Magnetic element and power module

Abstract

The application provides a magnetic element and a power module. The magnetic element comprises a first magnetic column, a second magnetic column, a first winding and a second winding. The first winding is formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part. The second winding is formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part. The first left metal part, the first middle metal part, the first right metal part, the second middle metal part, the second left metal part and the second right metal part are formed on a first substrate. The first substrate has a first upper groove and a first lower groove, and the first magnetic column and the second magnetic column are arranged in the first upper groove and the first lower groove respectively. The magnetic element and the power module have the advantages of simple process, low cost, easy automation and the like.

Description

Technical Field

[0001] This invention relates to the field of electronic power technology, and in particular to a magnetic element and a power supply module. Background Technology

[0002] Currently, the market size of cloud (data centers) and edge devices (mobile phones, iPads, etc.) is growing rapidly. However, this growth also brings multiple challenges. For example, as various smart ICs become more functional and consume more power, the number of components on the motherboard is increasing, requiring power modules to have higher power density or greater current output capacity per module. Furthermore, with the increasing computing power of smart ICs, the requirements for the dynamic performance of the power supply system are also rising. As the power of smart accelerator cards and servers increases, the space left for the power supply system on the system board is compressed, demanding higher power density, lower transmission loss, higher reliability, and better manufacturability. Existing transformer-based DC-DC converter power modules generally adopt a planar transformer structure, using PCB (printed circuit board) traces to form a complete winding. The winding is vertically wound, with magnetic posts inserted into the inner holes of the winding through assembly, and the magnetic posts are fixed to the cover plate with adhesive. This type of power module has vertically wound windings, resulting in uneven current distribution and high losses. Furthermore, the large assembly tolerances in the structure, such as the assembly tolerance between the magnetic column and the winding inner hole on the circuit board, result in a non-compact structure and lead to high losses in the winding or magnetic core. Additionally, the magnetic core cover plate, fixed by adhesive dispensing, is prone to detachment, affecting reliability. Alternatively, a transformer could be formed by winding copper foil, but this process is complex and results in poor precision at the output terminals, impacting yield.

[0003] A drawback of existing technology is that if five circuit boards are soldered together with solder paste to form a winding around two magnetic pillars, and protruding structures are set on the upper and lower ends of the circuit boards between the magnetic pillars to be inserted into pre-set openings on the circuit boards above or below the magnetic core for positioning and soldering, the large soldering tolerances and large required solder pads result in poor overall structural precision. Large connection tolerances also lead to a non-compact structure and low power density. Furthermore, solder paste soldering results in high transmission losses, and the connection reliability is low during the secondary melting process during system installation, affecting the reliability of the power module. Additionally, this structure has a cumbersome manufacturing process, is not easily automated, and is not conducive to cost reduction.

[0004] Another drawback of the existing technology is that if a slot is cut on one side of the PCB and a winding and a magnetic core are placed in the slot, the slot on one side of the PCB will result in structural asymmetry, easy deformation, and affect the soldering yield. The magnetic core forms a magnetic circuit in the horizontal direction. Due to the limited PCB slot depth, the magnetic flux density of the magnetic circuit is uneven, the loss is large, and the overall structure footprint is large. The inner surface of the slot is a three-dimensional structure, which makes the process of forming the winding difficult and makes it difficult to form multi-layer windings. The parasitic inductance is large, the cost is high, and the performance needs to be improved.

[0005] Therefore, there is an urgent need for a new solution to address the above problems. Summary of the Invention

[0006] To solve the above-mentioned technical problems, this application provides a magnetic element comprising:

[0007] A magnetic core, comprising:

[0008] First magnetic column;

[0009] A second magnetic post is located below the first magnetic post;

[0010] A first winding, comprising:

[0011] A first upper metal part is located above the first magnetic column;

[0012] A first left-side metal portion is located to the left of the first magnetic post;

[0013] A first intermediate metal portion is located between the first magnetic post and the second magnetic post; and

[0014] A first right-side metal portion is located to the right of the first magnetic post; the first upper metal portion, the first left-side metal portion, the first middle metal portion, and the first right-side metal portion are connected sequentially.

[0015] A second winding, comprising:

[0016] A second intermediate metal portion is located between the first magnetic post and the second magnetic post;

[0017] A second left-side metal portion is located to the left of the second magnetic post;

[0018] A first lower metal portion is located below the second magnetic post; and

[0019] A second right-side metal portion is located to the right of the second magnetic post, and the second middle metal portion, the second left-side metal portion, the first lower metal portion, and the second right-side metal portion are connected in sequence.

[0020] The first left metal portion, the first middle metal portion, the first right metal portion, the second middle metal portion, the second left metal portion, and the second right metal portion are formed on a first substrate. The first substrate has a first upper groove and a first lower groove, and the first magnetic post and the second magnetic post are respectively disposed in the first upper groove and the first lower groove.

[0021] In some embodiments, the first upper metal portion is formed on a second substrate, and the first lower metal portion is formed on a third substrate.

[0022] In some embodiments, the first substrate, the second substrate, and the third substrate are all printed circuit boards.

[0023] In some embodiments, the first left metal portion, the first right metal portion, the second left metal portion, and the second right metal portion are all conductive vias.

[0024] In some embodiments, the surface of the groove on the first is electroplated with metal.

[0025] In some embodiments, the second substrate includes:

[0026] A first wiring layer is disposed above the first magnetic pillar; and

[0027] A second wiring layer is disposed above the first wiring layer, with a portion of the first upper metal portion located on the first wiring layer and the remaining portion of the first upper metal portion located on the second wiring layer.

[0028] In some embodiments, a third winding is further included, the third winding comprising:

[0029] A second upper metal portion is located above the first magnetic column;

[0030] A third left-side metal portion is located to the left of the first magnetic post;

[0031] A third intermediate metal portion is located between the first magnetic post and the second magnetic post; and

[0032] A third right-side metal portion is located to the right of the first magnetic post. The second upper metal portion, the third left-side metal portion, the third middle metal portion, and the third right-side metal portion are connected in sequence. A portion of the second upper metal portion is located in the first wiring layer, and the remaining portion of the second upper metal portion is located in the second wiring layer.

[0033] In some embodiments, the magnetic core further includes a first magnetic cover plate, a second magnetic cover plate, a third magnetic cover plate, and a fourth magnetic cover plate. The first magnetic cover plate and the second magnetic cover plate are respectively disposed on the front side and the rear side of the first magnetic post, and the third magnetic cover plate and the fourth magnetic cover plate are respectively disposed on the front side and the rear side of the second magnetic post. The end faces of the first magnetic cover plate, the second magnetic cover plate, the third magnetic cover plate, and the fourth magnetic cover plate are inclined surfaces. An inclined first air gap is formed between the first magnetic cover plate and the third magnetic cover plate, and an inclined second air gap is formed between the second magnetic cover plate and the fourth magnetic cover plate.

