A light-emitting component and a manufacturing method thereof

Abstract

The present invention belongs to the field of lighting technology, and particularly relates to a light-emitting component and a manufacturing method thereof. The light-emitting component includes a light-emitting structure, a thermoelectric conduction structure, a heat-conducting structure, and a support structure; the support structure is provided with an installation groove, the light-emitting structure, the thermoelectric conduction structure, and the heat-conducting structure are sequentially stacked and all accommodated in the installation groove; the light-emitting structure has a first electrode and a second electrode, the first electrode and the second electrode are electrically connected to the support structure and the thermoelectric conduction structure respectively, and the thermoelectric conduction structure is electrically connected to the support structure; wherein, the thermoelectric conduction structure can receive heat from the light-emitting structure and transfer the heat to the heat-conducting structure; the support structure can receive heat from the heat-conducting structure and transfer the heat to the outside. The present invention can reduce the heat deposition in the light-emitting component.

Description

Technical Field

[0001] The present invention belongs to the technical field of lighting, and particularly relates to a light-emitting component and a manufacturing method thereof. Background Art

[0002] LED (semiconductor light-emitting diode) packaging refers to a component formed by packaging an LED chip, which can be connected to a circuit and convert electrical energy into light energy. Therefore, it can be used as a light source and has been increasingly widely used in the lighting field. In the field of outdoor lighting, in order to improve the illumination intensity and meet the requirements of high power and high lumen output, some lamps adopt a multi-chip packaging technology, welding multiple LED chips in the same bowl-shaped bracket.

[0003] However, such high-power lamps will generate a large amount of heat during the light-emitting process. If this heat is not timely dissipated, thermal deposition is likely to occur inside the LED chip, thereby affecting its performance. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a light-emitting component and a manufacturing method thereof, aiming to solve the problem of how to reduce the thermal deposition in the light-emitting component.

[0005] To achieve the above purpose, the technical solution adopted by the present application is: providing a light-emitting component, including a light-emitting structure, a thermoelectric conduction structure, a heat conduction structure, and a support structure; an installation groove is provided in the support structure, and the light-emitting structure, the thermoelectric conduction structure, and the heat conduction structure are sequentially stacked and all received in the installation groove; the light-emitting structure has a first electrode and a second electrode, the first electrode and the second electrode are respectively electrically connected to the support structure and the thermoelectric conduction structure, and the thermoelectric conduction structure is electrically connected to the support structure; wherein, the thermoelectric conduction structure can receive heat from the light-emitting structure and transfer the heat to the heat conduction structure; the support structure can receive the heat from the heat conduction structure and transfer the heat to the outside.

[0006] In some embodiments, the thermoelectric conduction structure includes a heat conduction part and an electric conduction part, and the heat conduction part and the electric conduction part are arranged at intervals; two side surfaces of the heat conduction part are respectively connected to the light-emitting structure and the heat conduction structure, and can receive and transfer the heat; the electric conduction part is electrically connected to the second electrode and the support structure.

[0007] In some embodiments, the light-emitting structure is adhesively connected to the thermoelectric conduction structure; the thermoelectric conduction structure is adhesively connected to the heat conduction structure; the heat conduction structure is adhesively connected to the inner wall of the installation groove.

[0008] In some embodiments, the first electrode and the second electrode are respectively located on two opposite sides of the light-emitting structure, the first electrode is disposed away from the bottom of the mounting groove, and the second electrode is disposed toward the bottom of the mounting groove.

[0009] In some embodiments, the light-emitting component further includes a first heat dissipation layer; the first heat dissipation layer is disposed between the light-emitting structure and the thermoelectric conduction structure, and its two side surfaces are respectively bonded to the light-emitting structure and the thermoelectric conduction structure.

[0010] And / or, the light-emitting component further includes a second heat dissipation layer; the second heat dissipation layer is disposed between the heat conduction structure and the support, and its two side surfaces are respectively bonded to the heat conduction structure and the support structure.

[0011] On the other hand, a manufacturing method of a light-emitting component is further provided for manufacturing a light-emitting component. The manufacturing method of the light-emitting component includes the following steps:

[0012] Stacking: sequentially laminating and connecting the light-emitting structure, the thermoelectric conduction structure, and the heat conduction structure, and connecting the heat conduction structure to the inner wall of the mounting groove; wherein, the second electrode is disposed opposite to the thermoelectric conduction structure and is electrically connected.

