A processing method for directly connecting to a PCB board

Abstract

The present application discloses a processing method for a directly connected PCB board. Among them, the processing method for the directly connected PCB board includes: providing a circuit board; performing a first etching on a preset area on the surface of the circuit board to thin the copper layer in the preset area; performing a full-board etching on the circuit board after the first etching to thin the copper layer on the entire surface of the circuit board; plating a copper covering layer on the circuit board by using a full-board electroplating process; performing a second etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area; etching the electroplated gold area in the preset area to obtain an area to be gold-plated; flash plating copper on the surface of the area to be gold-plated, and electroplating nickel-gold on the copper layer surface in the area to be gold-plated to increase the contact hardness of the circuit board, thereby obtaining the directly connected PCB board. By the above method, fine lines are made on the surface of the directly connected PCB board.

Description

Technical Field

[0001] This application relates to the technical field of circuit board processing, and particularly to a processing method for a direct-connect PCB board. Background Art

[0002] The direct-connect technology is generally used in the production of inserters and PCBs. The direct-connect PCB board, as an important structure of an electrical interconnection probe, generally includes a high-density interconnect area and an active area. The high-density interconnect area requires the production of fine lines with high precision.

[0003] The industry generally adopts the process of first electroplating copper and then dry film etching to produce the circuit copper layer. However, when the etching pitch and line width are too small, the etching solution cannot penetrate into the pitch, resulting in under-etching. Therefore, it is impossible to produce fine lines with higher precision.

[0004] Therefore, it is necessary to optimize the production process of the circuit copper layer to produce fine lines with higher precision. Summary of the Invention

[0005] The main technical problem to be solved by this application is to provide a processing method for a direct-connect PCB board to produce fine lines with high precision on the surface of the direct-connect PCB board.

[0006] This application provides a processing method for a direct-connect PCB board. The processing method for the direct-connect PCB board includes: providing a circuit board; performing a first etching on a preset area on the surface of the circuit board to thin the copper layer in the preset area; performing a full-board etching on the circuit board after the first etching to thin the copper layer on the entire surface of the circuit board; plating a covering copper layer on the circuit board by using a full-board electroplating process; performing a second etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area; etching a gold-plating area to be formed in the preset area; flash plating copper on the surface of the gold-plating area to be formed, and electroplating nickel-gold on the copper layer surface of the gold-plating area to be formed to increase the contact hardness of the circuit board, so as to obtain the direct-connect PCB board.

[0007] Among them, the step of providing a circuit board includes: providing a circuit board to be processed;

[0008] sticking a tape on a first area on the surface of the circuit board to be processed; laminating an insulating layer on the surface of the first area; laminating thin copper and electroplating a copper layer on the surface of the insulating layer to obtain the circuit board.

[0009] Among them, after flash plating copper on the surface of the area to be gold-plated and electroplating nickel-gold on the copper layer surface of the area to be gold-plated to increase the contact hardness of the circuit board to obtain the direct-connection PCB board, the following steps are further included: drilling holes in the first area on the other surface of the circuit board to obtain open cover holes; using a laser drill to cut along the edge of the first area on the other surface of the circuit board to obtain an open cover contour; using the open cover holes to remove the tape and its surface insulation layer in the first area to obtain a step; wherein, the step and the electroplated nickel-gold are disposed on opposite side surfaces of the circuit board.

[0010] Among them, after the step of flash plating copper on the surface of the area to be gold-plated and electroplating nickel-gold on the copper layer surface of the area to be gold-plated to increase the contact hardness of the circuit board to obtain the direct-connection PCB board, the following steps are included: printing anti-plating oil on the copper layer surface of the preset area to protect the nickel-gold layer and the circuit copper layer.

[0011] Among them, after the step of flash plating copper on the surface of the area to be gold-plated and electroplating nickel-gold on the copper layer surface of the area to be gold-plated to increase the contact hardness of the circuit board to obtain the direct-connection PCB board, the following steps are included: etching the copper layer in the non-preset area; printing green oil on the surfaces of the non-preset area and the preset area to protect the nickel-gold layer and the circuit copper layer on the surface of the circuit board.

[0012] Among them, after the step of printing green oil on the surfaces of the non-preset area and the preset area to protect the nickel-gold layer and the circuit copper layer on the surface of the circuit board, the following steps are included: performing chemical gold immersion treatment on the surface of the non-preset area.

