Manufacturing method of partitioned electromagnetic shielding packaging structure and packaging structure

Abstract

The present invention provides a manufacturing method and a packaging structure of a partitioned electromagnetic shielding packaging structure. The manufacturing method of the partitioned electromagnetic shielding packaging structure comprises the following steps: mounting components on the front side of a substrate; plastic-sealing the front side of the substrate to form a plastic-sealed body; removing the plastic-sealed body between an electromagnetic shielding area and a non-electromagnetic shielding area to form an isolation groove; sputtering the substrate to form a shielding layer on the surface of the plastic-sealed body and in the isolation groove; removing the shielding layer on the surface of the plastic-sealed body corresponding to the non-electromagnetic shielding area; the mold flow during normal plastic sealing will not be affected, and the isolation groove is suitable for the contours of various non-shielding areas, with a high degree of freedom in operation. In addition, when removing the shielding layer in the non-electromagnetic shielding area, the shielding layer on the electromagnetic shielding area can be avoided from being damaged, thereby ensuring the complete sealing of the shielding layer in the electromagnetic shielding area and ensuring that the components in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a manufacturing method and a packaging structure of a partitioned electromagnetic shielding packaging structure. Background Art

[0002] Among semiconductor packaging products, there are many integrated circuit chips that are sensitive to electromagnetic interference, such as radio frequency chips, especially high-frequency radio frequency chips. These chips must be electromagnetically shielded before operation to prevent signal anomalies caused by electromagnetic interference during product operation.

[0003] The main method for electromagnetic shielding is to plate or spray an electromagnetic shielding layer on the four sides and top surface of a single product, or to attach a layer of metal film. This method is mainly used to achieve electromagnetic shielding for a single product as a whole. However, this method is not suitable for situations where partition shielding is required inside a single product, especially for products where some components require electromagnetic shielding while others do not.

[0004] Please refer to Figure 1(a)-Figure 1(b) As shown, the existing method for achieving partitioned shielding on a single product is as follows: as shown in FIG1(a), a metal retaining wall is set between the electromagnetic shielding area and the non-electromagnetic shielding area, and then packaged, and then sputtered to form an electromagnetic shielding layer on the surface of the package body, as shown in FIG1(b), and finally a scraper, a grinding wheel, etc. are used to remove at least part of the electromagnetic shielding layer on the non-electromagnetic shielding area, so that the non-electromagnetic shielding area forms an electromagnetic non-enclosed space, thereby achieving partitioned electromagnetic shielding of a single product. However, this method has the following defects: 1) The metal retaining wall needs to be welded and fixed using a surface mounting process, which is complicated and increases the difficulty of surface mounting; 2) The mounted metal retaining wall is large in size and high in height, occupying a large amount of substrate space, reducing the density of component mounting on the substrate; 3) The metal retaining wall is mounted and then packaged, which affects the subsequent encapsulation mold flow, causing problems such as back-packing holes in the plastic encapsulation material during the injection molding process, affecting the encapsulation quality; 4) When removing the electromagnetic shielding layer in the non-electromagnetic shielding area by a scraper or a grinding wheel, the processing position needs to be precisely controlled. If the processing position deviates, the electromagnetic signal in the electromagnetic shielding area will leak, resulting in product function failure, low efficiency, and a high defect rate.

[0005] In view of this, it is necessary to provide a new manufacturing method and packaging structure of a partitioned electromagnetic shielding packaging structure to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a manufacturing method and a packaging structure of a partitioned electromagnetic shielding packaging structure.

[0007] To achieve the above-mentioned invention object, the present invention adopts the following technical solution: a method for manufacturing a partitioned electromagnetic shielding packaging structure, comprising the following steps:

[0008] Mount components on the front side of the substrate;

[0009] Plastic-sealing the front surface of the substrate to form a plastic-sealed body;

[0010] Removing the plastic package between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove;

[0011] Sputtering the substrate to form a shielding layer on the surface of the plastic package and in the isolation groove;

[0012] Remove the shielding layer on the surface of the plastic package corresponding to the non-electromagnetic shielding area.

[0013] As a further improved technical solution of the present invention, a height h1 of the plastic sealing body corresponding to the non-electromagnetic shielding area is greater than a height h2 of the plastic sealing body corresponding to the electromagnetic shielding area.

[0014] As a further improved technical solution of the present invention, h1-h2>10μm.

