Method, device, equipment and storage medium for monitoring heating of wire clamps of conductor equipment

Abstract

The present application discloses a method, apparatus, device and storage medium for monitoring the heating of a wire clamp of a conductor device. The method obtains the heating influencing parameters of the wire clamp of the conductor device and generates a plurality of heating influencing parameter combinations based on the current range, ambient temperature range and solar irradiance range in the heating influencing parameters. The method calculates the temperature distribution data of the wire clamp of the conductor device under the action of each heating influencing parameter combination by using a heating simulation model of the wire clamp of the conductor device. The heating simulation model is a multi-physical field coupling model. Based on the wire clamp temperature distribution data, the wire clamp of the conductor device to be tested is subjected to heating monitoring to obtain the maximum temperature of the wire clamp of the conductor device to be tested, thereby being able to monitor the temperature of any point on the wire clamp at any time, effectively solving the problems of infrared monitoring blind spots and inability to monitor in real time, and the inability of the temperature monitoring device to monitor the overall temperature, thereby improving the monitoring accuracy of the wire clamp heating monitoring and improving the reliability of the monitoring results.

Description

Technical Field

[0001] The present application relates to the technical field of equipment safety monitoring, and in particular to a method, device, equipment and storage medium for monitoring heating of wire clamps of conductor equipment. Background Art

[0002] Equipment clamps are hardware that connect conductors to electrical equipment, transferring electrical loads and withstanding certain mechanical loads. During operation, heating from equipment clamps can seriously impact the continued stable operation of power equipment, necessitating monitoring of heating.

[0003] Currently, wire clamp heating is monitored through infrared temperature measurement by manual inspections, infrared temperature measurement by drone inspections, or temperature monitoring devices. However, infrared temperature measurement can only measure the temperature at a specific point in time, making it difficult to detect the moment of highest temperature. Furthermore, for power grid equipment with crisscrossing lines, there are blind spots that infrared cannot detect. While temperature monitoring devices can monitor the temperature of wire clamps at every moment in real time, they require installation of a monitoring device for each wire clamp, resulting in high monitoring costs. Furthermore, temperature monitoring devices can only monitor the temperature at the installation point, not the overall temperature of the wire clamp. Therefore, current methods for monitoring wire clamp heating suffer from low monitoring accuracy. Summary of the Invention

[0004] The present application provides a method, apparatus, device and storage medium for monitoring the heating of a wire clamp of a conductor device, so as to solve the technical problem of low monitoring accuracy in the current method for monitoring the heating of a wire clamp.

[0005] In order to solve the above technical problems, in a first aspect, the present application provides a method for monitoring heating of a wire clamp of a conductor device, comprising:

[0006] Obtaining heat-influencing parameters of the conductor equipment clamp, the heat-influencing parameters including the current range passing through the conductor equipment clamp, the ambient temperature range of the environment in which the conductor equipment clamp is located, and the solar irradiance range of the area in which the conductor equipment clamp is located;

[0007] Generate multiple combinations of heating-influencing parameters based on current range, ambient temperature range, and solar irradiance range;

[0008] Using the heating simulation model of the conductor equipment clamp, the temperature distribution data of the conductor equipment clamp under the combined effect of various heating-influencing parameters is calculated. The heating simulation model is a multi-physics field coupling model.

[0009] Based on the temperature distribution data of the wire clamp, the heat generation of the wire clamp of the conductor equipment to be tested is monitored to obtain the maximum temperature of the wire clamp of the conductor equipment to be tested.

[0010] In some implementations, multiple combinations of heating influencing parameters are generated based on the current range, the ambient temperature range, and the solar irradiance range, including:

[0011] The current interval, ambient temperature interval and solar irradiance interval are divided into equal intervals to generate current series, ambient temperature series and solar irradiance series;

[0012] Current data in the current sequence, ambient temperature data in the ambient temperature sequence, and solar irradiance data in the solar irradiance sequence are randomly combined to generate a plurality of heating influencing parameter combinations.

