Equipment for uniform baking of photoresist film on large-diameter substrate surface

Abstract

A device for uniformly baking a photoresist film on the surface of a large-caliber substrate, the device mainly includes a baking system, a substrate loading and unloading system and a control system. The baking system is mainly composed of a circulating fan, a heating element, a high-efficiency filter, a baking chamber, a chamber sealing ring, a wind guide plate, an air inlet port, a return air port and a circulating air duct, a gas input port and an exhaust port. It has a cleanliness level of 100, a temperature control range of 20°C to 200°C, a chamber temperature uniformity better than ±3°C, and a temperature accuracy of ±0.5°C. The substrate loading and unloading system includes a transfer trolley and a substrate lifting device. The transfer trolley has a function of adjusting the substrate tilt at a small angle, and a guide plate is provided on the side close to the substrate near the air inlet end, which can ensure that the large-caliber sample is safely baked up and down the chamber station, and can also optimize the film baking process. The device of the present invention can realize the photoresist film baking process of a two-way meter-level size and ultra-thick substrate, and further improve its film thickness uniformity on the basis of the uniformity of the photoresist film thickness after coating.

Description

Technical Field

[0001] The invention relates to the technical field of large-aperture diffraction gratings, and in particular to a device for uniformly baking a photoresist film on the surface of a large-aperture substrate (bidirectional meter level) and a method for using the device. Background Art

[0002] The development of pulse width compression gratings has promoted the application of chirped pulse amplification technology in ultrashort and ultra-intense laser systems. As the output power of laser systems increases to several petawatts, tens of petawatts, or even hundreds of petawatts, the grating's ability to resist laser damage is difficult to be greatly improved in a short period of time due to the limitations of materials and processes. Therefore, the beam aperture can only be continuously expanded to reduce the laser energy density irradiated on the grating surface to below the grating damage threshold. Therefore, the size of the pulse width compression grating continues to increase. The diagonal length of the grating required for the petawatt system currently being designed in China is close to 2m.

[0003] The preparation process of pulse width compression grating mainly includes substrate processing, photoresist coating, baking, exposure, development and metal film plating. Obtaining a photoresist film with uniform thickness on the surface of a large-aperture substrate is one of the key processes for the development of this type of grating. The successful development of equipment for uniform baking of photoresist films on large-aperture substrate surfaces provides hardware conditions for the development of high-power pulse width compression gratings, and contributes to the development of my country's high-energy petawatt system.

[0004] At present, the photoresist baking method still adopts the hot plate baking method in most cases. The substrate and the hot plate are in contact with each other, and the heat is transferred from the hot plate to the upper surface of the substrate to bake the photoresist film. The advantages of using hot plate baking are short cycle time, high temperature precision control, and minimum residual photoresist solvent; the disadvantages are that it is suitable for baking thin-sheet substrates, the diameter of the baking substrate is limited to the order of meters, and it is easily affected by external environmental fluctuations. Therefore, the hot plate baking method is no longer suitable for baking photoresist films of meter-sized and ultra-thick substrates. Some experts and scholars have also proposed the use of a heating box baking method. The specific implementation method is: after the substrate is coated with glue, a mechanical arm is used to transfer the substrate to the top of the hot plate, and several ejectors are used to move from top to bottom to catch the substrate. After the substrate is placed horizontally on the positioning block of the hot plate, after the baking is completed, the ejector lifts the substrate, and finally a mechanical arm is used to transfer and place it in a fixed position. This method has poor cleanliness in the pre-baking process, is easy to contaminate the surface, and the thickness uniformity of the photoresist film after baking is poor, and the production efficiency is low. It is not suitable for baking photoresist substrates with high requirements for baking film thickness uniformity. Summary of the invention

[0005] In order to solve the above-mentioned technical problems, the present invention provides a device for uniformly baking a photoresist film on a large-aperture substrate surface and a method for using the device. The device can realize bidirectional baking of photoresist films on meter-sized and ultra-thick substrates, and can further improve the uniformity of the film thickness on the basis of the uniformity of the spin-coated photoresist film thickness.

