Embedded component circuit board and method of manufacturing the same

Abstract

A manufacturing method of an embedded component circuit board includes: providing a flexible double-sided substrate including a first metal layer, a flexible dielectric layer, and a second metal layer; adhering the second metal layer to a carrier plate; forming the first metal layer into a first circuit layer, the first circuit layer including a manufacturing unit including a first circuit region and a second circuit region, the first circuit region including a first connection pad, and the second circuit region including a second connection pad; pressing a plurality of hard dielectric blocks to the flexible dielectric layer to form a hard dielectric layer, the hard dielectric blocks surrounding a space, a first recess and a second recess respectively located on two sides of the space, the first connection pad being exposed from the first recess, and the second connection pad being exposed from the second recess; fixing an electronic component to the first recess; removing the carrier plate; bending the intermediate structure along the space in a manner that the second metal layer faces outward, so that the first circuit region and the second circuit region are opposite and pressed, and the first recess and the second recess are opposite; and forming the second metal layer into a second circuit layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board manufacturing, in particular to an embedded component circuit board and a manufacturing method thereof. BACKGROUND

[0002] The embedded component technology of circuit board is mainly to embed electronic components into the interior of circuit board, so that the circuit board module has the advantages of miniaturization, shortening of the connection path between components, reduction of transmission loss, etc. It is a technical approach that can realize smaller, more portable electronic devices, multifunctional and high performance. The prior art usually first opens a slot on the substrate, embeds the components in the slot, and then laminates the outer substrate for packaging. However, the above process has a heavy load, and the multi-layer circuit needs to be made by pressure and then laminated, which takes a long time. SUMMARY

[0003] Therefore, it is necessary to provide a manufacturing method of embedded component circuit board which is simple in process and saves process time.

[0004] It is also necessary to provide an embedded component circuit board manufactured by the above manufacturing method.

[0005] A manufacturing method of an embedded component circuit board, comprising the following steps:

[0006] Providing a flexible double-sided substrate, comprising a first metal layer, a flexible dielectric layer and a second metal layer which are sequentially laminated;

[0007] The side of the second metal layer in the above flexible double-sided substrate away from the flexible dielectric layer is attached to a carrier plate;

[0008] The first metal layer is subjected to circuit manufacturing to form a first circuit layer, so that the flexible double-sided substrate corresponds to form a flexible circuit substrate, wherein the first circuit layer comprises at least one manufacturing unit, each manufacturing unit comprises a first circuit area and a second circuit area which are spaced apart, the first circuit area comprises at least one first connection pad, and the second circuit area comprises at least one second connection pad;

[0009] A plurality of hard dielectric blocks with uniform thickness are provided corresponding to each manufacturing unit and are pressed onto the side of the flexible dielectric layer away from the second metal layer to form a hard dielectric layer, wherein a plurality of hard dielectric blocks form a space, at least one first recess and at least one second recess, the first connection pad is exposed from the first recess, the second connection pad is exposed from the second recess, and the first recess and the second recess are respectively located on opposite sides of the space;

[0010] A first electronic component is accommodated and fixed in the first recess and electrically connected to the first connection pad;

[0011] removing the carrier plate from one side of the flexible circuit substrate provided with the first electronic component, to obtain an intermediate structure;

[0012] bending the intermediate structure along the interval with the second metal layer outward, so that the first circuit area and the second circuit area are opposite and pressed together, wherein the first groove and the second groove correspond and cooperate to form a receiving cavity; and

[0013] performing circuit manufacturing on the bent second metal layer to correspondingly form a second circuit layer, thereby obtaining the embedded component circuit board.

[0014] An embedded component circuit board manufactured by the manufacturing method.

[0015] The manufacturing method of the embedded component circuit board of the present application omits the process of slotting the flexible circuit substrate by arranging a plurality of hard dielectric blocks of specific shapes on the flexible circuit substrate to form a groove for accommodating electronic components, which is beneficial to simplify the manufacturing process. Moreover, the groove is formed by surrounding the plurality of hard dielectric blocks of specific shapes, which is convenient to adjust the shape and size of the formed groove to accommodate electronic components of different shapes and sizes. Furthermore, the intermediate structure is bent and pressed together to realize packaging of electronic components and form a multi-layer structure, thereby reducing the process steps and saving the process time. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figures 1-10 The manufacturing method of the embedded component circuit board of the present application provides an embodiment.

