Quantum dot film assembly, manufacturing method thereof, and LED package

Abstract

The present invention relates to a quantum dot film assembly, a manufacturing method thereof, and an LED package. By fixing the quantum dot film in the hollow area of the protective frame to obtain the quantum dot film assembly, the quantum dot film is surrounded by the protective frame, which plays a protective role for the quantum dot film, thereby reducing the adverse effects of the environment on the quantum dot film and improving the reliability of the quantum dot film. At the same time, the quantum dot film assembly can be directly fixed on a conventional bracket without relying on the concave steps on the bracket to support and surround the quantum dot film, and the application range of the quantum dot film assembly is relatively wide.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a quantum dot film component and a manufacturing method thereof, and an LED package. Background Art

[0002] The backlight module can be used to provide a surface light source for the display panel. As the market demand for high color gamut increases significantly, more and more quantum dot films are applied to the backlight module. By using blue light to excite quantum dots to produce mixed white light, the color gamut of the display panel is made wider. Since water vapor and oxygen in the air can easily cause adverse effects on quantum dots, the reliability of quantum dots is affected. At present, the prior art provides a solution for applying quantum dot membranes to LED light sources, in which the LED lamp beads mainly include brackets, LED chips, packaging glue and quantum dot membranes. And the structure of the bracket is improved, that is, a concave step is set on the top of the bracket, and the height of the concave step is adapted to the thickness of the quantum dot membrane, so that the edge of the quantum dot membrane can be set on the concave step of the bracket, and the quantum dot membrane is supported by the concave step of the bracket. At the same time, the quantum dot membrane is surrounded by the bracket, which can achieve the purpose of avoiding the adverse effects of water vapor and oxygen in the air on the quantum dot membrane as much as possible. Since the aforementioned scheme has some restrictions on the structure of the bracket, it is not suitable for the brackets commonly used in the market, and the application range is small.

[0003] Therefore, how to improve the reliability of quantum dot films so that they can be used with conventional LED brackets is an urgent problem to be solved. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present invention is to provide a quantum dot film assembly and its manufacturing method, and an LED package, aiming to solve the technical problem in the prior art that it is impossible to apply the quantum dot film to a conventional LED while ensuring the reliability of the quantum dot film.

[0005] The present invention provides a quantum dot film assembly, which is configured to be arranged on the open end of the dam of a bracket to obtain an LED package, and the quantum dot film assembly includes:

[0006] A protection frame, wherein the middle area of ​​the protection frame is a hollow area;

[0007] A quantum dot film, wherein the quantum dot film is disposed in the hollow area, and the shape and size of the quantum dot film are configured to match the shape and size of the open end of the dam; the protective frame and the quantum dot film respectively have a top surface and a bottom surface that are arranged oppositely, and the bottom surfaces of the protective frame and the quantum dot film are both facing the open end of the dam;

[0008] A light-transmitting adhesive layer, which is filled in the hollow area to fixedly connect the quantum dot film and the protection frame.

[0009] In the quantum dot film assembly provided by the present invention, by arranging the quantum dot film to be fixed in the hollow area of the protection frame, and surrounding the quantum dot film with the protection frame, it plays a protective role for the quantum dot film, thereby reducing the adverse effects of the environment on the quantum dot film and improving the reliability of the quantum dot film; at the same time, the quantum dot film assembly can be directly fixed on a conventional bracket without relying on the concave step on the bracket to support and surround the quantum dot film, so the application range of the quantum dot film assembly is relatively wide.

[0010] Optionally, the light-transmitting adhesive layer is a light-transmitting glue layer; the bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protection frame; or, the bottom surface of the light-transmitting glue layer extends out of the protection frame and covers the bottom surfaces of the protection frame and the quantum dot film.

[0011] In the quantum dot film assembly provided by the present invention, the light-transmitting adhesive layer is further set as a light-transmitting glue layer, and the bottom surface of the light-transmitting glue layer is set to be flush with the bottom surface of the protection frame, or the light-transmitting glue layer covers the bottom surfaces of the protection frame and the quantum dot film. While satisfying the fixation connection of the quantum dot film and the protection frame by using the light-transmitting glue layer, the flexibility of the structural setting of the light-transmitting glue layer is increased, the application scenarios are expanded, and the adaptability is improved.

[0012] Optionally, the top surface of the light-transmitting glue layer is flush with the top surface of the protection frame; or, the top surface of the light-transmitting glue layer extends out of the protection frame and covers the top surfaces of the protection frame and the quantum dot film.

