Multilayer electronic assembly and method of manufacturing the same

Abstract

The present disclosure provides a multilayer electronic component and a method of manufacturing the same. The method of manufacturing the multilayer electronic component includes preparing a first ceramic green sheet on which a first internal electrode pattern spaced apart from each other is formed and a second ceramic green sheet on which a second internal electrode pattern spaced apart from each other is formed; forming a ceramic green sheet stack by stacking the first ceramic green sheet and the second ceramic green sheet so that the first internal electrode pattern and the second internal electrode pattern are cross-stacked with each other; obtaining a multilayer body having a side surface by cutting the ceramic green sheet stack, ends of the first internal electrode pattern and the second internal electrode pattern being exposed to the side surface; adhering an adhesive layer to the side surface of the multilayer body; and peeling the adhesive layer from the side surface.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2021-0055037, filed on April 28, 2021, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component and a method for manufacturing the same. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors that are mounted on the printed circuit board of any electronic product in various electronic products (such as image display devices such as liquid crystal displays (LCDs) or plasma display panels (PDPs), computers, smartphones, and mobile phones) and charged or discharged from therein.

[0004] MLCCs can be used as components in any electronic device in a wide variety of electronic devices because they are small, have high capacitance, and can be easily installed in electronic devices. As various electronic devices, such as computers and mobile devices, each have smaller dimensions and higher output, the demand for MLCCs with smaller size and higher capacitance is constantly increasing.

[0005] In recent years, with the increasing interest in electronic components for vehicles in related fields, there is also a demand for MLCCs with high reliability and high strength characteristics for use in vehicles or infotainment systems.

[0006] In order to achieve smaller size and higher capacitance, MLCCs have been required to have maximized effective electrode area (i.e., increase the effective volume fraction required to achieve capacitance within them).

[0007] To achieve the MLCC with smaller size and higher capacitance as described above, the following method for manufacturing MLCCs has been used: the inner electrode of the MLCC is exposed from the body of the MLCC in the width direction, and in this way the inner electrode is designed to be edgeless and thus have the maximum area in the width direction; after the body of the MLCC is formed in this way, in a process before sintering the body, the side edges are individually attached to the surface of the inner electrode of the MLCC exposed in the width direction, thereby finally completing the MLCC.

[0008] Using the method described above, which involves attaching the side edges separately to the body of the MLCC, the MLCC can have a higher capacitance per unit volume. However, problems such as defects such as separation of the side edges from the body of the MLCC, short-circuit faults, and reduced moisture resistance may occur. Summary of the Invention

[0009] One aspect of this disclosure provides a multilayer electronic component and a method for manufacturing the same, which addresses issues such as defects such as the separation of side edges from the main body of the multilayer electronic component, short-circuit faults, and low moisture resistance.

[0010] However, this disclosure is not limited to the above description and can be more readily understood from the description of exemplary embodiments in this disclosure.

[0011] According to one aspect of this disclosure, a method for manufacturing a multilayer electronic component may include: preparing a first ceramic green sheet and a second ceramic green sheet, forming a plurality of first internal electrode patterns spaced apart from each other on the first ceramic green sheet, and forming a plurality of second internal electrode patterns spaced apart from each other on the second ceramic green sheet; forming a ceramic green sheet stack by stacking the first ceramic green sheet and the second ceramic green sheet together such that the first internal electrode patterns and the second internal electrode patterns are interleaved; obtaining a multilayer body by cutting the ceramic green sheet stack, the multilayer body having side surfaces, the end edges of the first internal electrode patterns and the second internal electrode patterns being exposed to the side surfaces in the width direction of the multilayer body; adhering an adhesive layer to the side surfaces of the multilayer body; and peeling the adhesive layer from the side surfaces.

[0012] According to another aspect of this disclosure, a multilayer electronic component may include: a body comprising a plurality of dielectric layers, the body including a first surface and a second surface opposite to each other in a first direction of the body, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction of the body, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction of the body; side edges disposed on the first surface and the second surface, respectively; external electrodes disposed on the third surface and the fourth surface, respectively; and a plurality of internal electrodes disposed in the body, respectively connected to the external electrodes disposed on the third surface and the fourth surface, and respectively connected to the side edges disposed on the first surface and the second surface, wherein Np / Ne is 0.15 or less, wherein Np is the number of pores included in the internal electrodes within 3 μm of one of the side edges in a direction toward the interior of the body, and Ne is the number of internal electrodes.

[0013] According to another aspect of this disclosure, a multilayer electronic component may include: a body comprising a plurality of dielectric layers, the body including a first surface and a second surface opposite to each other in a first direction of the body, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction of the body, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction of the body; side edges respectively disposed on the first surface and the second surface; external electrodes respectively disposed on the third surface and the fourth surface; and a plurality of internal electrodes disposed in the body, respectively connected to the external electrodes disposed on the third surface and the fourth surface, and respectively connected to the side edges disposed on the first surface and the second surface. Np / Ne is 0.15 or less, wherein, in a cross-section of the multilayer electronic component cut along the plane of the first direction-the third direction, Np is the number of pores of the internal electrodes at the interface between the internal electrodes and one of the side edges, and Ne is the number of internal electrodes. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1 A perspective view of a multilayer electronic assembly according to an exemplary embodiment is schematically shown;

[0016] Figure 2 It is shown Figure 1 A three-dimensional view of a multilayer electronic component excluding the external electrodes;

[0017] Figure 3 It is shown Figure 1 A three-dimensional view of a multilayer electronic component excluding the outer electrodes and side edges;

[0018] Figure 4 It is along Figure 1 A cross-sectional view taken from line I-I';

[0019] Figure 5 It is along Figure 1 A cross-sectional view taken from line II-II;

[0020] Figures 6 to 18 These are schematic cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another exemplary embodiment of the present disclosure.

[0021] Figure 19The image is shown as being obtained by cutting the example of the invention along the width-thickness direction from the center of its length direction, and then scanning the boundary portion between the body and side edges of the example of the invention at the center of its thickness direction using a scanning electron microscope (SEM) to make the 20 inner electrodes visible; and

[0022] Figure 20 The image is shown as obtained by cutting the comparison example from the center along the width-thickness direction in the length direction, and then scanning the boundary portion between the body and the side edges of the comparison example at the center in the thickness direction of the comparison example using a scanning electron microscope (SEM) to make the 20 inner electrodes visible. Detailed Implementation

[0023] In the following, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0024] In the accompanying drawings, the W direction may refer to the first direction or the width direction, the L direction may refer to the second direction or the length direction, and the T direction may refer to the third direction or the thickness direction.

[0025] Method for manufacturing multilayer electronic components

[0026] Figures 6 to 18 These are cross-sectional and perspective views schematically illustrating a method for manufacturing a multilayer electronic component according to exemplary embodiments of the present disclosure.

[0027] In the following text, refer to Figures 6 to 18 The present disclosure describes in detail a method for manufacturing a multilayer electronic component according to exemplary embodiments.

