A glue - pasting machine for chip capacitors

Abstract

The present invention discloses a glue pasting machine for chip capacitors in the technical field of capacitor glue pasting, which includes a glue film cutting device, a loading suction cup, a discharging suction cup, a glue pressing and pasting mechanism, a glue application reel, a film winding reel and a frame. The frame is sequentially provided with a flat raw material rack, a docking rack, a glue pressing rack and a finished product rack from front to back. The raw material rack, the docking rack, the glue pressing rack and the finished product rack are all horizontally arranged. The raw material rack and the finished product rack are vertically liftable and installed on the frame, which can automatically apply film to the chip capacitors. The glue film can be easily passed through and spread out, effectively avoiding the mutual adhesion of the glue films. Moreover, it does not require manual operation by humans, can complete the spreading of the glue film by itself, and can automatically and neatly cut the glue film along the gaps between the chip capacitors. At the same time, the positioning of each chip capacitor is more accurate, and the chip capacitors are pressed stably during cutting, effectively avoiding the sliding of the blade and damaging the chip capacitors.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitor gluing, and particularly to a gluing machine for chip capacitors. Background Art

[0002] After the production of miniature chip capacitors, it is necessary to glue them for protection to avoid internal damage. Such capacitor chips are generally sheet-like structures. After gluing, subsequent processing processes are required, and finally, such large sheet-like capacitor chips are cut into tiny capacitor chip grains. Such subsequent processing processes require the chips to be transported and processed by other equipment. Therefore, it is necessary to attach a protective film to the chip capacitors for protection during processing.

[0003] For the convenience of transportation and use, such protective films for chip capacitors are almost all in the form of rolls. When being used for lamination, the film needs to be spread out, and then the adhesive surface of the film is laminated on the surface of the chip capacitor, aligned for sealing and protection. After gluing each chip capacitor, it is also necessary to use a blade to cut and separate the tape between the boards, and the blade must not touch the chip capacitor during cutting to avoid damaging the capacitor product. Currently, the above operations can be performed manually or by machine production. Manual operation has low efficiency, and when manually gluing, it is often easy to paste it crooked, which will cause the film to arch, resulting in the film not fitting well with the capacitor, and affecting the processing efficiency and quality during subsequent processing.

[0004] There are also relatively few automatic gluing machines, which use a roller to tear and press a film to laminate the film on the surface of the capacitor. Such equipment is very simple. When gluing, there is a high possibility that due to the sliding of the capacitor, the position is not at the set origin, resulting in misalignment of the chip capacitor during clamping, and there is a possibility of scratching or cutting the capacitor during cutting. Often, many steps still require manual correction and constant supervision of the equipment operation, resulting in low automation. Not only the production efficiency is not effectively improved, but also the operation of the film passing through and being torn is more cumbersome. The film is easily attached to the equipment, easily torn, and difficult to pass through the roll, with cumbersome operation.

[0005] Based on this, the present invention designs a gluing machine for chip capacitors to solve the above problems. Summary of the Invention

[0006] The object of the present invention is to provide a glue - sticking machine for chip capacitors, which can automatically apply a film to chip capacitors with a highly automated structure. The glue film can be easily passed through and spread out, effectively avoiding the mutual adhesion of the glue films. Moreover, it does not require manual operation by humans, can complete the spreading of the glue film by itself, and can automatically and neatly cut the glue film along the gaps between the chip capacitors. At the same time, the positioning of each chip capacitor is more accurate, and during cutting, the chip capacitors are pressed stably, effectively avoiding the sliding of the blade from damaging the chip capacitors, which is more convenient for automatically applying glue to the chip capacitors and effectively avoiding damage to the chip capacitors.

[0007] The present invention is implemented as follows: A glue - sticking machine for chip capacitors, comprising:

[0008] A glue - film cutting device, a loading suction cup, an unloading suction cup, a glue - pressing and glue - applying mechanism, a glue - applying reel, a film - winding reel and a frame;

[0009] The frame is successively provided with a flat - plate - shaped raw - material rack, a docking rack, a glue - pressing rack and a finished - product rack from front to back, and the raw - material rack, the docking rack, the glue - pressing rack and the finished - product rack are all horizontally arranged; the raw - material rack and the finished - product rack are vertically liftable and installed on the frame;

[0010] Both the loading suction cup and the unloading suction cup are jigs with vacuum suction cups at the bottom. The loading suction cup and the unloading suction cup are independently installed on the frame. The loading suction cup can be lifted and translated between the raw - material rack and the docking rack, and the unloading suction cup can be lifted and translated between the glue - pressing rack and the finished - product rack;

[0011] The glue - pressing and glue - applying mechanism and the glue - film cutting device are arranged between the docking rack and the glue - pressing rack, and the glue - pressing and glue - applying mechanism is arranged at the front end of the glue - film cutting device;

[0012] The glue - pressing and glue - applying mechanism includes a glue - applying plate and a glue - pressing roller, and the glue - pressing roller can be lifted to release and press tightly above the glue - applying plate;

[0013] The glue - film cutting device includes a cutting table, a pressing block, a cutting lifting drive and a blade. The blade is horizontally and transversely slid on the cutting table, and the pressing block can be lifted to release and press tightly on the cutting table through the cutting lifting drive;

[0014] The glue - applying plate is connected to the rear end of the docking rack, the glue - applying plate is seamlessly connected to the front end of the cutting table, the cutting table is connected to the rear end of the glue - pressing rack, and the glue - applying plate, the docking rack, the cutting table and the glue - pressing rack are on the same horizontal plane;

[0015] Both the glue - applying reel and the film - winding reel are arranged inside the frame, and the glue - applying reel and the film - winding reel rotate synchronously.

[0016] Furthermore, the glue - applying plate is a horizontal flat plate, the glue - pressing roller is a rubber circular roller, a glue - pressing air cylinder is fixedly installed above the glue - applying plate, the glue - pressing air cylinder vertically expands and contracts, a glue - pressing and glue - applying support is arranged at the lower end of the glue - pressing air cylinder, both ends of the glue - pressing roller are horizontally rotatably installed below the glue - pressing and glue - applying support through bearings, the glue - pressing roller is horizontally arranged, and the rotation axis of the glue - pressing roller is parallel to the rear side edge of the docking frame;

[0017] The connection gap between the glue - applying plate and the docking frame is between 0.2 mm and 3.5 mm;

[0018] The connection gap between the cutting table and the glue - pressing frame does not exceed 1 mm.

[0019] Furthermore, the raw material rack is arranged at the front end of the machine frame. A raw material lifting motor is installed at the bottom of the raw material rack. The raw material lifting motor is stably installed inside the machine frame. A raw material bottom plate is arranged below the raw material rack. The raw material bottom plate is horizontally and stably installed on the machine frame. The raw material rack horizontally ascends and descends directly above the raw material bottom plate through the raw material lifting motor. A material - blocking rod is vertically arranged on the side edge of the raw material bottom plate. The material - blocking rod is a vertical long rod. A waist - shaped hole is opened on the side of the raw material bottom plate. The material - blocking rod is stably locked in the waist - shaped hole of the raw material bottom plate through a bolt and can be horizontally adjusted in position. The material - blocking rod vertically extends above the raw material rack, and the raw material rack is perpendicular to the plane where the raw material rack and the raw material bottom plate are located;

[0020] An upper - feeding suction cup is installed at the top of the upper - feeding lifting air cylinder. The telescopic end of the upper - feeding lifting air cylinder is vertically arranged. An upper - feeding translation guide rail is horizontally arranged on the machine frame. The upper - feeding translation guide rail is horizontally installed above the upper - feeding suction cup. The upper - feeding translation guide rail extends from the front side edge of the raw material rack to the rear side edge of the docking frame. The fixed end of the upper - feeding lifting air cylinder is installed and slides on the upper - feeding translation guide rail. The upper - feeding lifting air cylinder horizontally moves on the upper - feeding translation guide rail through a rodless air cylinder.

