LED display module

Abstract

The present invention provides an LED display module, which includes a PCB substrate, a plurality of LED lamp beads, an ink layer and a sealing layer. The sealing layer is arranged on the surface of the ink layer and the surface and side of the LED lamp beads, and the surface of the sealing layer includes a plurality of protrusions, which are arranged at intervals in the width direction of the PCB substrate, and the widths of at least three adjacent protrusions are different. By setting the widths of at least three adjacent protrusions in the sealing layer to different sizes, the width positions of the light imaging at the protrusions can be made different, so as to eliminate the moiré pattern generated by the spatial frequency of the CCD / CMOS pixel of the camera photosensitive element close to the spatial frequency of the LED display module, improve the contrast of the LED display module, and ensure the better imaging effect of the LED display module.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to an LED display module. Background Art

[0002] The use of LED display screens for virtual studio shooting is an emerging application that has attracted much attention both at home and abroad in recent years. It combines LED display technology and virtual studio shooting technology to bring amazing professional video shooting effects.

[0003] At present, when using photography and video equipment to shoot LED display screens in a virtual studio, some irregular water ripples sometimes appear in the image, affecting the texture of the image. These water ripples are called "moiré" in physics. In addition, since virtual studio shooting has very high requirements on the clarity and color splendour of the LED display screen, and the clarity and color splendour of the screen are achieved by improving the contrast of the LED display screen, when the contrast is low, the clarity and color splendour of the screen are low, which requires the LED display screen to have a high contrast. In view of the above problems, an LED display screen is proposed to solve them. Summary of the invention

[0004] The purpose of the present invention is to solve the technical problems in the prior art that moiré patterns appear on the imaging screen of an LED display screen, the contrast is low, and the user experience is affected.

[0005] In order to solve the above technical problems, the present invention provides an LED display module, which includes a PCB substrate, a plurality of LED lamp beads, an ink layer and a sealing layer, wherein the plurality of LED lamp beads are arranged on the PCB substrate at intervals and distributed in a grid shape, and the LED lamp beads are electrically connected to the PCB substrate; the ink layer covers the surface of the PCB substrate and is arranged between two adjacent LED lamp beads; the sealing layer is arranged on the surface of the ink layer and on the surface and side surfaces of the LED lamp beads; the surface of the sealing layer includes a plurality of protrusions, the plurality of protrusions are arranged at intervals in the width direction of the PCB substrate, a recessed portion on the surface of the sealing layer is formed between two adjacent protrusions, and the widths of at least three adjacent protrusions are different.

[0006] Optionally, in the width direction of the PCB substrate, each of the protrusions corresponds to an integral multiple of the number of the LED lamp beads.

[0007] Optionally, the side surface of the raised portion is flush with the side surface of the PCB substrate or the side surface of the LED lamp bead.

[0008] Optionally, in the width direction of the PCB substrate, the widths of two adjacent recessed portions are different.

[0009] Optionally, the widths of the plurality of recessed portions of the sealing layer are the same.

[0010] Optionally, the height difference between the surface of the protruding portion and the surface of the LED lamp bead is 100 μm-500 μm, and the height difference between the surface of the recessed portion and the surface of the LED lamp bead is 50 μm-300 μm.

[0011] Optionally, the light transmittance of the sealing layer is 80%-99%, and the surface hardness of the sealing layer is 1H-2H; the materials used for the sealing layer include: 60%-80% of base resin, 5%-30% of curing agent and 2%-15% of light diffuser; the particle size of the light diffuser is 2μm-8μm, and the refractive index of the light diffuser is not less than 1.5; the light diffuser is an inorganic light diffuser or an organic light diffuser, the inorganic light diffuser is nano barium sulfate, calcium carbonate or silicon dioxide, and the organic light diffuser is an acrylic light diffuser, a silicone light diffuser or a polyethylene light diffuser.

[0012] Optionally, the LED display module further includes a protective film layer, and the protective film layer covers the surface of the sealing layer.

[0013] Optionally, the material used for the protective film layer includes: 55%-70% UV resin, 5%-10% matting agent, 15%-25% diluent and 5%-10% photopolymerization initiator.

