Interconnect ribbon, solar cell module and method for preparing solar cell module

By alternately arranging of welding zones and heat dissipation zones in the interconnection belt of solar cell modules, the stability problems caused by heat accumulation during welding are solved, and a more stable welding process and a lower component working temperature are achieved.

CN115312613BActive Publication Date: 2025-03-25JA SOLAR TECH YANGZHOU
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Patent Information

Application Number
CN202211057369.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-08-29
Publication Date
2025-03-25
Estimated Expiration
2042-08-29

AI Technical Summary

Technical Problem

During the preparation of solar cell modules, interconnect tape welding causes heat accumulation, causing the interconnect tape to heat up and expand and affect welding stability, increasing the risk of debris and hidden cracks.

Method used

An interconnected belt is designed with alternately arranged welding zones and heat dissipation zones. The conductive baseband runs through multiple welding zones and heat dissipation zones. The solder layer is located in the welding zone and the thermal coating is located in the heat dissipation zone. Through this structure, heat output in the welding zone is reduced and the heat dissipation rate is accelerated.

Benefits of technology

It effectively reduces heat accumulation during welding, ensures the stability of the welding process, avoids deformation of solar cells, reduces the risk of debris and hidden cracks during the preparation process, and improves the working temperature and operation safety of solar cell modules.

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Abstract

The present application provides an interconnection belt, a solar cell module, and a method for preparing a solar cell module. The present application provides an interconnection belt for use in a solar cell module. The interconnection belt has a welding area and a heat dissipation area. In the extension direction of the interconnection belt, multiple welding areas and multiple heat dissipation areas are alternately arranged. The interconnection belt includes: a conductive base belt, which runs through multiple welding areas and multiple heat dissipation areas: a solder layer, which is located in the welding area and covers the circumference of the conductive base belt; a thermal conductive coating, which is located in the heat dissipation area and covers the circumference of the conductive base belt. The thermal conductive coating is electrically insulated from the solder layer and the conductive base belt. On the one hand, reducing the setting of the welding area reduces the heat output during the welding process. On the other hand, the setting of the heat dissipation area speeds up the heat dissipation rate during the welding process and reduces the risk of fragments and hidden cracks during the preparation of the solar cell module.
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Description

Technical Field

[0001] The present application relates to the technical field of solar cells, and in particular to an interconnect ribbon, a solar cell module, and a method for preparing the solar cell module. Background Art

[0002] Solar cell modules require interconnecting ribbons to connect multiple solar cells in series, and the interconnecting ribbons are fixedly connected to the cells by welding. The general interconnecting ribbon welding process of solar cells to form solar cell modules is prone to deformation of the solar cells, thereby affecting the welding stability and increasing the risk of fragmentation and hidden cracks in the preparation process of solar cell modules.

[0003] Therefore, there is an urgent need for an interconnect ribbon, a solar cell module, and a method for preparing the solar cell module. Summary of the invention

[0004] In a first aspect, the present application provides an interconnection ribbon for a solar panel, wherein the interconnection ribbon has a welding area and a heat dissipation area. In the extension direction of the interconnection ribbon, a plurality of welding areas and a plurality of heat dissipation areas are alternately arranged, and the interconnection ribbon comprises:

[0005] Conductive base tape runs through multiple welding areas and multiple heat dissipation areas:

[0006] A solder layer, located in the welding area, covering the circumference of the conductive base tape;

[0007] The thermal conductive coating is located in the heat dissipation area and covers the circumference of the conductive base tape.

