Conductive structures, their preparation methods and applications

Abstract

A conductive structure, its preparation method, and its application are disclosed. The preparation method of the conductive structure includes: forming a plastic substrate; roughening at least one surface of the plastic substrate; coating a metal nanowire layer on the roughened surface; and embedding the metal nanowires into the plastic substrate using a hot-pressing process. This invention removes residual organic matter from the surface of the metal nanowires through the hot-pressing process, allowing the metal nanowires to be fused together to form a metal nanowire mesh structure with excellent conductivity. Simultaneously, the surface of the plastic substrate is softened, but the core still retains a certain supporting strength, allowing the metal nanowire network to be embedded in the intermediate plastic substrate, forming a composite conductive structure. Furthermore, the surface roughening treatment creates a rough, uneven layered structure on the surface of the plastic substrate, providing anchor points or pressing points for the metal nanowires, resulting in stronger bonding.

Description

Technical Field

[0001] This invention relates to the field of conductive structures on plastic substrates, and more particularly to a conductive structure, its preparation method, and its application. Background Technology

[0002] The demand for conductive structures with flexible conductive electrodes is increasing in electronic products, such as touch screens, automobiles, photovoltaics, and lithium batteries.

[0003] Conductive structures on plastic substrates are typically achieved by coating a plastic substrate with an ink containing a conductive metal substance, followed by drying and curing to form a conductive metal layer. Applying this conductive metal layer requires the addition of adhesives to allow the metal particles or wires to adhere to the plastic substrate. This method suffers from low peel strength of the conductive layer, and the addition of adhesives poses a reliability risk.

[0004] Conductive structures on plastic substrates can also be achieved by chemical plating, electroplating, or vacuum sputtering of metal conductive layers onto the plastic substrate; however, this method has high manufacturing costs and low production capacity.

[0005] In view of this, it is necessary to provide a new conductive structure, its preparation method, and its application to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a conductive structure, its preparation method, and its application.

[0007] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0008] A method for preparing a conductive structure includes the following steps:

[0009] Forming a plastic substrate;

[0010] At least one surface of the plastic substrate is subjected to surface roughening treatment;

[0011] A layer of metal nanowires is coated on at least one surface that has undergone surface roughening treatment;

[0012] The metal nanowires are embedded in the plastic substrate using a hot-pressing process.

[0013] Furthermore, the surface roughening process includes at least one of mechanical roughening and chemical roughening.

[0014] Furthermore, mechanical roughening includes: polishing the surface of the plastic substrate by at least one of tumbling, sandblasting, or sandpaper;

[0015] Chemical roughening includes: corroding the surface of a plastic substrate with a strong acid and / or a strong oxidizing compound, or corroding the surface of a plastic substrate with an organic solvent, said organic solvent including at least one of tetrahydrofuran and acetone.

[0016] Furthermore, the surface roughness after surface roughening treatment is between 10 μm and 1000 μm, or the surface roughness after surface roughening treatment is between ±5 μm of the length of the metal nanowire; the surface roughness is the surface roughness in the extension direction of the plastic substrate.

[0017] Furthermore, the portion of the metal nanowires embedded within the plastic substrate accounts for more than 5% of the total.

[0018] Furthermore, the plastic masterbatch and functional particles are blended and then thermoplastically extruded to form the plastic substrate; wherein,

[0019] The plastic masterbatch comprises at least one of the following: polyterephthalate, polyamide, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, polybutylene terephthalate, poly(p-phenylene terephthalate), polypropylene, acrylonitrile-butadiene-styrene copolymer, polyvinyl alcohol formal, polyvinyl butyral, polyurethane, polyurethane, polyacrylonitrile, polyvinyl acetate, polyoxymethylene, phenolic resin, epoxy resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, polysulfone, polyethersulfone, and polyphenylene ether.

[0020] The functional particles include at least one of flame retardants, conductive agents, and antibacterial agents. The flame retardants include at least one of magnesium hydroxide, aluminum hydroxide, ammonium polyphosphate, zinc borate, antimony trioxide, and layered silicates. The conductive agents include at least one of metallic conductive particles and conductive carbon. The antibacterial agents include one or more of glass-carrier inorganic antibacterial agents, isothiazine, and polyguanidine organic antibacterial agents.