[0014] Optionally, the UV resin includes: a combination of one or more of acrylated epoxy resin, unsaturated polyester, polyurethane gum, polythiol photocuring gum, and polyene photocuring resin; the matting agent includes: a combination of one or more of silicon oxide, barium sulfate, calcium sulfate, calcium carbonate, diatomaceous earth, kaolin, and talcum powder, and the particle size of the matting agent is 10μm-15μm; the diluent includes: styrene, vinyl pyrrolidone, vinyl acetate, butyl acrylate, isooctyl acrylate, hydroxy methacrylate, 6-hexanediol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate , trimethylolpropane triacrylate; the photopolymerization initiator includes: benzoyl formate, polyester acrylate, 2,4,6-trimethylbenzoyl, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-isopropylthioxanthone, 4-dimethylamino-ethyl benzoate, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone. One or more combinations; the thickness of the protective film layer is 150μm-200μm, the transmittance of the protective film layer is 95%-99%, and the surface hardness of the protective film layer is 6H-8H.

[0015] It can be seen from the above technical scheme that the beneficial effects of the present invention are as follows: the LED display module of the present invention includes a PCB substrate, a plurality of LED lamp beads, an ink layer and a sealing layer. The sealing layer is arranged on the surface of the ink layer and the surface and side of the LED lamp beads, and the surface of the sealing layer includes a plurality of protrusions, and the plurality of protrusions are arranged at intervals in the width direction of the PCB substrate, and the widths of at least three adjacent protrusions are different. By setting the widths of at least three adjacent protrusions in the sealing layer to different sizes, the width positions of the light imaging at the protrusions can be made different, so as to eliminate the moiré pattern caused by the spatial frequency of the camera photosensitive element CCD / CMOS pixel being close to the spatial frequency of the LED display module, improve the contrast of the LED display module, and ensure a better imaging effect of the LED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of an embodiment of an LED display module of the present invention.

[0017] Figure 2 yes Figure 1 A top view of the LED display module is shown.

[0018] Figure 3 yes Figure 1 The structural schematic diagram of the LED display module is shown.

[0019] The accompanying drawings are described as follows: 100, LED display module; 10, PCB substrate; 20, LED lamp beads; 30, ink layer; 40, sealing layer; 41, raised portion; 411, first raised portion; 412, second raised portion; 413, third raised portion; 414, fourth raised portion; 415, fifth raised portion; 42, recessed portion; 421, first recessed portion; 422, second recessed portion; 423, third recessed portion; 424, fourth recessed portion; 50, protective film layer. DETAILED DESCRIPTION

[0020] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially used for illustration purposes rather than for limiting the present invention.

[0021] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indications of directions or positional relationships (such as up, down, left, right, front and back, etc.) are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0023] See also Figures 1 to 3 An embodiment of the present application provides an LED display module 100 , including a PCB substrate 10 , a plurality of LED lamp beads 20 , an ink layer 30 and a sealing layer 40 .

[0024] Among them, a plurality of LED lamp beads 20 are arranged on the PCB substrate 10 at intervals and distributed in a grid shape, and the LED lamp beads 20 are electrically connected to the PCB substrate 10. The ink layer 30 covers the surface of the PCB substrate 10 and is arranged between two adjacent LED lamp beads 20. The sealing layer 40 is arranged on the surface of the ink layer 30 and the surface and side of the LED lamp beads 20. The surface of the sealing layer 40 includes a plurality of protrusions 41, and the plurality of protrusions 41 are arranged at intervals in the width direction of the PCB substrate 10. A recessed portion 42 on the surface of the sealing layer 40 is formed between two adjacent protrusions 41, and the widths of at least three adjacent protrusions 41 are different.

[0025] In this embodiment, the PCB substrate 10 can be a cup-shaped substrate, a flat substrate, a multi-layer circuit board substrate, and a multi-layer circuit board substrate with a driver IC. A plurality of pads are provided on the surface of the PCB substrate 10, and the plurality of pads are arranged at intervals and distributed in a grid shape on the PCB substrate 10, and the pads are used to solder and fix the LED lamp beads 20.

[0026] The LED lamp beads 20 are soldered to the pads of the PCB substrate 10 using solder paste, and are electrically connected to the PCB substrate 10 to form an LED light board. A plurality of LED lamp beads 20 are spaced and arranged in a grid on the PCB substrate 10. The LED lamp beads 20 of this embodiment can be either ordinary light-emitting diodes or micro light-emitting diodes (i.e., Mini-LEDs). Compared with mainstream display technologies such as OLED and LCD, Mini-LEDs have higher brightness, resolution and color saturation, lower energy consumption, longer life and faster response speed.

