Electronic circuit and method for manufacturing the same

Abstract

The present invention discloses an electronic circuit and a method for making the same, and relates to the technical field of electronic circuits. The method for making the electronic circuit comprises: providing a substrate; forming a removable first conductive layer on the substrate using conductive ink; the first conductive layer comprises a target conductive pattern and a temporary conductive pattern; forming a temporary covering film covering the temporary conductive pattern; forming a second conductive layer covering the target conductive pattern and not removable; removing the temporary covering film and the temporary conductive pattern to obtain a target electronic circuit. The embodiment of the present invention covers the temporary pattern to avoid the problem that the temporary pattern is processed in subsequent processing and is difficult to remove, and the removal process of the covering film and the temporary pattern is simple and easy to implement, and will not affect the target pattern, thereby ensuring product quality.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic circuits, and in particular relates to an electronic circuit and a manufacturing method thereof. Background Art

[0002] The electroplating lead is a process auxiliary line, and its function is to lead out the target circuit and connect it to complete the electroplating of the target circuit. It will not be retained in the final product and needs to be removed after the product is electroplated. The traditional method of removing the electroplating lead is to remove it by machining and cutting. However, with the increasing precision and complexity of current circuit products, such as coil products, the electroplating lead needs to be connected to its internal circuit. If machining is used, the substrate of the target circuit product will be damaged, resulting in a decrease in the structural stability of the substrate. At the same time, the machining accuracy is difficult to meet the cutting requirements of internal high-precision circuits. Summary of the invention

[0003] In view of this, an object of the present invention is to provide an electronic circuit and a method for manufacturing the same, so as to solve the problem in the prior art that the conventional process cannot meet the requirements for removing the electroplated leads in complex circuits.

[0004] In some illustrative embodiments, the method for manufacturing the electronic circuit includes: providing a substrate; forming a removable first conductive layer on the substrate using conductive ink; the first conductive layer includes a target conductive pattern and a temporary conductive pattern; forming a temporary covering film covering the temporary conductive pattern; forming a non-removable second conductive layer covering the target conductive pattern; removing the temporary covering film and the temporary conductive pattern to obtain a target electronic circuit.

[0005] In some optional embodiments, before forming the removable first conductive layer on the substrate using the conductive ink, the method further includes: roughening the surface of the substrate.

[0006] In some optional embodiments, the forming of a temporary covering film covering the temporary conductive pattern specifically includes: forming the temporary covering film on the temporary conductive pattern using insulating ink.

[0007] In some optional embodiments, forming the second conductive layer covering the target conductive pattern specifically includes: forming the second conductive layer on the target conductive pattern by printing, spraying, electroplating, chemical plating, evaporation or magnetron sputtering.

[0008] In some optional embodiments, the second conductive layer is a multi-layer structure.

[0009] In some optional embodiments, the removing of the temporary covering film and the temporary conductive pattern specifically includes: removing the temporary covering film and / or the temporary conductive pattern by one or more methods of corrosion, laser, grinding or cutting.

[0010] In some optional embodiments, there is a line overlap between the temporary conductive pattern and the target conductive pattern; the temporary conductive pattern is divided by the target conductive pattern into an inner line located inside the target conductive pattern and an outer line located outside the target conductive pattern; and the temporary covering film covers the inner line of the temporary conductive pattern.

[0011] In some optional embodiments, the inner circuit and the outer circuit of the temporary conductive pattern are removed in different ways.

[0012] In some optional embodiments, the substrate is a special-shaped structure, and the first conductive layer is formed on the special-shaped surface of the substrate.

[0013] Another object of the present invention is to provide an electronic circuit to solve the technical problems existing in the prior art.

[0014] In some illustrative embodiments, the electronic circuit is obtained by any of the above-mentioned methods for manufacturing an electronic circuit.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] The embodiment of the present invention covers the temporary pattern to avoid the temporary pattern being processed in subsequent processing and thus being difficult to remove. The removal process of the covering film and the temporary pattern is simple and easy to implement, and will not affect the target pattern, thereby ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a flow chart of a method for manufacturing an electronic circuit in an embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of a method for manufacturing an electronic circuit in an embodiment of the present invention;

[0019] Figure 3 is a schematic diagram of an electronic circuit in an embodiment of the present invention;

[0020] Figure 4 is a schematic diagram of an electronic circuit in an embodiment of the present invention;

[0021] Figure 5 is a flow chart of a method for manufacturing an electronic circuit in an embodiment of the present invention;

[0022] Figure 6is a flow chart of a method for manufacturing an electronic circuit in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following description and the accompanying drawings fully illustrate specific embodiments of the present invention so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The examples represent possible variations only. Unless explicitly required, separate components and functions are optional, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present invention includes the entire scope of the claims, and all available equivalents of the claims. In this article, these embodiments of the present invention may be represented individually or collectively by the term "invention", which is merely for convenience, and if more than one invention is disclosed in fact, it is not intended to automatically limit the scope of the application to any single invention or inventive concept.