[0034] In some embodiments, the first upper metal portion and the first lower metal portion are implemented by metallization.

[0035] In some embodiments, a first bonding layer and a second bonding layer are further included, the first bonding layer being located between the second substrate and the first substrate, and the second bonding layer being located between the third substrate and the first substrate.

[0036] In some embodiments, the first bonding layer is disposed outside the first upper groove opening, and the second bonding layer is disposed outside the first lower groove opening.

[0037] In some embodiments, the width of the first upper groove opening is greater than the width of the first upper groove bottom, and the width of the first lower groove opening is greater than the width of the first lower groove bottom.

[0038] In some embodiments, the shape of the first magnetic post matches the shape of the first upper groove, and the shape of the second magnetic post matches the shape of the first lower groove.

[0039] In some embodiments, the second substrate has a second lower groove with the opening of the second lower groove facing downwards, the third substrate has a second upper groove with the opening of the second upper groove facing upwards, the second lower groove and the first upper groove together form a first receiving cavity for accommodating the first magnetic post, and the second upper groove and the first lower groove together form a second receiving cavity for accommodating the second magnetic post.

[0040] In some embodiments, the magnetic core further includes a third magnetic post and a fourth magnetic post, the third magnetic post and the fourth magnetic post being stacked, the third magnetic post being located to the right of the first magnetic post, and the fourth magnetic post being located to the right of the second magnetic post; the magnetic element further includes:

[0041] A fourth winding, comprising:

[0042] A third upper metal part is located above the third magnetic column;

[0043] A fourth left-side metal portion is located to the left of the third magnetic post;

[0044] A fourth intermediate metal portion is located between the third magnetic post and the fourth magnetic post; and

[0045] A fourth right-side metal portion is located to the right of the third magnetic post. The third upper metal portion, the fourth left-side metal portion, the fourth middle metal portion, and the fourth right-side metal portion are connected sequentially.

[0046] A fifth winding, comprising:

[0047] A fifth intermediate metal part is located between the third magnetic post and the fourth magnetic post;

[0048] A fifth left-side metal portion is located to the left of the fourth magnetic post;

[0049] A second lower metal portion, located below the fourth magnetic post; and

[0050] A fifth right-side metal portion is located to the right of the fourth magnetic post. The fifth middle metal portion, the fifth left-side metal portion, the second lower metal portion, and the fifth right-side metal portion are connected in sequence. The fourth left-side metal portion, the fourth middle metal portion, the fourth right-side metal portion, the fifth middle metal portion, the fifth left-side metal portion, and the fifth right-side metal portion are formed on the first substrate. The first substrate also has a third upper groove and a third lower groove. The third magnetic post and the fourth magnetic post are respectively disposed in the third upper groove and the third lower groove.

[0051] In some embodiments, the first magnetic post, the second magnetic post, the third magnetic post, and the fourth magnetic post are all cuboids.

[0052] In some embodiments, a sixth winding is also included, the sixth winding comprising:

[0053] A fourth upper metal part is located above the first magnetic column;

[0054] A sixth left-side metal portion is located to the left of the first magnetic post;

[0055] A sixth intermediate metal portion is located between the first magnetic post and the second magnetic post; and

[0056] A sixth right-side metal portion is located to the right of the first magnetic post. The fourth upper metal portion, the sixth left-side metal portion, the sixth middle metal portion, and the sixth right-side metal portion are formed on the first substrate and connected in sequence.

[0057] Wherein, the first winding is the primary winding of the magnetic element, and the sixth winding is the first secondary winding of the magnetic element.

[0058] In some embodiments, a seventh winding is also included, the seventh winding comprising:

[0059] A fifth upper metal part is located above the first magnetic column;

[0060] The seventh left-side metal part is located to the left of the first magnetic post;

[0061] A seventh intermediate metal portion, located between the first magnetic post and the second magnetic post; and

[0062] A seventh right-side metal portion is located to the right of the first magnetic post. The fifth upper metal portion, the seventh left-side metal portion, the seventh middle metal portion, and the seventh right-side metal portion are formed on the first substrate and connected in sequence.

[0063] The seventh winding is the second secondary winding of the magnetic element, and at least a portion of the primary winding is located between at least a portion of the first secondary winding and at least a portion of the second secondary winding.

[0064] In some embodiments, the first substrate is formed by disposing a second circuit board with a first through hole and a third circuit board with a second through hole on the upper and lower surfaces of a first circuit board, respectively, or by creating grooves on the upper and lower surfaces of a fourth circuit board.

[0065] In some embodiments, a plurality of pins are further included, which are respectively disposed on the first end face of the second substrate and the first end face of the third substrate, wherein the first end face of the second substrate and the first end face of the third substrate are coplanar.

[0066] In some embodiments, the second and third substrates are electrically connected to the first substrate through a plurality of conductive vias.

[0067] In some embodiments, the second substrate and the third substrate are electrically connected to the first substrate only through a plurality of conductive vias.

[0068] In some embodiments, the second substrate and the third substrate are respectively bonded to both sides of the first substrate by bonding layers.

[0069] This application also provides a power module, including the magnetic element described above, and further including at least one power switch, the power switch being disposed above the first upper metal part or below the first lower metal part.

[0070] In some embodiments, the system further includes a plurality of pins, wherein the first upper metal portion is formed on a second substrate, the first lower metal portion is formed on a third substrate, and the plurality of pins are respectively disposed on the left end face of the second substrate and the third substrate, or respectively disposed on the right end face of the second substrate and the third substrate.

[0071] The beneficial effects of this invention are:

[0072] This magnetic core component, i.e., the transformer module, offers at least one of the following advantages: 1. Reliable symmetrical structure and stress, with a simple and compact design; 2. The magnetic core can extend along the magnetic loop axis, resulting in a balanced magnetic circuit ("flat-wound" core structure), which helps reduce magnetic flux loss; 3. The circuit board with a bidirectional symmetrical groove structure is manufactured using conventional processes, which are simple and facilitate continuous production, easy to automate, and low in cost.

[0073] This power module offers at least one of the following advantages: 1. Reliable and symmetrical structure and stress, with a simple and compact design; 2. Due to the absence of power or passive components stacked with the core in the vertical direction, the core can extend along the magnetic loop axis, resulting in a balanced magnetic circuit ("flat-wound" core structure), which helps reduce magnetic flux loss; 3. Terminals can be directly placed at the ends of the first and second wiring layers, resulting in a simple output terminal structure. The double-sided groove structure of the substrate reduces the number of components, achieves high power density, and is simple to manufacture and low in cost. Attached Figure Description

[0074] Figure 1 This is a schematic diagram of the magnetic element structure according to the first embodiment of the present invention (I).

[0075] Figure 2 It indicated Figure 1 A schematic diagram of the three-dimensional explosion structure.

[0076] Figure 3 This is a schematic diagram (II) of the magnetic element structure according to the first embodiment of the present invention.

[0077] Figure 4 This is a schematic diagram (III) of the magnetic element structure according to the first embodiment of the present invention.

