Optical fiber circuit board components and optoelectronic hybrid circuit boards

Abstract

The present application relates to the technical field of circuit boards, and specifically discloses an optical fiber circuit board assembly and an optoelectronic hybrid circuit board, wherein the optical fiber circuit board assembly at least comprises: a substrate, comprising a main body with a first window and a second window, a first extension formed by the main body located at the inner side of the first window extending toward the center of the first window, a second extension formed by extending outward from the outer side of the main body, and a third extension formed by extending outward from the outer side of the main body, wherein the ends of the plurality of third extensions are semi-enclosed or enclosed, and the inner side of the second window, the end of the first extension, the end of the second extension, and the end of the third extension are all provided with fiber outlets; a plurality of optical fiber units, partially arranged on the substrate, one end of each of the plurality of optical fiber units extending from one of the fiber outlets, and the other end of each of the plurality of optical fiber units extending from any of the remaining fiber outlets. In the above manner, the present application can simplify the assembly of optical and electrical interconnections, and greatly improve efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to an optical fiber circuit board assembly and an optoelectronic hybrid circuit board. Background Art

[0002] Electrical interconnection refers to the use of metal lines (usually copper) to achieve signal connections between circuit boards and chips. Optical interconnection refers to the use of light-conducting media (optical fibers, optical waveguides, etc.) to achieve signal connections between circuit boards and chips.

[0003] Optical interconnection can be combined with electrical interconnection, but currently the number of optical fibers in optical interconnection is usually large, which can easily lead to problems such as disorganization and difficulty in assembly. Summary of the invention

[0004] The embodiments of the present application provide a fiber optic circuit board assembly and an optoelectronic hybrid circuit board to solve the technical problem in the prior art that optical interconnection can be difficult to assemble with electrical interconnection.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide an optical fiber circuit board assembly, comprising at least: a substrate, comprising a main body with a first window and a second window, a first extension portion formed by the main body located at the inner side of the first window extending toward the center of the first window, a second extension portion formed by extending outward from the outer side of the main body, and a third extension portion formed by extending outward from the outer side of the main body, wherein the ends of the plurality of third extension portions are semi-enclosed or enclosed, and the inner side of the second window, the end of the first extension portion, the end of the second extension portion and the end of the third extension portion are all provided with fiber outlets; a plurality of optical fiber units, partially arranged on the substrate, one end of each of the plurality of optical fiber units extending from one of the fiber outlets, and the other end of each of the plurality of optical fiber units extending from any of the remaining fiber outlets.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide an optoelectronic hybrid circuit board, the optoelectronic hybrid circuit board includes: a printed circuit board; the aforementioned optical fiber circuit board assembly, which is stacked with the printed circuit board; a first electronic component, which is arranged on the printed circuit board, and the first electronic component is arranged corresponding to the first window; a first optical device, which is arranged on the printed circuit board, the optical fiber unit is coupled to the first optical device through an optical fiber interface, and the first optical device is coupled to the first electronic component through the printed circuit board, and the first optical device is arranged on the periphery of the first electronic component.

[0007] The beneficial effects of the present application are as follows: different from the prior art, the substrate of the present application includes a main body with a first window and a second window, a first extension portion formed by the main body located at the inner side of the first window extending toward the center of the first window, a second extension portion formed by extending outward from the outer side of the main body, and a third extension portion formed by extending outward from the outer side of the main body; the optical fiber unit part is arranged on the substrate, and each end of the plurality of optical fiber units extends from one of the fiber outlets, and each other end of the plurality of optical fiber units extends from any of the remaining fiber outlets, thereby realizing the fixation of the optical fiber unit and the protection of the optical fiber unit, and thus there will be no disorder, the arrangement order and position of the optical fiber unit are fixed, and there is no need to reposition the connected optical devices one by one, thereby greatly simplifying the assembly of optical and electrical interconnections and greatly improving the efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0009] Figure 1 It is a structural schematic diagram of an embodiment of an optical fiber circuit board assembly of the present application;

[0010] Figure 2 It is a structural schematic diagram of another embodiment of the optical fiber circuit board assembly of the present application;

[0011] Figure 3 This is a schematic structural diagram of a first embodiment of an optoelectronic hybrid circuit board of the present application;

[0012] Figure 4 It is a structural schematic diagram of another embodiment of the optical fiber circuit board assembly of the present application;

[0013] Figure 5 It is a structural schematic diagram of the second embodiment of the optoelectronic hybrid circuit board of the present application. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0015] See also Figure 1In this embodiment, the optical fiber circuit board assembly 10 may include a circuit board that transmits only optical signals, or may include a circuit board that transmits mixed signals including optical signals.