[0027] In this embodiment, the ink layer 30 is formed by inkjet printing, specifically by heating and curing black liquid ink on the LED lamp board. The ink layer 30 covers the surface of the PCB substrate 10 and is arranged in the gap between two adjacent LED lamp beads 20.

[0028] The black liquid ink used in the ink layer 30 of this embodiment includes a base resin, a curing agent, and a black filler. Among them, the base resin is epoxy resin and its modified resin, the curing agent is an amine curing agent, and the black filler is carbon black. The thickness of the ink layer 30 of this embodiment is 10um-50um, and the visible light absorption rate of the ink layer 30 is 95%-98.5%.

[0029] By setting the ink layer 30 on the surface of the PCB substrate 10 and in the gaps between the LED lamp beads 20, the overall contrast of the LED display module 100 can be improved by increasing the blackness of the black screen of the LED display module 100 without sacrificing the brightness of the LED display module 100.

[0030] Furthermore, a sealing layer 40 is provided on the surface of the ink layer 30 and the surface and side of the LED lamp bead 20. The sealing layer 40 is formed by heating and curing a liquid sealing glue on the LED lamp board provided with the ink layer 30. The sealing layer 40 is arranged in a molded packaging manner.

[0031] The solidified liquid sealant can form a wrapping protection on the surface of the ink layer 30 and the surface and side of the LED lamp beads 20, enhance the waterproof and moisture-proof performance of the LED lamp beads 20, and reduce the situation where the LED lamp beads 20 are knocked off, thereby ensuring the normal use of the LED display module 100.

[0032] In this embodiment, the surface of the sealing layer 40 is higher than the surface of the LED lamp bead 20. The surface of the sealing layer 40 includes a plurality of raised portions 41. The plurality of raised portions 41 are arranged at intervals in the width direction of the PCB substrate 10, and a recessed portion 42 on the surface of the sealing layer 40 is formed between two adjacent raised portions 41.

[0033] In the overall thickness direction of the LED display module 100 , the height difference H1 between the surface of the protrusion 41 and the surface of the LED lamp bead 20 is 100 μm-500 μm, and the height difference H2 between the surface of the recess 42 and the surface of the LED lamp bead 20 is 50 μm-300 μm.

[0034] like Figure 3 As shown, the surface of the sealing glue layer 40 of this embodiment includes five protrusions 41 and four recesses 42. Figure 3 In the viewing direction, from left to right, the five protrusions 41 are respectively the first protrusion 411, the second protrusion 412, the third protrusion 413, the fourth protrusion 414 and the fifth protrusion 415, and the four recesses 42 are respectively the first recess 421, the second recess 422, the third recess 423 and the fourth recess 424.

[0035] It can be understood that, in addition to the number of raised portions 41 and recessed portions 42 in the sealing layer 40 shown in this embodiment, in other examples, the number of raised portions 41 and recessed portions 42 can also be designed in other ways, such as six raised portions 41 and five recessed portions 42, nine raised portions 41 and eight recessed portions 42, etc.

[0036] In this embodiment, the lengths of the protrusions 41 and the recesses 42 are the same as the length of the PCB substrate 10. In the width direction of the PCB substrate 10, each protrusion 41 corresponds to an integral number of LED lamp beads 20, and each recess 42 also corresponds to an integral number of LED lamp beads 20. At the same time, the side of the protrusion 41 is flush with the side of the PCB substrate 10 or the side of the LED lamp beads 20.

[0037] Specifically, Figure 2 As shown, the LED lamp beads 20 are distributed in a grid shape on the PCB substrate 10. In this embodiment, the LED lamp beads 20 are arranged in twenty rows and twenty columns on the PCB substrate 10, and twenty LED lamp beads 20 are arranged in each row in the width direction of the PCB substrate 10, that is, on the PCB substrate 10.