[0078] Figure 5 This is a schematic diagram (four) of the magnetic element structure of the first embodiment of the present invention.

[0079] Figure 6 This is a schematic diagram (V) of the magnetic element structure of the first embodiment of the present invention.

[0080] Figure 7 for Figure 6 A cross-sectional view at point AA.

[0081] Figure 8This is a schematic diagram of the magnetic element structure according to the second embodiment of the present invention.

[0082] Figure 9A This is a schematic diagram of the magnetic element structure according to the third embodiment of the present invention (I).

[0083] Figure 9B This is a schematic diagram of the structure of the first substrate.

[0084] Figure 9C for Figure 9B The top view of the first substrate shown.

[0085] Figure 9D This is a schematic diagram (II) of the magnetic element structure according to the third embodiment of the present invention.

[0086] Figure 10 This is a schematic diagram of the structure of the magnetic element according to the fourth embodiment of the present invention.

[0087] Figure 11 This is a schematic diagram of the power module according to an embodiment of the present invention.

[0088] Figure 12 This is a three-dimensional structural diagram of a power module according to an embodiment of the present invention.

[0089] Figure 13A This is a schematic diagram of the structure of the second power module according to another embodiment of the present invention (I).

[0090] Figure 13B This is a schematic diagram of the matrix arrangement of magnetic cores in a power module according to another embodiment of the present invention.

[0091] Figure 14 This is a schematic diagram of a continuous first substrate structure manufactured using a continuous circuit board method.

[0092] Figures 15a-15f The following is the manufacturing process of a power module according to the present invention.

[0093] Figures 16a-16d The following is the fabrication process of the first substrate of the present invention.

[0094] Figure 17a It is a type of half-bridge LLC circuit.

[0095] Figure 17b This is another type of half-bridge LLC circuit.

[0096] Figure 17c It is a full-bridge LLC circuit.

[0097] Figure 17d This is an LLC circuit that incorporates an autotransformer. Detailed Implementation

[0098] Reference Figures 1 to 7 . Figure 1 This is a schematic diagram of the magnetic element structure according to the first embodiment of the present invention (I). Figure 2 It indicated Figure 1 A schematic diagram of the three-dimensional explosion structure. Figure 3 This is a schematic diagram (II) of the magnetic element structure according to the first embodiment of the present invention. Figure 4 This is a schematic diagram (III) of the magnetic element structure according to the first embodiment of the present invention. Figure 5 This is a schematic diagram (four) of the magnetic element structure of the first embodiment of the present invention. Figure 6 This is a schematic diagram (V) of the magnetic element structure of the first embodiment of the present invention. Figure 7 for Figure 6 A cross-sectional view at point AA. This application provides a magnetic element 100a, comprising a first magnetic post 11, a second magnetic post 12, a first winding 21 wound on the first magnetic post 11, and a second winding 22 wound on the second magnetic post. The second magnetic post 12 is located below the first magnetic post 11. The first winding 21 comprises a first upper metal portion 211, a first left metal portion 212, a first middle metal portion 213, and a first right metal portion 214. The first upper metal portion 211, the first left metal portion 212, the first middle metal portion 213, and the first right metal portion 214 are connected sequentially. The first upper metal portion 211 is located above the first magnetic post 11. The first left metal portion 212 is located to the left of the first magnetic post 11. The first middle metal portion 213 is located between the first magnetic post 11 and the second magnetic post 12. The first right metal portion 214 is located to the right of the first magnetic post 11. The second winding 22 includes a second intermediate metal portion 221, a second left-side metal portion 222, a first lower metal portion 223, and a second right-side metal portion 224. The second intermediate metal portion 221, the second left-side metal portion 222, the first lower metal portion 223, and the second right-side metal portion 224 are connected sequentially. The second intermediate metal portion 221 is located between the first magnetic post 11 and the second magnetic post 12. The second left-side metal portion 222 is located to the left of the second magnetic post 12. The first lower metal portion 223 is located below the second magnetic post 12. The second right-side metal portion 224 is located to the right of the second magnetic post 12.

[0099] The first left-side metal portion 212, the first middle metal portion 213, the first right-side metal portion 214, the second middle metal portion 221, the second left-side metal portion 222, and the second right-side metal portion 224 are formed on a first substrate 8a. The first substrate 8a has a first upper groove 81 and a first lower groove 82, and the first magnetic post 11 and the second magnetic post 12 are respectively disposed within the first upper groove 81 and the first lower groove 82. In some embodiments, the surface of the first upper groove 81 may be electroplated with metal. The grooves on the two surfaces of the first substrate 8a are symmetrical, and the first upper groove 81 and the first lower groove 82 are symmetrical on both sides of the first substrate 8a, which facilitates stress balance within the first substrate 8a, reduces deformation of the first substrate 8a during temperature changes, and improves the reliability of magnetic components or power modules or the stability of the manufacturing process.

[0100] In this embodiment, reference is also made to Figure 1 and Figure 3 The first upper metal portion 211 is formed on a second substrate 8b, and the first lower metal portion 223 is formed on a third substrate 8c. The first substrate 8a, the second substrate 8b, and the third substrate 8c are all printed circuit boards. The first left metal portion 212, the first right metal portion 214, the second left metal portion 222, and the second right metal portion 224 are all conductive vias. The second substrate 8b and the third substrate 8c are electrically connected to the first substrate 8a only through multiple conductive vias 63. Multiple pins 48 are provided on the first end face of the second substrate 8b and the first end face of the third substrate 8c, and the first end face of the second substrate 8b and the first end face of the third substrate 8c are coplanar.

[0101] Furthermore, refer to Figure 3In this embodiment, the first upper metal portion 211 and the first lower metal portion 223 are implemented by metallization. This metallization is implemented as follows: the first magnetic pillar 11 and the second magnetic pillar 12 are respectively placed in the first upper groove 81 and the first lower groove 82 of the first substrate 8a. Then, the first magnetic pillar 11 and the second magnetic pillar 12 are embedded in the insulating molding compound 5. The first upper metal portion 211 and the first lower metal portion 223 are formed on the upper and lower surfaces of the insulating molding compound 5 by metallization. The first upper metal portion 211 is electrically connected to terminals on both sides of the first upper groove 81 through conductive vias 63. The first lower metal portion 223 is electrically connected to terminals on both sides of the first lower groove 82 through conductive vias 63. By embedding the substrate and magnetic pillars within the insulating molding compound, and using a metal layer formed in a manner similar to embedded chip packaging to form the winding, the structure of the magnetic core element is more compact, with higher power density and higher reliability.

