A method for preparing a heat dissipation device for a communication base station housing

Abstract

The present invention discloses a heat dissipation device for a communication base station housing and a preparation method thereof, comprising the following steps: first, assembling a substrate and a fin on the outer surface of the communication base station housing; then preparing a coating slurry, fully mixing hexagonal boron nitride and hollow silicon microspheres in proportion to obtain a coating powder, and evenly mixing the mixed coating powder with a binder to obtain a coating slurry; finally, applying the coating slurry prepared in step 1 to the substrate and the fin, and obtaining a heat dissipation coating after curing. Compared with the traditional communication base station housing, the present invention can not only realize convection heat dissipation, but also utilize the excellent photothermal properties of the heat dissipation coating to transfer the heat generated by the communication equipment to the space and the surrounding cold environment in a radiation manner, thereby realizing the heat dissipation of the communication equipment. The reflectivity of the heat dissipation coating in the solar band can reach 97%, the emissivity in the infrared band can reach 95%, and the thermal conductivity is higher than 2W / mk. The radiation heat dissipation method does not require the input of external energy, and has the advantages of energy saving, environmental protection, and high efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation of communication base stations, and in particular relates to a method for preparing a heat dissipation device for a housing of a communication base station. Background Art

[0002] In recent years, with the rapid development of communication technology, the number of communication base stations has increased sharply. In addition, communication equipment continues to develop in the direction of miniaturization and integration, with higher and higher power and larger and larger heat dissipation required. The natural convection heat dissipation method is difficult to meet the cooling needs of communication equipment, while other cooling methods require energy consumption, which is not conducive to energy conservation and emission reduction. Therefore, seeking a zero-energy efficient cooling method to achieve the cooling of communication equipment has become one of the urgent problems to be solved. Passive passive radiation cooling technology uses space with a temperature close to absolute zero as a cold source, and continuously transfers the heat inside the object to space by radiation heat transfer, while reducing the absorption of solar radiation heat, which can effectively reduce the temperature of the object and achieve the cooling effect. Passive passive radiation cooling technology does not require external energy input, so it has the advantages of zero energy consumption, environmental protection, and high efficiency, and has become one of the current research hotspots. Applying passive passive radiation cooling technology to the field of communication equipment cooling can not only achieve efficient heat dissipation of communication equipment, but also achieve the purpose of reducing the total power consumption of communication base stations.

[0003] The key to passive radiation cooling technology lies in the optical properties of radiation cooling materials. Radiation cooling materials need to have high reflectivity and low absorptivity in the solar band, and high emissivity in the infrared band. At the same time, the cooling material must have good adhesion to the shell of the communication base station, and the material must have good environmental weather resistance. The use of radiation cooling coatings is highly flexible and can be applied on the surface of the object without being restricted by the flatness of the surface of the object to form a coating. However, based on the current research status of radiation cooling coatings at home and abroad, the optical properties of existing coatings are not ideal, the cooling effect is not obvious, the environmental weather resistance of the coating and the strength of the formed coating are not high, and it is difficult to use them outdoors for a long time. Therefore, based on the flexibility of radiation cooling coatings that are easy to apply on the surface of objects, the invention of a radiation cooling coating with high solar reflectivity, high atmospheric window emissivity, simple process, low cost, scalable preparation and good weather resistance has broad application prospects and great significance. Summary of the invention

[0004] The purpose of the present invention is to solve the problems that the optical performance of the existing communication base station heat dissipation coating is not ideal, the cooling effect is not obvious, the environmental weather resistance of the coating and the strength of the formed coating are not high.

