic diagram of the structure at C;

[0026] Figure 7 It is a schematic diagram of the structure of the contact lifting assembly of the present invention.

[0027] The meaning of each number in the figure is:

[0028] 1. Frame;

[0029] 2. Screen assembly;

[0030] 3. Main board component; 31. Groove; 32. Slider;

[0031] 4. Graphene layer;

[0032] 5. Positioning assembly; 51. Screw rod; 52. Connecting block; 53. Roller handle; 531. Locking rod; 54. Screw nut; 541. Positioning column; 542. Positioning shaft; 55. Contact lifting assembly; 551. Compression block; 552. Sliding arm; 553. Through port; 554. Connecting rod; 555. Rubber block; 556. Mounting plate; 557. Lifting spring. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention. Example

[0035] See also Figure 1-Figure 7As shown, the present embodiment provides a mobile phone motherboard with good heat dissipation effect based on graphene conduction, including a frame 1, a screen assembly 2, a motherboard component 3 and a graphene layer 4 arranged in sequence from bottom to top. The arrangement of the graphene layer 4 can effectively solve the problem that the current motherboard component 3 is overheated and affects the use. Positioning components 5 are arranged on both sides of the motherboard component 3. The positioning component 5 includes a screw rod 51 rotatably arranged on the motherboard component 3, and screw nuts 54 are threadedly connected at both ends close to the screw rod 51. A positioning column 541 for penetrating the motherboard component 3 and contacting the frame 1 for compression is installed at one end of the screw nut 54. A contact lifting component 55 is arranged on the motherboard component 3. The contact lifting component 55 includes a compression block 551 slidably arranged on the motherboard component 3, and the compression block 551 is located below the positioning column 541. The bottom of the compression block 551 is connected to a connecting rod 554 for contacting the screen assembly 2. When the positioning column 541 moves to compress the compression block 551, a reverse compression is formed when the compression block 551 moves downward. The force presses the positioning column 541, and the positioning column 541 moves and compresses the connecting rod 554 to contact the screen assembly 2 to position the main board component 3. A spring-lifting component is arranged between the connecting rod 554 and the compression block 551, and the spring-lifting component is arranged on the main board component 3. When the compression block 551 moves downward, the spring-lifting component also stores elastic compression force. As mentioned above, the present invention abandons the bolts arranged at the corner ends of the main board component 3, and external threads are relatively provided on the upper side surfaces near the two ends of the screw rod 51. The external threads are threadedly connected with the positioning column 541. When the main board component 3 is installed on the frame 1 and the screen assembly 2, the main board component 3 is placed on the screen assembly 2, and the screw rod 51 is rotated. The screw nut 54 drives the two positioning columns 541 to move relative to each other, so that the positioning column 541 penetrates the main board component 3 outward and contacts the inner wall of the frame 1. At this time, not only the main board component 3 is quickly fixed on the frame 1, but also the main board components 3 with different sizes can be fixed on the frame 1, thereby increasing the use scenarios of the main board component 3.

[0036] As the screw nut 54 is driven and displaced, the positioning column 541 compresses the compression block 551 downwards in the process of penetrating the main board component 3, so that the compression block 551 compresses the connecting rod 554 downwards and makes the spring-lifting component store elastic compression force, and the connecting rod 554 contacts the surface of the screen assembly 2 for compression, so that the main board component 3 is fixed laterally. At this time, the main board component 3 is installed. At the same time, the positioning column 541 also achieves reverse compression at the bottom to improve the stability of the main board component 3, and the contact of the connecting rod 554 and the elastic force stored by the spring-lifting component avoid direct pressure on the connecting rod 554, solve the problem of damage to the screen assembly 2 caused by the maintenance personnel when using bolts for direct connection, and make the connecting rod 554 fit on the screen assembly 2, which greatly improves the convenience of the current main board component 3 during installation and reduces the risk of damage.