[0015] As a further improved technical solution of the present invention, "removing the shielding layer on the surface of the plastic packaging body corresponding to the non-electromagnetic shielding area" is specifically: highly thinning the plastic packaging body corresponding to the non-electromagnetic shielding area, and removing the shielding layer on the side of the plastic packaging body corresponding to the non-electromagnetic shielding area away from the substrate.

[0016] As a further improved technical solution of the present invention, before "plastic-sealing the front side of the substrate to form a plastic-sealed body", the manufacturing method of the partitioned electromagnetic shielding packaging structure also includes the following steps: forming a grounding pin on the substrate between the electromagnetic shielding area and the non-electromagnetic shielding area, and the grounding pin is exposed outward from the front side of the substrate.

[0017] As a further improved technical solution of the present invention, before "plastic-sealing the front side of the substrate to form a plastic-sealed body", the manufacturing method of the partitioned electromagnetic shielding packaging structure also includes the following steps: forming a solder paste layer on the front side of the substrate between the electromagnetic shielding area and the non-electromagnetic shielding area.

[0018] As a further improved technical solution of the present invention, the width of the isolation groove is greater than 1 / 5 of the height of the isolation groove.

[0019] As a further improved technical solution of the present invention, the four sides of the substrate have exposed grounding circuits, and "sputtering the substrate to form a shielding layer on the surface of the plastic package and in the isolation groove" is specifically: sputtering the front and four sides of the substrate to form a shielding layer.

[0020] As a further improved technical solution of the present invention, "removing the plastic packaging body between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove" is specifically: using a laser cutting process or a cutting process to remove the plastic packaging body between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove.

[0021] In order to achieve the above-mentioned invention objectives, the present invention also provides a partitioned electromagnetic shielding packaging structure, including a substrate, components mounted on the front side of the substrate, and a plastic packaging body that plastic-seales the front side of the substrate and the components; the plastic packaging body includes a first plastic packaging body located in the electromagnetic shielding area and a second plastic packaging body located in the non-electromagnetic shielding area, and an isolation groove is provided between the first plastic packaging body and the second plastic packaging body; the partitioned electromagnetic shielding packaging structure also includes a shielding layer coated on the outer peripheral surface of the first plastic packaging body and in the isolation groove.

[0022] As a further improved technical solution of the present invention, the shielding layer is electrically connected to a ground pin in the substrate.

[0023] As a further improved technical solution of the present invention, a grounding pin is provided on the substrate between the electromagnetic shielding area and the non-electromagnetic shielding area, and the grounding pin is exposed outward from the front side of the substrate.

[0024] As a further improved technical solution of the present invention, the electromagnetic shielding area is located at the edge of the substrate; the four sides of the substrate have exposed grounding circuits, and the shielding layer is coated on the four sides of the substrate.

[0025] As a further improved technical solution of the present invention, the bottom of the isolation groove has a solder paste layer in contact with the ground pin.

[0026] As a further improved technical solution of the present invention, the width of the isolation groove is greater than 1 / 5 of the height of the isolation groove.

[0027] The beneficial effects of the present invention are as follows: in the manufacturing method of the partitioned electromagnetic shielding packaging structure of the present invention, an isolation groove for isolating the electromagnetic shielding area from the non-electromagnetic shielding area is formed after the plastic packaging body is formed, which will not affect the mold flow during normal plastic packaging, and the isolation groove is suitable for the contours of various non-shielding areas, with a high degree of operational freedom; in addition, when the shielding layer located in the non-electromagnetic shielding area is removed, there will be no interference with the shielding layer located in the electromagnetic shielding area, which can avoid damaging the shielding layer on the electromagnetic shielding area, ensure the complete sealing of the shielding layer in the electromagnetic shielding area, and ensure that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1(a)-Figure 1(b) It is a step diagram of the method for realizing partition shielding on a single product of the present invention.

[0029] Figure 2(a)-Figure 2(e) It is a step diagram of the manufacturing method of the partitioned electromagnetic shielding packaging structure in the present invention.

[0030] Figure 3 It is a structural schematic diagram of the partitioned electromagnetic shielding packaging structure in the present invention. DETAILED DESCRIPTION

[0031] The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings. Figure 3 It is shown as a preferred embodiment of the present invention. However, it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformation or replacement of functions, methods, or structures made by ordinary technicians in the field according to these embodiments shall fall within the protection scope of the present invention.