[0008] The interconnecting belt provided in the first aspect of the present application is provided with alternately arranged welding areas and heat dissipation areas. On the one hand, the welding area setting is reduced to reduce the heat output during the welding process. On the other hand, the setting of the heat dissipation area accelerates the heat dissipation rate during the welding process, avoiding the accumulation of heat released during the welding process, which causes the interconnecting belt to heat up and expand, and the temperature decreases after the welding is completed, which causes the interconnecting belt to shrink, ensuring the stability of the welding process, avoiding the deformation caused by the interconnecting belt when the solar cells are connected in series into a module, and reducing the risk of fragments and hidden cracks during the preparation of the solar cell module. Furthermore, the interconnecting belt provided in the first aspect of the present application can help reduce the operating temperature of the solar cell module because it has multiple heat dissipation zones, ensuring the safety and stability of the operation of the solar cell module.

[0009] In some optional embodiments of the first aspect of the present application, the thermal conductivity of the thermally conductive coating is ≥450 W / (m·K).

[0010] In some optional embodiments of the first aspect of the present application, the thickness of the thermal conductive coating is 5 μm to 30 μm.

[0011] In some optional embodiments of the first aspect of the present application, the thermally conductive coating is a thermal superconducting ceramic coating.

[0012] In some optional implementations of the first aspect of the present application, in the extension direction of the interconnection ribbon, a plurality of welding regions are centrally symmetrically arranged on the interconnection ribbon.

[0013] In some optional implementations of the first aspect of the present application, in the extension direction of the interconnection ribbon, the heat dissipation areas are disposed on both sides of each welding area.

[0014] In some optional implementations of the first aspect of the present application, a first extension length of the heat dissipation area in the extension direction of the interconnection ribbon is greater than a second extension length of the heat dissipation area in the extension direction of the interconnection ribbon.

[0015] In some optional embodiments of the first aspect of the present application, the thickness of the solder layer is 10 μm to 30 μm, and the solder layer contains tin.

[0016] In some optional embodiments of the first aspect of the present application, the cross-sectional area of ​​the interconnecting ribbon is 0.01 mm 2 ~4mm 2 .

[0017] In some optional implementations of the first aspect of the present application, the interconnection ribbon further includes:

[0018] The anti-corrosion protection layer is located in the heat dissipation area and covers the circumference of the conductive base tape, and is arranged between the conductive base tape and the thermal conductive coating in the radial direction of the interconnect tape.

[0019] In some optional embodiments of the first aspect of the present application, the material of the anti-corrosion protective layer is selected from any one of aluminum, aluminum alloy, nickel and nickel alloy.

[0020] In some optional embodiments of the first aspect of the present application, the melting point of the protective layer is ≥300°C.

[0021] A second aspect of the present application provides a solar cell assembly, comprising:

[0022] a plurality of solar cells; and,

[0023] The interconnecting ribbon is the interconnecting ribbon provided in the first aspect of the present application, wherein the plurality of solar cells are connected in series via the interconnecting ribbon.

[0024] The solar cell module provided in the second aspect of the present application has an operating temperature that is significantly reduced during operation of the solar cell module due to the provision of a heat dissipation zone on the interconnection belt, which is beneficial to the safe and stable operation of the solar cell module, improves the output power and power generation of the solar cell module, and reduces the power generation cost of the solar cell module.

[0025] In some optional implementations of the second aspect of the present application, the solar cell is a back-contact solar cell.

[0026] A third aspect of the present application provides a method for preparing a solar cell module, comprising:

[0027] An interconnecting ribbon is welded to the main grids of a plurality of back-contact solar cells so that the plurality of back-contact solar cells are connected in series, wherein the positive main grid of one of the two adjacent back-contact solar cells is electrically connected to the negative main grid of the other of the two adjacent back-contact solar cells through the interconnecting ribbon, and the interconnecting ribbon is the interconnecting ribbon provided in the first aspect of the present application.

