High-precision and fast assembly method for PCB or PCBA printed circuit parts

By preparing accurate workpieces and using visual positioning algorithms to polish the edges of PCB boards, the problem of low production efficiency of PCB or PCBA assembly in the prior art is solved, and high-precision and rapid assembly is achieved, which is suitable for mass production.

CN115256299BActive Publication Date: 2025-04-01CHONGQING TIMSENS PRECISION EQUIP TECH CO LTD
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Patent Information

Application Number
CN202210729458.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-24
Publication Date
2025-04-01
Estimated Expiration
2042-06-24

AI Technical Summary

Technical Problem

The existing PCB or PCBA assembly methods have low production efficiency during high-precision assembly and cannot meet the needs of mass production.

Method used

By preparing the precision workpiece, obtaining the position information of the target pad on the PCB board, grinding the edge of the PCB board using the visual positioning algorithm until it is flush with the edge of the target pad. Then, the polished PCB board is placed on the precision workpiece for snapping and aligning, and finally pressing it through a pressure tool to obtain a high-precision assembly product.

Benefits of technology

It realizes high-precision and rapid assembly of PCB or PCBA, ensuring that the assembly target surface has horizontal position accuracy and concentric accuracy, both within ±5μm, improving production efficiency and suitable for mass production.

✦ Generated by Eureka AI based on patent content.

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    Figure CN115256299B_ABST
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Abstract

The invention relates to the technical field of PCB assembly, and in particular to a high-precision rapid assembly method for a printed circuit part of a PCB or PCBA, comprising the steps of preparing a precision workpiece based on a preset precision; obtaining position information of a target pad on a printed circuit part of a PCB; grinding an edge of a PCB board based on the position information of the printed circuit part until the edge of the printed circuit part of the PCB board is flush with the edge of the target pad; placing the ground PCB board on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece; and pressing the combined workpiece by a pressure tool to obtain a finished workpiece. By adopting the above method, a target plane of PCB assembly has horizontal position accuracy. At the same time, if the PCB is a circular circuit board, it also has precision concentricity within ±5μm. The assembly method of the PCBA board is the same as the assembly method of the PCB board, thereby solving the problem of low production efficiency of the existing assembly method.
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Description

Technical Field

[0001] The invention relates to the technical field of PCB assembly, and in particular to a high-precision rapid assembly method for a PCB or PCBA printed circuit part. Background Art

[0002] The printed circuit board of PCB or PCBA needs to be assembled to the target plane position, and the target plane of PCB or PCBA assembly has horizontal position accuracy. At the same time, if the PCB or PCBA is a circular circuit board, it also has concentricity accuracy within ±5μm.

[0003] However, in the process of high-precision assembly, a common assembly method is to use a micrometer to measure the assembly. Although it has high assembly accuracy, it is necessary to check whether the micrometer is clamped firmly before assembly. During assembly, the measuring rod of the micrometer needs to be lifted several times to contact the workpiece to observe whether the repeated indication values ​​are the same. The assembly steps are cumbersome, which makes the assembly speed slow, resulting in low production efficiency and is not suitable for mass production. Summary of the invention

[0004] The object of the present invention is to provide a high-precision and rapid assembly method for a PCB or PCBA printed circuit part, aiming to solve the problem of low production efficiency of the existing assembly method.

[0005] To achieve the above object, in a first aspect, the present invention provides a high-precision rapid assembly method for a PCB printed circuit part, comprising the following steps:

[0006] Prepare precision workpieces based on preset precision;

[0007] Obtaining the position information of the target pad on the printed circuit board portion of the PCB;

[0008] Grinding the edge of the PCB board based on the position information until the edge of the printed circuit portion of the PCB board is flush with the edge of the target pad;

[0009] Placing the polished PCB board on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece;

[0010] The combined workpieces are pressed together by a pressure tool to obtain a finished workpiece.

[0011] The specific method of preparing the precision workpiece based on the preset precision is:

[0012] Determining a target plane on the workpiece;

[0013] Drawing the processing position of the protrusion or groove on the target plane to obtain position information;

[0014] The workpiece is processed based on the preset accuracy and the position information to obtain a high-precision workpiece.

[0015] The specific method of grinding the edge of the PCB board based on the position information until the edge of the printed circuit part of the PCB board is flush with the edge of the target pad is:

[0016] A visual positioning algorithm and a visual positioning device are used to control a grinder based on the position information to grind the edge of the PCB board until the edge of the printed circuit part of the PCB board is flush with the edge of the target pad.

[0017] The specific method of placing the polished PCB board on the precision workpiece until it is aligned with the precision workpiece to obtain the combined workpiece is:

[0018] Determine the surface of the polished PCB board close to the precision workpiece to obtain a coated surface;

[0019] Applying adhesive on the application surface;

[0020] The PCB board coated with adhesive is placed on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece.