[0032] Please refer to Figure 2(a)-Figure 2(e) As shown, the present invention provides a method for manufacturing a partitioned electromagnetic shielding packaging structure, in which some components of the partitioned electromagnetic shielding packaging structure 10 require electromagnetic shielding, while some components do not require electromagnetic shielding.

[0033] It can be understood that the components that require electromagnetic shielding include the chip 2 and the like, and the components that do not require electromagnetic shielding include the signal transmitter and receiver 3 and the like.

[0034] The manufacturing method of the partitioned electromagnetic shielding packaging structure comprises the following steps:

[0035] S1: Mount components on the front side of substrate 1;

[0036] S2: Plastic-sealing the front side of the substrate 1 to form a plastic-sealed body 4;

[0037] S3: removing the plastic package 4 between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove 5;

[0038] S4: sputtering the substrate 1 to form a shielding layer 6 on the surface of the plastic package and in the isolation groove;

[0039] S5: removing the shielding layer 6 on the surface of the plastic package body 4 corresponding to the non-electromagnetic shielding area.

[0040] The manufacturing method of the partitioned electromagnetic shielding packaging structure in the present invention sets an isolation groove 5 to physically isolate the electromagnetic shielding area from the non-electromagnetic shielding area, which is suitable for the contours of various non-electromagnetic shielding areas and has a high degree of operational freedom. At the same time, the isolation groove 5 is formed after the plastic packaging body is formed to replace the existing metal retaining wall, which will not affect the mold flow during normal plastic packaging. In addition, when the shielding layer located in the non-electromagnetic shielding area is removed, there will be no interference with the shielding layer 6 located in the electromagnetic shielding area, which can avoid damaging the shielding layer 6 on the electromagnetic shielding area, ensure the complete sealing of the shielding layer 6 in the electromagnetic shielding area, and ensure that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0041] Specifically, step S1 includes the following steps:

[0042] S11: forming a pad on the substrate 1;

[0043] S12: Mount components on the front surface of the substrate 1 at positions corresponding to the pads.

[0044] It can be understood that after mounting components on the front side of the substrate 1 in step S1, the area corresponding to the components requiring electromagnetic shielding is the electromagnetic shielding area, and the area corresponding to the components not requiring electromagnetic shielding is the non-electromagnetic shielding area.

[0045] In this embodiment, the components include a chip 2 and a signal transmitter and receiver 3, the area corresponding to the chip 2 is an electromagnetic shielding area, and the area corresponding to the signal transmitter and receiver 3 is a non-electromagnetic shielding area. Of course, this is not limited to this.

[0046] In step S2, a plastic encapsulation mold is used to plastic-encapsulate the front surface of the substrate 1 to form a plastic encapsulation body 4. The plastic encapsulation body 4 plastic-encapsulates the components and the exposed front surface of the substrate 1 to protect the components.

[0047] Furthermore, the height h1 of the plastic encapsulation body 4 corresponding to the non-electromagnetic shielding area is greater than the height h2 of the plastic encapsulation body 4 corresponding to the electromagnetic shielding area. The plastic encapsulation mold is in a step-like shape, so that the side of the plastic encapsulation body 4 formed away from the substrate 1 is in a step-like shape, that is, there is a height difference between the plastic encapsulation body 4 corresponding to the non-electromagnetic shielding area and the plastic encapsulation body 4 corresponding to the electromagnetic shielding area.

[0048] Furthermore, in the implementation of "the height h1 of the plastic encapsulation body 4 corresponding to the non-electromagnetic shielding area is greater than the height h2 of the plastic encapsulation body 4 corresponding to the electromagnetic shielding area", step S5 is specifically: thinning the height of the plastic encapsulation body 4 corresponding to the non-electromagnetic shielding area, and removing the shielding layer 6 on the side of the plastic encapsulation body 4 corresponding to the non-electromagnetic shielding area away from the substrate 1. Thus, the non-electromagnetic shielding area forms an electromagnetic non-enclosed space, and the components located in the non-electromagnetic shielding area can send or receive signals; at the same time, since the plastic encapsulation body 4 located in the non-electromagnetic shielding area is higher than the plastic encapsulation body 4 located in the electromagnetic shielding area, the shielding layer 6 in the electromagnetic shielding area will not be damaged during the thinning process, thereby ensuring the complete sealing of the shielding layer 6 in the electromagnetic shielding area, and ensuring that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0049] Specifically, the shielding layer 6 on the plastic package body 4 in the non-electromagnetic shielding area can be removed by using a surface grinding process. The grinding process has low requirements and only needs to control the grinding depth. There is no need to precisely control the processing position. It has strong versatility and can enhance processing efficiency.

