An integrated circuit package test socket with controllable abutment degree
By using a transmission screw system driven by a forward and reverse motor in the integrated circuit package test seat, the contact pressure between the package and the probe is automatically adjusted, which solves the problem of large wear of the probe and time-consuming and labor-intensive detection, and achieves the extension of the probe life and the improvement of the detection efficiency.
Patent Information
- Application Number
- CN202211016087.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-08-24
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2042-08-24
AI Technical Summary
In the existing integrated circuit packaging test seat, manual operation leads to large wear of the probe, shortened service life and time-consuming and labor-intensive inspection.
The transmission screw system driven by a forward and reverse motor is adopted. Through the threaded connection between the limiting device and the test device, the contact pressure between the package and the probe is automatically adjusted, so as to achieve controllable degree of resistance.
It reduces the wear of the probe, extends the service life of the probe, improves the detection efficiency and reduces the cost of manual operation.
Smart Images

Figure CN115469119B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of integrated circuit packaging and testing, and particularly relates to an integrated circuit packaging test socket with controllable abutment degree. Background Art
[0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging processes, such as BGA packaging. Before the processed semiconductor chip packages are provided to users, test sockets are used to check the electrical characteristics of the semiconductor chip packages.
[0003] In the actual operation of the existing test sockets, first, a fixed plate with socket pins (i.e., probes) is connected to the lower chassis through fixing screws, and side supports for fixing the package from the side are also connected to the lower chassis. Through the above side supports, the package is placed above the lower chassis. In the actual project of the pressurized package test socket with the above structure, in order to make the package contact the socket pins (i.e., probes), pressure is applied to the pressure plate; since this project is manually operated, it is impossible to apply a certain amount of pressure to the pressure plate. In order to make the above package and socket pins (i.e., probes) contact more firmly, excessive pressure is often applied, resulting in relatively large wear of the socket pins (i.e., probes), shortening the service life of the socket pins (i.e., probes), and the operation by manual force incurs high labor costs and is time-consuming and laborious. Therefore, we propose an integrated circuit packaging test socket with controllable abutment degree. Summary of the Invention
[0004] The main purpose of the present invention is to provide an integrated circuit packaging test socket with controllable abutment degree, which can effectively solve the problems in the background art.
[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:
[0006] An integrated circuit packaging test socket with controllable abutment degree, including a base, a side support plate is integrally formed at the rear part of the upper end of the base, a transmission groove and two stable grooves are provided at the front end of the side support plate, and the transmission groove is located between the two stable grooves. A limiting device and a testing device are slidably installed together between the transmission groove and the two stable grooves, and the limiting device is located above the testing device. A positive and negative motor is fixedly installed at the upper end of the side support plate, a transmission screw is fixedly installed at the output end of the positive and negative motor, the lower end of the transmission screw penetrates through the upper end of the side support plate and is movably installed with the lower groove wall of the transmission groove through a bearing, and both the limiting device and the testing device are threadedly connected to the transmission screw;
[0007] The limiting device includes a limiting plate. A plurality of suction nozzles are inserted and connected to the upper end of the limiting plate. A packaging limiting groove is arranged in the middle of the lower end of the limiting plate, and the packaging limiting groove is communicated with the inside of the suction nozzles. A driving block and two stabilizing blocks are fixedly installed at the rear end of the limiting plate, and the driving block is located between the two stabilizing blocks.
[0008] Preferably, the threads on the upper and lower sides of the outer surface of the driving screw are of reverse structure, and the limiting device and the testing device are respectively threadedly connected to the upper two sides of the driving screw.
[0009] Preferably, adjusting screws are inserted and connected to the left and right sides of the upper end of the limiting plate. Both of the adjusting screws are threadedly connected to the limiting plate. Avoidance grooves are arranged on the left and right sides of the lower end of the limiting plate, and the positions of the avoidance grooves correspond to the positions of the adjusting screws.
[0010] Preferably, the driving block and the two stabilizing blocks are respectively slidably installed in corresponding driving grooves and stabilizing grooves, and the driving block is threadedly connected to the lower part of the driving screw.
[0011] Preferably, the testing device includes a probe support plate. A lower driving block and two lower stabilizing blocks are fixedly installed at the rear part of the upper end of the probe support plate, and the lower driving block is located between the two lower stabilizing blocks. A number of probe bodies are uniformly arranged on the upper end of the probe support plate. Anti-pressure plates are fixedly installed on the left and right sides of the upper end of the probe support plate, and sensors are embedded in the upper ends of both of the anti-pressure plates.
[0012] Preferably, the lower driving block and the two lower stabilizing blocks are respectively slidably installed in corresponding driving grooves and stabilizing grooves, and the lower driving block is threadedly connected to the upper part of the driving screw.
