Terminal, substrate connector, and method for manufacturing terminal

Abstract

To provide a terminal and a connector for a substrate with improved connectivity simply. A terminal (20A, 20B) includes: a terminal body (30) extending from one end (21) to the other end (22) and having a quadrilateral cross section; a terminal contact portion (40) provided on the one end (21) side of the terminal body (30) and contacting an opposite terminal (T); and a substrate contact portion (50) provided on the other end (22) side of the terminal body (30) and contacting a substrate (B), of four faces of the terminal body (30), two faces facing opposite directions to each other are plated faces (23) having plating layers, and the plated face (23) of the terminal contact portion (40) and the plated face (23) of the substrate contact portion (50) face different directions from each other.

Description

Technical Field

[0001] This disclosure relates to terminals, connectors for substrates, and methods for manufacturing terminals. Background Technology

[0002] Patent Document 1 discloses a connector for a substrate. The connector's terminals are formed by bending a sheet of metal after punching. Each terminal has a plate-shaped mounting portion, a contact portion and a bridging portion integrally formed on the opposite side of the mounting portion, and a plate-shaped solder portion integrally formed with the bridging portion. Patent Document 2 also discloses a similar connector for a substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2000-68014

[0006] Patent Document 2: Japanese Patent Application Publication No. 2000-77120 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in connection areas such as splice sections and welded sections, plating is pre-applied to improve connection reliability. In this case, considering the workability and cost of the plating process, it is preferable to perform plating before the metal sheet is punched (pre-plating treatment). However, according to the pre-plating treatment, the surface of the metal sheet becomes the plating surface, but the cut surface (thickness surface) after punching does not become the plating surface. If the cut surface of the connection becomes the main surface for achieving connection with the opposite conductor, connection reliability may not be guaranteed.

[0009] Therefore, this disclosure aims to provide a simple technique that improves the connectivity of terminals. Additionally, it aims to provide a manufacturing method for producing such terminals.

[0010] Solution for solving the problem

[0011] The terminal disclosed herein comprises: a terminal body extending from one end to the other with a quadrilateral cross-section; a terminal contact portion disposed on one end of the terminal body and in contact with a terminal on the opposite side; and a substrate contact portion disposed on the other end of the terminal body and in contact with a substrate. Among the four surfaces surrounding the terminal body, two surfaces facing opposite directions are formed as plating surfaces with plating layers, and the plating surfaces of the terminal contact portion and the plating surfaces of the substrate contact portion face different directions.

[0012] The connector for a substrate disclosed herein includes the aforementioned terminals, wherein the plated surface of the terminal contact portion is disposed on the side that contacts the contact portion of the opposite terminal, and the plated surface of the substrate contact portion is disposed upright from the surface of the substrate.

[0013] Furthermore, the terminal manufacturing method disclosed herein is the same as the terminal manufacturing method described above, comprising the steps of plating two surfaces of a plate-shaped metal material to form the plating surfaces; cutting the metal material having the plating surfaces to obtain a terminal body base material along the two surfaces; and performing a process to make the orientation of the plating surfaces different between the portion of the terminal body base material that can become the terminal contact portion and the portion that can become the substrate contact portion.

[0014] Invention Effects

[0015] According to this disclosure, connectors for terminals and substrates with improved connectivity can be easily provided. Attached Figure Description

[0016] Figure 1 This is a longitudinal sectional view of the connector for the substrate according to the embodiment.

[0017] Figure 2 yes Figure 1 A sectional view along line AA.

[0018] Figure 3 This is a rear view of the connector for the substrate.

[0019] Figure 4 This is a diagram showing the substrate contact area cut open and viewed from the rear.

[0020] Figure 5 This is a three-dimensional diagram showing the terminals.

[0021] Figure 6 It is a three-dimensional view showing the base material of the terminal body. Detailed Implementation

[0022] [Description of embodiments of this disclosure]

[0023] First, the implementation methods of this disclosure are listed and explained.