[0050] In a specific implementation, h1-h2>10 μm, but of course, it is not limited thereto.

[0051] Furthermore, before step S2 , the manufacturing method of the partitioned electromagnetic shielding packaging structure 10 further includes the following steps: A1: forming a ground pin 7 on the substrate 1 between the electromagnetic shielding area and the non-electromagnetic shielding area, wherein the ground pin 7 is exposed outward from the front side of the substrate 1 .

[0052] It can be understood that the grounding pin 7 is exposed in the isolation groove 5. When the substrate 1 is sputtered, a shielding layer 6 is formed on the periphery of the plastic package 4 and in the isolation groove 5. Thus, the shielding layer 6 is electrically connected to the grounding pin 7 in the isolation groove 5, so that the shielding layer 6 is grounded to form an equipotential surface, so that the components located in the electromagnetic shielding area are not affected by external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0053] Specifically, the length of the grounding pin 7 is consistent with the partition boundary between the electromagnetic shielding area and the non-electromagnetic shielding area. When the partitioned electromagnetic shielding packaging structure 10 has only one electromagnetic shielding area and one non-electromagnetic shielding area, the end of the grounding pin 7 located between the electromagnetic shielding area and the non-electromagnetic shielding area in the length direction extends to the side of the substrate 1, so that the shielding layer 6 forms a closed space, and the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0054] Specifically, step A1 can be performed simultaneously with step S11, that is, the ground pin 7 and the pad are formed on the substrate 1 at the same time; or it can be performed in steps.

[0055] Furthermore, the electromagnetic shielding area is located at the edge of the substrate 1 , that is, the other three sides of the electromagnetic shielding area except the one side corresponding to the isolation groove 5 correspond to the side surfaces of the substrate 1 , and the four sides of the substrate 1 have exposed grounding circuits.

[0056] Step S4 is specifically as follows: sputtering is performed on the front and four side surfaces of the substrate 1 to form a shielding layer 6. The shielding layer 6 is wrapped on the other surfaces of the substrate 1 except the back surface, that is, the shielding layer 6 is wrapped on the four side surfaces of the substrate 1, the surface of the plastic package 4 and the isolation groove 5. The shielding layer 6 is electrically connected to the grounding circuit on the side surface of the substrate 1 to form a closed space, and the shielding layer 6 is grounded to form an equipotential surface, so that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0057] Furthermore, before step S2, the method for manufacturing the partitioned electromagnetic shielding packaging structure 10 further includes the following steps: B1: forming a solder paste layer 8 on the front surface of the substrate 1 between the electromagnetic shielding area and the non-electromagnetic shielding area.

[0058] In step S3, the isolation groove 5 can be formed by grooving into the solder paste layer 8, that is, the solder paste layer 8 forms the bottom of the isolation groove 5. On the one hand, the solder paste layer 8 can effectively absorb the depth processing error of the grooving process to prevent the substrate 1 from being damaged by excessive grooving; on the other hand, the solder paste layer 8 is in electrical contact with the grounding pin 7, which can increase the contact area with the shielding layer 6 and enhance the electrical connection stability between the shielding layer 6 and the grounding pin 7.

[0059] Specifically, step B1 and step S1 may be performed simultaneously or in separate steps.

[0060] Furthermore, the width of the isolation groove 5 is greater than 1 / 5 of the height of the isolation groove 5, so as to ensure that the thickness and uniformity of the shielding layer 6 formed in the isolation groove 5 after sputtering meet the process requirements.

[0061] It is understandable that the width of the isolation groove 5 refers to the width of the solder paste layer 8. The height of the isolation groove 5 refers to the lowest height of the isolation groove 5, that is, the height of the side of the isolation groove 5 corresponding to the electromagnetic shielding area.

[0062] Specifically, step S3 is as follows: using a laser cutting process or a cutting process to remove the plastic package 4 between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove 5. Of course, the present invention is not limited thereto.

