A detachable air-conditioning suit with semiconductor temperature control device

Abstract

The present invention discloses a detachable air-conditioning garment with a semiconductor temperature control device. The semiconductor temperature control device is installed on a garment with a hole to make an air-conditioning garment. A fan is installed inside the garment to make the air inside the garment flow, and then the air inside the garment exchanges heat with the semiconductor temperature control device fixed outside through a metal heat exchanger connected to the outside. Thus, the air temperature inside the garment is adjusted.

Description

Technical Field

[0001] The invention relates to semiconductor refrigeration technology, and in particular to a detachable air-conditioning suit applicable to a semiconductor temperature control regulating device. Background Art

[0002] Semiconductor refrigeration technology uses the Peltier effect in physics to control the heat transfer inside a specific material using electrical energy. In 1834, French scientist Peltier discovered the thermoelectric effect. When two different metals form a closed loop and a DC current flows in the loop, a temperature difference will be generated between the two joints.

[0003] In the 1950s and 1960s, research on thermoelectric technology made rapid progress. Among many materials, bismuth telluride was found to have the most outstanding performance and became the main material for making semiconductor Peltier. In the 1960s and 1970s, my country also conducted a lot of research in order to use thermoelectric technology in the aerospace field and achieved mass production of semiconductor Peltier.

[0004] Although the Peltier effect has been discovered for nearly 190 years, research on thermoelectric materials and thermoelectric applications is still ongoing. For example, the seat heating and cooling functions that have become popular in recent years are realized using semiconductor Peltier.

[0005] At the same time, with the rapid development of the electronics industry, the technology of integrated circuits is becoming more and more advanced, the integration is getting higher and higher, and the power consumption is getting lower and lower. Using a few small chips can realize the drive and control of semiconductor Peltier. This makes the application of semiconductor Peltier in portable devices and clothing possible.

[0006] A high-efficiency heat sink, a semiconductor Peltier and a control circuit can be assembled into a semiconductor temperature control device, and its size and weight are much smaller than the air compressor refrigeration system on air conditioners and refrigerators.

[0007] Therefore, semiconductor temperature control devices have great application potential in wearable devices and portable devices. Summary of the invention

[0008] The present invention includes a heat exchanger, a fan, an outer shell, an inner shell and a piece of clothing with a plurality of holes. The fixed structure on the outer shell of the clothing is connected to the semiconductor temperature control device, so that the heat exchange plane on the heat exchanger and the thermoelectric sheet in the semiconductor temperature control device are tightly attached together, thereby reducing the loss in the heat transfer process. A side-blowing fan is fixed on the inner shell of the clothing to blow the surrounding air into the ventilation duct of the heat exchanger to heat or cool the air inside the clothing, thereby realizing the regulation of the internal environmental temperature of the clothing.

[0009] The present invention provides a detachable air-conditioning garment applicable to a semiconductor temperature control regulating device.

[0010] The semiconductor temperature control and adjustment device comprises a semiconductor temperature control device provided with a thermoelectric sheet and a heat exchange device;

[0011] The heat exchange device comprises a connected heat-conducting column and a heat exchanger, wherein the top surface of the heat-conducting column is a heat exchange plane.

[0012] The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to the side-blowing fan;

[0013] Each hole on the air-conditioning suit is provided with fixing holes of the same size on both sides for fixing the semiconductor temperature control device and the heat exchange device;

[0014] It also includes an outer shell for fixing and installing a semiconductor temperature control device and an inner shell for fixing a heat exchange device; the outer shell and the inner shell are respectively provided with mutually cooperating fixing devices that can pass through fixing holes and be fixed and locked to each other; the clothes are tightly clamped between the inner shell and the outer shell.

[0015] The semiconductor temperature control device and the heat exchange device are respectively fixed and locked to each other through fixing devices that cooperate with each other on the outer shell and the inner shell through fixing holes; when fixed and locked, the heat exchange plane of the heat conductive column fits with the thermoelectric sheet in the semiconductor temperature control device.