[0038] Combination Figure 3 In this embodiment, the first protrusion 411 corresponds to the first LED lamp bead 20 in each row of LED lamp beads 20, that is, the first protrusion 411 covers a column of LED lamp beads 20 in the width direction of the PCB substrate 10. One side of the first protrusion 411 is flush with the side of the PCB substrate 10, and the other side of the first protrusion 411 is flush with the left side of the second LED lamp bead 20 in each row of LED lamp beads 20. The width of the first protrusion 411 is the distance between the outer edge of the PCB substrate 10 and the left side of the second LED lamp bead 20 in each row of LED lamp beads 20.

[0039] The first protrusion 411 and the second protrusion 412 form a first recessed portion 421, and the distance between the first protrusion 411 and the second protrusion 412 is the width of the first recessed portion 421. The first recessed portion 421 of this embodiment corresponds to the second LED lamp bead 20 in each row of LED lamp beads 20, that is, the first recessed portion 421 covers a column of LED lamp beads 20 in the width direction of the PCB substrate 10.

[0040] The second protrusion 412 corresponds to the third and fourth LED lamp beads 20 in each row of LED lamp beads 20, that is, the second protrusion 412 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10. One side of the second protrusion 412 is flush with the left side of the three LED lamp beads 20 in each row of LED lamp beads 20, and the other side of the second protrusion 412 is flush with the left side of the fifth LED lamp bead 20 in each row of LED lamp beads 20, then the width of the first protrusion 411 is the distance between the left side of the third LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the fifth LED lamp bead 20 in each row of LED lamp beads 20.

[0041] The second protrusion 412 and the third protrusion 413 form a second recessed portion 422, and the distance between the second protrusion 412 and the third protrusion 413 is the width of the second recessed portion 422. The second recessed portion 422 of this embodiment corresponds to the fifth and sixth LED lamp beads 20 in each row of LED lamp beads 20, that is, the second recessed portion 422 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10.

[0042] The third protrusion 413 corresponds to the seventh, eighth and ninth LED lamp beads 20 in each row of LED lamp beads 20, that is, the third protrusion 413 covers three columns of LED lamp beads 20 in the width direction of the PCB substrate 10. One side of the third protrusion 413 is flush with the left side of the seventh LED lamp bead 20 in each row of LED lamp beads 20, and the other side of the third protrusion 413 is flush with the left side of the tenth LED lamp bead 20 in each row of LED lamp beads 20, and the width of the third protrusion 413 is the distance between the left side of the seventh LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the tenth LED lamp bead 20 in each row of LED lamp beads 20.

[0043] The third protrusion 413 and the fourth protrusion 414 form a third recessed portion 423, and the distance between the third protrusion 413 and the fourth protrusion 414 is the width of the third recessed portion 423. The third recessed portion 423 of this embodiment corresponds to the tenth, eleventh and twelfth LED lamp beads 20 in each row of LED lamp beads 20, that is, the third recessed portion 423 covers three columns of LED lamp beads 20 in the width direction of the PCB substrate 10.

[0044] The fourth protrusion 414 corresponds to the thirteenth, fourteenth, fifteenth and sixteenth LED lamp beads 20 in each row of LED lamp beads 20, that is, the fourth protrusion 414 covers four columns of LED lamp beads 20 in the width direction of the PCB substrate 10. One side of the fourth protrusion 414 is flush with the left side of the thirteenth LED lamp bead 20 in each row of LED lamp beads 20, and the other side of the fourth protrusion 414 is flush with the left side of the seventeenth LED lamp bead 20 in each row of LED lamp beads 20, then the width of the fourth protrusion 414 is the distance between the left side of the thirteenth LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the seventeenth LED lamp bead 20 in each row of LED lamp beads 20.

[0045] A fourth recessed portion 424 is formed between the fourth protrusion 414 and the fifth protrusion 415, and the distance between the fourth protrusion 414 and the fifth protrusion 415 is the width of the fourth recessed portion 424. The fourth recessed portion 424 of the present embodiment corresponds to the seventeenth and eighteenth LED lamp beads 20 in each row of LED lamp beads 20, that is, the fourth recessed portion 424 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10.

[0046] The fifth raised portion 415 corresponds to the nineteenth and twentieth LED lamp beads 20 in each row of LED lamp beads 20, that is, the fifth raised portion 415 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10. One side of the fifth raised portion 415 is flush with the left side of the nineteenth LED lamp bead 20 in each row of LED lamp beads 20, and the other side of the fifth raised portion 415 is flush with the outer side of the PCB substrate 10, then the width of the fifth raised portion 415 is the distance between the left side of the nineteenth LED lamp bead 20 in each row of LED lamp beads 20 and the outer side of the PCB substrate 10.