[0028] The method for preparing a solar cell module provided in the third aspect of the present application can effectively reduce the risk of fragmentation and breakage of the back-contact solar cell when preparing the back-contact solar cell module, thereby ensuring the welding stability during the solar cell module manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 is a schematic diagram of the structure of an interconnection belt in an embodiment of the first aspect of the present application;

[0031] Figure 2 is a cross-sectional view of a welding area of ​​an interconnection ribbon in an embodiment of the first aspect of the present application;

[0032] Figure 3 is a cross-sectional view of the heat dissipation area of ​​the interconnection ribbon in an embodiment of the first aspect of the present application;

[0033] Figure 4 is a cross-sectional view of a heat dissipation area of ​​an interconnection ribbon in another embodiment of the first aspect of the present application;

[0034] Figure 5 This is a diagram showing the welding stress and heat conduction of a general interconnect ribbon when it is welded on the back contact solar cell.

[0035] Figure 6 It is a diagram of welding stress and heat conduction when the interconnection ribbon provided in the first aspect of the present application is welded to the back contact solar cell;

[0036] Figure 7is a schematic structural diagram of a back-contact solar cell in a solar cell assembly provided in the second aspect of the present application;

[0037] Figure 8 It is a schematic diagram of the placement of two adjacent back-contact solar cells in the method for preparing a solar cell assembly provided in the third aspect of the present application;

[0038] Fig. 9 It is a partial structural schematic diagram of a solar cell assembly obtained by the method for preparing a solar cell assembly provided in the third aspect of the present application.

[0039] Description of reference numerals:

[0040] 10-interconnection belt; 11-conductive base belt; 12-solder layer; 13-thermal conductive coating; 14-anti-corrosion protection layer; welding area-A; heat dissipation area-B;

[0041] 20-back contact solar cell; 21-silicon substrate; 22-p+ doped region; 23-n+ doped region; 24-passivation anti-reflection layer; 25-positive electrode fine grid; 26-negative electrode fine grid; 27-positive main grid; 28-negative main grid; 29-insulating material. DETAILED DESCRIPTION

[0042] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0043] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0046] The inventors found in their long-term and in-depth research that the battery module needs to use interconnecting ribbons to connect multiple solar cells in series, and the interconnecting ribbons are fixedly connected to the battery cells by welding. When the general interconnecting ribbons are welded to the solar cells, the heat released during the welding process causes the interconnecting ribbons to expand, and after the welding is completed, the interconnecting ribbons shrink due to the drop in temperature, causing the solar cells welded to them to be severely deformed, thereby affecting the welding stability and increasing the risk of fragmentation and hidden cracks during the preparation of solar cell modules.

[0047] In view of this, this application is filed.

[0048] like Figures 1 to 3 As shown, a first aspect of the present application provides an interconnection ribbon 10 for a solar panel. The interconnection ribbon 10 has a welding area A and a heat dissipation area B. In the extension direction of the interconnection ribbon 10, a plurality of welding areas A and a plurality of heat dissipation areas B are alternately arranged. The interconnection ribbon 10 includes:

[0049] The conductive base strip 11 passes through a plurality of welding areas A and a plurality of heat dissipation areas B:

[0050] The solder layer 12 is located in the welding area A and covers the circumference of the conductive base tape 11;

[0051] The thermal conductive coating 13 is located in the heat dissipation area B and covers the circumference of the conductive base tape 11 .

[0052] The interconnecting ribbon 10 provided in the first aspect of the present application is provided with alternately arranged welding areas A and heat dissipation areas B. On the one hand, the reduction of the welding area A domain reduces the heat output during welding, and on the other hand, the provision of the heat dissipation area B accelerates the heat dissipation rate during welding, avoiding the accumulation of heat released during welding, which causes the interconnecting ribbon 10 to heat up and expand, and the temperature decreases after welding, which causes the interconnecting ribbon 10 to shrink, thereby ensuring the stability of the welding process, avoiding the deformation caused by the interconnecting ribbon 10 when the solar cells are connected in series into a module, and reducing the risk of fragments and hidden cracks during the preparation of the solar cell module. Furthermore, the interconnecting ribbon 10 provided in the first aspect of the present application, because it has multiple heat dissipation areas B, can help reduce the operating temperature of the solar cell module, ensuring the safety and stability of the operation of the solar cell module.

