An electronic module

Abstract

An electronic module includes a circuit board, a plurality of electronic components disposed on and electrically connected to the circuit board, a package disposed on the circuit board to encapsulate the plurality of electronic components, wherein a first recess is formed in the package, and a first electrode, wherein at least a portion of an electrode of an external component is disposed in the first recess and electrically connected to the first electrode of the electronic module.

Description

TECHNICAL FIELD

[0001] The present invention relates to an electrode structure, and more particularly, to an electrode structure for electrically connecting a battery. BACKGROUND

[0002] Conventional circuit boards installed on a battery have very thick electrodes to reduce the effect of residual heat on the components on the circuit board during the spot welding process. However, the very thick electrodes occupy a large space on the circuit board and also increase the distance between the electrodes and the components on the circuit board.

[0003] In addition, the electronic components on conventional circuit boards installed on a battery do not have a protective body to prevent the electronic components from being damaged.

[0004] Therefore, there is a need for a better solution to solve the above problems. SUMMARY

[0005] An object of the present invention is to provide an electronic module for reducing the distance between the electrodes and the electronic components on the circuit.

[0006] An object of the present invention is to provide an electronic module for reducing the size of the circuit board and the overall height of the electronic module.

[0007] An object of the present invention is to provide an electronic module having a package for protecting the electronic devices in the electronic module.

[0008] An object of the present invention is to provide an electrode structure on a circuit board to reduce the effect of residual heat during spot welding.

[0009] An object of the present invention is to provide an electrode structure on a circuit board for reducing the distance between the electrodes and the conductive components on the circuit.

[0010] An object of the present invention is to provide an electrode structure on a circuit board to reduce the size of the circuit board.

[0011] An embodiment of the present invention provides an electronic module, comprising: a circuit board; a plurality of electronic components disposed on a first surface of the circuit board and electrically connected to the circuit board; a package disposed on the first surface of the circuit board to encapsulate the plurality of electronic components, wherein a first recess is formed in the package; a first electrode, wherein at least a portion of an electrode of an external component is disposed in the first recess and electrically connected to the first electrode of the electronic module.

[0012] In an embodiment of the present invention, the first electrode forms a portion of a bottom surface of the first recess.

[0013] In one embodiment of the present application, the first electrode forms an entire bottom surface of the first recess.

[0014] In one embodiment of the present application, the external component is a battery, wherein at least a portion of an electrode of the battery is disposed in the first recess and electrically connected to the first electrode.

[0015] In one embodiment of the present application, a second recess is formed in the package, wherein at least a portion of an electrode of the battery is disposed in the second recess and electrically connected to a second electrode of the electronic module.

[0016] In one embodiment of the present application, the second electrode forms a portion of a bottom surface of the second recess.

[0017] In one embodiment of the present application, the second electrode forms an entire bottom surface of the second recess.

[0018] In one embodiment of the present application, the external component is a battery, wherein at least a portion of a positive electrode of the battery is disposed in the first recess and electrically connected to the first electrode, and a negative electrode of the battery is disposed in the second recess and electrically connected to the second electrode.

[0019] In one embodiment of the present application, the electronic module includes a first metal structure forming a first space with the first surface of the circuit board, wherein at least a first conductive component is disposed in the first space, and wherein an outer surface of the first metal structure forms a first electrode.

[0020] In one embodiment of the present application, the first metal structure has a U-shape or an L-shape.

[0021] In one embodiment of the present application, the first metal structure includes copper.

[0022] In one embodiment of the present application, the first metal structure includes a copper layer and a tin layer covering the copper layer.

[0023] In one embodiment of the present application, the first surface of the circuit board is a lower surface of the circuit board.

[0024] In one embodiment of the present application, the first metal structure is soldered to the circuit board.

[0025] In one embodiment of the present application, the at least a first conductive component includes at least one of a resistor, a capacitor, and an inductor.

[0026] In one embodiment of the present application, the first metal structure includes a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer.

[0027] In one embodiment of the present application, the at least one first conductive element includes at least one active element and at least one passive element.

[0028] In one embodiment of the present application, a second metal structure is disposed on the circuit board and electrically connected to the circuit board, wherein the second metal structure and the first surface of the circuit board form a second space, wherein at least one second conductive element is disposed in the second space, and an outer surface of the second metal structure forms a second electrode for electrically connecting to the external element.

[0029] In one embodiment of the present application, the external element is a battery, and the first metal structure and the second metal structure are electrically connected to a positive electrode and a negative electrode of the battery, respectively.

[0030] In one embodiment of the present application, the first metal structure includes a first surface mount pad.