[0021] The specific method of pressing the combined workpieces by a pressure tool to obtain the finished workpiece is as follows:

[0022] Placing the combined workpiece on the pressing end of the press tool;

[0023] Setting the pressure value and speed of the pressure tool;

[0024] The pressure tool presses the combined workpiece based on the pressure value and the speed to obtain a finished workpiece.

[0025] In a second aspect, the present invention provides a high-precision rapid assembly method for a PCBA printed circuit part, which is assembled using the high-precision rapid assembly method for a PCB printed circuit part described in the first aspect.

[0026] The invention discloses a high-precision rapid assembly method for a PCB printed circuit part, which comprises the following steps: preparing a precision workpiece based on a preset precision; obtaining position information of a target pad on the PCB; grinding the edge of the PCB based on the position information until the edge of the printed circuit part of the PCB is flush with the edge of the target pad; placing the grinded PCB on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece; and pressing the combined workpiece by a pressure tool to obtain a finished workpiece. By adopting the above method, the target plane of the PCB assembly has horizontal position accuracy. At the same time, if the PCB is a circular circuit board, it also has concentric accuracy, and both are within ±5μm, thereby solving the problem of low production efficiency of the existing assembly method. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 The present invention provides a flowchart of a high-precision rapid assembly method for a PCB.

[0029] Figure 2 It is a structural schematic diagram of a PCB board, a target pad, and an edge of the PCB board.

[0030] Figure 3 It is a structural diagram of PCB board, precision workpiece and pressure tooling.

[0031] Figure 4 It is a schematic diagram of the structure of the finished workpiece when the precision workpiece has a protrusion.

[0032] Figure 5 It is a schematic diagram of the structure of a finished workpiece when the precision workpiece has a groove.

[0033] 1-PCB board, 2-target pad, 3-edge of PCB board, 6-precision workpiece, 7-upper board, 8-lower board. DETAILED DESCRIPTION

[0034] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0035] See also Figures 1 to 5 In a first aspect, the present invention provides a high-precision rapid assembly method for a PCB, comprising the following steps:

[0036] S1 prepares a precision workpiece 6 based on a preset precision;

[0037] The specific method is:

[0038] S11 determines a target plane on the workpiece;

[0039] S12 draws the processing position of the protrusion or groove on the target plane to obtain position information;

[0040] S13 processes the workpiece based on the preset accuracy and the position information to obtain a high-precision workpiece 6.

[0041] Specifically, a visual positioning algorithm and a visual positioning device are used to control a grinder based on the position information to grind the edge 3 of the PCB board until the edge 3 of the PCB board is flush with the edge of the target pad 2 .

[0042] S2 obtains the position information of the target pad 2 on the printed circuit part of the PCB board 1;

[0043] Specifically, a surface pad with a characteristic shape is designed and manufactured on the PCB board 1, and the surface pad is used as the target pad 2, and the position information of the target pad 2 on the printed circuit part of the PCB board 1 is obtained.

[0044] S3: grinding the edge 3 of the printed circuit portion of the PCB board based on the position information until the edge 3 of the PCB board is flush with the edge of the target pad 2;

[0045] Specifically, the edge 3 of the PCB board is subjected to straight edge grinding and curved edge grinding, such as the two grinding conditions of the curved edges of circles 4 and 5 shown in FIG. 2 .

[0046] S4: placing the polished PCB board 1 on the precision workpiece 6 until it is aligned with the precision workpiece 6 to obtain a combined workpiece;

[0047] The specific method is:

[0048] S41 determines the surface of the polished PCB board 1 close to the precision workpiece 6 to obtain a coated surface;

[0049] S42 applies adhesive on the application surface;

[0050] S43: placing the PCB board 1 coated with adhesive on the precision workpiece 6 until it is aligned with the precision workpiece 6 to obtain a combined workpiece.

[0051] S5: Pressing the combined workpieces by a press tool to obtain a finished workpiece.

[0052] The specific method is:

[0053] S51 placing the combined workpiece on the pressing end of the pressure tool;

[0054] Specifically, the press tooling includes an upper plate 7 and a lower plate 8, and the assembled workpiece is placed on the lower plate 8 of the press tooling.

[0055] S52 sets the pressure value and speed of the pressure tool;

[0056] Specifically, the pressure value and speed of the upper plate 7 of the pressure tool are set

[0057] S53: The pressure tool presses the combined workpiece based on the pressure value and the speed to obtain a finished workpiece.

[0058] Specifically, the upper plate 7 moves toward the lower plate 8 at the set pressure value and speed, and presses the combined workpiece on the lower plate 8 to obtain a finished workpiece.