[0053] In some embodiments of the first aspect of the present application, the solder layer 12 is in direct contact with the conductive base tape 11 at the peripheral side of the welding area A, and the thermal conductive coating 13 is in direct contact with the conductive base tape 11 at the peripheral side of the heat dissipation area B.

[0054] In some embodiments of the first aspect of the present application, the conductive base tape 11 is a metal conductive base tape 11. In some specific examples, the metal substrate of the conductive base tape 11 is any one of copper, silver or gold, preferably oxygen-free copper, and its copper content is required to be ≥99.9%.

[0055] In some embodiments of the first aspect of the present application, the thermal conductivity of the thermal conductive coating 13 is ≥450 W / (m·K).

[0056] In some embodiments of the first aspect of the present application, the thickness of the thermal conductive coating 13 is 5 μm to 30 μm.

[0057] In some embodiments of the first aspect of the present application, the thermally conductive coating 13 is a thermal superconducting ceramic coating.

[0058] In these embodiments, the thermal superconducting ceramic coating is formed by using a coating material mainly composed of nano-sized rare earth oxides, spinel, boron nitride and diamond-structured carbon.

[0059] In some embodiments of the first aspect of the present application, in the extension direction of the interconnection ribbon 10 , a plurality of welding regions A are centrally symmetrically arranged on the interconnection ribbon 10 .

[0060] In these optional embodiments, the symmetric center of the above-mentioned multiple welding areas A is the center of the interconnecting ribbon 10 in its own extension direction. In these optional embodiments, the central symmetric arrangement of the welding areas A is conducive to ensuring the stability and welding quality of the interconnecting ribbon 10 and the battery cell during the welding process, and ensuring the tight welding between the interconnecting ribbon 10 and the battery cell.

[0061] In some embodiments of the first aspect of the present application, in the extension direction of the interconnection ribbon 10, both sides of each welding area A are connected to each other with heat dissipation areas B. In these embodiments, both sides of each welding area A are connected to each other with heat dissipation areas B, which ensures that the heat generated by the interconnection ribbon 10 during the welding process of each welding area A can obtain efficient and fast heat dissipation effect with similar heat dissipation rate, further improves the welding quality, and avoids the situation where the interconnection ribbon 10 is partially deformed due to uneven heat dissipation during the welding process.

[0062] In some embodiments of the first aspect of the present application, a first extension length of the heat dissipation zone B in the extension direction of the interconnection ribbon is greater than a second extension length of the heat dissipation zone B in the extension direction of the interconnection ribbon. In these optional embodiments, it is beneficial to increase the heat dissipation rate during the welding process and prevent the welding ribbon from expanding during welding and then starting to shrink excessively after welding.

[0063] In some embodiments of the first aspect of the present application, the thickness of the solder layer 12 is 10 μm to 30 μm, and the solder layer 12 contains tin.

[0064] In these embodiments, the solder layer 12 includes tin, a metal commonly used in soldering, and the thickness of the solder layer 12 is designed to ensure soldering stability during the soldering process.

[0065] In some embodiments of the first aspect of the present application, the cross-sectional area of ​​the interconnecting ribbon 10 is 0.01 mm 2 ~4mm 2 .

[0066] In some embodiments of the first aspect of the present application, the cross-section of the interconnection ribbon 10 is circular, elliptical or rectangular.

[0067] like Figure 4 As shown, in some embodiments of the first aspect of the present application, the interconnect ribbon 10 further includes an anti-corrosion protection layer 14 .

[0068] The anti-corrosion protection layer 14 is located in the heat dissipation area B and covers the circumference of the conductive base tape 11. It is arranged between the conductive base tape 11 and the thermal conductive coating 13 in the radial direction of the interconnection tape 10 to provide protection for the conductive base tape 11 in the heat dissipation area B to isolate substances such as water and oxygen.