[0031] In one embodiment of the present application, the second metal structure includes a first surface mount pad.

[0032] In one embodiment of the present application, a side surface of the first metal structure includes a closed metal path.

[0033] In one embodiment of the present application, a side surface of the second metal structure includes a closed metal path.

[0034] So that the foregoing and other features and advantages of the present application can be understood, a detailed description will follow, with reference to the drawings, wherein: BRIEF DESCRIPTION OF DRAWINGS

[0035] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0036] Figure 1A A side view of an electronic module of one embodiment of the present application.

[0037] Figure 1B A side view of an electronic module of one embodiment of the present application.

[0038] Figure 1C A side view of an electronic module of one embodiment of the present application.

[0039] Figure 1D A side view of an electronic module of one embodiment of the present application.

[0040] Figure 1E A side view of an electronic module of one embodiment of the present application.

[0041] Figure 2A A side view of an electronic module of an embodiment of the present application connected with a battery.

[0042] Figure 2B A side view of an electronic module of an embodiment of the present application connected with a battery.

[0043] Figure 3A A side view of an electronic module of an embodiment of the present application.

[0044] Figure 3B A side view of an electronic module of an embodiment of the present application.

[0045] BRIEF DESCRIPTION OF DRAWINGS100 - electronic module; 101 - circuit board; 101M - package; 101h1 - first recess; 101E1 - first electrode; 101h2 - second recess; 101E12 - second electrode; 102 - first conductive element; 103 - second conductive element; 101a - first metal structure; 101c - first space; 102 - first conductive element; 103 - second conductive element; 101b - second metal structure; 101d - second space; 101aB - first surface mount pad; 101aL - side surface; 102a, 102b - conductive element; 201 - battery; 201P - positive electrode; 201N - negative electrode; 103a, 103b - conductive element; 104, 105 - conductive element; 101h1S1 - first side wall; 101h1S2 - second side wall; 101h1B - bottom surface; 101h2S1 - first side wall; 101h2S2 - second side wall; 101h2B - bottom surface. DETAILED DESCRIPTION

[0046] Figure 1A A side view of an electronic module 100 of an embodiment of the present application is shown, wherein the electronic module 100 includes: a circuit board 101; a plurality of electronic elements, such as a first conductive element 102 and a second conductive element 103, disposed on a first surface of the circuit board 101 and electrically connected to the circuit board 101; a package 101M disposed on the first surface of the circuit board 101 to encapsulate the plurality of electronic elements 102, 103, wherein a first recess 101h1 is formed in the package; a first electrode 101E1, wherein at least a portion of an external element, such as an electrode 201P of a battery 201, can be disposed in the first recess 101h1 to electrically connect to the first electrode 101E1 of the electronic module, as shown. Figure 2A

[0047] In one embodiment, as shown in Figure 1BAs shown, the first recess 101hl is formed by a first sidewall 101hlSl, a second sidewall 101hlS2, and a bottom surface 101hlB formed by a portion of the encapsulant 101M and the first electrode 101El.

[0048] In one embodiment, as shown in FIG. 1, the electronic module 100 includes a first recess 101hl formed in the encapsulant 101M, wherein the electronic module 100 includes a first electrode 101El electrically coupled to the circuit board 101, wherein the first electrode 101El is exposed to the first recess 101hl for electrical connection with an external element. Figure 1C As shown, the first recess 101hl is formed by a first sidewall 101hlSl, a second sidewall 101hlS2, and a bottom surface 101hlB formed by the first electrode 101El.

[0049] In one embodiment, the second recess 101h2 is formed in the encapsulant 101M, wherein the electronic module 100 includes a second electrode 101E2 electrically coupled to the circuit board 101, wherein the second electrode 101E2 is exposed to the second recess 101h2 for electrical connection with an external element.

[0050] In one embodiment, as shown in FIG. 1, the electronic module 100 includes a first recess 101hl formed in the encapsulant 101M, wherein the electronic module 100 includes a first electrode 101El electrically coupled to the circuit board 101, wherein the first electrode 101El is exposed to the first recess 101hl for electrical connection with an external element. Figure 1D As shown, the second recess 101h2 is formed by a first sidewall 101h2Sl, a second sidewall 101h2S2, and a bottom surface 101h2B formed by a portion of the encapsulant 101M and the second electrode 101E2.

[0051] In one embodiment, as shown in FIG. 1, the electronic module 100 includes a first recess 101hl formed in the encapsulant 101M, wherein the electronic module 100 includes a first electrode 101El electrically coupled to the circuit board 101, wherein the first electrode 101El is exposed to the first recess 101hl for electrical connection with an external element. Figure 1E As shown, the second recess 101h2 is formed by a first sidewall 101h2Sl, a second sidewall 101h2S2, and a bottom surface 101h2B formed by the second electrode 101E2.

