A plating solution degassing device and electrochemical deposition equipment

Abstract

The present invention relates to the field of semiconductor technology, and in particular, to a plating solution degassing device and an electrochemical deposition device, comprising a cavity, a degassing cavity is arranged inside the cavity, a liquid inlet, a liquid discharge port and an exhaust port are arranged in the cavity, the liquid inlet is connected to the degassing cavity, the liquid discharge port and the exhaust port are arranged opposite to each other and are connected through a connecting pipe, a plurality of discharge guide ports are provided on the connecting pipe, and the connecting pipe is connected to the degassing cavity through the discharge guide port; the cross section of the degassing cavity is circular, and the fluid entering the liquid inlet can be accelerated to rotate in the degassing cavity and form a laminar flow, the discharge guide port can guide the laminar flow, the discharge guide port includes a guide port and a discharge port, the caliber of the guide port is larger than the caliber of the discharge port, and the fluid can be accelerated to collide with the inner wall of the discharge guide port and be discharged. The present application can inject plating solution into the degassing cavity through the liquid inlet, and the injection can accelerate the rotation in the degassing cavity to form a laminar flow, and precipitate bubbles in the plating solution to increase the concentration of the plating solution.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a plating solution degassing device and an electrochemical deposition device. Background Art

[0002] Electrochemical deposition (ECD) is an important method for integrated circuit (IC) metallization. Compared with sputtering and evaporation, it has lower cost advantages and higher plating efficiency. As integrated circuits (ICs) continue to develop towards lightness, thinness, shortness and smallness, chip manufacturers have put forward higher requirements on the performance of electrochemical deposition (ECD) equipment.

[0003] The performance of electrochemical deposition (ECD) equipment currently on the market cannot meet the needs of development. One of the problems is that bubbles may be mixed into the plating solution during the pipeline circulation process, reducing the concentration of the plating solution. In this way, the bubbles in the plating solution cannot be discharged before they come into contact with the wafer, causing the bubbles to come into contact with the wafer surface, making it impossible to achieve metal deposition in the area covered by the bubbles, and then causing low-lying pits in the plating layer, which ultimately causes quality problems such as poor uniformity of the plating thickness on the wafer. Summary of the invention

[0004] The object of the present invention is to provide a plating solution degassing device, which can separate out bubbles in the plating solution and increase the concentration of the plating solution.

[0005] Another object of the present invention is to provide an electrochemical deposition device, which can precipitate bubbles in the plating solution before the bubbles in the plating solution contact the wafer when plating a layer on the wafer, thereby improving the uniformity of the wafer coating thickness.

[0006] The technical solution of the present invention is achieved in this way:

[0007] A plating liquid degassing device, comprising a cavity, a degassing cavity is arranged inside the cavity, the cavity is provided with a liquid inlet, a liquid discharge port and an exhaust port, the liquid inlet is communicated with the degassing cavity, the liquid discharge port and the exhaust port are arranged opposite to each other and are communicated with each other through a connecting pipe, a plurality of discharge guide ports are opened on the connecting pipe, and the connecting pipe is communicated with the degassing cavity through the discharge guide ports;

[0008] The cross-section of the degassing chamber is circular, which can accelerate the rotation of the fluid entering the liquid inlet in the degassing chamber and form a laminar flow. The discharge guide port can guide the laminar flow. The discharge guide port includes a guide port and a discharge port. The diameter of the guide port is larger than the diameter of the discharge port. At the same time, it can accelerate the collision of the fluid with the inner wall of the discharge guide port for discharge.

[0009] Furthermore, the exhaust port is provided with an exhaust pipe, and the inlet end of the exhaust pipe extends into the liquid discharge port.

[0010] Further, the cavity is a cylindrical structure, and the degassing cavity is cylindrical;

[0011] The cavity comprises a first circular plate, a second circular plate and a ring body, wherein the first circular plate and the second circular plate are respectively and sealedly arranged at two end openings of the ring body.

[0012] Furthermore, the exhaust port is arranged at the center of the first circular plate, the liquid discharge port is arranged at the center of the second circular plate, and the liquid inlet is arranged at the ring body.