[0013] Compared with the prior art, the present invention has the following beneficial effects:
[0014] 1. In the present invention, the heights of the adjusting screws on the left and right sides are synchronously adjusted according to the thickness of the package, so that the lower end surfaces of the adjusting screws and the lower end surface of the package are located on the same plane, preventing excessive pressure on the spherical pins of the package and the probe bodies, reducing the wear of the probe bodies, and prolonging the service life of the probe bodies.
[0015] 2. In the present invention, the driving screw is threadedly connected to the upper driving block and the lower driving block, so that the upper driving block and the lower driving block approach each other until the lower end of the adjusting screw contacts the sensor, eliminating the need for manual pressing operation, saving time and effort, and making the detection convenient and reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of a testing seat for an integrated circuit package with controllable abutment degree according to the present invention;
[0017] Figure 2 Schematic diagram of the connection between the limiting device, the testing device and the transmission screw of an integrated circuit packaging test socket with controllable abutment degree according to the present invention;
[0018] Figure 3 Schematic diagram of the structure of the limiting device of an integrated circuit packaging test socket with controllable abutment degree according to the present invention;
[0019] Figure 4 Schematic diagram of the structure of the testing device of an integrated circuit packaging test socket with controllable abutment degree according to the present invention.
[0020] In the figure: 1, base; 2, side support plate; 3, transmission groove; 4, stable groove; 5, limiting device; 6, testing device; 7, forward and reverse motor; 8, transmission screw; 51, limiting plate; 52, packaging limiting groove; 53, suction nozzle; 54, adjusting screw; 55, upper stable block; 56, upper transmission block; 511, avoidance groove; 61, probe support plate; 62, probe body; 63, lower transmission block; 64, lower stable block; 65, abutting plate; 66, sensor. Detailed implementation manners
[0021] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.
[0022] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0023] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0024] Embodiment
[0025] Please refer to Figures 1-4 , the present invention provides a technical solution:
[0026] An integrated circuit package test socket with controllable abutment degree, comprising a base 1. A side support plate 2 is integrally formed at the rear part of the upper end of the base 1. A transmission groove 3 and two stable grooves 4 are arranged at the front end of the side support plate 2, and the transmission groove 3 is located between the two stable grooves 4. A limiting device 5 and a testing device 6 are slidably installed between the transmission groove 3 and the two stable grooves 4, and the limiting device 5 is located above the testing device 6. A positive and negative motor 7 is fixedly installed at the upper end of the side support plate 2. The output end of the positive and negative motor 7 is fixedly installed with a transmission screw rod 8. The lower end of the transmission screw rod 8 penetrates through the upper end of the side support plate 2 and is movably installed with the lower groove wall of the transmission groove 3 through a bearing. Both the limiting device 5 and the testing device 6 are threadedly connected to the transmission screw rod 8.
[0027] The limiting device 5 includes a limiting plate 51. A plurality of suction nozzles 53 are inserted and connected to the upper end of the limiting plate 51. A package limiting groove 52 is arranged in the middle of the lower end of the limiting plate 51, and the package limiting groove 52 is communicated with the inside of the suction nozzles 53. The package is fixedly installed in the package limiting groove 52 by the suction generated by the suction nozzles 53, and the operation is convenient. A upper transmission block 56 and two upper stable blocks 55 are fixedly installed at the rear end of the limiting plate 51, and the upper transmission block 56 is located between the two upper stable blocks 55; the threads on the upper and lower sides of the outer surface of the transmission screw rod 8 are of reverse structure, and the limiting device 5 and the testing device 6 are respectively threadedly connected to the upper and lower sides of the transmission screw rod 8; adjusting screws 54 are inserted and connected to the left and right sides of the upper end of the limiting plate 51, and both adjusting screws 54 are threadedly connected to the limiting plate 51. Avoidance grooves 511 are arranged on the left and right sides of the lower end of the limiting plate 51, and the positions of the avoidance grooves 511 correspond to the positions of the adjusting screws 54. When the thickness of the package is equal to the thickness of the package limiting groove 52, the lower part of the adjusting screw 54 can be received in the avoidance groove 511, improving the scope of application; the upper transmission block 56 and the two upper stable blocks 55 are respectively slidably installed in the corresponding transmission groove 3 and stable groove 4, and the upper transmission block 56 is threadedly connected to the lower part of the transmission screw rod 8; the testing device 6 includes a probe support plate 61. A lower transmission block 63 and two lower stable blocks 64 are fixedly installed at the rear part of the upper end of the probe support plate 61, and the lower transmission block 63 is located between the two lower stable blocks 64. A plurality of probe bodies 62 are uniformly arranged at the upper end of the probe support plate 61. Anti-pressure plates 65 are fixedly installed on the left and right sides of the upper end of the probe support plate 61, and sensors 66 are embedded at the upper ends of both anti-pressure plates 65; the lower transmission block 63 and the two lower stable blocks 64 are respectively slidably installed in the corresponding transmission groove 3 and stable groove 4, and the lower transmission block 63 is threadedly connected to the upper part of the transmission screw rod 8. By driving the upper transmission block 56 and the lower transmission block 63 to move in opposite directions by the transmission screw rod 8, manual pressing operation is not required, which is time-saving and labor-saving, and the detection is convenient and reliable.