[0024] The terminals disclosed herein,

[0025] (1) The terminal body comprises: a quadrilateral-shaped terminal body extending from one end to the other; a terminal contact portion disposed at one end of the terminal body and in contact with a counter-terminal; and a substrate contact portion disposed at the other end of the terminal body and in contact with a substrate. Two of the four surfaces surrounding the terminal body, facing opposite directions, are formed as plating surfaces. The plating surfaces of the terminal contact portion and the substrate contact portion face different directions. According to this structure, even if the plating surfaces of the terminal body are formed through a pre-plating process, because the plating surfaces of the terminal contact portion and the substrate contact portion face different directions, a state can be achieved where the terminal contact portion is in conductive contact with the counter-terminal through the plating surface, and the substrate contact portion is in conductive contact with the substrate through the plating surface. As a result, the contact area between the substrate contact portion and the substrate can be easily ensured, improving the connectivity of the terminal.

[0026] (2) In the above structure, preferably, the terminal body further has a curved portion, and the plating surface of the terminal contact portion and the plating surface of the substrate contact portion change their relative orientation through the curved portion. According to this structure, by forming the curved portion, the structure of changing the orientation of the plating surface of the terminal contact portion and the plating surface of the substrate contact portion can be easily realized. In addition, by forming the curved portion, multiple terminals can be compactly arranged on the substrate connector.

[0027] In addition, the connector for the substrate disclosed herein,

[0028] (3) Preferably, the terminal is provided, wherein the plated surface of the terminal contact portion is disposed on the side that contacts the contact portion of the opposite terminal, and the plated surface of the substrate contact portion is disposed upright from the surface of the substrate. According to this structure, the contact area between the substrate contact portion and the substrate can be easily ensured, and the connectivity of the substrate connector can be improved.

[0029] (4) Preferably, the substrate contact surface is mounted on the substrate.

[0030] Furthermore, the method for manufacturing the terminals disclosed herein,

[0031] (5) Preferably, the method for manufacturing the above-mentioned terminal includes: a step of plating two surfaces of a plate-shaped metal material to form the plating surfaces; a step of cutting the metal material having the plating surfaces to obtain a terminal body base material along the two surfaces; and a step of performing a process to make the orientation of the plating surfaces different between the portion of the terminal body base material that can become the terminal contact portion and the portion that can become the substrate contact portion. According to this structure, terminals with improved connectivity can be easily manufactured.

[0032] [Details of the embodiments of this disclosure]

[0033] The following is a reference to the appendix. Figure 1 Specific examples of connectors for terminals and substrates disclosed herein will be described. Furthermore, the invention is not limited to these examples, but as indicated by the claims, it is intended to include all modifications within the meaning and scope equivalent to the claims.

[0034] The board connector 10 is a surface-mount type connector assembled on the surface (upper surface) of the board B. The board B is not limited, and a known circuit board can be selected depending on the application. The housing 11 can be fitted with the opposite housing H. In the following description, regarding the vertical direction, as... Figure 1 and Figure 3 As shown, the state in which the substrate connector 10 is assembled on the horizontal substrate B is defined as the reference. Furthermore, regarding the front-rear direction, the side facing the opposite housing H ( Figure 1 The left side of the middle is defined as the front side.

[0035] like Figure 1 and Figure 2 As shown, the connector 10 for the substrate is configured to have a housing 11 made of synthetic resin and a plurality of metal terminals 20A and 20B. The housing 11 is configured to have: a wall-shaped terminal holding wall 12, which is substantially perpendicular to the substrate B and is a horizontally elongated, generally square shape when viewed from the front; and a cylindrical cover 14 that protrudes forward from the outer periphery of the terminal holding wall 12.

[0036] A plurality of press-in holes 13A and 13B are formed in the terminal holding wall 12, which penetrate the terminal holding wall 12 in the front-to-back direction. The plurality of press-in holes 13A and 13B are arranged side by side in the left-to-right direction (parallel to the substrate B) and are arranged in two layers vertically. The upper layer press-in hole 13A and the lower layer press-in hole 13B are arranged vertically.