[0102] Reference Figure 4 and Figure 5 A bonding layer is provided between the second substrate 8b and the first substrate 8a, and between the third substrate 8c and the first substrate 8a. This bonding layer includes a first bonding layer 51 and a second bonding layer 52. The second substrate 8b is bonded to the first substrate 8a through the first bonding layer 51, and the third substrate 8c is bonded to the first substrate 8a through the second bonding layer 52. The first bonding layer 51 or the second bonding layer 52 can be a prepreg (PP layer), which is commonly used for bonding two double-sided boards in a multilayer circuit board. After the second substrate 8b is bonded to the first substrate 8a through the first bonding layer 51, and the third substrate 8c is bonded to the first substrate 8a through the second bonding layer 52, the second substrate 8b is electrically connected to the terminals on both sides of the first upper groove 81 of the first substrate 8a only through conductive vias 63 or conductive blind vias, forming a complete first winding 21. The third substrate 8c is electrically connected to the terminals on both sides of the first lower groove 82 of the first substrate 8a through the second bonding layer 52 via the conductive via 63 or the conductive blind via, forming a complete second winding 22.

[0103] Following on, such as Figure 4 and Figure 5 As shown, the first bonding layer 51 is disposed outside the opening of the first upper groove 81, and the second bonding layer 52 is disposed outside the opening of the first lower groove 82. More specifically, as... Figure 4As shown, the first bonding layer 51 is bonded to the entire lower surface of the second substrate 8b, the upper surface of the first substrate 8a, and the surface of the first magnetic post 11. The second bonding layer 52 is bonded to the upper surface of the third substrate 8c, the lower surface of the first substrate 8a, and the surface of the second magnetic post 12. As an optimal embodiment, refer to... Figure 5 The first bonding layer 51 is bonded to the surface of the first substrate 8a (excluding the area where the first magnetic pillar 11 is located) and a portion of the surface of the second substrate 8b. The second bonding layer 52 is disposed on the surface of the first substrate 8a (excluding the area where the second magnetic pillar 12 is located) and a portion of the surface of the third substrate 8c. This arrangement reduces adhesion to the magnetic pillars, lowers the stress on the first magnetic pillar 11 and the second magnetic pillar 12, and facilitates expanding the cross-sectional space of the first magnetic pillar 11 and the second magnetic pillar 12. Figure 5 A first adhesive layer is provided on the first substrate 8a, excluding the area where the first magnetic post 11 is located, thereby giving up the space of the original first bonding layer 51 to the first magnetic post 11, which relatively increases the space of the first magnet.

[0104] Reference Figure 10 In another embodiment, the two sides of the second substrate 8b and the first substrate 8a can also be electrically connected via solder paste joints 62. Similarly, the two sides of the third substrate 8c and the first substrate 8a are also electrically connected via solder paste joints 62. The above connection methods are simple, the process is mature, and they help reduce costs.

[0105] Refer to Figure 4 and Figure 5 In this embodiment, the cross-sections of the first upper groove 81 and the first lower groove 82 are trapezoidal. The width of the opening of the first upper groove 81 is greater than the width of the bottom of the first upper groove 81, and the width of the opening of the first lower groove 82 is greater than the width of the bottom of the first lower groove 82. The shape of the first magnetic post 11 matches the shape of the first upper groove 81, and the shape of the second magnetic post 12 matches the shape of the first lower groove 82. For example, if the first upper groove 81 and the first lower groove 82 are trapezoidal, the first magnetic post 11 and the second magnetic post 12 are trapezoids that match the corresponding grooves. This facilitates the installation of the first magnetic post 11 into the first upper groove 81 on the first substrate 8a, and similarly facilitates the installation of the second magnetic post 12 into the first lower groove 82 on the first substrate 8a. It also helps to reduce the fitting gap between the first magnetic post 11 and the first substrate 8a, and between the second magnetic post 12 and the first substrate 8a, thereby improving the space utilization of the electromagnetic components and increasing the efficiency or power density of the electromagnetic components.

[0106] Figure 2 It indicated Figure 1A three-dimensional exploded view of the structure. The first magnetic pillar 11 and the second magnetic pillar 12 form a complete magnetic circuit through the magnetic cover plates 18 at their ends. The magnetic cover plates 18 include a first magnetic cover plate 181, a second magnetic cover plate 182, a third magnetic cover plate 183, and a fourth magnetic cover plate 184. The first magnetic cover plate 181 and the second magnetic cover plate 182 are respectively disposed on the front and rear sides of the first magnetic pillar 11. The third magnetic cover plate 183 and the fourth magnetic cover plate 184 are respectively disposed on the front and rear sides of the second magnetic pillar 12. Please refer to [further details]. Figure 7 A first air gap 17a is formed between the first magnetic cover plate 181 and the third magnetic cover plate 183, and a second air gap 17b is formed between the second magnetic cover plate 182 and the fourth magnetic cover plate 184. In this embodiment, the magnetic cover plate 18 can be slightly deformed to better adjust the first magnetic post 11 and the second magnetic post 12 in the thickness direction. (Refer to...) Figure 7 , Figure 7 for Figure 6 A cross-sectional view at point AA. (See example) Figure 7 As shown, the end faces of the first magnetic cover plate 181, the second magnetic cover plate 182, the third magnetic cover plate 183, and the fourth magnetic cover plate 184 are inclined surfaces. An inclined first air gap 17a is formed between the first magnetic cover plate 181 and the third magnetic cover plate 183, and an inclined second air gap 17b is formed between the second magnetic cover plate 182 and the fourth magnetic cover plate 184. The first magnetic post 11 and the second magnetic post 12 are connected by air gaps 17a and 17b to form a complete magnetic circuit. Since the first and second air gaps are inclined, if the size of the air gaps 17a and 17b when the first magnetic post 11 and the second magnetic post 12 form a magnetic circuit does not meet expectations due to the thickness tolerance and / or other tolerances of the first substrate 8a, the relative position of the first magnetic post 11 or the second magnetic post 12 can be finely adjusted in the horizontal direction. This horizontal direction refers to the direction parallel to the first substrate 8a, the second substrate 8b, or the third substrate 8c. For example, if the air gap is too small, keep the second magnetic post 12 stationary and move the first magnetic post 11 to the left, in the direction indicated by arrow L. If the air gap 17 is too large, keep the second magnetic post 12 stationary and move the first magnetic post 11 to the right, in the direction indicated by arrow R. This inclined air gap design allows for flexible adjustment of air gaps 17a and 17b while ensuring the first magnetic post 11, the first substrate 8a, and the second magnetic post 12 are tightly fitted together. This improves the power density of the power module and facilitates easy adjustment of the magnetic circuit air gap. The magnetic cover plate 18 can also be integrated into the end of the first magnetic post 11 and / or the second magnetic post 12.

[0107] It should be noted that the first upper groove 81 and the first lower groove 82 on the first substrate 8a are completely symmetrical. The middle metal part in the first substrate 8a can also be arranged in a mirror image symmetrically or asymmetrically, and no restriction is imposed here.