[0028] It should be noted that the present invention is an integrated circuit package test socket with controllable abutment degree. During the specific use process, first, the positive and negative motor 7 drives the transmission screw 8 to rotate to make the distance between the limit plate 51 and the probe support plate 61 the largest. When testing the package, first place the package with the spherical pins facing down in the package limit groove 52, and then generate suction through the suction nozzle 53 to fixedly install the package in the package limit groove 52. Then, synchronously adjust the height of the adjustment screws 54 on both the left and right sides according to the thickness of the package, so that the lower end surfaces of the adjustment screws 54 and the lower end surface of the package are in the same plane. Then, start the positive and negative motor 7, and drive the transmission screw 8 to rotate in the reverse direction through the positive and negative motor 7. The transmission screw 8 is threadedly connected to the upper transmission block 56 and the lower transmission block 63, so that the upper transmission block 56 and the lower transmission block 63 approach each other until the lower end of the adjustment screw 54 contacts the sensor 66. At this time, the spherical pins of the package just contact the probe body 62. In this way, the pressure transmitted from the spherical pins of the package to the probe body 62 will not be too large, reducing the wear of the probe body 62 and extending the service life of the probe body 62. Moreover, there is no need for manual pressing operation, which saves time and effort and is convenient and reliable for detection.
[0029] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.
Claims
1. An integrated circuit package test socket with controllable abutment degree, comprising a base (1), characterized in that: A side support plate (2) is integrally formed at the rear part of the upper end of the base (1). A transmission groove (3) and two stabilizing grooves (4) are arranged at the front end of the side support plate (2), and the transmission groove (3) is located between the two stabilizing grooves (4). A limiting device (5) and a testing device (6) are jointly and slidably installed between the transmission groove (3) and the two stabilizing grooves (4), and the limiting device (5) is located above the testing device (6). A positive and negative motor (7) is fixedly installed at the upper end of the side support plate (2). An output end of the positive and negative motor (7) is fixedly installed with a transmission screw rod (8). A lower end of the transmission screw rod (8) penetrates through the upper end of the side support plate (2) and is movably installed with a lower groove wall of the transmission groove (3) through a bearing. Both the limiting device (5) and the testing device (6) are threadedly connected to the transmission screw rod (8); The limiting device (5) includes a limiting plate (51). A plurality of suction nozzles (53) are inserted and connected to an upper end of the limiting plate (51). A packaging limiting groove (52) is arranged in a middle part of a lower end of the limiting plate (51), and the packaging limiting groove (52) is communicated with an interior of the suction nozzle (53). An upper transmission block (56) and two upper stabilizing blocks (55) are fixedly installed at a rear end of the limiting plate (51), and the upper transmission block (56) is located between the two upper stabilizing blocks (55); Adjusting screw rods (54) are inserted and connected to left and right sides of the upper end of the limiting plate (51). Both the two adjusting screw rods (54) are threadedly connected to the limiting plate (51). Avoidance grooves (511) are arranged at left and right sides of the lower end of the limiting plate (51), and positions of the avoidance grooves (511) correspond to positions of the adjusting screw rods (54); The testing device (6) includes a probe support plate (61). A lower transmission block (63) and two lower stabilizing blocks (64) are fixedly installed at a rear part of the upper end of the probe support plate (61), and the lower transmission block (63) is located between the two lower stabilizing blocks (64). A plurality of probe bodies (62) are uniformly arranged at the upper end of the probe support plate (61). Anti - pressure plates (65) are fixedly installed at left and right sides of the upper end of the probe support plate (61). Sensors (66) are embedded at upper ends of both the two anti - pressure plates (65); The upper transmission block (56) and the two upper stabilizing blocks (55) are respectively slidably installed in corresponding transmission groove (3) and stabilizing groove (4), and the upper transmission block (56) is threadedly connected to a lower part of the transmission screw rod (8).
2. The integrated circuit package test socket with controllable abutment degree according to claim 1, wherein: Threads on upper and lower sides of an outer surface of the transmission screw rod (8) are of a reverse structure, and the limiting device (5) and the testing device (6) are respectively threadedly connected to two sides of an upper part of the transmission screw rod (8).
3. The integrated circuit package test socket with controllable abutment degree according to claim 1, characterized in that: The lower transmission block (63) and the two lower stabilizing blocks (64) are respectively slidably installed in corresponding transmission groove (3) and stabilizing groove (4), and the lower transmission block (63) is threadedly connected to an upper part of the transmission screw rod (8).
Citation Information
Patent Citations
An integrated circuit package testing socket seat capable of reducing probe abrasion
CN110907666A
Multifunctional testing device for circuit board
CN213581243U