Heat conducting rod and heat conducting device
By designing a thermal rod that can adjust the thermal conductivity in the thermometer, the problem that the thermal conductivity of the existing thermometer cannot be adjusted is solved, and flexible use and efficient temperature measurement in different environments are achieved.
Patent Information
- Application Number
- CN202110603550.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-05-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2041-05-31
AI Technical Summary
The thermal conductivity of existing thermometers cannot be adjusted, making it difficult to meet the requirements of use in different environments.
A thermal rod is designed, including an insulating layer and a thermal conductivity layer. The thermal conductivity layer is located on the surface and inside of the insulating layer. The number and thickness of the thermal conductivity layer can be adjusted as needed to meet the requirements of different thermal conductivity.
It realizes the flexible use of thermal conductivity rods in different environments, meets the needs of different thermal conductivity, and improves the applicability of the thermometer.
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Figure CN115479492B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat collection devices, and particularly to a heat conducting rod and a heat conducting device including the heat conducting rod. Background Art
[0002] During medical procedures, it is usually necessary to collect the heat of a certain part of an organism (such as the human body) to achieve temperature measurement of that part. Currently, when measuring the human body temperature, it is usually necessary to directly contact the temperature measuring device with the human body. However, the heat conductivity of existing temperature measuring devices usually cannot be adjusted, and thus cannot meet the usage requirements in different environments. Summary of the Invention
[0003] In view of this, this application provides a heat conducting rod that can meet different heat conductivity requirements.
[0004] This application also provides a heat conducting device including the heat conducting rod.
[0005] An embodiment of this application provides a heat conducting rod, including a heat conductor and a circuit connector connected to one end of the heat conductor;
[0006] The heat conductor includes a heat insulating layer and a heat conducting layer. The heat conducting layer is located on the surface of and in the heat insulating layer. Along the direction from the heat conductor to the circuit connector, a first mounting hole and a second mounting hole are provided in the heat conductor, and a first temperature sensor and a second temperature sensor are respectively provided in the first mounting hole and the second mounting hole;
[0007] Wherein, the heat conducting layer at the end of the heat conductor far from the circuit connector is a heat source contact surface for contacting an organism, so that the heat of the organism sequentially passes through the heat conducting layer, the first temperature sensor, the heat conducting layer, and the second temperature sensor. The first temperature sensor and the second temperature sensor are used to respectively convert the received heat into a first signal and a second signal. The circuit connector is used to transmit the first signal and the second signal, and the first signal and the second signal are used to calculate the temperature of the organism.
[0008] An embodiment of this application also provides a heat conducting device. The heat conducting device includes the heat conducting rod, and the heat conducting device further includes a first fixing bracket, a second fixing bracket fixed to the first fixing bracket, and an elastic device. The heat conducting rod is located in the first fixing bracket and the second fixing bracket, and the heat source contact surface of the heat conducting rod extends out of the first fixing bracket.
[0009] The heat conductor provided by the present application includes the heat insulation layer and the heat conduction layer. The heat conduction layer is located on the surface of and within the heat insulation layer. The number and thickness of the heat conduction layer within the heat insulation layer can be varied as needed to meet the requirements of different heat conductivities of the heat conducting rod, so that the heat conducting rod can be used in different environments. Description of the Drawings
[0010] Figure 1 is a schematic structural diagram of a heat conducting rod provided by an embodiment of the present application.
[0011] Figure 2 is Figure 1 an exploded view of the heat conducting rod shown.
[0012] Figure 3 is Figure 1 a cross-sectional view of the heat conducting rod shown along III-III.
[0013] Figure 4 is a schematic structural diagram of a heat conducting device provided by an embodiment of the present application.
[0014] Figure 5 is Figure 4 an exploded view of the heat conducting device shown.
[0015] Figure 6 is Figure 4 a schematic structural diagram of the second fixing bracket and the elastic device of the heat conducting device shown.
[0016] Figure 7 is Figure 4 a cross-sectional view of the heat conducting device shown along VII-VII.