[0037] like Figures 1 to 3As shown, one end 21 of terminal 20A, one of the multiple terminals 20A and 20B, is pressed into the upper pressing hole 13A and held in the terminal holding wall 12. One end 21 of terminal 20B, one of the multiple terminals 20A and 20B, is pressed into the lower pressing hole 13B and held in the terminal holding wall 12. With one end 21 of the multiple terminals 20A and 20B held in the terminal holding wall 12, they are arranged in a grid pattern when viewed from the front. That is, the upper terminal 20A and the lower terminal 20B on one end 21 of the terminals 20A and 20B are arranged coaxially in the vertical direction. The other ends 22 of the multiple terminals 20A and 20B, while held in the terminal holding wall 12, are arranged side-by-side in the left-right direction (parallel to the substrate B). The other ends 22 of the multiple terminals 20A and 20B are arranged at equal intervals in the left-right direction. The spacing between adjacent substrate contact portions 50 on the other end 22 side of terminals 20A and 20B (substrate contact portions 50 described later) is defined as a spacing P (refer to...). Figure 4 ).

[0038] Both terminals 20A and 20B include a terminal body 30, a terminal contact portion 40 disposed at one end 21 of the terminal body 30, and a substrate contact portion 50 disposed at the other end 22 of the terminal body 30. The structures of the terminal contact portion 40 and the substrate contact portion 50 are identical for both terminals 20A and 20B. Regarding terminals 20A and 20B, the description will focus on the identical structure of terminal 20A, and will omit the description of terminal 20B.

[0039] like Figure 5 As shown, the terminal body 30 extends from one end 21 to the other end 22, forming a quadrilateral cross-section. Of the four surfaces surrounding the terminal body 30, two facing opposite sides are formed as plated surfaces 23. Of the four surfaces surrounding the terminal body 30, two without plating are formed as cut-off surfaces 24 (non-plated surfaces) of metallic material. The terminal body 30 has a rectangular cross-section, with the long side being the plated surface 23 and the short side being the cut-off surface 24. That is, the width of the plated surface 23 is greater than the width of the cut-off surface 24. Compared to the cut-off surface 24, the plated surface 23 has superior conductivity with the opposite terminal T. Compared to the cut-off surface 24, the plated surface 23 has superior solder wettability.

[0040] like Figure 4 As shown, the terminal body 30 constituting the terminal 20A has a connecting portion 31A that connects the terminal contact portion 40 and the substrate contact portion 50. The connecting portion 31A is configured to include an offset portion 32A, a bending portion 33A, and a drooping portion 34A.

[0041] The offset portion 32A extends to the left from the terminal contact portion 40 while the terminal 20A is held in the terminal holding wall 12. The left-right dimension of the offset portion 32A is half of the interval P. That is, the offset portion 32A is a structure that offsets the substrate contact portion 50 to the left relative to the terminal contact portion 40 by half the dimension of the interval P. The front surface of the offset portion 32A contacts the rear surface of the terminal holding wall 12 while the terminal 20A is held in the terminal holding wall 12.

[0042] The bent portion 33A is curved and is disposed between the offset portion 32A and the drooping portion 34A. Viewed from the rear, the connector 10 for the substrate shows that the bent portion 33A is formed such that the offset portion 32A and the drooping portion 34A are arranged at a 90° angle. However, the angle between the offset portion 32A and the drooping portion 34A is not limited to an exact 90°; any angle that appears to be 90° (e.g., 85° to 95°) is acceptable. The drooping portion 34A extends downward from the left end of the offset portion 32A to the substrate contact portion 50.

[0043] The terminal body 30 constituting terminal 20B has a connecting portion 31B that connects terminal contact portion 40 and substrate contact portion 50. The connecting portion 31B is configured to include an offset portion 32B, a bending portion 33B, and a drooping portion 34B. When viewed from the rear, the offset portion 32B, the bending portion 33B, and the drooping portion 34B are L-shaped.