[0052] In one embodiment, the second electrode 101E2 forms a portion of the bottom surface of the second recess.

[0053] In one embodiment, the second electrode 101E2 forms the entire bottom surface of the second recess.

[0054] In one embodiment, the external element is a battery, wherein at least a portion of an electrode of the battery is disposed within the first recess and is electrically connected to the first electrode 101El.

[0055] In one embodiment, a second recess is formed in the encapsulant, wherein at least a portion of an electrode of the battery is disposed within the second recess and is electrically connected to the second electrode 101E2 of the electronic module.

[0056] In one embodiment, the second electrode 101E2 forms a portion of the bottom surface of the second recess.

[0057] In one embodiment, the second electrode 101E2 forms the entire bottom surface of the second recess.

[0058] In an embodiment, the external element is a battery, wherein at least a portion of a positive electrode of the battery is disposed in the first recess and electrically connected to the first electrode, and a negative electrode of the battery is disposed in the second recess and electrically connected to the second electrode.

[0059] In one embodiment, as shown in FIG. 1A, the electronic module 100 includes a first metal structure 101a disposed on and electrically connected to a circuit board 101, wherein the first metal structure 101a forms a first space 101c with a first surface of the circuit board 101, and at least one first conductive element 102 is disposed in the first space 101c, and an outer surface of the first metal structure 101a forms a first electrode for electrically connecting to an external element. Figure 2A

[0060] In one embodiment, as shown in FIG. 1A, the electronic module 100 includes a first metal structure 101a disposed on and electrically connected to a circuit board 101, wherein the first metal structure 101a forms a first space 101c with a first surface of the circuit board 101, and at least one first conductive element 102 is disposed in the first space 101c, and an outer surface of the first metal structure 101a forms a first electrode for electrically connecting to an external element. Figure 2A

[0061] In one embodiment, as shown in FIG. 1A, the electronic module 100 includes a first metal structure 101a disposed on and electrically connected to a circuit board 101, wherein the first metal structure 101a forms a first space 101c with a first surface of the circuit board 101, and at least one first conductive element 102 is disposed in the first space 101c, and an outer surface of the first metal structure 101a forms a first electrode for electrically connecting to an external element. Figure 2A

[0062] In one embodiment, as shown in FIG. 1A, the electronic module 100 includes a first metal structure 101a disposed on and electrically connected to a circuit board 101, wherein the first metal structure 101a forms a first space 101c with a first surface of the circuit board 101, and at least one first conductive element 102 is disposed in the first space 101c, and an outer surface of the first metal structure 101a forms a first electrode for electrically connecting to an external element.

[0063] In one embodiment, the first metal structure includes copper.

[0064] In one embodiment, the first metal structure includes a copper layer and a tin layer covering the copper layer.

[0065] In one embodiment, the first surface of the circuit board is a lower surface of the circuit board.

[0066] In one embodiment, the first metal structure is soldered to the circuit board.

[0067] In one embodiment, the at least one first conductive element includes at least one of a resistor, a capacitor, and an inductor.

[0068] In one embodiment, the first metal structure includes a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer. ​​​

[0069] In one embodiment, the at least one first conductive element includes at least one active element and at least one passive element.

[0070] In one embodiment, the electronic module further includes a second metal structure disposed on and electrically connected to the circuit board, wherein the second metal structure and the first surface of the circuit board form a second space, wherein at least one second conductive element is disposed in the second space, and the outer surface of the second metal structure forms a second electrode for electrically connecting to the external element.

[0071] In one embodiment, the external element is a battery, and the first metal structure and the second metal structure are electrically connected to the positive and negative terminals of the battery, respectively.

[0072] In one embodiment, the first metal structure includes a first surface mount pad.

[0073] In one embodiment, the second metal structure includes a first surface mount pad.

[0074] In one embodiment, the side surface of the first metal structure includes a closed metal path.

[0075] In one embodiment, the side surface of the second metal structure includes a closed metal path.

[0076] In one embodiment, the external element is a battery 201, wherein a first metal structure 101a is electrically connected to the positive terminal 201P of the battery 201.

[0077] In one embodiment, the external element is a battery 201, wherein a first metal structure 101a is electrically connected to the negative terminal 201N of the battery 201.

[0078] In one embodiment, such as Figure 1A As shown, at least one conductive element 104 is disposed on a circuit board 101.

[0079] In one embodiment, the first surface of the circuit board 101 is the lower surface of the circuit board.