[0059] The invention discloses a high-precision rapid assembly method for a PCB printed circuit part, which comprises the following steps: determining a target plane on a workpiece; drawing a processing position of a protrusion or a groove on the target plane to obtain position information; processing the workpiece based on a preset accuracy and the position information to obtain a precision workpiece 6; designing and manufacturing a surface pad with a characteristic shape on the PCB board 1, and using the surface pad as a target pad 2 to obtain the position information of the target pad 2 on the PCB board 1; and assembling the PCB board 1 based on the position information. The edge 3 of the board is polished until the edge 3 of the PCB board is flush with the edge of the target pad 2; the surface of the polished PCB board 1 close to the precision workpiece 6 is determined to obtain a coating surface; adhesive is applied on the coating surface; the PCB board 1 coated with adhesive is placed on the precision workpiece 6 until it is aligned with the precision workpiece 6 to obtain a combined workpiece; the combined workpiece is placed on the pressing end of the pressure tool; the pressure value and speed of the pressure tool are set; the pressure tool presses the combined workpiece based on the pressure value and the speed to obtain a finished workpiece. By using the above method, the target plane of the PCB assembly has horizontal position accuracy. At the same time, if the PCB is a circular circuit board, it also has precision concentricity, and both are within ±5μm.

[0060] In a second aspect, the present invention provides a high-precision rapid assembly method for PCBA, which is assembled using the high-precision rapid assembly method for the PCB printed circuit part described in the first aspect.

[0061] Specifically, the assembly method of the PCBA board is the same as that of the PCB board 1, that is, by determining a target plane on the workpiece; drawing the processing position of the protrusion or groove on the target plane to obtain the position information; processing the workpiece based on the preset accuracy and the position information to obtain the precision workpiece 6; designing and manufacturing a surface pad with a characteristic shape on the PCBA board, and taking the surface pad as the target pad 2, and obtaining the position information of the target pad 2 on the PCBA board; grinding the edge of the PCBA board based on the position information until the edge of the PCBA board is flush with the edge of the target pad 2; determining the surface of the PCBA board after grinding that is close to the precision workpiece 6 to obtain a coating surface; coating the adhesive on the coating surface; placing the PCBA board coated with the adhesive on the precision workpiece 6 until it is aligned with the precision workpiece 6 to obtain a combined workpiece; placing the combined workpiece on the pressing end of the pressure tooling; setting the pressure value and speed of the pressure tooling; the pressure tooling presses the combined workpiece based on the pressure value and the speed to obtain a finished workpiece. By using the above method, the PCBA The target plane of the assembly has horizontal position accuracy. At the same time, if the PCBA is a ring-shaped circuit board, it also has concentricity accuracy within ±5μm.

[0062] The above disclosure is only a preferred embodiment of a high-precision rapid assembly method for a PCB or PCBA printed circuit part of the present invention. Of course, this cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A high-precision rapid assembly method for a PCB printed circuit part, characterized in that: The following steps are involved: Prepare precision workpieces based on preset precision; Obtaining the position information of the target pad on the printed circuit board portion of the PCB; Grinding the edge of the PCB board based on the position information until the edge of the printed circuit portion of the PCB board is flush with the edge of the target pad; Placing the polished PCB board on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece; Pressing the combined workpieces by a pressure tool to obtain a finished workpiece; The specific method of grinding the edge of the PCB board based on the position information until the edge of the printed circuit part of the PCB board is flush with the edge of the target pad is: Using a visual positioning algorithm and a visual positioning device and based on the position information, controlling a grinder to grind the edge of the PCB board until the edge of the printed circuit portion of the PCB board is flush with the edge of the target pad; The specific method of placing the polished PCB board on the precision workpiece until it is aligned with the precision workpiece to obtain the assembled workpiece is: Determine the surface of the polished PCB board close to the precision workpiece to obtain a coated surface; Applying adhesive on the application surface; Placing the PCB board coated with adhesive on the precision workpiece until it is aligned with the precision workpiece to obtain a combined workpiece; The specific method of pressing the combined workpieces by the pressure tool to obtain the finished workpiece is: Placing the combined workpiece on the pressing end of the press tool; Setting the pressure value and speed of the pressure tool; The pressure tool presses the combined workpiece based on the pressure value and the speed to obtain a finished workpiece.

2. The high-precision rapid assembly method of a PCB printed circuit part according to claim 1, characterized in that: The specific method of preparing the precision workpiece based on the preset precision is: Determining a target plane on the workpiece; Drawing the processing position of the protrusion or groove on the target plane to obtain position information; The workpiece is processed based on the preset accuracy and the position information to obtain a high-precision workpiece.

3. A high-precision rapid assembly method for a PCBA printed circuit part, assembled using the high-precision rapid assembly method for a PCB printed circuit part as described in any one of claims 1-2.

Citation Information

Patent Citations

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    CN103209550A

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    CN103400831A