A laser radar transmitting module assembly device and assembly method

Abstract

The present invention provides a laser radar transmitter module assembly device and method. The laser radar transmitter module assembly device is used to assemble a transmitter module from a circuit board equipped with multiple semiconductor lasers, a collimating lens, and a microprism. The device includes a base, a power supply, an adsorption unit, a multi-dimensional adjustment bracket, a divergence angle measurement unit, a target plate, and a curing unit. The multi-dimensional adjustment bracket has an output end movable in at least a first direction and a second direction, the output end being connected to the adsorption unit. The target plate has multiple reference marks. The laser radar transmitter module assembly device is simple and quick to operate, effectively reducing the difficulty of debugging, improving overall efficiency, and the debugged transmitter module is compact and highly integrated.

Description

Technical Field

[0001] The present invention relates to the field of laser ranging, and in particular to an assembly device and an assembly method for a laser radar transmitting module. Background Art

[0002] With the development of optoelectronic technology, lidar is being used more and more widely in scenarios such as intelligent driving, surveying and mapping, robot navigation, and spatial modeling. At the same time, the requirements for the ranging capabilities of lidar are also becoming higher and higher.

[0003] At present, most mechanical lidars used for autonomous driving are based on the principle of pulsed laser ranging, and the lasers they use are mostly semiconductor lasers. The size of most semiconductor lasers is less than 1mm. 3 The following are the advantages of small size, light weight, safe use and low maintenance cost, so its application field is expanding.

[0004] However, semiconductor lasers also have significant disadvantages. For example, the divergence angle of the light beam emitted by a semiconductor laser is large, so its directivity, monochromaticity, and coherence are poor. In addition, there is astigmatism between the fast axis and the slow axis of the semiconductor laser, and there is a large difference in the divergence angle between the fast axis and the slow axis. The divergence angle in the fast axis direction is much larger than the divergence angle in the slow axis direction. Therefore, when a semiconductor laser is used in a lidar, it needs to be collimated by an optical system (such as a collimating lens) to reduce the divergence angle of the light beam and improve the directivity of the light beam.

[0005] For a LiDAR that includes multiple semiconductor lasers, the azimuth accuracy of the multiple laser beams and the divergence angle accuracy of each laser beam must be within the design error range to ensure the LiDAR's ranging distance and ranging accuracy. If the azimuth accuracy of the multiple laser beams is inaccurate, then the LiDAR's ranging accuracy will be inaccurate and there will be a certain error. When the error is large, it will affect the application of the LiDAR. If the divergence angle of each laser beam is too large, the signal returned from irradiating a target of a certain size is too small, and the LiDAR cannot detect the target, affecting the effective detection range of the LiDAR.

[0006] During the production of LiDAR, due to limitations in processing conditions, the transmitting module of the LiDAR cannot be assembled successfully in one go through processing. Instead, it must be adjusted and approximated step by step to ensure that the azimuth accuracy of multiple laser beams and the divergence angle accuracy of each laser beam are within the design error range.

[0007] Existing lidar transmitting modules often have multiple sub-circuit boards movably connected to a main control circuit board, each of which is connected to one or more semiconductor lasers, and each laser corresponds to a vertical field of view angle.

[0008] On the one hand, each sub-circuit board of this transmitting module needs to be debugged separately to adjust the azimuth angle of the laser. On the other hand, the relative position between the semiconductor laser and the corresponding collimating lens of this transmitting module needs to be debugged to adjust the divergence angle of the laser. When the field of view angle of the laser radar is large and the vertical resolution is high, more sub-circuit boards need to be debugged, which makes debugging difficult and time-consuming. At the same time, there is the defect of the transmitting module being too large. In addition, after debugging is completed, each sub-circuit board needs to be fixed, which is cumbersome and has poor manufacturability. Summary of the Invention

[0009] In order to solve the problems existing in the prior art, one of the purposes of the present invention is to provide a laser radar transmitting module assembly device.