[0013] Among them, the step of providing a circuit board includes: making through holes on the circuit board; resin plugging the through holes and leveling the resin on the surface of the through holes to obtain the circuit board with a flat surface; wherein, through holes are provided on the circuit board; after the step of performing a first etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area, the following steps are further included: leveling the resin on the surface of the through holes in the preset area; after the step of performing a full-board etching on the circuit board after the first etching to thin the copper layer on the entire surface of the circuit board, the following steps are further included: leveling the resin on the surface of the through holes in the preset area; the step of plating a copper covering layer on the circuit board using the full-board electroplating process includes: making the copper covering layer communicate with the through holes to form a connection with the inner-layer copper layer of the circuit board through the through holes.

[0014] Among them, the step of performing a first etching on the preset area of the circuit board surface to thin the copper layer of the preset area includes: pasting an anti-etching film on a part of the surface of the circuit board to expose the preset area; performing a first etching on the preset area of the circuit board surface to thin the copper layer of the preset area by 8 microns; removing the anti-etching film.

[0015] Among them, the step of performing a second etching on the preset area of the circuit board surface to thin the copper layer of the preset area includes: pasting an anti-etching film on a part of the surface of the circuit board to expose the preset area; performing a second etching on the preset area of the circuit board surface to thin the copper layer of the preset area by 8 microns; removing the anti-etching film.

[0016] Among them, the step of flash plating copper on the surface of the area to be gold-plated and electroplating nickel-gold on the area to be gold-plated to increase the contact hardness to obtain the direct-connection PCB board includes: flash plating a 5-micron copper layer on the surface of the area to be gold-plated; electroplating 3 - 8 microns of nickel on the copper layer surface; electroplating 0.762 microns of gold on the surface of the nickel to increase the contact hardness of the circuit board.

[0017] The beneficial effects of this application are as follows: By performing a first etching on the preset area of the circuit board surface to thin the copper layer of the preset area; then using the whole-board etching and whole-board electroplating to make the copper layer on the circuit board surface reach the preset thickness, and making the surface copper layer of the circuit board form an electrical connection with the inner-layer copper layer through vias to ensure the connectivity of the circuit; then performing a second etching on the copper layer of the preset area on the circuit board surface to further thin the copper layer of the preset area; finally, electroplating nickel-gold on the area to be gold-plated in the preset area, increasing the contact hardness, and forming a direct-connection PCB board with high-precision and high-density circuits in the preset area. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic flow chart of the first embodiment of the processing method of the direct-connection PCB board of this application;

[0020] Figure 2 It is a schematic flow chart of the second embodiment of the processing method of the direct-connection PCB board of this application;

[0021] Figure 3 It is a schematic flow chart of the third embodiment of the processing method of the direct-connection PCB board of this application. Detailed implementation manners

[0022] The following will combine with the attached drawings of the specification to detail the solutions of the embodiments of the present application.

[0023] In the following description, specific details such as specific system structures, interfaces, technologies, etc. are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the present application.

[0024] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless clearly indicated otherwise above. "Plural" generally includes at least two, but does not exclude the case of including at least one.

[0025] It should be understood that the term "and / or" used herein is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0026] It should be understood that the terms "including", "comprising" or any other variation used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "including..." do not exclude the existence of additional identical elements in the process, method, article or device including the said elements.

[0027] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present application, then the directional indications are only used to explain the relative position relationship, movement situation, etc. between components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] Referring to "embodiments" herein means that the specific features, structures or characteristics described in combination with the embodiments can be included in at least one embodiment of the present application. The phrase does not necessarily refer to the same embodiment at every position in the specification, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0029] The present application provides a first processing method for directly connecting a PCB board. Specifically, please refer to Figure 1 , Figure 1 , which is a schematic flowchart of the first embodiment of the processing method for directly connecting a PCB board in the present application. As Figure 1 shown, the processing method for directly connecting a PCB board includes:

[0030] Step S11: Provide a circuit board.

[0031] Among them, through holes are provided on the circuit board. The through holes are used to connect the copper layers on the circuit board to form electrical signal connection.

[0032] Before this step, it also includes electroplating copper on the surface of the circuit board to obtain a surface copper layer.