[0044] The offset portion 32B extends to the right from the terminal contact portion 40 while the terminal 20B is held in the terminal holding wall 12. The left-right dimension of the offset portion 32B is half of the interval P. That is, the offset portion 32B is a structure that offsets the substrate contact portion 50 to the right relative to the terminal contact portion 40 by half the dimension of the interval P. The front surface of the offset portion 32B contacts the rear surface of the terminal holding wall 12 while the terminal 20B is held in the terminal holding wall 12.

[0045] The bent portion 33B is curved and is disposed between the offset portion 32B and the drooping portion 34B. Viewed from the rear, the connector 10 for the substrate shows that the bent portion 33B is formed such that the offset portion 32B and the drooping portion 34B are arranged at a 90° angle. Furthermore, the angle between the offset portion 32B and the drooping portion 34B is not limited to an exact 90°; any angle that appears to be 90° (e.g., 85° to 95°) is acceptable. The drooping portion 34B extends downward from the right end of the offset portion 32B to the substrate contact portion 50. The drooping portion 34B is shorter in the vertical direction than the drooping portion 34A.

[0046] like Figure 1As shown, the terminal contact portion 40 is the part that contacts the counterpart terminal T. The terminal contact portion 40 extends forward from the terminal holding wall 12 while terminals 20A and 20B are held in the terminal holding wall 12. The terminal contact portion 40 is inserted into the counterpart terminal T, and its upper and lower surfaces contact the contact portion (not shown) of the counterpart terminal T. The upper and lower surfaces of the terminal contact portion 40 form the plating surface 23.

[0047] like Figure 2 As shown, the terminal contact portion 40 has a held portion 41 that is held in the terminal holding wall 12. The held portion 41 has a claw-shaped locking piece 42 that protrudes from the cut surface 24 of the terminal contact portion 40. The locking piece 42 can be locked in such a way that it can be inserted into the inner surface of the press-in holes 13A and 13B of the terminal holding wall 12.

[0048] like Figure 1 and Figure 4 As shown, the substrate contact portion 50 is the portion that contacts the substrate B. The substrate contact portion 50 extends rearward in a cantilever shape from the lower ends of the connecting portions 31A and 31B. The substrate contact portion 50 is formed in an inclined shape that slopes slightly downward as it moves rearward. The surface of the substrate contact portion 50 is mounted to the substrate B. The left and right sides of the substrate contact portion 50 are plated surfaces 23.

[0049] Then, while referring to Figure 4 and Figure 5 The orientation of the plating surfaces 23 in terminals 20A and 20B will be explained. The plating surfaces 23 of the terminal contact portion 40 and the substrate contact portion 50 face different directions. The orientation of the plating surfaces 23 of the terminal contact portion 40 and the substrate contact portion 50 is changed by the bending portions 33A and 33B. The plating surface 23 of the terminal contact portion 40 is disposed on the side that contacts the contact portion of the opposite terminal T. The plating surface 23 of the substrate contact portion 50 is disposed upright from the surface of the substrate B. Specifically, when terminals 20A and 20B are held in the terminal holding wall 12, the plating surface 23 of the terminal contact portion 40 faces the vertical direction, and the plating surface 23 of the substrate contact portion 50 faces the horizontal direction. In terminal 20A, the upper plating surface 23 of the terminal contact portion 40 and the left plating surface 23 of the substrate contact portion 50 are bent and connected at a bend 33A, and the lower plating surface 23 of the terminal contact portion 40 and the right plating surface 23 of the substrate contact portion 50 are bent and connected at a bend 33A. In terminal 20B, the upper plating surface 23 of the terminal contact portion 40 and the right plating surface 23 of the substrate contact portion 50 are bent and connected at a bend 33B, and the lower plating surface 23 of the terminal contact portion 40 and the left plating surface 23 of the substrate contact portion 50 are bent and connected at a bend 33B.