[0005] In order to achieve the purpose of the present invention, the present invention discloses a method for preparing a heat dissipation device for a communication base station housing, which is characterized by comprising the following steps:

[0006] Step 1, assembling the substrate and fins on the outer surface of the communication base station housing; the substrate is a plate made of a high thermal conductivity material (such as copper, aluminum), which is used to conduct the heat generated by the heat dissipation device in the communication base station to the outer surface of the substrate; the fins are arranged on the outer surface of the substrate, and are heat sinks made of a high thermal conductivity material; the fins are arranged in an inline, corrugated or windowed shape, which are used to expand the heat dissipation area and enhance the fluid disturbance;

[0007] Step 2, preparing a coating slurry, mixing hexagonal boron nitride and hollow silicon microspheres in proportion to obtain a coating powder, and uniformly mixing the mixed coating powder with a binder to obtain a coating slurry;

[0008] Step 3: Apply the coating slurry prepared in step 2 to the clean, dry, rough outer surface of the substrate and fins of the heat dissipation shell of the communication base station, and obtain the heat dissipation coating after curing.

[0009] Furthermore, the hollow silica microspheres in the coating slurry are prepared by a template removal method, comprising the following steps:

[0010] Step 2-1, using polystyrene nanoparticles as a template, placing the polystyrene nanoparticles in a beaker;

[0011] Step 2-2, add tetraethyl orthosilicate, anhydrous ethanol, deionized water and ammonia solution in a volume ratio of 1:5:4:2 into a beaker, stir magnetically for 10-15 minutes to fully mix the solution, and let it stand for 10-15 hours, so that silicon dioxide is attached to the surface of the polystyrene nanospheres;

[0012] Step 2-3, adding CH3CH2OOCCH3 into the beaker to remove polystyrene, thereby obtaining hollow silica microspheres.

[0013] Furthermore, the binder matrix is ​​one of potassium silicate aqueous solution, acrylic resin, polymethylsiloxane, and polyvinylidene fluoride binder, which is used for bonding the coating powder.

[0014] Furthermore, the hexagonal boron nitride is a flake structure with a thickness ranging from 10 to 100 nm and a diameter ranging from 600 to 900 nm.

[0015] Furthermore, the particle size of the hollow silica microspheres is distributed between 0.5-2.5 μm, and the shell thickness is 100-300 nm.

[0016] Furthermore, the proportion of hexagonal boron nitride and hollow silicon microspheres in the coating powder is not less than 20%.

[0017] Furthermore, in step 2, the volume ratio of the binder to the coating powder is 35-60%.

[0018] Furthermore, the heat dissipation coating has a thickness of 150 μm to 300 μm.

[0019] In order to achieve the purpose of the present invention, the present invention also discloses a communication base station shell heat dissipation device. The communication base station shell includes a substrate and fins. The fins are arranged on the outer surface of the substrate. The substrate and the fin surface are coated with a heat dissipation coating. The heat dissipation coating has high thermal conductivity, high solar reflection, and high infrared emission characteristics, and is used to realize passive radiation cooling function.

[0020] Compared with the prior art, the significant progress of the present invention is as follows: 1) Compared with the traditional communication base station shell, the present invention can not only realize convective heat dissipation, but also utilize the excellent photothermal performance of the heat dissipation coating to reduce the absorption of incident radiation in the solar band, while transferring the heat generated by the communication equipment to the space and the surrounding cold environment in the form of radiation, thereby realizing the heat dissipation of the communication equipment; 2) The heat dissipation coating prepared by the present invention has good optical properties, the reflectivity in the solar band can reach 97%, and the emissivity in the atmospheric window band can reach 95%, which can effectively improve the radiation cooling effect; 3) The hexagonal boron nitride in the present invention can effectively improve the thermal conductivity of the heat dissipation coating and enhance the heat dissipation effect; 4) The hexagonal boron nitride with a flaky structure in this article can effectively improve the backscattering ability in the solar band, and the hexagonal boron nitride has a wide optical band gap to prevent ultraviolet absorption; 5) The hollow silicon microspheres of the present invention can also enhance the backscattering ability in the solar band and improve the cooling reflectivity, and they have optical phonon vibrations in the infrared band, which can enhance the infrared absorption ability; 6) The preparation method of the present invention is simple, low-cost, pollution-free to the environment, easy to mass produce, and can be used on a large area.