[0033] This step also includes: making through holes on the circuit board; resin plugging the through holes and leveling the resin on the surface of the through holes to obtain a circuit board with a flat surface. Among them, the through holes in the preset area on the circuit board will affect the production of the fine circuit copper layer on the surface of the circuit board. Through whole-board etching and whole-board electroplating, the surface of the through holes in the preset area can be covered with a copper layer, thereby removing the influence of the through holes on the circuit copper layer.

[0034] Step S12: Perform a first etching on the preset area on the surface of the circuit board.

[0035] Through the first etching, the copper layer in the preset area on the surface of the circuit board is thinned. In this embodiment, the copper layer in the preset area is thinned by 8 microns through the etching process. In other embodiments, the thickness of copper reduction can also be designed according to the thickness of the fine circuit.

[0036] This step specifically includes: using the developing and exposing process to make the anti-etching film cover a part of the surface of the circuit board and expose the preset area on the surface of the circuit board. Then perform a first etching on the preset area of the circuit board to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after the first etching.

[0037] After this step, it also includes: leveling the resin on the surface of the through holes in the preset area to obtain a circuit board with a flat surface.

[0038] Step S13: Perform whole-board etching on the circuit board after the first etching.

[0039] Specifically, the copper layer on the surface of the circuit board is integrally thinned to 15 ± 2 microns.

[0040] Step S14: Use the whole-board electroplating process to electroplate a covering copper layer on the circuit board.

[0041] Specifically, a copper covering layer with a thickness of 16 microns is electroplated on the surface of the circuit board to make the copper layer on the surface of the circuit board reach a preset thickness, and the copper layer on the circuit surface covers the surface of the through hole, so that the surface copper layer forms an electrical connection with the inner copper layer through the through hole.

[0042] Step S15: Perform secondary etching on a preset area on the surface of the circuit board.

[0043] Specifically, the copper layer in the preset area is thinned by another 8 microns through the etching process. In other embodiments, the thickness of the copper reduction can also be designed according to the thickness of the fine circuit.

[0044] This step specifically includes: using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the preset area on the surface of the circuit board. Then perform secondary etching on the preset area of the circuit board to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after secondary etching.

[0045] Step S16: Etch out the area to be gold-plated within the preset area.

[0046] Among them, the area to be gold-plated refers to a part of the preset area, and the area of the preset area is larger than the area of the area to be gold-plated.

[0047] This step specifically includes: using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the area to be gold-plated in the preset area on the surface of the circuit board. Then use the etching process to etch the area to be gold-plated to expose the surface area to be gold-plated.

[0048] In another embodiment, it includes using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the non-gold-plating area in the preset area on the surface of the circuit board. Then use the etching process to remove the copper layer in the non-gold-plating area to expose the substrate in the non-gold-plating area, and obtain the copper layer in the area to be gold-plated. Finally, electroplate gold on the surface of the copper layer in the area to be gold-plated.

[0049] Step S17: Flash-plate copper on the surface of the area to be gold-plated and electroplate nickel-gold on the area to be gold-plated to increase the contact hardness of the circuit board, and obtain a direct-connection PCB board.

[0050] Among them, the contact hardness refers to the hardness of the circuit board in contact with other panels. The direct-connection PCB board is a circuit board used to connect the inserter and other board components.

[0051] Specifically, it includes: flashing a copper layer with a thickness of 5 microns in the area to be gold-plated by flash plating process; then electroplating 3 - 8 microns of nickel on the surface of the copper layer by electroplating process, and finally electroplating 0.762 microns of gold on the surface of the nickel to obtain a direct-connect PCB board with a fine-line nickel-gold pattern on the surface. Among them, the fine-line nickel-gold pattern is a high-precision fine-line pattern. Among them, nickel and gold can increase the contact hardness of the circuit board surface.

[0052] In one embodiment, after this step, it further includes: printing anti-plating oil on the surface of the copper layer in the preset area of the circuit board to protect the copper layer in the preset area.

[0053] In another embodiment, after this step, it further includes: etching the copper layer in the non-preset area, and then printing a layer of green oil on the surfaces of both the non-preset area and the preset area to cover the copper layer on the circuit board surface.

[0054] The beneficial effect of this embodiment is: by etching the preset area on the surface of the circuit board once to thin the copper layer in the preset area; then using full-board etching and full-board electroplating to make the copper layer on the surface of the circuit board reach the preset thickness, and making the surface copper layer of the circuit board form an electrical connection with the inner-layer copper layer through vias to ensure the connectivity of the circuit; then etching the copper layer in the preset area on the surface of the circuit board a second time to further thin the copper layer in the preset area; finally electroplating gold on the area to be gold-plated in the preset area to form a direct-connect PCB board with high-precision fine lines in the preset area.

