An ice maker

Abstract

The application provides an ice maker, a machine body shell, a fan, a radiator, a semiconductor refrigerator, a refrigeration body, an ice box, an ice separation assembly and a control circuit board, the radiator is located on the upper end of the semiconductor refrigerator and is combined with the hot end surface of the semiconductor refrigerator, the refrigeration body is located on the lower end of the semiconductor refrigerator and is combined with the cold end surface of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan. During ice making, heat is conducted upward through the radiator, and cold is conducted downward to the ice making cavity, which conforms to the natural heat conduction law and can accelerate the ice making efficiency. After ice making is completed, the ice separation program is entered, and the ice block is separated from the refrigeration body, the whole ice box is separated from the refrigeration body, the ice box containing the ice block is separated to a specified position, and the purpose of automatic ice separation is achieved.

Description

Technical Field

[0001] This invention relates to the field of ice-making equipment, and more particularly to an ice maker. Background Technology

[0002] An ice maker is a common type of ice-making equipment. Because the ice-making process requires low-temperature freezing, a large amount of cooling capacity, and a low cooling temperature, most ice makers currently use mechanical compression refrigeration. Its advantages are fast ice-making speed and large ice-making capacity, but its disadvantages are large size and high cost.

[0003] In today's society, with the continuous improvement of people's living standards, personalized needs are constantly emerging, which also puts forward special requirements for ice makers, such as miniaturization, intelligence, small size, convenient and flexible use, and low cost. Existing technologies include ice makers that use semiconductor refrigeration, which utilizes the Peltier effect of semiconductor materials to produce ice. After the ice cubes are made, they often need to be manually removed from the refrigeration unit. How to achieve automatic separation of the ice cubes after they are made and their detachment to a designated location has become a problem that needs to be solved.

[0004] Therefore, existing technologies have shortcomings and need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide an ice maker that solves the problem of insufficient automation in the ice removal process of existing ice makers.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0007] An ice maker includes: a housing, a fan, a radiator, a thermoelectric cooler, a cooling element, an ice box, an ice removal assembly, and a control circuit board. The radiator is located at the upper end of the thermoelectric cooler and is connected to the hot end face of the thermoelectric cooler; the cooling element is located at the lower end of the thermoelectric cooler and is connected to the cold end face of the thermoelectric cooler; and the control circuit board is electrically connected to the thermoelectric cooler and the fan.

[0008] The de-icing assembly includes a tray and a drive component. The drive component is connected to the tray to drive the tray to move up and down. The tray is located below the ice box and is used to support the ice box.

[0009] Furthermore, the cooling element is characterized in that it comprises a substrate and a first protrusion.

[0010] Furthermore, the feature is that a groove is formed on the side wall of the first protrusion, and the ice box is located below the cooling body. After being fastened with the cooling body, the groove is sealed to form a hollow space.

[0011] Furthermore, the groove is characterized by having a second protrusion.

[0012] Furthermore, the ice box is characterized by having protrusions.

[0013] Furthermore, the ice box is snapped onto the tray.

[0014] Furthermore, the driving element comprises:

[0015] A sleeve is provided below the tray, and the top end of the sleeve is connected to the tray. The inner wall of the sleeve is provided with internal threads.

[0016] A screw rod, which passes through the sleeve, and the screw rod is provided with an external thread that is compatible with the internal thread;

[0017] An electric motor, the output end of which is connected to the bottom end of the screw to drive the screw to rotate.

[0018] Furthermore, the tray is characterized by having drainage holes;

[0019] Furthermore, the ice maker further includes a wastewater box located below the tray and connected to the drain hole.

[0020] Furthermore, the ice maker further includes a temperature sensor, which is disposed on the cooling element and electrically connected to the control circuit board.

[0021] As can be seen from the above technical solution, the present invention has at least the following advantages and positive effects:

[0022] In this invention, the tray in the ice-removing assembly of the ice maker is positioned below the ice box to provide support. The tray moves up and down under the drive of a driving component. After successful ice making, the ice removal process begins, and the ice blocks separate from the cooling element, allowing the entire ice box to detach from the cooling element and move to a designated position, thus achieving automatic ice removal. Attached Figure Description

[0023] Figure 1 This is a perspective view of an ice maker according to an embodiment of the present invention.

[0024] Figure 2 This is a cross-sectional view of an ice maker according to an embodiment of the present invention.

[0025] Figure 3 This is a partial structural schematic diagram of an ice maker according to an embodiment of the present invention.