[0013] Furthermore, the second circular plate and the ring body are an integral structure, the first circular plate and the ring body are connected by bolts, and an O-ring is provided at the connection between the first circular plate and the ring body.

[0014] Furthermore, the connecting pipe is a circular pipe, and three discharge guide ports are formed through the connecting pipe along its length direction, and the connecting pipe is divided into three arc-shaped baffles by the three discharge guide ports;

[0015] After the discharge guide port is opened, a first cut surface and a second cut surface are formed on two adjacent arc-shaped baffles respectively, and the angle between the first cut surface and the second cut surface is in the range of 25°-35°.

[0016] Furthermore, the central axis of the liquid inlet, the central axis of the liquid discharge port and the central axis of the air discharge port are in the same horizontal plane.

[0017] Furthermore, it also includes a liquid inlet pipe and a liquid injection device, one end of the liquid inlet pipe is connected to the set liquid inlet, and the other end is connected to the liquid injection device.

[0018] Furthermore, a recovery device is also included, and the outlet end of the exhaust pipe is connected to the recovery device.

[0019] An electrochemical deposition device comprises the plating solution degassing device.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present application can inject plating liquid into the degassing chamber through the liquid inlet, and the inlet liquid has a certain flow rate and impact force. The injected plating liquid accelerates and rotates in the degassing chamber to form a laminar flow, and fully collides with the inner wall of the chamber and the connecting pipe, so that the bubbles in the plating liquid are fully separated out, and the separated bubbles are discharged from the exhaust port, and the plating liquid after the bubbles are separated is discharged from the drain port, thereby increasing the concentration of the plating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of the plating solution degassing device according to Example 1 of the present invention;

[0024] Figure 2 For the present invention Figure 1 A schematic diagram of the cross-sectional structure after cutting along the longitudinal plane;

[0025] Figure 3 For the present invention Figure 2 A schematic diagram of the front structure of

[0026] Figure 4 For the present invention Figure 1 A schematic diagram of the front structure of

[0027] Figure 5 For the present invention Figure 1 Schematic diagram of the cross-section structure after cutting along the horizontal plane;

[0028] Figure 6 This is a schematic structural diagram of a plating solution degassing device in Example 1 of the present invention, in which the liquid discharge port and the exhaust port are placed horizontally when in use;

[0029] Figure 7 For the present invention Figure 6 Schematic diagram of the cross-section structure after cutting along the horizontal plane;

[0030] Figure 8 It is a schematic diagram of the cross-sectional structure of the arc-shaped baffle and the discharge guide port of the present invention.

[0031] In the figure: (Description of reference numerals)

[0032] 1- chamber; 101- degassing chamber; 102- liquid inlet; 103- liquid outlet;

[0033] 104-exhaust port; 105-first circular plate; 106-second circular plate;

[0034] 107-ring body; 108-O-type sealing ring;

[0035] 2-connecting pipe; 201-discharge guide port; 202-arc baffle;

[0036] 2011- guide port; 2012- discharge port; 2013- first section; 2014- second section;

[0037] 3-exhaust pipe; 4-liquid inlet pipe; 5-liquid discharge pipe;

[0038] 6-abutment block; 7-second threaded joint. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0043] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0044] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0046] Example 1

[0047] The performance of electrochemical deposition (ECD) equipment currently on the market cannot meet the needs of development. One of the problems is that bubbles may be mixed into the plating solution during the pipeline circulation process, reducing the concentration of the plating solution. In this way, the bubbles in the plating solution cannot be discharged before they come into contact with the wafer, causing the bubbles to come into contact with the wafer surface, making it impossible to achieve metal deposition in the area covered by the bubbles, and then causing low-lying pits in the plating layer, which ultimately causes quality problems such as poor uniformity of the plating thickness on the wafer.

