Liquid flow heat sink

Abstract

The application discloses a liquid flow type heat dissipation device, which comprises a base, a cover, a flow guide plate and a heat conduction box. The base comprises a bottom and an annular wall part, the annular wall part is integrally connected to the bottom, and the bottom and the annular wall part jointly enclose a storage chamber. The annular wall part has an external outlet and an external inlet. The flow guide plate is stacked on the cover to form an impeller accommodating chamber. The flow guide plate divides the storage chamber into an inlet chamber and an outlet chamber which are not connected. There is a gap between the flow guide plate and the bottom of the base. The external inlet is connected to the impeller accommodating chamber through the inlet chamber. The heat conduction box encloses a heat exchange chamber which is connected to the storage chamber. When dissipating heat, the cooling liquid enters the inlet chamber through the external inlet, then flows into the gap, and then flows into the impeller accommodating chamber. The cooling liquid in the gap is brought into the heat exchange chamber by the impeller, and finally flows out of the external outlet through the outlet chamber.

Description

TECHNICAL FIELD

[0001] The present invention relates to a heat dissipating device, in particular, a liquid flow heat dissipating device. BACKGROUND

[0002] During the operation of a computer, heat is generated by the heat source, such as the central processing unit, due to the high speed operation. Therefore, the computer must be equipped with a cooling device to quickly and effectively remove the heat generated by the heat source and keep the temperature of the heat source within the design range specified by the manufacturer. The cooling device is generally divided into air-cooled and liquid-cooled. The air-cooled cooling device refers to the installation of heat dissipation fins on the heat source, and the installation of a fan on the computer, so as to remove the heat generated by the heat source through the airflow generated by the fan. However, due to the noise generated by the fan during operation, it is difficult to cool high heat generating heat sources, such as the processors of gaming computers. Therefore, currently, gaming computers generally use liquid cooling. The liquid cooling cooling device refers to the installation of a water cooling head and a water cooling radiator on the computer, the water cooling head is in thermal contact with the heat source, and is connected to the water cooling radiator through a flow pipe. The water cooling head has a pump, which can drive the cooling liquid that absorbs heat to flow from the water cooling head to the water cooling radiator, and then back to the water cooling head after being cooled in the water cooling radiator.

[0003] However, due to the large number of shell parts of the current water cooling head, the assembly efficiency is not good, and the waterproof design is difficult to be comprehensive. For example, if the original design of the water cooling head for a single heat source is modified and changed to a water cooling head for multiple heat sources, the waterproof performance may be difficult to reinforce after the structure is changed, so that the modified water cooling head loses the waterproof effect and causes the cooling liquid to leak. SUMMARY

[0004] The present invention provides a liquid flow heat dissipating device to improve the assembly efficiency of the water cooling head and increase the flexibility of the water cooling head for future modification.

[0005] The liquid-flow heat dissipation device includes a base, a cover, a flow guide plate and a heat conduction box. The base includes a bottom and an annular wall connected to the bottom, and the bottom and the annular wall together enclose a storage chamber. The bottom of the base has a transverse partition structure, and the annular wall of the base has an external outlet and an external inlet. The cover is arranged on the annular wall. The flow guide plate is arranged on the cover to form an impeller accommodating chamber. The flow guide plate abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber that are not connected. A gap is formed between the flow guide plate and the bottom of the base. The external inlet communicates with the impeller accommodating chamber through the inlet chamber. The heat conduction box is arranged on the bottom of the base away from the annular wall, and the heat conduction box has a heat exchange chamber. The impeller accommodating chamber communicates with the heat exchange chamber through the storage chamber, and the external outlet communicates with the heat exchange chamber through the outlet chamber. The bottom has a first communication port and a second communication port. The impeller accommodating chamber communicates with the heat exchange chamber through the first communication port, and the heat exchange chamber communicates with the external outlet through the second communication port. The first communication port that communicates the impeller accommodating chamber with the heat exchange chamber is offset from the rotation axis of the impeller in the impeller accommodating chamber. During heat dissipation, the cooling liquid enters the inlet chamber through the external inlet, flows into the gap, and then flows into the impeller accommodating chamber. The cooling liquid in the gap is then brought into the heat exchange chamber by the impeller, and finally flows out of the external outlet through the outlet chamber.

[0006] Another embodiment of the present application discloses a liquid flow heat dissipation device, which comprises a base, a cover, a flow guide plate and a heat conduction box. The base comprises a bottom and an annular wall connected to the bottom, and the bottom and the annular wall together surround a storage chamber. The bottom of the base has a transverse partition structure, and the annular wall of the base has an external outlet and an external inlet. The cover is arranged on the annular wall. The flow guide plate is arranged on the cover to form an impeller accommodating chamber. The flow guide plate abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber which are not connected. There is a gap between the flow guide plate and the bottom of the base. The external inlet communicates with the impeller accommodating chamber through the inlet chamber. The heat conduction box is arranged on the bottom of the base away from the annular wall, and the heat conduction box has a heat exchange chamber. The impeller accommodating chamber communicates with the heat exchange chamber through the storage chamber. The external outlet communicates with the heat exchange chamber through the outlet chamber. The annular wall of the base has an external outlet and an external inlet. The bottom has a first communication port and a second communication port. The flow guide plate has an impeller chamber inlet and an impeller chamber outlet which communicate with the impeller accommodating chamber. The external inlet communicates with the impeller chamber inlet through the storage chamber. The impeller chamber outlet communicates with the heat exchange chamber through the first communication port. The heat exchange chamber communicates with the external outlet through the second communication port. The projection of the first communication port and the impeller chamber inlet on the bottom does not overlap. When dissipating heat, the cooling liquid enters the inlet chamber through the external inlet, flows into the gap, and then flows into the impeller accommodating chamber. The cooling liquid in the gap is brought into the heat exchange chamber by the impeller, and finally flows out of the external outlet through the outlet chamber.

[0007] Another embodiment of the present application discloses a liquid flow heat dissipation device, which comprises a base and a heat conduction box. The base comprises a bottom and an annular wall which is integrally connected to the bottom, and the bottom and the annular wall together surround a storage chamber. The heat conduction box is arranged on the bottom of the base away from the annular wall, and the heat conduction box surrounds a heat exchange chamber which communicates with the storage chamber. When dissipating heat, the cooling liquid in the storage chamber is brought into the heat exchange chamber by the rotation of an impeller.