[0026] Figure 4This is a schematic diagram of the locking state of the cooling element and ice box of an ice maker in one embodiment of the present invention.

[0027] Figure 5 This is a schematic diagram showing the separation state of the cooling element and ice box of an ice maker in one embodiment of the present invention.

[0028] Figure 6 This is a schematic diagram of the structure of the cooling element of an ice maker in one embodiment of the present invention.

[0029] Figure 7 This is a schematic diagram of the ice box of an ice maker according to an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100. Semiconductor ice maker; 1. Semiconductor cooler; 11. Cold end; 12. Hot end; 2. Radiator; 21. Radiator fins; 3. Fan; 4. Cooling element; 41. Substrate; 42. First protrusion; 43. Second protrusion; 44. Groove; 5. Ice box; 51. Protrusion; 6. Outer shell; 61. Perforation; 62. Ice removal compartment door; 63. Mounting cavity; 64. Insulation layer; 7. De-icing assembly; 71. Tray; 711. Drain hole; 72. Drive component; 721. Sleeve; 722. Screw; 723. Motor; 8. Wastewater box; 81. Wastewater box door; 9. Drain pipe. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0033] Please see Figures 1 to 3 An ice maker 100 is provided, comprising a semiconductor cooler 1, a heat sink 2, a fan 3, a cooling element 4, a control circuit board (not shown), and an ice removal assembly 7. The control circuit board is electrically connected to the fan 3 and the semiconductor cooler 1. For ease of description, the width direction is referred to herein as... Figure 2 The direction of the X-axis is the vertical direction or height direction, and the direction of the Y-axis is the vertical direction or height direction.

[0034] Specifically, the thermoelectric cooler 1 (also called TEC, Thermo Electric Cooler) is a heat pump made using the Peltier effect of semiconductor materials. The thermoelectric cooler 1 includes a hot end 12 and a cold end 11, with the cold end 11 located above the hot end 12. When the thermoelectric cooler 1 is powered on, the temperature of the cold end 11 decreases, and the temperature of the hot end 12 increases.

[0035] Heat sink 2 is used to dissipate heat from the hot end 12. Heat sink 2 is located above the thermoelectric cooler 1, allowing heat from the hot end 12 to be transferred upwards through heat sink 2, with heat continuously transferred from the cold end 11 to the hot end 12. Therefore, by using heat sink 2 to dissipate heat from the hot end 12, the temperature of the cold end 11 can be further reduced, which helps to accelerate ice making by the ice maker 100.

[0036] The heat sink 2 is located at the hot end 12, including but not limited to the heat sink 2 being in direct contact with the hot end 12, the heat sink 2 being spaced apart from the hot end 12, and the heat sink 2 being in indirect contact with the hot end 12 through thermal silicone, thermal grease, etc.

[0037] The cooler 4 is located at the cold end 11 of the semiconductor cooler 1, that is, the cooler 4 is located below the semiconductor cooler 1. Therefore, the cooling energy generated by the cold end 11 of the semiconductor cooler 1 is transferred downward to the cooler 4, thereby reducing the temperature of the cooler 4.

[0038] The cooling element 4 is located at the cold end 11, including but not limited to the cooling element 4 being in direct contact with the cold end 11, or the cooling element 4 being spaced apart from the cold end 11.

[0039] Please see Figures 4 to 7 The cooling element 4 includes a substrate 41 and a first protrusion 42.

[0040] Specifically, a groove 44 is formed on the side wall of the first protrusion 42. The ice box 5 is placed below the cooling body 4. After it is fastened to the cooling body 4, the groove 44 forms a sealed hollow space for storing water. The temperature of the cooling body 4 decreases under the action of the semiconductor cooler 1, and the water stored in the groove 44 turns into ice, thereby realizing ice making.

[0041] Please see Figure 6 There are multiple grooves 44.

[0042] Specifically, each groove 44 is arranged side by side at intervals along the direction of the cooling body 4 toward the ice box 5, thus enabling the simultaneous production of multiple ice blocks.

[0043] All grooves 44 have the same shape, or the shapes of all grooves 44 are not the same, that is, there are at least two grooves 44 with different shapes.

[0044] The shape of the groove 44 is the same as the shape of the ice block. The shape of the groove 44 can be circular, cylindrical, conical, square, trapezoidal or irregular. The number of grooves 44 corresponds to the number of ice blocks to be made. Each groove 44 can be independent or connected to each other.