[0021] Furthermore, the mass ratio of the plastic masterbatch to the functional particles is 1:1 to 999:1.

[0022] Furthermore, the thickness of the plastic substrate is 1 μm to 5 mm.

[0023] Further, conductive ink containing metal nanowires is coated onto the surface of the plastic substrate and cured to form the metal nanowire layer. The conductive ink includes 0.1wt% to 25wt% metal nanowires, 0.01wt% to 10wt% dispersant, 0.05wt% to 1wt% thickener, 0.01wt% to 0.1wt% surfactant, and the balance being solvent.

[0024] Furthermore, the metal nanowires include one or a mixture of at least two of the following: silver nanowires, copper nanowires, gold nanowires, nickel nanowires, cobalt nanowires, aluminum nanowires, tin nanowires, iron oxide nanowires, copper oxide nanowires, and manganese oxide nanowires.

[0025] The dispersant includes polyvinylpyrrolidone;

[0026] The thickener includes one or more of polyvinyl butyral, hydroxypropyl methylcellulose, and ethylcellulose;

[0027] The surfactants include one or more of the following: Triton, Tween, Spandex, and fluorocarbon compounds;

[0028] The solvent includes one or a mixture of at least two of water, ethanol, and isopropanol.

[0029] Furthermore, the diameter of the metal nanowire is 5 nm to 500 nm, and the length is 5 μm to 200 μm.

[0030] Furthermore, the curing temperature after coating with conductive ink is between 60℃ and 150℃.

[0031] Furthermore, the thickness of the dry film after the conductive ink is cured is 0.001μm to 100μm.

[0032] Furthermore, the hot pressing temperature is 5℃ to 20℃ higher than the heat distortion temperature of the plastic substrate; or, in the hot pressing process, the temperature of the hot pressing roller is 150℃ to 300℃.

[0033] A conductive structure, prepared by the method for preparing the conductive structure.

[0034] Application of the aforementioned conductive structure in optoelectronic devices, photovoltaic devices, touch devices, automobiles, or lithium batteries.

[0035] The beneficial effects of this invention are as follows: The hot-pressing process removes residual organic matter from the surface of the metal nanowires, allowing them to be fused together to form a metal nanowire mesh structure with excellent conductivity. Simultaneously, it softens the surface of the plastic substrate while maintaining internal support strength, embedding the metal nanowire network within the plastic substrate to form a composite conductive structure. Furthermore, by roughening the surface of the plastic substrate before coating the metal nanowire layer, a rough, uneven layered structure is formed on the plastic substrate surface, providing anchor points or pressing points for the metal nanowires, resulting in stronger bonding and a peel strength reaching 5B across 100 cross sections. Attached Figure Description

[0036] Figure 1 It is a cross-cut test pattern using a plastic substrate with an untreated surface to form a conductive structure;

[0037] Figure 2 It is a cross-cut test pattern formed by using a surface-treated plastic substrate to create a conductive structure. Detailed Implementation

[0038] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings.

[0039] The inventors discovered that conductive components based on plastic substrates can be bonded to the plastic substrate using a hot-pressing process. This process is simple and requires no adhesive to achieve the bonding between the metal nanowires and the plastic substrate. Further research revealed that the surface smoothness / roughness of the plastic substrate significantly affects the hot-pressing effect.

[0040] Please see Figure 1 The method for preparing a conductive structure according to a preferred embodiment of the present invention includes the following steps: S1 forming a plastic substrate; S2 roughening at least one surface of the plastic substrate; S3 coating a metal nanowire layer on the roughened surface; and S4 embedding the metal nanowires into the plastic substrate using a hot-pressing process.

[0041] This invention removes residual organic matter from the surface of metal nanowires through a hot-pressing process, allowing the metal nanowires to be fused together and welded to form a metal nanowire mesh structure with excellent conductivity. Simultaneously, it softens the surface of the plastic substrate while maintaining internal support strength, embedding the metal nanowire network into the intermediate plastic substrate to form a composite conductive structure. Furthermore, by roughening the surface of the plastic substrate before coating the metal nanowire layer, a rough, uneven layered structure is formed on the plastic substrate surface, providing anchor points or pressing points for the metal nanowires, resulting in stronger adhesion and a peel strength reaching 5B across 100 cross sections.