[0021] Furthermore, the docking frame is a rectangular flat plate. A stepped glue - applying edge is arranged at the rear side of the docking frame. The thickness of the glue - applying edge is less than half of the thickness of the docking frame. The bottom rear side of the glue - applying edge is an upward - rising inclined plane. The thickness of the front side of the glue - applying edge is greater than that of the rear side. The thickness of the front side of the glue - applying edge does not exceed 5 mm, and the thickness of the last side edge of the glue - applying edge does not exceed 1 mm;

[0022] A cylinder guide block, two limit rotating shafts and two plate - side limit rods are arranged at the bottom of the docking frame. A limit block is arranged on each of the left and right sides below the docking frame. Both limit blocks are fixedly installed on the machine frame. Below the docking frame, a flip - cover air cylinder is also installed. One end of the flip - cover air cylinder is connected to the machine frame, and the other end of the flip - cover air cylinder is rotatably connected to the cylinder guide block through a rotating shaft with a fixed position;

[0023] One of the limit rotation shafts is fixedly and rotatably installed on a limit block. The rotation axes of the two limit rotation shafts coincide, and the rotation axis of the limit rotation shaft is parallel to the front side edge of the docking frame. The docking frame is rotatably installed on the limit block through the limit rotation shaft;

[0024] Two plate-side limit rods are symmetrically arranged on the left and right sides at the bottom of the docking frame. The lower ends of the plate-side limit rods are wrapped with cylindrical buffer sleeves. A limit adjustment screw is installed on each limit block. The limit adjustment screw is threadedly locked on the limit block so that it can extend and lift. The upper end of the limit adjustment screw extends above the top of the limit block. A cylindrical buffer rubber sleeve is provided at the top of the limit adjustment screw. The two plate-side limit rods can be separated and respectively cover the two limit adjustment screws.

[0025] Further, the cutting film device includes a cutting table, a pressing block, anti-slip strips, a cutting lifting drive, a cutting slide rail cylinder shaft, a blade and a blade slide table;

[0026] The cutting slide rail cylinder shaft is horizontally fixed on the frame in the left-right direction. The cutting slide rail cylinder shaft is directly below the cutting table. The cutting table is a horizontally erected flat plate. The cutting table is tightly connected between the glue pasting plate and the glue pressing frame. A cutting slit is opened on the cutting table. The cutting slit is opened along the left-right direction of the cutting table. The width of the cutting slit in the front-back direction does not exceed 5 mm. The cutting slide rail cylinder shaft and the cutting slit are in the same vertical plane. The cutting slide rail cylinder shaft and the cutting slit are both perpendicular to the advancing direction of the film in the same horizontal plane. The blade slide table is horizontally slid on the cutting slide rail cylinder shaft through a cylinder. The blade is locked on the blade slide table by bolts. The top of the blade passes through the cutting slit and exposes above the cutting table;

[0027] The cutting lifting drive is stably erected directly above the cutting table. The pressing block is connected to the telescopic end of the cutting lifting drive. The cutting lifting drive drives the pressing block to lift above the cutting table. The bottom of the pressing block is horizontal. A cutting groove is horizontally opened at the bottom of the pressing block. The cutting groove and the cutting slit are in the same vertical plane. The cutting groove and the cutting slit have the same width in the front-back direction. Two anti-slip strips are further provided at the bottom of the pressing block. The two anti-slip strips are distributed on the front and rear sides of the cutting groove. The anti-slip strips are rubber strips. The anti-slip strips are parallel to the edge of the cutting groove. The height of the blade protruding above the cutting table is less than the height of the cutting groove.

[0028] Furthermore, a discharge translation guide rail is horizontally installed on the frame. A discharge lifting cylinder is installed at the top of the discharge suction cup. The discharge lifting cylinder vertically expands and contracts. The discharge suction cup is installed at the expansion and contraction end of the discharge lifting cylinder, and the fixed end of the discharge lifting cylinder is installed in the discharge translation guide rail;

[0029] The finished product rack is installed on the lifting slide rail. The lifting slide rail is installed inside the frame. A discharge lifting motor is also installed on the lifting slide rail. The discharge lifting motor drives the lifting of the finished product rack.

[0030] Furthermore, a plurality of tension rollers are arranged between the glue application reel and the film winding reel. The axes of the tension rollers are all horizontally arranged, and the tension rollers are all rubber rollers. The glue film between the glue application reel and the film winding reel is tightened by the tension rollers.

[0031] The beneficial effects of the present invention are as follows: 1. The present invention step by step carries and positions the four different states of the patch capacitor during glue application through the raw material rack, the docking rack, the glue pressing rack and the finished product rack, so that the patch capacitor can be smoothly glued, and an automated assembly line operation is formed step by step, with a high degree of automation in glue application;

[0032] 2. Through the positioning of the material blocking rod, and the lifting of the raw material rack does not affect the positioning, so that the device can position and carry each patch capacitor in multiple laminations, fix its position, with high precision in automated film pasting, not easy to be pasted crookedly, effectively avoiding the glue film from overlapping and sticking to the patch capacitor, and also avoiding the glue film from arching and not fitting during pasting;

[0033] 3. Through the flip-type docking rack, it can be conveniently opened to pull out and spread the glue film on the glue pressing rack, the glue pressing and pasting mechanism and the cutting table. The operation of spreading the glue film is very simple, without having to stretch out little by little from the gap, effectively avoiding the glue film from adhering to other positions of the equipment, with simple operation, and after the glue film is spread, the docking rack is closed. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below with reference to the accompanying drawings in conjunction with embodiments.

[0035] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 It is a schematic diagram of the overall structure shown inside the frame of the present invention;

[0037] Figure 3 It is a schematic diagram of the overall structure of the back inside the present invention;

[0038] Figure 4 It is a schematic diagram of the bottom structure of the docking rack of the present invention;

[0039] Figure 5 Schematic diagram of the top structure of the docking frame of the present invention;

[0040] Figure 6 Another perspective schematic diagram of the whole of the present invention;

[0041] Figure 7 Schematic diagram of the structure of the cutting film device of the present invention;

[0042] Figure 8 Schematic diagram of the structure of the film pressing and pasting mechanism of the present invention;

[0043] Figure 9 Side structure schematic diagram of the cutting film device of the present invention;

[0044] Figure 10 Schematic diagram of the structure of the cutting slide rail cylinder shaft of the present invention;

[0045] Figure 11 Schematic diagram of the structure of the raw material rack of the present invention.