[0013] In the quantum dot film assembly provided by the present invention, the top surface of the light-transmitting glue layer can be further set to be flush with the top surface of the protection frame, or the light-transmitting glue layer covers the top surfaces of the protection frame and the quantum dot film. While satisfying the fixation connection of the quantum dot film and the protection frame by using the light-transmitting glue layer, the flexibility of the structural setting of the light-transmitting glue layer is increased, the application scenarios are expanded, and the adaptability is improved.

[0014] Optionally, the inner surface of the protection frame is a light-reflecting surface.

[0015] In the quantum dot film assembly provided by the present invention, the inner surface of the protection frame can be set as a light-reflecting surface to improve the luminous brightness of the LED product.

[0016] Optionally, the top surface of the light-transmitting adhesive layer extends out of the protection frame and covers the top surfaces of the protection frame and the quantum dot film. A first groove communicating with the top surface of the protection frame is provided in the area where the light-transmitting adhesive layer covers the top surface of the protection frame. The quantum dot film assembly further includes a first reflective layer disposed in the first groove; and / or, the bottom surface of the light-transmitting adhesive layer extends out of the protection frame and covers the bottom surfaces of the protection frame and the quantum dot film. A second groove communicating with the bottom surface of the protection frame is provided in the area where the light-transmitting adhesive layer covers the bottom surface of the protection frame. The quantum dot film assembly further includes a second reflective layer disposed in the second groove.

[0017] For the quantum dot film assembly provided by the present invention, a reflective layer may further be provided in the area where the light-transmitting adhesive layer covers the top surface or the bottom surface of the protection frame, so as to further improve the light-emitting brightness of the LED product.

[0018] Optionally, the bottom surface of the light-transmitting adhesive layer is flush with the bottom surface of the protection frame. The quantum dot film assembly further includes a first fixing post disposed on the bottom surface of the protection frame, and the first fixing post is configured to be fixedly connected to a first fixing hole on the open end of the dam; or, the quantum dot film assembly further includes a second fixing post disposed on the bottom surface of the light-transmitting adhesive layer, and the second fixing post is configured to be fixedly connected to a second fixing hole on the open end of the dam.

[0019] For the quantum dot film assembly provided by the present invention, fixing posts may further be provided on the bottom surface of the protection frame or the light-transmitting adhesive layer, so that the quantum dot film assembly can maintain a certain distance from the bracket, thereby adjusting the chromaticity of the light emitted by the LED package.

[0020] Optionally, the thickness of the quantum dot film is equal to the thickness of the protection frame, and the top surface and the bottom surface of the quantum dot film are respectively flush with the top surface and the bottom surface of the protection frame.

[0021] For the quantum dot film assembly provided by the present invention, the thickness of the quantum dot film may also be set to be equal to the thickness of the protection frame, and the formed quantum dot film assembly is relatively thin and light.

[0022] Optionally, the thickness of the quantum dot film is less than the thickness of the protection frame, and the bottom surface of the quantum dot film is flush with the bottom surface of the protection frame; or, the top surface of the protection frame is higher than the top surface of the quantum dot film, and the bottom surface of the quantum dot film is higher than the bottom surface of the protection frame.

[0023] For the quantum dot film assembly provided by the present invention, the thickness of the protection frame may also be set to be greater than the thickness of the quantum dot film, which helps the protection frame to better protect the quantum dot film.

[0024] Based on the same inventive concept, the present invention further provides an LED package, which includes any one of the quantum dot film assemblies described above, and further includes an LED chip and a bracket; wherein, the bracket includes a dam with an open end; the LED chip is disposed in the accommodating cavity of the dam; the quantum dot film assembly is disposed on the dam, and the quantum dot film of the quantum dot film assembly covers the open end of the dam.

[0025] For the LED package provided by the present invention, by using the quantum dot film assembly in combination with a conventional bracket, the adaptability is better and the application range is wider.

[0026] Based on the same inventive concept, the present invention further provides a manufacturing method for any one of the quantum dot film assemblies described above, including:

[0027] Providing a protective frame with a hollowed-out area and a quantum dot film;

[0028] Disposing the quantum dot film in the hollowed-out area, and injecting glue into the hollowed-out area to fixedly connect the quantum dot film with the protective frame.

