Pick-up device and wafer picking mechanism

Abstract

The present invention provides a pickup device and a wafer pickup mechanism, the pickup device includes: a bracket, a driving component, a first magnetic component and an adsorption rotary column, the bracket includes a first mounting portion and a second mounting portion; the driving component is arranged on the first mounting portion; the driving component is in transmission connection with the first magnetic component; the adsorption rotary column is arranged on the second mounting portion; the adsorption rotary column includes a nozzle rod and a second magnetic component fixed on the nozzle rod, the second magnetic component is located on one side of the first magnetic component and is spaced apart from the first magnetic component, and the first magnetic component drives the second magnetic component to rotate around its own central axis through a non-contact force magnetic coupling effect. The pickup device of the embodiment of the present invention realizes non-contact transmission through the magnetic coupling effect of the first magnetic component and the second magnetic component, so that the magnetic attraction rotary column rotates and realizes non-contact angle control, eliminating the force control precision error caused by friction.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip mounting equipment, and in particular to a pickup device and a wafer pickup mechanism. Background Art

[0002] Semiconductor chips are usually assembled using placement equipment during production. Currently, most production plans in the industry use fixed continuous tracks to implement the placement process, in which practical picking and transferring equipment picks up the chip from the feed end and sends it to the track for placement. After picking up the chip, the chip needs to be adjusted in posture. Currently, this is generally done through belt transmission, connecting rods and other structures, and the pressure of the nozzle patch is controlled by an elastic mechanism. This method has a large friction between the mechanisms, which will cause a large error in the force control accuracy. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the present invention provides a picking device, comprising:

[0004] A bracket, the bracket comprising a first mounting portion and a second mounting portion;

[0005] a driving component, wherein the driving component is disposed on the first mounting portion;

[0006] a first magnetic component, the driving component being in transmission connection with the first magnetic component to drive the first magnetic component to rotate; and

[0007] An adsorption rotary column, which is arranged on the second mounting portion and can rotate around its own central axis relative to the bracket; the adsorption rotary column includes a suction nozzle rod and a second magnetic component fixed on the suction nozzle rod, the suction nozzle rod is used to pick up the workpiece, the second magnetic component is located on one side of the first magnetic component and is spaced apart from the first magnetic component, and the first magnetic component drives the second magnetic component to rotate around its own central axis through the non-contact force magnetic coupling effect.

[0008] The pickup device of the embodiment of the present invention realizes non-contact transmission through the magnetic coupling of the first magnetic component and the second magnetic component, thereby rotating the magnetic spin column and realizing non-contact angle control, eliminating the force control accuracy error caused by friction.

[0009] Optionally, the first mounting portion is a mounting plate, and a transmission shaft hole is opened on the mounting plate, the driving component is located on the upper side of the mounting plate, the first magnetic component is located on the lower side of the mounting plate, and the transmission shaft of the driving component passes through the transmission shaft hole and is transmission-connected to the first magnetic component.

[0010] Optionally, the second mounting portion is a rotating shaft hole, and the nozzle rod is inserted into the rotating shaft hole and is loosely matched with the rotating shaft hole.

[0011] Optionally, the first magnetic component and the second magnetic component are both cylindrical, and the diameter of the first magnetic component is 2-4 times the diameter of the second magnetic component.

[0012] Optionally, the second magnetic component has a central fitting hole, and the nozzle rod is inserted into the central fitting hole and has an interference fit with the central fitting hole.

[0013] Optionally, the nozzle rod includes a rod body and a limiting ring fixed on the rod body, the limiting ring is coaxially arranged with the rod body, and the second magnetic component is located on the upper side of the limiting ring.

[0014] Optionally, the second mounting portion is a rotating shaft hole, and the nozzle rod is inserted into the rotating shaft hole;

[0015] A vacuum adsorption groove is opened on the upper side of the rotating shaft hole, the limiting ring covers the notch position of the vacuum adsorption groove, and the bottom wall and / or side wall of the vacuum adsorption groove has a suction hole for connecting to a vacuum pumping device.

[0016] Optionally, a sealing gasket for sealingly cooperating with the limiting ring is arranged around the vacuum adsorption groove, and the sealing gasket supports the limiting ring.

[0017] The present invention further provides a wafer picking mechanism, comprising: a mounting platform, a horizontal moving assembly arranged on the mounting platform, a vertical moving assembly arranged on the horizontal moving assembly, and a picking device arranged on the vertical moving assembly, wherein the picking device is the picking device of an embodiment of the present invention;

[0018] The horizontal moving component can drive the vertical moving component to move back and forth in the horizontal direction, and the vertical moving component can drive the picking device to move back and forth in the vertical direction.