[0042] In step S1, the plastic substrate is formed using plastic masterbatch as the raw material through a thermoplastic pressing process. The plastic masterbatch includes one or a combination of at least two of the following: polyterephthalate, polyamide, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, polybutylene terephthalate, poly(p-phenylene terephthalate), polypropylene, acrylonitrile-butadiene-styrene copolymer, polyvinyl alcohol formal, polyvinyl butyral, polyurethane, polyurethane, polyacrylonitrile, polyvinyl acetate, polyoxymethylene, phenolic resin, epoxy resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, polysulfone, polyethersulfone, and polyphenylene ether.

[0043] Preferably, the plastic substrate also contains some functional particles to improve its performance. Specifically, the plastic substrate is formed by thermoplastic extrusion after blending plastic masterbatch and functional particles.

[0044] The functional particles include, but are not limited to, at least one of flame retardants, conductive agents, and antibacterial agents.

[0045] The flame retardant is used to improve the flame retardant properties of the plastic substrate, including but not limited to: one or a combination of at least two of magnesium hydroxide, aluminum hydroxide, ammonium polyphosphate, zinc borate, antimony trioxide and layered silicates.

[0046] The conductive agent is used to improve the conductivity of the plastic substrate, optimizing it from surface conductivity (only on two surfaces) to multi-dimensional bulk conductivity. The conductive adhesive includes at least one of conductive metal particles and conductive carbon. The conductive metal particles include, but are not limited to, at least one of conductive metal particles such as silver, copper, or aluminum. The conductive carbon includes at least one of conductive carbon black, vapor-grown carbon fibers, carbon nanotubes, or Ketjen black.

[0047] The antimicrobial agent is used to enhance the antimicrobial properties of the plastic substrate, aiming to improve the antimicrobial properties of the final application product, such as a touchscreen. The antimicrobial properties include, but are not limited to, one or more of the following: glass-based inorganic antimicrobial agents, isothiazine-based and polyguanidine-based organic antimicrobial agents.

[0048] Furthermore, the mass ratio of the plastic masterbatch to the functional particles is 1:1 to 999:1, and the required functional particles and their content can be selectively added according to product requirements.

[0049] Normally, the thickness of the plastic substrate is determined by the product requirements. Based on this, the present invention takes into account the requirements of subsequent surface roughening processes and hot pressing processes on the plastic substrate, and sets the thickness of the plastic substrate to 0.01mm to 5mm.

[0050] In step S2, the surface roughening process includes, but is not limited to, at least one of mechanical roughening and chemical roughening.

[0051] The mechanical roughening process includes: polishing the surface of the plastic substrate by at least one of tumbling, sandblasting, or sandpaper.

[0052] The chemical roughening process includes: etching the surface of the plastic substrate with strong acids and / or strong oxidizing compounds, for example, roughening the surface of the plastic substrate with chromic acid and / or sulfuric acid. Alternatively, etching the surface of the plastic substrate with an organic solvent, said organic solvent including at least one of tetrahydrofuran and acetone.

[0053] The surface roughness after surface roughening treatment is above 10 μm, preferably 10 μm to 1000 μm. The surface roughness mentioned in this invention refers to the surface roughness in the extension direction of the plastic substrate. For example, after surface roughening, the surface has several "peaks and valleys", and the distance between two "peaks" is above 10 μm, which can provide anchor points or pressing points for metal nanowires and improve the bonding force.

[0054] Further research revealed that surface roughening, once it reaches a certain level, does not significantly improve the bonding force between the nanowires and the plastic substrate; instead, it negatively impacts parameters such as the mechanical strength and light transmittance of the plastic substrate. Preferably, the surface roughness after roughening treatment is within ±5 μm of the length of the metal nanowires.

[0055] In step S3, conductive ink containing metal nanowires is coated onto the surface of the plastic substrate and cured to form the metal nanowire layer.