[0010] The present invention provides the following technical solutions:

[0011] A laser radar transmitting module assembly device is used to assemble a circuit board provided with multiple semiconductor lasers, a collimating lens and a microprism into a transmitting module, wherein the collimating lens and the microprism are both provided corresponding to the semiconductor lasers;

[0012] The laser radar transmitting module assembly device includes a base, a power supply, an adsorption unit, a multi-dimensional adjustment bracket, a divergence angle measurement unit, a target plate and a curing unit;

[0013] The base is used to support the circuit board, the collimating lens and the microprism;

[0014] The power supply is used to supply power to the circuit board;

[0015] The adsorption unit is used to adsorb the collimating lens and the microprism;

[0016] The multi-dimensional adjustment bracket has an output end that can move in at least a first direction and a second direction, the output end is connected to the adsorption unit, the output end can adjust the position of the collimating lens relative to the base to adjust the divergence angle of the semiconductor laser, and the output end can adjust the position of the microprism relative to the base to adjust the azimuth angle of the semiconductor laser;

[0017] The divergence angle measurement unit is used to measure the divergence angle of the semiconductor laser;

[0018] The target plate has a plurality of reference marks, each of which is provided corresponding to the semiconductor laser and is a spot where the corresponding semiconductor laser light falls when the azimuth angle accuracy is within a design error range;

[0019] The curing unit is used to cure the collimating lens and the microprism on the base.

[0020] As a further optional solution for the laser radar transmitting module assembly device, the adsorption unit includes a vacuum suction head, a vacuum generator and an air compressor. The vacuum suction head, the vacuum generator and the air compressor are connected in sequence, and the vacuum suction head is connected to the output end.

[0021] As a further optional solution to the laser radar transmitting module assembly device, the laser radar transmitting module assembly device further includes a control unit;

[0022] The adsorption unit further includes a solenoid valve, which is electrically connected to the control unit.

[0023] As a further optional solution for the laser radar transmitting module assembly device, the laser radar transmitting module assembly device also includes a shooting unit, which is electrically connected to the control unit and is used to shoot the landing point of the light spot of the semiconductor laser.

[0024] As a further optional solution to the laser radar transmitting module assembly device, the divergence angle measurement unit is electrically connected to the control unit.

[0025] As a further optional solution for the laser radar transmitting module assembly device, the laser radar transmitting module assembly device also includes a base horizontal platform, and the multi-dimensional adjustment bracket, the base and the power supply are all arranged on the base horizontal platform.

[0026] As a further optional solution for the laser radar transmission module assembly device, a positioning piece is provided on the base horizontal platform, and the base is fixedly arranged on the positioning piece.

[0027] As a further optional solution to the laser radar transmitting module assembly device, the curing unit is a UV glue injection machine.

[0028] As a further optional solution for the laser radar transmitting module assembly device, the base has multiple marking areas, and the multiple marking areas are used to place the collimating lens and the microprism respectively.

[0029] Another object of the present invention is to provide a method for assembling a laser radar transmitting module.

[0030] The present invention provides the following technical solutions:

[0031] A laser radar transmitting module assembly method, applied to the above-mentioned laser radar transmitting module assembly device, the laser radar transmitting module assembly method comprising:

[0032] fixing the circuit board on the base;

[0033] placing the collimating lens on the base;

[0034] placing the microprism on the base;

[0035] Connecting the power supply to the circuit board to light up the semiconductor laser on the circuit board;

[0036] The adsorption unit is driven to move by the output end to adsorb the collimating lenses one by one and adjust the positions of the collimating lenses. Meanwhile, the divergence angle measurement unit is used to measure the divergence angle of the corresponding semiconductor laser until the divergence angle accuracy of the corresponding semiconductor laser is within the design error range. The collimating lens is cured on the base by the curing unit.

[0037] The output end is used to drive the adsorption unit to move, adsorb the microprisms one by one and adjust the positions of the microprisms until the corresponding spot of the semiconductor laser coincides with the reference mark, and the curing unit is used to cure the microprisms on the base.

[0038] The embodiments of the present invention have the following beneficial effects:

[0039] A base is provided to support the circuit board, collimating lens, and microprism. When assembling the transmitter module, the collimating lens and microprism are placed on the base, the circuit board is fixed to the base, and power is supplied to the circuit board using a power supply, illuminating the multiple semiconductor lasers provided on the circuit board. The collimating lenses are then adsorbed one by one using an adsorption unit, and the output end of the multi-dimensional adjustment bracket is used to drive the adsorption unit to move, adjusting the position of the collimating lens relative to the base. Simultaneously, the divergence angle measurement unit is used to measure the divergence angle of the corresponding semiconductor laser until the divergence angle of the corresponding semiconductor laser is within the design error range. The collimating lens is then solidified on the base using a curing unit. Similarly, the microprisms are adsorbed one by one using an adsorption unit, and the output end of the multi-dimensional adjustment bracket is used to drive the adsorption unit to move, adjusting the position of the microprism relative to the base until the corresponding semiconductor laser's spot coincides with the reference mark on the target plate. The microprism is then solidified on the base using a curing unit, thereby completing the assembly of the transmitter module. During this process, the collimating lenses are debugged and cured one by one according to the emission angle measured by the divergence angle measurement unit, and the microprisms are debugged and cured one by one according to the reference marks on the target plate. The operation is simple and fast, which effectively reduces the difficulty of debugging and improves the overall efficiency. After debugging, the emission module is small in size and highly integrated.