[0069] In these optional embodiments, in order to prevent the thermal conductive coating 13 in the heat dissipation zone B from having a weaker isolation performance against external water and oxygen than the general solder layer 12, an anti-corrosion coating is provided between the conductive base tape 11 and the thermal conductive coating 13 to prevent the conductive base tape 11 from being corroded, thereby ensuring the long-term operating stability and life of the solar cell module.

[0070] In some optional embodiments of the first aspect of the present application, the material of the anti-corrosion protection layer 14 is selected from any one of aluminum, aluminum alloy, nickel and nickel alloy.

[0071] In some optional embodiments of the first aspect of the present application, the melting point of the protective layer is ≥300°C.

[0072] A second aspect of the present application provides a solar cell assembly, comprising:

[0073] a plurality of solar cells; and,

[0074] The interconnection ribbon 10 is the interconnection ribbon 10 provided in the first aspect of the present application, wherein the plurality of solar cells are connected in series via the interconnection ribbon 10 .

[0075] The solar cell module provided in the second aspect of the present application has an operating temperature that is significantly reduced during operation of the solar cell module due to the provision of the heat dissipation zone B on the interconnection ribbon 10, which is beneficial to the safe and stable operation of the solar cell module, improves the output power and power generation of the solar cell module, and reduces the power generation cost of the solar cell module.

[0076] In some optional implementations of the second aspect of the present application, the solar cell is a back-contact solar cell 20 .

[0077] The inventors discovered in further in-depth research that since the positive and negative electrodes of the back-contact solar cell 20 are both located on the back side of the back-contact cell, when general interconnecting ribbons 10 are welded to the back side of the back-contact solar cell 20, due to the large difference in thermal expansion coefficients between the interconnecting ribbons 10 and the cell, the heat released by welding causes the interconnecting ribbons 10 to expand. After welding, the interconnecting ribbons 10 shrink due to the drop in temperature, which can easily cause serious bending deformation of the back-contact solar cell 20, thereby affecting welding stability and increasing the risk of fragmentation and hidden cracks in the component manufacturing process.

[0078] Figure 5 The figure shows the welding stress and heat conduction of a general interconnect ribbon 10 when it is welded to a back contact solar cell 20. Figure 6 The figure shows the welding stress and heat conduction when the interconnect ribbon 10 provided in the first aspect of the present application is welded to the back contact solar cell 20. Figure 5 and Figure 6It can be seen that the interconnection ribbon 10 provided in the first aspect of the present application is welded to the back contact solar cell 20. The interconnection ribbon 10 provided in the first aspect of the present application is provided with alternately arranged welding areas A and heat dissipation areas B. During the welding process, the heat conductivity Q1 of the heat dissipation area B is greater than the heat conductivity Q2 of the welding area A. On the one hand, the setting of the welding area A is reduced to reduce the heat output during the welding process. On the other hand, the setting of the heat dissipation area B accelerates the heat dissipation rate during the welding process, avoiding the continuous release of heat from the continuous welding area A along the extension direction of the interconnection ribbon 10 itself during the welding process of the general interconnection ribbon 10, and the heat is easy to accumulate and difficult to dissipate, thereby causing the interconnection ribbon 10 to heat up and expand rapidly. Since the interconnection ribbon 10 provided in the present application has a low degree of temperature rise during the welding process and a low degree of temperature drop after the welding is completed, the substantial contraction of the interconnection ribbon 10 after the welding is completed is avoided, and the stability of the welding process is ensured, and the deformation caused by the interconnection ribbon 10 when the solar cells are connected in series into a module is avoided, and the risk of fragments and hidden cracks during the preparation of solar cell modules is reduced. Furthermore, the interconnect ribbon 10 provided in the first aspect of the present application has multiple heat dissipation zones B, which can help reduce the operating temperature of the solar cell module and ensure the safety and stability of the operation of the solar cell module.