[0008] Another embodiment of the present application discloses a liquid flow heat dissipation device, which comprises a base, a cover, a flow guide plate, a heat conducting box and a sealing member. The base comprises a bottom and an annular wall part integrally connected to the bottom, and the bottom and the annular wall part together enclose a storage chamber. The cover is arranged on the base. The heat conducting box comprises a box body and a cover body, and the cover body covers the box body so that the box body and the cover body together enclose a heat exchange chamber. The heat conducting box is arranged on the bottom of the base away from the annular wall part, and the cover body has at least one opening and communicates with the storage chamber through the at least one opening. The sealing member is matched in size with the at least one opening, is clamped between the cover body and the base, and encloses the at least one opening. When dissipating heat, the cooling liquid in the storage chamber is driven to the heat exchange chamber through the at least one opening by rotating the impeller, and then the cooling liquid in the heat exchange chamber flows out of the heat exchange chamber through the at least one opening.

[0009] According to the liquid flow heat dissipation device of the above embodiment, since the annular wall part and the bottom of the base are integrally formed and in a bowl shape, the convex part and the surrounding part of the cover, the flow guide plate and the impeller are all placed in the bowl-shaped base, so that the assembly process between the base, the cover and the flow guide plate can be simplified, and the assembly difficulty of the liquid flow heat dissipation device is reduced.

[0010] In addition, since the annular wall part and the bottom of the base are integrally formed and in a bowl shape, and most of the lower part of the storage chamber is closed by the bottom, only a small part is designed with the first communication port and the second communication port which communicate with the heat exchange chamber. Therefore, if the original heat conducting box of the liquid flow heat dissipation device is to be modified into a larger size heat conducting box, because of the simple matching, only hole-to-hole is needed, without the combination problem of the overall structure level faced by the prior art. That is, the liquid flow heat dissipation device increases the flexibility of future modification. On the contrary, the base of the prior art adopts an outer cover design, and the heat conducting plate is an open design, both of which together constitute a complete sealed cavity. Once the size or shape of the heat conducting plate changes, the base cannot form a sealed cavity with the heat conducting plate, resulting in the problem of having to be redesigned.

[0011] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the principles of the present application, and provide further explanation of the scope of the patent application of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a perspective view of the liquid flow heat dissipation device according to the first embodiment of the present application.

[0013] Figure 2 It is an exploded view of Figure 1 .

[0014] Figure 3 is a perspective view of the base of the container. Figure 2

[0015] Figure 4 is a perspective view of the closure of the container. Figure 2

[0016] Figure 5 is a cross-sectional view of the closure. Figure 1

[0017] Figure 6 is a partial exploded view of the closure. Figure 1

[0018] Figure 7 is a partial exploded view of the closure. Figure 1

[0019] Figure 8 is a perspective view of the base of the container. Figure 1

[0020] Figure 9 is another perspective view of the base of the container. Figure 1

[0021] Figure 10 is a perspective view of a liquid flow heat sink according to a second embodiment of the application.

[0022] Figure 11 is a perspective view of a liquid flow heat sink according to a third embodiment of the application.

[0023] Figure 12 is an exploded view of the closure. Figure 11

[0024] Figure 13 is a perspective view of the base of the container. Figure 12

[0025] Figure 14 is a perspective view of the closure of the container. Figure 12

[0026] Figure 15 is a cross-sectional view of the closure. Figure 11

[0027] Figure 16 is a partial exploded view of the closure. Figure 11

[0028] Figure 17 is a partial exploded view of the closure. Figure 11

[0029] Figure 18 is a perspective view of the base of the container. Figure 11 ​​​​​​​​​​​​​​

[0030] Figure 19 Fig. 4 is another perspective view of the base and seal according to the first embodiment of the present application. Figure 11 Fig. 5 is another perspective view of the base and seal according to the first embodiment of the present application.

[0031] Figure 20 Fig. 6 is an exploded view of the base and seal according to the second embodiment of the present application.

[0032] In the drawings:

[0033] Liquid flow heat sink 10, 10a, 10b

[0034] First water nozzle 20b

[0035] Second water nozzle 30b

[0036] Base 100, 100b, 100c

[0037] Bottom 110, 110b, 110c

[0038] First communication port 111, 111b, 111c

[0039] Second communication port 112, 112b, 112c

[0040] Transverse partition structure 113

[0041] Annular partition structure 113b

[0042] Transverse partition structure 114b

[0043] Annular wall portion 120, 120b

[0044] Externally connected inlet 121, 121b, 121c

[0045] Externally connected outlet 122, 122b, 122c

[0046] Top surface 123, 123b

[0047] Annular groove 124, 124b

[0048] Partition protrusion 125

[0049] Sealing ring 150, 150b

[0050] Cover 200, 200b

[0051] Top portion 210, 210b

[0052] Protrusion 220, 220b

[0053] Enclosure portion 230, 230b

[0054] Partition protrusion 231b

[0055] baffle 300, 300b

[0056] plate portion 310, 310b

[0057] impeller cavity inlet 311, 311b

[0058] impeller cavity outlet 312, 312b

[0059] support column 320, 320b

[0060] flow blocking member 500, 500b

[0061] second opening 510

[0062] third opening 510b

[0063] heat conduction box 600, 600a, 600b

[0064] box body 610, 610b

[0065] heat absorption surface 611, 611b

[0066] heat dissipation fin 612, 612b

[0067] cover body 620, 620b

[0068] notch 621

[0069] first opening 622

[0070] first opening 621b

[0071] second opening 622b

[0072] seal 650b

[0073] outer seal ring 651b

[0074] first inner seal ring 652b

[0075] second inner seal ring 653b

[0076] seal 650c

[0077] first through hole 651b

[0078] second through hole 652b

[0079] impeller 700, 700b

[0080] drive assembly 750, 750b

[0081] control circuit board 800, 800b

[0082] shield 850, 850b

[0083] directions A-M

[0084] rotation axis AR

[0085] storage chamber S1

[0086] inlet chamber S11

[0087] outlet chamber S12

[0088] drive assembly housing space S2

[0089] impeller housing chamber S3

[0090] heat exchange chamber S4

[0091] gap SG

[0092] channel C1

[0093] directions F1-14 DETAILED DESCRIPTION

[0094] Please refer to Figures 1-2 . Figure 1 is a perspective view of a liquid flow heat sink according to a first embodiment of the present application. Figure 2 is an exploded view of Figure 1

[0095] The liquid flow heat sink 10 of the present embodiment is, for example, a water block for thermally coupling to at least one heat source (not shown) and removing heat generated by the heat source through liquid cooling. The heat source is, for example, a central processing unit or a graphics processing unit. The liquid flow heat sink 10 includes a base 100, a cover 200, a flow guide 300, a heat conduction box 600, an impeller 700, and a drive assembly 750.

[0096] Please refer to Figure 2 and Figure 3 , Figure 3 is a perspective view of the base of Figure 2 The base 100 includes a bottom portion 110 and an annular wall portion 120. The annular wall portion 120 is, for example, integrally connected to the bottom portion 110, and the bottom portion 110 and the annular wall portion 120 together surround a storage chamber S1. For example, the base 100 is an integrally formed structure made by means of injection molding.