[0028] A method for manufacturing a multilayer electronic component according to exemplary embodiments of the present disclosure may include: preparing a first ceramic green sheet and a second ceramic green sheet, forming a plurality of first internal electrode patterns on the first ceramic green sheet at predetermined distances from each other, and forming a plurality of second internal electrode patterns on the second ceramic green sheet at predetermined distances from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheet and the second ceramic green sheet such that the first internal electrode patterns and the second internal electrode patterns are interleaved; obtaining a multilayer body by cutting the ceramic green sheet stack, the multilayer body having a side surface, each of the end edges of the first internal electrode patterns and the second internal electrode patterns being exposed in the width direction to the side surface; bonding an adhesive layer to the side surface of the multilayer body; and peeling the adhesive layer from the side surface of the multilayer body to remove foreign matter from the side surface.

[0029] like Figure 6 As shown, it can be found in ceramic green sheet 211 (see Figure 7Multiple first inner electrode patterns 221 are formed on the electrode at predetermined distances from each other. Each of the multiple first inner electrode patterns 221 may have a strip shape and may be formed parallel to each other.

[0030] Ceramic green sheet 211 can be formed using ceramic paste, which contains ceramic powder, organic solvent and organic binder.

[0031] The ceramic powder (a material with a high dielectric constant) can be a barium titanate (BaTiO3) based material, a lead-based perovskite composite material, a strontium titanate (SrTiO3) based material, etc., and the ceramic powder can be barium titanate (BaTiO3) powder, but is not limited to these. During sintering, the ceramic green sheet 211 can become the dielectric layer 111 included in the body 110.

[0032] The first internal electrode pattern 221 can be formed by an internal electrode paste containing a conductive metal. The conductive metal is not specifically limited and can be at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0033] There are no particular limitations on the method of forming the first internal electrode pattern 221 on the ceramic green sheet 211, and it can be a printing method, such as screen printing or gravure printing.

[0034] Additionally, a plurality of second inner electrode patterns 222 may be formed on another ceramic green sheet 211 at predetermined distances from each other. The plurality of second inner electrode patterns 222 may each have a strip shape and may be formed parallel to each other.

[0035] In the following text, the ceramic green sheet on which the first inner electrode pattern 221 is formed may be referred to as the first ceramic green sheet 211a, and the ceramic green sheet on which the second inner electrode pattern 222 is formed may be referred to as the second ceramic green sheet 211b.

[0036] Next, as Figure 7 As shown, the first ceramic green sheet 211a and the second ceramic green sheet 211b can be stacked alternately on each other so that the first inner electrode pattern 221 and the second inner electrode pattern 222 are stacked crosswise on each other.

[0037] The first inner electrode pattern 221 can become the first inner electrode 121 after sintering, and the second inner electrode pattern 222 can become the second inner electrode 122 after sintering.

[0038] Here, the first and second ceramic green sheets can each have a thickness td' of 0.6 μm or less. Therefore, after sintering, an ultra-miniature and high-capacitance multilayer electronic component with a dielectric layer of 0.4 μm or less can be realized.

[0039] Furthermore, the first and second inner electrode patterns can each have a thickness of 0.5 μm or less. Therefore, after sintering, an ultra-miniature and high-capacitance multilayer electronic component with an inner electrode thickness of 0.4 μm or less can be realized.

[0040] Figure 8 This is a cross-sectional view showing a ceramic green sheet stack 220 in which a first ceramic green sheet and a second ceramic green sheet are stacked on top of each other according to an exemplary embodiment of the present disclosure. Figure 9 This is a perspective view of a ceramic green sheet stack 220, which shows a first ceramic green sheet and a second ceramic green sheet stacked on top of each other according to an exemplary embodiment of the present disclosure.

[0041] Reference Figure 8 and Figure 9 A first ceramic green sheet 211a, on which a plurality of first internal electrode patterns 221 are printed in parallel arrangement, and a second ceramic green sheet 211b, on which a plurality of second internal electrode patterns 222 are printed in parallel arrangement, can be stacked alternately.

[0042] More specifically, the first ceramic green sheet 211a and the second ceramic green sheet 211b can be stacked on top of each other in such a way that the center of the strip first inner electrode pattern 221 printed on the first ceramic green sheet 211a and the gap between each strip second inner electrode pattern 222 printed on the second ceramic green sheet 211b overlap each other.

[0043] Next, as Figure 9 As shown, the ceramic green sheet stack 220 can be cut in a manner that intersects with multiple strip-shaped first inner electrode patterns 221 and multiple strip-shaped second inner electrode patterns 222. That is, the ceramic green sheet stack 220 can be cut along mutually orthogonal cutting lines C1-C1 and C2-C2 to form a multilayer body 210.

[0044] More specifically, the first strip-shaped inner electrode pattern 221 and the second strip-shaped inner electrode pattern 222 can be cut along the length direction (cutting line C1-C1) and divided into multiple inner electrodes, each inner electrode having a constant width. Here, the stacked ceramic green sheet can also be cut together with the inner electrode patterns. Therefore, each dielectric layer can have the same width as each inner electrode.

[0045] Additionally, the ceramic green sheet stack 220 can be cut along the cutting line C2-C2 to suit the individual size of the multi-layer body. That is, before forming the first and second side edges, the rod-shaped stack can be cut along the cutting line C2-C2 to the individual size of the multi-layer body to form multiple multi-layer bodies 210.

[0046] In other words, the rod-shaped stack can be cut in such a way that the gap between each center of the first inner electrode and the second inner electrode, which are stacked on top of each other, is cut by the same cutting line C2-C2. Therefore, the ends of the first inner electrode and the ends of the second inner electrode can be alternately exposed to the cutting surface.

[0047] There are no particular limitations on the method used to cut the ceramic green sheet stack 220. For example, the method could be a cutting method that uses a blade to cut the ceramic green sheet stack 220 or a cutting method that uses a rotating cutting blade to cut the ceramic green sheet stack 220.

[0048] Reference Figure 10 The multilayer body 210 may have a first surface 1 and a second surface 2 opposite to each other in a first direction (W direction), a third surface 3 and a fourth surface 4 opposite to each other in a second direction (L direction), and a fifth surface 5 and a sixth surface 6 opposite to each other in a third direction (T direction). A first inner electrode pattern 221 may be exposed on the first surface 1, the second surface 2, and the third surface 3, and a second inner electrode pattern 222 may be exposed on the first surface 1, the second surface 2, and the fourth surface 4. The first surface 1 and the second surface 2 may be the side surfaces exposed in the width direction by the end edges of the first inner electrode pattern 221 and the second inner electrode pattern 222.

[0049] When performing the adhesion of the adhesive layer to the first surface 1 and the second surface 2 of the multilayer body 210 and the peeling of the adhesive layer from the same surface, the adhesion and peeling of the adhesive layer can be performed first on either the first surface 1 or the second surface 2, and then the adhesion and peeling of the adhesive layer can be performed on the other surface.

[0050] Specifically, the adhesive layer AD can be attached to the side surface exposed by the end edges of the first inner electrode pattern 221 and the second inner electrode pattern 222 of the multilayer body 210, and the adhesive layer AD can be peeled off from the side surface to remove foreign matter from the side surface.

[0051] When cutting the ceramic green sheet stack 220, the adhesive material used to fix the ceramic green sheet stack 220 may be applied to the blade or cutting blade, and the adhesive material applied to the blade or cutting blade may be transferred to the multilayer body 210 to become adhesive residue 30. Therefore, defects such as separation of the side edges from the multilayer body portion and lower moisture resistance may occur due to the adhesive residue 30.