[0013] In some implementations, a heat generation simulation model of a conductor equipment clamp is used to calculate the temperature distribution data of the conductor equipment clamp under the combined effects of various heat-influencing parameters, including:

[0014] Obtaining the clamp parameters of the conductor equipment clamp and the air parameters of the area where the conductor equipment clamp is located;

[0015] Using a preset steady-state solver, the multi-physics field coupling model is solved according to the combination of wire clamp parameters, air parameters and heat influencing parameters to obtain the wire clamp temperature distribution data under the action of various heat influencing parameter combinations. The multi-physics field coupling model includes the current physics field, solid heat transfer physics field and surface-to-surface radiation physics field.

[0016] In some implementations, the current physics field satisfies the resistivity-temperature law equation:

[0017]

[0018] Where σ is the conductivity at ambient temperature T, ρ0 is the resistivity at ambient temperature 0°C, α is the temperature coefficient of resistivity, and T Ave It is the actual surface temperature of the wire clamp of the conductor equipment.

[0019] In some implementations, the solid heat transfer physics satisfies the solid heat transfer equation:

[0020]

[0021]

[0022] Where ρ is the density of the wire clamp of the conductor equipment, C p is the solid heat capacity of the wire clamp at atmospheric pressure p, temperature T and time t, u is the translational motion velocity, q is the heat flux, k is the solid thermal conductivity, and Q is the heat source.

[0023] In some implementations, the radiation objects of the surface-to-surface radiation physical field are all surfaces of the wire device clamps, the boundary conditions are diffuse reflection surfaces, the radiation source is the sun, and the irradiance is the solar irradiance data in the heating influencing parameter combination.

[0024] In some implementations, performing heat monitoring on a wire clamp of a conductor device to be tested based on the wire clamp temperature distribution data to obtain a maximum temperature of the wire clamp of the conductor device to be tested includes:

[0025] Establish a mapping relationship table between the temperature distribution data of the wire clamp and each combination of heating influencing parameters;

[0026] Using the mapping relationship table, based on the actual current data, actual ambient temperature data, and actual solar irradiance data corresponding to the wire clamp of the conductor device under test, the wire clamp of the conductor device under test is monitored for heat generation, and the target wire clamp temperature distribution data of the conductor device under test is obtained;

[0027] Based on the target clamp temperature distribution data, the maximum temperature of the clamp of the conductor device to be tested is determined.

[0028] In a second aspect, the present application further provides a heating monitoring device for a wire clamp of a conductor device, comprising:

[0029] An acquisition module is used to obtain heat-influencing parameters of the conductor equipment clamp, wherein the heat-influencing parameters include a current range passing through the conductor equipment clamp, an ambient temperature range of an environment in which the conductor equipment clamp is located, and a solar irradiance range of an area in which the conductor equipment clamp is located;

[0030] A generation module, for generating multiple heating influencing parameter combinations based on a current range, an ambient temperature range, and a solar irradiance range;

[0031] A calculation module is used to calculate the temperature distribution data of the wire clamp of the conductor equipment under the combined effects of various heat-influencing parameters using a heat simulation model of the wire clamp of the conductor equipment. The heat simulation model is a multi-physics field coupling model.

[0032] The monitoring module is used to monitor the heat generation of the wire clamp of the conductor device to be tested based on the wire clamp temperature distribution data, and obtain the maximum temperature of the wire clamp of the conductor device to be tested.

[0033] In a third aspect, the present application further provides a computer device comprising a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the method for monitoring the heating of the wire clamp of the conductor device according to the first aspect is implemented.

[0034] In a fourth aspect, the present application further provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the method for monitoring heating of a wire clamp of a conductor device as described in the first aspect.

