A frame assembly, an audio module and an electronic device

Abstract

This disclosure relates to a speaker frame assembly, an audio module, and an electronic device. The speaker frame assembly is applied to an audio module having a voice coil. The speaker frame assembly includes a speaker frame body, the speaker frame body comprising: a metal portion; a plastic portion connected to the metal portion; and a conductive element embedded within the plastic portion, the conductive element forming a first contact and a second contact exposed above the plastic portion. The first contact is used for electrical connection to the voice coil of the audio module, and the second contact is used for electrical connection to a target circuit, the target circuit including an audio signal input circuit or an audio signal output circuit.

Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and more particularly to a basket assembly, an audio module, and an electronic device. Background Technology

[0002] Currently, mobile terminals are typically equipped with audio modules, which function as sound amplifiers or recorders. In related technologies, a vibration system can be used to drive a diaphragm to vibrate, thereby producing sound.

[0003] In related technologies, audio modules typically include metal or plastic frames. However, when using a metal frame, the conductive circuit of the voice coil is located on the diaphragm, which is connected to the metal frame, creating a short circuit risk and poor insulation. While using a plastic frame improves insulation performance, it results in poor heat dissipation and increased temperature rise of the audio module. Summary of the Invention

[0004] This disclosure provides a basket assembly, an audio module, and an electronic device to address the shortcomings of the related art.

[0005] According to a first aspect of the present disclosure, a frame assembly is provided for use in an audio module having a voice coil, the frame assembly including a frame body, the frame body comprising:

[0006] Metal Department;

[0007] A plastic part, which is connected to the metal part;

[0008] A conductive element is embedded within the plastic portion, and the conductive element forms a first contact and a second contact exposed in the plastic portion. The first contact is used to electrically connect to the voice coil of the audio module, and the second contact is used to electrically connect to a target circuit, the target circuit including an audio signal input circuit or an audio signal output circuit.

[0009] Optionally, the metal part includes a notch, and the plastic part is at least partially embedded in the notch to form the ring-shaped basin holder body.

[0010] Optionally, the metal portion includes a first metal portion and a second metal portion, and the notch includes a first notch and a second notch. The first notch is formed by the first metal portion and the second metal portion having their opposite first ends cooperate, and the second notch is formed by the first metal portion and the second metal portion having their opposite second ends cooperate.

[0011] The plastic part includes a first plastic part and a second plastic part arranged symmetrically. The first plastic part is at least partially embedded in the first notch, and the second plastic part is at least partially embedded in the second notch. The conductive element is embedded in the first plastic part or the second plastic part.

[0012] Optionally, the plastic part includes a first surface and a second surface that is axially opposite to the first surface along the body of the basin frame, wherein the first contact is flush with the first surface of the plastic part and the second contact is flush with the second surface of the plastic part.

[0013] Optionally, the conductive element includes a first conductive element and a second conductive element. The first contact of the first conductive element is used to connect to the first lead end of the voice coil, and the first contact of the second conductive element is used to connect to the second lead end of the voice coil. The second contact of one of the first conductive element and the second conductive element is connected to the positive terminal of the target circuit, and the second contact of the other is connected to the negative terminal of the target circuit.

[0014] Optionally, the metal part and the plastic part are connected to form the basin frame body arranged in a ring shape, and the first conductive member and the second conductive member are symmetrically arranged about the axis of symmetry of the basin frame body.

[0015] Optionally, the plastic portion is disposed outside the notch and stacked with the metal portion along the axial direction of the basin frame body, and the basin frame assembly further includes:

[0016] The circuit board is connected to the portion of the plastic part located outside the notch, the second contact is connected to the circuit board, and the circuit board is connected to the target circuit.

[0017] Optionally, the conductive element includes at least one of a first extension and a second extension and a connecting portion, the connecting portion being arranged along the axial direction of the basin frame body, the first extension extending radially from one end of the connecting portion along the basin frame body, the second extension extending radially from the other end of the connecting portion along the basin frame body, the surface of the first extension being flush with the plastic portion to form the first contact, and the surface of the second extension being flush with the plastic portion to form the second contact.

[0018] Optionally, the conductive element and the plastic part are injection molded together.