[0055] The present application also provides a second processing method for the direct-connect PCB board. Please refer to Figure 2 , Figure 2 which is a schematic flow chart of the second embodiment of the processing method for the direct-connect PCB board of the present application. As Figure 2 shown, the processing method for the direct-connect PCB board includes:

[0056] Step S21: Provide a circuit board to be processed.

[0057] Among them, the circuit board to be processed includes multiple layers of circuit copper layers and insulating layers. The surface of the circuit board to be processed is a copper layer.

[0058] Step S22: Stick a tape on the first area on the surface of the circuit board to be processed.

[0059] Among them, the first area and the preset area in the previous embodiment are arranged on both sides of the circuit board. Among them, the first area and the preset area can be arranged opposite to each other or offset, which is not limited herein. In this embodiment, the first area to be uncovered is formed by sticking the tape.

[0060] In this step, it further includes leaving the tape in the first area by using the laser milling contour process, and tearing off the tape in the non-first area to obtain the tape in the first area.

[0061] Step S23: Press and bond an insulating layer on the surface of the circuit board to be processed.

[0062] By pressing and bonding an insulating layer on the surface of the circuit board to be processed, the insulating layer is made to cover the tape in the first area and the surface of the copper layer in the non-first area.

[0063] Before this step, it also includes compacting the tape in the first area using a vacuum pressing process to avoid forming protrusions on the circuit board surface.

[0064] Step S24: Press thin copper on the surface of the insulating layer and electroplate a copper layer to obtain a circuit board.

[0065] Among them, copper layers are electroplated on both opposite surfaces of the circuit board, and the tape is located in the middle layer of the circuit board. Fine lines are made on the surface of the circuit board away from the tape.

[0066] Before this step, it also includes: making through holes on the circuit board. Among them, the through holes are on the side away from the tape. The through holes are used to connect the copper layers on the circuit board to form electrical signal connection.

[0067] After this step, it also includes: resin plugging the through holes and leveling the resin on the surface of the through holes to obtain a circuit board with a flat surface and drilled through holes.

[0068] Step S25: Perform a first etching on a preset area on the surface of the circuit board.

[0069] Through the first etching, the copper layer in the preset area on the surface of the circuit board is thinned. In this embodiment, the copper layer in the preset area is thinned by 8 microns through the etching process. In other embodiments, the thickness of copper reduction can also be designed according to the thickness of the fine lines.

[0070] This step specifically includes: using a developing and exposure process to make an anti-etching film cover a part of the surface of the circuit board and expose the preset area on the surface of the circuit board. Then perform a first etching on the preset area of the circuit board to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after the first etching.

[0071] After this step, it also includes: leveling the resin on the surface of the through holes in the preset area to obtain a circuit board with a flat surface.

[0072] Step S26: Perform a full-board etching on the circuit board after the first etching.

[0073] Specifically, the copper layer on the surface of the circuit board is thinned as a whole to 15 ± 2 microns.

[0074] Step S27: Electroplate a covering copper layer on the circuit board using a full-board electroplating process.

[0075] Specifically, a copper covering layer with a thickness of 16 microns is electroplated on the surface of the circuit board to make the copper layer on the surface of the circuit board reach a preset thickness and make the copper layer on the circuit surface cover the surface of the through holes, so that the surface copper layer forms an electrical connection with the inner copper layer through the through holes.

[0076] Step S28: Perform secondary etching on a preset area on the surface of the circuit board.

[0077] Specifically, the copper layer in the preset area is further thinned by 8 microns through the etching process. In other embodiments, the thickness of copper reduction can also be designed according to the thickness of the fine circuit.

[0078] This step specifically includes: using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the preset area on the surface of the circuit board. Then perform secondary etching on the preset area of the circuit board to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after secondary etching.

[0079] Step S29: Etch out the area to be gold-plated within the preset area.

[0080] This step specifically includes: using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the area to be gold-plated in the preset area on the surface of the circuit board. Then use the etching process to etch the area to be gold-plated to expose the surface area to be gold-plated.