[0024] The terms "removable" and "non-removable" in the embodiments of the present invention are relative, that is, the "removable" components can be cleared by the same process and under the same conditions, but the "non-removable" components will not be damaged or affected; or, the "removable" components can be cleared by the same process and under the same conditions, which will have a slight impact on the "non-removable" components, but their main performance will not be affected; the performance that is not affected may refer to the continuity, conductivity, surface flatness, surface gloss, etc. of the circuit.

[0025] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0026] The present invention discloses a method for manufacturing an electronic circuit. Specifically, Figure 1-2 As shown, Figure 1 is a flow chart of a method for manufacturing an electronic circuit in an embodiment of the present invention; Figure 2 Schematic diagram of a method for manufacturing an electronic circuit in an embodiment of the present invention; the method for manufacturing an electronic circuit includes:

[0027] Step S11, providing a substrate 10;

[0028] Step S12, forming a removable first conductive layer 20 on the substrate 10 using conductive ink; wherein the first conductive layer 20 includes a target conductive pattern 21 and a temporary conductive pattern 22;

[0029] Step S13, forming a temporary covering film 30 covering the temporary conductive pattern 22;

[0030] Step S14, forming a second conductive layer 40 that is not removable and covers the target conductive pattern 21;

[0031] Step S15 , removing the temporary covering film 40 and the temporary conductive pattern 22 to obtain a target electronic circuit.

[0032] The embodiment of the present invention covers the temporary pattern to avoid the temporary pattern being processed in subsequent processing and thus being difficult to remove. The removal process of the covering film and the temporary pattern is simple and easy to implement, and will not affect the target pattern, thereby ensuring product quality.

[0033] In some embodiments, the substrate in the embodiments of the present invention can be any one of PET (polyester, Polyethyleneterephthalate), PTFE (polytetrafluoroethylene, Poly tetra fluoroethylene), PI (polyimide, Polyimide), PC (polycarbonate, Polycarbonate), ABS (copolymer plastic, Acrylonitrile Butadiene Styrene plastic), LCP (liquid crystal polymer, Liquid Crystal Polymer), FR4, glass (such as glass resin, silicon dioxide, high borosilicate). Preferably, the substrate can be PET, PI, PTFE, LCP or glass, which has excellent heat resistance, corrosion resistance and adhesion properties.

[0034] In some embodiments, the conductive ink in the embodiments of the present invention can be an easily removable conductive ink, which is not limited to metal particle conductive ink, carbon-based conductive ink, inorganic conductive ink, liquid metal, etc.; preferably, the conductive ink in the embodiments of the present invention is a metal particle conductive ink, such as conductive silver paste, conductive aluminum paste, conductive copper paste, etc., or conductive silver paste, conductive aluminum paste, conductive copper paste doped with liquid metal, etc. Among them, the printed circuit of the conductive silver paste doped with liquid metal has good bending resistance and the best conductivity.

[0035] In the embodiment of the present invention, the specific method of forming a removable first conductive layer on the substrate using conductive ink in step S12 is not limited to printing or other molding methods. Specifically, the printing method is not limited to direct writing printing, extrusion printing, spraying, 3D printing and other methods, and the printing method is not limited to screen printing, pad printing, letterpress printing, gravure printing, coating and other methods. Preferably, in the embodiment of the present invention, screen printing can be used to form the first conductive layer, which is suitable for substrates with flat surfaces. In other embodiments, for substrates with special structures, methods such as pad printing and 3D printing can be used to form on the special-shaped surface of the substrate with special structures.

[0036] In some embodiments, before forming a removable first conductive layer on the substrate using conductive ink in step S12, the process may further include: performing a surface roughening treatment on the surface of the substrate, thereby forming a roughening layer on the surface of the substrate, and the roughening layer is conducive to improving the adhesion of the conductive ink on the surface of the substrate. The surface roughening treatment is not limited to surface roughening treatments such as sandblasting and plasma treatment. Preferably, the surface roughening treatment can only be performed on the area to be printed (i.e., the area where the first conductive layer is located) to ensure the surface flatness and glossiness of the non-printed area. Among them, the printed area can be consistent with the pattern of the first conductive layer, or cover the pattern area of ​​the first conductive layer.