[0019] According to a second aspect of the present disclosure, an audio module is provided, comprising:

[0020] Voice coil;

[0021] As described in any of the above-mentioned basin frame assemblies, the basin frame body of the basin frame assembly is disposed around the voice coil;

[0022] The diaphragm is connected on the same side to the frame body and the voice coil, respectively.

[0023] A conductive path is provided on the surface of the diaphragm facing the voice coil. One end of the conductive path is electrically connected to the voice coil, and the other end is connected to the first contact of the conductive element.

[0024] Optionally, the conductive element includes a first conductive element and a second conductive element, and the conductive path includes a first conductive path and a second conductive path spaced apart from each other on the surface of the diaphragm. The first conductive path connects the first lead end of the voice coil to the first contact of the first conductive element, and the second conductive path connects the second lead end of the voice coil to the first contact of the second conductive element. The second contact of one of the first conductive element and the second conductive element is connected to the positive terminal of the target circuit, and the second contact of the other is connected to the negative terminal of the target circuit.

[0025] Optionally, the audio module may include a speaker module or a handset module.

[0026] According to a third aspect of the present disclosure, an electronic device is provided, including an audio module as described in any of the above embodiments.

[0027] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0028] As can be seen from the above embodiments, the main body of the basin frame in this disclosure includes a plastic part and a metal part. The plastic material of the plastic part can provide insulation protection for the conductive parts, and the metal part can ensure the overall heat dissipation performance of the basin frame. Compared with the related technologies that use plastic basin frames or metal basin frames, it can take into account both heat dissipation performance and insulation performance.

[0029] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0031] Figure 1 This is a schematic diagram of the structure of a basin stand assembly according to an exemplary embodiment.

[0032] Figure 2 yes Figure 1 A cross-sectional schematic diagram of the middle basin frame assembly.

[0033] Figure 3 yes Figure 2 A magnified view of a portion of the image.

[0034] Figure 4 yes Figure 1 An exploded view of the mid-basin frame assembly.

[0035] Figure 5 yes Figure 1 Another exploded view of the middle basin frame assembly.

[0036] Figure 6 This is a schematic diagram illustrating the structure of an audio module according to an exemplary embodiment.

[0037] Figure 7 yes Figure 6 A cross-sectional schematic diagram of the mid-frequency module.

[0038] Figure 8 yes Figure 7 A magnified view of a portion of the image.

[0039] Figure 9 This is a schematic diagram of the structure of another basin assembly according to an exemplary embodiment.

[0040] Figure 10 yes Figure 9 A cross-sectional schematic diagram of the middle basin frame assembly. Detailed Implementation

[0041] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0042] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to separate information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0044] Figure 1 This is a schematic diagram of the structure of a basin stand assembly 100 according to an exemplary embodiment. Figure 2 yes Figure 1 A cross-sectional schematic diagram of the middle basin frame assembly 100. Figure 3 yes Figure 2 A partially enlarged schematic diagram, Figure 4 yes Figure 1 An exploded view of the middle basin frame assembly 100. Figure 5 yes Figure 1 Another exploded view of the middle basin frame assembly 100. Figures 1-3 The frame assembly 100 described herein can be applied to an audio module with a voice coil. The frame assembly 100 may include a frame body 1 and a circuit board 2. The frame body 1 may include a metal part 11, a plastic part 12, and a conductive element 13. The metal part 11 and the plastic part 12 are connected. The conductive element 13 may be embedded in the plastic part 12. For example, the conductive element 13 may be injection molded with the plastic part 12. The conductive element 13 may include a first contact 131 and a second contact 132 exposed in the plastic part 12. The first contact 131 may be electrically connected to the voice coil of the audio module 200, while the second contact 132 may be electrically connected to a target circuit. The target circuit is different when the audio module is configured with different functions. For example, when the audio module is a speaker module, the target circuit may include an audio signal input circuit. The audio signal input by this audio signal input circuit can be transmitted to the voice coil in sequence through the second contact 132 and the first contact 131, causing the diaphragm of the audio module to vibrate and produce sound.

[0045] In the technical solution disclosed herein, the main body 1 of the basin frame includes a plastic part 12 and a metal part 11. The plastic material of the plastic part can provide insulation protection for the conductive circuit connected to the conductive component 13, and the metal part 11 can ensure the overall heat dissipation performance of the basin frame main body 1. Compared with the related technologies that use plastic basin frames or metal basin frames, both heat dissipation performance and insulation performance can be taken into account.