[0013] Power connection: electrically connecting both the first electrode and the thermoelectric conduction structure to the support structure.

[0014] In some embodiments, the manufacturing method of the light-emitting component includes the following steps:

[0015] Glue spraying: filling a reflective material into the mounting groove to form a light output structure; and exposing the first electrode, and forming a light output surface on a side of the light output structure away from the bottom of the mounting groove.

[0016] In some embodiments, the manufacturing method of the light-emitting component further includes the following steps:

[0017] First glue dotting: dotting a fluorescent glue outside the first electrode to form a light filtering structure, and making a projection of the light filtering structure toward the bottom of the mounting groove cover the first electrode.

[0018] In some embodiments, the manufacturing method of the light-emitting component further includes the following steps:

[0019] Second glue dotting: dotting a transparent glue on the light output surface to form a transition structure, and making an outer surface of the transition structure flush with an edge of an opening of the mounting groove.

[0020] In some embodiments, the manufacturing method of the light-emitting component further includes the following steps:

[0021] Injection molding: Inject a transparent material at the notch of the installation groove to form a light condensing structure, and make the light condensing structure cover the notch of the installation groove.

[0022] The beneficial effects of the present application are as follows: The light-emitting component provided by the present application includes a light-emitting structure, a thermoelectric conduction structure, a heat conduction structure, and a support structure. Among them, the support structure is provided with an installation groove, and the installation groove can be used to accommodate and fix other components; the first electrode of the light-emitting structure is directly electrically connected to the support structure, and the second electrode of the light-emitting structure is electrically connected to the support structure through the thermoelectric conduction structure, so that the light-emitting structure can be connected to an external power supply device through the support structure to emit light; the light-emitting structure, the thermoelectric conduction structure, and the heat conduction structure are sequentially stacked, so the heat generated during the operation of the light-emitting structure can be transferred to the heat conduction structure through the thermoelectric conduction structure and then transferred to the support structure or directly dissipated. Among them, the current flows from the external power supply device through the support structure, and then flows to the light-emitting structure through the thermoelectric conduction structure; the heat generated by the light-emitting structure is transferred to the heat conduction structure through the thermoelectric conduction structure, and then transferred to the support structure or directly dissipated; in this way, the light-emitting component realizes the partial separation of heat and electricity, and effectively exports the heat inside the light-emitting component. In summary, the present application solves the technical problem of how to reduce the heat deposition in the light-emitting component. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 Schematic diagram of the light-emitting structure provided by an embodiment of the present application;

[0025] Figure 2 Schematic diagram of the light-emitting structure provided by another embodiment of the present application;

[0026] Figure 3 Schematic diagram of the connection process principle of the thermoelectric conduction structure and the heat conduction structure provided by an embodiment of the present application;

[0027] Figure 4 Schematic diagram of the connection process principle of the heat conduction structure and the installation groove provided by an embodiment of the present application;

[0028] Figure 5 Schematic diagram of the die bonding process provided by an embodiment of the present application;

[0029] Figure 6 Schematic diagram of the power connection process provided by an embodiment of the present application;

[0030] Figure 7 Schematic diagram of the process of filling the installation groove to form a light-emitting structure provided by an embodiment of the present application;

[0031] Figure 8 Schematic diagram of the dot coating of the filter structure provided by an embodiment of the present application;

[0032] Figure 9 Schematic diagram of the connection process between the heat conduction structure and the installation groove provided by another embodiment of the present application;

[0033] Figure 10 Schematic diagram of the die bonding process provided by another embodiment of the present application;

[0034] Figure 11 Schematic diagram of the power connection process provided by another embodiment of the present application;

[0035] Figure 12 Schematic diagram of the process of filling the installation groove to form a light-emitting structure provided by another embodiment of the present application;

[0036] Figure 13 Schematic diagram of the process of filling transparent glue and the filter structure provided by another embodiment of the present application.

[0037] Among them, the reference numerals in the figure: 100, light-emitting component; 10, light-emitting structure; 11, first electrode; 12, second electrode; 20, thermoelectric conduction structure; 21, first heat dissipation layer; 22, second pad; 30, heat conduction structure; 31, second heat dissipation layer; 40, support structure; 41, installation groove; 42, bonding wire; 43, first pad; 50, light-emitting structure; 51, light-emitting surface; 60, light condensing structure; 70, filter structure; 80, transparent glue. Detailed implementation manners

[0038] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present application.

