Optical waveguide module and light source module

Abstract

When joining the cover of the optical waveguide module, it is not easy to damage the protruding portion and the conductor layer. The optical waveguide module (110) includes: a substrate (1) having a first surface (1a); a core (21) extending in a first direction; a cladding (22) surrounding the core (21) and located on the first surface (1a); and a conductor layer (3) located on the cladding (22). The cladding (22) has a protruding portion (22b) on the core (21). A second surface (22d) of the protruding portion (22b) that contacts the conductor layer (3) is along the first surface (1a), and the protruding portion has a portion with a width wider than that of the core (21).

Description

Technical Field

[0001] The present disclosure relates to an optical waveguide module and a light source module. Background Art

[0002] There is known an optical waveguide module including a substrate, a core extending in a given direction, a cladding surrounding the core on the substrate, and a conductor layer located on the cladding.

[0003] In such an optical waveguide module, there has been conventionally known an optical waveguide module in which the surface of the cladding is also flat on the core (for example, see Patent Document 1).

[0004] In addition, in such an optical waveguide module, there is also known an optical waveguide module having a protrusion on the core in the cladding (see Patent Document 2).

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent No. 4579868

[0008] Patent Document 2: Japanese Unexamined Patent Application Publication No. 10-308555 Summary of the Invention

[0009] -Means for Solving the Problem-

[0010] An optical waveguide module according to one aspect of the present disclosure includes:

[0011] a substrate having a first surface;

[0012] a core extending in a first direction;

[0013] a cladding surrounding the core and located on the first surface; and

[0014] a conductor layer located on the cladding,

[0015] wherein the cladding has a protrusion on the core,

[0016] a second surface of the protrusion in contact with the conductor layer is along the first surface and the protrusion has a portion wider than the core.

[0017] A light source module according to one aspect of the present disclosure includes:

[0018] the above optical waveguide module;

[0019] an electrode located on the first surface of the optical waveguide module;

[0020] a light-emitting element located on the electrode; and

[0021] A cover body that covers the light-emitting element. Description of the Drawings

[0022] Figure 1 is an exploded perspective view of a light source module according to an embodiment of the present disclosure.

[0023] Figure 2 is a side view of a light source module according to another embodiment of the present disclosure.

[0024] Figure 3 is Figure 1 an example of an A-A cross-sectional view of

[0025] Figure 4 is Figure 1 another example of an A-A cross-sectional view of

[0026] Figure 5 is Figure 1 another example of an A-A cross-sectional view of

[0027] Figure 6 is Figure 1 another example of an A-A cross-sectional view of

[0028] Figure 7 is Figure 1 another example of an A-A cross-sectional view of

[0029] Figure 8 is Figure 1 another example of an A-A cross-sectional view of

[0030] Figure 9 is a top view showing a part of the light source module according to this embodiment.

[0031] Figure 10 is Figure 1 another example of an A-A cross-sectional view of

[0032] Figure 11 is Figure 1 another example of an A-A cross-sectional view of

[0033] Figure 12 is Figure 1 another example of an A-A cross-sectional view of

[0034] Figure 13 is Figure 1 another example of an A-A cross-sectional view of

[0035] Figure 14 is Figure 1 another example of an A-A cross-sectional view of

[0036] Figure 15 is Figure 1Another example of the A-A cross-sectional view.

[0037] Figure 16A It shows Figure 1 A cross-sectional view showing the state during the manufacture of the optical waveguide module included in the light source module.

[0038] Figure 16B It shows Figure 1 A cross-sectional view showing the state during the manufacture of the optical waveguide module included in the light source module.

[0039] Figure 16C It shows Figure 1 A cross-sectional view showing the state during the manufacture of the optical waveguide module included in the light source module.

[0040] Figure 16D It shows Figure 1 A cross-sectional view showing the state during the manufacture of the optical waveguide module included in the light source module.

[0041] Figure 16E It shows Figure 1 A cross-sectional view showing the state during the manufacture of the optical waveguide module included in the light source module. Detailed implementation mode

[0042] When manufacturing the module described in Patent Document 1, after forming a cladding on the core, it is necessary to remove the protruding portion of the cladding that can be formed on the core (for example, by grinding). Therefore, the manufacture of the module described in Patent Document 1 is time-consuming and laborious.