[0080] In one embodiment, the first surface of the circuit board 101 is an upper surface of the circuit board.

[0081] In one embodiment, the external component is a PCB.

[0082] In one embodiment, the first metal structure 101a has a U-shape.

[0083] In one embodiment, the first metal structure 101a has an L-shape.

[0084] In one embodiment, the first metal structure 101a comprises copper.

[0085] In one embodiment, the first metal structure 101a is made of copper.

[0086] In one embodiment, the first metal structure 101a comprises a copper layer and a tin layer covering the copper layer.

[0087] In one embodiment, the first metal structure 101a comprises copper, nickel and aluminum.

[0088] In one embodiment, the first metal structure 101a comprises a copper layer and a nickel layer covering the copper layer.

[0089] In one embodiment, the first metal structure 101a comprises a copper layer, a nickel layer covering the copper layer and an aluminum layer covering the nickel layer.

[0090] In one embodiment, the first metal structure 101a comprises a copper layer, a nickel layer covering the copper layer, an aluminum layer covering the nickel layer and a gold layer covering the aluminum layer.

[0091] In one embodiment, a space is formed between the first metal structure 101a and the lower surface of the circuit board 101, wherein at least one conductive element is disposed in the space, and the lower surface of the first metal structure 101a forms an electrode for electrically connecting with an external element.

[0092] In one embodiment, the electrode comprises a surface mount pad for electrically connecting with the external element.

[0093] In one embodiment, a space is formed between the first metal structure 101a and the upper surface of the circuit board 101, wherein at least one conductive element is disposed in the space, and the upper surface of the first metal structure 101a forms an electrode for electrically connecting with an external element.

[0094] In one embodiment, the electrode comprises a surface mount pad for electrically connecting with the external element.

[0095] In one embodiment, the first metal structure 101a is soldered to the circuit board 101.

[0096] In one embodiment, the at least one conductive element comprises a passive element.

[0097] In one embodiment, the at least one conductive element comprises at least one of the following: a resistor, a capacitor and an inductor.

[0098] In one embodiment, the at least one conductive element comprises an active element.

[0099] In one embodiment, the at least one conductive element comprises an IC.

[0100] In one embodiment, the at least one conductive element includes an active element and a passive element.

[0101] In one embodiment, as shown in FIG. 1, the electrode structure further includes a second metal structure 101b disposed on the circuit board 101 and electrically connected to the circuit board 101, wherein the second metal structure 101b forms a second space 101d with the first surface of the circuit board 101, and at least one second conductive element 103 is disposed in the second space 101d, and an outer surface of the second metal structure 101b forms a second electrode for electrically connecting to an external element. Figure 2A

[0102] In one embodiment, as shown in FIG. 1, the external element is a battery 201, and the first metal structure 101a and the second metal structure 101b are electrically connected to the positive electrode 201P and the negative electrode 201N of the battery 201, respectively. Figure 2A

[0103] In one embodiment, as shown in FIG. 1, the at least one conductive element 105 is embedded in the circuit board. Figure 2B

[0104] In one embodiment, as shown in FIG. 1, the plurality of conductive elements 102a, 102b are disposed in the first space 101c. Figure 2B

[0105] In one embodiment, as shown in FIG. 1, the plurality of conductive elements 103a, 103b are disposed in the second space 101d. Figure 2B

[0106] In one embodiment, at least one IC is embedded in the circuit board 101.

[0107] In one embodiment, the circuit board 101 is provided with at least one of the following conductive elements: a driver IC, a control IC, a MOSFET, an IGBT, and a diode.

[0108] In one embodiment, at least one active element and at least one passive element are embedded in the circuit board.

[0109] In one embodiment, as shown in FIG. 1, the first metal structure forms a first electrode 101E1 with a first surface mount pad. Figure 2A

[0110] In one embodiment, as shown in FIG. 1, the plurality of conductive elements 102a, 102b are disposed in the first space 101c. Figure 2B

[0111] In one embodiment, as shown in FIG. 1, the plurality of conductive elements 103a, 103b are disposed in the second space 101d. Figure 2A ​​​​​​​As shown, the side surface 101aL of the first metal structure 101a includes a closed metal path.

[0112] In one embodiment, the first metal structure 101a has a through hole on its side.

[0113] In one embodiment, the side surface of the second metal structure 101b includes a closed metal path.

[0114] In one embodiment, the second metal structure 101b has a through hole on its side.

[0115] In one embodiment, such as Figure 3A As shown, the package 101M encapsulates the conductive elements disposed on the circuit board 101.

[0116] In one embodiment, such as Figure 3B As shown, the package 01M encapsulates the conductive elements and the circuit board 101 mounted on the circuit board 101.