[0035] Compared with the prior art, this application has at least the following beneficial effects:

[0036] By obtaining the heating influencing parameters of the conductor equipment clamp, the heating influencing parameters include the current range passing through the conductor equipment clamp, the ambient temperature range of the environment in which the conductor equipment clamp is located, and the solar irradiance range of the area where the conductor equipment clamp is located, and based on the current range, ambient temperature range and solar irradiance range, multiple heating influencing parameter combinations are generated to simulate different influencing parameter combinations that affect the heating of the clamp; then using the heating simulation model of the conductor equipment clamp, the clamp temperature distribution data of the conductor equipment clamp under the action of each heating influencing parameter combination is calculated. The heating simulation model is a multi-physical field coupling model, and based on the clamp temperature distribution data, the heating of the conductor equipment clamp to be tested is monitored, and the maximum temperature of the conductor equipment clamp to be tested is obtained, so that the temperature of any point on the clamp at any time can be monitored, effectively solving the problems of infrared monitoring blind spots and inability to monitor in real time, and effectively solving the problem of the temperature monitoring device being unable to monitor the overall temperature, thereby improving the monitoring accuracy of the clamp heating monitoring and improving the reliability of the monitoring results. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a flow chart of a method for monitoring heating of a wire clamp of a conductor device according to an embodiment of the present application;

[0038] Figure 2 This is a schematic diagram of the temperature distribution of the wire clamp of the conductor equipment shown in an embodiment of the present application;

[0039] Figure 3 This is a schematic structural diagram of a heating monitoring device for a wire clamp of a conductor device according to an embodiment of the present application;

[0040] Figure 4 This is a schematic diagram of the structure of a computer device shown in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] Please refer to Figure 1 , Figure 1The present invention provides a flow chart of a method for monitoring the heating of a wire clamp of a conductor device. The method for monitoring the heating of a wire clamp of a conductor device according to the present invention can be applied to computer devices, including but not limited to smart phones, laptops, tablet computers, desktop computers, physical servers, cloud servers and other devices. Figure 1 As shown, the method for monitoring heating of a conductor equipment clamp of this embodiment includes steps S101 to S104, which are described in detail as follows:

[0043] Step S101 , obtaining heating influence parameters of a conductor equipment clamp, wherein the heating influence parameters include a current range passing through the conductor equipment clamp, an ambient temperature range of an environment where the conductor equipment clamp is located, and a solar irradiance range of an area where the conductor equipment clamp is located.

[0044] In this step, the current range is the current range that the wire clamp of the conductor equipment passes through during actual operation, which is recorded as I min ~I max , the unit is A, where I min The minimum value is 0, which means that when the line where the conductor equipment clamp is located is disconnected due to maintenance or other reasons, no current flows; the ambient temperature range is the ambient temperature range of the area where the conductor equipment clamp is located, which can be specifically the ambient temperature range of the environment where the conductor equipment clamp is located, recorded as T min ~T max , the unit is K; the solar irradiance range is the solar irradiance range of the area where the conductor equipment clamp is located, recorded as S min ~S max , unit is w / m 2 , where S min The minimum value is 0, which means there is no solar radiation at night.

[0045] Step S102 : generating a plurality of heating influencing parameter combinations based on the current range, the ambient temperature range, and the solar irradiance range.

[0046] In this step, optionally, multiple characteristic values in the current interval, ambient temperature interval and solar irradiance interval are taken respectively, that is, multiple current characteristic values, multiple ambient temperature values and multiple solar irradiance values are taken, and then a heating influence parameter combination is formed by randomly taking 1 current characteristic value, 1 ambient temperature characteristic value and 1 solar irradiance value to obtain multiple heating influence parameter combinations.

[0047] In some embodiments, step S102 includes:

[0048] Dividing the current interval, the ambient temperature interval, and the solar irradiance interval into equal intervals to generate a current sequence, an ambient temperature sequence, and a solar irradiance sequence;

[0049] The current data in the current sequence, the ambient temperature data in the ambient temperature sequence, and the solar irradiance data in the solar irradiance sequence are randomly combined to generate a plurality of heating influencing parameter combinations.

