A composite thermal conductive structure based on ultra-wide artificial graphite high-conductivity film

Abstract

The invention relates to the technical field of heat-conducting structures, and discloses a composite heat-conducting structure based on an ultra-wide artificial graphite high-conductivity film, which solves the problem that the existing heat-conducting structure has a single overall structure and leads to poor heat-conducting and heat-dissipating effects. The structure comprises a heat-conducting base, a plurality of mounting seats are arranged on both sides of the heat-conducting base, mounting holes are opened on the mounting seats, a composite heat-conducting plate is fixedly arranged on the top of the mounting seats, a heat-dissipating component 1 is fixedly arranged on one end of the composite heat-conducting plate, a heat-dissipating component 2 is fixedly arranged on the other end of the composite heat-conducting plate, and a heat-convection plate is fixedly arranged on the top of the composite heat-conducting plate; through the composite heat-conducting structure, heat conduction and heat convection can be integrated to form a combined heat-conducting structure, the high thermal conductivity of the ultra-wide artificial graphite high-conductivity film is used to improve the heat-conducting effect, and the heat pipe principle is used to effectively improve the heat conduction efficiency, thereby realizing rapid heat transfer and high-performance heat conduction and heat dissipation.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat-conducting structures, and in particular relates to a composite heat-conducting structure based on an ultra-wide artificial graphite high-conductivity film. Background Art

[0002] Thermal conductive structures are mainly used in electronic devices in various fields to achieve heat conduction and heat dissipation of electronic devices to increase the service life of electronic devices. The thermal conductive structures currently used are usually relatively simple, and the thermal conduction and heat dissipation effect is poor during use, which is not conducive to the long-term thermal conduction and heat dissipation of electronic devices. Poor thermal conduction and heat dissipation will affect the service life of the equipment.

[0003] Ultra-wide artificial graphite high-conductivity films have gradually been used in miniaturized electronic devices such as mobile phones, but how to improve heat dissipation based on ultra-wide artificial graphite high-conductivity films is an urgent problem to be solved. Therefore, this application proposes a composite thermal conductive structure based on ultra-wide artificial graphite high-conductivity films to meet usage requirements. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a composite thermal conductive structure based on an ultra-wide artificial graphite high-conductivity film, which effectively solves the problem that the existing thermal conductive structure has a single overall structure and leads to poor thermal conductivity and heat dissipation effects.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a composite heat-conducting structure based on an ultra-wide artificial graphite high-conductivity film, comprising a heat-conducting base, a plurality of mounting seats are arranged on both sides of the heat-conducting base, mounting holes are opened on the mounting seats, a composite heat-conducting plate is fixedly arranged on the top of the mounting seat, a heat-dissipating component 1 is fixedly arranged on one end of the composite heat-conducting plate, a heat-dissipating component 2 is fixedly arranged on the other end of the composite heat-conducting plate, and a heat-convection heat-conducting plate fixedly connected to the heat-dissipating component 1 and the heat-dissipating component 2 is fixedly arranged on the top of the composite heat-conducting plate;

[0006] A liquid storage evaporation chamber is provided inside the heat-conducting base, and the interior of the liquid storage evaporation chamber is filled with a low-boiling point medium. An evaporative heat-conducting chamber connected to the liquid storage evaporation chamber is provided at the top of the composite heat-conducting heat-conducting plate. A plurality of low-boiling point medium reflux grooves 1 and a plurality of low-boiling point medium reflux grooves 2 are provided at the bottom of the composite heat-conducting heat-conducting plate. A liquid wick assembly is provided inside the low-boiling point medium reflux groove 1. A heat convection chamber is provided inside the heat-convection heat-conducting plate. A heat-conducting arm is fixedly provided inside the heat-convection chamber. A graphene-like heat-conducting inner film layer is fixedly provided on the inner side walls of the liquid storage evaporation chamber, the evaporative heat-conducting chamber, the low-boiling point medium reflux groove 1, the low-boiling point medium reflux groove 2 and the heat-convection chamber. A graphene-like heat-conducting outer film layer is fixedly provided on the outer surfaces of the heat-conducting base, the composite heat-conducting heat-conducting plate, the heat dissipation assembly 1, the heat dissipation assembly 2 and the heat-convection heat-conducting plate.