[0043] On the other hand, when manufacturing the module described in Patent Document 2, there is no need to remove the protruding portion. However, when joining the cover to the module, the thermal stress generated by the heat of the joining material concentrates on the protruding portion. Due to this thermal stress, there is a possibility that at least one of the protruding portion and the conductor layer is damaged. Specifically, cracks may occur in the protruding portion, or the conductor layer may peel off from the protruding portion.

[0044] However, the optical waveguide module of the present disclosure is not easily damaged to the protruding portion and the conductor layer when joining the cover, so it has excellent reliability and can be used for a long time.

[0045] The light source module of the present disclosure has excellent reliability.

[0046] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0047] Among them, the scope of the technology of the present disclosure is not limited to the content illustrated in the following embodiments and drawings.

[0048] <1. Structure of the light source module>

[0049] First, the structure of the light source module 100 according to the embodiments of the present disclosure will be described.

[0050] Figure 1 It is an exploded perspective view of the light source module.

[0051] As Figure 1 shown, the light source module 100 includes an optical waveguide module 110, a light emitting element 120, a lens 130, a cover 140, and a bonding layer 150 (see Figure 3 ).

[0052] The light source module 100 according to the present embodiment includes three light emitting elements 120.

[0053] In addition, the number of light emitting elements 120 included in the light source module 100 may be two or less, or may be four or more.

[0054] 〔1-1. Optical waveguide module〕

[0055] The optical waveguide module 110 includes a substrate 1, an optical waveguide 2, and a conductor layer 3.

[0056] In addition, the optical waveguide module 110 according to the present embodiment includes an electrode 4.

[0057] (Substrate)

[0058] The substrate 1 has a first surface 1a.

[0059] The first surface 1a according to the present embodiment is the widest surface of the substrate 1.

[0060] The first surface 1a of the substrate 1 according to the present embodiment is in the shape of a rectangular plate.

[0061] In addition, the shape of the first surface 1a may also be a square or other polygon.

[0062] (Optical waveguide)

[0063] The optical waveguide 2 is located on the first surface 1a of the substrate 1.

[0064] The optical waveguide 2 includes a core 21 and a cladding 22.

[0065] The core 21 extends in the first direction.

[0066] The first direction is a direction parallel to the first surface 1a, and in the present embodiment, it is the long side direction of the substrate 1.

[0067] The core 21 extends from the upper left to the lower right direction in the Figure 1 shown perspective view.

[0068] The material of the core 21 is, for example, glass (such as quartz, etc.), resin, etc.

[0069] The core 21 according to this embodiment includes a plurality of branch paths 211, a multiplexing section 212, and an integrated path 213.

[0070] The plurality of branch paths 211 each extend from an incident surface 211a (refer to Figure 2 ) toward the multiplexing section 212.

[0071] Each incident surface 211a faces the side surface of each light-emitting element 120.

[0072] The plurality of branch paths 211 converge in the multiplexing section 212.

[0073] The integrated path 213 extends from the multiplexing section 212 to an exit surface 213a (refer to Figure 2 ).

[0074] The exit surface 213a according to this embodiment faces the lens 130.

[0075] The cladding 22 surrounds the core 21 and is located on the first surface 1a of the substrate 1. That is, the core 21 is located within the cladding 22.

[0076] The cladding 22 extends from the first end 110a toward the second end 110b where the lens 130 is located.

[0077] The material of the cladding 22 is, for example, glass (such as quartz, etc.), resin, or the like.

[0078] The refractive index of the cladding 22 is lower than the refractive index of the core 21.

[0079] Figure 1 The illustrated cladding 22 according to this embodiment shows an example where it does not exist at the first end 110a on the side opposite to the second end 110b of the first surface 1a (the end on the first end 110a side of the first surface 1a is exposed).

[0080] The cladding 22 has an opening 22a.

[0081] The cladding 22 according to this embodiment has a plurality of openings 22a (an amount corresponding to the number of light-emitting elements 120).

[0082] Each opening 22a according to this embodiment is located at the end of the cladding 22 on the first end 110a side.

[0083] Each opening 22a according to this embodiment is a rectangle whose contour is one size larger than the mounting portion 41 of the electrode 4 or the light-emitting element 120 when viewed from a direction orthogonal to the first surface 1a.

