Printed circuit board etching method

Abstract

The present invention discloses an etching method for a printed circuit board, wherein the etching method for a printed circuit board comprises: pre-etching a plurality of boards respectively, obtaining the etching line speeds of the plurality of boards during the pre-etching process and corresponding multiple influencing parameters; analyzing and processing the etching line speeds during the pre-etching process and the corresponding multiple influencing parameters, obtaining the corresponding relationship between the etching line speeds and the multiple influencing parameters; predicting the predicted etching line speed of the board to be etched based on the corresponding relationship and the multiple influencing parameters of the board to be etched; etching the board to be etched based on the predicted etching line speed. Through the above-mentioned etching method for a printed circuit board, the present invention can achieve precise etching of each board to be etched by directly obtaining the etching line speed of the board to be etched through the establishment of a corresponding relationship through the multiple influencing parameters of the board to be etched, thereby reducing the demand for manual etching process skills.

Description

Technical Field

[0001] The invention is applied to the technical field of preparation of printed circuit boards, in particular to an etching method of printed circuit boards. Background Art

[0002] The electronic information industry is the most innovative and permeable field in the world, and printed circuit boards (PCBs) are the foundation of the entire electronic information industry system. Among them, graphic etching is an important process in the printed circuit board related industry.

[0003] The traditional etching process has high skill requirements for operators. Operators will set the processing parameters of the first board based on their work experience to achieve batch etching. However, this method not only has high requirements for the skills of operators, but is also prone to human errors, resulting in the scrapping of a large number of boards due to the failure of the first piece. Summary of the invention

[0004] The invention provides an etching method for a printed circuit board, so as to solve the problem in the prior art that errors are prone to occur in the etching process, resulting in the scrapping of the board.

[0005] In order to solve the above technical problems, the present invention provides an etching method for a printed circuit board, and the etching method for a printed circuit board includes: pre-etching multiple boards respectively, obtaining the etching line speeds of the multiple boards during the pre-etching process and the corresponding multiple influencing parameters; analyzing and processing the etching line speeds and the corresponding multiple influencing parameters during the pre-etching process to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters; predicting the predicted etching line speed of the board to be etched based on the corresponding relationship and the multiple influencing parameters of the board to be etched; etching the board to be etched based on the predicted etching line speed.

[0006] The various influencing parameters include: line width ratio, board copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature and at least some influencing parameters in CAP.

[0007] The step of analyzing and processing the etching line speed and the corresponding multiple influencing parameters in the pre-etching process to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters includes: calculating the corresponding relationship by the following formula (1):

[0008] V=-6.5+0.111*S-0.0505*L1-0.422*L2+0.0056CAP-0.01P+8.1H+0.0247*T (1)

[0009] Among them, V is the etching line speed, S is the line width ratio, L 1 is the copper thickness of the plate, L 2is the substrate copper thickness, P is the acid equivalent, H is the specific gravity, T is the temperature, and CAP is the electrical conductivity.

[0010] Among them, the various influencing parameters also include: current density and line width compensation value.

[0011] The step of analyzing and processing the etching line speed and the corresponding multiple influencing parameters in the pre-etching process to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters includes: calculating the corresponding relationship by the following formula (2):

[0012] V=6.56-0.686*L2-0.0393*L1+0.0121*J-0.240*K (2)

[0013] Among them, V is the etching line speed, L2 is the substrate copper thickness, L1 is the board copper thickness, J is the current density, and K is the line width compensation value.

[0014] Among them, the etching line speed and the corresponding multiple influencing parameters in the pre-etching process are analyzed and processed to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters, including: inputting the etching line speed and the corresponding multiple influencing parameters into the modeling software to establish a corresponding equation; obtaining the corresponding relationship based on the corresponding equation.

[0015] Among them, the step of obtaining the corresponding relationship based on the corresponding equation includes: performing regression analysis on the corresponding equation to obtain the fit of the corresponding equation; judging whether the fit exceeds the preset fit; if it exceeds the preset fit, determining the corresponding equation as the corresponding relationship.