[0052] Additionally, refer to Figure 12 ,Right now Figure 11An enlarged view of region S1 shows that when the ceramic green sheet stack 220 is cut, the metal particles 12 of the inner electrode patterns 221 and 222 can be pushed out by a blade or cutting blade and may exist as foreign matter on the surface of the ceramic green sheet 211 in the side surface of the multilayer body 210. Here, some metal particles 12 may be oxidized when exposed to the surface and exist as metal oxide particles 12'. After sintering the multilayer body, the metal particles 12 and metal oxide particles 12' disposed on the surface of the ceramic green sheet 211 may become channels for electrically connecting the first inner electrode and the second inner electrode to each other, which may lead to a short circuit. In addition, Figures 11 to 18 Each showed along Figure 10 The cross-sectional view of the multilayer body 210 after being rotated by a certain angle is taken from III-III', so that both the first inner electrode pattern and the second inner electrode pattern are visible.

[0053] According to an exemplary embodiment of this disclosure, the adhesive layer AD can be adhered to the side surfaces exposed by the end edges of the first inner electrode pattern 221 and the second inner electrode pattern 222 of the multilayer body 210, and the adhesive layer AD can be peeled off from the side surfaces to remove foreign matter from the same surface. In this way, short circuits caused by metal particles 12 and metal oxide particles 12' on the surface of the ceramic green sheet 211 disposed in the side surfaces of the multilayer body 210 can be suppressed, and defects such as separation of the side edges from the body portion and reduced moisture resistance due to adhesive residue 30 can be suppressed.

[0054] In addition, the adhesive layer AD can be used to effectively remove foreign matter, thus minimizing the physical and chemical deformation of the multilayer body 210 and improving its productivity compared to the use of methods such as polishing, cutting, etching, and laser polishing to remove foreign matter.

[0055] like Figure 11 and Figure 13 As shown, a base film BF with an adhesive layer AD can be prepared, and then the adhesive layer AD can be pressed to adhere to the side surfaces exposed at the end edges of the first inner electrode pattern 221 and the second inner electrode pattern 222 of the multilayer body 210.

[0056] Next, as Figure 15 As shown, when the adhesive layer AD is peeled off from the side surface, foreign matter, such as adhesive residue 30, metal particles 12 and metal oxide particles 12', can be removed from the same surface.

[0057] Figure 16 yes Figure 15 A magnified view of region S2. (Refer to...) Figure 16 (Enlarged view of the side of the multilayer body 210 from which foreign matter has been removed) It can be seen that some of the metal particles 12 and the metal oxide particles 12' oxidized by exposure to the surface have been removed.

[0058] Furthermore, when metal particles 12 and metal oxide particles 12' are removed from the surface, it can be confirmed that the surface has increased roughness, and some areas of the ceramic green sheet and the internal electrode pattern are removed.

[0059] Here, after the adhesive layer AD is peeled off, the average roughness of the centerline of the side surfaces 1 and 2 (i.e., the first surface 1 and the second surface 2) of the multilayer body 210 can be 1.5 times or greater than the average roughness of the centerline of the side surfaces 1 and 2 of the multilayer body 210 before the adhesive layer AD is peeled off. Therefore, the contact area between the side edges and the side surfaces can be increased, thereby improving their adhesion.

[0060] Here, the removed portion can have a depth d greater than 0 nm and less than or equal to 250 nm from the side surface of the multilayer body 210 in a direction perpendicular to the side surface. If the removed portion has a depth d greater than 250 nm, the multilayer electronic component can have lower capacitance and a defective appearance.

[0061] There are no particular restrictions on the type of adhesive layer AD, and it can be made from natural rubber, synthetic rubber, silicone, urethane, acrylic, etc., and can also be made from mixtures of silicone-acrylic-urethane, etc. Natural rubber may include, for example, latex, starch, cellulose and protein, and synthetic rubber may include, for example, isoprene rubber (IR), nitrile rubber (NBR), styrene-butadiene rubber (SBR), chloroprene rubber (CR) or silicone rubber.

[0062] However, as Figure 14 As shown, the adhesive layer AD may include a material that cures upon irradiation with ultraviolet (UV) light. In this case, the method according to an exemplary embodiment of the present disclosure may further include irradiating the adhesive layer AD with UV light after adhering the adhesive layer AD and before peeling off the adhesive layer AD.

[0063] When the adhesive layer AD comprises a material that cures upon exposure to ultraviolet light, foreign matter can be partially trapped within the adhesive layer AD if it is pressed to adhere to the side surfaces exposed by the end edges of the first inner electrode pattern 221 and the second inner electrode pattern 222 of the multilayer body 210. Then, upon exposure to ultraviolet light (UV), the adhesive layer can cure to have lower adhesion, thus allowing the foreign matter to be easily removed from the surface of the multilayer body 210 without causing significant damage.

[0064] Furthermore, there is no need to specifically limit the ratio of the thickness of the base film (BF) to the thickness of the adhesive layer (AD). Experiments have shown that even when the thickness of the base film (BF) is very thin, i.e., when the ratio of the thickness of the base film to the thickness of the adhesive layer is 2.8%, foreign matter can still be stably removed.

[0065] The adhesive layer may have a surface that adheres to the base film and another surface that adheres to the multilayer substrate, and the ratio of the thickness of the base film to the thickness of the adhesive layer may be 2.8% or greater.

[0066] Here, there are no particular restrictions on the type of base film, and it can be a metal base film, a polymer base film, a paper base film, a cotton base film, a rubber base film, etc. Metal base films may include, for example, copper (Cu) foil or aluminum (Al) foil, and polymer base films may include, for example, polyethylene terephthalate (PET), polyimide (PI), polyurethane (PU), polyolefin (PO), polypropylene (PP), polyethylene (PE), nylon, cellophane, polyethylene naphthalate (PEN), polytetrafluoroethylene (Teflon), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), or polystyrene (PS).

[0067] In an exemplary embodiment, the adhesion of the adhesive layer can be performed at a temperature of 85°C or lower. If the adhesive layer is adhered to the multilayer body 210 at a temperature higher than 85°C, more adhesive residue may occur. Therefore, the possibility of defects such as side edge separation from the body portion and reduced moisture resistance increases.

[0068] Then, a first side edge and a second side edge can be formed on the first surface and the second surface of the multilayer body 210, respectively.

[0069] like Figure 17 As shown, ceramic green sheets 212 for the side edges can be attached to the side surfaces exposed by the end edges of the first and second inner electrode patterns of the multilayer body 210.

[0070] A first side edge 112 can be formed by attaching a ceramic green sheet 212 for the side edge to a first surface of the multilayer body 210, and a second side edge 113 can be formed by attaching the ceramic green sheet 212 for the side edge to a second surface of the multilayer body 210 (see...). Figure 1 or Figure 2 ).

[0071] In detail, in order to form the first side edge 112, a ceramic green sheet 212 for the side edge can first be placed on a stamping elastic material 300 made of rubber.

[0072] Next, the multilayer body 210 can be rotated 90 degrees so that the first surface 1 of the multilayer body 210 faces the ceramic green sheet 212 for the side edge, and then the multilayer body 210 can be pressed and attached to the ceramic green sheet 212 for the side edge.