[0084] In addition, the incident surface 211a of one branch path 211 among the multiple branch paths 211 of the core 21 is respectively located on the wall surface on the second end 110b side among the inner wall surfaces of the respective opening portions 22a.

[0085] (Conductor layer)

[0086] The conductor layer 3 (sealing ring) is located on the cladding 22.

[0087] The conductor layer 3 according to the present embodiment is in a rectangular frame shape surrounding the multiple opening portions 22a of the cladding 22.

[0088] The conductor layer 3 is joined to the lid 140 via a joining layer 150 (see Figure 3 ).

[0089] (Electrode)

[0090] The electrode 4 is located on the first surface 1a of the substrate 1.

[0091] A plurality of electrodes 4 are arranged corresponding to the plurality of light-emitting elements 120.

[0092] Each electrode 4 respectively has a mounting portion 41 and a lead-out portion 42.

[0093] The mounting portion 41 is located on the region within the opening portion 22a of the cladding 22 on the first surface 1a.

[0094] The lead-out portion 42 passes through the end portion on the first end 110a side of the cladding 22 from the mounting portion 41 and extends to the first end 110a of the substrate 1.

[0095] Moreover, the end portion on the first end 110a side of the lead-out portion 42 is exposed on the end portion on the first end 110a side of the first surface 1a.

[0096] [1-2. Light-emitting element]

[0097] The light-emitting element 120 is located within the opening portion 22a of the cladding 22.

[0098] Each light-emitting element 120 is mounted on the mounting portion 41 of each electrode 4 and is electrically connected to the electrode 4.

[0099] The light-emitting element 120 is, for example, a laser diode.

[0100] The three light-emitting elements 120 are respectively a red light-emitting element 120R that emits red light, a green light-emitting element 120G that emits green light, and a blue light-emitting element 120B that emits blue light.

[0101] [1-3. Lens]

[0102] The lens 130 is mounted on the second end 110b of the optical waveguide module 110.

[0103] The exit surface 213a of the combined path 213 of the lens 130 and the core 21 faces each other.

[0104] 〔1-4. Cover〕

[0105] The cover 140 may also include a main body 141 and a second conductor layer 142.

[0106] When observing the main body 141 from a direction orthogonal to the first surface 1a, the contour is a rectangle that is substantially equal to the contour of the conductor layer 3.

[0107] The main body 141 has a concave portion 141a at the central portion of the surface facing the substrate 1.

[0108] The second conductor layer 142 is located on the surface of the main body 141 that faces the substrate 1.

[0109] The second conductor layer 142 according to the present embodiment is in the shape of a rectangular frame along the periphery of the surface of the main body 141 that faces the substrate 1.

[0110] The second conductor layer 142 is joined to the conductor layer 3 of the optical waveguide module 110 via a joining layer 150 (see Figure 3 ).

[0111] 〔1-5. Joining layer〕

[0112] The joining layer 150 may also be a layer formed by curing a joining material.

[0113] The joining material is, for example, a metal-based material (e.g., Au, Sn, etc.) or a glass-based material.

[0114] The joining layer 150 is in close contact with the conductor layer 3 of the optical waveguide module 110 and is also in close contact with the second conductor layer 142 of the cover 140, thereby joining the cover 140 and the optical waveguide module 110.

[0115] 〔1-6. Others〕

[0116] In addition, as Figure 2 shown, the light source module 100 may also make the height of the light-emitting element 120 (the distance from the first surface 1a to the surface of the light-emitting element 120 that is farthest from the substrate 1) lower than the height of the conductor layer 3 (the distance from the first surface 1a to the surface of the conductor layer 3 that is farthest from the substrate 1).

[0117] Moreover, in this case, the cover 140 may be flat (it may not have the concave portion 141a).

[0118] 〔1-7. Function of the light source module〕

[0119] When a given voltage is applied to each lead portion 42 of the plurality of electrodes 4, the light-emitting elements 120R, 120G, and 120B emit light.

[0120] The red light, green light, and blue light emitted from the light-emitting elements 120R, 120G, and 120B are incident on the branching path 211 from the respective incident surfaces 211a.

[0121] As described above, the refractive index of the cladding 22 is lower than that of the core 21. Therefore, the light incident on the branching path 211 is totally reflected at the boundary surface between the branching path 211 and the cladding 22. As a result, each light travels directly within the branching path 211 while being confined within the branching path 211.