[0045] The complete ice-making process can be divided into two stages based on cold energy conduction. Specifically, the first stage involves cold energy being conducted from the cooling element 4 to the water in contact with it in the groove 44 (i.e., the water located on the outermost side of the groove 44). The second stage involves cold energy conduction within the water in the groove 44. For rapid ice making, the semiconductor cooler 1 needs to generate sufficient cold energy on the cooling element 4 and conduct it to the water in contact with it as quickly as possible. Using water as the cold energy conduction medium, the cold energy is conducted to the three-dimensional water body, causing the entire water body to drop below the freezing point temperature as quickly as possible, thus completing rapid freezing. According to the above process, the water in the groove 44 gradually freezes from the sidewall of the first protrusion 42 inwards.

[0046] For the first process, according to the cold transfer formula Q=hSΔT, where Q, h, S, and ΔT are the cold transfer amount, surface heat transfer coefficient, heat transfer area, and temperature difference, respectively, in order to increase the cold transfer amount and make the water in contact with the cooler 4 cool down and freeze quickly (i.e. reduce the temperature difference between the cooler 4 and the water), it can be seen that increasing the contact area between the cooler 4 and the water can quickly reduce the temperature difference between the cooler 4 and the water, thereby making the water in contact with the cooler 4 freeze.

[0047] For the second process, the time can be reduced by decreasing the thermal resistance of cold energy conduction in water. According to the formula for calculating thermal resistance, where L, S, and κ represent the cold energy conduction distance, the cross-sectional area of ​​cold energy conduction, and the ratio of the thermal conductivity of water to that of ice, respectively, the thermal resistance of cold energy conduction in water can be reduced by increasing the cold energy conduction cross-section S and decreasing the cold energy conduction distance L, thereby shortening the time of the second process and achieving rapid ice making.

[0048] Please see Figure 5 and Figure 6 The groove 44 is provided with a second protrusion 43.

[0049] Specifically, along the direction perpendicular to the cooling element 4 towards the ice box 5 (the direction of the X-axis), the average size of the groove 44 is 10 mm to 25 mm, that is, along the width direction, the average size of the groove 44 is 10 mm to 25 mm. Since the larger the ice block volume, the longer it takes to make ice, when the average size of the groove 44 along the width direction is 10 mm to 25 mm, the ice block can have a suitable volume and a relatively fast ice-making speed can be obtained.

[0050] The second protrusion 43 within the groove 44 increases the contact area between the water and the cooling element 4, reducing the time required for the first process and thus accelerating ice-making. Furthermore, the second protrusion 43 allows cold energy to be transferred simultaneously to the three-dimensional water body via both the sidewalls of the second protrusion 43 and the first protrusion 42. Compared to the prior art where cold energy is transferred from the sidewall of the first protrusion 42 of the cooling element 4 to the center of the groove 44, this shortens the cold conduction distance, reduces the thermal resistance of cold energy conduction in the water, reduces the time required for the second process, and further accelerates ice-making. Since the second protrusion 43 within the groove 44 positively promotes both the first and second processes, it significantly accelerates ice-making, improves ice-making efficiency, and offers the advantage of a simple structure, compared to only shortening the time required for the first or only the second process.

[0051] The shape of the second protrusion 43 includes, but is not limited to, a cylindrical, conical, square, trapezoidal, or irregular shape.

[0052] The height of the second protrusion 43 is less than the height of the first protrusion 42. The height ratio of the second protrusion 43 to the first protrusion 42 is 0.3 to 0.95. That is, along the height direction, the size ratio of the second protrusion 43 to the first protrusion 42 is 0.3 to 0.95, so as to obtain a better ice-making effect.

[0053] The process of separating the ice from the cooling element 4 is called de-icing. De-icing can directly disconnect the power to the semiconductor cooler 1. At this time, the heat of the hot end 12 is transferred in reverse to the cold end 11, and then to the cooling element 4. The contact surface between the ice and the cooling element 4 melts, so that the ice and the cooling element 4 are separated.

[0054] De-icing can also be achieved by reversing the positive and negative polarities of the DC input of the semiconductor cooler 1, changing the semiconductor cooler 1 from a cooling state to a heating state, and transferring heat from the semiconductor cooler 1 to the cooling body 4. The surface of the ice block in contact with the cooling body 4 melts, so that the ice block separates from the cooling body 4, and the ice block that has separated from the cooling body 4 is supported by the ice box 5.