[0037] In the embodiment of the present invention, step S13 forms a temporary covering film covering the temporary conductive pattern; wherein the temporary covering film is not limited to a film material or insulating ink. Wherein, when the temporary covering film is made of a film material, the film material can be made consistent with the pattern of the temporary conductive pattern, and covered on the temporary conductive pattern by attaching, thereby shielding the temporary conductive pattern. When insulating ink is used to form the temporary covering film, it can be covered on the temporary conductive pattern by printing, thereby shielding the temporary conductive pattern.

[0038] In the embodiment of the present invention, step S14 forms a second conductive layer that covers the target conductive pattern and cannot be removed. The second conductive layer can be formed on the target conductive pattern by printing, spraying, electroplating, chemical plating, evaporation or magnetron sputtering.

[0039] For example, a conductive ink that is not easy to remove is selected and printed on the target conductive pattern to form a second conductive layer; wherein the conductive ink has stronger stability after forming than the conductive ink forming the first conductive layer.

[0040] For example, a metal coating is formed on the target conductive pattern by electroplating, and the coating is not limited to any one of tin, copper, nickel, silver, gold or any alloy thereof. The metal coating may be a multi-layer structure, such as copper, nickel, gold, or silver, gold, etc., formed sequentially on the target conductive pattern.

[0041] For example, a metal plating layer is formed on the target conductive pattern by chemical plating, and the plating layer is not limited to any one of tin, copper, nickel, silver, gold or any alloy thereof. The metal plating layer may be a multi-layer structure, such as copper, nickel, gold, or silver, gold, etc., formed sequentially on the target conductive pattern.

[0042] In some embodiments, the temporary conductive pattern in the embodiments of the present invention may be a plating lead (also called a plating auxiliary line) designed by the user in order to form a metal plating layer on the target conductive pattern by electroplating, so the process of forming the second conductive layer on the target conductive pattern in step S14 is electroplating. In other embodiments, the temporary conductive pattern in the embodiments of the present invention may also be other process auxiliary lines, or other functional circuits designed by the user.

[0043] In the embodiment of the present invention, the method of removing the temporary covering film and / or the temporary conductive pattern in step S15 is not limited to removal by one or more combinations of chemical corrosion, laser etching, grinding, and cutting. Preferably, in the embodiment of the present invention, the temporary covering film and the temporary conductive pattern can be removed by chemical corrosion. Among them, this method is aimed at the first conductive layer (i.e., the temporary conductive pattern) formed by the conductive ink containing resin and the temporary covering film formed by the insulating ink. Since the temporary covering film and the temporary conductive pattern are both polymer components, they can be removed by corresponding polymer solvents, and the removal method is not limited to dipping and / or wiping, so as to remove them one by one or remove them as a whole. For other situations, it can also be removed by a combination of solvent and laser, for example, the temporary covering film is removed by solvent, and then the temporary conductive pattern is removed by laser.

[0044] In the embodiment of the present invention, a temporary covering film is formed on the temporary conductive pattern, thereby avoiding the formation of the second conductive layer on the temporary conductive pattern, thus saving the material of the second conductive layer and reducing the cost.

[0045] like Figure 3 As shown, in some embodiments, there is a line crossing between the temporary conductive pattern 22 of the first conductive layer 20 and the target conductive pattern 21, that is, a line overlapped portion, so that the temporary conductive pattern 22 is divided into two parts by the target conductive pattern 21, one part is located in the inner line 221 inside the range of the target conductive pattern 21, and the other part is located in the outer line 222 outside the range of the target conductive pattern 21. The inner line 221 and the outer line 222 of the temporary conductive pattern 22 in this embodiment can be removed by different methods, thereby further reducing the difficulty of removal and improving the removal efficiency.

[0046] Specifically, part of the temporary conductive pattern 22 in this embodiment is located outside the target conductive pattern 21 and can be removed by a combination of cutting. For example, after removing the temporary covering film 30 by solvent, the temporary conductive pattern within the range of the target conductive pattern 21 (i.e., the inner circuit 221) is removed by laser, and finally the temporary conductive pattern outside the range of the target conductive pattern 21 (i.e., the outer circuit 222) is removed by cutting. Compared with the aforementioned method, this solution can reduce the frequency of use of the laser, thereby reducing the maintenance cost of the laser, saving the service life of the laser equipment, reducing costs, and improving removal efficiency.