[0073] When the multilayer body 210 is pressed and attached to the ceramic green sheet 212 for the side edges to transfer the ceramic green sheet 212 for the side edges to the multilayer body 210, the ceramic green sheet 212 for the side edges can be formed to the edge of the side surface of the multilayer body 210 due to the use of the stamping elastic material 300 made of rubber material. The remaining portion of the ceramic green sheet 212 for the side edges can be cut off. Finally, the elastic material 300 is removed.

[0074] Figure 18 The ceramic green sheet 212 for the side edge is shown to be formed up to the edge of the side surface of the multilayer body 210.

[0075] The multilayer body 210 can then be rotated 180 degrees to repeat the above process, thereby forming a second side edge 113 on the second surface of the multilayer body 210.

[0076] Next, a multilayer body 210 with ceramic green sheets for the side edges attached thereon can be sintered. The ceramic green sheet 211 can be sintered to become a dielectric layer 111, and the first inner electrode pattern 221 and the second inner electrode pattern 222 can be sintered to become a first inner electrode 121 and a second inner electrode 122, respectively. Therefore, the multilayer body 210 can be sintered to become a body 110 including the dielectric layer 111 and the first inner electrode 121 and the second inner electrode 122.

[0077] In this disclosure, an adhesive layer can be used to remove metal oxide particles 12' from the first surface 1 and the second surface 2. Therefore, the weakly alkaline components included in the ceramic green sheet 212 for the side edges can encounter the non-oxidized metal particles of the inner electrode patterns 221 and 222, thereby suppressing the shrinkage of the inner electrodes during sintering of the body. Thus, after sintering the body, the number of pores within 3 μm of the first surface 1 and the second surface 2 in the direction toward the interior of the multilayer body can be reduced, thereby improving the moisture resistance of the multilayer electronic assembly of this disclosure.

[0078] In an exemplary embodiment, Np / Ne can be determined to be 0.15 or less when Np represents the number of pores within 3 μm of one of the first surface 1 and the second surface 2 of the multilayer body 210 in the direction toward the interior of the multilayer body 210 after sintering, and Ne is the number of internal electrodes. Np / Ne can be 0.10 or less, or it can be 0.05 or less.

[0079] Then, the outer electrodes 131 and 132 can be formed on the third surface of the body 110 exposed by the first inner electrode 121 and the fourth surface of the body 110 exposed by the second inner electrode 122, respectively.

[0080] The conductive paste for the external electrode can first be applied to the third and fourth surfaces of the multilayer body 210 and cover a portion of the side edges.

[0081] The external electrode can then be formed by firing a multilayer body coated with conductive paste for the external electrode.

[0082] A plating layer can then be formed on the external electrode.

[0083] There are no particular restrictions on the method of forming the coating, and it can be electroplating, electroless plating, etc. Furthermore, nickel (Ni), tin (Sn), palladium (Pd), etc., can be used to form the coating. In addition, the coating can be formed using two or more layers.

[0084] Specifically, the coating can be, for example, a nickel (Ni) coating, a tin (Sn) coating, or a palladium (Pd) coating, and can be formed by sequentially forming a Ni coating and a Sn coating, sequentially forming a Ni coating and a Pd coating, or sequentially forming a Sn coating, a Ni coating, and a Sn coating. Additionally, the coating may include multiple Ni coatings and / or multiple Sn coatings.

[0085] Multilayer electronic components

[0086] Figure 1 A perspective view of a multilayer electronic assembly according to another exemplary embodiment of the present disclosure is shown schematically.

[0087] Figure 2 It is shown Figure 1 A three-dimensional view of a multilayer electronic component excluding the external electrodes.

[0088] Figure 3 It is shown Figure 1 A three-dimensional view of a multilayer electronic component, excluding the outer electrodes and side edges.

[0089] Figure 4 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0090] Figure 5 It is along Figure 1 The cross-sectional view taken from line II-II.

[0091] In the following text, refer to Figures 1 to 6 A multilayer electronic assembly 100 is described according to another exemplary embodiment of the present disclosure.

[0092] A multilayer electronic component 100 according to another exemplary embodiment of the present disclosure may include: a body 110 including a plurality of dielectric layers 111, including a first surface 1 and a second surface 2 opposite to each other in a first direction (i.e., the W direction), a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in a second direction (i.e., the L direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction (i.e., the T direction); side edges 112 and 113 respectively disposed on the first surface 1 and the second surface 2; external electrodes 131 and 132 respectively disposed on the third surface 3 and the fourth surface 4; and a plurality of internal electrodes 121 and 122 arranged in the body 110, respectively connected to the external electrodes 131 and 132 disposed on the third surface 3 and the fourth surface 4, and all connected to the side edges 112 and 113 disposed on the first surface 1 and the second surface 2. Np / Ne can be 0.15 or less, where Np is the number of pores included in the inner electrode within 3 μm of one of the side edges 112 and 113 in the direction toward the interior of the body, and Ne is the number of inner electrodes.

[0093] The inner electrode 121 and the inner electrode 122 can be alternately arranged with the dielectric layer 111 in between.

[0094] The main body 110 is not limited to a specific shape, and may have, for example, Figure 3 The shape shown is a hexahedron or a shape similar to a hexahedron. Because the ceramic powder contained in the body 110 shrinks during the sintering process, the body 110 may not have a perfectly straight hexahedron shape. However, the body 110 may have a generally hexahedron shape.

[0095] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in a first direction (i.e., the W direction), a third surface 3 and a fourth surface 4 that are connected to the first surface and the second surface and are opposite to each other in a second direction (i.e., the L direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface, the second surface, the third surface and the fourth surface and are opposite to each other in a third direction (i.e., the T direction).

[0096] The multiple dielectric layers 111 included in the body 110 have been sintered, and adjacent dielectric layers 111 can thus be integrated with each other, making it difficult to confirm the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0097] According to another exemplary embodiment of this disclosure, the raw material for forming the dielectric layer 111 is not particularly limited, as long as sufficient capacitance can be obtained from the raw material. For example, the raw material may be a barium titanate-based material, a lead-based perovskite composite material, or a strontium titanate-based material. The barium titanate-based material may include barium titanate (BaTiO3)-based ceramic powder, and the barium titanate (BaTiO3)-based ceramic powder may be, for example, BaTiO3 or (BaTiO3) wherein calcium (Ca), zirconium (Zr), etc., are partially dissolved in BaTiO3. 1-x Ca x TiO3, Ba(Ti 1- y Ca y O3、(Ba 1-x Ca x (Ti) 1-y Zr y O3, Ba(Ti) 1-y Zr y O3, etc.

[0098] Furthermore, for the purposes of this disclosure, various ceramic additives, organic solvents, binders, dispersants, etc., can be added to ceramic powder.

[0099] One end of a plurality of internal electrodes 121 and 122 disposed in the main body 110 may be exposed to the third surface 3 and the fourth surface 4 of the main body respectively (or in contact with the third surface 3 and the fourth surface 4 respectively or extending from the third surface 3 and the fourth surface 4 respectively).

[0100] The internal electrodes 121 and 122 can be a pair of first internal electrodes 121 and second internal electrodes 122 with different polarities.

[0101] One end of the first inner electrode 121 may be exposed to the third surface 3, and one end of the second inner electrode 122 may be exposed to the fourth surface 4. The other end of the first inner electrode 121 may be spaced apart from the fourth surface 4, and the other end of the second inner electrode 122 may be spaced apart from the third surface 3.