[0046] In the drawings, the list of components represented by each reference numeral is as follows:

[0047] 1 - Cutting film device, 11 - Cutting table, 111 - Cutting seam, 12 - Pressing block, 13 - Anti - slip strip, 14 - Cutting groove, 15 - Cutting lifting drive, 16 - Cutting slide rail cylinder shaft, 17 - Blade, 18 - Blade slide, 2 - Loading suction cup, 21 - Raw material rack, 211 - Material blocking rod, 212 - Raw material lifting motor, 22 - Docking frame, 221 - Glue - applying edge, 222 - Flap cylinder, 223 - Limit block, 224 - Side - plate limit rod, 225 - Limit adjusting screw, 226 - Cylinder guide block, 227 - Limit rotating shaft, 23 - Loading lifting cylinder, 24 - Loading translation guide rail, 25 - Raw material bottom plate, 3 - Unloading suction cup, 31 - Film - pressing frame, 32 - Finished product rack, 33 - Unloading lifting cylinder, 34 - Unloading translation guide rail, 35 - Unloading lifting motor, 36 - Lifting slide rail, 4 - Film pressing and pasting mechanism, 41 - Pasting plate, 42 - Film - pressing roller, 43 - Film - pressing cylinder, 44 - Film pressing and pasting support, 5 - Winding reel, 51 - Glue - applying reel, 52 - Tensioning roller, 6 - Machine frame, 61 - Main switch. Detailed implementation manners

[0048] Please refer to Figures 1 to 11 As shown, the present invention provides a technical solution: A glue - applying machine for chip capacitors, comprising:

[0049] A cutting film device 1, a loading suction cup 2, an unloading suction cup 3, a film pressing and pasting mechanism 4, a glue - applying reel 51, a winding reel 5 and a machine frame 6;

[0050] The frame 6 is successively provided with a flat raw material rack 21, a docking rack 22, a rubber pressing rack 31 and a finished product rack 32 from front to back. The raw material rack 21, the docking rack 22, the rubber pressing rack 31 and the finished product rack 32 are all horizontally arranged. The raw material rack 21 and the finished product rack 32 are vertically liftable and installed on the frame 6.

[0051] The loading suction cup 2 and the unloading suction cup 3 are both jigs with vacuum suction cups at the bottom. The loading suction cup 2 and the unloading suction cup 3 are independently installed on the frame 6. The loading suction cup 2 can be lifted and translated between the raw material rack 21 and the docking rack 22. The unloading suction cup 3 can be lifted and translated between the rubber pressing rack 31 and the finished product rack 32.

[0052] The rubber pressing and pasting mechanism 4 and the cutting film device 1 are arranged between the docking rack 22 and the rubber pressing rack 31. The rubber pressing and pasting mechanism 4 is arranged at the front end of the cutting film device 1.

[0053] The rubber pressing and pasting mechanism 4 includes a pasting plate 41 and a rubber pressing roller 42. The rubber pressing roller 42 can be lifted and loosened to be tightly pressed directly above the pasting plate 41.

[0054] The cutting film device 1 includes a cutting table 11, a pressing block 12, a cutting lifting drive 15 and a blade 17. The blade 17 is horizontally and laterally slid on the cutting table 11. The pressing block 12 can be lifted and loosened to be tightly pressed on the cutting table 11 through the cutting lifting drive 15.

[0055] The pasting plate 41 is connected to the rear end of the docking rack 22. The pasting plate 41 is seamlessly connected to the front end of the cutting table 11. The cutting table 11 is connected to the rear end of the rubber pressing rack 31. The pasting plate 41, the docking rack 22, the cutting table 11 and the rubber pressing rack 31 are on the same horizontal plane.

[0056] The glue application reel 51 and the film winding reel 5 are both arranged inside the frame 6. The glue application reel 51 and the film winding reel 5 rotate synchronously. A PLC controller is arranged inside the frame 6.

[0057] The cutting film device 1, the loading suction cup 2, the unloading suction cup 3, the rubber pressing and pasting mechanism 4, the glue application reel 51 and the film winding reel 5 are all connected to the PLC controller. It can automatically apply film to the chip capacitors with a highly automated structure. The glue film can be easily passed through and spread out, effectively avoiding the mutual adhesion of the glue films. Moreover, it does not require manual operation by people, can automatically complete the spreading of the glue film, and can automatically and neatly cut the glue film along the gaps between the chip capacitors. At the same time, the positioning of each chip capacitor is more accurate, and the cutting presses the chip capacitors stably, effectively avoiding the sliding of the blade to damage the chip capacitors, making it more convenient to realize automatic glue application to the chip capacitors and effectively avoiding the damage of the chip capacitors.

[0058] Among them, the glue - sticking plate 41 is a horizontal flat plate, the glue - pressing roller 42 is a rubber circular roller, a glue - pressing air cylinder 43 is fixedly installed above the glue - sticking plate 41. The glue - pressing air cylinder 43 vertically expands and contracts. A glue - pressing and sticking support 44 is arranged at the lower end of the glue - pressing air cylinder 43. Both ends of the glue - pressing roller 42 are horizontally rotatably installed below the glue - pressing and sticking support 44 through bearings. The glue - pressing roller 42 is horizontally arranged, and the rotation axis of the glue - pressing roller 42 is parallel to the rear side edge of the docking frame 22;

[0059] The connection gap between the glue - sticking plate 41 and the docking frame 22 can freely adjust the desired gap width. The position of the glue - sticking plate 41 can be adjusted by tightening the bolts at the position - adjusting points, or the installation position of the docking frame 22 can be adjusted to achieve this purpose. The gap between the glue - sticking plate 41 and the docking frame 22 ranges from 0.2 mm to 3.5 mm, and the gap pressure during the downward pressing can be precisely controlled;

[0060] The connection gap between the cutting table 11 and the glue - pressing frame 31 does not exceed 1 mm. The rotation axis of the glue - pressing roller 42 is perpendicular to the advancing direction of the sheet - shaped chip capacitor on the same horizontal plane, which is convenient for stably and tightly attaching the glue film to the chip capacitor;

[0061] The raw material rack 21 is arranged at the front end of the machine frame 6. A raw material lifting motor 212 is installed at the bottom of the raw material rack 21. The raw material lifting motor 212 is stably installed inside the machine frame 6. A raw material bottom plate 25 is arranged below the raw material rack 21. The raw material bottom plate 25 is horizontally and stably installed on the machine frame 6. The raw material rack 21 horizontally moves up and down directly above the raw material bottom plate 25 through the raw material lifting motor 212. A material - blocking rod 211 is vertically arranged on the side edge of the raw material bottom plate 25. The material - blocking rod 211 is a vertical long rod. A waist - shaped hole is opened on the side of the raw material bottom plate 25. The material - blocking rod 211 is stably locked in the waist - shaped hole of the raw material bottom plate 25 through bolts and can be horizontally adjusted in position. The material - blocking rod 211 vertically extends above the raw material rack 21, and the raw material rack 21 is perpendicular to the plane where the raw material rack 21 and the raw material bottom plate 25 are located;

[0062] An upper - feeding suction cup 2 is installed with an upper - feeding lifting air cylinder 23 at the top. The telescopic end of the upper - feeding lifting air cylinder 23 is vertically arranged. A horizontal upper - feeding translation guide rail 24 and a rodless air cylinder are arranged on the machine frame 6. The upper - feeding translation guide rail 24 is horizontally installed above the upper - feeding suction cup 2. The upper - feeding translation guide rail 24 extends from the front side edge of the raw material rack 21 to the rear side edge of the docking frame 22. The fixed end of the upper - feeding lifting air cylinder 23 is installed and slides on the upper - feeding translation guide rail 24. The upper - feeding lifting air cylinder 23 horizontally moves on the upper - feeding translation guide rail 24 through the rodless air cylinder, and can continuously feed the temporarily stored chip capacitors into the rear end for film - sticking, enabling the line - type film - sticking to be continuously implemented;

[0063] The docking frame 22 is a rectangular flat plate. A stepped gluing edge 221 is provided at the rear side of the docking frame 22. The thickness of the gluing edge 221 is less than half of the thickness of the docking frame 22. The bottom rear side of the gluing edge 221 is an upwardly inclined plane. The thickness of the front side of the gluing edge 221 is greater than that of the rear side. The thickness of the front side of the gluing edge 221 does not exceed 5 mm, and the thickness of the last side edge of the gluing edge 221 does not exceed 1 mm;