[0039] It should be noted that when a component is referred to as "fixed to" or "arranged on" another component, it can be directly on the other component or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to this application. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances. The terms "first" and "second" are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0040] Please refer to Figure 1 and Figure 2 In an embodiment of the present application, a light-emitting component 100 is provided, which includes a light-emitting structure 10, a thermoelectric conduction structure 20, a heat-conducting structure 30, and a support structure 40. Among them, the support structure 40 is provided with an installation groove 41, and the light-emitting structure 10, the thermoelectric conduction structure 20, and the heat-conducting structure 30 are sequentially stacked and all received in the installation groove 41; the light-emitting structure 10 has a first electrode 11 and a second electrode 12, and the first electrode 11 and the second electrode 12 are respectively electrically connected to the support structure 40 and the thermoelectric conduction structure 20, and the thermoelectric conduction structure 20 is electrically connected to the support structure 40; wherein, the thermoelectric conduction structure 20 can receive heat from the light-emitting structure 10 and transfer the heat to the heat-conducting structure 30; the support structure 40 can receive heat from the heat-conducting structure 30 and transfer the heat to the outside.

[0041] Among them, the light-emitting structure 10 is a structure capable of converting electrical energy into light energy, which can be an LED, and the first electrode 11 and the second electrode 12 are respectively its positive electrode and negative electrode. Optionally, the light-emitting structure 10 is a vertical LED chip, that is, the first electrode 11 and the second electrode 12 are respectively located on two opposite sides of the light-emitting structure 10.

[0042] The thermoelectric conduction structure 20 can be a sheet-like or plate-like structure made of a conductive material, for example, a copper foil; its material itself has a conductive function, and the sheet-like and plate-like settings can increase the area for absorbing and dissipating heat, so as to effectively transfer the heat generated by the light-emitting structure 10 to the heat-conducting structure 30.

[0043] The heat-conducting structure 30 is made of an insulating material with good heat-conducting performance. Optionally, the heat-conducting structure 30 is made of a ceramic material with a high heat conductivity. Optionally, the heat-conducting structure 30 is made of aluminum nitride ceramic material; or, the heat-conducting structure 30 is made of alumina ceramic material. Among them, the thickness of the heat-conducting material can be determined according to the power of the light-emitting structure 10. The greater the power of the light-emitting structure 10, the more heat is dissipated per unit time, so the thickness of the heat-conducting material is thicker. Taking Figure 1 and Figure 2 the placement angle as an example, the thickness here refers to the extension length of the heat-conducting structure 30 in the vertical direction; among them, Figure 1 the light-emitting structure 10 shown has a relatively thin heat-conducting structure 30, Figure 2 the light-emitting structure 10 shown has a relatively thick heat-conducting structure 30.

[0044] On the one hand, the support structure 40 is used for electrically installing the light-emitting structure 10. On the other hand, it is used for electrically connecting to an external power supply device to supply power to the light-emitting structure 10. Optionally, two first pads 43 for electrically connecting other components are provided on the support structure 40, and a second pad 22 is provided on the electrothermal conduction structure; the first electrode 11 is electrically connected to one of the first pads 43 through a bonding wire 42, and the second pad 22 is electrically connected to the other first pad 43 through a bonding wire 42.

[0045] It can be understood that the light-emitting component 100 provided in this application includes a light-emitting structure 10, a thermoelectric conduction structure 20, a heat-conducting structure 30, and a support structure 40. Among them, the support structure 40 is provided with an installation groove 41, and the installation groove 41 can be used to house and fix other components; the first electrode 11 of the light-emitting structure 10 is directly electrically connected to the support structure 40, and the second electrode 12 of the light-emitting structure 10 is electrically connected to the support structure 40 through the thermoelectric conduction structure 20, so that the light-emitting structure 10 can be connected to an external power supply device through the support structure 40 to emit light; the light-emitting structure 10, the thermoelectric conduction structure 20, and the heat-conducting structure 30 are stacked in sequence, so the heat generated by the light-emitting structure 10 during operation can be transferred to the heat-conducting structure 30 through the thermoelectric conduction structure 20 and then transferred to the support structure 40 or directly dissipated. Among them, the current flows from the external power supply device through the support structure 40, and then flows to the light-emitting structure 10 through the thermoelectric conduction structure 20; the heat generated by the light-emitting structure 10 is transferred to the heat-conducting structure 30 through the thermoelectric conduction structure 20, and then transferred to the support structure 40 or directly dissipated; in this way, the light-emitting component 100 realizes partial thermoelectric separation and effectively conducts the heat inside the light-emitting component 100. In summary, this application solves the technical problem of how to reduce the heat deposition in the light-emitting component 100.