[0063] For further information, see Figure 3As shown, the present invention further provides a partitioned electromagnetic shielding packaging structure 10, and the partitioned electromagnetic shielding packaging structure 10 is manufactured using the above-mentioned manufacturing method of the partitioned electromagnetic shielding packaging structure.

[0064] Specifically, the partitioned electromagnetic shielding packaging structure 10 includes a substrate 1, components mounted on the front side of the substrate 1, and a plastic packaging body 4 that plastic-seales the front side of the substrate 1 and the components. The plastic packaging body 4 includes a first plastic packaging body 41 located in the electromagnetic shielding area and a second plastic packaging body 42 located in the non-electromagnetic shielding area. An isolation groove 5 is provided between the first plastic packaging body 41 and the second plastic packaging body 42. The partitioned electromagnetic shielding packaging structure 10 also includes a shielding layer 6 coated on the outer peripheral surface of the first plastic packaging body 41 and in the isolation groove 5. By setting an isolation groove 5 to physically isolate the electromagnetic shielding area from the non-electromagnetic shielding area, it is suitable for the contours of various non-electromagnetic shielding areas and has a high degree of freedom in operation. At the same time, after the plastic sealing body 4 is formed, a groove is formed to isolate the electromagnetic shielding area from the non-electromagnetic shielding area, which will not affect the mold flow during normal plastic sealing. In addition, the first plastic sealing body 41 and the second plastic sealing body 42 are isolated from each other. When the shielding layer located in the non-electromagnetic shielding area is removed, there will be no interference with the shielding layer 6 located in the electromagnetic shielding area, which can avoid damaging the shielding layer 6 on the electromagnetic shielding area, ensure the complete sealing of the shielding layer 6 in the electromagnetic shielding area, and ensure that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0065] Furthermore, the shielding layer 6 is electrically connected to the ground pin 7 in the substrate 1, so that the shielding layer 6 is grounded to form an equipotential surface, so that the components located in the electromagnetic shielding area are not affected by external electromagnetic interference, and will not generate electromagnetic interference to the outside world.

[0066] Specifically, a grounding pin 7 is provided on the substrate 1 between the electromagnetic shielding area and the non-electromagnetic shielding area. The grounding pin 7 is exposed outward from the front side of the substrate 1 . The shielding layer 6 is in electrical contact with the grounding pin 7 in the isolation groove 5 so that the shielding layer 6 is grounded.

[0067] Furthermore, the electromagnetic shielding area is located at the edge of the substrate 1, that is, the other three sides of the electromagnetic shielding area except the one side corresponding to the isolation groove 5 correspond to the side surfaces of the substrate 1, and the four side surfaces of the substrate 1 have exposed grounding circuits. The shielding layer 6 is covered on the four side surfaces of the substrate 1, and the shielding layer 6 is electrically connected to the grounding circuits on the side surfaces of the substrate 1 to form an enclosed space. The shielding layer 6 is grounded to form an equipotential surface, so that the components located in the electromagnetic shielding area are not affected by external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0068] Furthermore, the bottom of the isolation groove 5 has a solder paste layer 8 in contact with the ground pin 7. On the one hand, the solder paste layer 8 can effectively absorb the depth processing error of the grooving process to prevent the substrate 1 from being damaged by excessive grooving. On the other hand, the solder paste layer 8 is in electrical contact with the ground pin 7, which can increase the contact area with the shielding layer 6 and enhance the electrical connection stability between the shielding layer 6 and the ground pin 7.

[0069] Furthermore, the width of the isolation groove 5 is greater than 1 / 5 of the height of the isolation groove 5, so as to ensure that the thickness and uniformity of the shielding layer 6 formed in the isolation groove 5 after sputtering meet the process requirements.

[0070] It is understandable that the width of the isolation groove 5 refers to the width of the solder paste layer 8. The height of the isolation groove 5 refers to the lowest height of the isolation groove 5, that is, the height of the side of the isolation groove 5 corresponding to the electromagnetic shielding area.