[0007] Preferably, a stepped heat-conducting evaporation component is arranged inside the heat-conducting base, and an evaporation guide hole and a plurality of reflux guide holes connected to the liquid storage evaporation chamber, the evaporation heat-conducting chamber, the low-boiling-point medium reflux groove 1 and the low-boiling-point medium reflux groove 2 are provided between the heat-conducting base and the composite heat-conducting plate.

[0008] Preferably, the stepped heat-conducting evaporation assembly consists of a first heating evaporation plate, a plurality of second heating evaporation plates and a plurality of third heating evaporation plates, the second heating evaporation plates are located at both ends of the top of the first heating evaporation plate, the third heating evaporation plates are located at both ends of the top of the second heating evaporation plate, a plurality of heat-conducting columns 1 are fixedly provided at the bottom end of the first heating evaporation plate, a plurality of heat-conducting columns 2 connected to the first heating evaporation plate are fixedly provided at the bottom end of the second heating evaporation plate, and a plurality of heat-conducting columns 3 connected to the second heating evaporation plate are fixedly provided at the bottom end of the third heating evaporation plate.

[0009] Preferably, a plurality of liquid drain pipes are provided on one side of the first heating evaporation plate and the second heating evaporation plate, the first heating evaporation plate is connected with the liquid wick assembly, and a liquid storage type heating groove is provided on the top of the first heating evaporation plate, the second heating evaporation plate and the third heating evaporation plate, and a plurality of steam guide holes are provided inside the liquid storage type heating groove, and the top surface height of the steam guide hole is greater than the height of the liquid storage type heating groove.

[0010] Preferably, the liquid absorbent core assembly is composed of a first mounting plate, a second mounting plate, a plurality of limit support plates and a plurality of porous liquid absorbent units. The first mounting plate, the second mounting plate and the limit support plate are all fixedly connected to the interior of the low-boiling-point medium reflux groove one. Both ends of the porous liquid absorbent unit are respectively fixedly connected to the first mounting plate and the second mounting plate. An end of the porous liquid absorbent unit close to the first mounting plate forms a liquid absorbent beam, which is interspersed in the interior of the reflux guide hole and connected to the first heating evaporation plate.

[0011] Preferably, the first mounting plate, the second mounting plate and the position-limiting support plate are fixedly connected via a central connecting beam, and the position-limiting support plate is provided with a plurality of position-limiting through holes matching the porous liquid-absorbing units.

[0012] Preferably, the inner side wall of the low-boiling-point medium reflux groove 2 is provided with a plurality of strip-shaped limit mounting grooves, and a plurality of auxiliary reflux evaporation components are arranged inside the strip-shaped limit mounting grooves. The auxiliary reflux evaporation components are composed of a snap-fit ​​connection section and a liquid absorption type evaporation plate. The liquid absorption type evaporation plate is fixedly connected to one side of the snap-fit ​​connection section, and a plurality of liquid absorption type evaporation convex ribs are arranged on the other side of the liquid absorption type evaporation plate.

[0013] Preferably, a reinforcing frame is inserted inside the snap-fit ​​connection section, an ultra-wide artificial graphite high-conductivity side membrane is provided on one side of the liquid absorption evaporation plate, and a plurality of ultra-wide artificial graphite high-conductivity membrane strips inserted inside the liquid absorption evaporation plate and the liquid absorption evaporation convex ribs are fixedly provided on one side of the ultra-wide artificial graphite high-conductivity side membrane.

[0014] Preferably, an inlet fan inserted through the heat convection heat conduction plate and communicating with the heat convection cavity is fixedly provided at the middle position of the top end of the heat convection heat conduction plate, and the inlet fan is connected to the air inlet duct.