[0097] ​In this embodiment, the bottom 110 has a first communication port 111 and a second communication port 112. The first communication port 111 and the second communication port 112 communicate with the storage chamber S1. The bottom 110 can also have a transverse partition structure 113, which divides the bottom space of the storage chamber S1 into two parts. The annular wall portion 120 of the base 100 has an external inlet 121 and an external outlet 122. The external inlet 121 and the external outlet 122 are respectively used to be connected to a water cooling system (not shown) through pipes (not shown). The external outlet 122 and the external inlet 121 both communicate with the storage chamber S1, and communicate with the first communication port 111 and the second communication port 112 through the storage chamber S1. The detailed communication relationship will be described later. In addition, the annular wall portion 120 can also have a top surface 123, an annular groove 124, and a plurality of partition protrusions 125. The annular groove 124 is located on the top surface 123, and the annular groove 124 accommodates a sealing ring 150. The function of the partition protrusions 125 will be described later.

[0098] Please refer to Figure 2 and Figure 4 , Figure 4 for Figure 2 the sectional view of the cover. The cover 200 is installed on the annular wall portion 120 of the base 100 to close one side of the storage chamber S1. For example, the cover 200 includes a top portion 210, a protrusion portion 220, and a surrounding portion 230. The top portion 210 is installed on the annular wall portion 120 of the base 100, for example, by screwing. The top portion 210 is stacked on the top surface 123 of the annular wall portion 120, and the top portion 210 and the annular wall portion 120 jointly clamp the sealing ring 150 to prevent liquid in the storage chamber S1 from leaking from the gap between the top portion 210 and the annular wall portion 120. The protrusion portion 220 and the surrounding portion 230 protrude from the same side of the top portion 210. Specifically, the protrusion portion 220 and the surrounding portion 230 both protrude from the top portion 210 toward the bottom 110 of the base 100. The surrounding portion 230 surrounds the protrusion portion 220, and the surrounding portion 230 and the protrusion portion 220 are separated. The side of the protrusion portion 220 away from the bottom 110 is concave, and surrounds a drive assembly accommodation space S2. The drive assembly accommodation space S2 is not communicated with the storage chamber S1 by the blocking of the top portion 210.

[0099] Please refer to Figure 2 and Figure 5 , Figure 5 for Figure 1 the sectional view of the cover. The cover 200 is installed on the annular wall portion 120 of the base 100 to close one side of the storage chamber S1. For example, the cover 200 includes a top portion 210, a protrusion portion 220, and a surrounding portion 230. The top portion 210 is installed on the annular wall portion 120 of the base 100, for example, by screwing. The top portion 210 is stacked on the top surface 123 of the annular wall portion 120, and the top portion 210 and the annular wall portion 120 jointly clamp the sealing ring 150 to prevent liquid in the storage chamber S1 from leaking from the gap between the top portion 210 and the annular wall portion 120. The protrusion portion 220 and the surrounding portion 230 protrude from the same side of the top portion 210. Specifically, the protrusion portion 220 and the surrounding portion 230 both protrude from the top portion 210 toward the bottom 110 of the base 100. The surrounding portion 230 surrounds the protrusion portion 220, and the surrounding portion 230 and the protrusion portion 220 are separated. The side of the protrusion portion 220 away from the bottom 110 is concave, and surrounds a drive assembly accommodation space S2. The drive assembly accommodation space S2 is not communicated with the storage chamber S1 by the blocking of the top portion 210.

[0100] Please refer to Figure 2 and Figure 6 , Figure 6 forFigure 1 FIG. 6 is a partial exploded view of the heat dissipation device 100. The heat dissipation device 100 comprises a base 100, a cover 200, and a flow guide plate 300. The flow guide plate 300 is disposed on the bottom 110 of the base 100 and the surrounding portion 230 of the cover 200. For example, the flow guide plate 300 comprises a plate portion 310 and a plurality of support columns 320. The plate portion 310 is disposed on the surrounding portion 230, and the surrounding portion 230, the protrusion 220, and the flow guide plate 300 collectively define an impeller accommodation chamber S3.

[0101] The support columns 320 protrude from the plate portion 310 away from the surrounding portion 230 and abut against the bottom 110, so that the plate portion 310 and the bottom 110 maintain a gap SG, and the plate portion 310 abuts against the lateral partition structure 113. In this way, the lateral partition structure 113 divides the gap SG into two regions that are not directly connected, and the storage space S1 is divided into an inlet chamber S11 and an outlet chamber S12 by the partition of the lateral partition structure 113 and the partition protrusion 125. The inlet chamber S11 is connected to the external inlet 121. The outlet chamber S12 is connected to the external outlet 122, and the inlet chamber S11 and the outlet chamber S12 are not directly connected by the blocking of the surrounding portion 230 of the cover 200. The plate portion 310 has an impeller chamber inlet 311 and an impeller chamber outlet 312. The external inlet 121 is connected to the impeller accommodation chamber S3 through the inlet chamber S11 in the storage chamber S1, the gap SG, and the impeller chamber inlet 311. The impeller accommodation chamber S3 is connected to the external outlet 122 through the outlet chamber S12 of the storage chamber S1 and the impeller chamber outlet 312.

[0102] Please refer to Figure 2 and Figure 7 , Figure 7 is Figure 1 FIG. 7 is a partial exploded view of the heat dissipation device 100. The heat dissipation device 100 comprises a base 100, a cover 200, and a flow guide plate 300. The heat dissipation device 100 comprises a base 100, a cover 200, and a flow guide plate 300. The flow guide plate 300 is disposed on the bottom 110 of the base 100 and the surrounding portion 230 of the cover 200. For example, the flow guide plate 300 comprises a plate portion 310 and a plurality of support columns 320. The plate portion 310 is disposed on the surrounding portion 230, and the surrounding portion 230, the protrusion 220, and the flow guide plate 300 collectively define an impeller accommodation chamber S3. Figure 5 In addition, in combination with

[0103] The communication relationship between the chambers and the external inlet 121 and the external outlet 122 is that the external inlet 121 communicates with the impeller accommodating chamber S3 through the inlet chamber S11 of the storage chamber S1, the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 through the impeller chamber outlet 312 and the first communication port 111, the heat exchange chamber S4 communicates with the outlet chamber S12 of the storage chamber S1 through the second communication port 112 and the external outlet 122. In addition, the first communication port 111, which communicates the impeller accommodating chamber S3 with the heat exchange chamber S4, is offset from the rotation axis AR of the impeller 700 and is located at the tangent position of the impeller accommodating chamber S3. The impeller chamber inlet 311 is also offset from the rotation axis AR of the impeller 700.