[0050] Furthermore, the upper and lower surfaces of the offset portions 32A and 32B become plating surfaces 23 that are connected to the upper and lower surfaces of the terminal contact portion 40 without any steps. The left and right sides of the drooping portions 34A and 34B become plating surfaces 23 that are connected to the left and right sides of the substrate contact portion 50 without any steps.

[0051] Next, the manufacturing methods for terminals 20A and 20B will be described. The manufacturing method for terminal 20A includes: step A, plating two surfaces of a plate-shaped metal material, designating the two surfaces as plating surfaces 23; step B, cutting the metal material having the plating surfaces 23 to obtain a terminal body base material 35 along the two surfaces; and step C, performing a process in which the orientation of the plating surfaces 23 is different between the portion 38 that can become the terminal contact portion 40 and the portion 39 that can become the substrate contact portion 50 in the terminal body base material 35. In the manufacturing method for terminal 20A, a further step D is included after step B: by hammering the terminal body base material 35, the tip of the terminal contact portion 40 is formed into a head-tight shape. Step D can be performed before or after step C. Furthermore, the manufacturing method for terminal 20B is the same as that for terminal 20A, except that the bending orientation of the bent portion 33B is different.

[0052] In process A, as a plating treatment, specific methods such as electroplating and electroless plating can be used. As a plating treatment, one or a combination of two or more of the above-described examples can be used. Electroplating is preferred as the plating treatment. In conventional terminal manufacturing methods, for example, when the plating process is performed after a punching process, the punched terminal is suspended in an electrolyte for plating. In the terminal manufacturing method of this embodiment, a metal plate that has been pre-plated is punched. Therefore, by using inexpensive electroplating suitable for mass production, terminals 20A and 20B can be manufactured easily.

[0053] In process B, the metal sheet having the plated surface 23 obtained in process A is subjected to a punching process to obtain... Figure 6 The terminal body base material 35 is shown. In process B, multiple terminal body base materials 35 can be punched from a single metal sheet. For example... Figure 6As shown, the terminal body base material 35 extends in a crank shape along both surfaces of the metal plate. The terminal body base material 35 has corner portions 36 and 37. A portion 38 of the terminal body base material 35, closer to one end 21 than corner portion 36, can become the terminal contact portion 40. A portion 39 of the terminal body base material 35, closer to the other end 22 than corner portion 37, can become the substrate contact portion 50. These corner portions 36 and 37 are formed by stamping the metal plate. That is, the terminal 20A of this embodiment can be formed by only one bending process in step C described later. Therefore, compared to the case where the corner portions are formed by bending, as assumed in this embodiment, the dimensional accuracy and flatness of the terminal 20A can be improved. Furthermore, the stamping process method is not limited. Commonly cited methods for stamping include using a stamping die to stamp the metal plate.

[0054] In process C, a bending process is performed at a position half a dimension P away from the corner 36 located on one end 21 to form a bent portion 33A. The bent portion 33A is formed by bending the other end 22 side at a 90° angle relative to the one end 21 side. Furthermore, in terminal 20B, the bent portion 33B is formed by bending the other end 22 side at a 90° angle relative to the one end 21 side in the opposite direction to the bent portion 33A. The bending process method is not limited. Specific examples of bending processes include stamping the terminal body base material 35 using a stamping die.

[0055] Next, the manufacturing method of the substrate connector 10 and the substrate B with the substrate connector 10 will be described. The substrate connector 10 is manufactured, for example, by pressing one end 21 of a plurality of terminals 20A, 20B into corresponding pressing holes 13A, 13B, and assembling the plurality of terminals 20A, 20B and the housing 11. The plurality of terminals 20A, 20B are pressed in until the front surface of the offset portions 32A, 32B contacts the rear surface of the terminal holding wall 12.