[0015] Preferably, the heat dissipation component one and the heat dissipation component two are both composed of a heat dissipation plate, a plurality of heat dissipation fins, a guide sleeve and a heat dissipation fan. The heat dissipation fins are fixedly connected to one side of the heat dissipation plate, the heat dissipation fan is fixedly connected to the top of the guide sleeve, and the other end of the guide sleeve is inserted into the heat convection heat conduction plate and connected to the heat convection cavity.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) During operation, a heat-conducting base, a composite heat-conducting plate, a heat-dissipating component 1, a heat-dissipating component 2, a heat-convection heat-conducting plate, a liquid-storage evaporation chamber, an evaporation heat-conducting chamber, a low-boiling-point medium reflux groove 1, a low-boiling-point medium reflux groove 2, a liquid-absorbing core component, a heat-convection chamber, a graphene-like heat-conducting inner film layer, and a graphene-like heat-conducting outer film layer are provided to integrate heat conduction and heat convection to form a combined heat-conducting structure, and the high thermal conductivity of the graphene-like material is used to improve the heat-conducting effect. At the same time, the heat pipe principle is used to effectively improve the heat conduction efficiency, thereby realizing rapid heat transfer and achieving high-performance heat conduction and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0019] In the attached picture:

[0020] Figure 1 A top view of the composite heat-conducting structure based on the ultra-wide artificial graphite high-conductivity film of the present invention;

[0021] Figure 2 This is a front view of the composite heat-conducting structure based on the ultra-wide artificial graphite high-conductivity film of the present invention;

[0022] Figure 3 It is a front cross-sectional view of the composite heat-conducting structure based on the ultra-wide artificial graphite high-conductivity film of the present invention;

[0023] Figure 4 It is a side cross-sectional view of the composite heat conduction plate of the present invention;

[0024] Figure 5It is a schematic diagram of the structure of the stepped heat-conducting evaporation component of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the heating evaporation plate of the present invention;

[0026] Figure 7 It is a schematic diagram of the structure of the liquid absorbent core assembly of the present invention;

[0027] Figure 8 This is a schematic diagram of the structure of the position limiting support plate of the present invention;

[0028] Fig. 9 It is a schematic diagram of the connection structure between the auxiliary reflux evaporation component and the low-boiling-point medium reflux tank 2 of the present invention;

[0029] Fig.10 This is a schematic diagram of the structure of the auxiliary reflux evaporation component of the present invention;

[0030] In the figure: 1. heat-conducting base; 2. mounting base; 3. mounting hole; 4. composite heat-conducting heat-conducting plate; 5. heat-dissipating component 1; 6. heat-dissipating component 2; 7. heat-convection heat-conducting plate; 8. liquid storage evaporation chamber; 9. evaporation heat-conducting chamber; 10. low-boiling-point medium reflux groove 1; 11. low-boiling-point medium reflux groove 2; 12. liquid-absorbing core assembly; 13. heat-convection chamber; 14. heat-conducting arm; 15. ultra-wide artificial graphite high-conductivity inner film; 16. ultra-wide artificial graphite high-conductivity outer film; 17. stepped heat-conducting evaporation assembly; 18. evaporation guide hole; 19. reflux guide hole; 20. first heating evaporation plate; 21. second heating evaporation plate; 22. third heating evaporation plate; 23. heat-conducting column 1; 24. Heat column two; 25, heat-conducting column three; 26, drain pipe; 27, liquid storage heating groove; 28, steam guide hole; 29, first mounting plate; 30, second mounting plate; 31, limit support plate; 32, porous liquid absorption unit; 33, liquid absorption beam; 34, central connecting beam; 35, limit through hole; 36, strip limit mounting groove; 37, auxiliary reflux evaporation component; 38, snap-in connection section; 39, liquid absorption evaporation plate; 40, liquid absorption evaporation rib; 41, reinforcement frame; 42, extra-wide artificial graphite high-conductivity side membrane; 43, extra-wide artificial graphite high-conductivity membrane strip; 44, air inlet fan; 45, air inlet duct; 46, heat sink; 47, heat sink fin; 48, guide sleeve; 49, cooling fan. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0032] Embodiment 1, by Figures 1 to 4 The present invention provides a composite heat-conducting structure based on an ultra-wide artificial graphite high-conductivity film, including a heat-conducting base 1, a plurality of mounting seats 2 are arranged on both sides of the heat-conducting base 1, mounting seats 2 are provided with mounting holes 3, a composite heat-conducting plate 4 is fixedly arranged on the top of the mounting seat 2, a heat-dissipating component 1 5 is fixedly arranged on one end of the composite heat-conducting plate 4, a heat-dissipating component 2 6 is fixedly arranged on the other end of the composite heat-conducting plate 4, a heat-convection plate 7 fixedly connected to the heat-dissipating component 1 5 and the heat-dissipating component 2 6 is fixedly arranged on the top of the composite heat-conducting plate 4, a liquid storage evaporation chamber 8 is arranged inside the heat-conducting base 1, the interior of the liquid storage evaporation chamber 8 is filled with a low-boiling-point medium, and a heat-convection plate 7 fixedly connected to the liquid storage evaporation chamber 8 is arranged on the top of the composite heat-conducting plate 4. The interconnected evaporative heat conduction cavity 9, a plurality of low boiling point medium reflux grooves 10 and a plurality of low boiling point medium reflux grooves 2 11 are provided at the bottom of the composite heat conduction heat conduction plate 4, a liquid wick assembly 12 is provided inside the low boiling point medium reflux groove 10, a heat convection cavity 13 is provided inside the heat convection heat conduction plate 7, a heat conduction arm 14 is fixedly provided inside the heat convection cavity 13, an ultra-wide artificial graphite high conductivity inner film 15 is fixedly provided on the inner side walls of the liquid storage evaporation cavity 8, the evaporative heat conduction cavity 9, the low boiling point medium reflux groove 10, the low boiling point medium reflux groove 2 11 and the heat convection cavity 13, and an ultra-wide artificial graphite high conductivity outer film 16 is fixedly provided on the outer surfaces of the heat conduction base 1, the composite heat conduction heat conduction plate 4, the heat dissipation assembly 1 5, the heat dissipation assembly 2 6 and the heat convection heat conduction plate 7;