[0017] MAIN ELEMENT SYMBOL EXPLANATION

[0018]

[0019]

[0020] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0023] Some embodiments of the present application will be described in detail with reference to the drawings. The following embodiments and features can be combined with each other, without conflict.

[0024] Please refer to Figures 1-10 The manufacturing method of the embedded component circuit board of an embodiment of the present application includes the following steps:

[0025] Step S1, please refer to Figure 1 A flexible double-sided substrate 10 is provided, which includes a first metal layer 11, a flexible dielectric layer 13, and a second metal layer 15 stacked in sequence.

[0026] The flexible dielectric layer 13 can include, but is not limited to, at least one of polyimide (PI), liquid crystal polymer (LCP), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the flexible dielectric layer 13 is a polyimide film layer.

[0027] The material of the first metal layer 11 and the second metal layer 15 can be, but is not limited to, at least one of copper, silver, nickel, gold and their alloys.

[0028] In this embodiment, the flexible double-sided substrate 10 can be a double-sided copper-clad plate.

[0029] Step S2, please refer to Figure 2 The flexible double-sided substrate 10 is bonded to a carrier plate 20, wherein the side of the second metal layer 15 away from the flexible dielectric layer 13 is combined with the carrier plate 20.

[0030] Step S3, please refer to Figure 3 The first metal layer 11 is subjected to circuit fabrication to form a corresponding first circuit layer 11a, so that the flexible double-sided substrate 10 forms a corresponding flexible circuit substrate 10a. The first circuit layer 11a includes at least one fabrication unit 110. Each fabrication unit 110 includes spaced first and second circuit regions 111 and 113. The first circuit region 111 includes at least one first connection pad 112, and the second circuit region 113 includes at least one second connection pad 114.

[0031] In the embodiment, each of the manufacturing units 110 further comprises a gap 115 disposed between the first line area 111 and the second line area 113. A portion of the flexible dielectric layer 13 is exposed from the gap 115.

[0032] In the embodiment, the first connection pad 112 and the second connection pad 114 are symmetrically disposed with respect to the gap 115.

[0033] Step S4, please refer to Figure 4a corresponding to each of the manufacturing units 110, a plurality of hard dielectric blocks 30 with uniform thickness are provided and are laminated to the side of the flexible dielectric layer 13 away from the second metal layer 15 to form a hard dielectric layer 30a. Among them, the plurality of hard dielectric blocks 30 surround to form at least one first recess 301 and at least one second recess 303, the first connection pad 112 is exposed from the first recess 301, and the second connection pad 114 is exposed from the second recess 303. Corresponding to each of the manufacturing units 110, the plurality of hard dielectric blocks 30 also surround to form a gap 305. The first recess 301 is located on one side of the gap 305, and the second recess 303 is located on the other side of the gap 305 away from the first recess 301.

[0034] The gap 115 can be at least partially exposed from the gap 305.

[0035] The first recess 301 and the second recess 303 can be mirror-symmetrically disposed with respect to the gap 305.

[0036] In some embodiments, each of the hard dielectric blocks 30 can be substantially in the shape of “┗”, at least two hard dielectric blocks 30 in the shape of “┗” surround to form a first recess 301, and at least two hard dielectric blocks 30 in the shape of “┗” surround to form a second recess 303, and the shape of the first recess 301 and the shape of the second recess 303 are mirror-symmetric with respect to the gap 305. For example, as shown in Figure 4b , two hard dielectric blocks 30 in the shape of “┗” surround to form a rectangular recess; and as shown in Figure 4c , four hard dielectric blocks 30 in the shape of “┗” surround to form a rectangular recess, and the like.

[0037] In some embodiments, each of the hard dielectric blocks 30 can also be in other shapes, as long as the shape of the first recess 301 surrounded and the shape of the second recess 303 surrounded are mirror-symmetric with respect to the gap 305. For example, at least two hard dielectric blocks 30 surround to form a circular recess or a hexagonal recess, and the like.

[0038] Step S5, please refer to Figure 5 The first electronic component 41 is accommodated and fixed in the first groove 301 and electrically connected with the first connection pad 112.