[0047] In some embodiments, due to the high precision of the target conductive pattern, its line width can be less than 100 microns, tens of microns, or even more than ten microns, resulting in a large resistance value and low conductivity of such a precision line. The current flowing during the electroplating process is small, making it difficult to plate, affecting the electroplating effect. In particular, the conductive line formed by conductive ink has a greater resistance value than ordinary copper foil or aluminum foil, so the temporary conductive pattern can be designed to have a greater conductivity than the target conductive pattern, thereby improving the overall conductivity of the first conductive layer, and then improving the plating effect of the target conductive pattern.

[0048] Specifically, the temporary conductive pattern may be designed to have a conductivity greater than that of the target conductive pattern in a manner other than, for example, increasing the overall or partial line width / line thickness of the temporary conductive pattern, or other equivalent manners.

[0049] like Figure 3-4 As shown, further, during the electroplating process, the plating layer will gradually grow on the temporary conductive layer 22 and the target conductive layer 21. In the process of the generation and gradual growth of the plating layer, the conductivity of the temporary conductive layer 22 and the target conductive layer 21 will be further improved, thereby improving the electroplating effect of the target conductive pattern 21. The portion covered by the temporary covering film 30 will not form a plating layer on its surface during this process, which will instead affect the electroplating of the target conductive pattern 21. For this case, the temporary covering film 30 in the embodiment of the present invention may only cover the inner circuit 221 of the temporary conductive pattern 22, thereby ensuring the electroplating effect of the target conductive pattern 21 and reducing the difficulty of subsequent removal of the inner circuit 221 of the temporary conductive pattern 22.

[0050] In some embodiments, after removing the temporary covering film and the temporary conductive pattern in step S15, the process may further include: forming a protective layer covering the second conductive layer, the protective layer may play any one or any combination of the following effects: solder resistance, oxygen isolation, water resistance, corrosion resistance, temperature resistance, bending resistance, etc. Preferably, a window is provided on the protective layer to expose part of the second conductive layer.

[0051] like Figure 5As shown, the method for manufacturing an electronic circuit in the embodiment of the present invention can meet the requirements of manufacturing a double-sided circuit. Specifically, the embodiment of the present invention discloses a method for manufacturing an electronic circuit, including:

[0052] Step S21, providing a substrate;

[0053] Step S22, forming a removable third conductive layer on the first surface of the substrate using conductive ink; wherein the third conductive layer includes: a first target conductive pattern and a first temporary conductive pattern;

[0054] Step S23, forming a removable fourth conductive layer on the second surface of the substrate using conductive ink; wherein the fourth conductive layer includes: a second target conductive pattern and a second temporary conductive pattern;

[0055] Step S24, forming a first temporary covering film covering the first temporary conductive pattern, and forming a second temporary covering film covering the second temporary conductive pattern;

[0056] Step S25, forming a non-removable fifth conductive layer covering the first target conductive pattern, and forming a non-removable sixth conductive layer covering the second target conductive pattern;

[0057] Step S26, removing the first temporary covering film, the second temporary covering film, the first temporary conductive pattern and the second temporary conductive pattern to obtain a target electronic circuit with double-sided circuits.

[0058] In some embodiments, before step S22, the method may further include: forming a metallized via on the substrate to interconnect the first target conductive pattern and the second target conductive pattern; the formation method of the metallized via is not limited to any via metallization method in the prior art. Preferably, the metallized via in the embodiment of the present invention can be formed in one piece by forming the third conductive layer and / or the fourth conductive layer at the same time.

[0059] Specifically, the method for forming the metallized via includes: forming a via on a substrate that penetrates the first surface and the second surface of the substrate; wherein the position of the via is determined by the user's design requirements for the electronic circuit; and then, during the process of printing the conductive ink, the conductive ink is allowed to enter the via, thereby adhering to the inner wall of the via or filling the entire via. In this embodiment, when the via depth does not exceed 1000μm, the metallization of the via can be satisfied during the single-sided printing process. When it exceeds 1000μm-3000μm, the metallization of the via can be completed by printing on both sides. The number of metallized vias in this embodiment is not limited to one or more, and can be designed according to the requirements of the specific electronic circuit.