[0033] The heat-conducting base 1 is fixedly installed with the heat-generating component. The heat generated by the heat-generating component is transferred to the heat-conducting base 1, and then transferred to the composite heat-conducting plate 4 and the heat-convection plate 7 by the heat-conducting base 1. Then, the composite heat-conducting plate 4 and the heat-convection plate 7 transfer the heat to the heat-dissipating component 1 5 and the heat-dissipating component 2 6 to achieve heat dissipation. After the heat is transferred to the heat-conducting base 1, the low-boiling-point medium inside the heat-conducting base 1 is heated and evaporates to absorb heat to form steam. The steam enters the middle position inside the evaporative heat-conducting cavity 9. The temperature of the middle position of the evaporative heat-conducting cavity 9 rises, and the two sides of the evaporative heat-conducting cavity 9 are heated. The temperature at the end is lower than that in the middle, so a pressure difference is formed, causing the steam to flow to the two ends of the evaporative heat conduction cavity 9 and transfer the heat to the two ends of the composite heat conduction heat conduction plate 4. At this time, the steam condenses and releases heat, and transfers the heat to the heat dissipation component 1 5 and the heat dissipation component 2 6. The condensed low-boiling-point medium flows back to the interior of the liquid storage evaporation cavity 8 through the low-boiling-point medium reflux groove 1 10, the low-boiling-point medium reflux groove 2 11 and the liquid absorption core component 12 to form a circulation. The heat conduction efficiency can be further improved by the ultra-wide artificial graphite high-conductivity inner film 15 and the ultra-wide artificial graphite high-conductivity outer film 16.