[0021] In order to more clearly illustrate the functional characteristics and structural parameters of the present invention, further description is given below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 It is a schematic diagram of the structure of the heat dissipation device of the housing of a communication base station;

[0024] Figure 2 It is a schematic flow chart of a method for preparing a heat dissipation coating of a heat dissipation device for a communication base station housing;

[0025] Figure 3 It is the full-band reflectance spectrum of the heat dissipation coating;

[0026] Figure 4 It is a comparison diagram of the actual heat dissipation effect of the heat dissipation shell of the communication base station of the present invention and the heat dissipation shell not coated with the heat dissipation coating.

[0027] The reference numerals in the figure are: 1, substrate; 2, fins; 3, heat dissipation coating; 4, adhesive; 5, coating powder. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] A heat dissipation device structure of a communication base station housing Figure 1 As shown, the shell of the communication base station includes a substrate 1 and fins 2. The fins 2 are arranged on the outer surface of the substrate 1, and the surfaces of the substrate 1 and the fins 2 are coated with a heat dissipation coating 3. The substrate 1 is a plate made of a high thermal conductivity material, which is used to conduct the heat generated by the heat dissipation equipment in the communication base station to the outer surface of the substrate; the fins 2 are arranged in a straight line, corrugated or windowed shape, which are used to expand the heat dissipation area and enhance fluid disturbance. The heat dissipation coating 3 is made of a coating slurry formed by uniformly mixing a binder 4 and a coating powder 5. It has high thermal conductivity, high solar reflection, and high infrared emission characteristics, and is used to achieve passive radiation cooling function.

[0030] The overall preparation process is as follows Figure 2 As shown, first, the substrate and the fins are assembled on the outer surface of the communication base station shell; then, a coating slurry is prepared, and hexagonal boron nitride and hollow silicon microspheres are fully mixed in proportion to obtain a coating powder, and the mixed coating powder is evenly mixed with a binder to obtain a coating slurry; finally, the coating slurry prepared in step 2 is applied to the substrate and the fins, and a heat dissipation coating is obtained after curing. Example

[0031] A method for preparing a heat dissipation device for a communication base station housing comprises the following steps:

[0032] Step 1: Assemble the base station housing

[0033] An aluminum substrate with high thermal conductivity and corrugated fins are assembled on the outer surface of a communication base station shell; the inner surface of the substrate is closely attached to the heating device in the communication base station, and the corrugated fins are evenly arranged on the outer surface of the substrate.

[0034] Step 2: Prepare coating slurry

[0035] First, polystyrene microspheres with a particle size distribution of 200-2000nm are placed in a beaker, and tetraethyl orthosilicate, anhydrous ethanol, deionized water and ammonia solution are added in a volume ratio of 1:5:4:2 in the beaker, and magnetic stirring is performed for 10-15 minutes to fully mix the solution, and the solution is allowed to stand for 10-15 hours, and silicon dioxide is attached to the surface of the polystyrene nanospheres; CH3CH2OOCCH3 is added to the beaker to remove polystyrene, thereby obtaining hollow silicon microspheres. The obtained hollow silicon microspheres are mixed with hexagonal boron nitride in a mass ratio of 1:1, and the mixture, polyvinylidene fluoride and acetone in a volume ratio of 1:1:1 are added to the beaker, and the coating slurry is obtained after magnetic stirring for 20 minutes.

[0036] Step 3: Prepare heat dissipation coating

[0037] The coating slurry prepared in step 2 is applied to the clean, dry, rough substrate and fins on the outer surface of the heat dissipation shell of the communication base station, and the heat dissipation coating is obtained after curing. Example

[0038] A method for preparing a heat dissipation device for a communication base station housing comprises the following steps:

[0039] Step 1: Assemble the base station housing

[0040] An aluminum substrate with high thermal conductivity and window-type fins are assembled on the outer surface of a communication base station shell; the inner surface of the substrate is closely attached to the heating device in the communication base station, and the window-type fins are evenly arranged on the outer surface of the substrate.