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1 The figure shows the overall structure of a laser radar transmitting module assembly device provided in Example 1 of the present invention;

[0043] Figure 2 A schematic structural diagram of a transmitting module provided in Example 1 of the present invention is shown;

[0044] Figure 3 A schematic diagram showing the matching relationship between a base and a positioning member in a laser radar transmitting module assembly device provided in Example 1 of the present invention is shown;

[0045] Figure 4 A schematic structural diagram of an adsorption unit in a laser radar transmitting module assembly device provided in Example 1 of the present invention is shown;

[0046] Figure 5 A schematic structural diagram of a multi-dimensional adjustment bracket in a laser radar transmitting module assembly device provided in Example 1 of the present invention is shown;

[0047] Figure 6 A schematic structural diagram of a divergence angle measurement unit in a laser radar transmitting module assembly device provided in Example 1 of the present invention is shown;

[0048] Figure 7 A flowchart of the steps of a laser radar transmitting module assembly method provided in Example 2 of the present invention is shown.

[0049] Description of main component symbols:

[0050] 10-circuit board; 20-fast axis collimating microlens; 30-slow axis collimating microlens; 40-microprism; 50-compensating prism;

[0051] 100-base horizontal platform; 110-positioning part; 111-positioning groove; 200-base; 300-power supply; 400-adsorption unit; 410-vacuum suction head; 420-vacuum adapter; 430-vacuum generator; 440-air compressor; 450-solenoid valve; 460-air pipe; 500-multi-dimensional adjustment bracket; 510-first translation assembly; 520-second translation assembly; 530-third translation assembly; 540-rotation assembly; 550-output end; 600-divergence angle measurement unit; 610-attenuation plate; 620-doublet lens; 630-lens barrel; 640-filter; 650-industrial CCD camera; 700-target plate; 800-control unit; 900-shooting unit. DETAILED DESCRIPTION

[0052] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0053] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0054] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0055] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the template description herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0057] Example 1

[0058] Please also refer to Figure 1 and Figure 2 This embodiment provides a laser radar transmitting module assembly device for assembling a circuit board 10 provided with multiple semiconductor lasers, a collimating lens and a microprism 40 into a transmitting module.

[0059] Among them, the semiconductor laser is mounted on the circuit board 10 and is an edge-emitting semiconductor laser. The light emitted by the semiconductor laser has a certain divergence angle, which is generally divided into two directions. In one direction, the light divergence angle is large and the light diverges quickly, which is called the fast axis direction of the semiconductor laser. In the other direction, the light divergence angle is small and the light diverges slowly, which is called the slow axis direction of the semiconductor laser. The fast axis and slow axis of the semiconductor laser remain perpendicular, and the beam waist of the light in the fast axis direction and the beam waist of the light in the slow axis direction do not overlap, resulting in a certain amount of astigmatism.

[0060] The plurality of semiconductor lasers are arranged along a first direction, and the semiconductor lasers emit laser light along a second direction. In addition, the collimating lens and the microprism 40 are both arranged corresponding to the semiconductor lasers.

[0061] In this embodiment, the first direction and the second direction are perpendicular to each other and are both horizontal directions.

[0062] See also Figure 2 The collimating lenses are divided into two types: fast-axis collimating microlenses 20 and slow-axis collimating microlenses 30. The number of fast-axis collimating microlenses 20 and the number of slow-axis collimating microlenses 30 are the same as the number of semiconductor lasers. Similarly, the number of microprisms 40 is also the same as the number of semiconductor lasers.

[0063] Specifically, a plurality of fast-axis collimating microlenses 20 are arranged along a first direction, a plurality of slow-axis collimating microlenses 30 are arranged along the first direction, and a plurality of microprisms 40 are arranged along the first direction. Furthermore, a semiconductor laser, fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 are arranged along a second direction, and laser light emitted by the semiconductor laser passes through the corresponding fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 in sequence.