[0102] The outer electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body, respectively, so as to be connected to the inner electrodes 121 and 122, respectively.

[0103] Reference Figure 3 The first inner electrode 121 may be formed on the dielectric layer 111. The first inner electrode 121 may not be formed entirely on the dielectric layer in the length direction. That is, one end of the first inner electrode 121 may be formed to extend to and be exposed on the third surface 3, and the other end of the first inner electrode 121 may be formed at a predetermined distance from the fourth surface 4 of the body 110.

[0104] The end of the first inner electrode exposed on the third surface 3 of the body 110 can be connected to the first outer electrode 131.

[0105] In contrast to the first inner electrode, one end of the second inner electrode 122 may be exposed on the fourth surface 4 and connected to the second outer electrode 132, and the other end of the second inner electrode 122 may be formed at a predetermined distance from the third surface 3.

[0106] Internal electrodes can be stacked into 400 or more layers to achieve multilayer electronic components with high capacitance, and are not necessarily limited to this.

[0107] Np / Ne can be 0.15 or less, where Np represents the number of pores included in the inner electrode within 3 μm of the side edge 112 or 113 in the direction toward the interior of the body, and Ne is the number of inner electrodes. Np / Ne can be 0.10 or less, or it can be 0.05 or less.

[0108] In one example, Np / Ne can be fixed at 0.15 or less, where, in a cross-section in the first-third direction plane, Np represents the number of pores at the junction of the inner electrode and one of the side edges 112 and 113, and Ne is the number of inner electrodes. Np / Ne can be 0.10 or less, or it can be 0.05 or less. The junction can refer to a range within a certain distance from the side edge 112 or 113 in the direction toward the interior of the body. The certain distance can be 3 μm or less.

[0109] When the number of pores disposed in the end edge adjacent to the side edge of the inner electrode increases, the pores can serve as pathways for moisture to pass through, which may result in lower moisture resistance. However, according to another exemplary embodiment of this disclosure, when Np / Ne is 0.15 or less, moisture resistance can be improved.

[0110] The method for controlling the number of pores provided in the end edges of the inner electrode adjacent to the side edges is not particularly limited. However, as described above, before providing the side edges, the metal oxide particles 12' can be removed from the first surface 1 and the second surface 2 of the body using an adhesive layer. Therefore, the weakly alkaline component contained in the ceramic green sheet 212 for the side edges can encounter the non-oxidized metal particles of the inner electrode patterns 221 and 222, thereby suppressing the shrinkage of the inner electrode during sintering of the body and reducing the number of pores provided in the end edges of the inner electrode adjacent to the side edges.

[0111] There are no particular limitations on the methods used to control Np / Ne to 0.15 or less.

[0112] Here, Np and Ne can be measured at 20 internal electrodes in a cross-section of the body cut along the first and third directions at the center of the second direction of the body. These 20 internal electrodes are arranged at the center of the body along the third direction.

[0113] There are no particular limitations on the materials used to form the internal electrodes 121 and 122, and they can be materials with excellent conductivity. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for the internal electrodes onto a ceramic green sheet. The conductive paste includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0114] The methods for printing conductive paste for internal electrodes can include screen printing, gravure printing, etc., and are not limited to these.

[0115] The main body 110 may include a capacitor forming part A and protective layers 114 and 115. A capacitor is formed in the capacitor forming part A. A first inner electrode 121 and a second inner electrode 122 and a dielectric layer 111 are disposed in the capacitor forming part A. The first inner electrode 121 and the second inner electrode 122 are disposed opposite to each other and the dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122. The protective layers 114 and 115 are respectively formed on two end surfaces of the capacitor forming part A in the third direction (i.e., the T direction).

[0116] The capacitor forming section A is the part of the capacitor that forms capacitance, and it can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 in a third direction (i.e., the T direction) and having a dielectric layer 111 between the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122.

[0117] Protective layers 114 and 115 can be formed by stacking a single dielectric layer or two or more dielectric layers on the two end surfaces in the third direction (i.e., the T direction) of the capacitor forming portion, and can be used to substantially prevent damage to the inner electrode caused by physical or chemical stress.

[0118] Protective layers 114 and 115 do not include internal electrodes and may include the same material as dielectric layer 111.

[0119] In another exemplary embodiment, dielectric layer 111 may have an average thickness of 0.4 μm or less. The thickness of the dielectric layer corresponds to the distance between the inner electrodes, so when the dielectric layer has a small thickness, the multilayer electronic component can have improved capacitance.

[0120] In another exemplary embodiment, inner electrodes 121 and 122 may each have an average thickness of 0.4 μm or less. In the multilayer electronic assembly of this embodiment, the step difference of the capacitor body can be improved at the ends of the inner electrodes. Therefore, even when both the dielectric layer and the inner electrodes have the small thicknesses described above, there are no significant problems with the reliability of the multilayer electronic assembly. Thus, the capacitance of the multilayer electronic assembly can be increased and its reliability ensured. In addition, when each of the first and second inner electrodes has the small average thickness described above, the possibility of inner electrode shrinkage after sintering the body can be reduced. Therefore, the diameter of the pores at the ends and side edges of the capacitor body can be further reduced, thereby further improving the reliability of the multilayer electronic assembly.

[0121] When a scanning electron microscope (SEM) with a magnification of 10,000 is used to scan a cross-section of the subject 110 along its length, the average thickness of each of the dielectric layer and the inner electrode can be measured. More specifically, the average thickness can be measured by measuring the thickness of one dielectric layer and the thickness of one inner electrode at 30 points spaced equally apart along the length of the scanned image. The 30 points spaced equally apart can be specified in the capacitor forming section A. Furthermore, a more general average thickness of the dielectric layer and the inner electrode can be obtained by extending the measurement target of the average value to 10 dielectric layers and 10 inner electrodes.

[0122] Side edges 112 and 113 may be respectively disposed on the first surface 1 and the second surface 2 of the main body. Side edges 112 and 113 may refer to the first side edge 112 disposed on the first surface 1 and the second side edge 113 disposed on the second surface 2, respectively.

[0123] The sides of the plurality of inner electrodes 121 and 122 may be exposed on the first surface 1 and the second surface 2, which are the surfaces of the body 110 in the width direction, and the first side edge 112 and the second side edge 113 may be respectively disposed on the exposed sides of the plurality of inner electrodes 121 and 122.

[0124] Side edges 112 and 113 can be used to prevent damage to the inner electrodes 121 and 122 caused by physical or chemical stress.

[0125] The dimensions of each of the first side edge 112 and the second side edge 113 in the first direction are not particularly limited. For example, the dimensions of each of the first side edge 112 and the second side edge 113 in the first direction may be greater than or equal to 2 μm and less than or equal to 10 μm. Here, the dimension of each of the first side edge 112 and the second side edge 113 in the first direction may refer to the thickness tc1 of the region at the center of the first side edge or the second side edge in the third direction (i.e., the T direction).

[0126] When the dimension of each of the first side edge 112 and the second side edge 113 in the first direction is less than 2 μm, it may be difficult to prevent short circuits from the inner electrodes 121 and 122 exposed on the side surfaces. When the dimension is greater than 10 μm, the area of ​​overlap between the inner electrodes 121 and 122 can be relatively reduced, thereby making the effect of ensuring high capacitance by having side edges in the multilayer electronic assembly insignificant.