[0050] In this step, I min ~I max Divided into a current sequence containing n current values (I1, I2, ..., I n );T min ~T max Divide into an ambient temperature sequence (T1, T2, ..., T n ); with the preset solar irradiance interval, S min ~S max Divided into a solar irradiance sequence (S1, S2, ..., S n ). For (I1,I2,…,I n )、(T1,T2,…,T n ) and (S1,S2,…,S n ) are randomly combined to generate the heating effect parameter combination (I m ,T j ,S k ), m∈(1,2,…,n), j∈(1,2,…,n), k∈(1,2,…,n).

[0051] Step S103 , using a heating simulation model of a conductor equipment clamp, calculating the temperature distribution data of the conductor equipment clamp under the combined effects of various heating influencing parameters, wherein the heating simulation model is a multi-physics field coupling model.

[0052] In this step, the heating simulation model is a model established based on the coupling of multiple physical fields, including but not limited to the current physics field, the solid heat transfer physics field and the surface-to-surface radiation physics field, so as to simulate the current phenomenon, heat transfer phenomenon and surface radiation phenomenon of the wire clamp of the conductor equipment through the heating simulation model, thereby simulating the heating phenomenon of the wire clamp under the combined action of multiple heating influencing parameters and obtaining the temperature distribution data of the wire clamp. For example, the temperature distribution of the wire clamp of the conductor equipment is as follows: Figure 2 shown.

[0053] In some embodiments, step S103 includes:

[0054] Obtaining the clamp parameters of the conductor equipment clamp and the air parameters of the area where the conductor equipment clamp is located;

[0055] Using a preset steady-state solver, the multi-physics field coupling model is solved according to the combination of the wire clamp parameters, the air parameters and the heat influencing parameters to obtain the wire clamp temperature distribution data of the wire clamp of the conductor equipment under the action of each combination of the heat influencing parameters. The multi-physics field coupling model includes the current physics field, the solid heat transfer physics field and the surface-to-surface radiation physics field.

[0056] In this embodiment, the clamp parameters include: Figure 2 The clamp structure parameters and material parameters shown include but are not limited to elastic modulus, Poisson's ratio, density, relative dielectric constant, electrical conductivity, relative magnetic permeability, constant pressure heat capacity, thermal expansion coefficient and thermal conductivity. The air parameters include but are not limited to relative dielectric constant, electrical conductivity and relative magnetic permeability of air.

[0057] Optionally, the current physical field satisfies the resistivity-temperature law equation:

[0058]

[0059] Where σ is the conductivity at ambient temperature T, ρ0 is the resistivity at ambient temperature 0°C, α is the temperature coefficient of resistivity, and T Ave It is the actual surface temperature of the wire clamp of the conductor equipment.

[0060] Optionally, the solid heat transfer physical field satisfies the solid heat transfer equation:

[0061]

[0062] Where ρ is the density of the wire clamp of the conductor equipment, C p is the solid heat capacity of the wire clamp at atmospheric pressure p, temperature T and time t, u is the translational motion velocity, q is the heat flux, k is the solid thermal conductivity, and Q is the heat source.

[0063] Optionally, the radiation objects of the surface-to-surface radiation physical field are all surfaces of the wire clamp of the conductor equipment, the boundary condition is a diffuse reflection surface, the radiation source is the sun, and the irradiance is the solar irradiance data in the heat influencing parameter combination.

[0064] The steady-state solver helps obtain the stable temperature under specific current and sunlight intensity. The specific solution process can be implemented using COMSOL Multiphysics simulation software. For example, the simulation solution process is as follows:

[0065] (1) Geometric modeling and material parameter setting of the equipment wire clamp model based on COMSOL: According to the structural parameters, the geometric model of the equipment wire clamp is established in COMSOL, and according to the material parameters, the Young's modulus of the wire clamp is set to 110GPa, the Poisson's ratio is set to 0.35, and the density is set to 8970kg / m 3 , constant pressure heat capacity is 385J / (kg·K), relative dielectric constant is 1, thermal conductivity is 400W / (m·K), relative magnetic permeability is 1, thermal expansion coefficient is 17 / K, reference resistivity is 1.72e －8 Ω·m.