[0029] For the quantum dot film assembly formed by the manufacturing method provided by the present invention, the reliability of the quantum dot film is ensured, and it is suitable for being used in combination with a conventional bracket, with better adaptability and a wider application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The top view of the quantum dot film assembly provided by an optional embodiment of the present invention;

[0031] Figure 2 The A-A cross-section of the quantum dot film assembly provided by an optional embodiment of the present invention Figure 1 ;

[0032] Figure 3 The structural schematic diagram of the quantum dot film provided by an optional embodiment of the present invention Figure 1 ;

[0033] Figure 4 The structural schematic diagram of the quantum dot film provided by an optional embodiment of the present invention Figure 2 ;

[0034] Figure 5 The structural schematic diagram of the quantum dot film provided by an optional embodiment of the present invention Figure 3 ;

[0035] Figure 6 The A-A cross-section of the quantum dot film assembly provided by an optional embodiment of the present invention Figure 2 ;

[0036] Figure 7A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 3 ;

[0037] Figure 8 A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 4 ;

[0038] Figure 9 A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 5 ;

[0039] Figure 10 A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 6 ;

[0040] Figure 11 A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 7 ;

[0041] Figure 12 A-A cross-section of the quantum dot film assembly provided by an alternative embodiment of the present invention Figure 8 ;

[0042] Figure 13 Schematic structural diagram when the thickness of the quantum dot film and the protective frame provided by an alternative embodiment of the present invention are equal;

[0043] Figure 14 Schematic structure when the thickness of the quantum dot film and the protective frame provided by an alternative embodiment of the present invention are not equal Figure 1 ;

[0044] Figure 15 Schematic structure when the thickness of the quantum dot film and the protective frame provided by an alternative embodiment of the present invention are not equal Figure 2 ;

[0045] Figure 16 Top view of the LED package provided by an alternative embodiment of the present invention;

[0046] Figure 17 B-B cross-sectional view of the LED package provided by an alternative embodiment of the present invention;

[0047] Figure 18 Top view of the backlight module provided by an alternative embodiment of the present invention;

[0048] Figure 19 C-C cross-sectional view of the backlight module provided by an alternative embodiment of the present invention;

[0049] Figure 20 Flow chart of the manufacturing method of the quantum dot film assembly provided by another alternative embodiment of the present invention;

[0050] Figure 21 Schematic diagram of the process of the manufacturing method of the quantum dot film assembly provided in another alternative embodiment of the present invention;

[0051] Figure 22 Bottom view of the protective layer when the first fixing post is provided in an alternative embodiment of the present invention;

[0052] Figure 23 Bottom view of the protective layer when the second fixing post is provided in another alternative embodiment of the present invention;

[0053] Explanation of reference numerals in the drawings:

[0054] 100 - LED package; 10 - quantum dot film assembly; 11 - protective frame; 12 - quantum dot film; 13 - light - transmissive adhesive layer; 20 - LED chip; 30 - bracket; 31 - dam; 32 - positive electrode substrate; 33 - negative electrode substrate; 141 - first reflective layer; 142 - second reflective layer; 151 - first fixing post; 152 - second fixing post; 200 - backlight module; 40 - driving substrate; 50 - lens; 51 - lens part; 52 - support part; 110 - protective layer; 111 - hollowed - out area. Detailed implementation manners

[0055] For ease of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present invention can be understood more thoroughly and comprehensively.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0057] An alternative embodiment of the present invention:

[0058] Please refer to Figure 1 and Figure 17 , the present invention provides a quantum dot film assembly 10, which is configured to be disposed on the open end of the dam 31 of the bracket 30 to obtain an LED package 100. The quantum dot film assembly 10 includes:

[0059] A protective frame 11, and the middle area of the protective frame 11 is a hollowed - out area;

[0060] Quantum dot film 12 is disposed in the hollowed-out area, and the shape and size of the quantum dot film 12 are configured to be adapted to the shape and size of the open end of the dam 31; the protective frame 11 and the quantum dot film 12 each have a top surface and a bottom surface that are oppositely arranged, and the bottom surfaces of the protective frame 11 and the quantum dot film 12 are both the sides facing the open end of the dam 31;

[0061] Light-transmitting adhesive layer 13, and the light-transmitting adhesive layer 13 is filled in the hollowed-out area to fixedly connect the quantum dot film 12 and the protective frame 11.