[0017] Description of the Main Component Symbols
[0018] Heat conducting rod 100
[0019] Heat conductor 10
[0020] First mounting hole 11
[0021] Second mounting hole 12
[0022] Heat insulation layer 20
[0023] First heat insulation part 21
[0024] Second heat insulation part 22
[0025] Third heat insulation part 23
[0026] Heat conduction layer 30
[0027] Outer heat conduction copper layer 31
[0028] Heat source contact surface 311
[0029] First inner layer heat-conducting copper layer 32
[0030] Second inner layer heat-conducting copper layer 33
[0031] First temperature sensor 40
[0032] Second temperature sensor 41
[0033] First thermosensitive adhesive 42
[0034] Second thermosensitive adhesive 43
[0035] Circuit connector 50
[0036] Conductive channel 51
[0037] First conductive part 511
[0038] Second conductive part 512
[0039] Electrical connector 52
[0040] First welding leg 521
[0041] Second welding leg 522
[0042] Circuit board 60
[0043] First wire 70
[0044] Second wire 71
[0045] Structure fixator 80
[0046] Fixing body 81
[0047] Protruding part 82
[0048] Heat-conducting device 200
[0049] First fixing bracket 210
[0050] Outlet 211
[0051] First limiting rod 212
[0052] Second fixing bracket 220
[0053] Groove 221
[0054] Opening 222
[0055] Second limiting rod 223
[0056] Elastic device 230
[0057] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific Embodiments
[0058] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.
[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments, and are not intended to limit this application.
[0060] In order to further elaborate on the technical means and effects adopted by the present application to achieve the predetermined purpose, the following detailed description of the present application is made in conjunction with the drawings and preferred embodiments.
[0061] Please refer to Figure 1 , an embodiment of the present application provides a heat conducting rod 100, and the heat conducting rod 100 includes a heat conductor 10, a circuit connector 50, and a structure fixator 80 that are connected in sequence.
[0062] Please refer to Figure 2 and Figure 3 together. In one embodiment, the heat conductor 10 includes a heat insulating layer 20 and a heat conducting layer 30, and the heat conducting layer 30 is located on the surface of the heat insulating layer 20 and in the heat insulating layer 20. Specifically, the heat insulating layer 20 includes a first heat insulating portion 21, a second heat insulating portion 22, and a third heat insulating portion 23 that are stacked in sequence. The heat conducting layer 30 includes an outer heat conducting copper layer 31, a first inner heat conducting copper layer 32, and a second inner heat conducting copper layer 33. The outer heat conducting copper layer 31 is located on the outer surfaces of the first heat insulating portion 21, the second heat insulating portion 22, and the third heat insulating portion 23. The first inner heat conducting copper layer 32 is located between the first heat insulating portion 21 and the second heat insulating portion 22. The second inner heat conducting copper layer 33 is located between the second heat insulating portion 22 and the third heat insulating portion 23.
[0063] Among them, the thicknesses of the outer heat conducting copper layer 31, the first inner heat conducting copper layer 32, and the second inner heat conducting copper layer 33 can also be changed according to the requirements of the heat conductivity.
[0064] In another embodiment, the heat insulating layer 20 may include a greater number of inner heat conducting copper layers. That is, the number of the inner heat conducting copper layers is not limited to two, and may also be other numbers, such as one, three, etc.
[0065] The inner heat-conducting copper layers with different quantities and different thicknesses enable the heat conductor 10 to have different heat conductivities, so as to meet the requirements of different heat conductivities of the heat conducting rod 100.
[0066] The outer heat-conducting copper layer 31 located at one end of the heat conductor 10 away from the circuit connector 50 can serve as a heat source contact surface 311, and the heat source contact surface 311 is used to contact a certain part of the organism, so that the heat of this part of the organism is conducted to the heat source contact surface 311.
[0067] In one embodiment, gold can be coated on the heat source contact surface 311 to meet the requirements of biocompatibility of the heat conducting rod 100.