[0122] Then, the lights are multiplexed by the multiplexing section 212.

[0123] The multiplexed light travels within the combined path 213 while undergoing total reflection and exits from the exit surface 213a.

[0124] The light exiting from the exit surface 213a is irradiated to the outside through the lens 130.

[0125] <2. Characteristics of the optical waveguide module>

[0126] Next, the characteristics of the optical waveguide module 110 included in the light source module 100 described above will be described.

[0127] Figure 3 is Figure 1 an example of the A-A cross-sectional view (after the cover 140 is joined), Figures 4 - 8 10 to 15 are Figure 1 another example of the A-A cross-sectional view, Figure 9 is a top view showing a part of the light source module 100.

[0128] 〔2-1. Cross-sectional shape of the cladding〕

[0129] As described above, the cladding 22 surrounds the core 21 and is located on the first surface 1a.

[0130] Therefore, as Figure 3 shown, the cladding 22 has a protruding portion 22b on the core 21.

[0131] The portion of the cladding 22 that is not on the core 21 is the flat portion 22c.

[0132] The protruding portion 22b protrudes in a direction farther from the substrate 1 than the flat portion 22c.

[0133] The second surface 22d of the protruding portion 22b that contacts the conductor layer 3 is along the first surface 1a and the protruding portion has a portion with a width wider than that of the core 21.

[0134] "Along the first surface 1a" is not limited to being parallel to the first surface 1a, and also includes cases where it is inclined within the range of ±2° relative to the first surface 1a.

[0135] In Figure 3 the case of the cross-section shown, the entire top of the protrusion 22b is the second surface 22d.

[0136] In addition, there are various deformation modes in the cross-sectional shape of the protrusion 22b.

[0137] Hereinafter, each deformation mode will be described separately.

[0138] (Deformation mode 1)

[0139] The protrusion 22b involved in deformation mode 1, for example, as Figure 4 shown, the shape of the corner 22e in the cross-section orthogonal to the first direction is convex-curved.

[0140] "Corner 22e" is the part where the third surface 22f (side surface) extending in the direction away from the substrate 1 in the protrusion 22b is connected to the second surface 22d.

[0141] The shape of the corner 22e involved in deformation mode 1 is formed to bulge in the direction away from the core 21.

[0142] (Deformation mode 2)

[0143] For example, as Figure 5 shown, the width of the protrusion 22b involved in deformation mode 2 expands toward the substrate 1.

[0144] "Erecting part 22g" is the part where the fourth surface 22h facing the conductor layer 3 in the flat part 22c is connected to the third surface 22f.

[0145] That is, a part of the third surface 22f of the protrusion 22b involved in deformation mode 2 is inclined.

[0146] The erecting parts 22g involved in this embodiment are smoothly connected to the third surface 22f and the fourth surface 22h respectively.

[0147] (Deformation mode 3)

[0148] For example, as Figure 6 shown, the third surface 22f of the protrusion 22b involved in deformation mode 3 is inclined so that the width becomes wider as it approaches the substrate 1.

[0149] That is, the entire third surface 22f of the protrusion 22b involved in deformation mode 3 is inclined.

[0150] If the protrusion 22b is formed into a shape as in the above-described deformation modes 1 to 3, when the lid 140 is joined to the optical waveguide module 110, the change in the thickness of each part in the joining layer 150 becomes slow, and thus concentration of stress at the corner 22e can be prevented.

[0151] As a result, the conductor layer 3 is less likely to break.

[0152] In addition, in the corner 22e, voids are less likely to be generated between the protrusion 22b and the conductor layer 3, and between the conductor layer 3 and the joining layer 150.

[0153] (Deformation mode 4)

[0154] For example, as Figure 7 shown, the cladding 22 according to the deformation mode 4 has a recess 22i near the protruding portion of the protrusion 22b (the boundary portion between the protrusion 22b and the flat portion 22c).

[0155] In addition, the conductor layer 3 according to the deformation mode 4 enters the recess 22i.

[0156] In this way, by the conductor layer 3 entering the recess 22i, the conductor layer 3 is less likely to peel off from the cladding 22.

[0157] (Deformation mode 5)

[0158] For example, as Figure 8 shown, the erected portion 22g of the protrusion 22b according to the deformation mode 5 has a height difference.