[0016] The optical fiber circuit board assembly 10 at least includes: a substrate 11 , an optical fiber interface 14 and an optical fiber unit 12 .

[0017] The substrate 11 includes: a main body 111 having at least a first window 101 and a second window 102, a first extension portion 112 formed by the main body 111 located at the inner side of the first window 101 and extending toward the center of the first window 101, a second extension portion 113 formed by extending outward from the outer side of the main body 111, and a third extension portion 114 formed by extending outward from the outer side of the main body 111.

[0018] The ends of the third extension portions 114 are semi-enclosed or enclosed, and the inner side of the second opening 102, the end of the first extension portion 112, the end of the second extension portion 113 and the end of the third extension portion 114 are all provided with fiber outlets.

[0019] Furthermore, the ends of the plurality of third extension portions 114 may be arranged in a single ring array or a double ring array to increase the arrangement density of the optical components and the integration of the optoelectronic hybrid circuit board 100 .

[0020] Furthermore, the ends of the plurality of third extension portions 114 are arranged in a single ring array or a double ring array, and thus, the third optical devices 203 are arranged in a single ring array or a double ring array, so as to increase the arrangement density of the third optical devices 203 and increase the integration of the optoelectronic hybrid circuit board 100.

[0021] In one embodiment, at least one third extension portion 114 is bent to the vicinity of the remaining third extension portions 114 , so that the ends of the plurality of third extension portions 114 are distributed in a semi-enclosed or enclosed state.

[0022] The plurality of optical fiber units 12 are partially disposed on the substrate 11 , one end of each of the plurality of optical fiber units 12 extends out from one of the fiber outlets, and the other end of each of the plurality of optical fiber units 12 extends out from any of the other fiber outlets.

[0023] Specifically, in this embodiment, a graphic transfer process can be used to open a first window 101 and a second window 102 in the central area or edge area of ​​the main body 111, that is, the main body 111 in the central area or the edge area is removed so that in subsequent processing, electronic components and optical devices can be correspondingly arranged in the first window 101 and / or the second window 102.

[0024] The first window 101 may be a quadrilateral window, and the plurality of first extension portions 112 are disposed at two, three or four inner sides of the first window 101 at intervals and extend toward the center of the first window 101. When the plurality of first extension portions 112 are disposed at four inner sides of the first window 101 at intervals, the plurality of first extension portions 112 surround and surround the inner side of the first window 101.

[0025] The first window 101 may be a circular or elliptical window, and the plurality of first extension portions 112 are disposed at intervals on one half, three quarters, or the entire circumference of the inner side of the first window 101. When the plurality of first extension portions 112 are disposed at intervals on the entire circumference of the inner side of the first window 101, the plurality of first extension portions 112 surround and surround the inner side of the first window 101.

[0026] Part of the structure of the optical fiber unit 12 may be arranged in the main body 111 and the first extension part 112, or may be attached to the inside of the main body 111 and the first extension part 112. The optical fiber unit 12 is arranged in the main body 111 and the first extension part 112 in a certain manner, wherein the arrangement manner of each optical fiber unit 12 in the main body 111 and the first extension part 112 may also be the same or different. Each optical fiber unit 12 includes at least one optical fiber, which may be one or more optical fibers, one or more groups of optical fibers, etc. Among them, the number of optical fibers in each group of optical fibers can be set according to actual needs, such as the model of the connector to be connected, etc., for example, it can be 1, 4, 8, 12, 24, etc. The number of optical fiber groups can also be set according to needs, which is not limited here.

[0027] The optical fiber in the optical fiber unit 12 can be a high-temperature optical fiber or an ordinary optical fiber. The difference between a high-temperature optical fiber and an ordinary optical fiber is that the material of the surface coating of the high-temperature optical fiber is a high-temperature resistant material, so that the high-temperature optical fiber can meet the application in a high-temperature harsh environment. Although the surface of the ordinary optical fiber is also provided with a coating layer, the coating layer on the surface of the ordinary optical fiber will lose the function of protecting the optical fiber at high temperatures, and the optical fiber is easily damaged. Among them, the designer can select the optical fiber unit 12 as a high-temperature optical fiber or an ordinary optical fiber according to the application environment of the optical fiber circuit board assembly 10. For example: when the optical fiber circuit board assembly 10 is required to be able to work at a high temperature above 100°C and can be bent repeatedly, the optical fiber unit 12 can be selected as a high-temperature optical fiber. It is worth noting that setting the optical fiber unit 12 as a high-temperature optical fiber can not only broaden the working temperature of the optical fiber circuit board assembly 10, but also enable the optical fiber circuit board assembly 10 to be processed by lamination during the processing, thereby broadening the processing method of the optical fiber circuit board assembly 10.