[0066] (2) Perform physical field settings, mesh generation, and solution calculations in the COMSOL geometric model. Based on the geometric model of the wire clamp established in the previous step, add the current physics field, solid heat transfer physics field, and surface-to-surface radiation physics field in COMSOL to implement the current-solid heat transfer-radiation heat transfer coupled calculation.

[0067] (3) Set the initial temperature of the equipment clamp to T.

[0068] (4) In the current physics field, select the current input section and set its boundary condition to electric potential, where the electric potential is the product of the current I and the resistance R of the equipment clamp at room temperature. Select the current outflow section and set its boundary condition to ground. The temperature-dependent resistivity of each point on the equipment clamp satisfies the resistivity-temperature law equation described above.

[0069] (5) In the solid heat transfer physics field, select the current inflow and outflow sections and set their boundary conditions to thermal insulation. Select other surfaces and set their boundary conditions to heat flux. Heat transfer in solids satisfies the solid heat transfer equation above.

[0070] (6) In the surface-to-surface radiation physics field, select all surfaces of the clip and set their boundary conditions to diffuse reflection. Set the external radiation source according to the actual position of the sun, with an irradiance of S.

[0071] (7) In the multiphysics field, add electromagnetic heating calculations. In the coupling interface, select "Current" for electromagnetics and "Solid Heat Transfer" for heat transfer. In the multiphysics field, add surface-to-surface radiation heat transfer. In the coupling interface, select "Solid Heat Transfer" for heat transfer and "Surface-to-surface Radiation" for surface-to-surface radiation.

[0072] (8) In the Mesh Settings, select Free Tetrahedron Mesh to mesh the clip geometry. In the Mesh Cell Size Settings, calibrate the mesh cell size to normal physics.

[0073] (9) Set the solver to a steady-state process and start the calculation.

[0074] (10) After the calculation is completed, the temperature cloud map of the entire wire clamp is displayed through post-processing, and the maximum temperature on the surface of the wire clamp is displayed. The maximum temperature is recorded to complete the simulation.

[0075] Step S104 : Based on the clamp temperature distribution data, heat monitoring is performed on the clamp of the conductor device to be tested to obtain the maximum temperature of the clamp of the conductor device to be tested.

[0076] In this step, each wire clamp temperature distribution data corresponds to a combination of heating influencing parameters, so based on the actual current, ambient temperature and solar irradiance of the wire clamp of the conductor equipment to be tested, the corresponding wire clamp temperature distribution data is queried, and the maximum temperature of the wire clamp temperature distribution data is used as the maximum temperature of the wire clamp of the conductor equipment to be tested.

[0077] In some embodiments, step S104 includes:

[0078] Establishing a mapping relationship table between the clamp temperature distribution data and each combination of the heating influencing parameters;

[0079] Using the mapping relationship table, according to the actual current data, actual ambient temperature data and actual solar irradiance data corresponding to the wire clamp of the wire device to be tested, heat monitoring is performed on the wire clamp of the wire device to be tested to obtain target wire clamp temperature distribution data of the wire device to be tested;

[0080] The maximum temperature of the wire clamp of the conductor device to be tested is determined based on the target wire clamp temperature distribution data.

[0081] In this embodiment, to facilitate subsequent applications, a mapping relationship table between the temperature distribution data of the wire clamp and the combination of heating influencing parameters is established, thereby achieving rapid monitoring of subsequent applications and improving monitoring efficiency.