[0127] Reference Figure 5 The ratio of thickness tc2 to thickness tc1 can be 1.0 or less. Thickness tc2 is the thickness of the region of the first or second side edge that contacts the end edge of the inner electrode 121 or 122 disposed on the outermost side of the body. Thickness tc1 is the thickness of the region at the center of the first or second side edge in a third direction (i.e., the T direction). Here, the thickness of the region of the first and second side edges can refer to the dimensions of the first and second side edges in the first direction, respectively.

[0128] There is no particular limit to the lower limit of the ratio of thickness tc2 to thickness tc1, and it can be 0.9 or greater.

[0129] According to another exemplary embodiment of this disclosure, unlike the prior art, the first side edge 112 or the second side edge 113 can be formed by attaching a ceramic green sheet for the side edge to the side surface of the body 110, and thus the first side edge or the second side edge can have a constant thickness for each location.

[0130] In other words, in the existing technology, the side edges are formed by coating or printing ceramic paste, so the thickness of the side edges will have serious deviations at various locations.

[0131] In detail, in the prior art, the thickness of the region at the center of the first or second side edge in the third direction (i.e., the T direction) is thicker than the thickness of the other regions.

[0132] For example, in the prior art, the ratio of the thickness of the region of the first or second side edge that contacts the end edge of the inner electrode disposed on the outermost side of the body to the thickness of the region of the first or second side edge in the third direction (i.e., the T direction) can be less than 0.9, so the thickness deviation will be greater.

[0133] As described above, in the prior art, the thickness of the side edges at various locations varies greatly, resulting in a large portion occupied by the side edges in multilayer electronic assemblies of the same size. Consequently, it is impossible to ensure large capacitor formation areas, making it difficult to ensure high capacitance in multilayer electronic assemblies.

[0134] On the other hand, according to another exemplary embodiment of this disclosure, the ratio of thickness tc2 to thickness tc1 can be 1.0 or less, where thickness tc2 is the thickness of the region of the first or second side edge that contacts the end edge of the inner electrode disposed on the outermost side of the body among the plurality of inner electrodes 121 and 122, and thickness tc1 is the thickness of the region at the center of the first or second side edge in a third direction (i.e., the T direction). Therefore, both the first side edge 112 and the second side edge 113 can have a small length in the first direction, thereby allowing the capacitor forming portion to ensure a larger size.

[0135] In another exemplary embodiment of this disclosure, unlike the prior art, a first side edge or a second side edge can be formed by attaching a ceramic green sheet to the side surface of the body, so that the first side edge or the second side edge can have a constant thickness at each location.

[0136] Therefore, multilayer electronic components with high capacitance can be realized.

[0137] Additionally, refer to Figure 5 The ratio of thickness tc3 to thickness tc1 can be 1.0 or less. Thickness tc3 is the thickness of the area of ​​the first side edge or the second side edge that contacts the edge of the body 110. Thickness tc1 is the thickness of the area of ​​the first side edge or the second side edge at the center in the third direction (i.e., the T direction).

[0138] The ratio of thickness tc3 to thickness tc1 can be 0.9 or greater.

[0139] Due to the aforementioned characteristics, the thickness of each region on the side edge can have small deviations, thus ensuring a larger size of the capacitor forming part, which enables multilayer electronic components with high capacitance.

[0140] tc1, tc2 and tc3 can be measured in a cross section of the body cut from the center of the body in the second direction along the first direction and the third direction.

[0141] External electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0142] like Figure 4 As shown, the first external electrode 131 and the second external electrode 132 can be respectively disposed on the third surface 3 and the fourth surface 4 of the main body 110, and can be respectively connected to the first internal electrode 121 and the second internal electrode 122.

[0143] This exemplary embodiment describes a multilayer electronic assembly 100 including two external electrodes 131 and 132. However, the number, shape, etc. of the external electrodes may depend on the shape of the internal electrodes or other purposes.

[0144] Additionally, refer to Figure 1 The external electrodes 131 and 132 can be configured to partially cover the side edges 112 and 113, respectively.

[0145] In addition, the external electrodes 131 and 132 can be made of any conductive material (such as metal), each of which can use a specific material determined in consideration of electrical properties, structural stability, etc., and can have a multilayer structure.

[0146] For an example of the multilayer structure of external electrodes 131 and 132, such as Figure 4 As shown, the external electrode 131 may include an electrode layer 131a disposed on the main body 110, a conductive resin layer 131b disposed on the electrode layer 131a, and a plating layer 131c disposed on the conductive resin layer 131b. The external electrode 132 may include an electrode layer 132a disposed on the main body 110, a conductive resin layer 132b disposed on the electrode layer 132a, and a plating layer 132c disposed on the conductive resin layer 132b.

[0147] However, the external electrode is not limited to this. The external electrode may have the following two-layer structure: the external electrode includes an electrode layer and a plating layer disposed on the electrode layer.

[0148] Electrode layers 131a and 132a can be sintered electrodes comprising conductive metal and glass. Electrode layers 131a and 132a can also be formed by transferring a sheet comprising conductive metal onto a substrate. The first electrode layer 131a and the second electrode layer 132a can also be formed using atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, or other methods.

[0149] There are no particular limitations on the conductive metal used for electrode layers 131a and 132a, as long as the conductive metal is a material that can be electrically connected to the inner electrode to form a capacitor. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0150] Both conductive resin layers 131b and 132b can be resin electrodes containing conductive metal and resin.

[0151] There are no particular limitations on the conductive metal used for the conductive resin layers 131b and 132b, as long as the conductive metal is a material that can be electrically connected to the internal electrode to form a capacitor. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0152] Specifically, both plating layers 131c and 132c can be, for example, nickel (Ni) plating layers, tin (Sn) plating layers, or palladium (Pd) plating layers, and can be formed by sequentially forming Ni plating layers and Sn plating layers, sequentially forming Ni plating layers and Pd plating layers, or sequentially forming Sn plating layers, Ni plating layers, and Sn plating layers. Additionally, the plating layers may include multiple Ni plating layers and / or multiple Sn plating layers.

[0153] (Example of the first experiment)

[0154] Preparation of materials such as ceramic green sheet stacks by cutting them is carried out. Figure 10 The multilayer body shown is then adhered to and pressed onto side surfaces 1 and 2 of the multilayer body according to the embodiment of the invention. The UV tape is cured by irradiating it with UV light, and then a foreign matter removal process is performed on the multilayer body by peeling off the UV tape. On the other hand, in the comparative example, the foreign matter removal process is not performed separately.

[0155] Then, the average roughness R1 of each centerline of the side surface 1 and side surface 2 of the multilayer body of the present invention in the thickness direction and the length direction are measured, as well as the average roughness Ra (arithmetic mean roughness Ra) of each centerline of the side surface 1 and side surface 2 of the multilayer body of the comparative example in the thickness direction and the length direction.

[0156] The average roughness value of the centerline in the thickness direction is obtained by measuring 12 lines spaced equally apart in the length direction, and their average values ​​are listed in Table 1 below. Similarly, the average roughness value of the centerline in the length direction is obtained by measuring 12 lines spaced equally apart in the thickness direction, and their average values ​​are listed in Table 1 below.