[0006] In order to achieve the above purpose, the solution of the present invention is as follows:

[0007] A device for uniformly baking a photoresist film on a large-diameter substrate surface, which is characterized by comprising:

[0008] A baking system, used for baking the substrate by air circulation heating, and accommodating the substrate lifting device;

[0009] The substrate horizontal moving component is used to fix the substrate and can be moved to the substrate lifting device, and has a tilt angle adjustment function, so that the substrate is in a tilted state during baking to achieve uniform distribution of the flow field;

[0010] A flow guide device is arranged in front of the substrate, and the front part is in a bullet or triangular shape, and is used to reduce the edge wind resistance of the substrate;

[0011] A substrate lifting device is arranged below the baking system, and after receiving the substrate horizontal moving component, it can automatically rise to form a closed baking chamber on the upper part of the baking system;

[0012] The control system is used to control the horizontal movement of the substrate horizontal moving component, the up and down movement of the substrate lifting device, and the start and stop of the baking system.

[0013] The substrate horizontal moving component includes a transfer trolley, a transmission shaft, a transmission motor, a support bar, a support structure, a positioner, a transmission screw, a rotating support rod, a support structure lifting rod and a guide rail for the transfer trolley to move;

[0014] The guide device comprises a guide plate and a guide plate support block;

[0015] The transmission shaft and the transmission motor are arranged below the transfer trolley, and the transmission motor applies power to the transmission screw through the transmission shaft to realize the horizontal movement of the transfer trolley;

[0016] The support structure is placed on the transfer trolley, the front end of the support structure is fixedly connected to the transfer trolley via the rotating support rod, and the rear end of the support structure is connected to the transfer trolley via the support structure lifting rod. When the support structure lifting rod is raised or lowered, the support structure can be tilted at a small angle with the rotating support rod as the center.

[0017] The support structure is provided with a guide plate support block for fixing the guide plate and a support bar for fixing the base plate.

[0018] The horizontal transmission and up and down lifting of the transfer trolley can be realized by pneumatic transmission or pneumatic and mechanical combination in addition to mechanical transmission.

[0019] A wind guide plate is arranged in front of the air inlet port to facilitate adjusting the direction of the circulating airflow when it enters the baking chamber.

[0020] The baking chamber has a protective gas (inert gas) input port and an exhaust port, and an exhaust gas filtering device can be arranged in the exhaust port.

[0021] The baking system has a cleanliness level of 100, a temperature control range of 20°C to 200°C, a chamber temperature uniformity better than ±3°C, and a temperature accuracy of ±0.5°C.

[0022] The area of ​​the lower surface of the substrate is slightly larger than the area of ​​the support strips. The purpose of this structure is to facilitate the removal of the substrate fixture; when the baking chamber is in a closed state, the height of the upper surface of the substrate is located at 1 / 2 of the height of the baking chamber.

[0023] The method for using the device for uniformly baking a photoresist film on a large-diameter substrate surface of the present invention comprises the following steps:

[0024] 1) Before the power of the baking system is turned on, the upper surface of the support structure of the substrate lifting device supporting the transfer trolley fits with the chamber sealing ring, so that the upper surface of the transfer trolley constitutes the lower end surface of the baking chamber, so that the baking chamber is in a closed state to ensure the cleanliness of the baking environment; start the power of the baking system, the substrate lifting device supports the transfer trolley to move slowly downward, when the transfer trolley descends to a certain height and touches the photoelectric switch, the substrate lifting device stops descending, and the horizontal transmission system starts to work at the same time, moving the operating trolley from left to right, and after a certain distance of horizontal transmission, it touches the photoelectric switch in the horizontal position and stops horizontal movement, indicating that the transfer trolley has reached the sample loading area, which is on the right side of the baking chamber;

[0025] 2) Place the substrate after spin coating the photoresist film on the top of the polytetrafluoroethylene plate and the support bar of the transfer vehicle by hoisting or other substrate transfer equipment, and ensure that the lower surface of the substrate is completely attached to the polytetrafluoroethylene plate. The area of ​​the lower surface of the substrate is slightly larger than the area of ​​the support bar. This design is designed to facilitate the removal of the substrate fixture;

[0026] 3) The cross-sectional shape of the deflector is a bullet shape or a triangle shape, the deflector support block is fixed, the deflector is attached to the front side of the base plate and fixed on the deflector support block, and the support structure lifting rod is adjusted to rotate the base plate at a small angle (0-5°) relative to the horizontal direction;

[0027] 4) Set appropriate baking parameters on the control system panel, such as the first stage baking temperature T1 , Heating time t 1 , Second stage baking temperature T 2 , constant temperature time t 2 , 3rd stage baking temperature T 3 And the corresponding baking time t 3 Parameters to ensure that the baking process requirements are met. After determining the baking parameters, it is necessary to consider whether the baking chamber needs to be filled with protective gas. If protective gas is required, open the protective gas valve and enable the protective gas in the control system panel.