[0082] In order to implement the heating monitoring method of the conductor equipment clamp corresponding to the above method embodiment, to achieve the corresponding functions and technical effects. Figure 3 , Figure 3 The following is a block diagram of a heat monitoring device for a conductor equipment clamp provided by an embodiment of the present application. For ease of explanation, only the parts related to this embodiment are shown. The heat monitoring device for a conductor equipment clamp provided by an embodiment of the present application includes:

[0083] An acquisition module 301 is configured to acquire heat-influencing parameters of a conductor device clamp, wherein the heat-influencing parameters include a current range passing through the conductor device clamp, an ambient temperature range of an environment in which the conductor device clamp is located, and a solar irradiance range of an area in which the conductor device clamp is located;

[0084] A generating module 302 is configured to generate a plurality of heating influencing parameter combinations based on the current range, the ambient temperature range, and the solar irradiance range;

[0085] A calculation module 303 is configured to calculate temperature distribution data of the conductor equipment clamp under the combined effects of various heat-influencing parameters using a heat simulation model of the conductor equipment clamp, wherein the heat simulation model is a multi-physics field coupling model;

[0086] The monitoring module 304 is configured to perform heat monitoring on the wire clamp of the conductor device to be tested based on the wire clamp temperature distribution data, and obtain a maximum temperature of the wire clamp of the conductor device to be tested.

[0087] In some embodiments, the generating module 302 is configured to:

[0088] Dividing the current interval, the ambient temperature interval, and the solar irradiance interval into equal intervals to generate a current sequence, an ambient temperature sequence, and a solar irradiance sequence;

[0089] The current data in the current sequence, the ambient temperature data in the ambient temperature sequence, and the solar irradiance data in the solar irradiance sequence are randomly combined to generate a plurality of heating influencing parameter combinations.

[0090] In some embodiments, the calculation module 303 is configured to:

[0091] Obtaining the clamp parameters of the conductor equipment clamp and the air parameters of the area where the conductor equipment clamp is located;

[0092] Using a preset steady-state solver, the multi-physics field coupling model is solved according to the combination of the wire clamp parameters, the air parameters and the heat influencing parameters to obtain the wire clamp temperature distribution data of the wire clamp of the conductor equipment under the action of each combination of the heat influencing parameters. The multi-physics field coupling model includes the current physics field, the solid heat transfer physics field and the surface-to-surface radiation physics field.

[0093] In some embodiments, the current physical field satisfies the resistivity-temperature law equation:

[0094]

[0095] Where σ is the conductivity at ambient temperature T, ρ0 is the resistivity at ambient temperature 0°C, α is the temperature coefficient of resistivity, and T Ave It is the actual surface temperature of the wire clamp of the conductor equipment.

[0096] In some embodiments, the solid heat transfer physics field satisfies the solid heat transfer equation:

[0097]

[0098] Where ρ is the density of the wire clamp of the conductor equipment, C p is the solid heat capacity of the wire clamp at atmospheric pressure p, temperature T and time t, u is the translational motion velocity, q is the heat flux, k is the solid thermal conductivity, and Q is the heat source.

[0099] In some embodiments, the radiation objects of the surface-to-surface radiation physical field are all surfaces of the wire device clamps, the boundary conditions are diffuse reflection surfaces, the radiation source is the sun, and the irradiance is the solar irradiance data in the heat influencing parameter combination.

[0100] In some embodiments, the monitoring module 304 is configured to:

[0101] Establishing a mapping relationship table between the clamp temperature distribution data and each combination of the heating influencing parameters;

[0102] Using the mapping relationship table, according to the actual current data, actual ambient temperature data and actual solar irradiance data corresponding to the wire clamp of the wire device to be tested, heat monitoring is performed on the wire clamp of the wire device to be tested to obtain target wire clamp temperature distribution data of the wire device to be tested;

[0103] The maximum temperature of the wire clamp of the conductor device to be tested is determined based on the target wire clamp temperature distribution data.