[0079] In some embodiments, the back-contact solar cell 20 is an interdigitated back contact (IBC) cell, which is a cell in which both the positive electrode and the negative electrode contact electrodes are placed on the back side of the cell (non-light-receiving side), and the positive electrode and the negative electrode are arranged in an interdigitated manner on the back side of the cell. The light-receiving side of the cell is not blocked by any metal electrode, thereby effectively increasing the short-circuit current of the cell and improving the energy conversion efficiency of the cell.

[0080] A third aspect of the present application provides a method for preparing a solar cell module, comprising:

[0081] An interconnecting ribbon 10 is welded to the main grids of a plurality of back-contact solar cells 20 so that the plurality of back-contact solar cells 20 are connected in series, wherein the positive main grid 27 of one of the two adjacent back-contact solar cells 20 is electrically connected to the negative main grid 28 of the other of the two adjacent back-contact solar cells 20 through the interconnecting ribbon 10, and the interconnecting ribbon 10 is the interconnecting ribbon 10 provided in the first aspect of the present application.

[0082] like Figure 7As shown, in some optional embodiments of the third aspect of the present application, the back contact solar cell 20 includes: a silicon substrate 21, a P+ doped region 22, an n+ doped region 23, a passivation anti-reflection layer 24, a positive electrode fine grid 25, a negative electrode fine grid 26, a positive electrode main grid 27 and a negative electrode main grid 28. The P+ doped region 22 and the n+ doped region 23 are arranged alternately and spaced in the lateral direction and are distributed on the back side of the silicon substrate 21. The passivation anti-reflection layer 24 is arranged on the P+ doped region 22 and the n+ doped region 23 and is located on the side where the back side of the silicon substrate 21 is located. The positive electrode fine grid 25 is arranged on the side of the passivation anti-reflection layer 24 facing away from the silicon substrate 21 and is electrically connected to the P+ doped region 22. The negative electrode fine grid 26 is arranged on the side of the passivation anti-reflection layer 24 facing away from the silicon substrate 21 and is electrically connected to the n+ doped region 23. The positive electrode fine grid 25 and the negative electrode fine grid 26 are arranged alternately and spaced in the lateral direction and are in the same gate line layer.

[0083] The positive electrode main grid 27 is arranged on the side of the first grid line layer where the positive electrode fine grid 25 and the negative electrode fine grid 26 are located, facing away from the silicon substrate 21. The positive electrode main grid 27 extends in the lateral direction, and the positive electrode main grid 27 is electrically connected to the positive electrode fine grid 25. An insulating material is arranged at the contact portion between the positive electrode main grid 27 and the negative electrode fine grid 26, so that the positive electrode main grid 27 and the negative electrode fine grid 26 are insulated from each other. The negative electrode main grid 28 also extends in the lateral direction, and the negative electrode main grid 28 is arranged on the side of the first grid line layer where the positive electrode fine grid 25 and the negative electrode fine grid 26 are located, facing away from the silicon substrate 21, and is arranged alternately with the above-mentioned positive electrode main grid 27 in the longitudinal direction. The negative electrode main grid 28 is electrically connected to the negative electrode fine grid 26. An insulating material 29 is arranged at the contact portion between the negative electrode main grid 28 and the positive electrode fine grid 25, so that the negative electrode main grid 28 and the positive electrode fine grid 25 are insulated from each other.

[0084] like Figure 8 As shown, when a plurality of back-contact solar cells 20 are connected in series using an interconnect ribbon 10, the plurality of back-contact solar cells 20 are arranged in the same direction, and one of two adjacent back-contact solar cells 20 is rotated 180° relative to the other of the two adjacent back-contact solar cells 20 in the plane where the silicon substrate 21 is located, so that the positive main grid 27 of one of the two adjacent back-contact solar cells 20 and the negative main grid 28 of the other of the two adjacent back-contact solar cells 20 are aligned in the arrangement direction of the plurality of back-contact solar cells 20.

