A method for processing C / SiC composite materials based on ultrasonic vibration-assisted femtosecond laser

Through ultrasonic assisted high-frequency femtosecond laser processing method, combined with ultrasonic vibration and laser technology, the problems of surface defects and low efficiency in C/SiC composite materials processing are solved, and high-quality and defect-free processing effect is achieved.

CN115365639BActive Publication Date: 2025-03-18XI AN JIAOTONG UNIV
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Patent Information

Application Number
CN202211176127.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-26
Publication Date
2025-03-18
Estimated Expiration
2042-09-26

AI Technical Summary

Technical Problem

The existing C/SiC composite processing technology has problems such as surface defects, complex operation, high motion accuracy requirements, low processing efficiency and light wire effect, making it difficult to ensure high-quality processing effect.

Method used

Ultrasonic-assisted high-frequency femtosecond laser processing method is adopted to combine laser with ultrasound, and the cavitation effect and convection enhancement effect of ultrasonic vibration are used to reduce ion shielding and particle deposition. By adjusting the control of the three-dimensional mobile platform and galvanometer, the spot size and scanning speed are optimized, and the processing efficiency and quality are improved.

Benefits of technology

A smooth surface without fiber breakage, fiber extraction, and holes is achieved, which improves processing efficiency and quality, simplifies operation, and reduces the occurrence of processing defects.

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Abstract

A method for processing C / SiC composite materials based on ultrasound-assisted high-repetition-rate femtosecond laser, firstly building a femtosecond laser processing optical path system, the optical path comprising a high-repetition-rate femtosecond laser, the output laser of the high-repetition-rate femtosecond laser sequentially passing through a 1 / 2 wave plate, a beam splitter, a beam expander, etc., entering a galvanometer and vertically irradiating on a processing station of an ultrasonic vibration device, the amplitude of the ultrasonic vibration device being controlled by an ultrasonic generator, the position of the ultrasonic vibration device being controlled by a three-dimensional mobile platform, and controlling the galvanometer by a computer to control the power, motion trajectory speed and defocusing amount of the laser focus and the material surface during the processing of the high-repetition-rate femtosecond laser, the galvanometer and the three-dimensional mobile platform; the ultrasonic vibration cavitation effect and near-field convection enhancement effect of the invention are conducive to reducing particle shielding, better cooling of ablated particles and debris, reducing their tendency to combine with the material surface, reducing surface oxidation, and improving the processing surface quality and removal depth; the surface of the obtained C / SiC composite material is smooth and flat.
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