A drilling process for the PCB gold finger SLOT groove

Abstract

The present invention relates to the technical field of circuit board processing, and specifically relates to a drilling process for the SLOT groove of the PCB gold finger. The drilling process includes the following steps: S1. Etch the copper foil to form a gold finger pattern on the base material board, and a supporting copper block is formed on the area of the base material board where the SLOT groove to be drilled is located. The supporting copper block is at least back to the drilling direction of the drill bit and avoids the drilling position of the SLOT groove; S2. Perform solder mask treatment on the PCB board with solder mask ink, and dry the PCB board after the solder mask treatment; S3. Perform gold plating treatment on the gold finger pattern on the PCB board; S4. Drill the SLOT groove in the area of the base material board where the SLOT groove to be drilled is located. The SLOT groove is located at the position between adjacent gold finger patterns; S5. Use dry film to protect the gold finger pattern, while the supporting copper block is exposed; S6. Etch and remove the exposed supporting copper block. This drilling process can overcome the problem of the base material board bursting and turning white during the processing of the SLOT groove.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly relates to a drilling process for PCB gold finger SLOT grooves. Background Art

[0002] The PCB gold finger SLOT groove is used for inserting and positioning components. At present, the SLOT groove of the gold finger is drilled before gold plating. Otherwise, gold will seep during gold plating, resulting in poor quality and the PCB performance not meeting the requirements. Therefore, the SLOT groove is drilled by a drilling method after gold plating. Therefore, the current processing flow for the gold finger SLOT groove in gold finger processing is: etching - solder mask - gold plating - second drilling - forming. However, there are still deficiencies in the current SLOT groove processing method: Since the PCB is already a finished product when drilling the SLOT groove, the copper foil at the position to be drilled of the gold finger SLOT groove has been etched away at this time, as Figure 1-2 shown, this will cause the substrate board area of the SLOT groove to be drilled to be lower than the surface of the gold finger pattern, that is, the substrate board area of the large area of the SLOT groove to be drilled is in a suspended state. When the drill bit drills down, the substrate board area of the SLOT groove to be drilled will bend downward with the drill bit, causing the substrate board to burst, and the appearance of the substrate board has a whitening phenomenon (as Figure 4 shown), and its poor quality is scientifically named as the gold finger SLOT groove edge burst and whitening, which will not meet the production requirements and affect the production efficiency. Summary of the Invention

[0003] The purpose of the present invention is to avoid the deficiencies in the prior art and provide a drilling process for PCB gold finger SLOT grooves, which can overcome the problem of edge burst and whitening of the substrate board during SLOT groove processing.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] Provide a drilling process for PCB gold finger SLOT grooves. The PCB board includes a substrate board, and a copper foil is provided on the substrate board. The process includes the following steps:

[0006] S1. Primary etching: Etch the copper foil, a gold finger pattern is formed on the substrate board, and a supporting copper block is formed on the substrate board area where the SLOT groove to be drilled is located. The supporting copper block at least faces away from the drilling direction of the drill bit and avoids the drilling position of the SLOT groove.

[0007] S2. Solder mask: Perform a solder mask treatment on the PCB board using a solder mask ink, and dry the PCB board after the solder mask treatment.

[0008] S3. Gold plating: Perform a gold plating treatment on the gold finger pattern on the PCB board.

[0009] S4. Second Drilling: Drill the SLOT groove in the substrate board area where the SLOT groove to be drilled is located. The SLOT groove is located at the position between adjacent finger patterns.

[0010] S5. Second Dry Film: Perform a second dry film treatment on the PCB to protect the finger patterns with the dry film, while the supporting copper blocks are exposed.

[0011] S6. Second Etching: Etch and remove the exposed supporting copper blocks.

[0012] In some embodiments, in S1, there are four supporting copper blocks, and two supporting copper blocks are arranged on each side of the substrate board, and the supporting copper blocks on both sides are aligned with each other.

[0013] In some embodiments, the thickness of the copper block is the same as the thickness of the finger pattern.

[0014] In some embodiments, the width of the supporting copper block is 10 mil.

[0015] In some embodiments, in S4, the SLOT groove is drilled using a slot drill.

[0016] In some embodiments, the tip angle of the slot drill is 150°.

[0017] In some embodiments, the drilling method of the slot drill is G85.