[0064] During this process, the fast-axis collimating microlens 20 collimates the laser light in the fast-axis direction, and the slow-axis collimating microlens 30 collimates the laser light in the slow-axis direction. The fast-axis collimating microlens 20 and the slow-axis collimating microlens 30 work together to adjust the divergence angle of the laser light, converting the divergent light emitted by the semiconductor laser into parallel light. The microprism 40 changes the direction of the laser light emitted by the semiconductor laser through the principle of prism refraction, adjusting the azimuth angle of the laser light. Furthermore, the microprisms 40 are arranged in pairs, and the shapes of each pair of microprisms 40 are different, allowing for different azimuth angles to be achieved.

[0065] In this embodiment, the fast-axis collimating microlens 20 and the slow-axis collimating microlens 30 are both micro cylindrical lenses, the cylindrical surface of which can be spherical or aspherical, and the surface of the micro cylindrical lens is coated with an anti-reflection film.

[0066] Furthermore, the transmitting module further includes two compensating prisms 50. The two compensating prisms 50 are arranged along the first direction and are located on the side of the microprism 40 facing away from the slow-axis collimating microlens 30. They compensate and adjust the laser light deflected by the microprism 40 to ensure the deflection angle of the laser light.

[0067] Please refer again Figure 1 The laser radar transmitting module assembly device consists of a base horizontal platform 100, a base 200, a power supply 300, an adsorption unit 400, a multi-dimensional adjustment bracket 500, a divergence angle measurement unit 600, a target plate 700, a curing unit (not shown in the figure), a control unit 800 and a shooting unit 900.

[0068] The base platform 100 serves as the mounting base for the base 200, power supply 300, and multi-dimensional adjustment bracket 500. The base 200 supports the circuit board 10, fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, microprisms 40, and compensation prisms 50. The power supply 300 supplies power to the circuit board 10, enabling the semiconductor laser mounted thereon to emit laser light. The adsorption unit 400, in conjunction with the multi-dimensional adjustment bracket 500, adjusts the position of the fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 relative to the base 200, thereby adjusting the divergence and azimuth angles of the semiconductor laser. During the debugging process, the debugger uses the divergence angle measurement unit 600 and target plate 700 to determine whether the divergence and azimuth angles of the semiconductor laser are within the designed tolerance range. After debugging is complete, the curing unit cures the fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 onto the base 200. The control unit 800 is electrically connected to the adsorption unit 400 , the divergence angle measurement unit 600 and the shooting unit 900 for easy operation by the debugging personnel.

[0069] Specifically, the base horizontal platform 100 serves as a workbench, the upper surface of which is a table top, and the horizontal state of the table top can be adjusted.

[0070] Please also refer to Figure 1 and Figure 3 A positioning member 110 is provided on the table surface of the base horizontal platform 100, and the positioning member 110 is bolted to the base horizontal platform 100. A positioning groove 111 is provided on the positioning member 110 for accommodating and fixing the base 200 and positioning the base 200 to ensure repeatability during multiple assembly processes.

[0071] The power supply 300 is placed on the table or fixed on the table, and the multi-dimensional adjustment bracket 500 is fixed on the table.

[0072] See also Figure 2 Specifically, the base 200 has three marked areas, one for placing the fast-axis collimating microlens 20, another for placing the slow-axis collimating microlens 30, and the last for placing the microprism 40. Furthermore, the circuit board 10 is mounted on the base 200 by bolting, gluing, or clamping, and the compensation prism 50 is mounted on the base 200 by gluing or other means.

[0073] The marking area can guide the debugging personnel to place the fast-axis collimating microlens 20, the slow-axis collimating microlens 30 and the microprism 40 at the designated positions on the base 200, thereby reducing the position deviation of the fast-axis collimating microlens 20, the slow-axis collimating microlens 30 and the microprism 40 before and after debugging and shortening the debugging time.

[0074] See also Figure 4 Specifically, the adsorption unit 400 is composed of a vacuum head 410 , a vacuum adapter 420 , a vacuum generator 430 , an air compressor 440 , a solenoid valve 450 and an air pipe 460 .

[0075] The vacuum adapter 420 is connected to the multi-dimensional adjustment bracket 500 and moves under the drive of the multi-dimensional adjustment bracket 500. The vacuum head 410 and the vacuum generator 430 are both set on the vacuum adapter 420, and the vacuum head 410 is connected to the vacuum generator 430 via the vacuum adapter 420, and the vacuum generator 430 is connected to the air compressor 440 via the air pipe 460. The air compressor 440 has its own air tank and air filter device, which can generate compressed air, and the air pressure is controlled within the range of 0.3-0.8Mpa. In addition, the solenoid valve 450 is connected to the air pipe 460 and is electrically connected to the control unit 800.