[0108] Figure 8 This is a schematic diagram of the magnetic element structure according to a second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the first magnetic post 11 is further wound with a third winding 23. The third winding 23 includes: a second upper metal portion 231, a third left metal portion 232, a third middle metal portion 233, and a third right metal portion 234. The second upper metal portion 231, the third left metal portion 232, the third middle metal portion 233, and the third right metal portion 234 are connected sequentially. The second upper metal portion 231 is located above the first magnetic post 11; the third left metal portion 232 is located to the left of the first magnetic post 11; the third middle metal portion 233 is located between the first magnetic post 11 and the second magnetic post 12; and the third right metal portion 234 is located to the right of the first magnetic post 11.

[0109] In this embodiment, the first substrate 8a, the second substrate 8b, or the third substrate 8c is provided with multiple wiring layers. The first upper metal portion 211 is located on multiple wiring layers on the second substrate 8b, and the second upper metal portion 231 is also located on multiple wiring layers on the second substrate 8b. (Refer to...) Figure 8 ,like Figure 8 As shown, the second substrate 8b includes a first wiring layer 10 and a second wiring layer 20. The structure of the third substrate 8c is similar to the wiring layer structure of the second substrate 8b, and will not be described again here. It should be noted that in this embodiment, the first wiring layer 10 and the second wiring layer 20 refer to metal traces on the printed circuit board. Some of the metal traces are part of the first winding 21 or the second winding, and other metal traces are used for other circuits. The first wiring layer 10 is disposed above the first magnetic post 11, and the second wiring layer 20 is disposed above the first wiring layer. Taking the layout of the first winding 21 and the third winding on the second substrate 8b as an example, a portion of the first upper metal portion 211 is located in the first wiring layer 10, and the remaining portion of the first upper metal portion 211 is located in the second wiring layer 20. A portion of the second upper metal portion 231 is located in the first wiring layer, and the remaining portion of the second upper metal portion 231 is located in the second wiring layer. That is, part of the first winding 21 is located on the first wiring layer 10 (inner wiring layer), part of the first winding 21 is located on the second wiring layer 20 (outer wiring layer), part of the third winding 23 is located on the first wiring layer 10 (inner wiring layer), and part of the third winding 23 is located on the second wiring layer 20 (outer wiring layer). Other windings can also use a cross-layout of inner and outer wiring layers, which will not be elaborated further here. The first substrate 8a also has wiring layers, and some of the wiring layers on the first substrate 8a can also participate in forming the first winding 21, the second winding 22, and the third winding 23.

[0110] Figure 9AThis is a schematic diagram (I) of the magnetic element structure according to the third embodiment of the present invention. Figure 9B This is a schematic diagram of the structure of the first substrate. Figure 9C for Figure 9B The top view of the first substrate shown. Figure 9D This is a schematic diagram (II) of the magnetic element structure according to the third embodiment of the present invention. The magnetic element in this embodiment is similar in structure to the magnetic element shown in the first embodiment, wherein the same element symbols represent the same elements and functions, and therefore will not be described again here. The magnetic element provided in this embodiment includes: a first magnetic post 11, a second magnetic post 12, a first winding 21, a sixth winding 26 and a seventh winding 27 wound on the first magnetic post 11, and a second winding 22 wound on the second magnetic post 12. The structures of the first winding 21 and the second winding 22 are exactly the same as those of the first winding 21 and the second winding 22 in the first embodiment. The second magnetic post 12 is located below the first magnetic post 11. The sixth winding 26 includes a fourth upper metal portion 261, a sixth left metal portion 262, a sixth middle metal portion 263 and a sixth right metal portion 264. The sixth left metal portion 262, the sixth middle metal portion 263 and the sixth right metal portion 264 are formed on the first substrate 8a. The fourth upper metal portion 261, the sixth left metal portion 262, the sixth middle metal portion 263, and the sixth right metal portion 264 are electrically connected in sequence. The fourth upper metal portion 261 is located above the first magnetic post 11; the sixth left metal portion 262 is located to the left of the first magnetic post 11; the sixth middle metal portion 263 is located between the first magnetic post 11 and the second magnetic post 12; and the sixth right metal portion 264 is located to the right of the first magnetic post 11.

[0111] Continuing from the above, the seventh winding 27 includes a fifth upper metal portion 271, a seventh left metal portion 272, a seventh middle metal portion 273, and a seventh right metal portion 274. The seventh left metal portion 272, the seventh middle metal portion 273, and the seventh right metal portion 274 are formed on the first substrate 8a. The fifth upper metal portion 271, the seventh left metal portion 272, the seventh middle metal portion 273, and the seventh right metal portion 274 are connected sequentially. The fifth upper metal portion 271 is located above the first magnetic post 11; the seventh left metal portion 272 is located to the left of the first magnetic post 11; the seventh middle metal portion 273 is located between the first magnetic post 11 and the second magnetic post 12; and the seventh right metal portion 274 is located to the right of the first magnetic post 11.

[0112] Reference Figure 9BThe first winding 21 is defined as the primary winding 8P of the magnetic element, the sixth winding 21 is the first secondary winding 8s1 of the magnetic element, and the seventh winding is the second secondary winding 8s2 of the magnetic element. At least a portion of the primary winding 8P is located between at least a portion of the first secondary winding 8s1 and at least a portion of the second secondary winding 8s2. A portion of the second secondary winding 8s2 is disposed on the surface of the first upper groove 81.

[0113] Refer to Figure 9C , Figure 9C The diagram illustrates terminals disposed on the left and right sides of the first upper recess 81 of the first substrate 8a. These terminals include a primary side terminal 45, a first secondary side terminal 47, and a second secondary side terminal 46. The second secondary side terminal 46 is connected to the second secondary side winding 8S2, the first secondary side terminal 47 is connected to the first secondary side winding 8S1, and the primary side terminal 45 is connected to the primary side winding 8P. Alternatively, other terminals 49, such as input / output terminals or signal terminals, can be disposed on the left and right sides of the first upper recess 81 and the first lower recess 82 of the first substrate 8a. Figure 9C As illustrated, recessed openings 91 can also be provided on the upper and lower sides of the first upper groove 81 and the first lower groove 82, and the recessed openings 91 can be used to accommodate the magnetic cover plate 18.

[0114] In addition, such as Figure 9D As shown, a first wiring layer 10 and a second wiring layer 20 are disposed within the second substrate 8b. The first wiring layer 10 is close to the first upper groove 81. The second wiring layer 20 is located above the first wiring layer 10, serving as the outer wiring layer and the first wiring layer 10 as the inner wiring layer. The first secondary winding 8S1 and the second secondary winding 8S2 can be arranged in a cross-layout of inner and outer wiring layers. A portion of the first secondary winding 8S1 is located in the outer wiring layer, and another portion is located in the inner wiring layer. Similarly, a portion of the second secondary winding 8S2 is located in the inner wiring layer, and another portion is located in the outer wiring layer. This makes the path lengths of the first secondary winding 8S1 and the second secondary winding 8S2 more consistent, which is beneficial for improving the impedance consistency among multiple secondary windings.