[0104] The aforementioned heat monitoring device for a conductor device clamp can implement the heat monitoring method for a conductor device clamp described in the aforementioned method embodiment. The optional options in the aforementioned method embodiment also apply to this embodiment and will not be described in detail here. The remaining contents of the present application embodiment can be referenced to the contents of the aforementioned method embodiment and will not be further described in this embodiment.

[0105] Figure 4 This is a schematic diagram of the structure of a computer device provided in one embodiment of the present application. Figure 4 As shown, the computer device 4 of this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown in the figure) a processor, a memory 41, and a computer program 42 stored in the memory 41 and executable on the at least one processor 40, wherein the processor 40 implements the steps of any of the above method embodiments when executing the computer program 42.

[0106] The computer device 4 may be a computing device such as a smart phone, a tablet computer, a desktop computer, or a cloud server. The computer device may include but is not limited to a processor 40 and a memory 41. It will be understood by those skilled in the art that Figure 4This is merely an example of the computer device 4 and does not constitute a limitation on the computer device 4 . The computer device 4 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the computer device 4 may also include input and output devices, network access devices, etc.

[0107] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0108] In some embodiments, the memory 41 may be an internal storage unit of the computer device 4, such as a hard disk or memory of the computer device 4. In other embodiments, the memory 41 may also be an external storage device of the computer device 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the computer device 4. Furthermore, the memory 41 may include both an internal storage unit of the computer device 4 and an external storage device. The memory 41 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or is about to be output.

[0109] In addition, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0110] An embodiment of the present application provides a computer program product. When the computer program product is run on a computer device, the computer device implements the steps in the above-mentioned various method embodiments when executing the computer program product.

[0111] In several embodiments provided in the present application, it is understood that each box in the flow chart or block diagram can represent a part of a module, program segment or code, and the part of the module, program segment or code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which depends on the functions involved.

[0112] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device to execute all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage media include: various media that can store program codes, such as USB flash drives, mobile hard drives, read-only memories (ROMs), random access memories (RAMs), magnetic disks or optical disks.

[0113] The specific embodiments described above further illustrate the objectives, technical solutions, and beneficial effects of this application. It should be understood that the above descriptions are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application by those skilled in the art should be included within the scope of protection of this application.

Claims

1. A method for monitoring heating of a wire clamp of a conductor equipment, characterized in that: include: Obtaining heating influence parameters of the conductor equipment clamp, the heating influence parameters including a current range passing through the conductor equipment clamp, an ambient temperature range of an environment in which the conductor equipment clamp is located, and a solar irradiance range of an area in which the conductor equipment clamp is located; generating a plurality of heating influencing parameter combinations based on the current interval, the ambient temperature interval, and the solar irradiance interval; Obtaining clamp parameters of the conductor equipment clamp and air parameters in the area where the conductor equipment clamp is located; using a preset steady-state solver, solving a multi-physics field coupling model based on the clamp parameters, the air parameters, and the combination of the heat influencing parameters to obtain clamp temperature distribution data of the conductor equipment clamp under the action of each combination of the heat influencing parameters, the multi-physics field coupling model including the current physics field, the solid heat transfer physics field, and the surface-to-surface radiation physics field; The current physical field satisfies the resistivity-temperature law equation: Where σ is the conductivity at ambient temperature T, ρ0 is the resistivity at ambient temperature 0°C, α is the temperature coefficient of resistivity, and T Ave is the actual surface temperature of the wire clamp of the conductor equipment; The solid heat transfer physics field satisfies the solid heat transfer equation: Where ρ is the density of the wire clamp of the conductor equipment, C p is the solid heat capacity of the wire clamp under atmospheric pressure p, temperature T and time t, u is the translational motion velocity, q is the heat flux, k is the solid thermal conductivity, and Q is the heat source; The radiation objects of the surface-to-surface radiation physical field are all surfaces of the wire clamp of the conductor equipment, the boundary condition is a diffuse reflection surface, the radiation source is the sun, and the irradiance is the solar irradiance data in the heat influencing parameter combination; Based on the clamp temperature distribution data, heat monitoring is performed on the clamp of the conductor device to be tested to obtain the maximum temperature of the clamp of the conductor device to be tested.