[0034] Embodiment 2, by Figures 2 to 6It is shown that a stepped heat-conducting evaporation component 17 is arranged inside the heat-conducting base 1, and an evaporation guide hole 18 and a plurality of reflux guide holes 19 connected to a liquid storage evaporation chamber 8, an evaporation heat-conducting chamber 9, a low-boiling-point medium reflux groove 10 and a low-boiling-point medium reflux groove 2 11 are provided between the heat-conducting base 1 and the composite heat-conducting heat-conducting plate 4. The stepped heat-conducting evaporation component 17 is composed of a first heating evaporation plate 20, a plurality of second heating evaporation plates 21 and a plurality of third heating evaporation plates 22. The second heating evaporation plate 21 is located at both ends of the top of the first heating evaporation plate 20, and the third heating evaporation plate 22 is located at both ends of the top of the second heating evaporation plate 21. The bottom end of the first heating evaporation plate 20 is fixedly provided with a plurality of heat-conducting columns 23. , a plurality of heat-conducting columns 24 connected to the first heating evaporation plate 20 are fixedly provided at the bottom end of the second heating evaporation plate 21, a plurality of heat-conducting columns 3 25 connected to the second heating evaporation plate 21 are fixedly provided at the bottom end of the third heating evaporation plate 22, a plurality of liquid drain pipes 26 are provided on one side of the first heating evaporation plate 20 and the second heating evaporation plate 21, the first heating evaporation plate 20 is connected with the liquid wick assembly 12, a liquid storage heating groove 27 is provided at the top end of the first heating evaporation plate 20, the second heating evaporation plate 21 and the third heating evaporation plate 22, a plurality of steam guide holes 28 are provided inside the liquid storage heating groove 27, and the top surface height of the steam guide hole 28 is greater than the height of the liquid storage heating groove 27;

[0035] After the condensed low-boiling-point medium flows back to the liquid storage evaporation chamber 8 through the low-boiling-point medium reflux groove 1 10, the low-boiling-point medium reflux groove 2 11 and the liquid wick assembly 12, the low-boiling-point medium first flows to the top of the third heating evaporation plate 22 through the liquid wick assembly 12, and flows inside the liquid storage heating groove 27. When the liquid storage heating groove 27 at the top of the third heating evaporation plate 22 is filled with the low-boiling-point medium, the excess low-boiling-point medium is discharged to the second heating evaporation plate 21 through the drain pipe 26, and finally discharged to the first heating evaporation plate 20, and then flows through the first heating evaporation plate 20, a plurality of second heating evaporation plates 21 and a plurality of third heating evaporation plates. 22 can make the low-boiling-point medium form a multi-layer structure, so that the low-boiling-point medium can be uniformly heated through the first heating evaporator plate 20, the plurality of second heating evaporator plates 21 and the plurality of third heating evaporator plates 22, thereby improving the evaporation effect of the low-boiling-point medium and thus improving the heat conduction efficiency. The evaporated medium can be quickly discharged through the steam guide hole 28 to avoid obstruction of the steam flow. The heat of the heat-conducting base 1 can be quickly transferred to the first heating evaporator plate 20, the second heating evaporator plate 21 and the third heating evaporator plate 22 through the heat-conducting column 1 23, the heat-conducting column 24 and the heat-conducting column 3 25, and then the heat is transferred to the low-boiling-point medium.

[0036] Embodiment 3, by Figure 4 , Figure 7 and Figure 8It is given that the liquid absorbent core assembly 12 is composed of a first mounting plate 29, a second mounting plate 30, a plurality of limit support plates 31 and a plurality of porous liquid absorbent units 32. The first mounting plate 29, the second mounting plate 30 and the limit support plate 31 are all fixedly connected to the interior of the low-boiling-point medium reflux groove 10. The two ends of the porous liquid absorbent unit 32 are respectively fixedly connected to the first mounting plate 29 and the second mounting plate 30. The end of the porous liquid absorbent unit 32 close to the first mounting plate 29 forms a liquid absorbent beam 33. The liquid absorbent beam 33 is inserted into the interior of the reflux guide hole 19 and connected to the first heating evaporation plate 20. The first mounting plate 29, the second mounting plate 30 and the limit support plate 31 are fixedly connected by a central connecting beam 34. The limit support plate 31 is provided with a plurality of limit through holes 35 matching the porous liquid absorbent unit 32.

[0037] When the condensed medium refluxes, part of it will enter the interior of the liquid absorbent core assembly 12. The porous liquid absorbent unit 32 is a distributed arrangement structure, and its internal heat distribution is uniform. Since the internal temperature of the low-boiling-point medium reflux groove 10 changes in a step-by-step manner from the middle to the two ends, and the temperature changes from high to low, part of the medium will be heated and continue to evaporate during the reflux process of the low-boiling-point medium. The porous liquid absorbent unit 32 with a distributed arrangement structure can effectively improve the evaporation effect of the low-boiling-point medium after being evenly heated, and avoid the concentrated arrangement of the porous liquid absorbent unit 32 causing uneven heat and affecting the evaporation of the medium. Therefore, the liquid absorbent core assembly 12 can realize the reflux of the medium while realizing the continuous evaporation and heat absorption of the medium, effectively improving the thermal conductivity effect. The first mounting plate 29, the second mounting plate 30 and a plurality of limiting support plates 31 can support and limit the porous liquid absorbent unit 32 to avoid the porous liquid absorbent unit 32 sticking together and affecting the thermal conductivity effect.