[0062] It can be seen that for the quantum dot film assembly 10 provided by the present invention, by arranging the quantum dot film 12 to be fixed in the hollowed-out area of the protective frame 11 and surrounding the quantum dot film 12 with the protective frame 11, it plays a protective role for the quantum dot film 12, thereby reducing the adverse effects of the environment on the quantum dot film 12 and improving the reliability of the quantum dot film 12; at the same time, the quantum dot film assembly 10 can be directly fixed on a conventional bracket 30 without relying on the concave step on the bracket 30 to support and surround the quantum dot film 12, and the application range of the quantum dot film assembly 10 is relatively wide.

[0063] In this embodiment, the material of the protective frame 11 is not limited. By way of example, the protective frame 11 can be a white protective frame or a transparent protective frame. When a white protective frame is selected, the inner surface of the protective frame 11 is a light-reflecting surface, and the protective frame 11 can also be used to block light, so that more light converges to the light-emitting surface and is emitted, which is beneficial to improving the light-emitting brightness.

[0064] In this embodiment, the quantum dot film 12 generally includes two layers of transparent protective films and a quantum dot layer located between the two layers of transparent protective films, and the quantum dot layer can include at least one of red quantum dots and green quantum dots. In actual applications, the quantum dot film can be made into sheets or rolls, and can be cut or trimmed according to the required size during use. To ensure that the quantum dot film can be used to cover the open end of the dam 31, the shape and size of the quantum dot film 12 can be set to be adapted to the shape and size of the open end of the dam 31. At the same time, the shape of the quantum dot film 12 can be various. By way of example, the shape of the quantum dot film 12 can be but is not limited to circular, oval, rectangular, diamond-shaped or other irregular shapes, etc. It can also be referred to together Figures 3 to 5 , as Figure 3 shown, the shape of the quantum dot film 12 is circular. Another example is Figure 4 shown, the shape of the quantum dot film 12 is rectangular. Another example is Figure 5 shown, the shape of the quantum dot film 12 is diamond-shaped.

[0065] In this embodiment, the material of the light-transmitting adhesive layer 13 is not limited. In some exemplary embodiments, an opaque material is selected for the light-transmitting adhesive layer 13. At this time, the light-transmitting adhesive layer 13 can be filled only between the side surface of the quantum dot film and the inner wall of the protective frame, so as to fixedly connect the quantum dot film 12 and the protective frame 11. In other exemplary embodiments, a transparent material is selected for the light-transmitting adhesive layer 13. At this time, the light-transmitting adhesive layer 13 is not only filled between the side surface of the quantum dot film 12 and the inner wall of the protective frame, but also can be filled in other areas.

[0066] It can be understood that when the light-transmitting adhesive layer 13 is a light-transmitting glue layer, there are various situations for the setting position of the light-transmitting glue layer relative to the protective frame 11 and the quantum dot film 12. For example, the bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protective frame 11; for another example, the bottom surface of the light-transmitting glue layer extends out of the protective frame 11 and covers the bottom surfaces of the protective frame 11 and the quantum dot film 12; for another example, the top surface of the light-transmitting glue layer is flush with the top surface of the protective frame 11; for another example, the top surface of the light-transmitting glue layer extends out of the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12. It can be understood that when setting the specific structure of the light-transmitting glue layer, any combination of several of the foregoing examples can be adopted. For the convenience of understanding, further elaboration will be made below in conjunction with the accompanying drawings. It should be understood that the application of the present invention is not limited to the subsequent examples.

[0067] Please refer to Figure 6 , the bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protective frame 11, and the top surface of the light-transmitting glue layer is flush with the top surface of the protective frame 11. When adopting this method, it is beneficial to obtain a relatively thin and light quantum dot film assembly 10.

[0068] Please refer to Figure 7 , the bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protective frame 11, and the top surface of the light-transmitting glue layer extends out of the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12. When adopting this method, the light-transmitting glue layer has relatively good coverage of the quantum dot film 12, and the bonding force between the light-transmitting glue layer and the protective frame 11 is also relatively good, and the top surface of the quantum dot film assembly 10 is a flat surface, and the top surface is flatter.

[0069] Please refer to Figure 8 , the top surface of the light-transmitting glue layer extends out of the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12, and the bottom surface of the light-transmitting glue layer extends out of the protective frame 11 and covers the bottom surfaces of the protective frame 11 and the quantum dot film 12. When adopting this method, the light-transmitting glue layer has better coverage of the quantum dot film 12, and the bonding force between the light-transmitting glue layer and the protective frame 11 is also better, and the top surface and the bottom surface of the quantum dot film assembly 10 are both flat surfaces, and the top surface and the bottom surface are flatter.