[0016] Further, in the above technical solution, a window is provided in the middle of the outer shell, columns are provided on opposite sides of the window of the outer shell, telescopic buckles are provided at the upper and lower ends of the column, and the telescopic buckle retracts into the column under the action of external force; a switch slot is provided in the outer shell, and a switch for controlling the telescopic buckle to retract is provided in the switch slot;

[0017] The semiconductor temperature control device includes a semiconductor temperature control module. There are two grooves on both sides of the bottom surface of the semiconductor temperature control module that are slightly larger than the size of the pillars. The upper and lower ends of the grooves retain card slots that are larger than the size of the buckle. In the middle of the semiconductor temperature control module is a semiconductor refrigeration plate; align the two grooves on the semiconductor temperature control module with the two pillars on the outer shell of the clothes and press the semiconductor temperature control module downward, and the semiconductor temperature control module will be tightly buckled with the outer shell; pushing the switch in the direction of the arrow can make the buckle retract into the pillar in the direction of the arrow, and the semiconductor temperature control module can be removed from the outer shell.

[0018] Further, in the above technical solution, the semiconductor temperature control device includes a semiconductor temperature control module, and columns are provided on both sides of the bottom surface of the semiconductor temperature control module, and telescopic buckles are provided at the upper and lower ends of the columns, and the telescopic buckles are retracted into the columns under the action of external force; a switch slot is provided on the semiconductor temperature control device, and a switch for controlling the telescopic buckle to be extended and retracted is provided in the switch slot;

[0019] A window is provided in the middle of the outer shell, and two grooves slightly larger than the size of the pillars are provided on the opposite sides of the window of the outer shell. Card slots larger than the size of the buckle are retained at the upper and lower ends of the grooves. The two grooves are aligned with the two pillars on the semiconductor temperature control module of the clothes and the outer shell is pressed down, and the semiconductor temperature control module will be tightly buckled with the outer shell; pushing the switch in the direction of the arrow can make the buckle retract into the pillar in the direction of the arrow, and the semiconductor temperature control module can be removed from the outer shell.

[0020] Furthermore, in the above technical solution, the heat exchanger in the heat exchange device is made of a metal material with high thermal conductivity.

[0021] Furthermore, in the above technical solution, the heat exchanger in the heat exchange device is made of aluminum, copper, aluminum alloy or copper alloy.

[0022] Furthermore, in the above technical solution, the outer shell or the inner shell is made of a lightweight material that can fix the heat exchanger and the fan and make the heat exchange plane of the heat exchanger close to the thermoelectric sheet of the semiconductor temperature control device, and is not limited to flexible or rigid materials.

[0023] Furthermore, in the above technical solution, the material of the outer shell or the inner shell includes leather or plastic.

[0024] Furthermore, in the above technical solution, a high thermal conductivity material such as thermally conductive silica gel, thermally conductive silicone grease or thermally conductive silica gel paste is provided between the heat exchange plane of the heat exchange device and the thermoelectric sheet to reduce the contact thermal resistance of the surface.

[0025] Furthermore, in the above technical solution, the semiconductor temperature control device includes a thermoelectric sheet and a heat sink arranged outside the thermoelectric sheet.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] The invention not only uses a fan to circulate air inside the clothes, but also reserves space for a semiconductor temperature control device. It uses forced convection to accelerate the evaporation of sweat, and then uses thermoelectric refrigeration technology to cool the air inside the clothes. In weather above 35 or 36 degrees Celsius, it can better achieve the purpose of cooling the human body.

[0028] In addition, the invention has a simple structure, and the clothes can be washed by removing the shells on both sides. After washing, the clothes can be further used by buckling the shells on both sides. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 Schematic diagram of the structure of the heat exchange device in the embodiment.

[0031] Figure 2 Schematic diagram of the structure of the outer shell and the temperature control module in the embodiment.

[0032] Figure 3 Schematic diagram of the inner structure of the air-conditioning suit in the embodiment.

[0033] Figure 4 This is the air-conditioning clothing using multiple temperature control modules in Example 4 of the present invention.

[0034] Figure 5 Schematic diagram of the cross-section of the heat exchange structure of the air-conditioning clothing in the embodiment.

[0035] Figure 6 Schematic diagram of the outer structure of the air-conditioning suit in the embodiment. DETAILED DESCRIPTION

[0036] Example 1

[0037] A detachable air-conditioning garment applicable to a semiconductor temperature control and adjustment device, characterized in that it comprises a heat exchange device;

[0038] It also includes an outer shell for fixing and installing the semiconductor temperature control device and an inner shell for fixing the heat exchange device;

[0039] The heat exchange device comprises a connected heat-conducting column and a heat exchanger, and the top surface of the heat-conducting column is a heat exchange plane;

[0040] The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to the side-blowing fan;

[0041] The outer shell and the inner shell are respectively provided with mutually cooperating fixing devices which can pass through the fixing holes arranged on both sides of the air conditioning suit hole to be fixed and locked to each other;