[0047] In this embodiment, the first protrusion 411, the second protrusion 412 and the third protrusion 413 are three adjacent protrusions 41, the second protrusion 412, the third protrusion 413 and the fourth protrusion 414 are three adjacent protrusions 41, and the third protrusion 413, the fourth protrusion 414 and the fifth protrusion 415 are three adjacent protrusions 41.

[0048] The width of the first protrusion 411 is the distance between the outer edge of the PCB substrate 10 and the left side of the second LED lamp bead 20 in each row of LED lamp beads 20. The width of the second protrusion 412 is the distance between the left side of the third LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the fifth LED lamp bead 20 in each row of LED lamp beads 20. The width of the third protrusion 413 is the distance between the left side of the seventh LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the tenth LED lamp bead 20 in each row of LED lamp beads 20. The width of the fourth protrusion 414 is the distance between the left side of the thirteenth LED lamp bead 20 in each row of LED lamp beads 20 and the left side of the seventeenth LED lamp bead 20 in each row of LED lamp beads 20. The width of the fifth protrusion 415 is the distance between the left side of the nineteenth LED lamp bead 20 in each row of LED lamp beads 20 and the outer side of the PCB substrate 10.

[0049] In this embodiment, the widths of three adjacent protrusions 41 are different. After being scattered, the light emitted by the LED lamp bead 20 can be imaged on the protrusions 41 of the sealing layer 40. By setting the widths of the three adjacent protrusions 41 in the sealing layer 40 to different sizes, the width positions of the light imaging at the protrusions 41 can be made different in size, so as to eliminate the moiré pattern generated by the spatial frequency of the camera photosensitive element CCD / CMOS pixel being close to the spatial frequency of the LED display module 100, improve the contrast of the LED display module 100, and ensure the better imaging effect of the LED display module 100.

[0050] It can be understood that the width setting of the raised portion 41 shown above is only one example of the LED display module 100 of the present application. In other examples, the number of raised portions 41 and recessed portions 42 in the sealing layer 40 can also be set to other values, and the width of the raised portion 41 can also be set to other values, as long as the widths of at least three adjacent raised portions 41 are different.

[0051] In this embodiment, the first recessed portion 421 covers one column of LED lamp beads 20 in the width direction of the PCB substrate 10. The second recessed portion 422 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10. The third recessed portion 423 covers three columns of LED lamp beads 20 in the width direction of the PCB substrate 10. The fourth recessed portion 424 covers two columns of LED lamp beads 20 in the width direction of the PCB substrate 10.

[0052] Among them, the first recessed portion 421 and the second recessed portion 422 are two adjacent recessed portions 42, the second recessed portion 422 and the third recessed portion 423 are two adjacent recessed portions 42, and the third recessed portion 423 and the fourth recessed portion 424 are two adjacent recessed portions 42. In the width direction of the PCB substrate 10, the widths of the two adjacent recessed portions 42 in this embodiment are different, so as to further ensure that the width positions of the LED lamp beads 20 imaged on the surface of the sealing layer 40 are different, so as to effectively eliminate the moiré phenomenon of the LED display module 100.

[0053] In other examples, the widths of the plurality of recessed portions 42 of the sealing layer 40 may also be set to be the same width, so as to reduce the difficulty of preparing the sealing layer 40 and improve the production efficiency of the LED display module 100 .

[0054] The sealing layer 40 of this embodiment is formed by heating and curing a liquid sealing glue on the LED light board provided with the ink layer 30. The material used in the liquid sealing glue includes 60%-80% of base resin, 5%-30% of curing agent and 2%-15% of light diffuser.

[0055] The base resin of the sealant layer 40 is the same as the base resin of the ink layer 30, which can be epoxy resin and its modified resin. This arrangement can ensure the stability of the combination between the sealant layer 40 and the ink layer 30, and ensure the stability of the overall structure of the LED display module 100.