[0046] Optionally, in some embodiments, the thermoelectric conductive structure 20 includes a heat conductive part and a conductive part, and the heat conductive part and the conductive part are arranged at intervals; the two side surfaces of the heat conductive part are respectively connected to the light emitting structure 10 and the heat conductive structure 30, and can receive and transfer heat; the conductive part is electrically connected to the second electrode 12 and the support structure 40. It can be understood that in these embodiments, the heat conductive part and the conductive part are used for heat conduction and electricity conduction respectively, which can realize the thermal and electrical separation of the light emitting structure 10, and then can effectively export the heat generated by the light emitting structure 10 to reduce the heat deposition generated therein. Specifically, the current flows from the external power supply device to the corresponding electrical connection part of the support structure 40, then flows to the light emitting structure 10, and then flows to another electrical connection part of the support structure 40 through the conductive part; wherein the two electrical connection parts can be two first pads 43 on the support structure 40 respectively. Heat is generated from the light emitting structure 10, and then transferred to the heat conductive structure 30 through the heat conductive part, and then transferred to the support structure 40 or directly dissipated.

[0047] See also Figure 1 and Figure 2 Optionally, in some embodiments, the light emitting structure 10 is attached to the thermoelectric conductive structure 20; the thermoelectric conductive structure 20 is attached to the heat conductive structure 30; the heat conductive structure 30 is attached to the inner wall of the mounting groove 41. It is understood that in this embodiment, the light emitting structure 10, the thermoelectric conductive structure 20 and the heat conductive structure 30 are attached to the inner wall of the mounting groove 41 by attaching and connecting them to each other to increase the contact area, thereby effectively improving the efficiency of heat transfer and helping to timely remove the heat generated by the light emitting structure 10. Optionally, the heat conductive structure 30 is attached to the bottom of the mounting groove 41.

[0048] Optionally, in some embodiments, the light emitting structure 10 is a high-power vertical conductive chip. It is understandable that the high-power vertical conductive chip can meet the requirements of high power and high lumen output of outdoor lighting, and can replace multiple low-power light emitting chips to reduce the number of heat generating structures in the light emitting component 100, thereby reducing the heat deposition inside the light emitting component 100.

[0049] Optionally, in some embodiments, the first electrode 11 and the second electrode 12 are respectively located on two opposite sides of the light emitting structure 10, and the first electrode 11 is arranged away from the bottom of the mounting groove 41, and the second electrode 12 is arranged toward the bottom of the mounting groove 41. Figure 1 and Figure 2 Taking the placement angle shown as an example, the first electrode 11 and the second electrode 12 are arranged along the vertical direction shown in the figure, so that the bottom of the light-emitting structure 10 is opposite to the thermoelectric conductive structure 20, which can meet the needs of power connection and heat transfer at the same time and help to make the side walls of the light-emitting structure 10 emit light evenly in all directions.

[0050] Optionally, in some embodiments, the light-emitting component 100 further includes a first heat dissipation layer 21; the first heat dissipation layer 21 is disposed between the light-emitting structure 10 and the thermoelectric conduction structure 20, and its two side surfaces are respectively bonded to the light-emitting structure 10 and the thermoelectric conduction structure 20. It can be understood that the first heat dissipation layer 21 can be made of a material with good thermal conductivity and electrical conductivity, and its arrangement between the light-emitting structure 10 and the thermoelectric conduction structure 20 can facilitate the heat transfer of the light-emitting structure 10.

[0051] Optionally, the first heat dissipation layer 21 is made of conductive silver paste; wherein, the conductive silver paste is an adhesive that has certain electrical conductivity after curing or drying, and it usually consists mainly of a matrix resin and conductive fillers, i.e., conductive particles. Through the bonding action of the matrix resin, the conductive particles are combined together to form a conductive path, realizing the electrical connection of the adhered structures.