[0042] A window is provided in the middle of the outer shell;

[0043] The outer shell has columns on opposite sides of the window, and telescopic buckles are provided at the upper and lower ends of the columns. The telescopic buckles are retracted into the columns under the action of external force; the outer shell has a switch slot, and a switch for controlling the telescopic buckle to be extended and retracted is provided in the switch slot;

[0044] Alternatively, two grooves slightly larger than the size of the pillars are provided on opposite sides of the window of the outer shell, and slots larger than the size of the buckle are retained at the upper and lower ends of the grooves. The two grooves are aligned with the two pillars on the semiconductor temperature control module of the clothes and the outer shell is pressed down, and the semiconductor temperature control module will be tightly buckled with the outer shell; pushing the switch in the direction of the arrow can make the buckle retract into the pillar in the direction of the arrow, and the semiconductor temperature control module can be removed from the outer shell.

[0045] Example 2

[0046] A detachable air-conditioning garment applicable to a semiconductor temperature control and regulation device, wherein the semiconductor temperature control and regulation device comprises a semiconductor temperature control device provided with a thermoelectric sheet and a heat exchange device; Figure 1 , Figure 3 , heat exchange device structure. It includes a heat exchanger body 100, a heat exchange plane 110, a heat exchanger bottom 140, fins 120, and a ventilation duct 130. The heat exchanger body 100 is made of a metal material with high thermal conductivity. The semiconductor temperature control device is in contact with the heat exchange plane 110, and the heat is transferred to the heat exchanger body 100 to cool down or heat up. Then, the fan forced convection and the heat dissipation fins 120 accelerate the heat exchange between the air inside the clothes and the heat exchanger body.

[0047] The heat exchange device includes a connected heat-conducting column and a heat exchanger, and the top surface of the heat-conducting column is a heat exchange plane. The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to a side-blowing fan;

[0048] The semiconductor temperature control device includes a thermoelectric chip and a heat sink 290 disposed outside the thermoelectric chip.

[0049] Each hole on the air-conditioning suit is provided with fixing holes of the same size on both sides for fixing the semiconductor temperature control device and the heat exchange device;

[0050] It also includes an outer shell 200 for fixing and installing the semiconductor temperature control device and an inner shell 30 for fixing the heat exchange device; the outer shell and the inner shell are respectively provided with mutually cooperating fixing devices that can pass through the fixing holes to be fixed and locked to each other;

[0051] The semiconductor temperature control device and the heat exchange device are respectively fixed and locked to each other through fixing holes through the matching fixing devices on the outer shell 200 and the inner shell; when fixed and locked, the heat exchange plane of the heat conductive column fits with the thermoelectric sheet in the semiconductor temperature control device.

[0052] See also Figures 2 to 6 A feasible inner and outer shell structure. The fixing structure 280 on the outer shell of the clothing is connected to the semiconductor temperature control device; the outer shell 200, the outer shell 200 has a window 210 in the middle, the outer shell 200 has columns 230 on opposite sides of the window 210, the upper and lower ends of the column 230 are provided with telescopic buckles 235, the telescopic buckle 235 retracts into the column 230 under the action of external force; the outer shell 200 is provided with a switch slot 240, and the switch slot 240 is provided with a switch 245 for controlling the telescopic buckle 235 to retract.

[0053] The semiconductor temperature control device includes a semiconductor temperature control module 250. There are two grooves 260 on both sides of the bottom surface of the semiconductor temperature control module 250, which are slightly larger than the size of the column 230. The upper and lower ends of the grooves 260 retain a slot larger than the size of the buckle 235. In the middle of the semiconductor temperature control module 250 is a semiconductor cooling plate 270. The two grooves 260 on the semiconductor temperature control module 250 are aligned with the two columns 230 on the outer shell 200 of the clothes and the semiconductor temperature control module 250 is pressed down, and the semiconductor temperature control module 250 will be tightly buckled with the outer shell 200. Pushing the switch 245 in the direction of the arrow can make the buckle 235 retract into the column 230 in the direction of the arrow, and the semiconductor temperature control module 250 can be removed from the outer shell 200. Conversely, the buckle 235 and the switch 245 can be placed on the semiconductor temperature control module 250, and the groove 260 can be placed on the outer shell 200 on the clothes.

[0054] The heat exchanger in the heat exchange device is made of aluminum, copper, aluminum alloy or copper alloy.