[0076] During operation, the commissioning personnel control the control unit 800 to open the solenoid valve 450, connecting the vacuum generator 430 to the air compressor 440 via the air pipe 460. The vacuum generator 430 generates a vacuum using compressed air, creating a negative pressure at the vacuum head 410. This allows the vacuum head 410 to secure the fast-axis collimating microlens 20, the slow-axis collimating microlens 30, and the microprism 40 through vacuum suction. The commissioning personnel control the control unit 800 to close the solenoid valve 450, disconnecting the airflow and controlling the vacuum head 410 to release the fast-axis collimating microlens 20, the slow-axis collimating microlens 30, and the microprism 40.

[0077] The fast-axis collimating microlens 20 , the slow-axis collimating microlens 30 and the microprism 40 are fixed by vacuum adsorption, which can overcome the problem that the fast-axis collimating microlens 20 , the slow-axis collimating microlens 30 and the microprism 40 are too small to be easily clamped.

[0078] See also Figure 5 Specifically, multi-dimensional adjustment bracket 500 comprises a first translation assembly 510, a second translation assembly 520, a third translation assembly 530, a rotation assembly 540, and an output end 550, which are sequentially connected. Furthermore, vacuum adapter 420 is fixedly connected to output end 550.

[0079] The first translation assembly 510 drives the output end 550 to translate along a first direction, the second translation assembly 520 drives the output end 550 to translate along a second direction, the third translation assembly 530 drives the output end 550 to translate along a third direction, and the rotation assembly 540 drives the output end 550 to rotate about the third direction, which is a vertical direction.

[0080] When the vacuum head 410 adsorbs and fixes the fast-axis collimating microlens 20, the output end 550 drives the vacuum head 410 to move via the vacuum adapter 420, thereby adjusting the position of the fast-axis collimating microlens 20 relative to the base 200 and adjusting the divergence angle of the semiconductor laser in the fast-axis direction.

[0081] When the vacuum suction head 410 adsorbs and fixes the slow-axis collimating microlens 30, the output end 550 drives the vacuum suction head 410 to move via the vacuum adapter 420, thereby adjusting the position of the slow-axis collimating microlens 30 relative to the base 200 and adjusting the divergence angle of the semiconductor laser in the slow-axis direction.

[0082] When the vacuum head 410 adsorbs and fixes the microprism 40 , the output end 550 drives the vacuum head 410 to move via the vacuum adapter 420 , thereby adjusting the position of the microprism 40 relative to the base 200 and debugging the azimuth angle of the semiconductor laser.

[0083] In this embodiment, the first translation assembly 510, the second translation assembly 520, and the third translation assembly 530 are each composed of a base, a screw, a nut, and a slider. The screw is rotatably mounted on the base, and the nut is sleeved onto the screw. The nut is fixedly connected to the slider, and the slider is slidably mounted on the base along the length of the screw. In addition, the base of the first translation assembly 510 is fixedly connected to the tabletop, the base of the second translation assembly 520 is fixedly connected to the slider of the first translation assembly 510, the base of the third translation assembly 530 is fixedly connected to the slider of the second translation assembly 520, and the rotary assembly 540 is fixedly connected to the slider of the third translation assembly 530.

[0084] During use, the debugging personnel can manually rotate the screw to drive the output end 550 to move, or set a motor connected to the screw and electrically connect the motor to the control unit 800, and then control the movement of the output end 550 through the control unit 800.

[0085] See also Figure 6 Specifically, the divergence angle measurement unit 600 is composed of an attenuation plate 610, a doublet lens 620, a lens barrel 630, a filter 640, and an industrial CCD camera 650. The attenuation plate 610 and the doublet lens 620 are arranged at one end of the lens barrel 630, while the filter 640 and the industrial CCD camera 650 are arranged at the other end of the lens barrel 630. The industrial CCD camera 650 is electrically connected to the control unit 800.

[0086] The attenuation plate 610 attenuates the incoming laser light to a range that the industrial CCD camera 650 can withstand, and the filter 640 filters the surrounding ambient light to provide a low background noise working environment for the industrial CCD camera 650.

[0087] The focal length of doublet lens 620 is 500 mm. The CCD pixel size of industrial CCD camera 650 is 2.4 μm × 2.4 μm, the photosensitive surface size is 1 inch (13.19 mm × 8.81 mm), and the resolution is 5496 × 3672. Furthermore, the control unit 800 allows the operator to adjust the acquisition time of industrial CCD camera 650 and, therefore, the exposure level of industrial CCD camera 650.