[0071] Compared with the prior art, in the manufacturing method of the partitioned electromagnetic shielding packaging structure 10 in the present invention, an isolation groove 5 for isolating the electromagnetic shielding area from the non-electromagnetic shielding area is formed after the plastic sealing body 4 is formed, which will not affect the mold flow during normal plastic sealing and ensure the plastic sealing effect, and the isolation groove 5 is suitable for the contours of various non-electromagnetic shielding areas, with high operating freedom; in addition, when the shielding layer 6 located in the non-electromagnetic shielding area is removed, there will be no interference with the shielding layer 6 located in the electromagnetic shielding area, which can avoid damaging the shielding layer 6 on the electromagnetic shielding area, ensure the complete sealing of the shielding layer 6 in the electromagnetic shielding area, and ensure that the components located in the electromagnetic shielding area are not subject to external electromagnetic interference and will not generate electromagnetic interference to the outside world.

[0072] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0073] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for manufacturing a partitioned electromagnetic shielding packaging structure; characterized in that: The steps include: Mount components on the front side of the substrate; Forming a ground pin on the substrate between the electromagnetic shielding area and the non-electromagnetic shielding area, wherein the ground pin is exposed outward from the front side of the substrate, and the length of the ground pin is consistent with the partition boundary between the electromagnetic shielding area and the non-electromagnetic shielding area; Plastic-sealing the front surface of the substrate to form a plastic-sealed body; Removing the plastic package between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove; Sputtering the substrate to form a shielding layer on the surface of the plastic package and in the isolation groove, wherein the shielding layer is electrically connected to the ground pin; Remove the shielding layer on the surface of the plastic package corresponding to the non-electromagnetic shielding area.

2. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1, characterized in that: A height h1 of the plastic-sealed body corresponding to the non-electromagnetic shielding area is greater than a height h2 of the plastic-sealed body corresponding to the electromagnetic shielding area.

3. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 2, characterized in that: h1-h2>10μm.

4. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1 or 2, characterized in that: "Removing the shielding layer on the surface of the plastic package body corresponding to the non-electromagnetic shielding area" specifically means: highly thinning the plastic package body corresponding to the non-electromagnetic shielding area, and removing the shielding layer on the side of the plastic package body corresponding to the non-electromagnetic shielding area away from the substrate.

5. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1, characterized in that: Before "plastic-sealing the front side of the substrate to form a plastic-sealed body", the method for manufacturing the partitioned electromagnetic shielding packaging structure further includes the following step: forming a solder paste layer on the front side of the substrate between the electromagnetic shielding area and the non-electromagnetic shielding area.

6. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1, characterized in that: The width of the isolation trench is greater than 1 / 5 of the height of the isolation trench.

7. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1, characterized in that: The four sides of the substrate have exposed grounding circuits, and “sputtering the substrate to form a shielding layer” specifically includes: sputtering the front side and the four sides of the substrate to form a shielding layer.

8. The method for manufacturing a partitioned electromagnetic shielding packaging structure according to claim 1, characterized in that: "Removing the plastic packaging body between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove" specifically includes: using a laser cutting process or a cutting process to remove the plastic packaging body between the electromagnetic shielding area and the non-electromagnetic shielding area to form an isolation groove.

9. A partitioned electromagnetic shielding packaging structure, comprising a substrate, components mounted on the front surface of the substrate, and a plastic-sealed body that plastic-seales the front surface of the substrate and the components; characterized in that: A grounding pin is provided on the substrate located between the electromagnetic shielding area and the non-electromagnetic shielding area, and the grounding pin is exposed outward from the front side of the substrate, and the length of the grounding pin is consistent with the partition boundary between the electromagnetic shielding area and the non-electromagnetic shielding area; the plastic package body includes a first plastic package body located in the electromagnetic shielding area and a second plastic package body located in the non-electromagnetic shielding area, and an isolation groove is provided between the first plastic package body and the second plastic package body; the partitioned electromagnetic shielding packaging structure also includes a shielding layer coated on the outer peripheral surface of the first plastic package body and in the isolation groove, and the shielding layer is electrically connected to the grounding pin in the substrate.

10. The partitioned electromagnetic shielding packaging structure according to claim 9, characterized in that: The electromagnetic shielding area is located at the edge of the substrate; the four sides of the substrate are provided with exposed grounding circuits, and the shielding layer is coated on the four sides of the substrate.

11. The partitioned electromagnetic shielding packaging structure according to claim 9, characterized in that: The bottom of the isolation groove has a solder paste layer in contact with the ground pin.

12. The partitioned electromagnetic shielding packaging structure according to claim 9, characterized in that: The width of the isolation trench is greater than 1 / 5 of the height of the isolation trench.

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