[0055] The outer shell or the inner shell is made of a lightweight material that can fix the heat exchanger and the fan and make the heat exchange plane of the heat exchanger close to the thermoelectric sheet of the semiconductor temperature control device, and is not limited to flexible or rigid materials.

[0056] The outer shell or inner shell material includes leather and plastic.

[0057] Example 3

[0058] A detachable air-conditioning garment applicable to a semiconductor temperature control and regulation device, wherein the semiconductor temperature control and regulation device comprises a semiconductor temperature control device provided with a thermoelectric sheet and a heat exchange device;

[0059] The heat exchange device comprises a connected heat-conducting column and a heat exchanger, and the top surface of the heat-conducting column is a heat exchange plane;

[0060] The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to the side-blowing fan;

[0061] The semiconductor temperature control device includes a thermoelectric chip and a heat sink 290 disposed outside the thermoelectric chip.

[0062] Each hole on the air-conditioning suit is provided with fixing holes of the same size on both sides for fixing the semiconductor temperature control device and the heat exchange device;

[0063] It also includes an outer shell for fixing and installing the semiconductor temperature control device and an inner shell for fixing the heat exchange device; the outer shell and the inner shell are respectively provided with mutually cooperating fixing devices that can pass through the fixing holes and be fixed and locked to each other;

[0064] The semiconductor temperature control device and the heat exchange device are respectively fixed and locked to each other through fixing devices that cooperate with each other on the outer shell and the inner shell through fixing holes; when fixed and locked, the heat exchange plane of the heat conductive column fits with the thermoelectric sheet in the semiconductor temperature control device.

[0065] The semiconductor temperature control device comprises a semiconductor temperature control module, and columns are arranged on both sides of the bottom surface of the semiconductor temperature control module, and telescopic buckles are arranged at the upper and lower ends of the columns, and the telescopic buckles are retracted into the columns under the action of external force; a switch slot is arranged on the semiconductor temperature control device, and a switch for controlling the telescopic buckle to be extended and retracted is arranged in the switch slot;

[0066] A window is provided in the middle of the outer shell, and two grooves slightly larger than the size of the pillars are provided on the opposite sides of the window of the outer shell. Card slots larger than the size of the buckle are retained at the upper and lower ends of the grooves. The two grooves are aligned with the two pillars on the semiconductor temperature control module of the clothes and the outer shell is pressed down, and the semiconductor temperature control module will be tightly buckled with the outer shell; pushing the switch in the direction of the arrow can make the buckle retract into the pillar in the direction of the arrow, and the semiconductor temperature control module can be removed from the outer shell.

[0067] The heat exchanger in the heat exchange device is made of aluminum, copper, aluminum alloy or copper alloy.

[0068] The outer shell or the inner shell is made of a lightweight material that can fix the heat exchanger and the fan and make the heat exchange plane of the heat exchanger close to the thermoelectric sheet of the semiconductor temperature control device, and is not limited to flexible or rigid materials.

[0069] The outer shell or inner shell material includes leather and plastic.

[0070] A high thermal conductivity material such as thermally conductive silica gel, thermally conductive silicone grease or thermally conductive silica gel paste is provided between the heat exchange plane of the heat exchange device and the thermoelectric sheet to reduce the contact thermal resistance of the surface.

[0071] Example 4

[0072] like Figures 3 to 6 As shown, another embodiment of the present application provides an air-conditioning suit with multiple temperature control modules installed. The difference from Example 2 is that two semiconductor temperature control modules 410 with outer shells are installed above the chest on the front and above the shoulder blades on the back of the suit b400. The internal structure is the same as the fan and heat exchanger in Example 2.