[0028] 5) Start the loading program in the control system panel: the horizontal transmission system moves the operating trolley from right to left until it moves to the top of the substrate lifting device and touches the photoelectric switch in the horizontal position, the horizontal movement stops, and the vertical movement is triggered at the same time. The substrate lifting device supports the transfer trolley to move upward to the bottom of the baking chamber, closing the baking chamber. At this time, the protective gas begins to be filled into the circulating air duct, the circulating fan starts to work, and the heating element starts to work after a period of time, and the baking is performed according to the baking parameters set in step 4;

[0029] 6) After the baking is completed, the substrate lifting device supports the transfer trolley to move slowly downward. When the transfer trolley descends to a certain height, it touches the photoelectric switch, and the substrate lifting device stops descending. At the same time, the horizontal transmission system starts working, and moves the operating trolley from left to right to the sample loading area;

[0030] 7) After the substrate is cooled down, remove the guide plate and its support block, adjust the support structure lifting rod to place the substrate horizontally, and transfer the substrate to a fixed position through the substrate transfer equipment to prepare for measuring the film thickness non-uniformity data.

[0031] 8) After removing the substrate, operate the control system panel to return the transfer trolley to the lower end of the oven chamber to make it sealed and turn off the power.

[0032] Compared with the prior art, the technical effects of the present invention are as follows:

[0033] 1. The guide plate is closely attached to the front edge of the substrate and maintains the same height. The cross-sectional shape of the guide plate is a bullet shape or a triangle shape, which can well reduce the wind resistance at the edge of the substrate and make the wind speed flowing through the upper surface of the substrate more uniform, which is conducive to improving the uniformity of the baking film thickness;

[0034] 2. The transfer trolley has a small-angle tilt adjustment function. Theoretical analysis shows that the substrate baking method with a small-angle tilt can improve the uniform distribution of the flow field on the substrate surface, which is beneficial to improving the baking process and meeting the baking film thickness uniformity index;

[0035] 3. The baking chamber has a cleanliness level of 100, a temperature control range of 20℃~200℃, a chamber temperature uniformity better than ±3℃, and a temperature accuracy of ±0.5℃, which can further improve the uniformity of the film thickness of the spin-coated photoresist;

[0036] 4. It can realize the automation of the whole process of substrate baking, and can realize the automation of the whole process from loading, baking and sending out of bidirectional meter-sized and ultra-thick substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a front cross-sectional view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention.

[0038] Figure 2 It is a right view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention.

[0039] Figure 3 It is a top view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention.

[0040] Figure 4 It is a front view of the transfer trolley 2.

[0041] Figure 5 It is a front cross-sectional view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention after sample loading.

[0042] Figure 6 It is a schematic diagram of the front air inlet and the rear air outlet of the baking chamber.

[0043] Figure 7 Schematic diagram of the guide plate structure, including (a) a schematic diagram of a bullet-shaped guide plate at the front, and (b) a schematic diagram of a triangular guide plate.

[0044] Figure 8 The figure shows the airflow distribution inside the baking chamber before and after the improvement of the large-aperture substrate baking method, where (a) is before improvement and (b) is after improvement.

[0045] Fig. 9 Schematic diagram of the present invention for improving the uniformity of film thickness, wherein (a) without adding a guide plate, when the inclination angle is 0°, the difference in film thickness before and after baking fluctuates by 22.9nm; (b) with adding a bullet-shaped guide plate at the front, when the inclination angle is 1.5°, the difference in film thickness before and after baking fluctuates by 9nm.