[0019] The wafer picking mechanism of the present invention includes the picking device of the present invention, so that the workpiece can be picked up flexibly and accurately, and the posture of the workpiece can be adjusted.

[0020] Optionally, the vertical moving assembly is provided with a crystal leakage detection device, and the crystal leakage detection device is used to detect whether the picking device picks up the workpiece.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0023] Figure 1 is a three-dimensional schematic diagram of a pickup device in one embodiment of the present invention;

[0024] Figure 2 is an exploded schematic diagram of a pickup device in one embodiment of the present invention;

[0025] Figure 3 is a cross-sectional schematic diagram of a pickup device in one embodiment of the present invention;

[0026] Figure 4 is a three-dimensional schematic diagram of a bracket in one embodiment of the present invention;

[0027] Figure 5 It is a three-dimensional schematic diagram of a wafer picking mechanism in one embodiment of the present invention.

[0028] Reference numerals:

[0029] 10- bracket; 11- first mounting portion; 111- transmission shaft hole; 12- second mounting portion; 121- vacuum adsorption groove;

[0030] 20- driving components;

[0031] 30- a first magnetic component;

[0032] 40 - adsorption rotary column; 41 - suction nozzle rod; 411 - main body; 412 - limiting ring; 42 - second magnetic component; 421 - center matching hole; 43 - suction nozzle.

[0033] 50-mounting table;

[0034] 60- horizontal movement component;

[0035] 70- vertical movement assembly;

[0036] 80-Leakage crystal detection device. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0038] The present invention provides a picking device, which can be used to pick up a workpiece and adjust the posture of the workpiece, wherein the workpiece can be a wafer, and the picking device is used to pick up the wafer and adjust the posture of the wafer to a predetermined state.

[0039] See also Figure 1-Figure 3In some embodiments, the pickup device mainly includes: a bracket 10, a driving component 20, a first magnetic component 30 and an adsorption spin column 40. The bracket 10 includes a first mounting portion 11 and a second mounting portion 12; the driving component 20 is disposed on the first mounting portion 11, and the driving component 20 can be a motor, which is transmission-connected to the first magnetic component 30 to drive the first magnetic component 30 to rotate.

[0040] The adsorption rotary column 40 is arranged on the second mounting part 12, and can rotate around its own central axis relative to the bracket 10; the adsorption rotary column 40 includes a suction nozzle rod 41 and a second magnetic component 42 fixed on the suction nozzle rod 41, the suction nozzle rod 41 is used to pick up the workpiece, the second magnetic component 42 is located on one side of the first magnetic component 30, and is spaced apart from the first magnetic component 30, and the first magnetic component 30 drives the second magnetic component 42 to rotate around its own central axis through the non-contact force magnetic coupling effect.

[0041] In the picking device of the above embodiment, the first magnetic component 30 and the second magnetic component 42 are not in contact, and the second magnetic component 42 drives the suction nozzle rod 41 to rotate synchronously. During the rotation, the main friction force is between the adsorption spin column 40 and the second mounting part 12. There is no friction force between the first magnetic component 30 and the second magnetic component 42. The transmission between the two is achieved through the non-contact force magnetic coupling effect, and the rotation angle is accurately controlled.

[0042] In some embodiments, see Figure 2 and Figure 4 The first mounting portion 11 is a mounting plate, and a transmission shaft hole 111 is opened on the mounting plate. The driving component 20 is located on the upper side of the mounting plate, and the first magnetic component 30 is located on the lower side of the mounting plate. The transmission shaft of the driving component 20 passes through the transmission shaft hole 111 and is transmission-connected to the first magnetic component 30.

[0043] Bolt holes for fixing the driving component 20 may also be provided on the mounting plate, and the driving component 20 is fixed to the mounting plate by bolts.

[0044] In some embodiments, the second mounting portion 12 is a rotating shaft hole, the axial direction of the rotating shaft hole is parallel to the axial direction of the transmission shaft of the driving component 20, the suction nozzle rod 41 is inserted into the rotating shaft hole, and is loosely matched with the rotating shaft hole, thereby ensuring that the suction nozzle rod 41 can rotate flexibly under the constraint of the rotating shaft hole. Lubricating oil can be set in the rotating shaft hole to reduce the friction of the suction nozzle rod 41, thereby improving the rotation accuracy.