[0070] It can be seen that in this embodiment, the top surface and the bottom surface of the light-transmitting adhesive layer can be further set to be flush with the top surface and the bottom surface of the protection frame 11 respectively, and the light-transmitting adhesive layer covers the top surface and / or the bottom surface of the protection frame 11 and the quantum dot film 12. While satisfying the fixation connection of the quantum dot film 12 and the protection frame 11 by the light-transmitting adhesive layer, the flexibility of the structural setting of the light-transmitting adhesive layer is increased, the application scenarios are expanded, and the adaptability is improved.

[0071] In this embodiment, based on the specific structure of the light-transmitting adhesive layer described above, the quantum dot film assembly 10 can also be provided with a reflective layer to help improve the luminous brightness. In an exemplary embodiment, the top surface of the light-transmitting adhesive layer extends out of the protection frame 11 and covers the top surfaces of the protection frame 11 and the quantum dot film 12. The area of the top surface of the light-transmitting adhesive layer covering the top surface of the protection frame 11 is provided with a first groove communicating with the top surface of the protection frame 11. The quantum dot film assembly 10 further includes a first reflective layer 141 disposed in the first groove; and / or, the bottom surface of the light-transmitting adhesive layer extends out of the protection frame 11 and covers the bottom surfaces of the protection frame 11 and the quantum dot film 12. The area of the bottom surface of the light-transmitting adhesive layer covering the bottom surface of the protection frame 11 is provided with a second groove communicating with the bottom surface of the protection frame 11. The quantum dot film assembly 10 further includes a second reflective layer 142 disposed in the second groove. Please refer to Figure 9 , the top surface of the light-transmitting adhesive layer extends out of the protection frame 11 and covers the top surfaces of the protection frame 11 and the quantum dot film 12, and the bottom surface of the light-transmitting adhesive layer extends out of the protection frame 11 and covers the bottom surfaces of the protection frame 11 and the quantum dot film 12. The quantum dot film assembly 10 includes a first reflective layer 141 and a second reflective layer 142. It can be seen that in this embodiment, the area where the light-transmitting adhesive layer covers the top surface or the bottom surface of the protection frame can be further provided with a reflective layer to further improve the luminous brightness of the LED product.

[0072] In this embodiment, based on the specific structure of the light-transmitting adhesive layer described above, the quantum dot film assembly 10 can also be provided with fixing posts to help adjust the chromaticity of the light emitted by the LED package. The specific number of the fixing posts is not limited and can be 2, 3, 4 or other values. In some exemplary embodiments, please refer to Figure 10 , the bottom surface of the light-transmitting adhesive layer is flush with the bottom surface of the protection frame 11. The quantum dot film assembly 10 further includes a first fixing post 151 disposed on the bottom surface of the protection frame 11. The first fixing post 151 is configured to be fixedly connected to a first fixing hole on the open end of the dam 31. In other exemplary embodiments, please refer to Figures 11 to 12, the quantum dot film assembly 10 further includes a second fixing post 152 disposed on the bottom surface of the light-transmitting adhesive layer. The second fixing post 152 is configured to be fixedly connected to a second fixing hole on the open end of the dam 31. It can be seen that in this embodiment, a fixing post can be further provided on the bottom surface of the protective frame 11 or the light-transmitting adhesive layer, so that when the quantum dot film assembly 10 is disposed on the bracket 30, the fixing post can be used to achieve alignment and fixed connection with the fixing hole on the dam 31. At the same time, the quantum dot film assembly 10 can be held at a certain distance from the bracket 30 through the fixing post, thereby adjusting the distance between the quantum dot film assembly 10 and the LED chip to achieve the target emission chromaticity of the LED package.

[0073] In this embodiment, the thickness relationship between the quantum dot film 12 and the protective frame 11 is not limited. The thickness of the quantum dot film 12 can be set to be less than or equal to the thickness of the protective frame 11, or the thickness of the quantum dot film 12 can be set to be greater than or equal to the thickness of the protective frame 11. Based on the thickness relationship between the foregoing two, the height relationship between the top and bottom surfaces of the quantum dot film 12 and the top and bottom surfaces of the protective frame 11 can also be set. For ease of understanding, further elaboration will be made below in conjunction with the accompanying drawings. It should be understood that the application of the present invention is not limited to the subsequent examples.