[0028] One end of the optical fiber unit 12 may extend from the fiber outlet on the inner side of the second opening 102 , and the other end may extend from any fiber outlet of the end of the first extension portion 112 , the end of the second extension portion 113 , and the end of the third extension portion 114 .

[0029] Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet at the end of the first extension portion 112 , and the other end may extend from any fiber outlet of the inner side of the second opening 102 , the end of the second extension portion 113 , and the end of the third extension portion 114 .

[0030] Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet at the end of the second extension portion 113 , and the other end may extend from any fiber outlet of the inner side of the second opening 102 , the end of the first extension portion 112 , and the end of the third extension portion 114 .

[0031] Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet at the end of the third extension portion 114 , and the other end may extend from any fiber outlet of the inner side of the second opening 102 , the end of the first extension portion 112 , and the end of the second extension portion 113 .

[0032] Different from the prior art, the substrate of the present application includes a main body with a first window and a second window, a first extension portion formed by the main body located at the inner side of the first window extending toward the center of the first window, a second extension portion formed by extending outward from the outer side of the main body, and a third extension portion formed by extending outward from the outer side of the main body. The optical fiber unit part is arranged on the substrate, and each end of the multiple optical fiber units extends from one of the fiber outlets, and each other end of the multiple optical fiber units extends from any other fiber outlet, thereby realizing the fixation and protection of the optical fiber units, and thus there will be no disorder. The setting order and position of the optical fiber units are fixed, and there is no need to reposition the connected optical devices one by one, thereby greatly simplifying the assembly of optical and electrical interconnections and greatly improving the efficiency.

[0033] In one embodiment, the fiber optic circuit board assembly further includes: a fiber optic interface 14, one end of the fiber optic unit 12 extending from the fiber optic port is connected to the fiber optic interface 14, and the fiber optic unit is coupled to an optical device or other fiber optic units 12 via the fiber optic interface.

[0034] Specifically, the optical fiber interface 14 may include a single-way optical connector and / or a multi-way optical connector. The inner cavity of the single-way optical connector is provided with a positioning structure for positioning a single optical fiber unit 12, and the single-way optical connector can be used to receive the optical fiber unit 12 extending from the optical fiber port, and the optical fiber unit 12 is positioned by the positioning structure. The inner cavity of the multi-way optical connector is provided with a positioning structure for positioning a multi-way optical fiber unit 12, and the multi-way optical connector can be used to receive the multi-way optical fiber unit 12 extending from the optical fiber port, and the multi-way optical connector can be positioned by the positioning structure.

[0035] In the actual production process, whether it is a single-channel optical connector or a multi-channel optical connector, the corresponding optical fiber unit 12 must first be inserted into the inner cavity of the optical connector, and then the optical fiber can be fixed with glue, and the excess optical fiber is cut off, and then ground and polished to make a fiber optic interface 14 that meets the requirements.

[0036] Part of the optical fiber unit 12 is arranged in the substrate in a certain manner, and the remaining part of the optical fiber unit 12 extends out from the fiber outlet.

[0037] like Figure 4 As shown, in one embodiment, the substrate 11 includes: a first film layer 1111 and a second film layer 1112 which are stacked and spaced apart, and a bonding layer 1113. The first film layer 1111 and the second film layer 1112 are stacked and spaced apart, and the optical fiber unit is accommodated between the first film layer 1111 and the second film layer 1112, wherein a first opening is formed between the first film layer 1111 and the second film layer 1112 at the end of the first extension portion, and the optical fiber interface is at least partially located in the first opening. The bonding layer 1113 is filled in the remaining space between the first film layer 1111 and the second film layer 1112 except for the optical fiber unit, so that the optical fiber unit is fixed relative to the first film layer 1111.