[0056] Conductive inks can be coated using small roll-to-roll coating machines, inkjet printers, screen printing equipment, or by brushing, spin coating, or other methods.

[0057] The conductive ink comprises 0.1wt% to 25wt% metal nanowires, 0.01wt% to 10wt% dispersant, 0.05wt% to 1wt% thickener, 0.01wt% to 0.1wt% surfactant, and the balance being solvent.

[0058] The metal nanowires include one or a mixture of at least two of the following: silver nanowires, copper nanowires, gold nanowires, nickel nanowires, cobalt nanowires, aluminum nanowires, tin nanowires, iron oxide nanowires, copper oxide nanowires, and manganese oxide nanowires. The diameter of the metal nanowires is 5 nm to 500 nm, and the length is 5 μm to 200 μm.

[0059] The dispersant is used to prevent the aggregation of metal nanowires, including but not limited to polyvinylpyrrolidone.

[0060] The thickener is used to improve the viscosity of conductive ink, its storage stability and coating performance, and includes one or more of polyvinyl butyral, hydroxypropyl methylcellulose and ethylcellulose.

[0061] The surfactant is used to reduce the surface tension of the conductive ink to facilitate coating, and includes one or more of Triton, Tween, Spandex and fluorocarbon compounds.

[0062] The solvent includes one or a mixture of at least two of water, ethanol, and isopropanol.

[0063] After coating with conductive ink, the curing temperature is between 60℃ and 150℃, and the curing time is more than 30 seconds. The thickness of the cured dry film is between 0.001μm and 100μm, and a continuous conductive film layer can be formed.

[0064] Furthermore, when the plastic substrate is coated with conductive ink on both sides, the two conductive inks can be the same, for example, both being silver nanowires, resulting in consistent conductivity on both sides. Alternatively, the two conductive inks can be different; for example, one side may be silver nanowires, while the other side may be a combination of silver nanowires and copper oxide nanowires, creating differentiated conductivity properties.

[0065] In step S4, hot pressing is performed using a hot pressing roller. The surface of the hot pressing roller is required to be covered with a smooth Teflon high-temperature cloth to prevent it from sticking to the metal nanowires and damaging them.

[0066] The hot-pressing temperature is 5℃ to 20℃ higher than the heat distortion temperature of the plastic substrate; or, in the hot-pressing process, the temperature of the hot-pressing roller is 150℃ to 300℃, which can remove residual organic matter on the surface of the metal nanowires, allowing the metal nanowires to melt and weld together under hot pressing, forming a metal nanowire mesh structure with excellent conductivity; at the same time, it softens the surface of the plastic substrate, but the core still has a certain supporting strength, embedding the metal nanowire network into the plastic substrate to form a composite conductive structure. The structure of the plastic substrate encapsulating or partially encapsulating the nanowires can also effectively protect the nanowires from corrosion and oxidation.

[0067] The following specific embodiments provide a detailed description of the solution of the present invention.

[0068] Example 1

[0069] Polyvinyl butyral masterbatch and aluminum hydroxide flame retardant particles are mixed at a mass ratio of 10:1 and then processed into a sheet-like roll of plastic substrate with a thickness of 380μm through thermoplastic extrusion molding.

[0070] Ink preparation: A silver nanowire dispersion was formed by adding 0.15wt% solid content of silver nanowires with a diameter of 30nm and a length of 15μm, 0.025wt% polyvinylpyrrolidone, 0.1wt% carboxymethyl cellulose, and 0.01wt% fluorocarbon surfactant to the remaining solvent. The mixture was stirred at room temperature for 30min to obtain silver nanowire conductive ink.

[0071] First, the surface of the plastic substrate is roughened to a roughness of 15 μm. Then, silver nanowire conductive ink is coated onto the surface of the plastic substrate using a small roll-to-roll coating machine, with a dry film thickness of 10 μm. The coating is then dried at 120°C for 30 s to obtain a pre-dried nanowire conductive layer. After the PVB is wound up, silver nanowire conductive ink is coated onto the uncoated side, with a dry film thickness of 10 μm. The coating is then dried at 120°C for 30 s to obtain a pre-dried double-layer nanowire conductive layer.