[0064] A cylinder guide block 226, two limit rotating shafts 227 and two plate-side limit rods 224 are provided at the bottom of the docking frame 22. One limit block 223 is provided on each of the left and right sides below the docking frame 22. The two limit blocks 223 are both fixedly installed on the frame 6. The limit block 223, and a flip cover cylinder 222 is also installed below the docking frame 22. One end of the flip cover cylinder 222 is connected to the frame 6, and the other end of the flip cover cylinder 222 is rotationally connected to the cylinder guide block 226 through a shaft with a fixed position;

[0065] One of the limit rotating shafts 227 is rotatably installed on one limit block 223 with a fixed position. The rotation axes of the two limit rotating shafts 227 coincide, and the rotation axis of the limit rotating shaft 227 is parallel to the front side edge of the docking frame 22. The docking frame 22 is rotatably installed on the limit block 223 through the limit rotating shaft 227;

[0066] The two plate-side limit rods 224 are symmetrically arranged on the left and right sides at the bottom of the docking frame 22. The lower ends of the plate-side limit rods 224 are wrapped with cylindrical buffer sleeves. A limit adjusting screw 225 is installed on each limit block 223. The limit adjusting screw 225 is threadedly locked on the limit block 223 so that it can extend and retract. The upper end of the limit adjusting screw 225 extends out of the top of the limit block 223. A cylindrical buffer rubber sleeve is provided at the top of the limit adjusting screw 225. The two plate-side limit rods 224 can be respectively detachably covered on the two limit adjusting screws 225. The docking frame 22 is rotatably installed on the limit block 223 through the limit rotating shaft 227 and can be opened or covered. When the docking frame 22 is opened, the rear side is lifted. When the docking frame 22 is covered, it remains horizontal. The placement and spreading of the glue film can be carried out through the flipping and opening of the docking frame 22, and then the docking frame 22 can be covered and pressed down to be locked to seal the glue film. The docking frame 22 can also be locked by the flip cover cylinder 222 so that the equipment can remain stable and non-shaking during operation, while the conventional snap type will become loose after running for a period of time, resulting in its looseness and causing the equipment to run smoothly;

[0067] The glue film cutting device 1 includes a cutting table 11, a pressing block 12, an anti-slip strip 13, a cutting lifting drive 15, a cutting slide rail cylinder shaft 16, a blade 17 and a blade slide 18;

[0068] The cutting slide rail cylinder shaft 16 is horizontally fixed on the frame 6 along the left - right direction. The cutting slide rail cylinder shaft 16 is directly below the cutting table 11. The cutting table 11 is a horizontally installed flat plate. The cutting table 11 is tightly connected between the glue - sticking plate 41 and the glue - pressing frame 31. A cutting slot 111 is opened on the cutting table 11. The cutting slot 111 is opened along the left - right direction of the cutting table 11. The width of the cutting slot 111 in the front - back direction does not exceed 5 mm. The cutting slide rail cylinder shaft 16 and the cutting slot 111 are in the same vertical plane. The cutting slide rail cylinder shaft 16 and the cutting slot 111 are both perpendicular to the advancing direction of the glue film in the same horizontal plane. The blade slide 18 is horizontally and transversely slid on the cutting slide rail cylinder shaft 16 through a cylinder. The blade 17 is locked on the blade slide 18 by bolts. The top of the blade 17 passes through the cutting slot 111 and protrudes above the cutting table 11;

[0069] The cutting lifting drive 15 is stably installed directly above the cutting table 11. The pressing block 12 is connected to the telescopic end of the cutting lifting drive 15. The cutting lifting drive 15 drives the pressing block 12 to lift above the cutting table 11. The bottom of the pressing block 12 is kept horizontal. A cutting groove 14 is horizontally opened at the bottom of the pressing block 12. The cutting groove 14 and the cutting slot 111 are in the same vertical plane. The front - back width of the cutting groove 14 is the same as that of the cutting slot 111. Two anti - slip strips 13 are also arranged at the bottom of the pressing block 12. The two anti - slip strips 13 are distributed on the front and back sides of the cutting groove 14. The anti - slip strips 13 are rubber strips. The anti - slip strips 13 are parallel to the edge of the cutting groove 14. The height of the blade 17 protruding above the cutting table 11 is less than the height of the cutting groove 14, which can accurately cut the glue film between two chip capacitors. If the anti - slip strips 13 cannot press on the chip capacitors, they can also press on the glue film and can also perform neat cutting. And during cutting, the anti - slip strips 13 can prevent the chip capacitors and the glue film from sliding. Even the horizontal cutting force of the cutting blade 17 will not deflect the glue film, effectively avoiding the deviation of the glue film cutting and effectively preventing the chip capacitors from being damaged by the blade 17;

[0070] A discharge translation guide rail 34 is horizontally installed on the frame 6. A discharge lifting cylinder 33 is installed at the top of the discharge suction cup 3. The discharge lifting cylinder 33 vertically telescopes. The discharge suction cup 3 is installed at the telescopic end of the discharge lifting cylinder 33. The fixed end of the discharge lifting cylinder 33 is installed in the discharge translation guide rail 34;

[0071] The finished product rack 32 is installed on the lifting slide rail 36. The lifting slide rail 36 is installed inside the frame 6. A discharge lifting motor 35 is also installed on the lifting slide rail 36. The discharge lifting motor 35 is the lifting drive for the finished product rack 32, which is convenient for collecting the chip capacitors after glue - sticking;

[0072] A plurality of tension rollers 52 are also arranged between the glue application reel 51 and the film winding reel 5. The axes of the tension rollers 52 are all horizontally arranged, and the tension rollers 52 are all rubber rollers. The glue film between the glue application reel 51 and the film winding reel 5 is tensioned by the tension rollers 52, which facilitates separating the glue film from the protective layer, and both are tensioned and conveyed along their respective paths.

[0073] In a specific embodiment of the present invention:

[0074] The embodiment of the present invention provides a gluing machine for chip capacitors. The technical problems solved by the present invention are as follows: 1. Currently, the manual gluing of chip capacitors is slow and inefficient. Moreover, the adhesive film is originally in a roll, and one side of the adhesive film is smooth and non-sticky, while the other side is adhesive and is an adhesive surface. However, the adhesive surface is covered with a non-adhesive protective layer. When gluing the chip capacitors, the protective layer on the adhesive film needs to be torn off. At this time, the adhesive film needs to be torn off with both hands, but the gluing also requires both hands. However, the chip capacitors cannot be fixed. When the chip capacitors are fixed, the adhesive film is prone to static electricity due to the protective layer. If it cannot be pressed and spread all the time, the adhesive films will stick to each other, resulting in the tearing. The film is scrapped and the operation is very troublesome; 2. After the film is tightly attached to the chip capacitor, it needs to be cut, and it needs to be cut neatly to prevent the film from sticking to the other side of the chip capacitor. The film can only stick to and cover one side of the chip capacitor, and it is also very difficult to cut neatly. Therefore, this operation requires at least two skilled workers to complete, which is time-consuming and labor-intensive, and the effect is not good. Once deflection occurs, it is easy to cut the chip capacitor and cause damage to the chip capacitor; 3. In some existing semi-automatic equipment, when feeding the chip capacitor, it is necessary to watch it manually at all times, and the positioning of the chip capacitor is difficult to align. As the production of the chip capacitor decreases, the raw material rack 2 1 needs to rise continuously, at this time, the chip capacitor is easy to slide, resulting in misalignment when the film is attached, and it is also easy to slip, resulting in the entire chip capacitor sliding out of the machine being broken; 4. The glue sticking platform of conventional equipment requires high stability, so only an opening is made on the glue sticking platform to extend the glue film for covering and laminating. Such a hole should not be too large, and the width generally does not exceed 2mm. It is very difficult for the glue film to pass through a hole of such width. Only the glue film can be extended, and the protective layer needs to be wound on another film winding reel 5. In order to avoid taking away the protective layer when cutting, the protective layer of the glue film will not extend out of the glue sticking platform, and the glue film is sticky and will stick when extended. The gap between the chip capacitor and the adhesive film makes it very difficult to spread the adhesive film. Once the gap is too large, the adhesive film will not be stable and the film will be easily skewed. Once the gap exceeds 2mm, the thickness of the chip capacitor is only 2-3mm, and the chip capacitor is tough and can easily extend into the gap when the adhesive film is pressed. Therefore, the gap is generally controlled at about 0.5mm. Such a gap will not hinder the progress of the chip capacitor and reduce the production failure rate. However, the current structure cannot prevent the normal progress of the chip capacitor. Either it is particularly difficult to penetrate the film, or the chip capacitor is very easy to penetrate into the interior of the film reel 51 placed on the adhesive platform, or both failures are prone to occur.