[0052] Optionally, the first heat dissipation layer 21 is formed by curing solder paste; wherein, the solder paste is a paste-like mixture formed by mixing solder powder, flux, and other surfactants, thixotropic agents, etc. It can be understood that the solder paste has strong thermal conductivity, which helps to further improve the heat transfer efficiency between the light-emitting structure 10 and the thermoelectric conduction structure 20.

[0053] Optionally, in some embodiments, the light-emitting component 100 further includes a second heat dissipation layer 31; the second heat dissipation layer 31 is disposed between the heat conduction structure 30 and the support structure 40, and its two side surfaces are respectively bonded to the heat conduction structure 30 and the support structure 40. It can be understood that the second heat dissipation layer 31 can be made of an insulating material with good thermal conductivity. Its arrangement between the heat conduction structure 30 and the support structure 40 can not only be used to connect the two structures, but also assist the heat conduction structure 30 in transferring heat to the support structure 40.

[0054] Optionally, the second heat dissipation layer 31 is made of a silicone-based adhesive with high thermal conductivity; wherein, the main components of the silicone-based adhesive are silica gel and epoxy resin. Silica gel has good adsorption properties, and epoxy resin has good heat resistance and electrical insulation properties. Therefore, the silicone-based adhesive can be used to bond the heat conduction material and the support structure 40, and after baking and forming, the heat conduction structure 30 and the support structure 40 are stably connected.

[0055] The present invention also provides a manufacturing method for the light-emitting component 100, which is used to manufacture the light-emitting component 100. The specific structure of the light-emitting component 100 refers to the above embodiments, and the beneficial effects brought by each embodiment of the light-emitting component 100 will not be elaborated here one by one.

[0056] Specifically, the manufacturing method of the light-emitting component 100 includes a stacking step and a power connection step. In this embodiment, it is carried out in the following order:

[0057] S1: Stacking, stack and connect the light-emitting structure 10, the thermoelectric conduction structure 20 and the heat conduction structure 30 in sequence, and connect the heat conduction structure 30 to the inner wall of the mounting groove 41; wherein, the second electrode 12 is disposed opposite to the thermoelectric conduction structure 20 and is electrically connected.

[0058] S2: Power connection, electrically connect both the first electrode 11 and the thermoelectric conduction structure 20 to the support structure 40.

[0059] Among them, the stacking step can be specifically divided into the following steps:

[0060] Molding, please refer to Figure 3 , mold the thermoelectric conduction structure 20 onto the outer surface of the heat conduction structure 30. Specifically, a molding press can be used, set the clamping pressure to 100 - 120 kg / cm 2 , the mold temperature to 200 °C, and the molding time to 120 s. After molding, the thermoelectric conduction structure 20 is molded onto the heat conduction structure 30 to form an integral body, and can be used as an extension and heat transfer base for the second electrode 12 of the light-emitting structure 10.

[0061] First die bonding, please refer to Figure 4 stage Figure 9 , bond the heat conduction structure 30 to the inside of the mounting groove 41 through a colloid. Specifically, a die bonder can be used. First, apply a high thermal conductivity silicon-based colloid to the bottom of the mounting groove 41 or other suitable inner walls for connection, then connect the heat conduction structure 30 to this place, and then bake and form to complete the mechanical connection between the heat conduction structure 30 and the support structure 40. Among them, Figure 4 and Figure 9 In the structures shown, the difference lies in the different thicknesses of the heat conduction structure 30.

[0062] Second die bonding, please refer to Figure 5 stage Figure 10 , bond the light-emitting structure 10 to the corresponding surface of the thermoelectric conduction structure 20 through a colloid. Specifically, a die bonder can be used. Apply a silver colloid with high thermal conductivity to the outer surface of the thermoelectric conduction structure 20, then fix the light-emitting structure 10 here, and then bake and form to complete the mechanical connection and electrical connection between the light-emitting structure 10 and the thermoelectric conduction structure 20. Optionally, the silver colloid contains 80% silver powder, 15% epoxy resin, and 5% additives. Among them, the silver colloid can also be replaced with solder paste to improve the efficiency of heat transfer.