[0038] In one embodiment, the first film layer 1111 is a flexible material; the second film layer 1112 and the bonding layer 1113 are thermosetting materials or thermoplastic materials; wherein the bonding layer 1113 includes n layers of adhesive layers 1114 stacked together, and a plurality of optical fiber units are distributed in the form of m layers of optical fiber units stacked together, wherein n≥1, m≥1; the optical fiber unit layer is arranged between two adjacent adhesive layers 1114 or within one of the adhesive layers 1114.

[0039] In one embodiment, the first film layer 1111 and the second film layer 1112 are flexible materials, wherein the bonding layer 1113 includes n layers of adhesive layers 1114 stacked, and the plurality of optical fiber units are stacked in m layers of optical fiber unit layers, wherein n≥1, m≥1. The optical fiber unit layer is disposed between two adjacent adhesive layers 1114 or in one of the adhesive layers 1114, and the adhesive layer 1114 is a thermosetting material or a thermoplastic material.

[0040] Specifically, the flexible material may be a flexible composite material, such as polyimide, polyethylene terephthalate, polydimethylsiloxane, etc. The first film layer 1111 is made of a flexible material, and a flexible substrate 11 may be obtained so as to be able to withstand repeated bending to adapt to actual position requirements. The thickness of the first film layer 1111 may be no greater than 100 μm, such as 20 μm-100 μm, such as 20 μm, 25 μm, 45 μm, 65 μm, 85 μm, 100 μm, etc., which is not specifically limited here.

[0041] Among them, a bonding layer 1113 is arranged between the adjacent first film layers 1111 and the second film layers 1112, so as to be connected together through the bonding layer 1113, and a corresponding optical fiber unit 12 is fixed between the two adjacent first film layers 1111 and the second film layers 1112 through the bonding layer 1113, and the bonding layer 1113 is filled in the remaining space between the corresponding two adjacent first film layers 1111 and the second film layers 1112 except the optical fiber unit 12.

[0042] It should be pointed out that if the thickness of the bonding layer 1113 is too small, it is difficult to fix the optical fiber, and if the thickness is too large, it is difficult to maintain the flexibility of the substrate 11. The thickness here refers to the thickness of the bonding layer 1113 in the direction perpendicular to the board surface of the first film layer 1111 and the second film layer 1112. In this embodiment, the thickness of the thinnest area of ​​the bonding layer 1113 between two adjacent first film layers 1111 and the second film layer 1112 is greater than one-tenth of the diameter of the optical fiber unit 12 and less than 10 times the diameter of the optical fiber unit 12, or greater than one-half of the diameter of the optical fiber unit 12 and less than two times the diameter of the optical fiber unit 12. For example, the thickness of the thinnest area of ​​the bonding layer 1113 between two adjacent first film layers 1111 and the second film layer 1112 is one-fifth, one-half, 1 time, 2 times, 5 times, etc. of the diameter of the optical fiber, which is not specifically limited here.

[0043] Specifically, the thickness of the bonding layer 1113 is not less than 50 μm, and can be 50 μm, 60 μm, 70 μm, etc. After using the bonding layer 1113, the peel strength between the adjacent first film layer 1111 and the second film layer 1112 is not less than 15 N / cm 3 .

[0044] Specifically, in an application scenario, the adhesive layer 1114 is solid and flexible within a first temperature range and / or a first pressure range, and has fluidity within a second temperature range and / or a second pressure range, wherein any temperature value within the first temperature range is not greater than any temperature value within the second temperature range. Specifically, at room temperature and pressure, or close to room temperature and pressure, the adhesive layer 1114 is solid and flexible, and has a certain fluidity when heated to a certain temperature and / or a certain pressure is applied. Specifically, the adhesive layer 1114 can be a thermoplastic material or a thermosetting material.

[0045] The adhesive layer 1114 of different materials can be selected according to the actual use environment of the optical fiber circuit board assembly 10. Specifically, when it is necessary to adapt to a high temperature environment, as described above, the optical fiber of the optical fiber unit 12 uses a high temperature optical fiber, and the material of the adhesive layer 1114 can be at least one of an epoxy resin system, an acrylic system, and a silicone system. When it is only necessary to operate in a normal temperature environment, as described above, the optical fiber of the optical fiber unit 12 uses an ordinary optical fiber, and the material of the adhesive layer 1114 can be at least one of an acrylic system and a silicone system.

[0046] When the substrate 11 is heated and / or pressurized, the adhesive layer 1114 made of the above material can flow and wrap around the periphery of the optical fiber unit 12, and fill the space between the adjacent first film layer 1111 and the second film layer 1112 except for the optical fiber, thereby fixing the optical fiber more firmly, so as to reduce the loosening and displacement of the optical fiber due to insecure fixation during long-term use, thereby improving the reliability of the substrate 11 and the optical fiber circuit board assembly 10.