[0016] Among them, the step of judging whether the degree of fit exceeds the preset degree of fit includes: if it does not exceed the preset degree of fit, performing deviation adjustment on multiple influencing parameters; inputting the adjusted multiple influencing parameters and the corresponding etching line speed into the modeling software to re-establish the corresponding equation.

[0017] The preset fitting degree range is 85%-90%.

[0018] Among them, the steps of pre-etching multiple plates respectively and obtaining the etching line speeds of the multiple plates during the multiple pre-etching processes and the corresponding multiple influencing parameters include: pre-etching multiple plates respectively under a preset environment, obtaining the etching line speeds of the multiple plates during the multiple pre-etching processes and the corresponding multiple influencing parameters; the step of etching the plates to be etched based on the predicted etching line speed includes: etching the plates to be etched based on the predicted etching line speed under a preset environment.

[0019] The beneficial effects of the present invention are as follows: Different from the prior art, the etching method of the printed circuit board of the present invention obtains and analyzes the etching line speeds of the multiple boards during the pre-etching process and the corresponding multiple influencing parameters by pre-etching the multiple boards separately first, and then obtains the corresponding relationship between the etching line speed and the multiple influencing parameters, and then predicts the predicted etching line speed of the board to be etched based on the corresponding relationship and the multiple influencing parameters of the board to be etched, and finally etches the board to be etched based on the predicted etching line speed. The present invention can directly obtain the etching line speed of the board to be etched through the multiple influencing parameters of the board to be etched based on the establishment of the corresponding relationship, so as to realize the precise etching of each board to be etched, improve the accuracy and reliability of the etching process, and reduce the requirements for manual etching process skills. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic flow chart of an embodiment of an etching method for a printed circuit board provided by the present invention;

[0021] Figure 2 The figure is a flow chart of another embodiment of the etching method for a printed circuit board provided by the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] See also Figure 1 , Figure 1 The figure is a flow chart of an embodiment of a printed circuit board etching method provided by the present invention.

[0026] Step S11: pre-etching the plurality of plates respectively, and obtaining the etching line speeds of the plurality of plates during the pre-etching process and corresponding various influencing parameters.

[0027] Pre-etching is performed on multiple plates respectively. Pre-etching is normal etching of each plate. By etching multiple plates, the etching line speed and corresponding various influencing parameters in the etching process are obtained. In a specific application scenario, when etching multiple plates in the actual production process, the etching line speed and corresponding various influencing parameters of each plate in the pre-etching process can be collected.

[0028] In this embodiment, the number of pre-etched plates can be more than 30, and is not limited to 100, 500, etc., wherein the more pre-etched plates there are, the more etching line speeds and corresponding influencing parameters are obtained, and the more accurate the corresponding relationship finally generated is.

[0029] In the etching process, after etching is completed, the line width of each etching circuit is an important control requirement, and the etching line speed has a serious impact on the line width. Therefore, this embodiment controls the etching line speed and then controls the line width of each etching circuit to improve the success rate of the etching process.

[0030] The various influencing parameters in this embodiment are various parameters that affect the etching line speed. By pre-etching multiple plates in actual applications and collecting the actual etching line speed of each plate in the pre-etching and all parameters related to the etching line speed, it is convenient to determine the corresponding relationship between the etching line speed and each parameter based on the above parameters.

[0031] Step S12: analyzing and processing the etching line speed and the corresponding multiple influencing parameters in the pre-etching process to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters.

[0032] After obtaining the etching line speed of each plate and the corresponding multiple influencing parameters, the etching line speed in the pre-etching process and the corresponding multiple influencing parameters are analyzed and processed by big data based on each set of data, so as to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters.