[0063] Furthermore, please refer to Figure 6 stage Figure 11, the power-on steps can be specifically carried out in the following manner: Adopt the wire bonding process to electrically connect the first electrode 11 and the corresponding first pad 43 through a bonding wire 42, and electrically connect the second pad 22 and the corresponding first pad 43 through another bonding wire 42. It can be understood that by adopting the wire bonding process, the electrical connection between the light-emitting structure 10 and the support structure 40 can be completed through the bonding wire 42. At this time, the thermal resistance of the light-emitting component 100 includes the first heat dissipation layer, the thermoelectric conduction structure 20, the heat conduction structure 30, and the second heat dissipation layer 31. The aforementioned structures all have good heat conduction performance; and at this time, the current of the light-emitting component 100 flows from the first pad 43 through the corresponding bonding wire 42 to the light-emitting structure 10, so that thermoelectric partial separation or thermoelectric separation can be achieved to reduce heat generation and improve the efficiency of heat transfer, and thus the thermal deposition in the light-emitting component 100 can be effectively reduced.

[0064] Please refer to Figure 7 and Figure 12 Optionally, in some embodiments, the manufacturing method of the light-emitting component 100 includes the following steps: Glue spraying, filling the installation groove 41 with a reflective material to form a light-emitting structure 50; and exposing the first electrode 11, and forming a light-emitting surface 51 on the side of the light-emitting structure 50 facing away from the bottom of the installation groove 41. Specifically, a glue spraying machine can be used to fill the installation groove 41 with a high-reflection particle glue, and then the whole component is baked and shaped to form the light-emitting structure 50.

[0065] Optionally, the aforementioned high-reflection particle glue includes TiO2, ZnO, and SiO2. It can be understood that through the glue spraying step, a light-emitting structure 50 can be formed in the installation groove 41, and the light emitted by the light-emitting structure 10 can be uniformly emitted from the light-emitting surface 51 after being corrected by the light-emitting structure 50.

[0066] Among them, the filling height of the high-reflection particle glue can be determined according to the thickness of the heat conduction structure 30, and the corresponding outer surfaces of the first electrode 11 and the light-emitting structure 10 are exposed outside the light-emitting structure 50. Specifically, Figure 7 In the structure shown, the heat conduction structure 30 is relatively thin, and the vertical distance between the upper surface of the light-emitting structure 10 and the edge of the notch of the installation groove 41 is relatively large. The light-emitting surface 51 can be set as a downwardly concave arc surface, that is, the edge of the light-emitting surface 51 is flush with the notch of the installation groove 41, and the middle part is downwardly concave to expose the corresponding part of the light-emitting structure 10. Figure 12 In the structure shown, the heat conduction structure 30 is relatively thick, and the vertical distance between the upper surface of the light-emitting structure 10 and the edge of the notch of the installation groove 41 is relatively small. The light-emitting surface 51 can be basically flush with the corresponding surface of the light-emitting structure 10, or set as an arc surface with a smaller curvature.

[0067] Optionally, the light-emitting surface 51 is recessed toward the bottom of the mounting groove 41 and is arc-shaped. It can be understood that after the light-emitting structure 10 emits light, the arc-shaped light-emitting surface 51 helps the light converge toward its center of curvature. Therefore, the light-emitting surface 51 in this embodiment has a light-concentrating effect.

[0068] Please refer to Figure 8 and Figure 13 , optionally, in some embodiments, the manufacturing method of the light-emitting component 100 further includes the following steps: First dispensing, dispensing a fluorescent glue outside the first electrode 11 to form a light-filtering structure 70, and making the projection of the light-filtering structure 70 toward the bottom of the mounting groove 41 cover the first electrode 11. Among them, the fluorescent glue includes a colloid and phosphor powder incorporated into the colloid; the colloid is used to connect the corresponding structures, and it can be silica gel; the phosphor powder is used to filter the light emitted by the light-emitting structure 10 to form white light and emit it. In addition, the light-filtering structure 70 can be directly disposed on the corresponding surface of the light-emitting structure 10, or may not be in direct contact with the light-emitting structure 10, and its projection toward the bottom of the mounting groove 41 can cover the corresponding surface of the light-emitting structure 10 to filter the light emitted by the light-emitting structure 10. It can be understood that the light emitted by the light-emitting structure 10 forms white light after passing through the light-filtering structure 70, and thus can meet the lighting requirements of different occasions.