[0081] In another embodiment, it includes using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the non-area to be gold-plated in the preset area on the surface of the circuit board. Then use the etching process to remove the copper layer in the non-area to be gold-plated to expose the substrate in the non-area to be gold-plated, and obtain the copper layer in the area to be gold-plated. Finally, electroplate gold on the surface of the copper layer in the area to be gold-plated.

[0082] Step S30: Flash-plate copper on the surface of the area to be gold-plated and electroplate nickel-gold on the area to be gold-plated to increase the contact hardness of the circuit board, and obtain a direct-connection PCB board.

[0083] Specifically, it includes: using the flash-plating process to flash-plate a copper layer with a thickness of 5 microns on the area to be gold-plated; then using the electroplating process to electroplate 3 - 8 microns of nickel on the surface of the copper layer, and finally electroplate 0.762 microns of gold on the surface of the nickel to obtain a direct-connection PCB board with a patterned nickel-gold on the surface. Among them, the patterned nickel-gold is a high-precision fine circuit pattern.

[0084] Step S31: Drill holes in the first area on the other surface of the circuit board to obtain open cover holes.

[0085] Wherein, the other surface of the circuit board refers to the surface opposite to the fine circuit.

[0086] Step S32: Use a laser drill to cut along the edge of the first area on the other surface of the circuit board to obtain an opening profile.

[0087] Step S33: Use the opening hole to remove the tape and the insulating layer and copper layer on its surface in the first area to obtain a step.

[0088] Specifically, with the opening hole as the support point, tear along the opening profile to obtain a sunken step in the first area. Among them, the surface of the first area is metallic copper.

[0089] After this step, it also includes printing anti-plating oil on the surface of the non-first area to protect the surface copper layer of the non-first area.

[0090] The beneficial effect of this embodiment is that by etching a preset area on the surface of the circuit board once to thin the copper layer in the preset area; then using full-board etching and full-board electroplating to make the copper layer on the surface of the circuit board reach the preset thickness, and making the surface copper layer of the circuit board form an electrical connection with the inner-layer copper layer through through-holes to ensure the connectivity of the circuit; then etching the copper layer in the preset area on the surface of the circuit board a second time to further thin the copper layer in the preset area; finally, electroplating gold on the area to be gold-plated in the preset area to form a direct-connection PCB board with high-density fine lines in the preset area. In addition, on the other surface, a step is made by pasting tape, pressing, and then tearing the tape, so that one side surface of the direct-connection PCB board is provided with a high-density interconnection area, and a step is made on the other side surface, making it suitable for between an inserter and a direct-connection PCB.

[0091] The present application also provides a third processing method for a direct-connection PCB board. Please refer to Figure 3 , Figure 3 which is a schematic flow chart of the third embodiment of the processing method for the direct-connection PCB board of the present application. As Figure 3 shown, the processing method for the direct-connection PCB board includes:

[0092] Step S41: Provide a circuit board.

[0093] Among them, the circuit board is a multi-layer board composed of multiple layers of circuit copper layers, and its surface is flat.

[0094] Step S42: Make through-holes on the circuit board.

[0095] By making through-holes on the circuit board, the copper layer on the surface of the circuit board can form a connection with the inner-layer copper layer, and the inner-layer copper layers of different layers can also form a connection.

[0096] Step S43: Resin plug the through-holes and level the resin on the surface of the through-holes to obtain a circuit board with a flat surface and through-holes provided.

[0097] A circuit board with through-holes on the surface is obtained by drilling + resin plugging the holes. Since the through-holes on the circuit board will affect the thickness and fineness of the circuit copper layer on the surface of the circuit board. In order to fabricate fine circuits on a circuit board with through-holes, the circuit board is etched multiple times to thin the copper layer on the surface of the circuit board and the thickness of the through-holes, so that fine circuits can be fabricated on its surface.

[0098] Among them, the through-hole is a common hole on the circuit board, which is used to connect the circuit copper layers of different layers to form a circuit board with circuit conduction.

[0099] Step S44: Etch a preset area on the surface of the circuit board once, and level the resin on the surface of the through-holes in the preset area.

[0100] By etching once, the copper layer in the preset area on the surface of the circuit board is thinned. In this embodiment, the copper layer in the preset area is thinned by 8 microns through the etching process. In other embodiments, the thickness of copper reduction can also be designed according to the thickness of the fine circuit.

[0101] This step specifically includes: using the developing and exposure process to make the anti-etching film cover a part of the surface of the circuit board and expose the preset area on the surface of the circuit board. Then etch the preset area of the circuit board once to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after one etching.