[0037] When the mainboard component 3 needs to be removed for inspection, the positioning column 541 is driven to move inward by the reverse rotation of the screw rod 51, and the mainboard component 3 is no longer locked on the frame 1. When the positioning column 541 moves away from the compression block 551, the compression block 551 bounces upward under the elastic force of the spring-lifting assembly, and the mainboard component 3 bounces up accordingly. This allows the mainboard component 3 to be quickly separated from the frame 1 and the screen assembly 2, thereby speeding up the efficiency of personnel in inspecting the screen assembly 2 or the mainboard component 3.

[0038] Among them, a groove 31 for installing a screw rod 51 is opened on the main board component 3, and the screw rod 51 and the groove 31 are connected by a connecting block 52. The screw rod 51 is rotatably set in the connecting block 52, and the screw nut 54 is slidably connected to the inner wall of the groove 31. Then, a person can rotate the screw rod 51 to drive the positioning column 541 to move laterally to position the main board component 3.

[0039] In order to make the screw rod 51 more convenient to rotate, a roller handle 53 with an anti-slip layer embedded on the surface is installed on the screw rod 51. The roller handle 53 and the anti-slip layer are an integrated structure. A person can quickly rotate the screw rod 51 by touching the anti-slip layer of the roller handle 53. A plurality of connecting ports in different directions are provided on the roller handle 53, and a locking rod 531 is connected to one of the connecting ports. A card slot connected to the locking rod 531 is provided on the inner wall of the groove 31. When the screw rod 51 no longer rotates and is locked to the card slot by the locking rod 531 passing through the connecting port, the roller handle 53 will be locked to position the screw rod 51 to prevent it from accidentally rotating during use and affecting the positioning of the main board component 3.

[0040] Since the mainboard component 3 needs to be respectively provided with cables to connect with the screen assembly 2 and the battery, in order to prevent the mainboard component 3 from bouncing up beyond the length of the cables, causing damage to the cables, the screen assembly 2 or the mainboard component 3, sliders 32 are slidably provided on both sides of the mainboard component 3. The sliders 32 are slidably connected to the inner wall of the frame 1 and can be pulled outward along the mainboard component 3 through the slider 32 with the cable position and stuck on the inner wall of the frame 1. Since the slider 32 is locked on only one side, only one side of the mainboard component 3 will be bounced up when the pop-up assembly pops up, thereby protecting the side with the cable connection.

[0041] Among them, a protrusion is provided on the inner side of the frame 1, and the positioning column 541 is a tubular hollow structure. The positioning column 541 is slidably connected to the protrusion. The inner diameter of the protrusion is the same as the hole core of the positioning column 541, so that when the positioning column 541 moves relatively, it can contact the protrusion and slide connected, thereby strengthening the connection locking of the positioning column 541 and improving the stability of the mainboard component 3.

[0042] Secondly, a sliding opening is provided on the main board component 3 and is slidably connected to the compression block 551. Sliding arms 552 are installed on both sides of the compression block 551. The inner wall of the sliding opening is symmetrically provided with sliding cavities which are slidably connected to the sliding arms 552. Through the sliding restriction of the sliding arms 552 and the sliding cavities, the compression block 551 can slide in the sliding opening.

[0043] In order to prevent the connecting rod 554 from contacting the screen assembly 2 and causing squeezing damage, a rubber block 555 is installed on the bottom surface of the connecting rod 554. The rubber block 555 is made of rubber material, so that the rubber block 555 contacts the screen assembly 2, thereby preventing the connecting rod 554 from crushing the screen assembly 2.