[0088] The measurement method and principle of the divergence angle refer to the standard "GB / T26599.1-2011 / ISO11146-1:2005 Laser and laser-related equipment - Test method for laser beam width, divergence angle and beam transmission ratio - Part 1: Non-astigmatic and simple astigmatic beams". The lens transformation method is used to measure the divergence angle of the laser emitted by the ranging radar.

[0089] Specifically, the divergence angle is determined by measuring the beam width or beam diameter at the focal plane of the focusing element.

[0090] First, the laser beam should be transformed using an aberration-free focusing element. For a simple astigmatic beam, the beam width d is measured at a distance f from the rear principal plane of the focusing element. σxf and d σyf , the corresponding divergence angle Θ σx and Θ σy Determined by the following two formulas:

[0091]

[0092]

[0093] The calculation of the divergence angle is completed by the control unit 800 and displayed by the control unit 800 .

[0094] In this embodiment, the minimum angle that industrial CCD camera 650 can resolve is 0.023 mrad. Furthermore, the horizontal dimension of the photosensitive surface of industrial CCD camera 650 is 13.19 mm, and the divergence angle measurement range is approximately 26.34 mrad. The vertical dimension of the photosensitive surface is 8.81 mm, and the divergence angle measurement range is approximately 17.6 mrad.

[0095] During use, the debugging personnel debug the divergence angle of the semiconductor laser according to the measurement result of the divergence angle measurement unit 600 until the divergence angle accuracy of the semiconductor laser is within the design error range.

[0096] Please refer again Figure 1 Specifically, the target plate 700 is positioned perpendicular to the second direction and relatively fixed to the substrate horizontal platform 100. The target plate 700 has multiple reference marks, and the number of reference marks is the same as the number of semiconductor lasers. The reference marks are positioned corresponding to the semiconductor lasers and represent the corresponding semiconductor laser's spot landing point when the azimuth angle accuracy is within the designed error range.

[0097] During use, the debugging personnel debug the azimuth angle of the corresponding semiconductor laser by adjusting the position of the microprism 40 relative to the base 200 until the landing point of the corresponding semiconductor laser spot coincides with the reference mark on the target plate 700 .

[0098] Specifically, the photographing unit 900 uses an infrared CCD camera. The camera of the photographing unit 900 faces the target plate 700 and can monitor the relative position of the light spot and the reference mark on the target plate 700 in real time, and transmit the information to the control unit 800 for display.

[0099] Specifically, the control unit 800 adopts a dual-display computer and is electrically connected to the industrial CCD camera 650 , the shooting unit 900 and the solenoid valve 450 .

[0100] Specifically, the curing unit is a UV glue injection machine. After the commissioning personnel adjust the positions of the fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 relative to the base 200, the curing unit injects UV glue between the fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, microprisms 40 and the base 200, curing the fast-axis collimating microlenses 20, slow-axis collimating microlenses 30, and microprisms 40 on the base 200, completing the assembly of the emission module.

[0101] It should be noted that the base 200 on which the circuit board 10, the fast-axis collimating microlens 20, the slow-axis collimating microlens 30, the microprism 40 and the compensating prism 50 are fixed is used as part of the transmitting module. Together with the circuit board 10, the fast-axis collimating microlens 20, the slow-axis collimating microlens 30, the microprism 40 and the compensating prism 50, they are processed and assembled to finally obtain a laser radar.

[0102] The UV glue injection machine can be a handheld glue injection machine, which is manually controlled by a commissioning person, or an automatic glue injection machine, which is fixedly set on the output end 550.

[0103] In summary, the above-mentioned laser radar transmitting module assembly device debugs and installs the fast-axis collimating microlens 20, the slow-axis collimating microlens 30 and the microprism 40 by vacuum adsorption, and debugs and monitors the divergence angle and azimuth angle information at the same time. The operation is simple and quick, which effectively reduces the difficulty of debugging and improves the overall efficiency of debugging. In addition, the vertical field of view angle of the laser radar is mainly determined by the microprism 40 and is not affected by the position of the semiconductor laser on the circuit board 10. The microprism 40 can be replaced as needed to facilitate improving the vertical field of view resolution of the laser radar. Furthermore, the use of UV glue to cure the fast-axis collimating microlens 20, the slow-axis collimating microlens 30 and the microprism 40 increases the speed compared to traditional epoxy glue. Finally, the transmitting module after debugging is small in size and highly integrated, which facilitates modular integration of the laser radar and helps to compress the volume of the laser radar.