[0055] Please see Figure 2 The de-icing assembly 7 includes a tray 71 and a drive component 72. The ice box 5 can be detached from the cooling body 4 by natural or forced detachment.

[0056] Specifically,

[0057] Natural detachment method: The tray 71 is roughly disc-shaped and is positioned below the ice box 5 to support it. Along the direction perpendicular to the cooling element 4 towards the ice box 5, the size of the tray 71 is larger than the size of the ice box 5. A drive unit 72 provides power to the tray 71 and is driven by the tray 71 to move it up and down. During ice making, the tray 71 moves under the drive of the drive unit 72 until it contacts the ice box 5, providing support and ensuring the ice box 5 is fully engaged with the cooling element 4 to prevent liquid leakage. After successful ice making, the tray 71 moves downward under the drive of the drive component 72 and separates from the ice box 5. The downward movement distance is greater than or equal to the height of the ice box 5. Once the contact surface between the ice and the cooling element 4 is separated, and the ice box 5 loses its supporting force due to the removal of the tray 71, the ice and ice box 5 fall together into the tray 71 due to their own weight and the falling space of the free fall of the ice box 5. Thus, the ice box 5 containing ice falls onto the tray 71, and the user can directly take the ice from the tray 71.

[0058] Forced detachment method: The tray 71 and ice box 5 are snapped together. The drive unit 72 is connected to the tray 71. The tray 71 moves up and down under the drive of the drive unit 72. Because the tray 71 and ice box 5 are snapped together, the downward movement of the tray 71 also drives the ice box 5 to move up and down. After successful ice making, the ice removal process begins and the ice is separated from the cooling body 4. The drive unit 72 moves downward, forcibly pulling the ice box 5 downward, causing the ice box 5 to detach from the cooling body 4, thus achieving ice removal.

[0059] Please see Figure 6 and Figure 7 The ice box 5 has a protrusion 51.

[0060] Specifically, to speed up the removal of ice from the cooling body 4, protrusions 51 can be provided on the ice box 5. The protrusions 51 correspond one-to-one with the grooves 44, that is, one ice block corresponds to one protrusion 51. The optimal solution is to set the protrusions 51 in the center of the ice block. The setting of the protrusions 51 makes the ice block and the ice box 5 better integrated. After the ice is made, the ice box 5 can more easily remove the ice block from the cooling body 4.

[0061] Ice box 5 is made of rubber or plastic, which makes it easier for ice cubes to detach from ice box 5 quickly through deformation.

[0062] Please see Figure 2 and Figure 3 The fan 3 is located at one end of the heat sink fins 21 of the heat sink 2.

[0063] Specifically, the airflow direction of fan 3 is consistent with the direction of semiconductor cooler 1 toward heat sink 2, so as to enhance the heat dissipation of heat sink 2.

[0064] The semiconductor ice maker 100 also includes a temperature sensor (not shown) disposed on the cooling element 4. The temperature sensor is used to sense the temperature of the cooling element 4, or the ice cube, or the ice box 5. When the temperature sensor detects that the temperature of the cooling element 4, or the ice cube, or the ice box 5 has reached a set temperature threshold, it can indicate that ice making is finished. The temperature sensor is electrically connected to the control circuit board. Through program control, it can be selected to remove the made ice cube from the cooling element 4 or enter the cold-keeping state to keep the ice cube in a frozen state.

[0065] Please see Figure 1 and Figure 2 The semiconductor ice maker 100 also includes a housing 6.

[0066] Specifically, the outer casing 6 encloses and forms a mounting cavity 63, in which the semiconductor cooler 1, heat sink 2, fan 3, and cooling element 4 are all located. A perforation 61 is provided on the top of the outer casing 6 corresponding to the fan 3, allowing the hot air output by the fan 3 to be exhausted to the outside of the outer casing 6 through the perforation 61.

[0067] The outer shell 6 includes an ice-retrieving door 62. After ice making is completed and ice removal is successful, the ice-retrieving door 62 can be opened to remove the ice blocks.

[0068] Please see Figure 1 The semiconductor ice maker 100 also includes a heat insulation layer 64 filled in the outer casing 6.

[0069] Specifically, the outer casing 6 has a hollow center, and a heat insulation layer 64 is filled inside the outer casing 6 to improve the heat insulation performance of the semiconductor ice maker 100. The materials of the heat insulation layer 64 include, but are not limited to, expanding foam, fiberglass, asbestos, rock wool, silicates, etc. Correspondingly, the ice retrieval door 62 can also be filled with the heat insulation layer 64.