[0041] Step 2: Prepare coating slurry

[0042] First, polystyrene microspheres with a particle size distribution of 200-2000nm are placed in a beaker, and tetraethyl orthosilicate, anhydrous ethanol, deionized water and ammonia solution are added in a volume ratio of 1:5:4:2 in the beaker, and magnetic stirring is performed for 10-15min to fully mix the solution, and the solution is allowed to stand for 10-15h, and silicon dioxide is attached to the surface of the polystyrene nanospheres; CH3CH2OOCCH3 is added to the beaker to remove polystyrene, thereby obtaining hollow silicon microspheres. The obtained hollow silicon microspheres are mixed with hexagonal boron nitride in a mass ratio of 1:2, and a mixture in a volume ratio of 1.5:1:1, potassium silicate water glass and deionized water are added to the beaker, and a coating slurry is obtained after magnetic stirring for 20min.

[0043] Step 3: Prepare heat dissipation coating

[0044] The coating slurry prepared in step 2 is applied to the clean, dry, rough substrate and fins on the outer surface of the heat dissipation shell of the communication base station, and the heat dissipation coating is obtained after curing.

[0045] Figure 3It is a full-band reflection spectrum diagram of the heat dissipation coating. It can be seen from the diagram that the reflectivity of the heat dissipation coating of the present invention in the solar band can reach 97%, and the emissivity in the infrared band can reach 95%, which has an absolute advantage in existing materials. Figure 4 This is a comparison chart of the actual heat dissipation effect of the heat dissipation shell of the communication base station of the present invention and the heat dissipation shell not coated with the heat dissipation coating. It can be seen from the figure that the surface of the heat dissipation shell of the present invention has a lower temperature, so the heat dissipation effect is better, which reflects the technical advantages of the present invention.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a heat dissipation device for a communication base station housing, characterized in that: The following steps are involved: Step 1: assembling the substrate (1) and the fins (2) on the outer surface of the communication base station housing; The substrate (1) is a plate made of a high thermal conductivity material, and is used to conduct heat generated by a heat dissipation device in a communication base station to the outer surface of the substrate; the fins (2) are arranged on the outer surface of the substrate (1), and are heat sinks made of a high thermal conductivity material; the fins (2) are arranged in a straight line, corrugated or windowed shape, and are used to expand the heat dissipation area and enhance fluid disturbance; Step 2, preparing a coating slurry, mixing hexagonal boron nitride and hollow silicon microspheres in proportion to obtain a coating powder (5), and mixing the mixed coating powder (5) and a binder (4) evenly to obtain a coating slurry; Step 3, coating the coating slurry prepared in step 2 onto the clean, dry, rough outer surface of the communication base station heat dissipation housing substrate (1) and fins (2), and curing to obtain a heat dissipation coating (3); The hollow silica microspheres in the coating slurry are prepared by a template removal method, which includes the following steps: Step 2-1, using polystyrene nanoparticles as a template, placing the polystyrene nanoparticles in a beaker; Step 2-2, add tetraethyl orthosilicate, anhydrous ethanol, deionized water and ammonia solution in a volume ratio of 1:5:4:2 into a beaker, stir magnetically for 10-15 minutes to fully mix the solution, and let it stand for 10-15 hours, so that silicon dioxide is attached to the surface of the polystyrene nanospheres; Step 2-3, adding CH3CH2OOCCH3 into the beaker to remove polystyrene, thereby obtaining hollow silica microspheres; The binder (4) has a base selected from the group consisting of potassium silicate aqueous solution, acrylic resin, polymethylsiloxane, and polyvinylidene fluoride binders, and is used for bonding the coating powder (5).

2. A method for preparing a heat dissipation device for a communication base station housing according to claim 1, characterized in that: Hexagonal boron nitride has a flake structure with a thickness ranging from 10 to 100 nm and a diameter ranging from 600 to 900 nm.

3. A method for preparing a heat dissipation device for a communication base station housing according to claim 1, characterized in that: The particle size of the hollow silica microspheres is distributed between 0.5 and 2.5 μm, and the shell thickness is 100 to 300 nm.

4. A method for preparing a heat dissipation device for a communication base station housing according to claim 1, characterized in that: The proportion of hexagonal boron nitride and hollow silicon microspheres in the coating powder (5) is not less than 20%.

5. The method for preparing a heat dissipation device for a communication base station housing according to claim 1, characterized in that: The heat dissipation coating (3) has a thickness of 150 μm to 300 μm.

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