[0075] The technical problem solved by the invention is: the chip capacitor is automatically glued by the device, and the glue film is easy to spread, the chip capacitor is accurately positioned, and the degree of automation is high.

[0076] The achieved technical effects are as follows: 1. The present invention uses a raw material rack 21, a docking rack 22, a glue pressing rack 31, and a finished product rack 32 to step - by - step carry and position the four different states of the patch capacitor during glue application, enabling the patch capacitor to be smoothly glued and forming an automated assembly - line operation in steps, with a high degree of automation in glue application;

[0077] 2. Through the positioning of the material blocking rod 211 and the fact that the lifting of the raw material rack 21 does not affect the positioning, the device can position and carry each patch capacitor in a multi - laminated stack, fixing its position, with high precision in automated film pasting, not easily pasted crooked, and effectively avoiding the adhesive film from overlapping and sticking to the patch capacitor;

[0078] 3. Through the flip - type docking rack 22, it can be conveniently opened to pull out and spread the adhesive film on the glue pressing rack 31, the glue pressing and pasting mechanism 4, and the cutting table 11. The operation of spreading the adhesive film is extremely simple. There is no need to slowly extend the adhesive film from the gap for spreading. The docking rack 22 that blocks the adhesive film can be directly opened, effectively preventing the adhesive film from adhering to other positions of the equipment. After the adhesive film is spread, the docking rack 22 is closed. The operation is simple. Moreover, the docking rack 22 of the device has functions of automatic opening and automatic flipping and closing, making the operation more convenient. And it can continuously tighten the docking rack 22 through the flip - type cylinder 222 to keep its position and angle stable, without jittering and shaking during the operation of the equipment. And through the cooperation of the limit block 223, the side - plate limit rod 224, and the limit adjustment screw 225, the final locking angle of the docking rack 22 can be adjusted, enabling it to operate and adjust stably, being more convenient to use and adjust, and making the equipment operation more stable.

[0079] The technical solution in the embodiment of the present invention is to solve the above problems, and the general idea is as follows:

[0080] To better understand the above - mentioned technical solution, the above - mentioned technical solution will be described in detail below in conjunction with the specification drawings and specific implementation manners.

[0081] When the present invention is manufactured and installed, first, the frame 6 is manufactured. The frame 6 is a frame structure welded by square steel pipes, and a sheet - metal cabinet door needs to be added after all the internal equipment is installed.

[0082] Inside the frame 6, a PLC controller needs to be installed. This is a conventional device. On one side of the front end of the frame 6, a raw material base plate 25 needs to be stably erected. The raw material base plate 25 is rectangular, and the raw material base plate 25 is fixed on the top platform of the frame 6. Each side length of the raw material base plate 25 should be slightly larger than each side length of the chip capacitor. In order to be applicable to various different models of chip capacitors, the size of the raw material base plate 25 needs to be larger than the size of all chip capacitors. That is, due to adaptability, the existing chip capacitor gluing equipment cannot accurately and stably support the chip capacitors. In this device, waist-shaped holes are opened on each side of the raw material base plate 25, and vertical baffle rods 211 are installed in each waist-shaped hole through bolts. The baffle rods 211 need to be perpendicular to the plane of the raw material base plate 25. The raw material base plate 25 is horizontally arranged, and the baffle rods 211 can be horizontally slid and adjusted in the waist-shaped holes of the raw material base plate 25 through bolts. The baffle rods 211 are arranged on the left side and the rear side of the raw material base plate 25, then positioning can be achieved, the feeding is convenient, the positioning is stable, and it can be applicable to various different sizes of chip capacitors;

[0083] A raw material lifting motor 212 is installed at the bottom of the raw material base plate 25. Vertical guide rails are arranged inside the raw material base plate 25. A raw material rack 21 is arranged above the raw material base plate 25. The raw material rack 21 is a square flat plate. The raw material rack 21 is driven by the raw material lifting motor 212 and is installed in the guide rails inside the raw material base plate 25, so that the raw material rack 21 can be driven by the raw material lifting motor 212 to vertically lift above the raw material base plate 25, and the raw material rack 21 always remains horizontal. The baffle rods 211 extend above the raw material rack 21 to block the raw materials, and only vertical baffle plates need to be arranged on the front side and the right side of the raw material rack 21;

[0084] A docking rack 22 is arranged at the rear side of the raw material rack 21. A feeding translation guide rail 24 is horizontally erected above the raw material rack 21 and the docking rack 22. The feeding translation guide rail 24 extends in the front-rear direction to cover the range of the raw material rack 21 and the docking rack 22. The fixed end of the feeding lifting cylinder 23 is slid in the feeding translation guide rail 24 through a dovetail groove. The telescopic end of the feeding lifting cylinder 23 is vertically downward, and a feeding suction cup 22 is arranged on the telescopic end of the feeding lifting cylinder 23. The feeding suction cup 22 is horizontally arranged. The feeding suction cup 22 is a flat plate. Suction cup holes are opened at the bottom of the feeding suction cup 22. The suction cup holes of the feeding suction cup 22 are connected to an external negative pressure pipeline and are controlled by a PLC controller;

[0085] Then, it is necessary to fabricate the docking frame 22 of the flip cover. The docking frame 22 is a flat plate. A stepped glue-applying edge 221 is provided at the rear side edge of the docking frame 22. The thickness of the glue-applying edge 221 is less than half of the normal thickness of the docking frame 22. Therefore, the glue-applying edge 221 and the docking frame 22 form a step. The rear side edge of the glue-applying edge 221 slopes upward to form an upwardly raised inclined plane. The rear side edge of the glue-applying edge 221 is flush with the glue-attaching plate 41. It is necessary to fabricate two limit blocks 223 and arrange the limit blocks 223 on the left and right sides of the docking frame 22. And the two limit blocks 223 are symmetrically arranged below the docking frame 22, and the limit blocks 223 are fixed on the machine frame 6. Then, two limit rotating shafts 227 are provided at the bottom of the docking frame 22 to ensure that the axes of the two limit rotating shafts 227 are on the same straight line. And the axis of the limit rotating shaft 227 is located at the front side of the docking frame 22, and the axis of the limit rotating shaft 227 is parallel to the front side edge in the projection of the docking frame 22. Then, the limit rotating shaft 227 is rotatably installed in the limit block 223. One limit rotating shaft 227 is rotatably installed in a position-fixed manner in one limit block 223. In this way, the docking frame 22 can be flipped open or closed on the limit block 223 through the limit rotating shaft 227;

[0086] A cylinder guide block 226 is installed at the bottom of the docking frame 22. The cylinder guide block 226 is rotatably connected to the telescopic end of the flip cover cylinder 222 through a conventional pin. And the axis of rotation of the cylinder guide block 226 and the flip cover cylinder 222 is parallel to the axis of the limit rotating shaft 227 in the projection of the docking frame 22. Only the cylinder guide block 226 is arranged near the rear end of the docking frame 22. The fixed end of the flip cover cylinder 222 is stably mounted on the machine frame 6;