[0033] In a specific application scenario, the etching line speed can be used as the dependent variable, and multiple influencing parameters can be used as independent variables. Analysis and processing are performed based on the etching line speed of each plate and the corresponding multiple influencing parameters. Finally, the equation between the dependent variable-etching line speed and the independent variable-multiple influencing parameters is determined, and the corresponding relationship between the above parameters is obtained.

[0034] Step S13: predicting the etching line speed of the plate to be etched based on the corresponding relationship and various influencing parameters of the plate to be etched.

[0035] After obtaining the corresponding relationship between the etching line speed and multiple influencing parameters, the multiple influencing parameters corresponding to the plate to be etched are obtained. Then, the multiple influencing parameters corresponding to the plate to be etched are substituted into the corresponding relationship, and the etching line speed of the plate to be etched is predicted through the corresponding relationship to obtain the predicted etching line speed of the plate to be etched.

[0036] Step S14: etching the plate to be etched based on the predicted etching line speed.

[0037] After the predicted etching line speed of the plate to be etched is obtained, the plate to be etched is etched based on the predicted etching line speed, thereby completing the etching operation of the plate to be etched.

[0038] Through the above method, the etching method of the printed circuit board of this embodiment first pre-etches multiple boards separately, obtains and analyzes the etching line speeds of the multiple boards during the pre-etching process and the corresponding multiple influencing parameters, and then obtains the corresponding relationship between the etching line speed and the multiple influencing parameters, and then predicts the predicted etching line speed of the board to be etched based on the corresponding relationship and the multiple influencing parameters of the board to be etched, and finally etches the board to be etched based on the predicted etching line speed. This embodiment can directly obtain the etching line speed of the board to be etched through the multiple influencing parameters of the board to be etched based on the establishment of the corresponding relationship, so as to achieve accurate etching of each board to be etched, improve the accuracy and reliability of the etching process, and reduce the requirements for manual etching process skills.

[0039] See also Figure 2 , Figure 2 The figure is a flow chart of another embodiment of the etching method for a printed circuit board provided by the present invention.

[0040] Step S21: pre-etching the plurality of plates respectively under a preset environment, and obtaining etching line speeds of the plurality of plates during the plurality of pre-etching processes and corresponding various influencing parameters.

[0041] Under a preset environment, multiple plates are pre-etched respectively. The preset environment is a fixed environment, such as the cleanliness of the etching equipment, the acid concentration of the etching solution, the concentration of the developer, the etching temperature and other environmental factors are fixed, so as to avoid the environmental factors affecting the pre-etching, thereby causing inaccurate corresponding relationship.

[0042] The etching line speeds of multiple panels during multiple pre-etching processes and the corresponding various influencing parameters are obtained.

[0043] In a specific application scenario, by collecting data on on-site pre-etching processing, the following data can be collected.

[0044]

[0045] Therefore, by analyzing the above data, it can be determined that the various influencing parameters affecting the etching line speed include: line width ratio, board copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature and at least some influencing parameters in CAP.

[0046] In a specific application scenario, considering that for external etching, the etching rate is not only related to the thickness of the board, but also to the quality of the board, and in the electroplating process before the etching process of the printed circuit board, the copper morphology produced by different current densities is different. Therefore, in this application scenario, the line width compensation on the board and the current density in the electroplating process are taken as influencing parameters and added to the various influencing parameters corresponding to the etching line speed for analysis and consideration. The various influencing parameters in this application scenario include: line width ratio, board copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature, CAP, current density and line width compensation value.

[0047] Step S22: inputting the etching line speed and corresponding multiple influencing parameters into the modeling software to establish a corresponding equation, and performing regression analysis on the corresponding equation to obtain the fitting degree of the corresponding equation.

[0048] The etching line speed and the corresponding influencing parameters generated during the pre-etching of each plate are input into the modeling software respectively. The etching line speed is used as the dependent variable, and the various influencing parameters are used as independent variables. The relationship between the dependent variable and the independent variable in the data corresponding to multiple plates is analyzed, and the corresponding equations between the etching line speed and the various influencing parameters are obtained.