[0104] In the embodiment, the liquid flow heat dissipation device 10 can further include a flow blocking member 500 stacked on the heat conduction box 600. The flow blocking member 500 covers at least part of the first communication port 111. In detail, the heat conduction box 600 includes a box body 610 and a cover body 620. The box body 610 has a heat absorbing surface 611. The heat absorbing surface 611 is used to be thermally coupled to at least one heat source. The heat source is, for example, a central processing unit or an image processing unit. In addition, the box body 610 has a plurality of heat dissipation fins 612 on the side away from the heat absorbing surface 611 to improve the heat exchange efficiency of the liquid flow heat dissipation device 10 and the heat source. The cover body 620 is fixed to the box body 610 by bonding means such as welding, pressing or gluing to serve as the cover of the heat exchange chamber S4. The box body 610 is fixed to the bottom 110, and the cover body 620 is between the box body 610 and the bottom 110. The cover body 620 has an opening 621 and a first opening 622. The flow blocking member 500 is clamped between the cover body 620 and the heat dissipation fins 612 and has a second opening 510. The second opening 510 is aligned with the first opening 622, and the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 through the first opening 622 and the second opening 510. The flow blocking member 500 limits the direction and range of water flow through the second opening 510. The external outlet 122 communicates with the heat exchange chamber S4 through the opening 621. The size of the second opening 510 is smaller than the size of the first opening 622, and the second opening 510 is offset from the first communication port 111.

[0105] In the embodiment, the cover body 620 and the flow blocking member 500 are two independent components, but this is not the case. In other embodiments, the cover and the flow blocking member are integrally formed.

[0106] In the embodiment, the flow blocking member 500 is located in the heat conduction box 600, but this is not the case. In other embodiments, the flow blocking member can also be located outside the heat conduction box.

[0107] Please refer to Figure 2Impeller 700 is rotatably located in impeller accommodating chamber S3. Driving assembly 750 is located in driving assembly accommodating space S2 and is used to drive impeller 700 to rotate relative to base 100. In addition, convex portion 220 of cover 200, surrounding portion 230, flow guide plate 300 and impeller 700 are all located in storage chamber S1 and are surrounded by annular wall portion 120.

[0108] Please refer to Figure 2 Liquid-flow heat dissipation device 10 can further include a control circuit board 800 and a shield 850. Control circuit board 800 is fixed to top portion 210 of cover 200, and control circuit board 800 is electrically connected to driving assembly 750 to adjust the rotating speed of driving assembly 750 through control circuit board 800. If control circuit board 800 is additionally provided with a light source and a temperature sensor, control circuit board 800 can also control the light effect and monitor the temperature. Shield 850 is fixed to base 100 and covers cover 200, driving assembly 750 and part of annular wall portion 120. Shield 850 has the functions of protecting control circuit board and driving assembly and can also be used as a place for installing decorations and light effects.

[0109] In the embodiment, liquid-flow heat dissipation device 10 is provided with shield 850, but it is not limited thereto. In other embodiments, shield 850 can be omitted.

[0110] Please refer to Figure 2 、 Figure 8 and Figure 9 , Figure 8 is Figure 1 a perspective view of a cross section. Figure 9 is Figure 1 another perspective view of a cross section.

[0111] As shown in Figure 2 and Figure 8 , when liquid-flow heat dissipation device 10 is in operation, first, the cooling liquid flows into inlet chamber S11 of storage chamber S1 from outer connecting inlet 121 along direction A. Then, the cooling liquid located in inlet chamber S11 flows into the gap SG between plate portion 310 of flow guide plate 300 and bottom portion 110 of base 100 along directions B, C and D in sequence. Then, the cooling liquid located in gap SG flows into impeller accommodating chamber S3 through impeller chamber inlet 311 along direction E. Then, the cooling liquid located in impeller accommodating chamber S3 is first driven by impeller 700 to be thrown to the tangent of impeller accommodating chamber S3 along directions F and G, and then flows through impeller chamber outlet 312 and first connecting port 111 along direction H in sequence.

[0112] Then, as shown in Figure 2 and Figure 9As shown, the coolant flows sequentially along direction I through the first opening 622 of the cover 620 into the heat exchange chamber S4. The flow state of the coolant is controlled by the second opening 510, allowing the coolant to flow into the microchannels between the heat dissipation fins 612 according to the heat exchange requirements. For example, the length, width, or shape of the opening can be adjusted according to the temperature distribution of the heat absorption surface 611 to concentrate the coolant flow to the high-temperature area of ​​the heat absorption surface 611, thereby improving the heat exchange efficiency at the high-temperature area of ​​the heat absorption surface 611. Next, the coolant flows sequentially along directions J, K, L, and M in the heat exchange chamber S4, and flows out from the external outlet 122 through the notch 621 and the second connecting port 112 of the cover 620.

[0113] Because pairing is simple, requiring only hole-to-hole alignment, and avoids the overall structural integration issues faced by existing technologies, the fluid flow cooling system gains greater flexibility for future retrofitting. Please refer to [link / reference]. Figure 10 . Figure 10 This is a perspective view of the liquid flow cooling device according to the second embodiment of the present invention. The structure of the liquid flow cooling device 10a in this embodiment is similar to that of the liquid flow cooling device 10 in the above embodiment, the only difference being that this embodiment uses a larger heat conduction box 600a. That is, the size of the heat conduction box 600a is larger than that of the heat conduction box 600. In other words, if there is a need to replace the heat conduction box 600a with a larger one, the assembler can directly replace the small heat conduction box with the large heat conduction box 600a.

[0114] Please see Figures 11-12 . Figure 11 This is a three-dimensional schematic diagram of the liquid flow cooling device according to the third embodiment of the present invention. Figure 12 for Figure 11 A schematic diagram of its breakdown.

[0115] The liquid flow cooling device 10b in this embodiment is, for example, a water cooling head, used for thermal coupling to at least one heat source (not shown), and for removing the heat generated by the heat source through liquid cooling. The heat source is, for example, a central processing unit or a graphics processing unit. The liquid flow cooling device 10b includes a base 100b, a cover 200b, a guide plate 300b, a heat conduction box 600b, an impeller 700b, and a drive assembly 750b.

[0116] Please see Figure 12 and Figure 13 , Figure 13 for Figure 12 A three-dimensional cross-sectional view of the base. The base 100b includes a bottom 110b and an annular wall 120b. The annular wall 120b is integrally formed to the bottom 110b, and the bottom 110b and the annular wall 120b together surround a storage chamber S1. For example, the base 100b is an integrally formed structure manufactured by injection molding.