[0038] Embodiment 4, by Figure 4 , Fig. 9 and Fig.10 It is shown that the inner wall of the low-boiling-point medium reflux groove 11 is provided with a plurality of strip-shaped limit mounting grooves 36, and a plurality of auxiliary reflux evaporation components 37 are arranged inside the strip-shaped limit mounting grooves 36. The auxiliary reflux evaporation components 37 are composed of a snap-fit ​​connection section 38 and a liquid absorption type evaporation plate 39. The liquid absorption type evaporation plate 39 is fixedly connected to one side of the snap-fit ​​connection section 38, and a plurality of liquid absorption type evaporation convex ribs 40 are arranged on the other side of the liquid absorption type evaporation plate 39. A reinforcement skeleton 41 is inserted into the inside of the snap-fit ​​connection section 38, and an ultra-wide artificial graphite high-conductivity side membrane 42 is arranged on one side of the liquid absorption type evaporation plate 39, and a plurality of ultra-wide artificial graphite high-conductivity membrane strips 43 inserted into the liquid absorption type evaporation plate 39 and the liquid absorption type evaporation convex ribs 40 are fixedly arranged on one side of the ultra-wide artificial graphite high-conductivity side membrane 42;

[0039] When the condensed medium refluxes, part of the medium will enter the low-boiling-point medium reflux groove 11 and reflux through the low-boiling-point medium reflux groove 11. When the condensed low-boiling-point medium enters the low-boiling-point medium reflux groove 11, the low-boiling-point medium will be absorbed by the auxiliary reflux evaporation component 37. Since the auxiliary reflux evaporation component 37 is tightly attached to the low-boiling-point medium reflux groove 11 through the ultra-wide artificial graphite high-conductivity side film 42, and the auxiliary reflux is realized through the ultra-wide artificial graphite high-conductivity film strip 43. The liquid evaporation component 37 can be penetrated, so the heat of the composite heat conduction plate 4 can be quickly transferred to the auxiliary reflux evaporation component 37. When the liquid absorption type evaporation plate 39 and the liquid absorption type evaporation rib 40 are heated, the low boiling point medium will be evaporated, so evaporation heat conduction is achieved while the medium is refluxed, and the excess medium will flow back to the inside of the liquid storage type evaporation chamber 8. The setting of the low boiling point medium reflux groove 1 10 and the low boiling point medium reflux groove 2 11 can increase the space for steam flow, so that the heat can be quickly taken away.

[0040] Embodiment 5, by Figure 2 and Figure 3 It is shown that an inlet fan 44 is fixedly provided at the middle position of the top of the heat convection heat conduction plate 7, which is inserted into the heat convection heat conduction plate 7 and communicated with the heat convection cavity 13. The inlet fan 44 is connected to the air inlet duct 45. The heat dissipation component 1 5 and the heat dissipation component 2 6 are both composed of a heat dissipation plate 46, a plurality of heat dissipation fins 47, a guide sleeve 48 and a heat dissipation fan 49. The heat dissipation fins 47 are fixedly connected to one side of the heat dissipation plate 46. The heat dissipation fan 49 is fixedly connected to the top of the guide sleeve 48. The other end of the guide sleeve 48 is inserted into the heat convection heat conduction plate 7 and communicated with the heat convection cavity 13.

[0041] Air is introduced into the heat convection heat conduction plate 7 through the inlet fan 44 and the air inlet duct 45. A heat dissipation duct can be formed by the inlet fan 44, the heat convection cavity 13 and the heat dissipation fan 49 to achieve convection heat dissipation inside the heat convection heat conduction plate 7. When the heat dissipation fan 49 is working, the heat dissipation efficiency of the heat dissipation plate 46 and the heat dissipation fins 47 can be improved, so that the heat can be dissipated quickly, thereby improving the heat dissipation effect.