[0049] In a specific application scenario, the modeling software may be Minitab 16 software or other modeling software, etc., which is not specifically limited here.

[0050] In a specific application scenario, when multiple influencing parameters include line width ratio, board copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature and CAP, the etching line speed and the data corresponding to the above parameters are analyzed and calculated to obtain the following formula (1):

[0051] V=-6.5+0.111*S-0.0505*L1-0.422*L2+0.0056CAP-0.01P+8.1H+0.0247*T (1)

[0052] Among them, V is the etching line speed, S is the line width ratio, L1 is the copper thickness of the board, L2 is the copper thickness of the substrate, P is the acid equivalent, H is the specific gravity, T is the temperature, and CAP is the conductivity.

[0053] That is, the above formula (1) is a corresponding equation between the etching line speed and the above-mentioned various influencing parameters.

[0054] After obtaining formula (1), regression analysis is performed on formula (1) to obtain the fit R-Sq (the percentage of regression model error in the total error) of formula (1). In a specific application scenario, the plate can be pre-etched again under a preset environment to obtain new data on etching line speed and various influencing parameters, and regression analysis is performed on formula (1) based on the new data. In another specific application scenario, regression analysis can also be performed on formula (1) based on the relevant data obtained in step S21.

[0055] In a specific application scenario, when multiple influencing parameters include line width ratio, plate copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature, CAP, current density and line width compensation value, the etching line speed and the data corresponding to the above parameters are analyzed and calculated to obtain formula (2), wherein formula (2) is applied to the line width ratio, acid equivalent, specific gravity, temperature, and CAP parameters that have reliable stability. Since the above parameters are stable, the above parameters are no longer variables but fixed quantities, and the above parameters can be converted into corresponding constant terms for calculation to simplify formula (2). Specifically, in a specific application scenario, the etching solution concentration (etching solution affects acid equivalent and CAP) can be fixed at 1.39 mol / L, the specific gravity can be fixed at 2.48, the temperature can be fixed at 25 degrees Celsius, and the line width ratio can be fixed at 1.3. Formula (2) is as follows:

[0056] V=6.56-0.686*L 2 -0.0393*L 1 +0.0121*J-0.240*K (2)

[0057] Where V is the etching line speed, L 2 is the base copper thickness, L 1 is the copper thickness of the board, J is the current density, and K is the line width compensation value.

[0058] Step S23: Determine whether the degree of fit exceeds a preset degree of fit.

[0059] Determine whether the degree of fit of the corresponding equation exceeds the preset degree of fit. When the degree of fit exceeds the preset degree of fit, it can be said that the corresponding equation is valid and can have guiding significance for actual production, and step S24 is executed at this time. When the degree of fit does not exceed the preset degree of fit, on the contrary, the corresponding equation has no guiding value, and step S26 is executed at this time.

[0060] Among them, the preset fitting degree ranges from 85% to 100%, and can be specifically 85%, 86%, 87%, 88%, 90%, etc., and there is no specific limitation here. The larger the numerical setting of the preset fitting degree is, the higher the accuracy requirement for the corresponding equation is.

[0061] In a specific application scenario, a regression analysis of formula (1) can be performed, and its R-Sq = 87.4%. When the preset fitting degree is 85%, the fitting degree of formula (1) exceeds the preset fitting degree, which means that formula (1) is effective and has production guidance significance. In another specific application scenario, when the fitting degree is 90%, the fitting degree of formula (1) does not exceed the preset fitting degree, which means that formula (1) does not yet have production guidance significance.

[0062] In a specific application scenario, a regression analysis is performed on formula (2), and its fitting degree R-Sq = 90.4%. In a specific application scenario, when the fitting degree is 90%, the fitting degree of formula (2) exceeds the preset fitting degree, which means that formula (2) has production guidance significance.