[0087] It is also necessary to fix two plate-side limit rods 224 at the bottom of the docking frame 22. The plate-side limit rods 224 are stainless steel rods, and the outer and bottom are wrapped with cylindrical rubber buffer sleeves. It is also necessary to install limit adjustment screws 225 on each limit block 223. The top of the limit adjustment screw 225 extends above the limit block 223, and the limit adjustment screw 225 moves up and down on the limit block 223 through threads and is locked by threads and external nuts when it is stationary. A rubber buffer sleeve is also sleeved on the top of the limit adjustment screw 225. When the docking frame 22 is closed, each limit adjustment screw 225 abuts against a plate-side limit rod 224 to form impact limitation, and the lower end of the plate-side limit rod 224 and the limit adjustment screw 225 are used for limitation; And the flip cover cylinder 222 is the drive for the flipping or closing of the docking frame 22;

[0088] An adhesive application reel 51, a film winding reel 5 and a plurality of tension rollers 52 are installed inside the frame 6. The adhesive application reel 51, the film winding reel 5 and the tension rollers 52 are all rotating rollers. The adhesive application reel 51 and the film winding reel 5 are each driven independently by a motor, while the tension rollers 52 are driven rollers, and the tension rollers 52 are all rubber rollers. The adhesive application reel 51 is the reel raw material for the adhesive film. To tear an opening in the adhesive layer of the adhesive film, the adhesive film needs to extend through the gap between the adhesive application edge 221 of the docking frame 22 and the adhesive pasting plate 41. The protective layer of the adhesive film needs to be wound and recycled by the film winding reel 5. Tightening of the torn protective layer and the adhesive film depends on the tension rollers 52 to ensure that the adhesive film can be straightened and continuously extend upward through the docking frame 22. The protective layer of the adhesive film needs to be tightened by the tension rollers 52 and then wound by the film winding reel 5;

[0089] And the adhesive film is tensioned and extended between the adhesive application reel 51 and the film winding reel 5 and placed on the top of the adhesive pasting plate 41 and the cutting table 11. A PLC controller is provided inside the frame 6.

[0090] Then, a pressure-applying and adhesive-pasting mechanism 4 is provided at the rear side of the docking frame 22. The structure of the pressure-applying and adhesive-pasting mechanism 4 is simple. It mainly presses and adheres the extended adhesive film to cover the chip capacitor. The pressure-applying and adhesive-pasting mechanism 4 includes an adhesive pasting plate 41. The adhesive pasting plate 41 needs to be a horizontally arranged fixed plate. The adhesive pasting plate 41 is fixedly installed on the frame 6, and the adhesive pasting plate 41 needs to be horizontal in the same plane as the docking frame 2 in the closed state;

[0091] A pressure-applying cylinder 43 is erected above the adhesive pasting plate 41. The fixed end of the pressure-applying cylinder 43 is stably erected on the frame 6. The telescopic end of the pressure-applying cylinder 43 extends and retracts vertically. A pressure-applying and adhesive-pasting bracket 44 is locked at the lower end of the pressure-applying cylinder 43. The pressure-applying and adhesive-pasting bracket 44 is of a long strip structure. The pressure-applying and adhesive-pasting bracket 44 is horizontally erected directly above the adhesive pasting plate 4, and the pressure-applying and adhesive-pasting bracket 44 is driven by the pressure-applying cylinder 43 to lift vertically. Pressure-applying rollers 42 are installed on both sides of the pressure-applying and adhesive-pasting bracket 44 through bearings. The pressure-applying rollers 42 can rotate along the horizontal axis, and the position of the pressure-applying rollers 42 is fixed relative to the pressure-applying and adhesive-pasting bracket 44.

[0092] It is also necessary to install a cutting adhesive film device 1, which is arranged at the rear end of the rubber pressing device 4; the cutting adhesive film device 1 includes a horizontally installed cutting table 11. The cutting table 11 is a flat plate and needs to be flush with the rubber pasting plate 41, and seamless connection should be achieved. A cutting slot 111 is opened at the middle position of the cutting table 11. The cutting slot 111 is opened along the left-right direction and needs to be perpendicular to the advancing direction of the adhesive film and the chip capacitor. The cutting table 11 is fixedly installed on the machine frame 6, and a cutting slide rail cylinder shaft 16 is arranged below the cutting table 11; the cutting slide rail cylinder shaft 16 also needs to be fixed within the machine frame 6, and a blade slide table 18 is slidably arranged on the cutting slide rail cylinder shaft 16 through a dovetail groove. The sliding direction of the blade slide table 18 is also a horizontal slide along the left-right direction, and a vertical blade 17 is locked on the blade slide table 18 through bolts. The blade 17 slides on the cutting slide rail cylinder shaft 16 following the blade slide table 18, and the cutting slide rail cylinder shaft 16 is just below the cutting slot 111 and is parallel to each other in the same vertical plane. In this way, the blade 17 slides horizontally and cuts within the cutting slot 111;

[0093] A cutting lifting drive 15 also needs to be installed on the top of the cutting table 11. The top of the cutting lifting drive 15 is fixed on the machine frame 6, and the bottom of the cutting lifting drive 15 is a telescopic end. The cutting lifting drive 15 is a vertically telescopic cylinder, and a pressing block 12 is installed at the telescopic end of the bottom of the cutting lifting drive 15. The pressing block 12 is a horizontally arranged long strip-shaped block structure. The pressing block 12 is parallel to the cutting slot 111 in the same vertical plane. The pressing block 12 is directly above the cutting slot 111. A cutting groove 14 is opened at the bottom of the pressing block 12. The cutting groove 14 is a long strip-shaped groove. The cutting groove 14 is parallel to the cutting slot 111. Anti-slip strips 13 are fixedly arranged on both the front and rear sides of the cutting groove 14, and the anti-slip strips 13 are also parallel to the opening edge of the cutting groove 14;

[0094] A rubber pressing frame 31 is installed at the rear end of the cutting table 11. The rubber pressing frame 31 is fixed on the machine frame 6, and the pressing foot frame 31 needs to be closely connected with the cutting table 11 in the same height plane. A finished product frame 32 is installed at the rear end of the rubber pressing frame 31. A vertical unloading translation guide rail 36 also needs to be installed at the rearmost end of the machine frame 6. The finished product frame 32 is vertically slidably arranged on the unloading translation guide rail 36, and the finished product frame 32 is driven by a unloading lifting motor 36 to lift along the unloading translation guide rail 36;

[0095] An unloading translation guide rail 34 is horizontally installed above the rubber pressing frame 31 and the finished product frame 32. An unloading lifting cylinder 33 is horizontally slidably arranged on the unloading translation guide rail 34. A unloading suction cup 3 is installed at the telescopic end of the bottom of the unloading lifting cylinder 33. The unloading suction cup 3 has the same structure as the loading suction cup 2, except that the unloading suction cup 3 is used to suck the finished chip capacitor after film pasting. The unloading suction cup 3 is horizontally driven on the unloading translation guide rail 34 by a separate motor, and the loading suction cup 2 is also horizontally moved on the loading translation guide rail 24 by a separate motor. Thus, the installation of this device is completed.

[0096] The cutting adhesive film device 1, the loading suction cup 2, the unloading suction cup 3, the pressing and pasting mechanism 4, the glue application reel 51 and the film winding reel 5 are all connected to the PLC controller, and this control method belongs to the conventional connection and control in the art.