[0048] This embodiment provides a technical solution to solve this defect, as shown below:

[0049] Reference Figure 1-Figure 8 , Figure 1 It is a schematic diagram of the three-dimensional structure of the plating solution degassing device of this embodiment; Figure 2 For this embodiment Figure 1 A schematic diagram of the cross-sectional structure after cutting along the longitudinal plane; Figure 3 For this embodiment Figure 2 A schematic diagram of the front structure of Figure 4 For this embodiment Figure 1 A schematic diagram of the front structure of Figure 5 For this embodiment Figure 1 Schematic diagram of the cross-section structure after cutting along the horizontal plane; Figure 6 It is a schematic structural diagram of the plating liquid degassing device of this embodiment when the liquid discharge port 103 and the gas exhaust port 104 are placed horizontally; Figure 7 For this embodiment Figure 6 Schematic diagram of the cross-section structure after cutting along the horizontal plane; Figure 8 It is a schematic diagram of the cross-sectional structure of the arc-shaped baffle and the discharge guide port of the present invention.

[0050] A plating liquid degassing device comprises a cavity 1, wherein a degassing cavity 101 is arranged inside the cavity 1, wherein a liquid inlet 102, a liquid discharge port 103 and an exhaust port 104 are arranged in the cavity 1, wherein the liquid inlet 102 is communicated with the degassing cavity 101, and the liquid discharge port 103 and the exhaust port 104 are arranged opposite to each other and are communicated with each other through a connecting pipe 2, i.e., the two ends of the connecting pipe 2 respectively surround the liquid discharge port 103 and the exhaust port 104, and isolate the communication between the liquid discharge port 103, the exhaust port 104 and the degassing cavity 101.

[0051] The cross section of the degassing chamber 101 is circular, which can accelerate the fluid (i.e., the plating solution) entering the liquid inlet 102 to rotate in the degassing chamber 101 and form a laminar flow. The discharge guide port 201 includes a guide port 2011 and a discharge port 2012. The diameter of the guide port 2011 is larger than that of the discharge port 2012. Figure 8 As shown, the guide port 2011 has a larger diameter to facilitate flow guidance, and the discharge port 2012 has a smaller diameter, so that the guided fluid is not so easily discharged, and the plating solution is more fully rotated and accelerated in the degassing chamber 101, so that the bubbles are better precipitated. Therefore, the discharge guide port 201 can guide the laminar flow, and at the same time, the fluid can collide with the side wall of the discharge guide port 201 when being discharged through the discharge port 2012. Since the discharge port 2012 has a smaller diameter, it is equivalent to squeezing the fluid, and can also accelerate the fluid to collide with the inner wall of the discharge guide port 201 and discharge, thereby promoting the bubble precipitation again.

[0052] The connecting pipe 2 is provided with a discharge guide port 201 , and the connecting pipe 2 is connected with the degassing chamber 101 through the discharge guide port 201 , that is, the liquid discharge port 103 and the air discharge port 104 can be connected with the degassing chamber 101 through the discharge guide port 201 .

[0053] When placing the drain port 103, the exhaust port 104 and the liquid inlet 102, it should be noted that the exhaust port 104 can be set horizontally or upward (the exhaust port 104 is set upwardly inclined or vertically upward) to facilitate the discharge of precipitated bubbles; the drain port 103 is set horizontally or downward (the drain port 103 is set downwardly inclined or vertically downward) to facilitate the discharge of the plating solution after the bubbles are precipitated.

[0054] In this way, the present application can inject plating liquid into the degassing chamber 101 through the liquid inlet 102. The injected plating liquid (i.e., the plating liquid entering the degassing chamber 101, referred to as the inlet liquid) has a certain flow rate and impact force. The injected plating liquid flows in the degassing chamber 101 and fully collides with the inner wall of the chamber and the connecting pipe. Under the drainage and guiding action of the discharge guide port 201, the bubbles in the plating liquid are precipitated, and the precipitated bubbles are discharged from the exhaust port 104. The plating liquid after the bubbles are precipitated is discharged from the discharge port 103, thereby increasing the concentration of the plating liquid.