[0063] In other embodiments, the corresponding equation can also be pre-applied. First, the predicted etching line speed of the plate to be etched is predicted by the corresponding equation, and then the predicted etching line speed is compared with the actual etching line speed of the plate to be etched in the actual production process to determine whether the error between the predicted etching line speed and the actual etching line speed exceeds the set value. If it does not exceed the set value, it means that the corresponding equation has a guiding significance for actual production, and step S24 is executed. If it exceeds the set value, it means that the corresponding equation does not have a guiding significance for actual production, and step S26 is executed.

[0064] Step S24: Determine the corresponding equation as the corresponding relationship.

[0065] When the fitting degree of the corresponding equation exceeds the preset fitting degree, or has guiding significance for actual production, the corresponding equation is determined as the corresponding relationship between the etching line speed and a plurality of influencing parameters.

[0066] Step S25: Based on the corresponding relationship and various influencing parameters of the plate to be etched, a predicted etching line speed of the plate to be etched is predicted, and the plate to be etched is etched based on the predicted etching line speed.

[0067] Apply the corresponding relationship. After obtaining the various influencing parameters corresponding to the plate to be etched, substitute the various influencing parameters into the corresponding relationship for calculation to obtain the predicted etching line speed of the plate to be etched. And under the same preset environment as step S21, etch the plate to be etched based on the predicted etching line speed. Thereby, the etching process is automated to a certain extent, reducing the need for manual skills.

[0068] In a specific application scenario, when the fit of formula (1) exceeds the preset fit of 85%, formula (1) is applied to obtain the line width ratio, plate copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature and CAP corresponding to the plate to be etched, and the line width ratio, plate copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature and CAP corresponding to the plate to be etched are substituted into formula (1) for calculation to obtain the predicted etching line speed of the plate to be etched. The plate to be etched is etched based on the predicted etching line speed.

[0069] In another specific application scenario, when the degree of fit of formula (2) exceeds the preset degree of fit, formula (2) is applied to obtain the line width ratio, plate copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature, CAP, current density and line width compensation value corresponding to the plate to be etched, and the line width ratio, plate copper thickness, substrate copper thickness, acid equivalent, specific gravity, temperature, CAP, current density and line width compensation value corresponding to the plate to be etched are substituted into formula (2) for calculation to obtain the predicted etching line speed of the plate to be etched. The plate to be etched is etched based on the predicted etching line speed.

[0070] Step S26: performing deviation adjustment on various influencing parameters.

[0071] When the degree of fit of the corresponding equation does not exceed the preset degree of fit, it means that the corresponding relevant data in the corresponding equation are inaccurate, and it is necessary to make deviation adjustments to the various influencing parameters.

[0072] In a specific application scenario, the relevant parameters of the etching equipment and the potions (such as specific gravity, oxidant, etching temperature, acid equivalent, etc.) in the pre-etching process may have poor stability. The fluctuations in each pre-etching process are too large, which will cause the collected data to be non-real-time, and then lead to a decrease in data accuracy, resulting in a low degree of fit. Then the actual situation corresponding to the above parameters is improved. Specifically, the calibration adjustment deviation can be corrected and the calibration frequency can be increased for the etching solution concentration; the calibration frequency can be increased and the laboratory analysis method can be adjusted for the specific gravity; the float can be cleaned and the liquid level sensor can be calibrated regularly for the developer concentration, and so on, to adjust the deviation of various influencing parameters.

[0073] In a specific application scenario, when the relevant parameters of the etching equipment and the stability of the solution during the pre-etching process meet the requirements, if the fitting degree of the corresponding equation still does not exceed the preset fitting degree, it may be due to the incompleteness of the multiple influencing parameters determined in step S21 and the lack of independent variables, which leads to the inaccuracy of the corresponding equation. In this embodiment, by increasing the number of pre-etchings, data can be collected for more parameters to find out the missing independent variables, and then modeling and calculation can be performed through the newly added independent variables and the original independent variables.