[0074] Please refer to Figure 13 , the thickness of the quantum dot film 12 is equal to the thickness of the protective frame 11, and the top and bottom surfaces of the quantum dot film 12 are flush with the top and bottom surfaces of the protective frame 11 respectively. By setting the thickness of the quantum dot film 12 to be equal to the thickness of the protective frame 11, the formed quantum dot film assembly 10 is relatively thin and light.

[0075] Please refer to Figure 14 , the thickness of the quantum dot film 12 is less than the thickness of the protective frame 11, and the bottom surface of the quantum dot film 12 is flush with the bottom surface of the protective frame 11. By setting the thickness of the protective frame 11 to be greater than the thickness of the quantum dot film 12, it helps the protective frame 11 to better protect the quantum dot film 12.

[0076] Please refer to Figure 15 , the top surface of the protective frame 11 is higher than the top surface of the quantum dot film 12, and the bottom surface of the quantum dot film 12 is higher than the bottom surface of the protective frame 11. By setting the thickness of the protective frame 11 to be greater than the thickness of the quantum dot film 12 and the quantum dot film 12 is disposed in the middle, it helps the protective frame 11 to better protect the quantum dot film 12.

[0077] Please refer to together Figures 16 to 17, this embodiment also provides an LED package 100, which includes any one of the quantum dot film assemblies 10 described above, and further includes an LED chip 20 and a bracket 30. Among them, the bracket 30 includes a dam 31 with an open end; the LED chip 20 is disposed in the receiving cavity of the dam 31; the quantum dot film assembly 10 is disposed on the dam 31, and the quantum dot film 12 of the quantum dot film assembly 10 covers the open end of the dam 31. It can be seen that the LED package 100 provided in this embodiment uses the quantum dot film assembly 10 in combination with a conventional bracket 30, which has better adaptability and a wider application range.

[0078] It can be understood that the bracket 30 includes a dam 31, a positive electrode substrate 32 and a negative electrode substrate 33. The dam 31 is disposed on both the positive electrode substrate 32 and the negative electrode substrate 33 at the same time and surrounds the positive electrode substrate 32 and the negative electrode substrate 33. At this time, the dam 31 and the positive electrode substrate 32 and the negative electrode substrate 33 form a bowl-shaped structure, and the dam 31 has an open end and a receiving cavity. The LED chip 20 is disposed in the receiving cavity of the dam 31 and is in contact with the positive electrode substrate 32 and / or the negative electrode substrate 33. The bracket 30 may further include a packaging glue, and the packaging glue is also disposed in the receiving cavity of the dam 31 and covers the LED chip 20 to protect the LED chip 20. This LED chip 20 is a blue LED chip. The type of the packaging glue is not limited. By way of example, the packaging glue may be, but is not limited to, a transparent packaging glue, a packaging glue containing red phosphor, or a packaging glue containing green phosphor. Based on the foregoing introduction, the quantum dots in the quantum dot film 12 may include at least one of red quantum dots and green quantum dots. In practical applications, in order to enable the LED package 100 to generate mixed white light, a blue LED chip may be selected and used in combination with a transparent packaging glue and a quantum dot film 12 containing red and green quantum dots, or a blue LED chip may be selected and used in combination with a packaging glue containing red phosphor and a quantum dot film 12 containing green quantum dots, or a blue LED chip may be selected and used in combination with a packaging glue containing green phosphor and a quantum dot film 12 containing red quantum dots.

[0079] It can also be understood that fixing holes may be provided at the top of the bracket 30 for fixedly connecting with the fixing posts on one side of the quantum dot film assembly 10, so that there is a certain distance between the quantum dot film 12 in the LED package 100 and the open end of the dam 31, increasing the distance between the quantum dot film 12 and the LED chip 20, further reducing the adverse effects of the heat generated by the LED chip 20 on the quantum dots, and at the same time realizing the adjustment of the emission chromaticity.

[0080] Please refer to Figures 18 to 19, this embodiment also provides a backlight module 200, which includes a driving substrate 40 and a plurality of LED packages 100 disposed on the driving substrate 40. It can be understood that the LED packages 100 in the backlight module 200 are any of the types described above, and the specific structure of the LED packages 100 will not be elaborated here.