[0115] Reference Figure 10 , Figure 10This is a schematic diagram of the structure of the magnetic element according to the fourth embodiment of the present invention. The difference between this embodiment and the first embodiment is that the second substrate 8b and the third substrate 8c have grooves on the side facing the first substrate 8a. Specifically, the second substrate 8b has a second lower groove 81a with its opening facing downwards. The third substrate 8c has a second upper groove 82a with its opening facing upwards. The second lower groove 81a and the first upper groove 81a together form a first receiving cavity for accommodating the first magnetic post 11, and the second upper groove 82a and the first lower groove 82a together form a second receiving cavity for accommodating the second magnetic post 12. The grooves on the second substrate 8b and the third substrate 8c cooperate with the groove on the first substrate 8a, expanding the space for placing the magnetic post and allowing for the placement of a larger magnetic core. For example, without increasing the thickness of the first substrate 8a, by providing grooves on the second substrate 8b and the third substrate 8c, the thickness of the first magnetic post 11 and the second magnetic post 12 can be increased. This helps reduce magnetic circuit losses and improve efficiency. The groove depth of the first substrate 8a ( Figure 10 The depth of the first upper groove 81 and the first lower groove 82 is generally limited by the circuit board process. Without increasing the thickness of the first substrate 8a, the required magnetic column thickness can be achieved by setting grooves on the second substrate 8b and the third substrate 8c as described above. By adopting this embodiment, the application scope of the present invention can be expanded.

[0116] Figure 11 This is a schematic diagram of the structure of a power module according to an embodiment of the present invention. Figure 12 This is a three-dimensional structural diagram of the power module in this embodiment. Figure 11 As shown, the first power module 200 includes any of the magnetic elements in the first to fourth embodiments and at least one power switch 3. The power switch 3 is disposed above the first upper metal portion 211 or below the first lower metal portion 223. Figure 12 As shown, a first upper metal portion 211 is formed on the second substrate 8b, and a first lower metal portion 223 is formed on the third substrate 8c. Power switches 3 are disposed on the surfaces of the second substrate 8b and the third substrate 8c facing away from the magnetic pillars. The power module structure of this application is reliable in terms of symmetrical stress, and its structure is simple and compact. Since there are no power switches or passive components stacked with the magnetic pillars in the vertical direction, the magnetic pillars can extend in the height direction, i.e., along the axis of the magnetic loop, making the magnetic circuit of the magnetic pillars balanced and helping to reduce magnetic flux loss. The power switches 3 are respectively disposed on the surfaces of the second substrate 8b and the third substrate 8c facing away from the magnetic pillars, resulting in a simple structure, fewer components, high power density, and simple manufacturing process with low cost.

[0117] Figure 13A This is a schematic diagram of the power module according to another embodiment of the present invention. Figure 13BThis is a schematic diagram of a matrix arrangement of magnetic cores in a power module according to another embodiment of the present invention. Figure 14 This is a schematic diagram of a continuous first substrate structure fabricated using a continuous circuit board method. Figure 11 The difference in the power module shown is that it contains an array of magnetic columns. (Refer to...) Figure 13A The magnetic components of the second power module 200a include a first magnetic post 11, a second magnetic post 12, a third magnetic post 13, a fourth magnetic post 14, a first winding 21, a second winding 22, a fourth winding 24, and a fifth winding 25. The first and second windings are the same as those in the first to fourth embodiments and will not be described again here. The third magnetic post 13 and the fourth magnetic post 14 are stacked, with the third magnetic post 13 located to the right of the first magnetic post 11 and the fourth magnetic post 14 located to the right of the second magnetic post 12. The fourth winding 24 is wound around the third magnetic post 13, and the fifth winding 25 is wound around the fourth magnetic post 14. The fourth winding 24 includes a third upper metal portion 241, a fourth left metal portion 242, a fourth middle metal portion 243, and a fourth right metal portion 244. The third upper metal portion 241, the fourth left metal portion 242, the fourth middle metal portion 243, and the fourth right metal portion 244 are connected sequentially. The third upper metal portion 241 is located above the third magnetic post 13. The fourth left metal portion 242 is located to the left of the third magnetic post 13. The fourth middle metal portion 243 is located between the third magnetic post 13 and the fourth magnetic post 14. The fourth right metal portion 244 is located to the right of the third magnetic post 13. The fifth winding 25 includes a fifth middle metal portion 251, a fifth left metal portion 252, a second lower metal portion 253, and a fifth right metal portion 254. The fifth middle metal portion 251, the fifth left metal portion 252, the second lower metal portion 253, and the fifth right metal portion 254 are connected sequentially. The fifth middle metal portion 251 is located between the third magnetic post 13 and the fourth magnetic post 14. The fifth left metal portion 252 is located to the left of the fourth magnetic post 14. The second lower metal portion 253 is located below the fourth magnetic post 14. The fifth right metal portion 254 is located to the right of the fourth magnetic post 14. The third upper metal portion 241, the fourth left metal portion 242, the fourth middle metal portion 243, the fourth right metal portion 244, the fourth left metal portion 242, the fourth middle metal portion 243, the fourth right metal portion 244, the fifth middle metal portion 251, the fifth left metal portion 252 and the fifth right metal portion 254 are formed on the first substrate 8a.

[0118] The first substrate 8a also has a third upper groove 81b and a third lower groove 82b, and the third magnetic post 13 and the fourth magnetic post 14 are respectively disposed in the third upper groove 81b and the third lower groove 82b. The first substrate 8a can be fabricated in a continuous lamination manner. (Refer to...) Figure 14 , Figure 14 This is a schematic diagram of a continuous first substrate structure fabricated using a continuous circuit board method. The continuous first substrate is nxn ( Figure 14 The continuous arrangement of n=3). After the first continuous substrate is manufactured, it is cut to obtain a one-piece molded product, such as... Figure 13A The first substrate 8a shown.

[0119] Continuing from the above, in this embodiment, referring to Figure 13A The third upper metal portion 241 may be formed on the second substrate 8b. The second lower metal portion 253 is formed on the third substrate 8c. A power switch 3 is provided on the upper surface of the second substrate 8b and the power switch 3 is provided on the lower surface of the third substrate 8c.

[0120] like Figure 13B As shown, the two ends of the first magnetic post 11, the second magnetic post 12, the third magnetic post 13, and the fourth magnetic post 14 of the array-type power module are connected by magnetic cover plates 18 to form magnetic circuits. The array structure of this power module is beneficial for increasing the power of the power module and allows for the reuse of magnetic flux and magnetic circuits to improve efficiency. It may also allow for circuit reuse, further improving efficiency. Alternatively, it facilitates the arrangement of switching devices, especially the rectifier devices on the secondary side, which helps reduce winding length and losses. Furthermore, the array-type power module formed using the power module structure of this invention is more compact and simple, and has higher power density.

[0121] In the above embodiments, the first magnetic post 11, the second magnetic post 12, the third magnetic post 13 and the fourth magnetic post are all cuboids.