[0039] In the present embodiment, the surface of the first electronic component 41 facing away from the flexible dielectric layer 13 can be lower than the surface of the hard dielectric layer 30a facing away from the flexible dielectric layer 13, so that the first electronic component 41 is completely embedded in the first groove 301.

[0040] In the present embodiment, the above step S5 can further include: accommodating and fixing the second electronic component 43 in the second groove 303 and electrically connecting with the second connection pad 114.

[0041] The surface of the second electronic component 43 facing away from the flexible dielectric layer 13 can be lower than the surface of the hard dielectric layer 30a facing away from the flexible dielectric layer 13, so that the second electronic component 43 is completely embedded in the second groove 303.

[0042] Step S6, please refer to Figure 6 The glue 50 is filled into the first groove 301 provided with the first electronic component 41, so as to further fix the first electronic component 41, the first circuit layer 11a and the hard dielectric layer 30a.

[0043] In the present embodiment, the above step S6 can further include: filling the glue 50 into the second groove 303 provided with the second electronic component 43, so as to further fix the second electronic component 43, the first circuit layer 11a and the hard dielectric layer 30a.

[0044] In some embodiments, the step S6 can also be omitted.

[0045] Step S7, please refer to Figure 7 The carrier plate 20 is removed to obtain an intermediate structure 55.

[0046] In some embodiments, when the first circuit layer 11a includes a plurality of manufacturing units 110, the step S7 can further include, after removing the carrier plate 20, segmenting the flexible circuit substrate 10a including a plurality of the manufacturing units 110 to obtain an intermediate structure 55 corresponding to each of the manufacturing units 110.

[0047] Step S8, please refer to Figure 7 and Figure 8The intermediate structure 55 is bent along the gap 305 outwardly from the second metal layer 15, so that the first circuit area 111 is opposite and pressed to the second circuit area 113. The first part 31a of the hard dielectric layer 30a combined with the first circuit area 111 and the second part 31b of the hard dielectric layer 30a combined with the second circuit area 113 are bonded after pressing. The first groove 301 and the second groove 303 correspond and cooperate to form a receiving cavity 35.

[0048] Step S9, please refer to Figure 8 and Figure 9 The area of the flexible circuit board 10a corresponding to the gap 305 after bending is removed.

[0049] In some embodiments, the above step S9 can also be omitted.

[0050] Step S10, please refer to Figure 10 The second metal layer 15 after bending is subjected to circuit manufacturing, so that the second metal layer 15 corresponds to form a second circuit layer 15a, and then the inner embedded component circuit board 100 is obtained.

[0051] In this embodiment, at least one conductive hole 17 can also be formed to electrically connect the first circuit layer 11a and the second circuit layer 15a when the second metal layer 15 after bending is subjected to circuit manufacturing.

[0052] The manufacturing method of the inner embedded component circuit board of the present application omits the process of slotting the flexible circuit board 10a by arranging a plurality of hard dielectric blocks 30 of specific shapes on the flexible circuit board 10a to form a recess for accommodating electronic components, which is beneficial to simplify the manufacturing process. Moreover, the recess is formed by a plurality of hard dielectric blocks 30 of specific shapes, which is convenient to adjust the shape and size of the recess formed, so as to accommodate electronic components of different shapes and sizes. In addition, the intermediate structure 55 is bent and pressed, which realizes packaging electronic components and forms a multi-layer structure, thereby reducing the process steps and saving the process time.

[0053] Further, the gap 305 formed by the void 115 and the plurality of hard dielectric blocks 30 corresponding to each manufacturing unit 110 is at least partially exposed from the gap 305, which is beneficial to the subsequent bending and pressing of the intermediate structure 55, and further beneficial to the stability of the structure of the inner embedded component circuit board 100 subsequently manufactured.

[0054] Further, the first recess 301 and the second recess 303 can be mirror-symmetrically arranged compared to the interval 305, which is advantageous for the complete correspondence of the first recess 301 and the second recess 303 when the intermediate structure 55 is subsequently bent and press-bonded, thereby being advantageous for reducing the risk of damage of the electronic components in the recesses.

[0055] Further, the surface of the second electronic component 43 away from the flexible dielectric layer 13 can be lower than the surface of the hard dielectric layer 30a away from the flexible dielectric layer 13, which is advantageous for further reducing the risk of damage of the electronic components in the recesses when the intermediate structure 55 is bent and press-bonded.