[0097] When the present invention is in use, the chip capacitors need to be placed flat on the raw material rack 21, and dozens of them can be stacked. At this time, the raw material rack 21 is lowered to the lowest position by the raw material lifting motor 212 to facilitate accommodating more chip capacitors. Then, the PLC controller in the frame 6 is controlled to start the equipment. A main switch 61 also needs to be set in the frame 6 for emergency use;

[0098] Then, a glue film reel needs to be installed on the glue application reel 51, and then the coiled glue film is unfolded. The glue film reel is like transparent tape, with glue on one side and smooth on the other side. The adhesive surface of the glue film is also covered with a protective layer. The protective layer is separated from the glue film, and the docking frame 22 is raised by controlling the flip cylinder 222. The adhesive surface of the glue film is stretched upward and spread to the rear side of the docking frame 22, while the protective layer is wound into a cylinder by the film winding reel for recycling. Both the glue film and the protective layer need to be tensioned by multiple tension rollers 52. The tension rollers 52 need to be set for tensioning at all turning and scattering points, and the tension rollers 52 must not contact the adhesive surface of the glue film. The flip cylinder 222 retracts the docking frame 22 to close it, so that the docking frame 22 is horizontally installed on the top of the limit block 223 and will not collide or shake. The docking frame 22 is tightened by the flip cylinder 222, effectively preventing the chip capacitors from hitting and shaking the docking frame 22 during equipment operation, ensuring smooth operation, and can also be supported and limited through the cooperation of the side plate limit rod 224 and the limit adjustment screw rod 225 to prevent the docking frame 22 from being pulled too low;

[0099] After the loading suction cup 2 sucks one chip capacitor from the raw material rack 21, the loading suction cup 2 rises under the action of the loading lifting cylinder 23. The loading lifting cylinder 23 slides backward driven by a motor on the loading translation guide rail 24 and stops above the docking frame 22. Then the loading lifting cylinder 23 is started again to extend, and the chip capacitor sucked by the loading suction cup 2 is placed flat on the docking frame 22, and the positioning needs to be accurate. The chip capacitors on the raw material rack 21 are positioned and clamped by the stop rods 211, and can be applied to chip capacitors of different sizes;

[0100] After the chip capacitors on the docking frame 22 are stably placed, the loading suction cup 2 needs to align the front end of the chip capacitor and stick it to the adhesive film extending from the rear side of the docking frame 22, so that the rear side edge of the chip capacitor is adhered to the adhesive film. At this time, the pressure roller is pressed against the top of the chip capacitor, the bottom of the chip capacitor is attached to the adhesive film, and the chip capacitor is continuously rotated backward by the pressure roller 42 on the adhesive pasting plate 41. At this time, when the first chip capacitor moves backward, the adhesive film completely covers and adheres to the bottom of the chip capacitor, and a section of adhesive film will be exposed behind the passing chip capacitor. The loading suction cup 2 sucks the second chip capacitor again, aligns the second chip capacitor and adheres it to the adhesive film with a certain width exposed, and the spacing gap from the first chip capacitor shall not exceed the width of the cutting groove 14. In this way, the chip capacitors are continuously adhered to the adhesive film and continuously rolled backward by the pressure roller 42 for conveying;

[0101] Then, the first chip capacitor adhered to the adhesive film is continuously conveyed through the station of the adhesive film cutting device 1. The frontmost edge of the chip capacitor is at the edge of the cutting slit 111. Then, the pressure block 12 is controlled to press down. The pressure block 12 presses the front end of the chip capacitor tightly. At this time, the rear side of this chip capacitor has been placed flat on the pressure adhesive frame 31. The anti-slip strip 13 behind the pressure block 12 presses the first chip capacitor at this time, and the anti-slip strip 13 in the front presses the second anti-slip strip. At this time, the cylinder controlling the sliding table 18 of the pushing blade makes a round trip, horizontally pushes and pulls the blade 17 on the cutting slide rail cylinder shaft 16 once, and cuts off the adhesive film between the first passed chip capacitor and the second chip capacitor. In this way, the first chip capacitor is sucked by the unloading suction cup 3 and then placed on the finished product rack 32 after being clamped by the unloading suction cup 3. In this way, continuous cutting is carried out, and continuous chip capacitors are pasted with adhesive. They are continuously placed on the finished product rack 32 by the unloading suction cup 3. At the same time, the loading suction cup 2 at the front end also continuously places the chip capacitors on the docking frame 22 for pasting adhesive;

[0102] As the number of chip capacitors on the finished product rack 32 increases, the unloading lifting motor 35 continuously controls the finished product rack 32 to lower to accommodate more chip capacitors. The finished product rack 32 does not need to control the position accuracy, only needs to stably receive them.

[0103] This device has high adhesive pasting efficiency, convenient die threading, no redundant actions during work, small gaps, less waste of adhesive film, and higher production continuity.

[0104] The front-rear direction refers to the direction in which the chip capacitor advances in this device. The starting point is the front and the end point is the rear. The raw material rack 21 locked by this device is the starting point carrying the chip capacitor, that is, the front side, and the finished product rack 32 is the end point carrying the chip capacitor, that is, the rear side; the left-right direction and the horizontal direction both refer to along the left-right direction. The left-right direction refers to the left and right sides in the direction of the chip capacitor advancing.

[0105] Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments we described are illustrative rather than used to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should all be covered by the scope protected by the claims of the present invention.

Claims

1. A glue - pasting machine for chip capacitors, characterized in that, Comprising: A cutting adhesive film device (1), a loading suction cup (2), a discharging suction cup (3), a pressing and pasting adhesive mechanism (4), an adhesive applying reel (51), a film winding reel (5) and a frame (6); The frame (6) is sequentially provided with a flat raw material rack (21), a docking rack (22), a pressing adhesive rack (31) and a finished product rack (32) from front to back. The raw material rack (21), the docking rack (22), the pressing adhesive rack (31) and the finished product rack (32) are all horizontally arranged; the raw material rack (21) and the finished product rack (32) are vertically liftable and installed on the frame (6); The loading suction cup (2) and the discharging suction cup (3) are both jigs with vacuum suction cups at the bottom. The loading suction cup (2) and the discharging suction cup (3) are independently installed on the frame (6). The loading suction cup (2) can be lifted and translated between the raw material rack (21) and the docking rack (22), and the discharging suction cup (3) can be lifted and translated between the pressing adhesive rack (31) and the finished product rack (32); The pressing and pasting adhesive mechanism (4) and the cutting adhesive film device (1) are arranged between the docking rack (22) and the pressing adhesive rack (31), and the pressing and pasting adhesive mechanism (4) is arranged at the front end of the cutting adhesive film device (1); The pressing and pasting adhesive mechanism (4) includes a pasting plate (41) and a pressing adhesive roller (42). The pressing adhesive roller (42) can be lifted to loosen and press tightly above the pasting plate (41); The cutting adhesive film device (1) includes a cutting table (11), a pressing block (12), a cutting lifting drive (15) and a blade (17). The blade (17) is horizontally and laterally slid on the cutting table (11), and the pressing block (12) can be lifted to loosen and press tightly on the cutting table (11) through the cutting lifting drive (15); The pasting plate (41) is connected to the rear end of the docking rack (22), the pasting plate (41) is seamlessly connected to the front end of the cutting table (11), the cutting table (11) is connected to the rear end of the pressing adhesive rack (31), and the pasting plate (41), the docking rack (22), the cutting table (11) and the pressing adhesive rack (31) are on the same horizontal plane; A cylinder guide block (226), two limit rotating shafts (227) and two side limit rods (224) are arranged at the bottom of the docking rack (22). One limit block (223) is arranged on each of the left and right sides below the docking rack (22), and the two limit blocks (223) are both fixedly installed on the frame (6). A flip cylinder (222) is also installed below the docking rack (22). One end of the flip cylinder (222) is connected to the frame (6), and the other end of the flip cylinder (222) is rotatably connected to the cylinder guide block (226) with a fixed position through a rotating shaft; One of the limit rotating shafts (227) is fixedly installed on one of the limit blocks (223) and can rotate. The rotating axes of the two limit rotating shafts (227) coincide, and the rotating axis of the limit rotating shaft (227) is parallel to the front side edge of the docking rack (22). The docking rack (22) is rotatably installed on the limit blocks (223) through the limit rotating shafts (227); The glue - applying reel (51) and the film - winding reel (5) are both arranged inside the frame (6), and the glue - applying reel (51) and the film - winding reel (5) rotate synchronously.