[0122] Figures 15a-15f This document illustrates the manufacturing process of a power module according to the present invention, specifically the manufacturing process of the power module using the magnetic components of the first embodiment. (Refer to...) Figure 15a , Figure 15a Step S1 is disclosed, a first substrate 8a is provided, and a first upper groove 81 and a first lower groove 82 are provided on the upper and lower surfaces of the first substrate 8a.

[0123] Figure 15b Step S2 is disclosed, in which the first magnetic post 11 and the second magnetic post 12 are placed in the first upper groove 81 and the first lower groove 82 respectively. Specifically, adhesive is applied to the first groove 81 and the second groove 82 firstly, and then the first magnetic post 11 and the second magnetic post 12 are placed in sequence, so that the first magnetic post 11 and the second magnetic post 12 are fixed in the first upper groove 81 and the first lower groove 82 respectively.

[0124] While performing step S2, step S3 can be performed simultaneously. Power components, such as switching devices or passive components, can be soldered on the side of the third substrate 8c away from the groove, for example, by using SMT (surface mounting technology) and reflow soldering. If magnetic components are being fabricated, this step can be omitted.

[0125] Figure 15e Step S4 is revealed, in which the second substrate 8b and the third substrate 8c, on which power components are soldered, are placed on the first substrate 8a of the magnetic post to form a complete first winding 21 and a complete second winding 22.

[0126] Figure 15e It also reveals that if the actual manufacturing or production is carried out in a panel manner, the multiple power modules formed in the panel manner will be cut into a single power module. Conductive vias are provided at both ends of the second substrate 8b and the third substrate 8c, with the optimal cutting line position (…). Figure 15e The dashed line indicates the cutting line location, situated at the point where conductive vias are provided on the second substrate 8b and the third substrate 8c. For example... Figure 15f As shown, after cutting along the cutting line, multiple pins 48 of the power module, such as pads, can be formed on the left end face or the right end face of the second substrate 8b and the third substrate 8c.

[0127] In step S1, a continuous first substrate can be provided, referring to the combination Figure 14 , Figure 14 This is a schematic diagram of a continuous first substrate manufactured using a continuous lamination method. The continuous first substrates are arranged in a 3x3 continuous lamination pattern. After the continuous first substrates are manufactured, they are cut at the cutting line (dashed line in the figure) to form 9 first substrates 8a. Production using the continuous lamination method can significantly improve substrate manufacturing efficiency and reduce costs. It should be noted that, optimally, the grooves on the two surfaces of the first substrate 8a are symmetrical. The first upper groove 81 and the first lower groove 82 are completely symmetrical on both sides of the first substrate 8a. This facilitates stress balance within the first substrate 8a, reduces deformation of the first substrate 8a during temperature changes, and improves the reliability or process stability of the transformer module or power supply module.

[0128] Figures 16a-16d This describes the fabrication process of the first substrate of the present invention. (Refer to...) Figure 16a , Figure 16a Step S11 is disclosed, a first circuit board 7a is provided, the first circuit board 7a having a metal part inside for forming the winding.

[0129] Figure 16bIn step S12, a second circuit board 7b and a third circuit board 7c are provided. The second circuit board 7b has a first through hole 71, and the third circuit board 7c has a second through hole 72. The second circuit board 7b is bonded to the upper surface of the first circuit board 7a through a third bonding layer 53, and the third circuit board 7c is bonded to the lower surface of the first circuit board 7a through a fourth bonding layer 54. The second circuit board 7b with the first through hole 71 is stacked on the upper surface of the first circuit board 7a, and the third circuit board 7c with the second through hole 72 is attached to the lower surface of the first circuit board 7a, so that the upper and lower surfaces of the first circuit board 7a respectively form a first upper groove 81 and a first lower groove 82.

[0130] Figure 16c Step S13 is revealed, in which the upper and lower groove structures of the first circuit board 7a are shaped using a laser beam, for example, to remove the extruded bonding layer.

[0131] Figure 16d Step S14 is revealed. In step S14, multiple conductive vias 63 are fabricated. Pads 4 are formed on the end face of the second circuit board 7b for electrical connection with the corresponding internal conductive layer. Through the above steps, by stacking the second circuit board 7b and the third circuit board 7c, which are equipped with vias, on the upper and lower surfaces of the first circuit board 7a, it is easier to increase the depth of the groove, which is beneficial to increasing the cross-sectional area of ​​the magnetic post and improving efficiency.

[0132] In some other embodiments, the first substrate can also be formed by cutting grooves in the upper and lower surfaces of a fourth circuit board.

[0133] Figures 17a to 17d The illustrations show some typical application circuits that utilize the power module provided in this application, but are not limited to these circuits. Figure 17a This diagram illustrates a half-bridge LLC circuit. Figure 17b This illustrates another type of half-bridge LLC circuit. Figure 17c This diagram illustrates a full-bridge LLC circuit. Figure 17d This diagram illustrates an LLC circuit incorporating an autotransformer. In the figure, 31-32 represent rectifier components, Q1 to Q4 represent primary-side bridge switching devices, TR represents the transformer (magnetic component), Co represents the output capacitor, Cin represents the input capacitor, Lr represents the resonant inductor, and Cr represents the resonant capacitor. Vin represents the input voltage, Vo represents the positive output terminal, and GND represents the negative output terminal.

[0134] In addition, the structure of this invention can also be applied to Cuk circuits or flyback circuits, etc.

[0135] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims defined in the appended patent application.

Claims

1. A magnetic element, characterized by, A magnetic core comprising: a first magnetic pillar; a second magnetic pillar below the first magnetic pillar; a first winding comprising: a first upper metal portion above the first magnetic pillar; a first left metal portion left of the first magnetic pillar; a first middle metal portion between the first magnetic pillar and the second magnetic pillar; and a first right metal portion right of the first magnetic pillar, the first upper metal portion, the first left metal portion, the first middle metal portion, and the first right metal portion being connected in sequence, and a second winding comprising: a second middle metal portion between the first magnetic pillar and the second magnetic pillar; a second left metal portion left of the second magnetic pillar; a first lower metal portion below the second magnetic pillar; and a second right metal portion right of the second magnetic pillar, the second middle metal portion, the second left metal portion, the first lower metal portion, and the second right metal portion being connected in sequence, wherein the first left metal portion, the first middle metal portion, the first right metal portion, the second middle metal portion, the second left metal portion, and the second right metal portion are formed on a first substrate having a first upper recess and a first lower recess, the first magnetic pillar and the second magnetic pillar being disposed in the first upper recess and the first lower recess, respectively. The first upper metal portion is formed on a second substrate, and the first lower metal portion is formed on a third substrate.

2. The magnetic element of claim 1, wherein, The first substrate, the second substrate, and the third substrate are printed circuit boards.

3. The magnetic element of claim 2, wherein, The first left metal portion, the first right metal portion, the second left metal portion, and the second right metal portion are conductive vias.