[0072] The composite film layer is heated and melted at 200°C, covered with glass on both sides under vacuum, and then completely cured under heat preservation and pressure to obtain PVB laminated glass containing a silver nanowire conductive layer. The silver nanowire conductive network in the laminated glass can be used as a thermal conductive film.

[0073] Example 2

[0074] Polyethylene terephthalate and glass-carrier inorganic antibacterial agent are mixed at a mass ratio of 10:1 and then processed into a sheet-like roll of plastic substrate with a thickness of 10μm through thermoplastic extrusion molding.

[0075] Ink preparation: A silver nanowire dispersion was formed by adding 0.15wt% solid content of silver nanowires with a diameter of 30nm and a length of 15μm, 0.025wt% polyvinylpyrrolidone, 0.1wt% carboxymethyl cellulose, and 0.01wt% fluorocarbon surfactant to the remaining solvent. The mixture was stirred at room temperature for 30min to obtain silver nanowire ink.

[0076] First, the surface of the plastic substrate is roughened to a roughness of 15μm. Then, silver nanowire conductive ink is coated onto the PET surface using a small roll-to-roll coating machine, with a dry film thickness of 2μm. It is then dried at 120℃ for 30s to obtain a pre-dried nanowire conductive layer. After the PET is rolled up, silver nanowire conductive ink is coated onto the other side that is not coated with silver nanowire conductive ink, with a dry film thickness of 2μm. It is then dried at 120℃ for 30s to obtain a pre-dried double-layer nanowire conductive layer.

[0077] The composite film is pressed together using a 300°C hot press roller and then wound into a sheet-like roll, which can be used as a current collector material for lithium batteries. This silver nanowire current collector is lighter than ordinary aluminum foil and copper foil current collectors, which can reduce the weight of the battery pack and increase its specific capacity.

[0078] Comparative Example 1

[0079] The only difference from Example 2 is that the surface of the plastic substrate was not roughened, and the silver nanowire conductive ink was directly coated on the PET surface using a small roll-to-roll coating machine.

[0080] The conductive structures obtained in Comparative Example 1 and Example 2 were tested respectively, as shown below. Figure 1 , Figure 2 As shown.

[0081] Depend on Figure 1 It is known that when using a smooth plastic substrate (PET substrate), the metal nanowires are usually welded together to form a whole, resulting in weak bonding with the plastic substrate, poor interfacial adhesion, and easy peeling.

[0082] Depend on Figure 2 It can be seen that after the surface of the plastic substrate is roughened by the present invention, the rough plastic substrate surface stores a concave-convex layer structure, which can provide anchor points or pressing points for metal nanowires, resulting in stronger bonding force and peel strength reaching 5B across 100 grids.

[0083] The present invention also provides a conductive structure obtained by the above method. Specifically, the conductive structure includes a plastic substrate layer and a metal layer disposed on at least one surface of the plastic substrate layer. The surface on which the metal nanowires are disposed on the plastic substrate has a rough, uneven structure with a roughness of 10 μm or more.

[0084] The conductive structure described in this invention can be applied to optoelectronic devices, photovoltaic devices, touch devices, automobiles, or lithium batteries.

[0085] In summary, the conductive structure fabricated in this case can bond the conductive network and the plastic substrate layer without the need for adhesives. Furthermore, because the conductive network is embedded in the plastic substrate, the entire conductive layer exhibits good peel strength. Additionally, the structure of the plastic substrate encapsulating or partially encapsulating the nanowires effectively protects them from corrosion and oxidation.

[0086] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0087] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing a conductive structure, characterized in that, Includes the following steps: A plastic substrate is formed, with no adhesive on the surface of the plastic substrate; At least one surface of the plastic substrate is subjected to surface roughening treatment; the surface roughness after surface roughening treatment is between 10 μm and 1000 μm, or the surface roughness after surface roughening treatment is between ±5 μm of the length of the metal nanowire. A layer of metal nanowires is coated on at least one surface that has undergone surface roughening treatment; A hot-pressing process is used to embed metal nanowires into the plastic substrate. The hot-pressing temperature is 5°C to 20°C higher than the heat distortion temperature of the plastic substrate to remove residual organic matter on the surface of the metal nanowires. This allows the metal nanowires to melt and weld together under hot pressing, while simultaneously softening the surface of the plastic substrate, thus embedding the metal nanowire network into the plastic substrate. The portion of the metal nanowires embedded within the plastic substrate accounts for more than 5% of the total.