[0117] In this embodiment, the bottom 110b has a first communication port 111b and a second communication port 112b. The first communication port 111b and the second communication port 112b communicate with the storage chamber S1. The bottom 110b can also have an annular partition structure 113b and a transverse partition structure 114b. The annular partition structure 113b and the transverse partition structure 114b together divide the bottom space of the storage chamber S1 into three parts, which will be described later. The annular wall portion 120b of the base 100b has an external inlet 121b and an external outlet 122b. The external inlet 121b and the external outlet 122b are respectively used to connect the pipeline (not shown) through the first water nozzle 20b and the second water nozzle 30b, and are connected to the water cooling system (not shown) through the pipeline. The external outlet 122b and the external inlet 121b both communicate with the storage chamber S1, and communicate the first communication port 111b and the second communication port 112b through the storage chamber S1. The detailed communication relationship will be described later. In addition, the annular wall portion 120b can also have a top surface 123b and an annular groove 124b. The annular groove 124b is located on the top surface 123b, and the annular groove 124b accommodates a sealing ring 150b.

[0118] Please refer to Figure 12 and Figure 14 , Figure 14 is Figure 12 a perspective view of a cover. The cover 200b is installed on the annular wall portion 120b of the base 100b to close one side of the storage chamber S1. For example, the cover 200b includes a top portion 210b, a protruding portion 220b, and a surrounding portion 230b. The top portion 210b is installed on the annular wall portion 120b of the base 100b, for example, by screwing. The top portion 210b is stacked on the top surface 123b of the annular wall portion 120b, and the top portion 210b and the annular wall portion 120b together sandwich the sealing ring 150b to prevent liquid in the storage chamber S1 from leaking from the gap between the top portion 210b and the annular wall portion 120b. The protruding portion 220b and the surrounding portion 230b protrude from the same side of the top portion 210b. Specifically, the protruding portion 220b and the surrounding portion 230b both protrude from the top portion 210b toward the bottom 110b of the base 100b. The surrounding portion 230b surrounds the protruding portion 220b, and the surrounding portion 230b is separated from the protruding portion 220b. The protruding portion 220b is concave on the side away from the bottom 110b, and surrounds a drive assembly accommodation space S2. The drive assembly accommodation space S2 is not communicated with the storage chamber S1 by the blocking of the top portion 210b. The surrounding portion 230b has a partition protruding portion 231b protruding in the radial direction.

[0119] Please refer to Figure 12 and Figure 15 , Figure 15 is Figure 11A cross-sectional schematic diagram. The dividing protrusion 231b of the enclosure 230b of the cover 200b, together with at least other parts, abuts against the annular wall 120b of the base 100b, dividing the upper space of the storage chamber S1 into two parts. That is, when the top 210b is stacked on the top surface 123b of the annular wall 120b, the dividing protrusion 231b of the enclosure 230b abuts against the annular wall 120b, together with the transverse dividing structure 114b, dividing the storage chamber S1 into an inlet chamber S11 and an outlet chamber S12, which will be explained later.

[0120] Please see Figure 12 and Figure 16 , Figure 16 for Figure 11 A partially exploded view. The guide vane 300b is stacked on opposite sides of the bottom 110b of the base 100b and the surrounding portion 230b of the cover 200b. For example, the guide vane 300b includes a plate portion 310b and multiple support columns 320b. The plate portion 310b is stacked on the surrounding portion 230b, and the surrounding portion 230b, the protrusion 220b, and the guide vane 300b together surround an impeller housing chamber S3.

[0121] These support columns 320b protrude from the side of the plate portion 310b away from the surrounding portion 230b and abut against the bottom 110b, maintaining a gap SG between the plate portion 310b and the bottom 110b. The plate portion 310b abuts against the annular partition structure 113b and the transverse partition structure 114b. In this way, the annular partition structure 113b divides a channel C1, and the transverse partition structure 114b divides the gap SG into two non-directly connected regions. The inlet chamber S11 connects to the external inlet 121b. The outlet chamber S12 connects to the external outlet 122b, and the inlet chamber S11 and the outlet chamber S12 are not directly connected by the obstruction of the annular partition structure 113b, the transverse partition structure 114b, and the partition protrusion 231b. The plate portion 310b has an impeller cavity inlet 311b and an impeller cavity outlet 312b. The external inlet 121b connects to the impeller housing chamber S3 via the inlet chamber S11 of the storage chamber S1, the gap SG, and the impeller chamber inlet 311b. The impeller housing chamber S3 connects to the first connecting port 111b via the impeller chamber outlet 312b and the channel C1. Furthermore, a composite... Figure 5 The projections of the first connecting port 111b and the impeller cavity inlet 311b on the bottom 110b do not overlap, and the projections of the first connecting port 111b and the impeller cavity outlet 312b on the bottom 110b do not overlap.

[0122] Please see Figure 12 and Figure 17 , Figure 17 for Figure 11Figure 6B is a schematic view of a partial exploded view of the liquid cooling device 10b. The heat conduction box 600b is disposed on the bottom 110b of the base 100b away from the side of the annular wall portion 120b, and the heat conduction box 600b has a heat exchange chamber S4. The impeller accommodating chamber S3 is connected to the heat exchange chamber S4 through the storage chamber S1.

[0123] The connection relationship between the above-mentioned chambers, the external inlet 121b and the external outlet 122b is that the external inlet 121b is connected to the impeller accommodating chamber S3 through the inlet chamber S11 of the storage chamber S1, the impeller accommodating chamber S3 is connected to the heat exchange chamber S4 through the impeller chamber outlet 312b, the channel C1 and the first connection port 111b. The heat exchange chamber S4 is connected to the external outlet 122b through the second connection port 112b and the outlet chamber S12 of the storage chamber S1. In addition, the first connection port 111b connecting the impeller accommodating chamber S3 and the heat exchange chamber S4 is offset from the rotation axis AR of the impeller 700b. The impeller chamber inlet 311b is also offset from the rotation axis AR of the impeller 700b. The impeller chamber outlet 312b is located at the tangent position of the impeller accommodating chamber S3.