[0045] In some embodiments, the bracket 10 further has a fixing portion for installation and fixing, through which the bracket 10 can be stably installed on a designated device, such as Figure 2As shown, the first mounting portion 11 of the bracket 10 is a mounting plate, the side of which is connected to a vertical fixing plate, which is the fixing portion, and the lower end of the fixing plate is connected to a trapezoidal platform, on which a rotating shaft hole (i.e., the second mounting portion 12) is provided.

[0046] For example, the bracket 10 can be integrally formed and manufactured by casting or machining.

[0047] In some embodiments, the first magnetic component 30 and the second magnetic component 42 are both cylindrical, and the diameter of the first magnetic component 30 is 2-4 times the diameter of the second magnetic component 42, so that the adsorption spin column 40 is lighter as a whole and easier to drive. The first magnetic component 30 is larger in size and has stronger magnetism, which can make it more stable and more precisely controlled when driving the second magnetic component 42.

[0048] Specifically, both the first magnetic component 30 and the second magnetic component 42 may be permanent magnets.

[0049] In some embodiments, the second magnetic component 42 has a central matching hole 421, the nozzle rod 41 is inserted into the central matching hole 421, and is interference fit with the central matching hole 421, thereby ensuring that the second magnetic component 42 and the nozzle rod 41 are relatively fixed and the two can rotate synchronously.

[0050] The second magnetic component 42 and the nozzle rod 41 may also be fixedly connected in other ways, as long as they can be ensured to rotate synchronously.

[0051] Specifically, the nozzle rod 41 includes a rod body 411 and a limiting ring 412 fixed to the rod body 411, the limiting ring 412 is coaxially arranged with the rod body 411, and the second magnetic component 42 is located on the upper side of the limiting ring 412. By providing the limiting ring 412, the adsorption spin column 40 can be prevented from slipping from the rotating shaft hole of the bracket 10.

[0052] The rod body 411 and the limiting ring 412 may be integrally formed.

[0053] In some embodiments, see Figure 4 The second mounting portion 12 is a rotating shaft hole, and the suction nozzle rod 41 is inserted into the rotating shaft hole; a vacuum adsorption groove 121 is provided on the upper side of the rotating shaft hole, and a limiting ring 412 covers the notch position of the vacuum adsorption groove 121, and the bottom wall and / or side wall of the vacuum adsorption groove 121 have a suction hole for connecting to a vacuum pumping device. The vacuum pumping device can generate an adsorption force on the limiting ring 412 by vacuuming the vacuum adsorption groove 121. When picking up a workpiece, the picking device moves downward, and the suction nozzle rod 41 will be lifted up after contacting the workpiece, so that the limiting ring 412 is separated from the vacuum adsorption groove 121. By detecting the air pressure in the vacuum adsorption groove 121, it can be determined whether the workpiece is picked up.

[0054] Furthermore, in order to further ensure the sealing performance, a sealing gasket for sealingly cooperating with the limiting ring 412 is provided around the vacuum adsorption groove 121, and the sealing gasket supports the limiting ring 412. By providing the sealing gasket, the sealing performance between the limiting ring 412 and the vacuum adsorption groove 121 can be improved, so that when picking up a workpiece, the air pressure in the vacuum adsorption groove 121 changes more obviously, and the detection device for judging whether the workpiece is picked up can detect more accurately.

[0055] In some embodiments, the suction spin column 40 further includes a suction nozzle 43 disposed at the lower end of the suction nozzle rod 41, the suction nozzle 43 suctions the workpiece and moves to a designated position along with the suction nozzle rod 41. The suction nozzle rod 41 has a through hole at its center, and the upper end is used to connect a vacuum pumping device, so that a negative pressure is generated at the position of the suction nozzle 43 by vacuum pumping, thereby sucking the workpiece.

[0056] Specifically, the vacuum adsorption groove 121 is in a circular ring shape and surrounds the suction nozzle rod 41 .

[0057] See also Figure 5 In this embodiment, a wafer picking mechanism is further provided, which includes: a mounting table 50, a horizontal moving component 60 arranged on the mounting table 50, a vertical moving component 70 arranged on the horizontal moving component 60, and a picking device arranged on the vertical moving component 70, and the picking device is the picking device of any of the above embodiments; the horizontal moving component 60 can drive the vertical moving component 70 to reciprocate in the horizontal direction, and the vertical moving component 70 can drive the picking device to reciprocate in the vertical direction.