[0068] In one embodiment, along the direction from the heat conductor 10 to the circuit connector 50, a first mounting hole 11 and a second mounting hole 12 are provided in the heat conductor 10. Among them, the first mounting hole 11 and the second mounting hole 12 are arranged at a distance. In one embodiment, both the first mounting hole 11 and the second mounting hole 12 penetrate through the heat conductor 10. Among them, the inner walls of the first mounting hole 11 and the second mounting hole 12 are both the outer heat-conducting copper layer 31.
[0069] In one embodiment, the heat conductor 10 includes a first temperature sensor 40 and a second temperature sensor 41. In one embodiment, the first temperature sensor 40 is fixed in the first mounting hole 11 through a first thermosensitive adhesive 42, and the second temperature sensor 41 is fixed in the second mounting hole 12 through a second thermosensitive adhesive 43. In one embodiment, both the first temperature sensor 40 and the second temperature sensor 41 are thermistors.
[0070] The heat on the heat source contact surface 311 can be conducted to the first thermosensitive adhesive 42 respectively through the outer heat-conducting copper layer 31, the first inner heat-conducting copper layer 32 and the second inner heat-conducting copper layer 33, and then conducted to the first temperature sensor 40. After a certain period of time, the heat can be conducted to the second thermosensitive adhesive 43 respectively through the outer heat-conducting copper layer 31, the first inner heat-conducting copper layer 32 and the second inner heat-conducting copper layer 33, and then conducted to the second temperature sensor 41. When both the first temperature sensor 40 and the second temperature sensor 41 are thermistors, the resistance values of the first temperature sensor 40 and the second temperature sensor 41 change, so that the heat received by the first temperature sensor 40 is converted into a first signal (i.e., a first resistance signal), and the heat received by the second temperature sensor 41 is converted into a second signal (i.e., a second resistance signal).
[0071] The circuit connector 50 is provided with a conductive channel 51. In one embodiment, the conductive channel 51 includes a first conductive portion 511 and a second conductive portion 512. Among them, both the first conductive portion 511 and the second conductive portion 512 penetrate the circuit connector 50. An electrical connector 52 and a circuit board 60 are provided on the circuit connector 50. Among them, the electrical connector 52 and the circuit board 60 are respectively located on two opposite surfaces of the circuit connector 50. The electrical connector 52 and the circuit board 60 are electrically connected through the conductive channel 51.
[0072] In one embodiment, the electrical connector 52 includes a first welding foot 521 and a second welding foot 522. Among them, the first welding foot 521 is electrically connected to the first temperature sensor 40 through a first wire 70, and the first welding foot 521 is electrically connected to the circuit board 60 through the first conductive portion 511, so that the first temperature sensor 40 is electrically connected to the circuit board 60, thereby enabling the first signal to be transmitted to the circuit board 60. The second welding foot 522 is electrically connected to the second temperature sensor 41 through a second wire 71, and the second welding foot 522 is electrically connected to the circuit board 60 through the second conductive portion 512, so that the second temperature sensor 41 is electrically connected to the circuit board 60, thereby enabling the second signal to be transmitted to the circuit board 60.
[0073] In one embodiment, the circuit board 60 is a flexible circuit board.
[0074] In one embodiment, the circuit board 60 is connected to a central processing unit (CPU, not shown in the figure) so that the first signal and the second signal are transmitted to the central processing unit. Among them, the central processing unit calculates the instantaneous temperatures of the first temperature sensor 40 and the second temperature sensor 41 according to the data when the first signal and the second signal are stable, and calculates the heat released per unit time on the surface of the measured organism according to relevant parameters such as the heat conductivity of the heat conducting rod 100 and time.
[0075] Among them, the heat conducting layer 30 and the circuit connector 50 are spaced apart. That is, there is no heat conducting layer 30 on the circuit connector 50 to prevent the heat on the heat conducting layer 30 from being conducted to the circuit connector 50 and the structure fixing body 80, thereby preventing the heat storage of the heat conducting rod 100 from being too large, resulting in the temperature of the heat conducting rod 100 not being able to return to room temperature in a short time and then restarting to work.