[0056] The curing agent of the sealing layer 40 can be an acid anhydride curing agent. The light diffuser of the sealing layer 40 is an inorganic light diffuser or an organic light diffuser, wherein the inorganic light diffuser is nano barium sulfate, calcium carbonate or silicon dioxide; the organic light diffuser is an acrylic light diffuser, an organic silicon light diffuser or a polyethylene light diffuser.

[0057] The particle size of the light diffuser of the sealing layer 40 of this embodiment is 2 μm-8 μm, and the refractive index of the light diffuser is not less than 1.5. Under the action of the light diffuser, the sealing layer 40 diffuses the light more evenly during imaging, thereby improving the contrast and clarity of the LED display module 100.

[0058] In this embodiment, the light transmittance of the sealing layer 40 is 80%-99% to improve the contrast of the LED display module 100, so that it presents a bright and vivid display effect, creating a better visual experience for users. The surface hardness of the sealing layer 40 is 1H-2H to effectively ensure the strength of the overall structure of the LED.

[0059] Furthermore, the LED display module 100 of the present embodiment further includes a protective film layer 50, which covers the surface of the sealing layer 40. The protective film layer 50 is used to protect the surface of the sealing layer 40, improve the ability of the sealing layer 40 to resist scratches, dirt, and glare, absorb interference light, and block interference light reflection, thereby eliminating the influence of interference light reflection on the shooting effect, making the LED display effect clearer and more three-dimensional.

[0060] In this embodiment, the protective film layer 50 is formed by placing the material of the protective film layer 50 on the sealing glue layer 40 and curing it through UV irradiation. The protective film layer 50 is arranged in a molded packaging manner. The material used for the protective film layer 50 of this embodiment includes: 55%-70% UV resin, 5%-10% matting agent, 15%-25% diluent and 5%-10% photopolymerization initiator.

[0061] The UV resin includes one or more combinations of acrylated epoxy resin, unsaturated polyester, polyurethane gum, polythiol photocurable gum, and polyene photocurable resin. The matting agent includes one or more combinations of silicon oxide, barium sulfate, calcium sulfate, calcium carbonate, diatomaceous earth, kaolin, and talc, and the particle size of the matting agent is 10 μm-15 μm.

[0062] The diluent includes one or more combinations of styrene, vinyl pyrrolidone, vinyl acetate, butyl acrylate, isooctyl acrylate, hydroxy methacrylate, 6-hexanediol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, and trimethylolpropane triacrylate. The photopolymerization initiator includes one or more combinations of benzoyl formate, polyester acrylate, 2,4,6-trimethylbenzoyl, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-isopropylthioxanthone, 4-dimethylamino-ethyl benzoate, 1-hydroxy-cyclohexyl phenyl ketone, and 2-hydroxy-2-methyl-1-phenyl-1-propanone.

[0063] In this embodiment, the thickness of the protective film layer 50 is 150 μm-200 μm to ensure that the protective film layer 50 provides better protection for the sealing layer 40. The light transmittance of the protective film layer 50 is 95%-99% to improve the contrast of the LED display module 100, so that it presents a bright and beautiful display effect, creating a better visual experience for users. The surface hardness of the protective film layer 50 is 6H-8H to effectively ensure the strength of the overall structure of the LED.

[0064] When preparing the LED display module 100 of this embodiment, the LED lamp beads 20 are first installed on the PCB substrate 10 at intervals to form an LED light board. Then, black liquid ink is set on the surface of the LED light board, and the ink layer 30 is formed by heating and curing. The thickness of the ink layer 30 is less than the height of the LED lamp beads 20. A transparent liquid encapsulating glue is set on the surface of the ink layer 30 and the surface and side of the LED lamp beads 20, and the sealing glue layer 40 is formed by curing. The sealing glue layer 40 covers the LED lamp beads 20 and the ink layer 30. Then, the material of the transparent liquid protective film layer 50 is set on the surface of the sealing glue layer 40, and the protective film layer 50 is formed by UV irradiation and curing, thereby obtaining the LED display module 100.

[0065] After the LED display module 100 is prepared, multiple LED display modules 100 can be spliced ​​together to obtain an LED display screen.