[0157] The arithmetic mean roughness Ra is obtained by extracting only the reference length l in the direction of the mean line from the roughness curve, taking the direction of the mean line of the extracted portion as the x-axis, taking the vertical magnification direction as the y-axis, and representing the roughness curve as y = f(x). The arithmetic mean roughness Ra has a value obtained by Equation 1 below (in micrometers).

[0158] [Formula 1]

[0159]

[0160] The arithmetic mean roughness Ra was measured by scanning the L-T side surface of the multilayer body in both the length and thickness directions using a Nanosurface 3D optical profilometer (VK-X1000, Keyence).

[0161] [Table 1]

[0162]

[0163] Measurements showed that the average roughness of the centerline in the thickness direction of the comparative example was 0.431, while the average roughness of the centerline in the thickness direction of the inventive example was 0.717. Therefore, it can be confirmed that the average roughness of the centerline in the thickness direction of the inventive example is 1.5 times or more than that of the comparative example.

[0164] Furthermore, the average roughness of the centerline in the length direction of the comparative example was determined to be 0.324, while the average roughness of the centerline in the length direction of the inventive example was 0.602. Therefore, it can be seen that the average roughness of the centerline in the length direction of the inventive example is 1.5 times or more than the average roughness of the centerline in the thickness direction of the comparative example.

[0165] Then, side edges are formed on the first surface 1 and the second surface 2, respectively, and the adhesion of the side edges is measured. The adhesion of the side edges is measured by the maximum adhesion when the side edges separate from the body, using a Dage4000Plus device in the lateral direction (e.g., ...). Figure 2 Pull the side edge of each of the 100 samples in the comparative example and the invention example along the width (W direction) of the sample.

[0166] When the average adhesion strength of the side edges of the comparative example was 100, the average adhesion strength of the side edges of the inventive example was 112. Therefore, it can be confirmed that the adhesion strength of the inventive example was improved by 12%.

[0167] The main body was then sintered, and the porosity at the end of the inner electrode in the width direction was observed.

[0168] First, the WT side surface of the electronic component sample is polished using a polishing machine, so that each sample of the electronic component in the inventive example and comparative example exposes a surface (i.e., the WT surface) defined by the width direction (i.e., the W direction) and the thickness direction (i.e., the T direction). Here, the electronic component sample is polished in the length (L) direction to approximately half the depth of the sample to expose the WT surface (i.e., the WT polished section), i.e., the polished surface. The area of ​​the body with stacked internal electrodes is divided into three parts in the T direction, thus being divided into three regions: an upper region, a middle region, and a lower region. Additionally, as... Figure 19 and Figure 20 As shown, Np is measured in the middle region, where Np is the number of pores included in the inner electrode within 3 μm from the side edge in the direction toward the interior of the body.

[0169] Figure 19 An image of an example of the invention is shown. Figure 20 Images showing comparison examples are provided. If... Figure 19 and 20 In comparison, when Np represents the number of pores included in the inner electrode within 3 μm of the side edge in the direction toward the interior of the body, and Ne is the number of inner electrodes, the Np / Ne ratio of the inventive example is 0.15, while that of the comparative example is 0.35. It can be confirmed that the number of pores at the end edge of the inner electrode in the inventive example is significantly reduced compared to the number of pores at the end edge of the inner electrode in the comparative example.

[0170] Furthermore, 100 samples were prepared for each of the comparative example and the inventive example, and their short-circuit failure rates were compared with each other. When the short-circuit failure rate of the comparative example was 100, the short-circuit failure rate of the inventive example was 41.10. Therefore, it can be confirmed that the short-circuit failure rate of the inventive example is also significantly reduced.

[0171] (Example of the second experiment)

[0172] Foreign matter was removed by setting the tape specifications and process conditions as shown in Table 2 below. Then, adhesive residue, defects appearing on the side edges, and moisture resistance were measured and listed in Table 3 below.

[0173] For adhesive residues, an image analysis program is used to clearly distinguish the adhesive residues from other parts, and then the area of ​​the adhesive residues is quantitatively measured.

[0174] Defects appearing in the side edges were identified as follows: 1200 electronic component samples for each test number were inspected. The electronic component samples were polished to expose the cross-section in the WT direction, and then their 1 / 10, 1 / 3, and 1 / 2 portions were examined three times in the T direction using an optical microscope to confirm whether the side edges were separated from the main body of the electronic component. Samples whose side edges were separated from the main body of the electronic component were then identified as defective, and the number of defective samples is shown in Table 3 below.

[0175] For each test number, 120 samples of electronic components were evaluated for moisture resistance. An electric field of 5 V / μm was applied to each sample of electronic components for 20 hours in an atmosphere of 120°C and 95% relative humidity. Samples of electronic components whose insulation resistance value decreased to 1 / 10 or less compared to the insulation resistance value before the application of the electric field were then identified as defective. Table 3 below shows the number of electronic component samples identified as defective.

[0176] [Table 2]

[0177]

[0178] [Table 3]

[0179]

[0180]

[0181] Test No. 15 (at a temperature of 100°C during the bonding of the adhesive layer) showed an increase in adhesive residue and an increase in the number of defects where the side edges separated from the main body of the electronic component compared to Test No. 16 (without the foreign matter removal process).

[0182] It can be confirmed that, compared with test number 16, all of the tests except test number 15, from test number 1 to test number 14, showed a significantly reduced ratio of defective side edges and also showed improved moisture resistance.

[0183] In particular, test number 4 was conducted using a very thin base film, and this experiment demonstrated that foreign matter could be completely removed even when the ratio of the thickness of the base film to the thickness of the adhesive layer was 2.8%.

[0184] As described above, according to exemplary embodiments of the present disclosure, short circuits can be suppressed by using an adhesive layer to remove foreign matter from the cut surface.

[0185] In addition, according to exemplary embodiments of the present disclosure, defects such as separation of the side edges from the main body of the electronic component can be suppressed and reduced moisture resistance can be prevented.

[0186] However, this disclosure is not limited to the above description and can be more readily understood from the description of exemplary embodiments of this disclosure.

[0187] Although exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and changes may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A method for manufacturing a multilayer electronic component, the method comprising: A first ceramic green sheet and a second ceramic green sheet are prepared. A plurality of first internal electrode patterns spaced apart from each other are formed on the first ceramic green sheet, and a plurality of second internal electrode patterns spaced apart from each other are formed on the second ceramic green sheet. A ceramic green sheet stack is formed by stacking the first ceramic green sheet and the second ceramic green sheet together such that the first internal electrode pattern and the second internal electrode pattern are stacked in an intersecting manner. A multilayer body is obtained by cutting the ceramic green sheet stack, the multilayer body having a side surface, the end edges of the first inner electrode pattern and the second inner electrode pattern being exposed to the side surface in the width direction of the multilayer body; The adhesive layer is adhered to the side surface of the multilayer body; Peel the adhesive layer from the side surface. The side edges are formed by attaching ceramic green sheets for the side edges to the side surfaces of the multilayer body from which the adhesive layer is removed, and The multilayer body to which the ceramic green sheets for the side edges are sintered and attached. Wherein, Np / Ne is 0.15 or less, where Np is the number of pores included in the first inner electrode pattern and the second inner electrode pattern after sintering, within 3 μm of the side surface in the direction toward the interior of the multilayer body, and Ne is the number of inner electrodes.