2. The method for preparing the conductive structure as described in claim 1, characterized in that: Surface roughening processes include at least one of mechanical roughening and chemical roughening.

3. The method for preparing the conductive structure as described in claim 2, characterized in that: Mechanical roughening includes: abrading the surface of the plastic substrate by at least one of tumbling, sandblasting, or sandpaper; Chemical roughening includes: corroding the surface of a plastic substrate with a strong acid and / or a strong oxidizing compound, or corroding the surface of a plastic substrate with an organic solvent, said organic solvent including at least one of tetrahydrofuran and acetone.

4. The method for preparing the conductive structure according to claim 1, characterized in that: The plastic substrate is formed by blending plastic masterbatch and functional particles and then performing thermoplastic extrusion; wherein, The plastic masterbatch comprises at least one of the following: polyterephthalate, polyamide, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, polybutylene terephthalate, poly(p-phenylene terephthalate), polypropylene, acrylonitrile-butadiene-styrene copolymer, polyvinyl alcohol formal, polyvinyl butyral, polyurethane, polyurethane, polyacrylonitrile, polyvinyl acetate, polyoxymethylene, phenolic resin, epoxy resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, polysulfone, polyethersulfone, and polyphenylene ether. The functional particles include at least one of flame retardants, conductive agents, and antibacterial agents. The flame retardants include at least one of magnesium hydroxide, aluminum hydroxide, ammonium polyphosphate, zinc borate, antimony trioxide, and layered silicates. The conductive agents include at least one of metallic conductive particles and conductive carbon. The antibacterial agents include one or more of glass-carrier inorganic antibacterial agents, isothiazine, and polyguanidine organic antibacterial agents.

5. The method for preparing the conductive structure as described in claim 4, characterized in that: The mass ratio of the plastic masterbatch to the functional particles is 1:1 to 999:

1.

6. The method for preparing the conductive structure according to claim 1, characterized in that: The thickness of the plastic substrate is 1μm to 5mm.

7. The method for preparing the conductive structure according to claim 1, characterized in that: Conductive ink containing metal nanowires is coated onto the surface of the plastic substrate and cured to form the metal nanowire layer. The conductive ink includes 0.1 wt% to 25 wt% metal nanowires, 0.01 wt% to 10 wt% dispersant, 0.05 wt% to 1 wt% thickener, 0.01 wt% to 0.1 wt% surfactant, and the balance being solvent.

8. The method for preparing the conductive structure as described in claim 7, characterized in that: The metal nanowires include one or a mixture of at least two of the following: silver nanowires, copper nanowires, gold nanowires, nickel nanowires, cobalt nanowires, aluminum nanowires, tin nanowires, iron oxide nanowires, copper oxide nanowires, and manganese oxide nanowires. The dispersant includes polyvinylpyrrolidone; The thickener includes one or more of polyvinyl butyral, hydroxypropyl methylcellulose, and ethylcellulose; The surfactants include one or more of the following: Triton, Tween, Spandex, and fluorocarbon compounds; The solvent includes one or a mixture of at least two of water, ethanol, and isopropanol.

9. The method for preparing the conductive structure as described in claim 1 or 7, characterized in that: The metal nanowires have a diameter of 5 nm to 500 nm and a length of 5 μm to 200 μm.

10. The method for preparing the conductive structure according to claim 7, characterized in that: The curing temperature after coating with conductive ink is between 60℃ and 150℃.

11. The method for preparing the conductive structure according to claim 7, characterized in that: The thickness of the dry film after the conductive ink is cured is 0.001μm to 100μm.

12. A conductive structure, characterized in that, The conductive structure is prepared by the method described in any one of claims 1 to 11.

13. The application of the conductive structure of claim 12 in optoelectronic devices, photovoltaic devices, touch devices, automobiles, or lithium batteries.

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