[0066] The LED display module of this embodiment includes a PCB substrate, a plurality of LED lamp beads, an ink layer and a sealing layer. The sealing layer is arranged on the surface of the ink layer and the surface and side of the LED lamp beads, and the surface of the sealing layer includes a plurality of protrusions, and the plurality of protrusions are arranged at intervals in the width direction of the PCB substrate, and the widths of at least three adjacent protrusions are different. By setting the widths of at least three adjacent protrusions in the sealing layer to different sizes, the width positions of the light imaging at the protrusions can be made different, so as to eliminate the moiré pattern generated by the spatial frequency of the camera photosensitive element CCD / CMOS pixel being close to the spatial frequency of the LED display module, improve the contrast of the LED display module, and ensure a better imaging effect of the LED display module.

[0067] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. An LED display module, It is characterized in that include: PCB substrate; A plurality of LED lamp beads are arranged on the PCB substrate at intervals and distributed in a grid shape, and the LED lamp beads are electrically connected to the PCB substrate; An ink layer, covering the surface of the PCB substrate and arranged between two adjacent LED lamp beads; The sealing layer is arranged on the surface of the ink layer and the surface and side of the LED lamp bead; the surface of the sealing layer includes a plurality of protrusions, the plurality of protrusions are arranged at intervals in the width direction of the PCB substrate, a recessed portion on the surface of the sealing layer is formed between two adjacent protrusions, and at least three adjacent protrusions have different widths.

2. The LED display module according to claim 1, It is characterized in that In the width direction of the PCB substrate, each of the protrusions corresponds to an integral multiple of the number of the LED lamp beads.

3. The LED display module according to claim 1, It is characterized in that The side surface of the protrusion is flush with the side surface of the PCB substrate or the side surface of the LED lamp bead.

4. The LED display module according to claim 1, It is characterized in that In the width direction of the PCB substrate, the widths of two adjacent recessed portions are different.

5. The LED display module according to claim 1, It is characterized in that The widths of the plurality of recessed portions of the sealing layer are the same.

6. The LED display module according to claim 1, It is characterized in that The height difference between the surface of the protruding portion and the surface of the LED lamp bead is 100 μm-500 μm, and the height difference between the surface of the recessed portion and the surface of the LED lamp bead is 50 μm-300 μm.

7. The LED display module according to claim 1, It is characterized in that The light transmittance of the sealing layer is 80%-99%, and the surface hardness of the sealing layer is 1H-2H; The materials used in the sealing layer include: 60%-80% of base resin, 5%-30% of curing agent and 2%-15% of light diffusing agent; The particle size of the light diffuser is 2μm-8μm, and the refractive index of the light diffuser is not less than 1.5; the light diffuser is an inorganic light diffuser or an organic light diffuser, the inorganic light diffuser is nano barium sulfate, calcium carbonate or silicon dioxide, and the organic light diffuser is an acrylic light diffuser, a silicone light diffuser or a polyethylene light diffuser.

8. The LED display module according to claim 1, It is characterized in that The LED display module further comprises a protective film layer, and the protective film layer covers the surface of the sealing glue layer.

9. The LED display module according to claim 8, It is characterized in that The materials used in the protective film layer include: 55%-70% UV resin, 5%-10% matting agent, 15%-25% diluent and 5%-10% photopolymerization initiator; The UV resin includes: a combination of one or more of acrylated epoxy resin, unsaturated polyester, polyurethane gum, polythiol photocurable gum, and polyene photocurable resin; the matting agent includes: a combination of one or more of silicon oxide, barium sulfate, calcium sulfate, calcium carbonate, diatomaceous earth, kaolin, and talc, and the particle size of the matting agent is 10 μm-15 μm; The diluent includes: one or more combinations of styrene, vinyl pyrrolidone, vinyl acetate, butyl acrylate, isooctyl acrylate, hydroxy methacrylate, 6-hexanediol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, and trimethylolpropane triacrylate; the photopolymerization initiator includes: one or more combinations of benzoyl formate, polyester acrylate, 2,4,6-trimethylbenzoyl, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-isopropylthioxanthone, 4-dimethylamino-ethyl benzoate, 1-hydroxy-cyclohexyl phenyl ketone, and 2-hydroxy-2-methyl-1-phenyl-1-propanone.

10. The LED display module according to claim 8, It is characterized in that The thickness of the protective film layer is 150 μm-200 μm, the light transmittance of the protective film layer is 95%-99%, and the surface hardness of the protective film layer is 6H-8H.

Images