[0046] In the figure: 1-baking system; 2-transfer trolley; 3-substrate lifting device; 4-control system; 5-circulating fan; 6-heating element; 7-filter; 8-baking chamber; 9-chamber sealing ring; 10-wind guide plate; 11-air inlet port; 12-return air port; 13-circulating air duct; 14-gas input port; 15-exhaust port; 16-transmission motor; 17-transmission shaft; 18-guide plate; 19-guide plate support block; 20-substrate; 21-polytetrafluoroethylene plate; 22-support bar; 23-support structure; 24-handle; 25-positioner; 26-transmission screw; 27-rotating support rod; 28-support structure lifting rod; 29-lifting support rod; 30-photoelectric switch; 31-guide rail; 32-blocking piece; 33-ventilation hole. DETAILED DESCRIPTION

[0047] The technical solution provided by the present invention is described in detail below in conjunction with the embodiments and the accompanying drawings. It should be understood that the following specific implementation methods are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0048] Figure 1 It is a front view cross-sectional view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention. Figure 2 It is a right side view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention. Figure 3 It is a top view of the overall structure of the device for uniformly baking a photoresist film on a large-diameter substrate surface of the present invention. As can be seen from the figure, the device for uniformly baking a photoresist film on a large-diameter substrate surface of the present invention comprises: a baking system 1, a substrate loading and unloading system and a control system 4, wherein the substrate loading and unloading system comprises a transfer trolley 2 and a substrate lifting device 3.

[0049] Figure 1As shown, the baking system 1 includes a circulating fan 5, a heating element 6, a high-efficiency filter 7, a baking chamber 8, a chamber sealing ring 9, a wind guide plate 10, an air inlet port 11, a return air port 12, a circulating air duct 13, a gas input port 14, and an exhaust port 15. The fan blades of the circulating fan 5 are located in the circulating air duct 13 to provide the circulation power of the chamber airflow. The heating wire of the heating element 6 is located in the circulating air duct 13 as a heating source for the chamber airflow. The high-efficiency filter 7 is located in the circulating air duct 13 and is located 10-15 cm in front of the air inlet port 11. The air inlet port 11 and the return air port 12 replace the front face and the rear face of the baking chamber 8 respectively. The air inlet port 11 and the return air port 12 both include a plurality of baffles 32 and vents 33. When the air supply volume is constant, the baffles 32 can be adjusted to control the wind speed of each vent, thereby adjusting the overall airflow distribution in the baking chamber 8 to improve the temperature uniformity of the baking chamber 8. A wind deflector 10 is provided in front of the air inlet port 11 to facilitate adjusting the direction of the airflow when entering the oven cavity 8. The baking chamber 8 has a protective gas (inert gas) input port 14 and an exhaust port 15, and an exhaust gas filter device can be provided in the exhaust port 15. The lower end surface of the baking chamber 8 is not sealed, and the chamber sealing ring 9 is located at the edge of the lower end surface of the baking chamber 8. The upper surface of the supporting structure 23 of the transfer trolley 2 serves as the lower end sealing surface of the baking chamber.

[0050] Figure 4 It is a front view of the transfer vehicle 2. Figure 5 It is a front view cross-sectional view of the overall structure of the equipment for uniformly baking the photoresist film on the surface of a large-diameter substrate of the present invention after loading. The substrate loading and unloading system is composed of a transfer trolley 2 and a substrate lifting device 3. The horizontal transmission and up and down lifting of the transfer trolley 2 can be realized by pneumatic, mechanical or a combination of pneumatic and mechanical methods. The mechanical transmission method is adopted in the view of the present invention. The transfer trolley 2 includes a guide plate 18, a guide plate support block 19, a substrate 20, a polytetrafluoroethylene plate 21, a support bar 22, a support structure 23, a handle 24, a positioner 25, a transmission screw 26, a rotating support rod 27, a support structure lifting rod 28, a lifting support rod 29, a photoelectric switch 30 and a guide rail 31. The structure of the guide plate 18 is as shown in FIG. Figure 7As shown, the cross-sectional shape of the guide plate 18 is a bullet shape or a triangular shape, which can well reduce the wind resistance at the edge of the substrate, make the wind speed flowing through the upper surface of the substrate more uniform, and help improve the uniformity of the baking film thickness; close to the front side of the substrate 20, the height of the guide plate 18 is consistent with the thickness of the substrate 20. The guide plate support block 19 is located below the guide plate 18 and is used to fix the guide plate 18. The support bar 22 is fixed to the upper surface of the support structure 23 by screws, which is detachable and can be designed according to the size of the substrate. The polytetrafluoroethylene plate 21 is located above the support bar 22 to prevent the support bar 22 from scratching the substrate 20. The support structure lifting rod 28 is located at the tail of the support structure 23, and the small angle (0° to 5°) deflection of the substrate 20 can be achieved with the rotating support rod 27 as the center. The handle 24 is located at the tail of the transfer trolley 2, and the horizontal transmission of the transfer trolley can be achieved manually when necessary. The positioner 25 is fixed under the trolley and can realize the horizontal and vertical positioning of the transfer trolley in cooperation with the photoelectric switch 30. The transmission screw 26 is located at the bottom of the transfer trolley 2 and is used to realize the automatic horizontal transmission of the trolley. The substrate lifting device 3 adopts a mechanical screw lifting structure with a maximum weighing capacity of 1.5 tons. This system belongs to a conventional mechanical transmission system and will not be described in detail.