[0076] Please refer to Figure 2, in one embodiment, the structure fixing body 80 is generally T-shaped. The structure fixing body 80 is used to mount the heat conducting rod 100 on other structures. The structure fixing body 80 includes a fixing body 81 and a protruding portion 82 formed by extending outward from the outer surface of the fixing body 81.
[0077] Please refer to Figure 4 and Figure 5 , an embodiment of the present application further provides a heat conducting device 200, which includes the heat conducting rod 100, a first fixing bracket 210, a second fixing bracket 220, and an elastic device 230.
[0078] The second fixing bracket 220 is fixed to the first fixing bracket 210. The heat conducting rod 100 is located in the first fixing bracket 210 and the second fixing bracket 220, and part of it protrudes from the first fixing bracket 210. Specifically, the heat conductor 10 is located in the first fixing bracket 210, and part of it protrudes from the first fixing bracket 210, and the structure fixing body 80 is located in the second fixing bracket 220.
[0079] Please refer to them together Figure 6 and Figure 7 , the first fixing bracket 210 is generally cylindrical. In one embodiment, the first fixing bracket 210 is provided with an outlet 211. Among them, the outlet 211 penetrates the first fixing bracket 210. The heat conductor 10 protrudes from the first fixing bracket 210 through the outlet 211. The first fixing bracket 210 includes a first limiting rod 212, and one end of the first limiting rod 212 away from the outlet 211 abuts against the protruding portion 82.
[0080] In one embodiment, the second fixing bracket 220 is fixed to the first fixing bracket 210 by means of a hook. The second fixing bracket 220 is provided with a slot 221 and an opening 222 communicating with the slot 221. The slot 221 is used to place the elastic device 230 and the structure fixing body 80.
[0081] In one embodiment, the elastic device 230 is a spring. Among them, the structure fixing body 80 is located in the spring and can protrude through the opening 222. One end of the spring is located at the bottom of the slot 221, and the other end of the spring abuts against the protruding portion 82. The elastic device 230 is used to improve the comfort of measurement.
[0082] Please refer to Figure 7, the second fixing bracket 220 includes a second limiting rod 223, the second limiting rod 223 is disposed opposite to the first limiting rod 212, and there is a certain distance between the second limiting rod 223 and the first limiting rod 212. The protruding portion 82 can move between the first limiting rod 212 and the second limiting rod 223, so as to control the length of the heat conductor 10 extending out of the first fixing bracket 210.
[0083] Specifically, when the spring is in a relaxed state, one end of the first limiting rod 212 abuts against the protruding portion 82. At this time, there is a certain distance between the second limiting rod 223 and the protruding portion 82. When the heat source contact surface 311 contacts a certain part of the organism and the heat source contact surface 311 receives a force, since the spring contacts the protruding portion 82, the spring is compressed. At this time, the length of the heat conductor 10 extending out of the first fixing bracket 210 is shortened, and the structure fixing body 80 extends out through the opening 222.
[0084] The heat conductor 10 provided in this application includes the heat insulation layer 20 and the heat conduction layer 30. The heat conduction layer 30 is located on the surface of the heat insulation layer 20 and in the heat insulation layer 20. The number and thickness of the heat conduction layer 30 in the heat insulation layer 20 can be changed according to needs to meet the requirements of different heat conduction rates of the heat conduction rod 100, so that the heat conduction rod 100 can be used in different environments. That is, different numbers and different thicknesses of the inner heat conduction copper layers make the heat conductor 10 have different heat conduction rates, so as to meet the requirements of different heat conduction rates of the heat conduction rod 100.
[0085] The above description is only a specific implementation manner of an optimization of this application, but in the actual application process, it cannot be limited to this implementation manner only. For those of ordinary skill in the art, other deformations and changes made according to the technical concept of this application should all fall within the protection scope of this application.