[0102] After this step, it also includes: leveling the resin on the surface of the through-holes in the preset area to obtain a circuit board with a flat surface.

[0103] Step S45: Etch the whole circuit board after one etching, and level the resin on the surface of the through-holes in the preset area.

[0104] Specifically, the copper layer on the surface of the circuit board is thinned as a whole to 15 ± 2 microns.

[0105] Step S46: Use the whole-board electroplating process to electroplate a copper covering layer on the circuit board so that the copper covering layer is connected to the through-holes.

[0106] Specifically, electroplate a copper covering layer with a thickness of 16 microns on the surface of the circuit board to thicken the copper layer on the surface of the circuit board to reach the preset thickness, and make the copper layer on the circuit surface cover the surface of the through-holes, so that the surface copper layer forms an electrical connection with the inner-layer copper layer through the through-holes.

[0107] Step S47: Perform secondary etching on the preset area on the surface of the circuit board.

[0108] Specifically, the copper layer in the preset area is thinned by another 8 microns through the etching process. In other embodiments, the thickness of copper reduction can also be designed according to the thickness of the fine circuit.

[0109] This step specifically includes: using the developing and exposure process to cover a part of the surface of the circuit board with an anti-etching film and exposing a preset area on the surface of the circuit board. Then, perform secondary etching on the preset area of the circuit board to thin the copper layer in the preset area. Finally, remove the anti-etching film to obtain the circuit board after secondary etching.

[0110] Step S48: Etch a gold-plating area to be formed within the preset area.

[0111] This step specifically includes: using the developing and exposure process to cover a part of the surface of the circuit board with an anti-etching film and exposing the gold-plating area to be formed in the preset area on the surface of the circuit board. Then, use the etching process to etch the gold-plating area to be formed to expose the surface area to be gold-plated.

[0112] In another embodiment, it includes using the developing and exposure process to cover a part of the surface of the circuit board with an anti-etching film and exposing the non-gold-plating area in the preset area on the surface of the circuit board. Then, use the etching process to remove the copper layer in the non-gold-plating area to expose the substrate in the non-gold-plating area, obtaining the copper layer in the gold-plating area to be formed. Finally, electroplate gold on the surface of the copper layer in the gold-plating area to be formed.

[0113] Step S49: Flash-plate copper on the surface of the gold-plating area to be formed and electroplate nickel-gold on the gold-plating area to be formed to increase the contact hardness of the circuit board, obtaining a direct-connect PCB board.

[0114] Specifically, it includes: using the flash-plating process to flash-plate a copper layer with a thickness of 5 microns on the gold-plating area to be formed; then using the electroplating process to electroplate 3 - 8 microns of nickel on the surface of the copper layer, and finally electroplating 0.762 microns of gold on the surface of the nickel to obtain a direct-connect PCB board with patterned nickel-gold plated on the surface.

[0115] The beneficial effects of this embodiment are as follows: By performing primary etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area; then using full-board etching and full-board electroplating to make the copper layer on the surface of the circuit board reach the preset thickness and make the surface copper layer of the circuit board form an electrical connection with the inner-layer copper layer through vias to ensure the connectivity of the circuit; then performing secondary etching on the copper layer in the preset area on the surface of the circuit board to further thin the copper layer in the preset area; finally, electroplating gold on the gold-plating area to be formed in the preset area to form a direct-connect PCB board with high-precision and fine lines in the preset area. Through multiple etching operations, while ensuring the connectivity of each layer of the circuit board, fine lines for connecting to other circuit boards are fabricated on the surface of the circuit board.

[0116] The above is only the implementation mode of this application, and it does not limit the patent scope of this application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. A processing method for a directly connected PCB board, characterized in that, the processing method for the directly connected PCB board includes: providing a circuit board; performing a first etching on a preset area on the surface of the circuit board to thin the copper layer in the preset area; performing a full-board etching on the circuit board after the first etching to thin the copper layer on the entire surface of the circuit board; using a full-board electroplating process to electroplate a covering copper layer on the circuit board so that the copper layer on the surface of the circuit board reaches a preset thickness; performing a second etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area; using a developing and exposure process to cover an anti-etching film on a part of the surface of the circuit board and expose the non-gold-plating area in the preset area on the surface of the circuit board; using an etching process to remove the copper layer in the non-gold-plating area to expose the substrate in the non-gold-plating area, obtaining a copper layer in the gold-plating area; flash plating copper on the surface of the gold-plating area and electroplating nickel-gold on the copper layer surface in the gold-plating area to increase the contact hardness of the circuit board, obtaining the directly connected PCB board.