[0056] The above description is only the preferred embodiments of the present application, and is not intended to limit the present application in any form. Although the present application has been disclosed as the preferred embodiments above, it is not intended to limit the present application, and any person skilled in the art can make some changes or modifications to the above disclosed technical contents without departing from the technical solution of the present application, and any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A method for manufacturing an embedded component circuit board, comprising the steps of: providing a flexible double-sided substrate, comprising a first metal layer, a flexible dielectric layer and a second metal layer stacked in sequence; adhering the second metal layer of the flexible double-sided substrate to a carrier plate; performing circuit fabrication on the first metal layer to form a first circuit layer, so that the flexible double-sided substrate corresponds to form a flexible circuit substrate, wherein the first circuit layer comprises at least one fabrication unit, each fabrication unit comprises a first circuit region and a second circuit region separated by a gap, the first circuit region comprises at least one first connection pad, and the second circuit region comprises at least one second connection pad; providing a plurality of hard dielectric blocks with uniform thickness corresponding to each fabrication unit and pressing the hard dielectric blocks to the side of the flexible dielectric layer away from the second metal layer to form a hard dielectric layer, wherein the plurality of hard dielectric blocks form a gap, at least one first recess and at least one second recess, the first connection pad is exposed from the first recess, the second connection pad is exposed from the second recess, and the first recess and the second recess are located on opposite sides of the gap, respectively; accommodating and fixing a first electronic component in the first recess and electrically connecting the first electronic component to the first connection pad; removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component to obtain an intermediate structure; bending the intermediate structure along the gap with the second metal layer outward, so that the first circuit region and the second circuit region are opposite and pressed together, wherein the first recess and the second recess correspond and cooperate to form a receiving cavity; and performing circuit fabrication on the bent second metal layer to form a second circuit layer, thereby obtaining the embedded component circuit board. Each fabrication unit further comprises a gap between the first circuit region and the second circuit region, and a part of the flexible dielectric layer is exposed from the gap; at least part of the gap is exposed from the gap. The first recess and the second recess are mirror-symmetrically arranged relative to the gap. Before the step of removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component to obtain an intermediate structure, the method further comprises: filling glue into the first recess provided with the first electronic component. Before the step of removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component to obtain an intermediate structure, the method further comprises: accommodating and fixing a second electronic component in the second recess and electrically connecting the second electronic component to the second connection pad. Before the step of removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component to obtain an intermediate structure, the method further comprises: filling glue into the second recess provided with the second electronic component. The surface of the first electronic component away from the flexible dielectric layer is lower than the surface of the hard dielectric layer away from the flexible dielectric layer, and the surface of the second electronic component away from the flexible dielectric layer is lower than the surface of the hard dielectric layer away from the flexible dielectric layer. ​ ​ 2. The method of manufacturing a buried inductor circuit board according to claim 1, wherein ​ 3. The method of manufacturing a buried inductor circuit board according to Claim 1, wherein ​ 4. The method of manufacturing a buried inductor circuit board according to Claim 1, wherein ​ ​ 5. The method of manufacturing a buried inductor circuit board according to Claim 1, wherein ​ ​ 6. The method of manufacturing a buried inductor circuit board according to claim 5, wherein ​ ​ 7. The method of manufacturing a buried inductor circuit board according to claim 5, wherein ​ 8. The method of manufacturing a buried inductor circuit board according to Claim 1, wherein The first circuit layer includes a plurality of manufacturing units, and the step of "removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component to obtain an intermediate structure" specifically includes: removing the carrier plate from the side of the flexible circuit substrate provided with the first electronic component; and segmenting the flexible circuit substrate including a plurality of the manufacturing units to obtain an intermediate structure corresponding to each of the manufacturing units.

9. The method of manufacturing a buried inductor circuit board according to Claim 1, wherein Before the step of "performing circuit manufacturing on the bent second metal layer to form a second circuit layer, and then obtaining the embedded component circuit board", it further includes: removing the area of the bent flexible circuit substrate corresponding to the interval.

10. An embedded component circuit board manufactured by the method according to any one of claims 1 to 9.

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