[0042] During operation, by setting up a thermal conductive base, a composite thermal conduction plate, a heat dissipation component one, a heat dissipation component two, a thermal convection thermal conduction plate, a liquid storage evaporation chamber, an evaporative thermal conduction chamber, a low boiling point medium reflux groove one, a low boiling point medium reflux groove two, a liquid absorption core component, a thermal convection chamber, an ultra-wide artificial graphite high conductivity inner film and an ultra-wide artificial graphite high conductivity outer film, heat conduction and thermal convection can be integrated to form a combined thermal conductive structure, and the high thermal conductivity of graphene-like materials is used to improve the thermal conduction effect. At the same time, the heat pipe principle is used to effectively improve the thermal conduction efficiency, thereby realizing rapid heat transfer and achieving high-performance thermal conduction and heat dissipation.

Claims

1. A composite heat-conducting structure based on an ultra-wide artificial graphite high-conductivity film, comprising a heat-conducting base (1), characterized in that: A plurality of mounting seats (2) are arranged on both sides of the heat-conducting base (1), mounting holes (3) are provided on the mounting seats (2), a composite heat-conducting plate (4) is fixedly arranged on the top of the mounting seats (2), a heat-dissipating component 1 (5) is fixedly arranged on one end of the composite heat-conducting plate (4), a heat-dissipating component 2 (6) is fixedly arranged on the other end of the composite heat-conducting plate (4), and a heat-convection heat-conducting plate (7) fixedly connected to the heat-dissipating component 1 (5) and the heat-dissipating component 2 (6) is fixedly arranged on the top of the composite heat-conducting plate (4); A liquid storage type evaporation chamber (8) is provided inside the heat conduction base (1), and the liquid storage type evaporation chamber (8) is filled with a low boiling point medium. An evaporation type heat conduction chamber (9) connected to the liquid storage type evaporation chamber (8) is provided at the top of the composite heat conduction heat conduction plate (4). A plurality of low boiling point medium reflux grooves (10) and a plurality of low boiling point medium reflux grooves (11) are provided at the bottom of the composite heat conduction heat conduction plate (4). A liquid absorption core component (12) is provided inside the low boiling point medium reflux groove (10). A heat convection heat conduction plate (7) is provided inside. A convection chamber (13), a heat conduction support arm (14) is fixedly arranged inside the heat convection chamber (13), a graphene-like heat conduction inner film layer (15) is fixedly arranged on the inner side wall of the liquid storage evaporation chamber (8), the evaporation heat conduction chamber (9), the low boiling point medium reflux groove one (10), the low boiling point medium reflux groove two (11) and the heat convection chamber (13), and a heat conduction base (1), a composite heat conduction heat conduction plate (4), a heat dissipation component one (5), a heat dissipation component two (6) and the heat convection heat conduction plate (7) are fixedly arranged on the outer surface of the graphene-like heat conduction outer film layer (16); The thermally conductive base (1) is provided with a stepped thermally conductive evaporation component (17) inside, and an evaporation guide hole (18) and a plurality of reflux guide holes (19) are provided between the thermally conductive base (1) and the composite thermally conductive plate (4), and are connected to a liquid storage evaporation chamber (8), an evaporation heat conduction chamber (9), a low boiling point medium reflux groove 1 (10) and a low boiling point medium reflux groove 2 (11); The stepped heat-conducting evaporation assembly (17) is composed of a first heating evaporation plate (20), a plurality of second heating evaporation plates (21) and a plurality of third heating evaporation plates (22); the second heating evaporation plates (21) are located at two ends of the top of the first heating evaporation plate (20); the third heating evaporation plates (22) are located at two ends of the top of the second heating evaporation plate (21); a plurality of heat-conducting columns (23) are fixedly arranged at the bottom end of the first heating evaporation plate (20); a plurality of heat-conducting columns (24) connected to the first heating evaporation plate (20) are fixedly arranged at the bottom end of the second heating evaporation plate (21); and a plurality of heat-conducting columns (25) connected to the second heating evaporation plate (21) are fixedly arranged at the bottom end of the third heating evaporation plate (22); The inner side wall of the low-boiling-point medium reflux groove 2 (11) is provided with a plurality of strip-shaped limit installation grooves (36), and a plurality of auxiliary reflux evaporation components (37) are arranged inside the strip-shaped limit installation grooves (36). The auxiliary reflux evaporation components (37) are composed of a snap-fit ​​connection section (38) and a liquid absorption type evaporation plate (39). The liquid absorption type evaporation plate (39) is fixedly connected to one side of the snap-fit ​​connection section (38), and a plurality of liquid absorption type evaporation convex ribs (40) are arranged on the other side of the liquid absorption type evaporation plate (39).