[0124] In this embodiment, the liquid cooling device 10b can also include a flow blocking member 500b stacked on the heat conduction box 600b. The flow blocking member 500b covers at least part of the first connection port 111b. In detail, the heat conduction box 600b includes a box body 610b and a cover body 620b. The box body 610b has a heat absorbing surface 611b. The heat absorbing surface 611b is used to be thermally coupled to at least one heat source. The heat source is, for example, a central processing unit or an image processing unit. In addition, the box body 610b has a plurality of heat dissipation fins 612b on the side away from the heat absorbing surface 611b to improve the heat exchange efficiency of the liquid cooling device 10b and the heat source. The cover body 620b is fixed to the box body 610b by bonding means such as welding, pressing or gluing to serve as a cover of the heat exchange chamber S4. The box body 610b is fixed to the bottom 110b, and the cover body 620b is between the box body 610b and the bottom 110b. The cover body 620b has a first opening 621b and a second opening 622b. The flow blocking member 500b is clamped between the cover body 620b and the heat dissipation fins 612b and has a third opening 510b. The third opening 510b is aligned with the second opening 622b, and the impeller accommodating chamber S3 is connected to the heat exchange chamber S4 through the second opening 622b and the third opening 510b. The flow blocking member 500b limits the direction and range of water flow through the third opening 510b. The external outlet 122b is connected to the heat exchange chamber S4 through the second opening 622b.

[0125] In this embodiment, the cover body 620b and the flow blocking member 500b are two independent components, but this is not limited. In other embodiments, the cover body and the flow blocking member are integrally formed.

[0126] In the present embodiment, the flow blocking member 500b is located in the heat conducting box 600b, but the present application is not limited thereto. In other embodiments, the flow blocking member can also be located outside the heat conducting box.

[0127] In the present embodiment, the liquid cooling device 10b can further comprise a sealing member 650b. The sealing member 650b comprises an outer sealing ring 651b, a first inner sealing ring 652b and a second inner sealing ring 653b. The first inner sealing ring 652b is connected to the second inner sealing ring 653b and is connected to the outer sealing ring 651b. The sealing member 650b is arranged on the bottom 110b of the base 100b and faces away from the storage chamber S1. The first inner sealing ring 652b surrounds the first communication port 111b to prevent fluid from flowing out of the first communication port 111b. The second inner sealing ring 653b surrounds the second communication port 112b to prevent fluid from flowing out of the second communication port 112b.

[0128] In the present embodiment, the outer sealing ring 651b, the first inner sealing ring 652b and the second inner sealing ring 653b are connected to each other, but the present application is not limited thereto. In other embodiments, the outer sealing ring, the first inner sealing ring and the second inner sealing ring can also be three separate elements.

[0129] Please refer to Figure 12 and Figure 15 . The impeller 700b is rotatably located in the impeller accommodating chamber S3. The driving assembly 750b is located in the driving assembly accommodating space S2 and is used to drive the impeller 700b to rotate relative to the base 100b. In addition, the convex portion 220b, the surrounding portion 230b, the flow guide plate 300b and the impeller 700b of the cover 200b are located in the storage chamber S1 and are surrounded by the annular wall portion 120b.

[0130] Please refer to Figure 12 . The liquid cooling device 10b can further comprise a control circuit board 800b and a shield 850b. The control circuit board 800b is fixed to the top 210b of the cover 200b and the control circuit board 800b is electrically connected to the driving assembly 750b to adjust the speed of the driving assembly 750b through the control circuit board 800b. If the control circuit board 800b is additionally provided with a light source and a temperature sensor, the control circuit board 800b can also control the light effect and monitor the temperature. The shield 850b is fixed to the base 100b and covers the cover 200b, the driving assembly 750b and part of the annular wall portion 120b. The shield 850b has the functions of protecting the control circuit board and the driving assembly, and can also be used as a place for installing decorations and light effects.

[0131] In this embodiment, the fluid cooling device 10b is equipped with a shield 850b, but this is not a limitation. In other embodiments, the shield may be omitted. Furthermore, in this embodiment, the shield 850b is, for example, but not limited to, a one-piece molded part or an assembly composed of multiple components.

[0132] Please see Figure 12 , Figure 18 and Figure 19 , Figure 18 for Figure 11 A three-dimensional cross-sectional schematic diagram. Figure 19 for Figure 11 Another three-dimensional cross-sectional view.

[0133] like Figure 12 and Figure 18 As shown, when the liquid flow cooling device 10b is operating, firstly, the coolant flows along direction F1 from the external inlet 121b into the inlet chamber S11 of the storage chamber S1. Next, the coolant in the inlet chamber S11 flows sequentially along directions F2, F3, and F4 into the gap SG between the plate portion 310b of the guide plate 300b and the bottom 110b of the base 100b. Then, the coolant in the gap SG flows along direction F5 through the impeller cavity inlet 311b into the impeller housing chamber S3. Next, the coolant in the impeller housing chamber S3 is first driven by the impeller 700b and thrown along direction F6 to the tangent of the impeller housing chamber S3, then flows sequentially along directions F7 and F8 through the impeller cavity outlet 312b, the channel C1, and the first connecting port 111b located at the tangent position of the outer periphery of the impeller housing chamber S3.

[0134] Next, as Figure 12 , Figure 18 and Figure 19 As shown, the coolant flows sequentially along direction F9 through the second opening 622b and the third opening 510b of the cover 620b into the heat exchange chamber S4. The flow state of the coolant is controlled by the third opening 510b, allowing the coolant to flow into the microchannels between the heat dissipation fins 612b according to the heat exchange requirements. For example, in the design, the length, width, or shape of the opening can be adjusted according to the temperature distribution of the heat absorption surface 611b to concentrate the coolant flow to the high temperature area of ​​the heat absorption surface 611b, thereby improving the heat exchange efficiency at the high temperature area of ​​the heat absorption surface 611b. Next, the coolant in the heat exchange chamber S4 flows sequentially along directions F10, F11, F12, F13, and F14, and flows out from the external outlet 122b through the second opening 622b and the second connecting port 112b of the cover 620b.

[0135] Please see Figure 20 . Figure 20Figure 8 is an exploded view of a base and a seal according to a fourth embodiment of the present application. The seal 650c of this embodiment is used to replace the seal 650b of the above-mentioned embodiments, and has similar connection and positional relationships with the base 100b and the heat-conducting box 600b. Therefore, the base 100c and the seal 650c will be described below. The base 100c includes a bottom 110c and an annular wall 120c. The bottom 110c has a first communication port 111c and a second communication port 112c. The annular wall 120c has an external inlet 121c and an external outlet 122c. The external inlet 121c and the external outlet 122c directly or indirectly communicate with the first communication port 111c and the second communication port 112c. The seal 650c, for example, is in the shape of a sheet, and has a first through-hole 651c and a second through-hole 652c. The first through-hole 651c is aligned with the first communication port 111c and the first opening 621b (as shown in Figure 6) of the heat-conducting box 600b, and the size of the first through-hole 651c matches the size of the first opening 621b, so as to avoid leakage of fluid flowing between the first communication port 111c and the first opening 621b. The second through-hole 652c is aligned with the second communication port 112c and the second opening 622b (as shown in Figure 6) of the heat-conducting box 600b, and the size of the second through-hole 652c matches the size of the second opening 622b, so as to avoid leakage of fluid flowing between the second communication port 112c and the second opening 622b. Figure 17 Figure 17

[0136] According to the liquid-flow heat dissipation device of the above-mentioned embodiments, since the annular wall and the bottom of the base are integrally formed and in the shape of a bowl, the convex portion and the surrounding portion of the cover, the flow guide plate, and the impeller are all placed in the bowl-shaped base, so as to simplify the assembly procedure between the base, the cover, and the flow guide plate, and to reduce the assembly difficulty of the liquid-flow heat dissipation device.