[0051] Figure 2 As shown, the control system 4 is connected to the control ends of the baking system 1, the substrate lifting device 3, the transmission motor 16, and the photoelectric switch 30 through cables to realize the automatic control of the substrate loading, baking, and sending processes.

[0052] The baking system and transfer trolley 2 are the core parts of the equipment. The baking system has a cleanliness level of 100, a temperature control range of 20℃~200℃, a chamber temperature uniformity better than ±3℃, and a temperature accuracy of ±0.5℃. The transfer trolley 2 has a guide plate 18 and a small angle adjustment device - a support structure lifting rod 28, which can improve the airflow distribution on the upper surface of the substrate to the greatest extent, so that the airflow blows smoothly and evenly over the upper surface of the substrate. Figure 8 Comparison of airflow distribution inside the baking chamber before and after the substrate baking method is improved. The structural design of the baking system and the transfer trolley is the basic process guarantee for realizing the bidirectional baking of photoresist films on meter-sized and ultra-thick substrates, and improving the baking uniformity of the photoresist film thickness.

[0053] The height of the upper surface of the substrate 20 is located at 1 / 2 of the height of the baking chamber.

[0054] The method for using the above-mentioned large-diameter substrate surface photoresist film uniform baking device comprises the following steps:

[0055] 1) Before the power of the baking system 1 of the present invention is turned on, the support structure 23 of the substrate lifting device 3 supporting the transfer trolley 2 is fitted with the chamber sealing ring 9, so that the transfer trolley 2 constitutes the lower end surface of the baking chamber 8, so that the baking chamber 8 is in a closed state to ensure the cleanliness of the baking environment; the power of the baking system 1 is turned on, and the substrate lifting device 3 supports the transfer trolley 2 to move slowly downward. When the transfer trolley 2 descends to a certain height and touches the photoelectric switch 30, the substrate lifting device 3 stops descending, and the horizontal transmission system starts to work at the same time, moving the operating trolley 2 from left to right. After a certain distance of horizontal transmission, it will touch the photoelectric switch 30 in the horizontal position and stop horizontal movement, indicating that the transfer trolley 2 has reached the sample loading area at this time, and the sample loading area is on the right side of the baking chamber 8;

[0056] 2) Place the substrate 20 after spin coating the photoresist film on the top of the polytetrafluoroethylene plate 21 and the support bar 22 of the transfer trolley 2 by hoisting or other substrate transfer equipment, and ensure that the lower surface of the substrate 20 is completely attached to the polytetrafluoroethylene plate 21. The area of ​​the lower surface of the substrate 20 is slightly larger than the area of ​​the support bar 22. This design is designed to facilitate the removal of the substrate fixture;

[0057] 3) Fix the guide plate support block 19, fit the guide plate 18 to the front surface of the base plate 20 and fix it on the guide plate support block 19, and adjust the support structure lifting rod 28 to rotate the base plate 20 at a small angle (0-5°) relative to the horizontal direction;

[0058] 4) Set appropriate baking parameters on the panel of the control system 4, such as the first stage baking temperature, heating time, second stage baking temperature, constant temperature time, third stage baking temperature and corresponding baking time parameters, to ensure that the baking process requirements are met; after determining the baking parameters, consider whether the baking chamber needs to be filled with protective gas. If protective gas needs to be introduced, open the protective gas valve and enable the protective gas in the control system panel.