2. The method according to claim 1, wherein, After the adhesive layer is peeled off, the average roughness of the centerline of the side surface is 1.5 times or greater than the average roughness of the centerline of the side surface before the adhesive layer is applied.

3. The method according to claim 1, wherein, In the peeling of the adhesive layer, The first ceramic green sheet and / or the second ceramic green sheet, as well as a portion of the first inner electrode pattern and / or the second inner electrode pattern, are removed, and The removed portion has a depth greater than 0 nm and less than or equal to 250 nm from the side surface in a direction perpendicular to the side surface.

4. The method according to claim 1, wherein, The adhesive layer comprises a material that cures upon exposure to ultraviolet light. The method further includes irradiating the adhesive layer with ultraviolet light between the adhesion and peeling of the adhesive layer.

5. The method according to claim 1, wherein, The adhesive layer adheres to the base film on the other surface opposite to the surface adhered to the multilayer body, and The ratio of the thickness of the base film to the thickness of the adhesive layer is 2.8% or greater.

6. The method according to claim 1, wherein, The adhesion of the adhesive layer is performed at a temperature of 85°C or lower.

7. The method according to claim 1, wherein, The multilayer body has a first surface and a second surface opposite to each other in a first direction of the multilayer body, a third surface and a fourth surface opposite to each other in a second direction of the multilayer body, and a fifth surface and a sixth surface opposite to each other in a third direction of the multilayer body. The first direction of the multilayer body is the width direction. The first inner electrode pattern in the multilayer body is exposed on the first surface, the second surface and the third surface. The second inner electrode pattern in the multilayer body is exposed on the first surface, the second surface and the fourth surface. The first surface and the second surface are the side surfaces exposed in the width direction by the end edges of the first inner electrode pattern and the second inner electrode pattern.

8. The method according to claim 1, wherein, The adhesion of the adhesive layer is performed at a temperature greater than or equal to 40°C and less than or equal to 85°C.

9. The method according to claim 1, wherein, The first ceramic green sheet and the second ceramic green sheet each have a thickness of 0.6 μm or less.

10. The method according to claim 1, wherein, The first inner electrode pattern and the second inner electrode pattern each have a thickness of 0.5 μm or less.

11. The method of claim 9, further comprising applying a conductive paste for the external electrode to the multilayer body to cover a portion of the side edge.

12. The method of claim 11, further comprising forming the external electrode by sintering the multilayer body coated with the conductive paste for the external electrode.

13. The method of claim 12, further comprising forming a plating layer on the external electrode.

14. The method according to claim 13, wherein, The coating is formed comprising two or more layers.

15. The method according to claim 4, wherein, After the adhesive layer is peeled off, the average roughness of the centerline of the side surface is 1.5 times or greater than the average roughness of the centerline of the side surface before the adhesive layer is applied.

16. The method according to claim 15, wherein, In the peeling of the adhesive layer, The first ceramic green sheet and / or the second ceramic green sheet, as well as a portion of the first inner electrode pattern and / or the second inner electrode pattern, are removed, and The removed portion has a depth greater than 0 nm and less than or equal to 250 nm from the side surface in a direction perpendicular to the side surface.

17. The method according to claim 4, wherein, The adhesive layer adheres to the base film on the other surface opposite to the surface adhered to the multilayer body, and The ratio of the thickness of the base film to the thickness of the adhesive layer is 2.8% or greater.

18. The method according to claim 4, wherein, The adhesion of the adhesive layer is performed at a temperature of 85°C or lower.

19. The method according to claim 1, wherein, When the adhesive layer is peeled off from the side surface, foreign matter on the side surface is removed.

20. A multilayer electronic component, comprising: A body comprising a plurality of dielectric layers, the body including a first surface and a second surface opposite to each other in a first direction of the body, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction of the body, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction of the body; Side edges are respectively disposed on the first surface and the second surface; External electrodes are respectively disposed on the third surface and the fourth surface; as well as Multiple inner electrodes are arranged in the main body and respectively connected to the outer electrodes disposed on the third and fourth surfaces, and respectively connected to the side edges disposed on the first and second surfaces. Wherein, Np / Ne is 0.15 or less, where Np is the number of pores included in the inner electrode within 3 μm of one of the side edges in the direction toward the interior of the body, and Ne is the number of inner electrodes.

21. The multilayer electronic assembly according to claim 20, wherein, Np and Ne are measured at 20 internal electrodes in a cross-section of the body cut along the first direction and the third direction at the center of the body in the second direction. The 20 internal electrodes are arranged at the center of the body along the third direction.

22. The multilayer electronic component according to claim 20, wherein, The external electrodes are respectively configured to partially cover the side edges.

23. The multilayer electronic component according to claim 20, wherein, The ratio of the thickness of the region where the end edge of the side edge and the region where the end edge of the inner electrode of the plurality of inner electrodes is located on the outermost side of the body are in contact with each other to the thickness of the region where the side edge is located in the center of the third direction is greater than or equal to 0.9 and less than or equal to 1.

0.

24. The multilayer electronic assembly according to claim 23, wherein, The ratio of the thickness of the area where the side edge contacts the edge of the body to the thickness of the area at the center of the side edge in the third direction is greater than or equal to 0.9 and less than or equal to 1.

0.

25. The multilayer electronic component according to claim 20, wherein, The average thickness of the dielectric layer is 0.4 μm or less.

26. The multilayer electronic assembly according to claim 20, wherein, The average thickness of the internal electrode is 0.4 μm or less.

27. The multilayer electronic assembly according to claim 20, wherein, The average thickness of both the dielectric layer and the inner electrode is 0.4 μm or less.

28. A multilayer electronic component, comprising: A body comprising a plurality of dielectric layers, the body including a first surface and a second surface opposite to each other in a first direction of the body, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction of the body, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction of the body; Side edges are respectively disposed on the first surface and the second surface; External electrodes are respectively disposed on the third surface and the fourth surface; as well as Multiple inner electrodes are arranged in the main body and respectively connected to the outer electrodes disposed on the third and fourth surfaces, and respectively connected to the side edges disposed on the first and second surfaces. Wherein, Np / Ne is 0.15 or less, and in a cross-section cut along the first direction-the third direction of the multilayer electronic assembly, Np is the number of pores of the inner electrode at the junction of the inner electrode and one of the side edges, and Ne is the number of inner electrodes.

29. The multilayer electronic assembly according to claim 28, wherein, The ratio of the thickness of the region where the end edge of the side edge and the region where the end edge of the inner electrode of the plurality of inner electrodes is located on the outermost side of the body are in contact with each other to the thickness of the region where the side edge is located in the center of the third direction is greater than or equal to 0.9 and less than or equal to 1.

0.

30. The multilayer electronic component according to claim 29, wherein, The ratio of the thickness of the area where the side edge contacts the edge of the body to the thickness of the area at the center of the side edge in the third direction is greater than or equal to 0.9 and less than or equal to 1.

0.

31. The multilayer electronic assembly according to claim 28, wherein, The average thickness of the dielectric layer is 0.4 μm or less.

32. The multilayer electronic component according to claim 28, wherein, The average thickness of the internal electrode is 0.4 μm or less.

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