[0117] In one embodiment, such as Figure 3B As shown, the conductive elements on the package 01M package circuit board 101, the circuit board 101, and a portion of the first metal structure 101a.

[0118] The advantages of this invention include: 1. Reducing the design area and cost of the circuit board; 2. Reducing the thickness of the electronic module; 3. Increasing the available space for the battery; 4. Increasing the usable space of the motherboard; 5. Reducing the impact of residual heat during spot welding on components and the circuit board; 6. Reducing the distance between the electrodes and components on the circuit board.

[0119] Although the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that modifications can be made to the described embodiments without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the appended claims, not by the detailed description above.

Claims

1. An electronic module, characterized by The electronic module comprises: a circuit board; a plurality of electronic components disposed on a first surface of the circuit board and electrically connected to the circuit board; a package disposed on the first surface of the circuit board to encapsulate the plurality of electronic components, wherein a first recess is formed in the package; a first electrode, wherein at least a portion of an electrode of an external component is disposed in the first recess and electrically connected to the first electrode of the electronic module, wherein the first electrode of the electronic module forms a portion of a bottom surface of the first recess; a first metal structure forming a first space with the first surface of the circuit board, wherein at least one first conductive element is disposed in the first space, an outer surface of the first metal structure forms the first electrode, and the connection between the first electrode and the electrode of the external component at least partially overlaps the at least one first conductive element disposed in the first space in a direction perpendicular to the circuit board.

2. The electronic module of claim 1, wherein, The external component is a battery, wherein at least a portion of a first electrode of the battery is disposed in the first recess and electrically connected to the first electrode of the electronic module.

3. The electronic module of claim 2, wherein, A second recess is formed in the package, wherein at least a portion of a second electrode of the battery is disposed in the second recess and electrically connected to a second electrode of the electronic module.

4. The electronic module of claim 3, wherein, The second electrode of the electronic module forms a portion of a bottom surface of the second recess.

5. The electronic module of claim 3, wherein, The second electrode of the electronic module forms an entire bottom surface of the second recess.

6. The electronic module of claim 3, wherein, The external component is a battery, wherein at least a portion of a positive electrode of the battery is disposed in the first recess and electrically connected to the first electrode of the electronic module, and a negative electrode of the battery is disposed in a second recess and electrically connected to a second electrode of the electronic module.

7. The electronic module of claim 1, wherein, The first metal structure has a U shape or an L shape.

8. The electronic module of claim 1, wherein, The first metal structure comprises copper.

9. The electronic module of claim 1, wherein, The first metal structure comprises a copper layer and a tin layer covering the copper layer.

10. The electronic module of claim 1, wherein, The first surface of the circuit board is a lower surface of the circuit board.

11. The electronic module of claim 1, wherein, The first metal structure is soldered to the circuit board.

12. The electronic module of claim 1, wherein, The at least one first conductive element comprises at least one of: a resistor, a capacitor, and an inductor.

13. The electronic module of claim 1, wherein, The first metal structure comprises a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer.

14. The electronic module of claim 1, wherein, The at least one first conductive element comprises at least one active component and at least one passive component.

15. The electronic module of claim 1, wherein, The electronic module further comprises a second metal structure disposed on the circuit board and electrically connected to the circuit board, wherein the second metal structure forms a second space with the first surface of the circuit board, wherein at least one second conductive element is disposed in the second space, and an outer surface of the second metal structure forms a second electrode for electrically connecting to the external component.

16. The electronic module of claim 15, wherein, The external component is a battery, and the first metal structure and the second metal structure are electrically connected to a positive electrode and a negative electrode of the battery, respectively.

17. The electronic module of claim 1, wherein, The first metal structure comprises a first surface mount pad.

18. An electronic module, characterized by The electronic module comprises: a circuit board; a plurality of electronic components disposed on a first surface of the circuit board and electrically connected to the circuit board; a package disposed on the first surface of the circuit board to encapsulate the plurality of electronic elements, wherein a first recess is formed in the package; a first electrode, wherein at least a portion of an electrode of an external element is disposed in the first recess and electrically connected to the first electrode of the electronic module, wherein the first electrode of the electronic module forms a portion of a bottom surface of the first recess; a first metal structure forming a first space with the first surface of the circuit board, wherein at least a first conductive element is disposed in the first space, an outer surface of the first metal structure forms the first electrode, and the connection between the first electrode and the electrode of the external element at least partially overlaps the at least a first conductive element disposed in the first space in a direction perpendicular to the circuit board, and a width of the first recess is less than a width of the first metal structure.

Images