[0047] See also Figures 2-3 In this embodiment, the optoelectronic hybrid circuit board 100 includes: a printed circuit board 30 , an optical fiber circuit board assembly 10 , a first electronic component 401 and a first optical device 201 .

[0048] The optical fiber circuit board assembly 10 is the optical fiber circuit board assembly 10 in the above embodiment. The optical fiber circuit board assembly 10 is stacked with the printed circuit board 30, the first electronic component 401 is arranged on the printed circuit board 30, and the first electronic component 401 is arranged corresponding to the first window 101. The first optical device 201 is arranged on the printed circuit board 30, the optical fiber unit 12 is coupled to the first optical device 201 through the optical fiber interface 14, and the first optical device 201 is coupled to the first electronic component 401 through the printed circuit board 30.

[0049] The first electronic component 401 may or may not exceed the first window 101 .

[0050] Specifically, a support member 60 is provided between the printed circuit board 30 and the optical fiber circuit board assembly 10. Specifically, mounting holes (not shown) can be provided on the printed circuit board 30 and the optical fiber circuit board assembly 10. In this case, the support member 60 can be a screw, a rivet, a pin, etc., which is inserted into the mounting hole to fix the printed circuit board 30 and the optical fiber circuit board assembly 10. In this way, the fixing between the printed circuit board 30 and the optical fiber circuit board assembly 10 can be made more secure and the disassembly is more convenient.

[0051] like Figure 3 As shown, in one embodiment, the optoelectronic hybrid circuit board 100 further includes: a first optical device 201. The first optical device 201 is disposed on the printed circuit board 30, and the first optical device 201 is disposed on the periphery of the first electronic component 401.

[0052] In one embodiment, the optoelectronic hybrid circuit board 100 further includes: a second optical fiber unit or a second optical device 202 disposed on a printed circuit board 30, the optical fiber unit is coupled to the second optical fiber unit or the second optical device 202 via an optical fiber interface, and the second optical device 202 is coupled to the first electronic component 401 via the printed circuit board 30.

[0053] In one embodiment, the optoelectronic hybrid circuit board 100 further includes: a second electronic component 50 and a third optical device 203, both of which are arranged on the printed circuit board 30, and a plurality of third optical devices 203 are arranged at intervals from each other, and a plurality of third optical devices 203 are semi-enclosed or surrounded and distributed outside the second electronic component 50, the third optical fiber unit is coupled to the third optical device 203 through a third optical fiber interface, and the third optical device 203 is coupled to the second electronic component 50 through the printed circuit board 30. Further, the plurality of third optical devices 203 can be arranged in a single ring array or a double ring array to increase the arrangement density of the plurality of third optical devices 203 and increase the integration of the optoelectronic hybrid circuit board 100.

[0054] In one embodiment, a second window 102 is further provided on the main body, and the second window 102 is spaced apart from the first window 101. The optoelectronic hybrid circuit board 100 further includes: a third electronic component. The third electronic component is provided on the printed circuit board 30, and the third electronic component is provided corresponding to the second window 102 of the optoelectronic hybrid circuit board 100, wherein the second window 102 is used to expose the third electronic component.

[0055] like Figure 5As shown, in one embodiment, the optoelectronic hybrid circuit board 100 further includes: a printed circuit board 30, an optical fiber circuit board assembly 10, a high-speed substrate 70, a first optical device 201, and a first electronic component 401. The optical fiber circuit board assembly 10 is the optical fiber circuit board assembly 10 in the above embodiment. The printed circuit board 30 can be made of ordinary cheap board material and there may be no high-speed signal inside the printed circuit board 30. The high-speed substrate 70 is arranged on one side of the printed circuit board 30. The first optical device 201 and the first electronic component 401 are both arranged on the side of the high-speed substrate 70 away from the printed circuit board 30. The number of the first optical devices 201 can be multiple. The optical fiber circuit board assembly 10 and the printed circuit board 30 are stacked, and the first electronic component 401 is arranged corresponding to the first window 101. The optical fiber unit 12 is coupled to the first optical device 201 through the optical fiber interface 14, and the first optical device 201 is coupled to the first electronic component 401 through the high-speed substrate 70.