[0056] The substrate B with the substrate connector 10 is manufactured by mounting the substrate connector 10 onto the substrate B using reflow soldering or the like. First, flux is applied to the predetermined soldering locations on one side of the substrate B. Next, the substrate connector 10 is placed at a predetermined position on the substrate B. At this time, the substrate contact portion 50 is arranged such that one of its cut surfaces 24 faces the upper surface of the substrate B, and the plated surfaces 23, 23 stand upright from the upper surface of the substrate B.

[0057] Next, the substrate B, which carries the substrate connector 10, is moved through a reflow oven (not shown) to heat the flux. Then, when the flux cools and solidifies, a solder portion 51 is formed, the substrate contact portion 50 and the conductive path are connected, and the substrate contact portion 50 is fixed to the substrate B. The solder wettability of the plating surfaces 23, 23 in the substrate contact portion 50 becomes good, so the solder portion 51 is smoothly wetted, forming a good solder joint.

[0058] Next, the operation of this embodiment will be explained. In this embodiment, since the plated surface 23 of the terminal contact portion 40 is disposed on the upper and lower sides of the terminal contact portion 40, the plated surface 23 in the terminal contact portion 40 contacts the opposite terminal T. Therefore, compared with the assumed structure where the exposed metal plate surface in the terminal contact portion contacts the opposite terminal, the conductivity between the terminal contact portion 40 and the opposite terminal T is improved in this embodiment.

[0059] In this embodiment, since the plating surface 23 of the substrate contact portion 50 is disposed on the left and right sides of the substrate contact portion 50, the contact surface between the plating surface 23 and the solder portion 51 can be ensured on both sides. Therefore, compared to the structure where the plating surface of the substrate contact portion is disposed on the upper and lower sides of the substrate contact portion, as assumed in this embodiment, the contact area between the substrate contact portion 50 and the solder portion 51 can be increased. Furthermore, since the width dimension of the plating surface 23 in the substrate contact portion 50 is larger than the width dimension of the cut surface 24, the solder portion 51 is sufficiently wetted on the plating surface 23, thus ensuring a sufficient contact area between the plating surface 23 and the solder portion 51. As a result, the reliability of the electrical and mechanical connection between the substrate contact portion 50 and the substrate B is improved.

[0060] In this embodiment, terminals 20A and 20B have two of their four surfaces, which face opposite directions, as plating surfaces 23. Therefore, they can be manufactured through a so-called pre-plating process, where a metal material cutting process B is performed after plating process A. Furthermore, because the plating surfaces 23 of the terminal contact portion 40 and the substrate contact portion 50 change their relative orientation via bending portions 33A and 33B, both plating surfaces 23 of the terminal contact portion 40 and the substrate contact portion 50 can be formed simultaneously during plating process A. Therefore, terminals 20A and 20B with improved connectivity can be manufactured easily.

[0061] Furthermore, in this embodiment, since terminals 20A and 20B have bent portions 33A and 33B that bend in different directions, even when the terminal contact portions 40 of terminal 20A and 20B are arranged vertically, interference between the connecting portions 31A and 31B can be avoided. Therefore, it is not necessary to stagger the terminal contact portions 40 of terminal 20A and 20B to avoid interference between the connecting portions 31A and 31B, and terminals 20A and 20B can be arranged compactly. As a result, the connector 10 for the substrate can be miniaturized.

[0062] As described above, in this embodiment, terminals 20A and 20B with improved connectivity and a substrate connector 10 can be easily provided. Furthermore, in this embodiment, miniaturization of the substrate connector 10 is facilitated.

[0063] [Other embodiments of this disclosure]

[0064] The embodiments disclosed herein should be considered illustrative in all respects, and not restrictive.

[0065] In the above-described embodiment, the plating surface of the terminal contact portion and the plating surface of the substrate contact portion change their relative orientation by bending the portion. However, the plating surface of the terminal contact portion and the plating surface of the substrate contact portion can also change their relative orientation by twisting and deforming the portion of the terminal body.