[0074] The etching method of the printed circuit board of this embodiment is to pre-etch multiple boards respectively under a preset environment, obtain and analyze the etching line speed of multiple boards in the pre-etching process and the corresponding multiple influencing parameters, and then input the above data into the modeling software to establish a corresponding equation. The corresponding equation is subjected to regression analysis to obtain the degree of fit of the corresponding equation. When the degree of fit of the corresponding equation exceeds the preset degree of fit, the corresponding equation is determined as a corresponding relationship to predict the etching line speed of the board to be etched. Based on the establishment of the corresponding relationship, this embodiment can directly obtain the etching line speed of the board to be etched through the multiple influencing parameters of the board to be etched, so as to achieve precise etching of each board to be etched, improve the accuracy and reliability of the etching process, and reduce the requirements for manual etching process skills. Moreover, this embodiment can improve the prediction accuracy of the corresponding relationship through the setting of the preset degree of fit, improve the etching quality of the board, and reduce the occurrence of scrap.

[0075] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for etching a printed circuit board, characterized in that: The etching method of the printed circuit board comprises: Pre-etching a plurality of plates respectively, and obtaining etching line speeds of the plurality of plates during the pre-etching process and corresponding multiple influencing parameters; The etching line speed and the corresponding multiple influencing parameters in the pre-etching process are analyzed and processed to obtain the corresponding relationship between the etching line speed and the multiple influencing parameters; wherein the etching line speed and the corresponding multiple influencing parameters are input into the modeling software to establish a corresponding equation; the corresponding relationship is obtained based on the corresponding equation; wherein the corresponding equation is subjected to regression analysis to obtain the fitting degree of the corresponding equation; it is determined whether the fitting degree exceeds a preset fitting degree; if it exceeds the preset fitting degree, the corresponding equation is determined as the corresponding relationship; the preset fitting degree ranges from 85% to 90%; Based on the corresponding relationship and multiple influencing parameters of the plate to be etched, predicting the predicted etching line speed of the plate to be etched; Etching the plate to be etched based on the predicted etching line speed; The corresponding relationship is calculated by the following formula (1) or (2): V=-6.5+0.111*S-0.0505*L1-0.422*L2+0.0056CAP-0.01P+8.1H+0.0247*T (1) Wherein, V is the etching line speed, S is the line width ratio, L1 is the copper thickness of the plate, L2 is the copper thickness of the substrate, P is the acid equivalent, H is the specific gravity, T is the temperature, and CAP is the electrical conductivity; V=6.56-0.686*L2-0.0393*L1+0.0121*J-0.240*K (2) Wherein, V is the etching line speed, L2 is the substrate copper thickness, L1 is the plate copper thickness, J is the current density, and K is the line width compensation value; Wherein, the step of determining whether the degree of fit exceeds a preset degree of fit includes: If the preset degree of fit is not exceeded, deviation adjustments are made to various influencing parameters, including correcting the calibration adjustment deviation for etching solution concentration, increasing the calibration frequency, increasing the calibration frequency for specific gravity, and adjusting the laboratory's analysis method and / or cleaning the float ball and regularly calibrating the liquid level sensor for developer concentration to make deviation adjustments to various influencing parameters; the adjusted various influencing parameters and the corresponding etching line speeds are input into the modeling software to re-establish the corresponding equations.

2. The method for etching a printed circuit board according to claim 1, characterized in that: The step of pre-etching the plurality of plates respectively and obtaining the etching line speeds of the plurality of plates during the pre-etching process and the corresponding multiple influencing parameters comprises: Pre-etching a plurality of plates respectively under a preset environment, and obtaining etching line speeds of the plurality of plates during the plurality of pre-etching processes and corresponding various influencing parameters; The step of etching the plate to be etched based on the predicted etching line speed comprises: The plate to be etched is etched based on the predicted etching line speed under the preset environment.

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