[0059] 5) Start the loading program in the control system 4 panel: the horizontal transmission system moves the operating trolley 2 from right to left until it moves to the top of the substrate lifting device 3 and touches the photoelectric switch 30 in the horizontal position, and the horizontal movement stops. At the same time, the vertical movement is triggered, and the substrate lifting device 3 supports the transfer trolley 2 to move upward to the bottom of the baking chamber 8, closing the baking chamber 8. At this time, the protective gas begins to be filled into the circulating air duct 13, and the circulating fan 5 starts to work. After a period of time, the heating element starts to work, and baking is performed according to the baking parameters set in step 4;

[0060] 6) After the baking is finished, the substrate lifting device 3 supports the transfer trolley 2 to slowly move downward. When the transfer trolley 2 drops to a certain height, it touches the photoelectric switch 30, and then the substrate lifting device 3 stops descending. At the same time, the horizontal transmission system starts working, and moves the operating trolley 2 from left to right to the sample loading area;

[0061] 7) After the substrate 20 is cooled down, the guide plate 18 and the guide plate support block 19 are removed, the support structure lifting rod 28 is adjusted to place the substrate 20 horizontally, and the substrate 20 is transferred to a fixed position by a substrate transfer device to prepare for measuring the film thickness non-uniformity data;

[0062] 8) After removing the substrate 20, operate the control system 4 panel to restore the transfer vehicle 2 to the lower end of the oven chamber 8 so that it is in a sealed state, and turn off the power.

[0063] Experiments show that if Figure 8 As shown, the equipment for uniformly baking photoresist films on the surface of large-diameter substrates of the present invention can realize a bidirectional photoresist film baking process for meter-scale and ultra-thick substrates, and further improve the uniformity of the photoresist film thickness on the basis of the uniformity of the photoresist film thickness after coating.

[0064] Finally, it should be noted that the above embodiments are only used to describe the technical solutions of the present invention rather than limiting technical solutions. Those skilled in the art should understand that those modifications or equivalent replacements of the technical solutions of the present invention, without departing from the purpose and scope of the technical solutions, all belong to the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A device for uniformly baking a photoresist film on a large-diameter substrate surface, characterized in that: include: A baking system, used for baking the substrate by air circulation heating, and accommodating the substrate lifting device; The substrate horizontal moving component is used to fix the substrate and can be moved to the substrate lifting device, and has a tilt angle adjustment function, so that the substrate is in a tilted state during baking to achieve uniform distribution of the flow field; A deflector device is arranged in front of the substrate, and the front part is in a bullet or triangular shape, and is used to reduce the edge wind resistance of the substrate; the deflector device comprises a deflector plate (18) and a deflector plate support block (19); the deflector plate (18) is adjacent to the front side of the substrate (20), and the height of the deflector plate (18) is consistent with the thickness of the substrate (20); the deflector plate is attached to the front side of the substrate and fixed on the deflector plate support block, and the support structure lifting rod is adjusted to rotate the substrate by 0 to 5 degrees relative to the horizontal direction; A substrate lifting device is arranged below the baking system, and after receiving the substrate horizontal moving component, it can automatically rise to form a closed baking chamber on the upper part of the baking system; The control system is used to control the horizontal movement of the substrate horizontal moving component, the up and down movement of the substrate lifting device, and the start and stop of the baking system.

2. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 1, characterized in that: The substrate horizontal moving component comprises a transfer trolley (2), a transmission shaft (16), a transmission motor (17), a support bar (22), a support structure (23), a positioner (25), a transmission screw (26), a rotating support rod (27), a support structure lifting rod (28) and a guide rail (31) for the transfer trolley (2) to move; The transmission shaft (16) and the transmission motor (17) are arranged below the transfer trolley (2); the transmission motor (17) applies power to the transmission screw (26) through the transmission shaft (16) to achieve horizontal movement of the transfer trolley (2); The support structure (23) is placed on the transfer trolley (2), the front end of the support structure (23) is fixedly connected to the transfer trolley (2) via the rotating support rod (27), and the rear end of the support structure (23) is connected to the transfer trolley (2) via the support structure lifting rod (28). When the support structure lifting rod (28) is raised or lowered, the support structure (23) can be tilted at a small angle with the rotating support rod (27) as the center. A guide plate support block (19) for fixing the guide plate (18) and a support bar (22) for fixing the base plate are arranged on the support structure (23).

3. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 2, characterized in that: The support bar (22) is fixed to the upper surface of the support structure (23) by means of screws.

4. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 2 or 3, characterized in that: The area of ​​the upper surface of the support bar (22) is smaller than the area of ​​the lower surface of the base plate (20).

5. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 2 or 3, characterized in that: A polytetrafluoroethylene plate (21) is also provided between the support bar (22) and the base plate (20) to prevent the support bar (22) from scratching the base plate (20).

6. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 2, characterized in that: A handle (24) is also provided at the rear of the transfer trolley (2) for manually pushing the transfer trolley (2) for horizontal transmission.

7. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 1, characterized in that: The substrate lifting device adopts a mechanical screw lifting platform structure or a pneumatic or pneumatic and mechanical combination method.

8. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 1, characterized in that: The baking system is divided into two parts, the upper part is a baking chamber (8) with a lower opening formed by a bracket and a shell, which is used for baking the substrate, and the lower part is composed of a bracket, which is used to accommodate the substrate lifting device and the substrate horizontal moving component; One side of the baking chamber (8) is an air inlet end face (11), and the other side is an air return end face (12), and a circulating air duct (13) is formed between the two. A circulating fan (5), a heating element (6) and a filter (7) are installed on the top of the baking chamber (8). The fan blades of the circulating fan (5) are located in the circulating air duct (13) to provide air circulation power for the baking chamber (8). The heating wire of the heating element (6) is located in the circulating air duct (13) to provide an air flow heating source for the baking chamber (8). The filter (7) is located in the circulating air duct (12) and is located in front of the air inlet end face (11), and is used to filter the circulating air flow passing through the air inlet port (11) to ensure the 100-level cleanliness of the baking chamber (8).

9. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8, characterized in that: The air inlet end surface (11) and the air return end surface (12) are composed of evenly distributed ventilation holes (33), and each ventilation hole (33) is provided with a baffle (32). By adjusting the baffle (32), the wind speed of each ventilation hole (33) can be controlled, thereby regulating the air supply volume and air supply distribution pattern of the overall airflow in the baking chamber (8), thereby achieving the goal of improving the temperature uniformity of the baking chamber (8).

10. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8 or 9, characterized in that: A wind guide plate (10) is also provided between the filter (7) and the air inlet end surface (11); the diameter of the wind guide plate (10) is consistent with the diameter of the air inlet end surface (11), and is used to adjust the direction of the circulating airflow entering the baking chamber (8).

11. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8 or 9, characterized in that: A chamber sealing ring (9) is provided at the bottom of the lower opening of the baking chamber (8); When the substrate lifting device receives the substrate horizontal moving component and automatically rises, the upper surface of the supporting structure (23) of the substrate horizontal moving component fits with the chamber sealing ring (9) to form the bottom surface of the baking chamber (8), so that the interior of the baking chamber (8) is in a closed state.

12. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 11, characterized in that: When the baking chamber (8) is in a closed state, the height of the upper surface of the substrate (20) is located at 1 / 2 of the height of the baking chamber (8).

13. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8 or 9, characterized in that: A protective gas input port (14) and an exhaust port (15) are respectively provided on the outer shell of the baking chamber (8); the input port (14) and the exhaust port (15) are connected to the circulating air duct (13) for protecting the film material on the surface of the substrate.

14. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8 or 9, characterized in that: A photoelectric switch (30) is provided on the lower bracket of the baking system, and a positioner (25) is provided at the bottom of the transfer trolley (2); when the substrate lifting device drives the substrate horizontal moving component to move downward and reaches a certain height, the substrate horizontal moving component touches the photoelectric switch (30), and the substrate horizontal moving component stops descending, turns to horizontal movement, and moves out of the baking system.

15. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 8 or 9, characterized in that: The control system controls the temperature in the baking chamber (8) to range from 20°C to 200°C, with a temperature uniformity better than ±3°C and a temperature accuracy of ±0.5°C.

16. The device for uniformly baking a photoresist film on a large-diameter substrate surface according to claim 1 or 15, characterized in that: The control panel of the control system is set with baking parameters, including the first stage baking temperature T1, heating time t1; the second stage baking temperature T2, constant temperature time t2; the third stage baking temperature T3, baking time t3.

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