Claims
1. A heat conducting rod, characterized in that, it comprises a heat conductor and a circuit connector connected to one end of the heat conductor; the heat conductor includes a heat insulating layer and a heat conducting layer, the heat conducting layer is located on the surface of the heat insulating layer and in the heat insulating layer, in the direction from the heat conductor to the circuit connector, a first mounting hole and a second mounting hole are provided in the heat conductor, and a first temperature sensor and a second temperature sensor are respectively provided in the first mounting hole and the second mounting hole; wherein, the heat conducting layer at the end of the heat conductor far from the circuit connector is a heat source contact surface, the heat source contact surface is used to contact with a living body, so that the heat of the living body sequentially passes through the heat conducting layer, the first temperature sensor, the heat conducting layer and the second temperature sensor, the first temperature sensor and the second temperature sensor are used to respectively convert the received heat into a first signal and a second signal, the circuit connector is used to transmit the first signal and the second signal, and the first signal and the second signal are used to calculate the temperature of the living body; the heat insulating layer includes a first heat insulating part and a second heat insulating part which are sequentially laminated, the heat conducting layer includes an outer heat conducting copper layer and a first inner heat conducting copper layer, the outer heat conducting copper layer is located on the outer surfaces of the first heat insulating part and the second heat insulating part, and the first inner heat conducting copper layer is located between the first heat insulating part and the second heat insulating part.
2. The heat conducting rod according to claim 1, characterized in that, the heat insulating layer further includes a third heat insulating part, the third heat insulating part is located on the side of the second heat insulating part far from the first heat insulating part, the outer heat conducting copper layer is also located on the outer surface of the third heat insulating part, the heat conducting layer further includes a second inner heat conducting copper layer, and the second inner heat conducting copper layer is located between the second heat insulating part and the third heat insulating part.
3. The heat conducting rod according to claim 1, characterized in that, both the first temperature sensor and the second temperature sensor are thermistors.
4. The heat conducting rod according to claim 1, characterized in that, a first thermosetting adhesive and a second thermosetting adhesive are respectively provided in the first mounting hole and the second mounting hole, the first thermosetting adhesive is used to fix the first temperature sensor in the first mounting hole, and the second thermosetting adhesive is used to fix the second temperature sensor in the second mounting hole.
5. The heat conducting rod according to claim 1, characterized in that, a conductive channel is provided in the circuit connector, an electrical connector and a circuit board are provided on the circuit connector, the electrical connector and the circuit board are respectively located on two opposite surfaces of the circuit connector, the electrical connector and the circuit board are electrically connected through the conductive channel, and the first temperature sensor and the second temperature sensor are respectively electrically connected to the electrical connector.
6. The heat conducting rod according to claim 5, characterized in that, The electrical connector includes a first welding leg and a second welding leg. The conductive channel includes a first conductive portion and a second conductive portion. The first welding leg is electrically connected to the first temperature sensor through a first wire, and the first welding leg is electrically connected to the circuit board through the first conductive portion. The second welding leg is electrically connected to the second temperature sensor through a second wire, and the second welding leg is electrically connected to the circuit board through the second conductive portion.
7. The heat conducting rod according to claim 1, characterized in that it further includes a structure fixing body, which is connected to an end of the circuit connecting body away from the heat conducting body. The structure fixing body includes a fixing body and a protruding portion extending outward from the outer surface of the fixing body.
8. A heat conducting device, characterized in that the heat conducting device includes the heat conducting rod according to any one of claims 1 to 7. The heat conducting device further includes a first fixing bracket, a second fixing bracket fixed to the first fixing bracket, and an elastic device. The heat conducting rod is located between the first fixing bracket and the second fixing bracket, and the heat source contact surface of the heat conducting rod extends out of the first fixing bracket.
9. The heat conducting device according to claim 8, characterized in that the first fixing bracket includes a first limiting rod, the second fixing bracket includes a second limiting rod, the second limiting rod is arranged opposite to the first limiting rod, and the first limiting rod, the second limiting rod and the elastic device jointly control the length of the heat conducting rod extending out of the first fixing bracket.
Citation Information
Patent Citations
Patch type thermometer with heat conduction device
CN108362391A
Heat conducting member, temperature sensor assembly, secondary lock assembly and connector
WO2019239247A1