[0081] It can be understood that to adjust the light-emitting angle of the backlight module 200, the backlight module 200 may further include a plurality of lenses 50 disposed on the driving substrate 40, and one lens 50 corresponds to one LED package 100. It can also be set that the lens 50 includes a lens portion 51 and a support portion 52; wherein, the lens portion 51 is in a spherical convex shape, and the support portion 52 is fixedly connected to the lens portion 51, and the two cooperate to form a receiving cavity. Since the support portion 52 of the lens 50 is fixedly connected to the driving substrate 40, and the LED package 100 is placed in the receiving cavity of the lens 50, so as to realize that the lens 50 covers the corresponding LED package 100. The height of the support portion 52 can also be flexibly set. For example, the height of the support portion 52 can be set to be equal to the height of the LED package 100, or the height of the support portion 52 can be set to be appropriately greater than the height of the LED package 100. The latter increases the distance between the lens portion 51 and the LED package 100, which helps to improve the light-emitting uniformity of the backlight module 200.

[0082] This embodiment also provides a display device, which includes any of the backlight modules described above. The display device of this embodiment can be applied to terminals such as televisions, monitors, or mobile phones.

[0083] Another optional embodiment of the present invention:

[0084] Please refer to Figure 20 , this embodiment also provides a manufacturing method of a quantum dot film assembly, including:

[0085] S101. Provide a protective frame with a hollow area and a quantum dot film;

[0086] S102. Place the quantum dot film in the hollow area, and inject glue into the hollow area to fixedly connect the quantum dot film and the protective frame.

[0087] The quantum dot film assembly formed by the foregoing manufacturing method ensures the reliability of the quantum dot film, is suitable for being used in combination with a conventional bracket, has better adaptability, and a wider application range.

[0088] In this embodiment, to save time costs, the quantum dot film assembly can also be mass-produced. For easy understanding, the following introduces a manufacturing method of the quantum dot film assembly in a specific application scenario. Please refer to Figure 21 , this method includes the following steps:

[0089] S201 , providing a protection layer 110 , wherein the protection layer 110 includes a plurality of protection frames 11 connected in sequence, and the middle area of ​​each protection frame 11 is a hollow area 111 .

[0090] S202 , providing a plurality of quantum dot films 12 , and fixing each quantum dot film 12 in the corresponding hollow area 111 of the protection frame 11 .

[0091] S203 , cutting the protective layer 110 provided with a plurality of quantum dot films 12 to obtain a quantum dot film assembly 10 .

[0092] It is understandable that in the above S201, the material of the protective layer 110 is not limited, and the protective layer 110 can be a white protective layer or a transparent protective layer. In addition, the shape of the hollow area 111 of each protective frame 11 can be the same as or different from the shape of the quantum dot film 12, and the size of the hollow area 111 of each protective frame 11 needs to be larger than the size of the quantum dot film unit 302 to reserve a position for glue, thereby facilitating the subsequent combination of the quantum dot film 12 and the protective layer 110 to form a whole. In addition, the thickness of the protective layer 110 can be the same as or different from the thickness of the quantum dot film 12.

[0093] It can also be understood that in the above S202, glue is injected into the hollow area 111 of the protection frame 11 to form a light-transmitting adhesive layer, and the quantum dot film is fixedly connected to the protection frame through the light-transmitting adhesive layer. Based on the introduction of an optional embodiment of the present invention, the light-transmitting adhesive layer can be a light-transmitting glue layer. Please refer to Figure 22 The bottom and top surfaces of the light-transmitting adhesive layer can be set flush with the bottom and top surfaces of the protection frame 11, respectively. The bottom surface of the protection frame 11 is provided with a first fixing column 151. Please refer to Figure 23 , the bottom and top surfaces of the light-transmitting adhesive layer may be arranged to extend out of the protective frame 11, and cover the bottom and top surfaces of the protective frame 11 and the quantum dot film 12 respectively. A second fixing column 152 is provided on the bottom surface of the light-transmitting adhesive layer. This light-transmitting adhesive layer may be integrally formed with the second fixing column 152. In practical applications, it may not be limited to forming the light-transmitting adhesive layer and the fixing column by dispensing or molding processes. When the light-transmitting adhesive layer formed by the molding process can cover the bottom surface of the protective frame 11, part of the light-transmitting adhesive layer may be subsequently cut off so that the light-transmitting adhesive layer covers the bottom surface of the protective frame 11, and a groove communicating with the bottom surface of the protective frame 11 is provided, and then white glue is injected into the aforementioned groove by the molding process to form a reflective layer.

[0094] The LED package provided in the foregoing embodiments can be applied to various lighting fields. In addition to being made into a backlight module and applied to the display backlight field as described above (which can be the backlight module of terminals such as TVs, monitors, mobile phones, etc.), it can also be applied to the automotive field and the like. When applied to the automotive field, it can be made into automotive headlights, automotive indicator lights, etc. The above applications are only several applications exemplified in this embodiment. It should be understood that the application of the LED in this embodiment is not limited to the several fields exemplified above.