[0060] Preferably, if Figure 6As shown, an embodiment of the present invention provides a method for manufacturing an electronic circuit, which can meet the needs of manufacturing double-sided interconnection lines, including:

[0061] Step S31, providing a substrate;

[0062] Step S32, forming a via hole on the substrate that penetrates the first surface and the second surface of the substrate;

[0063] Step S33, forming a removable third conductive layer on the first surface of the substrate using conductive ink; wherein the third conductive layer includes: a first target conductive pattern and a first temporary conductive pattern;

[0064] Step S34, forming a removable fourth conductive layer on the second surface of the substrate using conductive ink; wherein the fourth conductive layer includes: a second target conductive pattern and a second temporary conductive pattern;

[0065] The via holes in step S32 are metallized during step S33 and / or step S34 to obtain metallized via holes interconnecting the first target conductive pattern and the second target conductive pattern;

[0066] Step S35, forming a first temporary covering film covering the first temporary conductive pattern, and forming a second temporary covering film covering the second temporary conductive pattern;

[0067] Step S36, forming a non-removable fifth conductive layer covering the first target conductive pattern, and forming a non-removable sixth conductive layer covering the second target conductive pattern;

[0068] Step S37 , removing the first temporary covering film, the second temporary covering film, the first temporary conductive pattern, and the second temporary conductive pattern to obtain a target electronic circuit with double-sided circuits.

[0069] In some embodiments, since the first target conductive pattern and the second target conductive pattern are connected through metallized vias, the first temporary conductive pattern in step S33 or the second temporary conductive pattern in step S34 can be omitted, that is, step S36 is implemented using the first temporary conductive pattern or the second temporary conductive pattern.

[0070] The processes or steps in the method for manufacturing the electronic circuit in the embodiment of the present invention can be combined with each other without conflict. For example, the processes or steps in the single-sided electronic circuit can be applied to the embodiments of the double-sided electronic circuit and the double-sided interconnected electronic circuit, and this should not limit the scope of protection of the present invention.

[0071] Another object of the present invention is to provide an electronic circuit, which can be obtained by the above-mentioned method for manufacturing an electronic circuit. Specifically, the electronic circuit may include: a substrate; a target conductive pattern located on the surface of the substrate; and a second conductive layer attached to the target conductive pattern.

[0072] In some embodiments, the present invention can also stack multiple electronic circuits to obtain a multi-layer electronic circuit.

[0073] Those skilled in the art will also appreciate that the various illustrative logic blocks, modules, circuits, and algorithmic steps described in conjunction with the embodiments herein can all be implemented as electronic hardware, computer software, or a combination thereof. In order to clearly illustrate the interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above around their functions. Whether such functions are implemented as hardware or software depends on specific applications and the design constraints imposed on the entire system. A skilled person can implement the described functions in an alternative manner for each specific application, but such implementation decisions should not be interpreted as departing from the scope of protection of the present disclosure.

Claims

1. A method for manufacturing an electronic circuit, characterized in that: include: providing a substrate; Printing or printing a target conductive pattern and a temporary conductive pattern on the substrate using conductive ink; The temporary conductive pattern is divided by the target conductive pattern into an inner circuit located inside the target conductive pattern and an outer circuit located outside the target conductive pattern; forming a temporary covering film covering the inner circuit; forming a second conductive layer covering the target conductive pattern and the outer circuit; removing the temporary covering film; The inner circuit is removed by laser and the outer circuit is removed by cutting to obtain a target electronic circuit.

2. The method for manufacturing a circuit according to claim 1, characterized in that: Before printing or forming a target conductive pattern and a temporary conductive pattern on the substrate using conductive ink, the method further comprises: The surface of the substrate is roughened.

3. The method for manufacturing a circuit according to claim 1, characterized in that: The forming of a temporary covering film covering the inner circuit specifically comprises: The temporary covering film is formed on the inner circuit by using insulating ink.

4. The method for manufacturing a circuit according to claim 1, characterized in that: The forming of the second conductive layer covering the target conductive pattern and the outer circuit specifically includes: The second conductive layer is formed on the target conductive pattern and the outer circuit by printing, spraying, electroplating, chemical plating, evaporation or magnetron sputtering.

5. The method for manufacturing a circuit according to claim 4, characterized in that: The second conductive layer is a multi-layer structure.

6. The method for manufacturing a circuit according to claim 1, characterized in that: The removing of the temporary covering film specifically comprises: The temporary covering film is removed by etching.

7. The method for manufacturing a circuit according to claim 1, characterized in that: The substrate is a special-shaped structure, and the target conductive pattern and the temporary conductive pattern are formed on the special-shaped surface of the substrate.

8. An electronic circuit, characterized in that: The method for manufacturing the circuit according to any one of claims 1 to 7 is obtained.

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