2. The processing method for the directly connected PCB board according to claim 1, characterized in that, the step of providing a circuit board includes: providing a circuit board to be processed; sticking a tape on a first area on the surface of the circuit board to be processed; pressing an insulating layer on the surface of the circuit board to be processed; pressing thin copper on the surface of the insulating layer and electroplating a copper layer to obtain the circuit board.

3. The processing method for the directly connected PCB board according to claim 2, characterized in that, after the step of flash plating copper on the surface of the gold-plating area and electroplating nickel-gold on the copper layer surface in the gold-plating area to increase the contact hardness and obtaining the directly connected PCB board, it further includes: drilling holes in the first area on the other surface of the circuit board to obtain opening holes; using a laser drill to cut along the edge of the first area on the other surface of the circuit board to obtain an opening contour; using the opening holes to remove the tape and its surface insulating layer in the first area to obtain a step; wherein, the step is disposed on opposite two side surfaces of the circuit board with the electroplated nickel-gold.

4. The processing method for the directly connected PCB board according to claim 1, characterized in that, after the step of flash plating copper on the surface of the gold-plating area and electroplating nickel-gold on the copper layer surface in the gold-plating area to increase the contact hardness and obtaining the directly connected PCB board, it includes: printing anti-plating oil on the copper layer surface in the preset area to protect the nickel-gold layer and the circuit copper layer in the preset area.

5. The processing method for the directly connected PCB board according to claim 1, characterized in that, after the step of flash plating copper on the surface of the gold-plating area and electroplating nickel-gold on the copper layer surface in the gold-plating area to increase the contact hardness and obtaining the directly connected PCB board, it includes: etching the copper layer in the non-preset area; printing green oil on the surfaces of the non-preset area and the preset area to protect the nickel-gold layer and the circuit copper layer on the surface of the circuit board.

6. The processing method for the directly connected PCB board according to claim 5, characterized in that, After the step of printing solder mask on the surfaces of the non - preset area and the preset area to protect the nickel - gold layer and the circuit copper layer on the surface of the circuit board, it includes: Perform immersion gold treatment on the surface of the non - preset area.

7. The processing method of the direct - connection PCB board according to claim 1, characterized in that, The step of providing a circuit board includes: Make vias on the circuit board; Resin - plug the vias and plane the resin on the surface of the vias to obtain the circuit board with a flat surface; wherein, vias are provided on the circuit board; After the step of performing a first etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area, it further includes: Plane the resin on the surface of the vias in the preset area; After the step of performing a full - board etching on the circuit board after the first etching to thin the copper layer on the entire surface of the circuit board, it further includes: Plane the resin on the surface of the vias in the preset area; The step of plating a copper - covering layer on the circuit board using the full - board electroplating process includes: Plating a copper - covering layer on the circuit board to connect the copper - covering layer with the vias, so as to form a connection with the inner - layer copper layer of the circuit board through the vias.

8. The processing method of the direct - connection PCB board according to claim 1, characterized in that, The step of performing a first etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area includes: Attach an anti - etching film to a part of the surface of the circuit board to expose the preset area; Perform a first etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area by 8 microns; Remove the anti - etching film.

9. The processing method of the direct - connection PCB board according to claim 1, characterized in that, The step of performing a second etching on the preset area on the surface of the circuit board includes: Attach an anti - etching film to a part of the surface of the circuit board to expose the preset area; Perform a second etching on the preset area on the surface of the circuit board to thin the copper layer in the preset area by 8 microns; Remove the anti - etching film.

10. The processing method of the direct - connection PCB board according to claim 1, characterized in that, The step of flash - plating copper on the surface of the area to be gold - plated and electroplating nickel - gold on the copper layer surface in the area to be gold - plated to increase the contact hardness of the circuit board to obtain the direct - connection PCB board includes: Flash - plate a 5 - micron copper layer on the surface of the area to be gold - plated; Electroplate 3 - 8 microns of nickel on the copper layer surface; Electroplate 0.762 microns of gold on the surface of the nickel to increase the contact hardness of the circuit board.

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