[0137] In addition, since the annular wall and the bottom of the base are integrally formed and in the shape of a bowl, and most of the lower portion of the storage chamber is closed by the bottom, only a small portion is designed with the first communication port and the second communication port that are connected with the heat exchange chamber. Therefore, if the original heat-conducting box of the liquid-flow heat dissipation device is to be modified into a larger size heat-conducting box, because of the simple matching, only hole-to-hole is needed, and there is no problem of combination of the overall structure as faced by the prior art. Therefore, the liquid-flow heat dissipation device has increased flexibility for future modification. On the contrary, the base of the prior art is mostly designed in the form of an outer cover, and the heat-conducting plate is designed in an open form, and both of them together constitute a complete closed chamber. Once the size or shape of the heat-conducting plate is changed, the base cannot form a closed chamber with the heat-conducting plate, resulting in the problem of having to be redesigned.

[0138] ​​Although the present application has been disclosed with reference to the above embodiments, the above embodiments are not intended to limit the present application, and any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present application. Therefore, the patent protection scope of the present application should be defined by the patent protection scope of the application attached to the present specification.

Claims

1. A liquid flow heat dissipating device, characterized by, The base comprises a bottom and an annular wall connected to the bottom, and the bottom and the annular wall together surround a storage chamber, the bottom of the base has a transverse partition structure, the annular wall of the base has an external outlet and an external inlet; The cover is arranged on the annular wall; The flow guide plate is stacked on the cover to form an impeller accommodating chamber, the flow guide plate abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber that are not connected, and the external inlet communicates with the impeller accommodating chamber through the inlet chamber; The heat conduction box is arranged on the bottom of the base away from the annular wall, and the heat conduction box has a heat exchange chamber, the impeller accommodating chamber communicates with the heat exchange chamber through the storage chamber, and the external outlet communicates with the heat exchange chamber through the outlet chamber; The bottom has a first communication port and a second communication port, the impeller accommodating chamber communicates with the heat exchange chamber through the first communication port, the heat exchange chamber communicates with the external outlet through the second communication port, and the first communication port communicating the impeller accommodating chamber and the heat exchange chamber is offset from the rotation axis of the impeller in the impeller accommodating chamber; When dissipating heat, the cooling liquid enters the inlet chamber through the external inlet, then flows into the gap, and then flows into the impeller accommodating chamber, and then is brought into the heat exchange chamber by the impeller, and finally flows out from the external outlet through the outlet chamber. The cover comprises a top, a convex part and a surrounding part, the opposite sides of the flow guide plate are respectively stacked on the base and the surrounding part, the surrounding part, the convex part and the flow guide plate together surround the impeller accommodating chamber, the top is arranged on the annular wall, the convex part and the surrounding part protrude from the same side of the top, the surrounding part surrounds the convex part, and the convex part surrounds a driving assembly accommodating space on the side away from the bottom, and the driving assembly accommodating space is not connected to the storage chamber.

2. The liquid flow heat sink of claim 1, wherein The flow guide plate comprises a plate part and a plurality of support columns, the plate part is stacked on the surrounding part, the support columns protrude from the side of the plate part away from the surrounding part and abut against the bottom, so that the plate part and the bottom maintain the gap, and the external inlet communicates with the impeller accommodating chamber through the gap.

3. The liquid flow heat sink of claim 2, wherein The plate part has an impeller chamber inlet and an impeller chamber outlet, the gap communicates with the impeller accommodating chamber through the impeller chamber inlet, and the impeller accommodating chamber communicates with the heat exchange chamber through the impeller chamber outlet and the first communication port.

4. The liquid flow heat sink of claim 3, wherein Further comprising at least one flow blocking member stacked on the heat conduction box, the at least one flow blocking member covers at least part of the first communication port.

5. The liquid flow heat sink of claim 1, wherein ​ 6. The liquid flow heat sink of claim 5, wherein The heat conduction box comprises a box body and a cover body fixed to the box body. The box body is fixed to the bottom, and the cover body is located between the box body and the bottom. The box body has a plurality of heat dissipation fins. The cover body has a notch and a first opening. The at least one flow blocking member is clamped between the cover body and the heat dissipation fins and has a second opening. The second opening is aligned with the first opening. The impeller accommodating chamber communicates with the heat exchange chamber through the first opening and the second opening. The external outlet communicates with the heat exchange chamber through the notch.

7. The liquid flow heat sink of claim 2, wherein The annular wall portion further has at least one partition protrusion. The surrounding portion is at least partially pressed against the at least one partition protrusion of the annular wall portion.

8. The liquid flow heat sink of claim 1, wherein, The first communication port, which communicates the impeller accommodating chamber and the heat exchange chamber, is located outside the 1 / 2 radius range of the impeller.

9. The liquid flow heat sink of claim 6, wherein, The size of the second opening is smaller than the size of the first opening, and the second opening is misaligned with the first communication port.

10. The liquid flow heat sink of claim 6, wherein, The cover body and the at least one flow blocking member are two independent components.

11. The liquid flow heat sink of claim 6, wherein, The cover body and the at least one flow blocking member are integrally formed.

12. The liquid flow heat sink of claim 2, wherein, The bottom and the annular wall portion are integrally formed, and the protrusion of the cover, the surrounding portion, the flow guide plate, and the impeller are located in the storage chamber and surrounded by the annular wall portion.

13. The liquid flow heat sink of claim 2, wherein, Further comprising a shield fixed to the base and covering the cover, a drive assembly located in the drive assembly accommodating space, and part of the annular wall portion.

14. The liquid flow heat sink of claim 13, wherein, Further comprising a control circuit board fixed to the top of the cover and electrically connected to the drive assembly.