[0058] By cooperating with the horizontal moving assembly 60 and the vertical moving assembly 70 , the workpiece picked up by the picking device can be moved to a specified position, and the posture of the workpiece can be controlled by the picking device, thereby improving the workpiece processing efficiency.

[0059] The horizontal moving assembly 60 and the vertical moving assembly 70 can both be driven by a lead screw, or a belt, or a linear motor, and a guide rail can be provided to improve the accuracy of the direction.

[0060] In some embodiments, the vertical moving assembly 70 is provided with a crystal leakage detection device 80, which is used to detect whether the picking device has picked up a workpiece. When the workpiece is not detected, the next step is not performed, thereby avoiding invalid operations and long-term operation, and improving work efficiency.

[0061] Among them, the picking device in the wafer picking mechanism is used to pick up the wafer, that is, the above-mentioned workpiece is the wafer.

[0062] For those skilled in the art, the picking device can also pick up other similar workpieces.

[0063] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0064] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0065] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A picking device, characterized in that: include: A bracket (10), the bracket (10) comprising a first mounting portion (11) and a second mounting portion (12); a driving component (20), the driving component (20) being arranged on the first mounting portion (11); a first magnetic component (30), the driving component (20) being drivingly connected to the first magnetic component (30) so as to drive the first magnetic component (30) to rotate; and An adsorption rotary column (40), wherein the adsorption rotary column (40) is arranged on the second mounting portion (12) and is capable of rotating around its own central axis relative to the bracket (10); the adsorption rotary column (40) comprises a suction nozzle rod (41) and a second magnetic component (42) fixed to the suction nozzle rod (41), wherein the suction nozzle rod (41) is used to pick up a workpiece, and the second magnetic component (42) is located on one side of the first magnetic component (30) and is spaced apart from the first magnetic component (30), and the first magnetic component (30) drives the second magnetic component (42) to rotate around its own central axis through a non-contact force magnetic coupling effect; The second magnetic component (42) has a central matching hole (421), and the nozzle rod (41) is inserted into the central matching hole (421) and is interference-fitted with the central matching hole (421); The nozzle rod (41) comprises a rod body (411) and a limiting ring (412) fixed on the rod body (411), the limiting ring (412) being coaxially arranged with the rod body (411), and the second magnetic component (42) being located on the upper side of the limiting ring (412); The second mounting portion (12) is a rotating shaft hole, and the nozzle rod (41) is inserted into the rotating shaft hole; A vacuum adsorption groove (121) is provided on the upper side of the rotating shaft hole, the limiting ring (412) covers the notch position of the vacuum adsorption groove (121), and the bottom wall and / or side wall of the vacuum adsorption groove (121) has a suction hole for connecting to a vacuum extraction device.

2. The pickup device according to claim 1, characterized in that: The first mounting portion (11) is a mounting plate, and a transmission shaft hole (111) is provided on the mounting plate. The driving component (20) is located on the upper side of the mounting plate, and the first magnetic component (30) is located on the lower side of the mounting plate. The transmission shaft of the driving component (20) passes through the transmission shaft hole (111) and is transmission-connected to the first magnetic component (30).

3. The pickup device according to claim 1, characterized in that: The second mounting portion (12) is a rotating shaft hole, and the suction nozzle rod (41) is inserted into the rotating shaft hole and is loosely matched with the rotating shaft hole.

4. The pickup device according to claim 1, characterized in that: The first magnetic component (30) and the second magnetic component (42) are both cylindrical, and the diameter of the first magnetic component (30) is 2 to 4 times the diameter of the second magnetic component (42).

5. The pickup device according to claim 1, characterized in that: A sealing gasket for sealingly cooperating with the limiting ring (412) is arranged around the vacuum adsorption groove (121), and the sealing gasket supports the limiting ring (412).

6. A wafer picking mechanism, characterized in that: include: A mounting platform (50), a horizontal moving assembly (60) arranged on the mounting platform (50), a vertical moving assembly (70) arranged on the horizontal moving assembly (60), and a picking device arranged on the vertical moving assembly (70), wherein the picking device is the picking device according to any one of claims 1 to 5; The horizontal moving component (60) can drive the vertical moving component (70) to move back and forth in the horizontal direction, and the vertical moving component (70) can drive the picking device to move back and forth in the vertical direction.

7. The wafer picking mechanism according to claim 6, characterized in that: The vertical moving assembly (70) is provided with a crystal leakage detection device (80), and the crystal leakage detection device (80) is used to detect whether the picking device has picked up a workpiece.

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