[0159] Specifically, the erected portion 22g side of the third surface 22f protrudes away from the core 21 along the first surface 1a.

[0160] In this way, the contact area between the protrusion 22b and the conductor layer 3 increases corresponding to the height difference, and thus the conductor layer 3 is difficult to peel off.

[0161] (Deformation mode 6)

[0162] When the protrusion 22b located on the core 21 is the first protrusion 22b in the cladding 22 according to the deformation mode 6, for example, as Figure 9 shown, it has at least a second protrusion 22j on the side of the light-emitting element 120.

[0163] Since the first protrusion 22b extends from the second end side 110b of the opening 22a of the cladding 22 in the first direction, it is preferable that the second protrusion 22j extends from the first end 110a side located at a position opposite to the second end 110b side of the opening 22a in a direction opposite to the first direction.

[0164] In this way, compared with the case of only the first protrusion 22b, the thermal stress during the joining of the cover body 140 can be dispersed.

[0165] In addition, as Figure 9 shown, the second protrusion 22j can extend parallel to the first protrusion 22b or can extend in a direction orthogonal to the first protrusion 22b.

[0166] [2-2. Cross-sectional Shape of Conductor Layer]

[0167] Figures 3 - 8 The conductor layer 3 shown imitates the surface shape of the cladding 22.

[0168] However, the conductor layer 3 does not necessarily have to be like this.

[0169] That is, there are various deformation methods for the cross-sectional shape of the conductor layer 3.

[0170] Hereinafter, each deformation method will be described separately.

[0171] Here, taking the case where the cross-sectional shape of the protrusion 22b is the same as that Figure 3 shown as an example for description, but it is also possible to combine the following various conductor layers 3 with the Figures 4 - 8 shown protrusion 22b.

[0172] (Deformation Method A)

[0173] For example, as Figure 10 shown, the shape on the second surface 22d of the protrusion 22b of the conductor layer 3 related to the deformation method A is a convex curved shape.

[0174] (Deformation Method B)

[0175] For example, as Figure 11 shown, the shape on the corner 22e of the protrusion 22b of the conductor layer 3 related to the deformation method B is a convex curved shape.

[0176] (Deformation Method C)

[0177] For example, as Figure 12 shown, the thickness T1 on the corner 22e of the protrusion 22b of the conductor layer 3 related to the deformation method C is thicker than the thickness T2 on the second surface 22d.

[0178] (Deformation Method D)

[0179] For example, as Figure 13 shown, the thickness T3 of the part of the conductor layer 3 related to the deformation method D opposite to the vicinity of the protrusion 22b (the boundary part between the protrusion 22b and the flat part 22c) is thicker than the thickness T4 on the flat part 22c (the part of the cladding 22 other than the protrusion 22b, adjacent to the standing part 22g).

[0180] (Deformation method E)

[0181] For example Figure 14 As shown, the portion of the conductor layer 3 involved in the deformation method E that is opposed to the front of the protruding portion 22b is connected in a convexly curved shape.

[0182] (Deformation method F)

[0183] For example Figure 15 As shown, the portion of the conductor layer 3 involved in the deformation method F that is opposed to the front of the protruding portion 22b is connected in a concavely curved shape.

[0184] ><Manufacturing method of optical waveguide module>

[0185] Next, the manufacturing method of the above optical waveguide module 110 will be described.

[0186] Figures 16A - 16E is a cross-sectional view showing the state during the manufacturing of the optical waveguide module 110.

[0187] The manufacturing method of the optical waveguide module 110 according to the present embodiment includes a first cladding film formation step, a core formation step, a second cladding film formation step, a smoothing step, an opening formation step, and a conductor layer film formation step.

[0188] (First cladding film formation step)

[0189] In the first cladding film formation step at the start, as Figure 16A shown, a first cladding 221, which is a part of the cladding 22, is formed on the first surface 1a of the substrate 1 on which the electrode 4 is formed.

[0190] (Core formation step)

[0191] After the first cladding 221 is formed on the substrate 1, the process proceeds to the core formation step.

[0192] In the core formation step, as Figure 16B shown, a core 21 is formed on the surface of the first cladding 221.

[0193] Specifically, first, a core layer is formed on the entire surface of the first cladding 221.