[0055] In this embodiment, when the drain port 103 and the exhaust port 104 are both arranged horizontally, the exhaust port 104 is preferably further provided with an exhaust pipe 3, and the inlet end of the exhaust pipe 3 extends into the drain port 103. The injected plating solution flows and rotates in the degassing chamber 101, collides with the inner wall of the chamber 1 and the connecting pipe 2, forms a laminar flow under the action of centrifugal force, and precipitates bubbles in the plating solution, especially the plating solution is drained under the action of the discharge guide port 201, because the inlet end of the exhaust pipe 3 extends into the drain port 103, that is, the diameter of the drain port 103 is larger than the diameter of the exhaust pipe 3, the plating solution forms a vortex in the drain port 103, because a negative pressure is generated at the center of the vortex, and because the pressure in the direction of the exhaust port 104 is relatively small, the precipitated and gathered gas is discharged from the exhaust pipe 3, and the concentration of the plating solution discharged from the drain port 103 is made more uniform.

[0056] In this embodiment, the cavity 1 is a cylindrical structure with a more regular cavity shape, and the degassing cavity 101 is cylindrical as a whole with a circular cross-section; an annular cavity is formed between the outer wall of the connecting tube 2 and the inner wall of the degassing cavity 101, so that the incoming liquid can accelerate the rotation along the annular cavity to form a laminar flow to precipitate bubbles.

[0057] The cavity 1 includes a first circular plate 105 , a second circular plate 106 and a ring body 107 . The first circular plate 105 and the second circular plate 106 are respectively sealed and disposed at two end openings of the ring body 107 .

[0058] It should be noted that the first circular plate 105 and the second circular plate 106 are designed to be circular, which is a preferred design. They can also be designed to be other shapes as long as they can be installed at the two end openings of the ring body 107 to achieve a sealed connection.

[0059] More preferably, if Figure 1 As shown, the exhaust port 104 is arranged at the center position of the first circular plate 105, the liquid discharge port 103 is arranged at the center position of the second circular plate 106, and the liquid inlet 102 is arranged on the ring body 107. The liquid discharge port 103 and the exhaust port 104 are coaxially arranged, and the connecting tube 2 is coaxially arranged with the liquid discharge port 103 to facilitate the discharge of bubbles.

[0060] Preferably, the second circular plate 106 and the ring body 107 are an integral structure, which can increase the overall structural strength and sealing performance. The first circular plate 105 and the ring body 107 are connected by bolts, and an O-ring 108 is provided at the connection between the first circular plate 105 and the ring body 107. After the second circular plate 106 and the ring body 107 are an integral structure, a groove body is formed, and the groove in the groove body is the degassing chamber 101. The first circular plate 105 serves as a cover of the groove body for easy opening and closing. The first circular plate 105 and the ring body are bolted together by multiple bolts, and the O-ring 108 is used to ensure the sealing performance of the connection between them.

[0061] It should be noted that a plurality of bolt holes are provided on the first circular plate 105 , and a plurality of threaded holes are correspondingly provided on the circular surface where the ring body 107 contacts the first circular plate 105 , so as to facilitate bolt connection between the first circular plate 105 and the ring body 107 .

[0062] Preferably, the cross section of the connecting pipe 2 is circular, the connecting pipe 2 is a linear circular pipe, and the connecting pipe 2 is penetrated along its length direction to open a plurality of discharge guide ports 201, the connecting pipe 2 is divided into a plurality of arc-shaped baffles 202 by the plurality of discharge guide ports 201, each arc-shaped baffle 202 exists as an individual, and the plurality of arc-shaped baffles 202 are arranged in a circular array along the central axis of the discharge port 103, and the shapes of the arc-shaped baffles 202 and the discharge guide ports 201 are as follows: Figure 5 shown.

[0063] It should be noted that the discharge guide port 201 is preferably designed to be three and divided into three arc-shaped baffles 202. One end of the arc-shaped baffle 202 close to the discharge port 103 is fixedly connected to the inner wall of the cavity 1, one end of the arc-shaped baffle 202 is an integral structure with the cavity 1 or connected by welding, and the other end of the arc-shaped baffle 202 is detachably connected to the inner side surface of the first circular plate 105, specifically, the other end of the arc-shaped baffle 202 abuts against the inner side surface of the first circular plate 105. More specifically, an abutment block 6 is provided on the inner side surface of the first circular plate 105 so that the arc-shaped baffle 202 abuts against it. In addition, after the abutment block 6 is provided, the space in the degassing chamber 101 can be reduced, and the plating solution can also collide and rub with the outer side surface of the abutment block 6 during the flow process, so as to facilitate the further precipitation of bubbles in the plating solution.