[0056] In one embodiment, the first electronic component 401 may be an Application Specific Integrated Circuit (ASIC) chip for a specific application, and the first optical device 201 may be a photonic engine.

[0057] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An optoelectronic hybrid circuit board, characterized in that: The optoelectronic hybrid circuit board comprises: Printed circuit boards; An optical fiber circuit board assembly is stacked with the printed circuit board; A first electronic component is arranged on the printed circuit board; A first optical device is arranged on the printed circuit board; Wherein, the optical fiber circuit board assembly at least comprises: A substrate, comprising a main body with a first window and a second window, a first extension formed by the main body located at the inner side of the first window extending toward the center of the first window, a second extension formed by extending outward from the outer side of the main body, and a third extension formed by extending outward from the outer side of the main body, wherein the ends of the plurality of third extensions are semi-enclosed or enclosed, and the inner side of the second window, the end of the first extension, the end of the second extension, and the end of the third extension are all provided with fiber outlets; wherein the first electronic component is arranged corresponding to the first window; A plurality of optical fiber units, partially disposed on the substrate, one end of each of the plurality of optical fiber units extending from one of the optical fiber outlets, and another end of each of the plurality of optical fiber units extending from any of the remaining optical fiber outlets; An optical fiber interface, wherein one end of the optical fiber unit extending from the fiber outlet is connected to the optical fiber interface; wherein the optical fiber unit is coupled to the first optical device via the optical fiber interface, and the first optical device is coupled to the first electronic component via the printed circuit board, and the first optical device is arranged on the periphery of the first electronic component.

2. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The optical fiber unit is coupled to an optical device or other optical fiber units through the optical fiber interface.

3. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The ends of adjacent fiber outlets have different distances from the center of the first window, and the distance is at least greater than or equal to the size of the optical device.

4. The optoelectronic hybrid circuit board according to claim 1, characterized in that: At least one of the third extension portions is bent to the vicinity of the remaining third extension portions, so as to form a semi-enclosed or enclosed distribution state at the ends of the plurality of third extension portions.

5. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The substrate comprises: A first film layer and a second film layer are stacked and spaced apart, wherein the optical fiber unit is partially accommodated between the first film layer and the second film layer; A bonding layer is filled in a remaining space between the first film layer and the second film layer except for the optical fiber unit, so as to fix the optical fiber unit relative to the first film layer.

6. The optoelectronic hybrid circuit board according to claim 5, characterized in that: The fiber outlet is formed between the first film layer and the second film layer.

7. The optoelectronic hybrid circuit board according to claim 5, characterized in that: The first film layer is a flexible material; The second film layer and the bonding layer are thermosetting materials or thermoplastic materials; Wherein, the bonding layer comprises n layers of adhesive layers stacked in layers, and the plurality of optical fiber units are stacked in layers of m optical fiber units, wherein n≥1, m≥1; The optical fiber unit layer is arranged between two adjacent adhesive layers or in one of the adhesive layers.

8. The optoelectronic hybrid circuit board according to claim 5, characterized in that: The first film layer and the second film layer are made of flexible materials; Wherein, the bonding layer comprises n layers of adhesive layers stacked in layers, and the plurality of optical fiber units are stacked in layers of m optical fiber units, wherein n≥1, m≥1; The optical fiber unit layer is arranged between two adjacent bonding layers or in one of the bonding layers, and the bonding layer is a thermosetting material or a thermoplastic material.

9. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The optoelectronic hybrid circuit board also includes: A second optical fiber unit or a second optical device is arranged on the printed circuit board, the optical fiber unit is coupled to the second optical fiber unit or the second optical device through the optical fiber interface, and the second optical device is coupled to the first electronic component through the printed circuit board.

10. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The optoelectronic hybrid circuit board also includes: The second electronic component and the third optical device are both arranged on the printed circuit board, and the plurality of the third optical devices are arranged at intervals from each other, and the plurality of the third optical devices are distributed outside the second electronic component in a semi-enclosed or surrounded manner, the third optical fiber unit is coupled to the third optical device through a third optical fiber interface, and the third optical device is coupled to the second electronic component through the printed circuit board.

11. The optoelectronic hybrid circuit board according to claim 1, characterized in that: The main body is also provided with a second window, and the second window is spaced apart from the first window; The optoelectronic hybrid circuit board also includes: A third electronic component is arranged on the printed circuit board, and the third electronic component is arranged corresponding to the second opening of the optoelectronic hybrid circuit board, wherein the second opening is used to expose the third electronic component.

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