[0194] Then, unnecessary portions in the core layer are removed (for example, by etching).

[0195] Thus, the portions in the core layer that are not removed and remain become the core 21.

[0196] In addition, when the optical waveguide module 110 is to be provided with the above-described second protrusion 22j, in this core film-forming step, a dummy core 21A may also be formed at a position where the second protrusion 22j is to be formed.

[0197] In this way, in the subsequent second cladding forming step, the second protrusion 22j can be easily formed.

[0198] In addition, the material of the dummy core 21A may be the same as or different from that of the core portion 21.

[0199] If the material of the dummy core 21A is set to be the same as that of the core 21, it is consistent with the core 21 in terms of the degree of thermal expansion. Therefore, it is possible to prevent stress from concentrating on a part of the cladding 22 due to non-uniformity of the thermal expansion difference.

[0200] (Second Cladding Film-Forming Step)

[0201] After the core 21 is formed, the process proceeds to the second cladding film-forming step.

[0202] In the second cladding film-forming step, as Figure 16C shown, the second cladding 222 is formed so as to cover the first cladding 221 and the core 21.

[0203] The formed second cladding 222 and the first cladding 221 together form the cladding 22.

[0204] In addition, a part of the second cladding 222 is formed on the core 21 to become the protrusion 22b.

[0205] In the manufacturing method according to the present embodiment, by making the film-forming time of the second cladding 222 longer than before or increasing the film-forming speed, the second cladding 222 is formed thicker than before. As a result, the width of the second surface 22d of the protrusion 22b is larger than the width of the core 21.

[0206] (Smoothing Step)

[0207] After the second cladding 222 is formed, the process proceeds to the smoothing step.

[0208] In the smoothing step, as Figure 16D shown, the entire surface of the protrusion 22b (including the second surface 22d, the third surface 22f, the corner portion 22e of the protrusion 22b, and the standing portion 22g) is smoothed.

[0209] Specifically, sandblasting or wet etching is performed on the entire surface of the cladding 22 including the protrusion 22b.

[0210] Such processing can be easily performed compared to removing the protrusion 22b by polishing.

[0211] In addition, when the cross-sectional shape of the protruding portion 22b is in the above-described various modified forms, in this smoothing process, the protruding portion 22b is cut into a desired shape.

[0212] (Opening forming process)

[0213] After forming the second cladding 222 or after smoothing the entire surface of the protruding portion 22b, the process proceeds to the opening forming process.

[0214] In the opening forming process, a plurality of openings 22a are formed in a part of the cladding 22 formed by laminating the second cladding 222 on the first cladding 221 (see Figure 1 ).

[0215] (Conductor layer forming process)

[0216] After forming the openings 22a in the cladding 22, the process proceeds to the conductor layer forming process.

[0217] In the conductor layer forming process, as Figure 16E shown, a conductor layer 3 is formed on the second surface 22d of the cladding 22 and around the openings 22a.

[0218] Specifically, plating, sputtering, etc. are performed.

[0219] In addition, when the cross-sectional shape of the conductor layer 3 is in the above-described various modified forms, in this conductor layer forming process, film formation is performed while adjusting the direction of metal atoms sputtered from the sputtering target, etc.

[0220] In this way, the above-described optical waveguide module 110 is manufactured.

[0221] <4. Effects>

[0222] In the optical waveguide module 110 according to the present embodiment described above and the light source module 100 including the optical waveguide module 110, there is no need for a process of removing the protruding portion during manufacturing.

[0223] In addition, in the optical waveguide module 110 and the light source module 100 according to the present embodiment, thermal stress generated by the heat of the bonding material is less likely to concentrate on the protruding portion 22b.

[0224] In addition, the light source module 100 according to the present embodiment reduces the time and effort during manufacturing, and is less likely to damage the protruding portion 22b and the conductor layer 3 when bonding the cover 140, so it has excellent reliability and can be used for a long time.

[0225] In addition, the optical waveguide module 110 and the light source module 100 according to the present embodiment can also prevent the deformation of the core 21 or the deviation of the optical axis by alleviating the thermal stress acting on the protrusion 22b. As a result, the optical waveguide module 110 and the light source module 100 according to the present embodiment can prevent the reduction of the light transmission efficiency.

[0226] - Industrial Applicability -

[0227] The present invention can be applied to an optical waveguide module and a light source module.