[0064] The discharge guide opening 201 is formed by cutting out the connecting pipe 2. After the discharge guide opening 201 is opened, two cut surfaces are formed on the two arc-shaped baffles 202 adjacent thereto. The two cut surfaces are respectively a first cut surface 2013 and a second cut surface 2014. Figure 8 The angle between the first cut surface 2013 and the second cut surface 2014 is in the range of 25°-35°. More preferably, the angle between the first cut surface 2013 and the second cut surface 2014 is designed to be 30°.

[0065] In this embodiment, when the plating liquid degassing device of the present application is in use, the liquid inlet 102, the liquid discharge port 103 and the exhaust port 104 are preferably arranged in such a manner that the central axis of the liquid inlet 102, the central axis of the liquid discharge port 103 and the central axis of the exhaust port 104 are in the same horizontal plane, such as Figure 6 and Figure 7 shown.

[0066] The present application also includes a liquid inlet pipe 4 and a liquid injection device, one end of the liquid inlet pipe 4 is connected to the liquid inlet 102, and the other end is connected to the liquid injection device. Specifically, the liquid inlet pipe 4 uses a first threaded joint, and the first threaded joint is connected to the liquid inlet 102 by threading.

[0067] The present application also includes a recovery device, and the outlet end of the exhaust pipe 3 is connected to the recovery device. A vortex is formed at the discharge port 103, and gas-liquid separation is achieved due to pressure and solubility reasons. If a small amount of plating liquid is discharged together with the bubbles in the exhaust pipe 3, the plating liquid is recycled and reused by the recovery device. Specifically, a second threaded joint 7 is installed at the exhaust port 104, and the second threaded joint 7 is connected to the exhaust port 104 by threads, and the exhaust pipe 3 is connected to the recovery device through the second threaded joint 7.

[0068] The present application also includes a drain pipe 5, which is installed at the drain port 103. Specifically, the drain pipe 5 uses a third threaded joint, which is connected to the drain port 103 by threads.

[0069] In this embodiment, the outer diameter of the cavity 1 is 90 mm, the inner diameter of the annular cavity is 34.6 mm, the outer diameter is 75 mm, and the height is 50 mm. The outer diameter of the abutment block 6 is 35 mm and the height is 15 mm. The inner diameter of the connecting pipe 2 is 24.6 mm and the outer diameter is 34.6 mm, that is, the thickness of the connecting pipe 2 is 5 mm. The inner diameter of the exhaust pipe 3 is 3.6 mm and the outer diameter is 6 mm. The diameter of the first circular plate 105 is 90 mm and the thickness is 10 mm.

[0070] When in use: the liquid injection device injects the plating liquid from the liquid inlet 102 into the degassing chamber 101, and the liquid is guided by multiple arc-shaped baffles 202, and circulates along the degassing chamber 101 to accelerate the rotation. During the rotating flow, the plating liquid rubs against the inner wall of the chamber 1, and the internal friction between the plating liquids forms a laminar flow under the action of centrifugal force. There is a certain flow rate difference between each plating liquid layer, and the bubbles are precipitated. The plating liquid is guided to be discharged toward the discharge port 103 through the discharge guide port 201, and a vortex is formed in the discharge direction of the plating liquid (i.e., in the discharge port 103). Since a negative pressure is generated at the center of the vortex, a small amount of gas remaining in the plating liquid can also be precipitated, and because the pressure toward the exhaust port 104 is relatively small, all the precipitated gas flows out along the exhaust pipe 3, and may be discharged from the exhaust port 104 together with part of the plating liquid, and enters the recovery device for recycling and reuse. After the plating liquid flows out from the discharge pipe 5, the concentration of the plating liquid is more uniform, so that in the subsequent steps, the coating thickness of the wafer is more uniform when the wafer is plated.