2. The glue - applying machine for a chip capacitor according to claim 1, wherein: The glue - applying plate (41) is a horizontal flat plate, the glue - pressing roller (42) is a rubber round roller, a glue - pressing cylinder (43) is fixedly installed above the glue - applying plate (41), the glue - pressing cylinder (43) expands and contracts vertically, a glue - pressing and glue - applying support (44) is arranged at the lower end of the glue - pressing cylinder (43), the two ends of the glue - pressing roller (42) are horizontally rotatably installed through bearings below the glue - pressing and glue - applying support (44), the glue - pressing roller (42) is horizontally arranged, and the rotation axis of the glue - pressing roller (42) is parallel to the rear side edge of the docking frame (22); The connection gap between the glue - applying plate (41) and the docking frame (22) is between 0.2 mm and 3.5 mm; The connection gap between the cutting table (11) and the glue - pressing frame (31) does not exceed 1 mm.

3. The glue applicator for a chip capacitor according to claim 1, wherein: The raw material rack (21) is arranged at the front end of the frame (6). A raw material lifting motor (212) is installed at the bottom of the raw material rack (21), the raw material lifting motor (212) is stably installed inside the frame (6). A raw material bottom plate (25) is arranged below the raw material rack (21), the raw material bottom plate (25) is horizontally and stably installed on the frame (6), the raw material rack (21) horizontally lifts above the raw material bottom plate (25) through the raw material lifting motor (212). A material - blocking rod (211) is vertically arranged on the side edge of the raw material bottom plate (25), the material - blocking rod (211) is a vertical long rod, a waist - shaped hole is opened on the side of the raw material bottom plate (25), the material - blocking rod (211) is stably locked in the waist - shaped hole of the raw material bottom plate (25) by bolts and can be horizontally adjusted in position, the material - blocking rod (211) vertically extends above the raw material rack (21), and the material - blocking rod (211) is perpendicular to the plane where the raw material rack (21) and the raw material bottom plate (25) are located; An upper - feeding lifting cylinder (23) is installed at the top of the upper - feeding suction cup (2), the telescopic end of the upper - feeding lifting cylinder (23) is vertically arranged, an upper - feeding translation guide rail (24) is horizontally arranged on the frame (6), the upper - feeding translation guide rail (24) is horizontally installed above the upper - feeding suction cup (2), the upper - feeding translation guide rail (24) extends from the front side edge of the raw material rack (21) to the rear side edge of the docking frame (22), the fixed end of the upper - feeding lifting cylinder (23) is installed and slides on the upper - feeding translation guide rail (24), and the upper - feeding lifting cylinder (23) horizontally moves on the upper - feeding translation guide rail (24) through a rodless cylinder.

4. A glue - applying machine for a chip capacitor according to claim 1, wherein: The docking frame (22) is a rectangular flat plate, a stepped glue - applying edge (221) is arranged at the rear side of the docking frame (22), the thickness of the glue - applying edge (221) is less than half of the thickness of the docking frame (22), the bottom rear side of the glue - applying edge (221) is an upward - raised inclined plane, the thickness of the front side of the glue - applying edge (221) is greater than that of the rear side, and the thickness of the front side of the glue - applying edge (221) does not exceed 5 mm; Two of the plate-side limit rods (224) are symmetrically arranged on the left and right sides of the bottom of the docking frame (22). The lower end of the plate-side limit rod (224) is wrapped with a cylindrical buffer sleeve. A limit adjustment screw (225) is installed on each limit block (223). The limit adjustment screw (225) is locked on the limit block (223) by threads so that it can be lifted and lowered. The upper end of the limit adjustment screw (225) extends out of the top of the limit block (223). A cylindrical buffer rubber sleeve is provided at the top of the limit adjustment screw (225). The two plate-side limit rods (224) can be separated and respectively cover the two limit adjustment screws (225).

5. The glue applicator for a chip capacitor according to claim 1, characterized in that: The cutting film device (1) includes a cutting table (11), a pressing block (12), anti-slip strips (13), a cutting lifting drive (15), a cutting slide rail cylinder shaft (16), a blade (17), and a blade slide (18). The cutting slide rail cylinder shaft (16) is horizontally fixed on the frame (6) along the left-right direction. The cutting slide rail cylinder shaft (16) is directly below the cutting table (11). The cutting table (11) is a horizontally installed flat plate. The cutting table (11) is closely connected between the glue pasting plate (41) and the glue pressing frame (31). A cutting slot (111) is opened on the cutting table (11). The cutting slot (111) is opened along the left-right direction of the cutting table (11). The width of the cutting slot (111) in the front-back direction does not exceed 5 mm. The cutting slide rail cylinder shaft (16) and the cutting slot (111) are in the same vertical plane. The cutting slide rail cylinder shaft (16) and the cutting slot (111) are both perpendicular to the advancing direction of the film in the same horizontal plane. The blade slide (18) is horizontally and transversely slid on the cutting slide rail cylinder shaft (16) by a cylinder. The blade (17) is locked on the blade slide (18) by bolts. The top of the blade (17) passes through the cutting slot (111) and exposes above the cutting table (11). The cutting lifting drive (15) is stably installed directly above the cutting table (11). The pressing block (12) is connected to the telescopic end of the cutting lifting drive (15). The cutting lifting drive (15) drives the pressing block (12) to lift and lower above the cutting table (11). The bottom of the pressing block (12) is kept horizontal. A cutting groove (14) is transversely opened at the bottom of the pressing block (12). The cutting groove (14) and the cutting slot (111) are in the same vertical plane. The cutting groove (14) and the cutting slot (111) have the same width in the front-back direction. Two anti-slip strips (13) are also provided at the bottom of the pressing block (12). The two anti-slip strips (13) are distributed on the front and back sides of the cutting groove (14). The anti-slip strips (13) are rubber strips. The anti-slip strips (13) are parallel to the edge of the cutting groove (14). The height of the blade (17) extending out of the cutting table (11) is less than the height of the cutting groove (14).

6. The glue applicator for a chip capacitor according to claim 1, wherein: A discharge translation guide rail (34) is horizontally installed on the frame (6). A discharge lifting cylinder (33) is installed at the top of the discharge suction cup (3). The discharge lifting cylinder (33) vertically expands and contracts. The discharge suction cup (3) is installed at the telescopic end of the discharge lifting cylinder (33), and the fixed end of the discharge lifting cylinder (33) is installed in the discharge translation guide rail (34). The finished product rack (32) is installed on the lifting slide rail (36). The lifting slide rail (36) is installed in the frame (6). A discharge lifting motor (35) is also installed on the lifting slide rail (36). The discharge lifting motor (35) drives the lifting of the finished product rack (32).

7. The glue - applying machine for a chip capacitor according to claim 1, characterized in that: A plurality of tension rollers (52) are provided between the glue application reel (51) and the film winding reel (5). The axes of the tension rollers (52) are all horizontally arranged, and the tension rollers (52) are all rubber rollers. The glue film between the glue application reel (51) and the film winding reel (5) is tensioned by the tension rollers (52).

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