[0044] In order to make a specific explanation of the above-mentioned pop-up lifting assembly to facilitate the understanding and implementation of the professional personnel, the lifting assembly includes a mounting plate 556 installed in the sliding opening, and the mounting plate 556 and the compression block 551 are connected by a lifting spring 557, and the connecting rod 554 passes through the surface of the mounting plate 556 and extends downward. Under the fixed installation of the mounting plate 556, the lifting spring 557 will be compressed by the movement of the compression block 551 to store the elastic compression force. Therefore, when the positioning column 541 leaves the compression block 551, the elastic compression force stored in the lifting spring 557 is released and rises up, so that the mainboard component 3 pops up, thereby speeding up the efficiency of personnel in repairing the screen assembly or the mainboard component. Example

[0045] See also Figure 5 As shown, a positioning shaft 542 is also installed on the screw nut 54, and a through hole 553 is opened on the compression block 551 for sliding connection with the positioning shaft 542. The length of the positioning shaft 542 is smaller than the positioning column 541. When the screw nut 54 moves to make the positioning column 541 compress the compression block 551, and the screw nut 54 drives the positioning shaft 542 to move, because the length of the positioning shaft 542 is smaller than the positioning column 541, after the compression block 551 is compressed, the positioning shaft 542 will pass through one side of the groove 31 and enter the through hole 553, so that the positioning shaft 542 and the compression block 551 are connected to form a locking structure, which improves the stability of the positioning column 541 and the compression block 551, and the installation stability of the main board component 3 is improved from the side.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A mobile phone motherboard with good heat dissipation effect based on graphene conduction, comprising a frame (1), a screen assembly (2), a motherboard component (3) and a graphene layer (4) arranged in sequence from bottom to top, characterized in that: Positioning assemblies (5) are provided on both sides of the main board component (3), and the positioning assembly (5) comprises a screw rod (51) rotatably arranged on the main board component (3), screw rod nuts (54) are threadedly connected to the two ends of the screw rod (51), and one end of the screw rod nut (54) is installed with a positioning column (541) for penetrating the main board component (3) and contacting the frame (1) for compression, and the main board component (3) is provided with a contact lifting assembly (55), and the contact lifting assembly (55) comprises a compression block (551) slidably arranged on the main board component (3), and the compression block (551) is located Below the positioning column (541), a connecting rod (554) for contacting the screen assembly (2) is connected to the bottom of the compression block (551); when the positioning column (541) moves to compress the compression block (551) downward, a reverse compression force is formed to press the positioning column (541); and the positioning column (541) moves and compresses the connecting rod (554) to contact the screen assembly (2) to position the mainboard component (3); a spring-lifting component is arranged between the connecting rod (554) and the compression block (551); the spring-lifting component is arranged on the mainboard component (3); when the compression block (551) moves downward, the spring-lifting component also stores elastic compression force; The main plate component (3) is provided with a sliding opening slidably connected to the compression block (551), sliding arms (552) are installed on both sides of the compression block (551), and the inner wall of the sliding opening is symmetrically provided with sliding cavities slidably connected to the sliding arms (552); The spring-lift assembly comprises a mounting plate (556) mounted in the sliding opening, and the mounting plate (556) and the compression block (551) are connected via a lifting spring (557), and the connecting rod (554) penetrates the surface of the mounting plate (556) and extends downward.

2. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: The main plate component (3) is provided with a groove (31) for mounting a screw rod (51); the screw rod (51) and the groove (31) are connected via a connecting block (52); and the screw rod (51) is rotatably arranged in the connecting block (52).

3. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: A rolling handle (53) with an anti-slip layer embedded on its surface is mounted on the screw rod (51); the rolling handle (53) and the anti-slip layer are an integrated structure; the rolling handle (53) is provided with a plurality of connection ports in different directions, and a locking rod (531) is connected to one of the connection ports.

4. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: Slide blocks (32) are slidably provided on both sides of the mainboard component (3), and the slide blocks (32) are slidably connected to the inner wall of the frame (1).

5. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: A protrusion is provided on the inner side of the frame (1); the positioning column (541) is a tubular hollow structure; the positioning column (541) is slidably connected to the protrusion.

6. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: A positioning shaft (542) is also mounted on the screw nut (54), and a through opening (553) is provided on the compression block (551) for sliding connection with the positioning shaft (542). The length of the positioning shaft (542) is shorter than the positioning column (541).

7. The mobile phone motherboard with good heat dissipation effect based on graphene conduction according to claim 1, characterized in that: A rubber block (555) is installed on the bottom surface of the connecting rod (554).

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