[0071] Example 2

[0072] The present embodiment provides an electrochemical deposition device, including the plating solution degassing device in Example 1, wherein the bubbles mixed in the plating solution are first precipitated through the plating solution degassing device to increase the concentration of the plating solution. When the plating operation is performed on the wafer, the uniformity of the wafer plating thickness can be improved, thereby getting rid of the defects existing in the prior art to prevent the bubbles in the plating solution from being unable to be discharged before they come into contact with the wafer during plating, causing the bubbles to come into contact with the wafer surface, thereby making it impossible to achieve metal deposition in the area covered by the bubbles, thereby causing low-lying pits to appear in the plating layer, and ultimately causing quality problems such as poor uniformity of the plating thickness on the wafer.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0074] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and to form different embodiments. For example, in the above claims, any one of the claimed embodiments may be used in any combination. The information disclosed in this background technology section is intended only to deepen the understanding of the overall background technology of the present invention and should not be regarded as an admission or in any form of implication that the information constitutes prior art known to those skilled in the art.

[0075] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plating solution degassing device, characterized in that: The invention comprises a cavity (1), wherein a degassing cavity (101) is arranged inside the cavity (1), and the cavity (1) is provided with a liquid inlet (102), a liquid discharge port (103) and an exhaust port (104), wherein the liquid inlet (102) is communicated with the degassing cavity (101), the liquid discharge port (103) and the exhaust port (104) are arranged opposite to each other and are communicated with each other through a connecting pipe (2), wherein a plurality of discharge guide ports (201) are provided on the connecting pipe (2), and the connecting pipe (2) is communicated with the degassing cavity (101) through the discharge guide ports (201); The cross section of the degassing chamber (101) is circular, and the fluid entering through the liquid inlet (102) can be accelerated to rotate in the degassing chamber (101) and form a laminar flow. The discharge guide port (201) can guide the laminar flow. The discharge guide port (201) comprises a guide port (2011) and a discharge port (2012). The diameter of the guide port (2011) is larger than that of the discharge port (2012). The fluid can be accelerated to collide with the inner wall of the discharge guide port (201) and be discharged. The exhaust port (104) is provided with an exhaust pipe (3), and the inlet end of the exhaust pipe (3) extends into the liquid discharge port (103); The cavity (1) is a cylindrical structure, and the degassing cavity (101) is cylindrical; The cavity (1) comprises a first circular plate (105), a second circular plate (106) and a ring body (107); the first circular plate (105) and the second circular plate (106) are respectively sealed and arranged at the openings at both ends of the ring body (107); The exhaust port (104) is arranged at the center of the first circular plate (105), the liquid discharge port (103) is arranged at the center of the second circular plate (106), and the liquid inlet (102) is arranged at the ring body (107); The second circular plate (106) and the ring body (107) are an integral structure, the first circular plate (105) and the ring body (107) are connected by bolts, and an O-ring (108) is provided at the connection between the first circular plate (105) and the ring body (107); The connecting pipe (2) is a circular pipe, and three discharge guide openings (201) are formed through the connecting pipe (2) along its length direction. The connecting pipe (2) is divided into three arc-shaped baffles (202) by the three discharge guide openings (201); After the discharge guide port (201) is opened, a first cut surface (2013) and a second cut surface (2014) are formed on two adjacent arc-shaped baffles (202), respectively, and the angle between the first cut surface (2013) and the second cut surface (2014) is in the range of 25°-35°.

2. The plating solution degassing device according to claim 1, characterized in that: The exhaust port (104) is provided with an exhaust pipe (3), and the inlet end of the exhaust pipe (3) extends into the liquid discharge port (103).

3. The plating solution degassing device according to claim 1, characterized in that: The central axis of the liquid inlet (102), the central axis of the liquid discharge port (103) and the central axis of the gas discharge port (104) are located in the same horizontal plane.

4. The plating solution degassing device according to claim 1, characterized in that: It also comprises a liquid inlet pipe (4) and a liquid injection device, wherein one end of the liquid inlet pipe (4) is connected to the liquid inlet port (102) and the other end is connected to the liquid injection device.

5. The plating solution degassing device according to claim 2, characterized in that: It also comprises a recovery device, and the outlet end of the exhaust pipe (3) is connected to the recovery device.

6. An electrochemical deposition device, characterized in that: The plating liquid degassing device comprises the plating liquid degassing device according to any one of claims 1 to 5.

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