[0228] - Symbol Explanation -

[0229] 100 Light source module

[0230] 110 Optical waveguide module

[0231] 1 Substrate

[0232] 1a First surface

[0233] 2 Optical waveguide

[0234] 21 Core

[0235] 211 Branch path

[0236] 211a Incident surface

[0237] 212 Combiner

[0238] 213 Composite path

[0239] 213a Exit surface

[0240] 21A Virtual core

[0241] 22 Cladding

[0242] 22a Opening

[0243] 22b Protrusion (first protrusion)

[0244] 22c Flat part

[0245] 22d Second surface

[0246] 22e Corner

[0247] 22f Third surface

[0248] 22g Upright part

[0249] 22h Fourth surface

[0250] 22i Recess

[0251] 22j Second protrusion

[0252] 221 First cladding layer

[0253] 222 Second cladding layer

[0254] 3 Conductor layer

[0255] 4 Electrode

[0256] 41 Mounting part

[0257] 42 Lead-out part

[0258] 120 Light-emitting element

[0259] 120B Blue light-emitting element

[0260] 120G Green light-emitting element

[0261] 120R Red light-emitting element

[0262] 130 Lens

[0263] 140 Cover

[0264] 141 Main body

[0265] 141a Recess

[0266] 142 Second conductor layer

[0267] 150 Bonding layer.

Claims

1. An optical waveguide module, comprising: A substrate having a first surface; A core extending in a first direction; A cladding surrounding the core and located on the first surface, and having a protruding portion located on the core, a flat portion disposed at an interval from the core in a plan view, and an opening; and A conductor layer continuously provided from the flat portion to the protruding portion, and surrounding the opening, The protruding portion has a second surface in contact with the conductor layer, The second surface is along the first surface, and the protruding portion has a portion wider than the core.

2. The optical waveguide module according to claim 1, wherein, The shape of the corner in the cross-section orthogonal to the first direction of the protruding portion is convexly curved.

3. The optical waveguide module according to claim 1, wherein, The width of the protruding portion in the standing portion extends toward the substrate.

4. The optical waveguide module according to claim 1, wherein, The third surface of the protruding portion connected to the second surface is inclined so that the width of the protruding portion becomes wider as it approaches the substrate.

5. The optical waveguide module according to any one of claims 1 to 4, wherein, The cladding has a recess in front of the protruding portion.

6. The optical waveguide module according to claim 1, wherein, The cladding has a plurality of the flat portions and a plurality of the protruding portions. The conductor layer is continuously provided from each of the flat portions to each of the protruding portions.

7. The optical waveguide module according to any one of claims 1 to 4, wherein, The conductor layer follows the surface shape of the cladding.

8. The optical waveguide module according to any one of claims 1 to 4, wherein, The shape on the second surface of the protruding portion of the conductor layer is convexly curved.

9. The optical waveguide module according to any one of claims 1 to 4, wherein, The shape at the corner of the protruding portion of the conductor layer is convexly curved.

10. The optical waveguide module according to any one of claims 1 to 4, wherein, The thickness at the corner of the protruding portion of the conductor layer is thicker than the thickness on the second surface.

11. The optical waveguide module according to any one of claims 1 to 4, wherein, The thickness of the portion of the conductor layer opposite to the front of the protruding portion is thicker than the thickness of the portion of the cladding other than the protruding portion.

12. The optical waveguide module according to any one of claims 1 to 4, wherein, The portion of the conductor layer opposite to the front of the protruding portion is convexly curved.

13. The optical waveguide module according to any one of claims 1 to 4, wherein, The portion of the conductor layer opposite to the front of the protruding portion is concavely curved.

14. The optical waveguide module according to any one of claims 1 to 4, wherein, The core is an optical waveguide through which light emitted by the light-emitting element passes. When the protruding portion located on the core is a first protruding portion, the cladding has at least a second protruding portion on the side of the light-emitting element.

15. A light source module, comprising: The optical waveguide module according to any one of claims 1 to 14; An electrode located within the opening of the optical waveguide module; A light-emitting element located on the electrode; and A cover covering the light-emitting element.

16. The light source module according to claim 15, wherein, A plurality of the light-emitting elements are provided. Each light-emitting element is a red light-emitting element, a green light-emitting element, and a blue light-emitting element.

Images