2. The composite thermal conductive structure based on the ultra-wide artificial graphite high-conductivity film according to claim 1, characterized in that: A plurality of liquid discharge pipes (26) are provided on one side of the first heating evaporation plate (20) and the second heating evaporation plate (21); the first heating evaporation plate (20) is connected to the liquid wick assembly (12); the tops of the first heating evaporation plate (20), the second heating evaporation plate (21) and the third heating evaporation plate (22) are provided with liquid storage type heating grooves (27); a plurality of steam guide holes (28) are provided inside the liquid storage type heating grooves (27); and the top surface height of the steam guide holes (28) is greater than the height of the liquid storage type heating grooves (27).

3. The composite thermal conductive structure based on the ultra-wide artificial graphite high-conductivity film according to claim 2, characterized in that: The liquid wick assembly (12) is composed of a first mounting plate (29), a second mounting plate (30), a plurality of position-limiting support plates (31) and a plurality of porous liquid wicking units (32); the first mounting plate (29), the second mounting plate (30) and the position-limiting support plate (31) are all fixedly connected to the interior of the low-boiling-point medium reflux groove (10); two ends of the porous liquid wicking unit (32) are respectively fixedly connected to the first mounting plate (29) and the second mounting plate (30); an end of the porous liquid wicking unit (32) close to the first mounting plate (29) forms a liquid wicking beam (33); the liquid wicking beam (33) is inserted into the interior of the reflux guide hole (19) and is connected to the first heating evaporation plate (20).

4. The composite thermal conductive structure based on the ultra-wide artificial graphite high-conductivity film according to claim 3, characterized in that: The first mounting plate (29), the second mounting plate (30) and the position-limiting support plate (31) are fixedly connected via a central connecting beam (34); the position-limiting support plate (31) is provided with a plurality of position-limiting through holes (35) matching the porous liquid-absorbing units (32).

5. The composite thermal conductive structure based on the ultra-wide artificial graphite high-conductivity film according to claim 1, characterized in that: A reinforcing frame (41) is inserted into the interior of the snap-fit ​​connection section (38); an ultra-wide artificial graphite high-conductivity side membrane (42) is provided on one side of the liquid absorption type evaporation plate (39); and a plurality of ultra-wide artificial graphite high-conductivity membrane strips (43) inserted into the interior of the liquid absorption type evaporation plate (39) and the liquid absorption type evaporation convex rib (40) are fixedly provided on one side of the ultra-wide artificial graphite high-conductivity side membrane (42).

6. The composite thermal conductive structure based on ultra-wide artificial graphite high-conductivity film according to claim 1, characterized in that: An air inlet fan (44) is fixedly arranged at the middle position of the top end of the heat convection heat conduction plate (7), which is inserted into the heat convection heat conduction plate (7) and communicated with the heat convection cavity (13), and the air inlet fan (44) is connected to the air inlet duct (45).

7. The composite thermal conductive structure based on ultra-wide artificial graphite high-conductivity film according to claim 1, characterized in that: The heat dissipation component 1 (5) and the heat dissipation component 2 (6) are both composed of a heat dissipation plate (46), a plurality of heat dissipation fins (47), a guide sleeve (48) and a heat dissipation fan (49). The heat dissipation fins (47) are fixedly connected to one side of the heat dissipation plate (46), the heat dissipation fan (49) is fixedly connected to the top of the guide sleeve (48), and the other end of the guide sleeve (48) is inserted into the heat convection heat conduction plate (7) and communicated with the heat convection cavity (13).

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