[0095] It should be understood that the application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present invention.

Claims

1. A quantum dot film component, the quantum dot film component being configured to be disposed on an open end of a dam of a bracket to obtain an LED package, characterized in that, The quantum dot film assembly includes: A protective frame, the middle area of the protective frame being a hollow area; A quantum dot film, the quantum dot film being disposed in the hollow area, and the shape and size of the quantum dot film being configured to be adapted to the shape and size of the open end of the dam; the protective frame and the quantum dot film respectively have a top surface and a bottom surface disposed opposite to each other, and the bottom surfaces of the protective frame and the quantum dot film are both the surfaces facing the open end of the dam; A light-transmitting adhesive layer, the light-transmitting adhesive layer filling the hollow area to fixedly connect the quantum dot film and the protective frame; The inner surface of the protective frame is a light-reflecting surface; the light-transmitting adhesive layer is a light-transmitting glue layer; The top surface of the light-transmitting glue layer extends out of the protective frame and covers the top surfaces of the protective frame and the quantum dot film. A first groove communicating with the top surface of the protective frame is provided in the area where the light-transmitting glue layer covers the top surface of the protective frame. The quantum dot film assembly further includes a first reflective layer disposed in the first groove; And / or The bottom surface of the light-transmitting glue layer extends out of the protective frame and covers the bottom surfaces of the protective frame and the quantum dot film. A second groove communicating with the bottom surface of the protective frame is provided in the area where the light-transmitting glue layer covers the bottom surface of the protective frame. The quantum dot film assembly further includes a second reflective layer disposed in the second groove.

2. The quantum dot film assembly according to claim 1, wherein When only the top surface of the light-transmitting glue layer extends out of the protective frame, the bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protective frame.

3. The quantum dot film assembly according to claim 1, wherein When only the bottom surface of the light-transmitting glue layer extends out of the protective frame, the top surface of the light-transmitting glue layer is flush with the top surface of the protective frame.

4. The quantum dot film assembly according to claim 1 or 2, characterized in that, The bottom surface of the light-transmitting glue layer is flush with the bottom surface of the protective frame. The quantum dot film assembly further includes a first fixing post disposed on the bottom surface of the protective frame. The first fixing post is configured to be fixedly connected to a first fixing hole on the open end of the dam, so that the quantum dot film assembly is kept at a certain distance from the bracket through the first fixing post, so that the quantum dot film assembly and the LED in the bracket are kept at a distance, and the target luminous chromaticity of the LED package is achieved.

5. The quantum dot film assembly according to any one of claims 1-3, characterized in that The quantum dot film assembly further includes a second fixing post disposed on the bottom surface of the light-transmitting glue layer. The second fixing post is configured to be fixedly connected to a second fixing hole on the open end of the dam, so that the quantum dot film assembly is kept at a certain distance from the bracket through the second fixing post, so that the quantum dot film assembly and the LED in the bracket are kept at a distance, and the target luminous chromaticity of the LED package is achieved.

6. The quantum dot film assembly according to any one of claims 1-3, characterized in that, The thickness of the quantum dot film is equal to the thickness of the protective frame, and the top surface and the bottom surface of the quantum dot film are respectively flush with the top surface and the bottom surface of the protective frame.

7. The quantum dot film assembly according to any one of claims 1-3, characterized in that The thickness of the quantum dot film is less than the thickness of the protective frame; The bottom surface of the quantum dot film is flush with the bottom surface of the protective frame; Or, the top surface of the protective frame is higher than the top surface of the quantum dot film, and the bottom surface of the quantum dot film is higher than the bottom surface of the protective frame.

8. An LED package, characterized in that, It includes a quantum dot film component as described in any one of claims 1-7, and further includes an LED chip and a bracket; wherein, the bracket includes a dam having an open end; the LED chip is disposed in the accommodating cavity of the dam; the quantum dot film component is disposed on the dam, and the quantum dot film of the quantum dot film component covers the open end of the dam.

9. A method for manufacturing a quantum dot film assembly according to any one of claims 1-7, characterized in that, It includes: providing a protective frame having a hollowed-out area and a quantum dot film; disposing the quantum dot film in the hollowed-out area, and injecting glue into the hollowed-out area to fixedly connect the quantum dot film with the protective frame.

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