[0066] In the above-described embodiment, one end of the multiple terminals is configured in a grid pattern with two layers, but one end of the multiple terminals can have one layer or more layers. Alternatively, one end of the multiple terminals can be configured in an alternating arrangement with two or more layers.

[0067] In the above-described embodiment, both the upper and lower terminals have bent portions, but it is also possible for only one of the upper or lower terminals to have a bent portion.

[0068] In the above embodiments, the substrate contact portion is mounted on the substrate surface, but the substrate contact portion may also be mounted through the substrate.

[0069] Explanation of reference numerals in the attached figures

[0070] 10: Connectors for substrates

[0071] 11: Shell

[0072] 12: Terminal retaining wall

[0073] 13A, 13B: Press-in holes

[0074] 14: Cover

[0075] 20A, 20B: Terminal

[0076] 21: One end

[0077] 22: The other end

[0078] 23: Plating surface

[0079] 24: Cross-section

[0080] 30: Terminal body

[0081] 31A, 31B: Connecting parts

[0082] 32A, 32B: Offset section

[0083] 33A, 33B: Bends

[0084] 34A, 34B: Lower part

[0085] 35: Terminal body base material

[0086] 36, 37: Corner

[0087] 38: Parts that can become terminal contacts

[0088] 39: Parts that can become substrate contact portions

[0089] 40: Terminal contact portion

[0090] 41: The part that is kept

[0091] 42: Locking clip

[0092] 50: Substrate contact part

[0093] 51: Soldering Department

[0094] B:Substrate

[0095] H: Opposite side shell

[0096] T: Counterside terminal

[0097] P: Interval

Claims

1. A terminal comprising: The terminal body has a quadrilateral cross-section extending from one end to the other; A terminal contact portion is disposed on one end of the terminal body and contacts the terminal on the other side; A substrate contact portion is disposed on the other end side of the terminal body and contacts the substrate; as well as The connecting portion connects the terminal contact portion and the substrate contact portion. Of the four surfaces surrounding the terminal body, two surfaces facing opposite directions are plated surfaces, while the other two surfaces are unplated surfaces. The connecting portion has an offset portion that extends from the terminal contact portion in a direction orthogonal to the direction in which the plated surface of the terminal contact portion faces. The curved portion has a curved shape that curves from the offset portion. The plated surfaces of the terminal contact portion and the plated surfaces of the substrate contact portion are bent at the bending portion, changing their orientation relative to each other and facing different directions.

2. A connector for a substrate, comprising the terminals as described in claim 1, The plated surface of the terminal contact portion is disposed on the side that contacts the contact portion of the opposite terminal. The plated surface of the substrate contact portion is disposed upright from the surface of the substrate.

3. The connector for a substrate according to claim 2, wherein, The substrate contact surface is mounted on the substrate.

4. A method for manufacturing a terminal, wherein the terminal comprises: The terminal body has a quadrilateral cross-section extending from one end to the other; A terminal contact portion is disposed at one end of the terminal body and contacts the opposite terminal; a substrate contact portion is disposed at the other end of the terminal body and contacts the substrate. The connecting portion connects the terminal contact portion and the substrate contact portion. Of the four surfaces surrounding the terminal body, two surfaces facing opposite directions are plated surfaces, while the other two surfaces are unplated surfaces. The connecting portion has: an offset portion extending from the terminal contact portion in a direction orthogonal to the direction in which the plated surface of the terminal contact portion faces; and a bent portion having a bent shape that bends from the offset portion. The plating surface of the terminal contact portion and the plating surface of the substrate contact portion are oriented in different directions, and the method for manufacturing the terminal includes: The process of plating two surfaces of a plate-shaped metal material, and setting the two surfaces as the plating surfaces; The process of cutting the metal material having the plated surface and using the cut surface as the unplated surface to obtain the terminal body base material along the two plate surfaces; In the terminal body base material, the portion that can become the terminal contact portion and the portion that can become the substrate contact portion are bent at the bending portion, and a process is performed to make the orientation of the plating surface different.

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