[0069] Please refer to Figure 8 , optionally, in some embodiments, the first dispensing is specifically: using a dispenser, dispensing a mass of fluorescent glue on the upper surface of the light-emitting structure 10 provided with the first electrode 11, setting the glue output within the range of 0.3 - 0.5 ul, and then baking and forming to form the light-filtering structure 70. Optionally, the fluorescent glue is a jelly glue with a fluid viscosity of 10000 - 15000 cps.

[0070] Please refer to Figure 13 , optionally, in some embodiments, the manufacturing method of the light-emitting component 100 further includes the following steps: Second dispensing, dispensing a transparent glue 80 on the light-emitting surface 51 to form a transition structure, and the outer surface of the transition structure is flush with the edge of the opening of the mounting groove 41. Specifically, a dispenser can be used to fill the remaining cavity between the light-emitting surface 51 and the edge of the opening of the mounting groove 41, and the filling height is not higher than 1 / 5 of the height of the light-emitting structure 10. It can be understood that the transparent glue 80 has strong light transmittance, and it is mainly used to fill the recessed part of the light-emitting surface 51 to form a plane flush with the edge of the opening of the mounting groove 41 for setting the light-filtering structure 70; among them, the light-filtering structure 70 in these embodiments can be formed on the outer surface of the transition structure and is arranged in a film shape.

[0071] Please refer to Figure 13, optionally, in embodiments where a second dispensing step is performed, the first dispensing step is carried out after the second dispensing step, and the filter structure 70 is arranged in a film shape on the outer surface of the transition structure. Specifically, a cutting machine and a printing machine can be used to perform waterless cutting on the film formed by the fluorescent glue to form a filter structure 70 of an appropriate size in a film shape, and then the filter structure 70 is printed above the light-emitting structure 10 through a printing process. Among them, the area size of the filter structure 70 can be adjusted; optionally, the area of the filter structure 70 is set within the range of 2 times the upper surface area of the light-emitting structure 10 to 3 times the upper surface area of the light-emitting structure 10.

[0072] Please refer to Figure 1 and Figure 2 , optionally, in some embodiments, the manufacturing method of the light-emitting component 100 further includes the following steps: injection molding, injecting a transparent material at the notch of the installation groove 41 to form a light-concentrating structure 60, and making the light-concentrating structure 60 cover the notch of the installation groove 41. It can be understood that the light-concentrating structure 60 is a lens, which is made of a light-transmitting material, and its outer surface facing away from the support structure 40 protrudes and forms an arc surface or a spherical surface to achieve the light-concentrating function. It can be understood that the light-emitting angle of the light-emitting component 100 can be changed by changing the curvature of the outer surface of the light-concentrating structure 60, and specifically, it can be adjusted according to the specific application scenario.

[0073] It can be understood that in terms of structure, the light-emitting component 100 of the present application can adopt a high-power single-crystal grain packaging structure, the number of light-emitting structures 10 is single, and the generated heat is less. In addition, the current flows through the bracket structure to the light-emitting structure 10, and the heat can be transferred from the light-emitting structure 10 to the heat-conducting structure 30 through the thermoelectric conduction structure 20, and thermoelectric separation or partial thermoelectric separation can be achieved. Therefore, it has good heat dissipation ability, can meet the requirements of higher-power light emission, and helps to extend the service life of the light-emitting structure 10. In addition, the light-emitting component 100 of the present application can adopt a single-crystal grain packaging structure. Compared with the lamp beads with multiple crystal grains, the light-emitting angle of the present application is small, the light-emitting uniformity is strong, and it helps to avoid the generation of light spots; at the same time, by changing the spherical head radius of the light-concentrating structure 60, the control of the light-emitting angle can be realized.

[0074] It can be understood that in terms of method, the manufacturing method of the light-emitting component 100 of the present application can adopt a single vertical high-power chip as the light-emitting structure 10, which has low preparation cost, high controllability and consistency in manufacturing. In addition, when the light-emitting component 100 is produced by this method, the thickness of the heat-conducting structure 30, the filling height of the high-reflection particle glue, the dispensing amount of the fluorescent glue or the area size of the fluorescent film, and the spherical head radius or angle of the light-concentrating structure 60 can all be adjusted, so as to meet the rapid replacement between products with different requirements.