[0073] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0074] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0076] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0077] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A detachable air-conditioning garment with a semiconductor temperature control device, characterized in that: including a heat exchange device; It also includes an outer shell for fixing and installing the semiconductor temperature control device and an inner shell for fixing the heat exchange device; The heat exchange device comprises a connected heat-conducting column and a heat exchanger, the top surface of the heat-conducting column is a heat exchange plane; the heat exchanger in the heat exchange device is made of a metal material with high thermal conductivity; The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to the side-blowing fan; The outer shell and the inner shell are respectively provided with mutually cooperating fixing devices which can pass through the fixing holes arranged on both sides of the air conditioning suit hole to be fixed and locked to each other; The semiconductor temperature control device and the heat exchange device are respectively fixed and locked to each other through the fixing devices that cooperate with each other on the outer shell and the inner shell through the fixing holes; when fixed and locked, the heat exchange plane of the heat conductive column is in contact with the thermoelectric sheet in the semiconductor temperature control device; between the heat exchange plane of the heat exchange device and the thermoelectric sheet, there is a heat conductive silica gel and heat conductive silicone grease for reducing the contact thermal resistance of the surface; A window is provided in the middle of the outer shell; The outer shell has columns on opposite sides of the window, and telescopic buckles are provided at the upper and lower ends of the columns. The telescopic buckles are retracted into the columns under the action of external force; the outer shell has a switch slot, and a switch for controlling the telescopic buckle to be extended and retracted is provided in the switch slot; The semiconductor temperature control device includes a semiconductor temperature control module; Cooperating with the upper column of the outer shell; There are two grooves slightly larger than the size of the pillars on both sides of the bottom surface of the semiconductor temperature control module. Card slots larger than the size of the buckles are retained at the upper and lower ends of the grooves. In the middle of the semiconductor temperature control module is a semiconductor refrigeration plate; align the two grooves on the semiconductor temperature control module with the two pillars on the outer shell of the clothes and press the semiconductor temperature control module down, the semiconductor temperature control module will be tightly buckled with the outer shell; pushing the switch in the direction of the arrow can make the buckle retract into the pillar in the direction of the arrow, and the semiconductor temperature control module can be removed from the outer shell.

2. A detachable air-conditioning garment with a semiconductor temperature control device, characterized in that: including a heat exchange device; It also includes an outer shell for fixing and installing the semiconductor temperature control device and an inner shell for fixing the heat exchange device; The heat exchange device comprises a connected heat-conducting column and a heat exchanger, the top surface of the heat-conducting column is a heat exchange plane; the heat exchanger in the heat exchange device is made of a metal material with high thermal conductivity; The air-conditioning clothing is provided with a plurality of holes, and the holes allow the heat exchange plane on the top surface of the heat-conducting column of the heat exchange device to pass through the holes and be exposed outside the clothing; the heat exchanger cannot pass through the holes and is arranged on the inside of the clothing, and the heat exchanger is connected to the side-blowing fan; The outer shell and the inner shell are respectively provided with mutually cooperating fixing devices which can pass through the fixing holes arranged on both sides of the air conditioning suit hole to be fixed and locked to each other; A window is provided in the middle of the outer shell; The semiconductor temperature control device and the heat exchange device are respectively fixed and locked to each other through the fixing devices that cooperate with each other on the outer shell and the inner shell through the fixing holes; when fixed and locked, the heat exchange plane of the heat conductive column is in contact with the thermoelectric sheet in the semiconductor temperature control device; between the heat exchange plane of the heat exchange device and the thermoelectric sheet, there is a heat conductive silica gel and heat conductive silicone grease for reducing the contact thermal resistance of the surface; Two grooves slightly larger than the size of the pillars are provided on opposite sides of the window of the outer shell, and the upper and lower ends of the grooves retain slots larger than the size of the buckle. Align the two grooves with the two pillars on the semiconductor temperature control module of the clothes and press the outer shell downward, and the semiconductor temperature control module will be tightly buckled with the outer shell; push the switch in the direction of the arrow to make the buckle retract into the pillar in the direction of the arrow, and then the semiconductor temperature control module can be removed from the outer shell; The semiconductor temperature control device includes a semiconductor temperature control module; Cooperating with the groove on the outer shell; There are columns on both sides of the bottom surface of the semiconductor temperature control module, and telescopic buckles are provided at the upper and lower ends of the columns. The telescopic buckles retract into the columns under the action of external force; a switch slot is provided on the semiconductor temperature control device, and a switch for controlling the extension and retraction of the telescopic buckle is provided in the switch slot.

3. The air-conditioning clothing according to claim 1 or 2, characterized in that: The heat exchanger in the heat exchange device is made of aluminum, copper, aluminum alloy or copper alloy.

4. The air-conditioning clothing according to claim 1 or 2, characterized in that: The outer shell or the inner shell is made of a light material that can fix the heat exchanger and the fan and make the heat exchange plane of the heat exchanger closely attached to the thermoelectric sheet of the semiconductor temperature control device.

5. The air-conditioning clothing according to claim 1 or 2, characterized in that: The outer shell or inner shell material includes leather and plastic.

6. The air-conditioning clothing according to claim 1 or 2, characterized in that: The semiconductor temperature control device comprises a thermoelectric sheet and a heat sink arranged outside the thermoelectric sheet.

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