2. The method for monitoring heating of a conductor equipment clamp according to claim 1, wherein: The generating of a plurality of heating influencing parameter combinations based on the current interval, the ambient temperature interval, and the solar irradiance interval includes: Dividing the current interval, the ambient temperature interval, and the solar irradiance interval into equal intervals to generate a current sequence, an ambient temperature sequence, and a solar irradiance sequence; The current data in the current sequence, the ambient temperature data in the ambient temperature sequence, and the solar irradiance data in the solar irradiance sequence are randomly combined to generate a plurality of heating influencing parameter combinations.

3. The method for monitoring heating of a conductor equipment clamp according to claim 1, wherein: The step of performing heat monitoring on the wire clamp of the conductor device to be tested based on the wire clamp temperature distribution data to obtain the maximum temperature of the wire clamp of the conductor device to be tested comprises: Establishing a mapping relationship table between the clamp temperature distribution data and each combination of the heating influencing parameters; Using the mapping relationship table, according to the actual current data, actual ambient temperature data and actual solar irradiance data corresponding to the wire clamp of the wire device to be tested, heat monitoring is performed on the wire clamp of the wire device to be tested to obtain target wire clamp temperature distribution data of the wire device to be tested; The maximum temperature of the wire clamp of the conductor device to be tested is determined based on the target wire clamp temperature distribution data.

4. A heating monitoring device for a conductor equipment clamp, characterized in that: include: an acquisition module, configured to acquire heat-influencing parameters of the conductor device clamp, the heat-influencing parameters including a current range passing through the conductor device clamp, an ambient temperature range of an environment in which the conductor device clamp is located, and a solar irradiance range of an area in which the conductor device clamp is located; a generating module, configured to generate a plurality of heating influencing parameter combinations based on the current interval, the ambient temperature interval, and the solar irradiance interval; A calculation module, used for obtaining the clamp parameters of the conductor equipment clamp and the air parameters in the area where the conductor equipment clamp is located; Using a preset steady-state solver, a multi-physics field coupling model is solved according to the clamp parameters, the air parameters, and the combination of the heat influencing parameters to obtain clamp temperature distribution data of the conductor equipment clamp under the action of each combination of the heat influencing parameters, wherein the multi-physics field coupling model includes a current physics field, a solid heat transfer physics field, and a surface-to-surface radiation physics field; The current physical field satisfies the resistivity-temperature law equation: Where σ is the conductivity at ambient temperature T, ρ0 is the resistivity at ambient temperature 0°C, α is the temperature coefficient of resistivity, and T Ave is the actual surface temperature of the wire clamp of the conductor equipment; The solid heat transfer physics field satisfies the solid heat transfer equation: Where ρ is the density of the wire clamp of the conductor equipment, C p is the solid heat capacity of the wire clamp under atmospheric pressure p, temperature T and time t, u is the translational motion velocity, q is the heat flux, k is the solid thermal conductivity, and Q is the heat source; The radiation objects of the surface-to-surface radiation physical field are all surfaces of the wire clamp of the conductor equipment, the boundary condition is a diffuse reflection surface, the radiation source is the sun, and the irradiance is the solar irradiance data in the heat influencing parameter combination; The monitoring module is used to perform heat monitoring on the wire clamp of the conductor device to be tested based on the wire clamp temperature distribution data to obtain the maximum temperature of the wire clamp of the conductor device to be tested.

5. A computer device, characterized in that: The method comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the method for monitoring the heating of a wire clamp of a conductor device according to any one of claims 1 to 3 is implemented.

6. A computer-readable storage medium, characterized in that It stores a computer program, which, when executed by a processor, implements the method for monitoring the heating of a wire clamp of a conductor device according to any one of claims 1 to 3.

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