[0070] Please see Figure 2 The drive component 72 includes a sleeve 721, a screw 722, and a motor 723.

[0071] Specifically, the sleeve 721 is roughly cylindrical and is located below the tray 71, with its top end connected to the tray 71. The inner wall of the sleeve 721 has internal threads. A screw 722 passes through the sleeve 721 and has external threads that match the internal threads. Rotation of the screw 722 causes the sleeve 721 to move up and down along it. The upward and downward movement of the sleeve 721 is controlled by the rotation direction of the screw 722.

[0072] Motor 723 is located below screw 722. The output end of motor 723 is connected to the bottom end of screw 722 to drive screw 722 to rotate. Motor 723 controls the rotation direction of screw 722 by rotating forward or backward, thereby controlling the rise or fall of sleeve 721.

[0073] In other embodiments, the drive unit 72 may also be a linear motor, the output end of which is connected to the tray 71, and the up and down movement of the tray 71 is achieved by controlling the start and stop of the linear motor.

[0074] Please see Figure 2 and Figure 3 The tray 71 is provided with a drain hole 711, and a wastewater box 8 is provided below the tray 71.

[0075] Specifically, the wastewater box 8 is connected to the drain hole 711. A drain pipe 9 is provided at the lower end of the drain hole 711. The input end of the drain pipe 9 is connected to the drain hole 711, and the output end is connected to the wastewater box 8. The melted ice water in the tray 71 can flow into the wastewater box 8 through the drain hole 711 and the drain pipe 9. The outer casing 6 is provided with a wastewater box door 81 so that the user can take out the wastewater box 8 and pour out the wastewater.

[0076] In summary, in this invention, the tray 71 in the de-icing assembly 7 moves up and down under the drive of the drive component 72. The tray 71 is positioned below the ice box 5 to provide support for the ice box 5. After successful ice making, the de-icing process begins and the ice blocks are separated from the cooling body 4. Through the up and down movement of the drive component 72, the ice box 5 is detached from the cooling body 4 as a whole, causing the ice box 5 containing the separated ice blocks to move to the designated position, thereby achieving the purpose of automatic de-icing.

[0077] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0078] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0079] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0080] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0081] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0082] Of course, the above description of the embodiments of the present invention is quite detailed, but it should not be construed as a limitation on the scope of protection of the present invention. The present invention may have many other implementations. Based on this implementation, other implementations obtained by those skilled in the art without any creative effort are all within the scope of protection of the present invention. The scope of protection of the present invention is determined by the appended claims.

Claims

1. An ice maker, comprising: The machine casing includes a fan, a heat sink, a semiconductor cooler, a cooling element, an ice box, a de-icing assembly, and a control circuit board. The heat sink is located at the upper end of the semiconductor cooler and is connected to the hot end face of the semiconductor cooler; the cooling element is located at the lower end of the semiconductor cooler and is connected to the cold end face of the semiconductor cooler; and the control circuit board is electrically connected to the semiconductor cooler and the fan. The de-icing assembly includes a tray and a drive component. The drive component is connected to the tray to drive the tray to move up and down. The tray is located below the ice box and is used to support the ice box. The cooling element is composed of a substrate and a first protrusion. The driving component includes: A sleeve is provided below the tray, and the top end of the sleeve is connected to the tray. The inner wall of the sleeve is provided with internal threads. A screw rod, which passes through the sleeve, and the screw rod is provided with an external thread that is compatible with the internal thread; An electric motor, the output end of which is connected to the bottom end of the screw to drive the screw to rotate.

2. The ice maker according to claim 1, characterized in that, A groove is formed on the side wall of the first protrusion. The ice box is located below the cooling body and is sealed by the groove after being fastened to the cooling body, forming a hollow space.

3. The ice maker according to claim 2, characterized in that, The groove is provided with a second protrusion.

4. The ice maker according to claim 1, characterized in that, The ice box has protrusions.

5. The ice maker according to claim 4, characterized in that, The ice box is snapped onto the tray.

6. The ice maker according to claim 1, characterized in that, The tray is equipped with drainage holes.

7. The ice maker according to claim 6, characterized in that, The ice maker also includes a wastewater box, which is located below the tray and is connected to the drain hole.

8. The ice maker according to claim 1, characterized in that, The ice maker also includes a temperature sensor, which is located on the cooling element and electrically connected to the control circuit board.

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