[0018] In some embodiments, in S4, before drilling, first use a CCD camera to locate the MARK points of the outer layer pattern, then perform expansion and stretching on the PCB board, and then drill the SLOT groove.

[0019] In some embodiments, in S5, use an LDI device to locate the finger pattern, and then perform dry film protection on the finger pattern.

[0020] In some embodiments, after S6, it further includes performing a forming process on the PCB board to remove the excess process edges in the PCB board.

[0021] The beneficial effects of the drilling process for the SLOT groove of the PCB finger of the present invention:

[0022] (1) In the drilling process for the SLOT groove of the PCB finger of the present invention, when forming the finger pattern, a supporting copper block is simultaneously formed on the substrate board area where the SLOT groove to be drilled is located. The supporting copper block can act together with the finger pattern on the platform, and can support the substrate board area where the SLOT groove to be drilled is located, preventing the substrate board from being bent and causing problems such as edge explosion and whitening under the downward pressure of the drill bit.

[0023] (2) The drilling process of the PCB gold finger SLOT groove of the present invention is to protect the gold finger pattern by secondary dry film, and then remove the supporting copper block by etching method, which will not affect the quality of the PCB and is suitable for large-scale production applications. Description of the Drawings

[0024] Figure 1 It is a cross-sectional working state diagram of the substrate board area, gold finger pattern and drill bit where the SLOT groove to be drilled is located in the prior art.

[0025] Figure 2 It is a top view working state diagram of the substrate board area, gold finger pattern and drill bit where the SLOT groove to be drilled is located in the prior art.

[0026] Figure 3 It is a cross-sectional working state diagram of the substrate board area, supporting copper block, gold finger pattern and drill bit where the SLOT groove to be drilled is located in the embodiment.

[0027] Figure 4 It is a picture of the PCB board with edge cracking and whitening after drilling the SLOT groove in the prior art.

[0028] Figure 5 It is an effect diagram of the PCB board after drilling the SLOT groove in the embodiment. Detailed Embodiments

[0029] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0030] The terms used in the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a", "the" used in the present invention and the appended claims are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0031] It should be understood that although the terms "first", "second", "third", etc. may be used in the present invention to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0032] Embodiment

[0033] The drilling process of the PCB gold finger SLOT groove disclosed in this embodiment Figure 3 As shown, the PCB board includes a base board, and a copper foil is provided on the base board, including the following steps

[0034] S1. First etching: Using a chemical solution to etch the copper foil, a gold finger pattern is formed on the base board, and a supporting copper block is formed on the area of the base board where the SLOT groove to be drilled is located. The supporting copper block is at least in the direction away from the drilling direction of the drill bit and avoids the drilling position of the SLOT groove.

[0035] S2. Solder mask: Using a solder mask ink to perform a solder mask treatment on the PCB board to prevent the circuit from being short-circuited, and drying the PCB board after the solder mask treatment so that the ink is not non-conductive.

[0036] S3. Gold plating: Performing a gold plating treatment on the gold finger pattern on the PCB board. This gold plating refers to electroplating nickel-gold, which is used to prevent the oxidation of the copper surface and has welding performance during welding.

[0037] S4. Second drilling: Drilling the SLOT groove in the area of the base board where the SLOT groove to be drilled is located. The SLOT groove is located at a position between adjacent gold finger patterns. The second drilling treatment here supplements the drilling that cannot be achieved by the first drilling. For example, to avoid gold infiltration into the drilled hole during gold plating, the second drilling is performed after gold plating.

[0038] S5. Second dry film: Performing a second dry film treatment on the PCB to protect the gold finger pattern with the dry film, while the supporting copper block is exposed. The second dry film protects the gold finger pattern, and the supporting copper block is exposed, facilitating the subsequent etching of the supporting copper block.

[0039] S6. Second etching: Etching and removing the exposed supporting copper block. After removing the supporting copper block, it will not leave any impact on the structure of the PCB board.

[0040] Functions and benefits of the drilling process for the above PCB gold finger SLOT: When forming the gold finger pattern, a supporting copper block is simultaneously formed on the substrate board area where the SLOT to be drilled is located. This supporting copper block can act together with the gold finger pattern on the platform to support the substrate board area where the SLOT to be drilled is located, preventing the substrate board from bending and causing problems such as edge cracking and whiteening under the downward pressure of the drill bit. By using a secondary dry film to protect the gold finger pattern and then removing the supporting copper block through etching, it will not affect the quality of the PCB and is suitable for large-scale production applications.