[0085] Please refer to Figure 8 and Fig. 9 , welding the interconnection ribbon 10 to the main grids of the above-mentioned multiple back-contact solar cells 20, wherein one interconnection ribbon 10 connects the positive main grid 27 of one of two adjacent contact solar cells and the negative main grid 28 of the other of the two adjacent contact solar cells, and the above-mentioned connection method allows the multiple back-contact solar cells 20 to be connected in series.

[0086] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An interconnection ribbon, characterized in that: For a solar panel, the interconnection belt has a plurality of welding areas and a plurality of heat dissipation areas. In the extension direction of the interconnection belt, the welding areas and the heat dissipation areas are arranged alternately, a heat dissipation area is arranged between every two adjacent welding areas, and a welding area is arranged between every two adjacent heat dissipation areas. The interconnection belt includes: A conductive base strip runs through the plurality of welding areas and the plurality of heat dissipation areas: A solder layer, located in the welding area, circumferentially arranged around the conductive base strip and covering the circumferential side of the conductive base strip; The thermal conductive coating is located in the heat dissipation area, circumferentially arranged around the conductive base strip and covers the circumferential side of the conductive base strip.

2. The interconnect tape according to claim 1, characterized in that: The thermal conductivity of the thermal conductive coating is ≥450 W / (m·K).

3. The interconnect tape according to claim 1, characterized in that: The thickness of the thermal conductive coating is 5 μm to 30 μm.

4. The interconnect tape according to claim 1, characterized in that: The thermal conductive coating is a thermal superconducting ceramic coating.

5. The interconnect tape according to claim 1, characterized in that: In the extending direction of the interconnection belt, the plurality of welding areas are centrally symmetrically arranged on the interconnection belt.

6. The interconnect ribbon according to claim 1, characterized in that: In the extending direction of the interconnection belt, the heat dissipation areas are arranged on both sides of each welding area.

7. The interconnect ribbon according to claim 1, characterized in that: A first extension length of the heat dissipation area in the extension direction of the interconnection ribbon is greater than a second extension length of the welding area in the extension direction of the interconnection ribbon.

8. The interconnect ribbon according to claim 1, characterized in that: The solder layer has a thickness of 10 μm to 30 μm, and the solder layer contains tin.

9. The interconnect ribbon according to claim 1, characterized in that: The cross-sectional area of ​​the interconnecting ribbon is 0.01 mm 2 ~4mm 2 .

10. The interconnect tape according to any one of claims 1 to 9, characterized in that: The interconnecting strip further comprises: The anti-corrosion protection layer is located in the heat dissipation area and covers the circumference of the conductive base tape, and is arranged between the conductive base tape and the thermal conductive coating in the radial direction of the interconnect tape.

11. The interconnect ribbon according to claim 10, characterized in that: The material of the anti-corrosion protection layer is selected from any one of aluminum, aluminum alloy, nickel and nickel alloy.

12. The interconnect ribbon according to claim 10, characterized in that: The melting point of the anti-corrosion protective layer ≥300℃。 13. A solar cell module, characterized in that: include: A plurality of solar cells; as well as, The interconnecting ribbon is the interconnecting ribbon according to any one of claims 1 to 12, wherein the plurality of solar cells are connected in series via the interconnecting ribbon.

14. The solar cell assembly according to claim 13, characterized in that: The solar cell is a back contact solar cell.

15. A method for preparing a solar cell module, characterized in that: include: An interconnecting ribbon is welded to the main grids of a plurality of back-contact solar cells so that the plurality of back-contact solar cells are connected in series, wherein the positive main grid of one of two adjacent back-contact solar cells is electrically connected to the negative main grid of the other of two adjacent back-contact solar cells through the interconnecting ribbon, and the interconnecting ribbon is the interconnecting ribbon as described in any one of claims 1 to 12.

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