[0075] The above are only optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. A light-emitting component, characterized in that, It includes a light-emitting structure, a thermoelectric conduction structure, a heat-conducting structure and a supporting structure; the supporting structure is provided with a mounting groove, the light-emitting structure, the thermoelectric conduction structure and the heat-conducting structure are stacked in sequence and are all accommodated in the mounting groove; The light-emitting structure comprises a first electrode and a second electrode, wherein the first electrode of the light-emitting structure is directly electrically connected to the support structure, and the second electrode of the light-emitting structure is electrically connected to the support structure via a thermoelectric conductive structure; the first electrode and the second electrode are respectively located on two opposite sides of the light-emitting structure, and the first electrode is arranged away from the bottom of the mounting groove, and the second electrode is arranged toward the bottom of the mounting groove; wherein the thermoelectric conductive structure can receive heat from the light-emitting structure and transfer the heat to the heat-conducting structure; the support structure can receive heat from the heat-conducting structure and transfer the heat to the outside; The support structure is provided with two first pads for electrically connecting other components, and the electrical heat conduction structure is provided with a second pad; the first electrode is electrically connected to one of the first pads through a bonding wire, and the second pad is electrically connected to the other first pad through a bonding wire; thereby, the light-emitting structure can be connected to an external power supply device through the support structure to emit light; the thermal and electrical conduction structure includes a heat-conducting part and a conductive part, and the heat-conducting part and the conductive part are arranged at intervals; the two side surfaces of the heat-conducting part are respectively connected to the light-emitting structure and the heat-conducting structure, and can receive and transfer the heat; the conductive part is electrically connected to the second electrode and the support structure.

2. The light-emitting component according to claim 1, characterized in that, The light emitting structure is attached to the thermoelectric conductive structure; the thermoelectric conductive structure is attached to the heat conductive structure; and the heat conductive structure is attached to the inner wall of the mounting groove.

3. The light-emitting component according to any one of claims 1-2, characterized in that The light-emitting component further comprises a first heat dissipation layer; the first heat dissipation layer is arranged between the light-emitting structure and the thermoelectric conductive structure, and the light-emitting structure and the thermoelectric conductive structure are bonded to the two side surfaces thereof respectively; And / or, the light emitting component further includes a second heat dissipation layer; the second heat dissipation layer is arranged between the heat conductive structure and the support structure, and the heat conductive structure and the support structure are bonded to both side surfaces thereof.

4. A manufacturing method of a light-emitting component, for manufacturing the light-emitting component according to any one of claims 1-3, characterized in that, The manufacturing method of the light emitting component comprises the following steps: Stacking, connecting the light-emitting structure, the thermoelectric conductive structure and the heat-conducting structure in sequence, and connecting the heat-conducting structure to the inner wall of the mounting groove; wherein the second electrode is arranged opposite to the thermoelectric conductive structure and is electrically connected; Electrical connection is performed so that the first electrode and the thermoelectric conductive structure are both electrically connected to the supporting structure.

5. The manufacturing method of the light-emitting component according to claim 4, characterized in that, The manufacturing method of the light emitting component comprises the following steps: Spray glue to fill the installation groove with reflective material to form a light-emitting structure; expose the first electrode, and form a light-emitting surface of the light-emitting structure on a side away from the groove bottom of the installation groove.

6. The manufacturing method of the light-emitting component according to claim 5, characterized in that, The manufacturing method of the light emitting component further comprises the following steps: The first glue dispensing is to dispense fluorescent glue on the outside of the first electrode to form a filter structure, and the projection of the filter structure toward the bottom of the installation groove covers the first electrode.

7. The manufacturing method of the light-emitting component according to claim 6, characterized in that, The manufacturing method of the light-emitting component further includes the following steps: Second dispensing, dotting a transparent adhesive on the light-emitting surface to form a transition structure, and the outer surface of the transition structure is flush with the notch edge of the mounting groove.

8. The manufacturing method of the light-emitting component according to claim 6, characterized in that, The manufacturing method of the light-emitting component further includes the following steps: Injection molding, injecting a transparent material at the notch of the mounting groove to form a light condensing structure, and making the light condensing structure cover the notch of the mounting groove.

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