[0041] In S1, there are four such supporting copper blocks, with two supporting copper blocks provided on each side of the substrate board, and the supporting copper blocks on both sides are aligned in pairs. The alignment of the supporting copper blocks on both sides improves the supporting effect.

[0042] The thickness of the copper block is the same as the thickness of the gold finger pattern. The same thickness of the copper block and the gold finger pattern enables the PCB board to be placed flat.

[0043] The process parameters for drilling the SLOT are as follows: the width of the supporting copper block is 10 mil. In S4, a slot drill is used to drill the SLOT. The tip angle of the slot drill is 150°. The drilling method of the slot drill is G85. In S4, before drilling, a CCD camera is first used to locate the MARK points of the outer layer pattern, and then the PCB board is subjected to expansion and contraction stretching, and then the SLOT is drilled. In S5, an LDI device is used to locate the gold finger pattern, and then a dry film is used to protect the gold finger pattern. After S6, it also includes forming the PCB board to remove the excess process edges of the PCB board.

[0044] Performance test:

[0045] The PCB board prepared in the embodiment is as Figure 5 shown. There is no edge cracking and whiteening phenomenon on the PCB board surface. It can be seen that the drilling process of the present invention can overcome the problem of edge cracking and whiteening of the substrate board during the processing of the SLOT, and it is suitable for large-scale production applications.

[0046] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0047] In the description of the present application, it should be understood that the orientation or positional relationship indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present application; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0048] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature shown in the drawings and other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used herein.

[0049] In addition, it should be noted that the use of terms such as "first", "second", etc. to define components is only for the convenience of distinguishing the corresponding components. Without otherwise stating, the above terms have no special meaning, and thus cannot be construed as limiting the protection scope of the present application.

[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A drilling process for the SLOT groove of the PCB gold finger, the PCB board comprising a base substrate, and a copper foil being provided on the base substrate, characterized in that: including the following steps S1. First etching: Etch the copper clad, form a gold finger pattern on the substrate board, and form a supporting copper block on the area of the substrate board where the SLOT groove to be drilled is located. The supporting copper block is at least back to the drilling direction of the drill bit and avoids the drilling position of the SLOT groove. S2. Solder mask: Perform a solder mask treatment on the PCB board with solder mask ink and dry the PCB board after the solder mask treatment. S3. Gold plating: Perform a gold plating treatment on the gold finger pattern on the PCB board. S4. Second drilling: Drill the SLOT groove in the area of the substrate board where the SLOT groove to be drilled is located. The SLOT groove is located at the position between adjacent gold finger patterns. S5. Second dry film: Perform a second dry film treatment on the PCB to protect the gold finger pattern with the dry film while exposing the supporting copper block. S6. Second etching: Etch and remove the exposed supporting copper block. In the S1, there are four such supporting copper blocks, and two such supporting copper blocks are arranged on each side of the substrate board, and the supporting copper blocks on both sides are aligned in pairs.

2. The drilling process of the PCB gold finger SLOT groove according to claim 1 is characterized in that: The thickness of the copper block is the same as that of the gold finger pattern.

3. The drilling process of the PCB gold finger SLOT groove according to claim 1 is characterized in that: The width of the supporting copper block is 10 mil.

4. The drilling process of the PCB gold finger SLOT groove according to claim 1, characterized in that: In the S4, a slot drill is used to drill the SLOT groove.

5. The drilling process of the PCB gold finger SLOT groove according to claim 4, characterized in that: The tip angle of the slot drill is 150°.

6. The drilling process of the PCB gold finger SLOT groove according to claim 4, characterized in that: The drilling method of the slot drill is G85.

7. The drilling process of the PCB gold finger SLOT groove according to claim 1 is characterized in that: In the S4, before drilling, first use a CCD camera to locate the MARK points of the outer layer pattern, then perform expansion and contraction stretching on the PCB board, and then drill the SLOT groove.

8. The drilling process of the PCB gold finger SLOT groove according to claim 1, characterized in that: In the S5, use an LDI device to locate the gold finger pattern and then perform dry film protection on the gold finger pattern.

9. The drilling process of the PCB gold finger SLOT groove according to claim 1 is characterized in that: After S6, it also includes a shaping treatment on the PCB board to remove the redundant process edges of the PCB board.

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