[0104] Example 2

[0105] See also Figure 7 This embodiment provides a laser radar transmitting module assembly method, which is applied to the above-mentioned laser radar transmitting module assembly device, and includes the following steps:

[0106] S1. Secure the multi-dimensional adjustment bracket 500 and the positioning member 110 to the base horizontal platform 100. Secure the base 200 to the positioning member 110. Adjust the base horizontal platform 100 and the positioning member 110 to a horizontal position. Maintain relative fixation between the target plate 700 and the base horizontal platform 100, and between the imaging unit 900 and the target plate 700.

[0107] S2 , fixing the circuit board 10 and the compensation prism 50 on the base 200 .

[0108] S3 , placing the fast-axis collimating microlens 20 and the slow-axis collimating microlens 30 on the base 200 .

[0109] Specifically, the debugger controls the solenoid valve 450 through the control unit 800 to open, uses the vacuum head 410 to fix one of the fast-axis collimating microlenses 20, then uses the output end 550 to move the vacuum head 410 to transfer the fast-axis collimating microlens 20 to the marked area on the base 200 for placing the fast-axis collimating microlens 20. The control unit 800 then controls the solenoid valve 450 to close, causing the vacuum head 410 to release the fast-axis collimating microlens 20. This operation is repeated until all the fast-axis collimating microlenses 20 are placed on the base 200.

[0110] Similarly, the debugger controls the solenoid valve 450 through the control unit 800 to open, uses the vacuum head 410 to absorb and fix one of the slow-axis collimating microlenses 30, then uses the output end 550 to move the vacuum head 410 to transfer the slow-axis collimating microlens 30 to the marked area on the base 200 for placing the slow-axis collimating microlens 30. The control unit 800 then controls the solenoid valve 450 to close, causing the vacuum head 410 to release the slow-axis collimating microlens 30. This operation is repeated until all the slow-axis collimating microlenses 30 are placed on the base 200.

[0111] In other embodiments of the present application, the debugger may also grab or clamp the fast-axis collimating microlens 20 and the slow-axis collimating microlens 30 in other ways, and then place the fast-axis collimating microlens 20 and the slow-axis collimating microlens 30 on the base 200 .

[0112] S4 , placing the microprism 40 on the base 200 .

[0113] Specifically, the commissioning personnel control the solenoid valve 450 through the control unit 800 to open, use the vacuum head 410 to suck and fix one of the microprisms 40, then use the output end 550 to drive the vacuum head 410 to move, transfer the microprism 40 to the marked area on the base 200 for placing microprisms 40, and then control the solenoid valve 450 through the control unit 800 to close, causing the vacuum head 410 to release the microprism 40. This operation is repeated until all microprisms 40 are placed on the base 200.

[0114] In other embodiments of the present application, the debugging personnel may also grab or clamp the microprism 40 in other ways and then place the microprism 40 on the base 200 .

[0115] S5 , connecting the power supply 300 to the circuit board 10 to light up the semiconductor laser on the circuit board 10 .

[0116] It should be noted that, under the condition that step S2 is ensured to be before step S5, the order of steps S2, S3, S4 and S5 can be arbitrarily changed.

[0117] S6, debug the divergence angle of the semiconductor laser. The specific steps are as follows:

[0118] The debugging personnel control the solenoid valve 450 to open through the control unit 800, use the vacuum suction head 410 to absorb and fix one of the fast-axis collimating microlenses 20, and then use the output end 550 to drive the vacuum suction head 410 to move, adjust the position of the fast-axis collimating microlens 20 relative to the base 200, and simultaneously use the divergence angle measurement unit 600 to measure the divergence angle of the corresponding semiconductor laser until the divergence angle accuracy of the corresponding semiconductor laser is within the design error range. Finally, the fast-axis collimating microlens 20 is cured on the base 200 using the curing unit.

[0119] Repeat the previous step until all the fast-axis collimating microlenses 20 are cured.

[0120] The debugging personnel control the solenoid valve 450 to open through the control unit 800, use the vacuum suction head 410 to absorb and fix one of the slow-axis collimating microlenses 30, and then use the output end 550 to drive the vacuum suction head 410 to move, adjust the position of the slow-axis collimating microlens 30 relative to the base 200, and simultaneously use the divergence angle measurement unit 600 to measure the divergence angle of the corresponding semiconductor laser until the divergence angle accuracy of the corresponding semiconductor laser is within the design error range. Finally, the slow-axis collimating microlens 30 is cured on the base 200 using the curing unit.