4. The magnetic element of claim 1, wherein, A surface of the first upper recess is plated with metal.

5. The magnetic element of claim 1, wherein, The second substrate comprises:

6. The magnetic element of claim 3, wherein, a first wiring layer disposed above the first magnetic pillar; and a second wiring layer disposed above the first wiring layer, part of the first upper metal portion being disposed on the first wiring layer, and the rest of the first upper metal portion being disposed on the second wiring layer. The magnetic core further comprises a third winding comprising:

7. The magnetic element of claim 6, wherein, a second upper metal portion above the first magnetic pillar; a third left metal portion left of the first magnetic pillar; a third middle metal portion between the first magnetic pillar and the second magnetic pillar; and a third right metal portion right of the first magnetic pillar, the second upper metal portion, the third left metal portion, the third middle metal portion, and the third right metal portion being connected in sequence, wherein part of the second upper metal portion is disposed on the first wiring layer, and the rest of the second upper metal portion is disposed on the second wiring layer. ​ 8. The magnetic element of claim 1, wherein, The magnetic core further comprises a first magnetic cover plate, a second magnetic cover plate, a third magnetic cover plate and a fourth magnetic cover plate, the first magnetic cover plate and the second magnetic cover plate are respectively arranged on the front side and the back side of the first magnetic column, the third magnetic cover plate and the fourth magnetic cover plate are respectively arranged on the front side and the back side of the second magnetic column, the end faces of the first magnetic cover plate, the second magnetic cover plate, the third magnetic cover plate and the fourth magnetic cover plate are inclined surfaces, a first inclined air gap is formed between the first magnetic cover plate and the third magnetic cover plate, and a second inclined air gap is formed between the second magnetic cover plate and the fourth magnetic cover plate.

9. The magnetic element of claim 1, wherein, The first upper metal part and the first lower metal part are realized by metallization.

10. The magnetic element of claim 3, wherein, Further comprising a first bonding layer and a second bonding layer, the first bonding layer is located between the second substrate and the first substrate, and the second bonding layer is located between the third substrate and the first substrate.

11. The magnetic element of claim 10, wherein, The first bonding layer is arranged outside the first upper groove slot, and the second bonding layer is arranged outside the first lower groove slot.

12. The magnetic element of claim 1, wherein, The width of the first upper groove slot is greater than the width of the first upper groove bottom, and the width of the first lower groove slot is greater than the width of the first lower groove bottom.

13. The magnetic element of claim 1, wherein, The shape of the first magnetic column matches the shape of the first upper groove, and the shape of the second magnetic column matches the shape of the first lower groove.

14. The magnetic element of claim 3, wherein, The second substrate has a second lower groove, the second lower groove slot is downward, the third substrate has a second upper groove, the second upper groove slot is upward, the second lower groove and the first upper groove form a first accommodating cavity for accommodating the first magnetic column, and the second upper groove and the first lower groove form a second accommodating cavity for accommodating the second magnetic column.

15. The magnetic element of claim 1, wherein, The magnetic core further comprises a third magnetic column and a fourth magnetic column, the third magnetic column and the fourth magnetic column are stacked, the third magnetic column is located on the right side of the first magnetic column, and the fourth magnetic column is located on the right side of the second magnetic column; the magnetic element further comprises: A fourth winding comprises: A third upper metal part located above the third magnetic column; A fourth left metal part located on the left side of the third magnetic column; A fourth intermediate metal part located between the third magnetic column and the fourth magnetic column; and A fourth right metal part located on the right side of the third magnetic column, the third upper metal part, the fourth left metal part, the fourth intermediate metal part and the fourth right metal part are sequentially connected, and A fifth winding comprises: A fifth intermediate metal part located between the third magnetic column and the fourth magnetic column; A fifth left metal part located on the left side of the fourth magnetic column; A second lower metal part located below the fourth magnetic column; and A fifth right metal part located on the right side of the fourth magnetic column, the fifth intermediate metal part, the fifth left metal part, the second lower metal part and the fifth right metal part are sequentially connected, ​ The fourth left metal part, the fourth middle metal part, the fourth right metal part, the fifth middle metal part, the fifth left metal part and the fifth right metal part are formed on the first substrate, and the first substrate further has a third upper groove and a third lower groove, and the third magnetic column and the fourth magnetic column are arranged in the third upper groove and the third lower groove respectively.

16. The magnetic element of claim 15, wherein, The first magnetic column, the second magnetic column, the third magnetic column and the fourth magnetic column are all cuboids.

17. The magnetic element of claim 1, wherein, The magnetic element further comprises a sixth winding, and the sixth winding comprises: A fourth upper metal part above the first magnetic column; A sixth left metal part on the left side of the first magnetic column; A sixth middle metal part between the first magnetic column and the second magnetic column; and A sixth right metal part on the right side of the first magnetic column, the sixth left metal part, the sixth middle metal part and the sixth right metal part are formed on the first substrate, and the fourth upper metal part, the sixth left metal part, the sixth middle metal part and the sixth right metal part are sequentially connected, The first winding is a primary winding of the magnetic element, and the sixth winding is a first secondary winding of the magnetic element.

18. The magnetic element of claim 17, wherein, The magnetic element further comprises a seventh winding, and the seventh winding comprises: A fifth upper metal part above the first magnetic column; A seventh left metal part on the left side of the first magnetic column; A seventh middle metal part between the first magnetic column and the second magnetic column; and A seventh right metal part on the right side of the first magnetic column, the seventh left metal part, the seventh middle metal part and the seventh right metal part are formed on the first substrate, and the fifth upper metal part, the seventh left metal part, the seventh middle metal part and the seventh right metal part are sequentially connected, The seventh winding is a second secondary winding of the magnetic element, and at least part of the primary winding is located between at least part of the first secondary winding and at least part of the second secondary winding.

19. The magnetic element of claim 1, wherein, The first substrate is formed by arranging a second circuit board with a first through hole on the upper surface of a first circuit board and a third circuit board with a second through hole on the lower surface of the first circuit board, or by forming grooves on the upper and lower surfaces of a fourth circuit board.

20. The magnetic element of claim 2, wherein, The second and third substrates are electrically connected to the first substrate through a plurality of conductive vias.

21. The magnetic element of claim 2, wherein, The second and third substrates are electrically connected to the first substrate only through a plurality of conductive vias.

22. The magnetic element of claim 20, wherein, The second and third substrates are respectively combined with the two sides of the first substrate by a bonding layer.

23. The magnetic element of claim 20, wherein, 24. A power module comprising the magnetic element of claim 1, and further comprising at least one power switch arranged above the first upper metal part or below the first lower metal part. ​ 25. The power module of claim 24, wherein, Also comprising a plurality of pins, the first upper metal part is formed on a second substrate, the first lower metal part is formed on a third substrate, the plurality of pins are respectively arranged on the left side end surface of the second substrate and the third substrate, or respectively arranged on the right side end surface of the second substrate and the third substrate.

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