15. A liquid flow heat sink, comprising: Comprise: A base comprising a bottom and an annular wall portion connected to the bottom. The bottom and the annular wall portion together surround a storage chamber. The bottom of the base has a transverse partition structure. The annular wall portion of the base has an external outlet and an external inlet. A cover installed on the annular wall portion. A flow guide plate stacked on the cover to form an impeller accommodating chamber. The flow guide plate abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber that are not connected. There is a gap between the flow guide plate and the bottom of the base. The external inlet communicates with the impeller accommodating chamber through the inlet chamber. A heat conduction box installed on the side of the bottom of the base away from the annular wall portion. The heat conduction box has a heat exchange chamber. The impeller accommodating chamber communicates with the heat exchange chamber through the storage chamber. The external outlet communicates with the heat exchange chamber through the outlet chamber. The annular wall portion of the base has an external outlet and an external inlet. The bottom has a first communication port and a second communication port. The flow guide plate has an impeller chamber inlet and an impeller chamber outlet that communicate with the impeller accommodating chamber. The external inlet communicates with the impeller chamber inlet through the storage chamber. The impeller chamber outlet communicates with the heat exchange chamber through the first communication port. The heat exchange chamber communicates with the external outlet through the second communication port. The projections of the first communication port and the impeller chamber inlet on the bottom do not overlap. When heat is dissipated, the cooling liquid enters the inlet chamber through the external inlet, flows into the gap, and then flows into the impeller accommodating chamber. The cooling liquid in the gap is then brought into the heat exchange chamber by the impeller, and finally flows out of the external outlet through the outlet chamber.

16. The liquid flow heat sink of claim 15, wherein, The cover comprises a top, a protruding portion, and a surrounding portion. The opposite sides of the flow guide plate are respectively stacked on the base and the surrounding portion. The surrounding portion, the protruding portion, and the flow guide plate collectively surround the impeller accommodating chamber. The top is arranged on the annular wall portion. The protruding portion and the surrounding portion protrude from the same side of the top. The surrounding portion surrounds the protruding portion. The protruding portion surrounds a driving assembly accommodating space on the side away from the base. The driving assembly accommodating space is not connected to the storage chamber.

17. The liquid flow heat sink of claim 15, wherein, The projection of the first communication port and the outlet of the impeller chamber on the base do not overlap.

18. The liquid flow heat sink of claim 16, wherein, The flow guide plate comprises a plate portion and a plurality of support columns. The plate portion is stacked on the surrounding portion. The support columns protrude from the side of the plate portion away from the surrounding portion and abut against the base, so that the plate portion and the base maintain the gap. The gap is connected to the external inlet and the impeller accommodating chamber through the impeller chamber inlet. The impeller accommodating chamber is connected to the heat exchange chamber through the outlet of the impeller chamber and the first communication port.

19. The liquid flow heat sink of claim 16, wherein, The base has an annular separation structure surrounding a channel. One end of the channel is connected to the first communication port. The other end of the channel is connected to the outlet of the impeller chamber.

20. The liquid flow heat sink of claim 16, wherein, Further comprising at least one flow blocking member stacked on the heat conduction box. The heat conduction box comprises a box body and a cover body. The cover body is fixed to the box body. The box body is fixed to the base, so that the cover body is between the box body and the base. The box body has a plurality of heat dissipation fins. The cover body has a first opening and a second opening. The at least one flow blocking member is clamped between the cover body and the heat dissipation fins and has a third opening. The third opening is aligned with the first opening. The impeller accommodating chamber is connected to the heat exchange chamber through the first opening and the third opening. The external outlet is connected to the heat exchange chamber through the second opening.

21. The liquid flow heat sink of claim 20, wherein, Further comprising a seal. The seal comprises an outer sealing ring, a first inner sealing ring, and a second inner sealing ring. The first inner sealing ring and the second inner sealing ring are connected inside the outer sealing ring. The sizes of the first inner sealing ring and the second inner sealing ring match the sizes of the first opening and the second opening, respectively. The first inner sealing ring and the second inner sealing ring surround the first opening and the second opening, respectively.

22. The liquid flow heat sink of claim 21, wherein, The seal has a first through hole and a second through hole. The sizes of the first through hole and the second through hole match the sizes of the first opening and the second opening, respectively. The first through hole and the second through hole surround the first opening and the second opening, respectively.

23. The liquid flow heat sink of claim 20, wherein, The cover body and the at least one flow blocking member are two independent components.

24. The liquid flow heat sink of claim 20, wherein, The cover body and the at least one flow blocking member are integrally formed.

25. The liquid flow heat sink of claim 16, wherein, The surrounding portion of the cover further has at least one separation protruding portion. The separation protruding portion abuts against the annular wall portion.

26. The liquid flow heat sink of claim 16, wherein, The base and the annular wall portion are integrally formed. The protruding portion, the surrounding portion, the flow guide plate, and the impeller of the cover are all located in the storage chamber and surrounded by the annular wall portion.

27. The liquid flow heat sink of claim 16, wherein, Further comprising a shield fixed to the base and covering the cover, a drive assembly located in the drive assembly accommodating space of the base and part of the annular wall portion.

28. The liquid flow heat sink of claim 27, wherein, Further comprising a control circuit board fixed to the top of the cover and electrically connected to the drive assembly.

29. A liquid flow heat sink, comprising: Further comprising: a base comprising a bottom and an annular wall portion integrally connected to the bottom, and the bottom and the annular wall portion together surrounding a storage cavity; a cover arranged on the base; a heat-conducting box comprising a box body and a cover body covering the box body so that the box body and the cover body together surround a heat exchange cavity, the heat-conducting box being arranged on the side of the bottom of the base away from the annular wall portion, and the cover body having at least one opening and being in communication with the storage cavity through the at least one opening; a sealing element matching the size of the at least one opening in size, the sealing element being clamped between the cover body and the base and surrounding the at least one opening; When dissipating heat, the cooling liquid in the storage cavity is driven into the heat exchange cavity through the at least one opening by rotating the impeller, and the cooling liquid in the heat exchange cavity flows out of the heat exchange cavity through the at least one opening.

30. The liquid flow heat sink of claim 29, wherein, The sealing element comprises an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring being connected inside the outer sealing ring, the at least one opening comprising a first opening and a second opening, the sizes of the first inner sealing ring and the second inner sealing ring matching the sizes of the first opening and the second opening respectively, and the first inner sealing ring and the second inner sealing ring surrounding the first opening and the second opening respectively, the cooling liquid in the storage cavity flowing into the heat exchange cavity through the first opening, and the cooling liquid in the heat exchange cavity flowing out through the second opening.

31. The liquid flow heat sink of claim 29, wherein, The sealing element has a first through hole and a second through hole, the at least one opening comprising a first opening and a second opening, the sizes of the first through hole and the second through hole matching the sizes of the first opening and the second opening respectively, and the first through hole and the second through hole surrounding the first opening and the second opening respectively, the cooling liquid in the storage cavity flowing into the heat exchange cavity through the first opening, and the cooling liquid in the heat exchange cavity flowing out through the second opening.

32. The liquid flow heat sink of claim 29, wherein, Further comprising: a drive assembly arranged on the cover and located outside the storage cavity, and used to drive the impeller to rotate relative to the base.

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