[0121] Repeat the previous step until all the slow-axis collimating microlenses 30 are cured.

[0122] S7, debug the azimuth angle of the semiconductor laser. The specific steps are as follows:

[0123] The debugging personnel control the solenoid valve 450 to open through the control unit 800, use the vacuum suction head 410 to absorb and fix one of the microprisms 40, and then use the output end 550 to drive the vacuum suction head 410 to move, adjust the position of the microprism 40 relative to the base 200 until the corresponding semiconductor laser spot coincides with the reference mark on the target plate 700, and finally use the curing unit to cure the fast-axis collimating microlens 20 on the base 200.

[0124] Repeat the previous step until all the microprisms 40 are cured.

[0125] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

[0126] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0127] The above-described embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that variations and modifications are possible without departing from the scope of the present invention, and such variations and modifications are fully within the scope of protection of the present invention.

Claims

1. A laser radar transmitting module assembly device, characterized in that: Used to assemble a circuit board provided with a plurality of semiconductor lasers, a collimating lens and a microprism into a transmitting module, wherein the collimating lens and the microprism are both provided corresponding to the semiconductor lasers; The laser radar transmitting module assembly device includes a base, a power supply, an adsorption unit, a multi-dimensional adjustment bracket, a divergence angle measurement unit, a target plate and a curing unit; The base is used to carry the circuit board, the collimating lens and the microprism, and the base has a plurality of marking areas, and the plurality of marking areas are used to place the collimating lens and the microprism respectively; The power supply is used to supply power to the circuit board; The adsorption unit is used to adsorb the collimating lens and the microprism; The multi-dimensional adjustment bracket has an output end that can move in at least a first direction and a second direction, the output end is connected to the adsorption unit, the output end can adjust the position of the collimating lens relative to the base to adjust the divergence angle of the semiconductor laser, and the output end can adjust the position of the microprism relative to the base to adjust the azimuth angle of the semiconductor laser; The divergence angle measurement unit is used to measure the divergence angle of the semiconductor laser; The target plate has a plurality of reference marks, each of which is provided corresponding to the semiconductor laser and is a spot where the corresponding semiconductor laser light falls when the azimuth angle accuracy is within a design error range; The curing unit is used to cure the collimating lens and the microprism on the base; The adsorption unit includes a vacuum suction head, a vacuum generator and an air compressor, the vacuum suction head, the vacuum generator and the air compressor are connected in sequence, and the vacuum suction head is connected to the output end; The laser radar transmitting module assembly device also includes a control unit; The adsorption unit further includes a solenoid valve, which is electrically connected to the control unit; The laser radar transmitting module assembly device also includes a shooting unit, which is electrically connected to the control unit and is used to shoot the landing point of the light spot of the semiconductor laser.

2. The laser radar transmitting module assembly device according to claim 1, characterized in that: The divergence angle measurement unit is electrically connected to the control unit.

3. The laser radar transmitting module assembly device according to claim 1 or 2, characterized in that: The laser radar transmitting module assembly device also includes a base horizontal platform, and the multi-dimensional adjustment bracket, the base and the power supply are all arranged on the base horizontal platform.

4. The laser radar transmitting module assembly device according to claim 3, characterized in that: A positioning piece is provided on the base horizontal platform, and the base is fixedly arranged on the positioning piece.

5. The laser radar transmitting module assembly device according to claim 1, characterized in that: The curing unit is a UV glue injection machine.

6. A method for assembling a laser radar transmitting module, characterized in that: The laser radar transmitting module assembly device according to any one of claims 1 to 5, wherein the laser radar transmitting module assembly method comprises: fixing the circuit board on the base; placing the collimating lens on the base; placing the microprism on the base; Connecting the power supply to the circuit board to light up the semiconductor laser on the circuit board; The adsorption unit is driven to move by the output end to adsorb the collimating lenses one by one and adjust the positions of the collimating lenses. Meanwhile, the divergence angle measurement unit is used to measure the divergence angle of the corresponding semiconductor laser until the divergence angle accuracy of the corresponding semiconductor laser is within the design error range. The collimating lens is cured on the base by the curing unit. The output end is used to drive the adsorption unit to move, adsorb the microprisms one by one and adjust the positions of the microprisms until the corresponding spot of the semiconductor laser coincides with the reference mark, and the curing unit is used to cure the microprisms on the base.

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