[0046] Still with Figures 1-3As shown, the metal part 11 may include a notch, and a portion of the plastic part 12 is embedded in the notch. The plastic part 12 and the metal part 11 can surround and form a ring-shaped frame body 1, which can be arranged around the voice coil. Another portion of the plastic part 12 may be located outside the notch and is arranged axially with the metal part 11 along the frame body 1. The circuit board 2 can be connected to the portion of the plastic part 12 outside the notch, and the circuit board 2 can be used to conduct signals to a target circuit. In this embodiment, since the circuit board 2 is physically connected to the plastic part 12, a portion of the plastic part 12 can protrude from the notch. In other embodiments, the plastic part 12 may just fill the notch, and the end face of the plastic part 12 is flush with the end face of the metal part 11. This disclosure does not impose any limitations on this.

[0047] There are various ways to determine the positional relationship between the metal part 11 and the plastic part 12, which will be illustrated below.

[0048] In one embodiment, still using Figures 1-3 As shown, the notch in the metal part 11 may include a first notch and a second notch. The metal part 11 may include a first metal part 111 and a second metal part 112. The first notch is formed by the first ends of the first metal part 111 and the second metal part 112 that are arranged opposite to each other, and the second notch is formed by the second ends of the first metal part 111 and the second metal part 112 that are arranged opposite to each other. The plastic part 12 may include a first plastic part 121 and a second plastic part 122 that are symmetrically arranged about the axis of symmetry of the frame body 1. The first plastic part 121 is partially embedded in the first notch, and the second plastic part 122 is partially embedded in the second notch. The conductive element 13 may be embedded in the first plastic part 121 or the second plastic part 122. The circuit board 2 may be connected to the first plastic part 121 or the second plastic part 122 that is embedded with the conductive element 13. Based on this, since the diaphragm of the audio module is connected to the frame body 1, the symmetrical arrangement of the first plastic part 121 and the second plastic part 122 helps to ensure the vibration balance of the audio module configured with the frame assembly 100. Furthermore, it is understandable that a conductive element 13 is embedded in the first plastic part 121. Since the conductive element 13 has a certain mass, in order to balance the vibration of the audio module, a conductive element 13 can also be embedded in the second plastic part 122. The conductive element 13 embedded in the second plastic part 122 is symmetrically arranged with the conductive element 13 embedded in the first plastic part 121 to maintain mass balance.

[0049] In this embodiment, the first plastic part 121 may include a first surface and a second surface that is axially opposite to the first surface along the main body 1 of the basin frame. The first contact 131 of the conductive element 13 is flush with the first surface, and the second contact 132 is flush with the second surface. This can avoid short circuits caused by the protrusion of the first contact 131 or the second contact 132. On the other hand, when the circuit board 2 is connected to the first plastic part 121, the flush setting can avoid unevenness after the circuit board 2 is connected.

[0050] In another embodiment, the metal part 11 may also include a notch. The metal part 11 may be formed axially around the body of the basin frame 1, with its opposite ends fitting together to form the notch. The basin frame assembly 100 may also include a single plastic part, which may be partially embedded in the notch, or may just fill the notch end face and be flush with the end face of the metal part 11. This disclosure does not limit this. When the basin frame assembly 100 includes a single plastic part, the conductive element 13 is disposed on the single plastic part 12. Similarly, the plastic part 12 may include a first surface and a second surface that is axially opposite to the first surface along the body of the basin frame 1. The first contact 131 of the conductive element 13 is flush with the first surface, and the second contact 132 is flush with the second surface. This can avoid short circuits caused by the protrusion of the first contact 131 or the second contact 132. On the other hand, when the subsequent circuit board 2 is connected to the first plastic part 121, the flush arrangement can avoid unevenness after the circuit board 2 is connected.

[0051] The structure of the basin frame assembly 100 described in the above embodiments can be applied to Figures 6-8 The audio module 200 shown may include a voice coil 201, a frame assembly 100, a diaphragm 202, and a conductive path 203. The frame body 1 of the frame assembly 100 may be arranged around the voice coil 201. The same side of the diaphragm 202 may be connected to both the voice coil 201 and the frame body 1. The conductive path 203 may be disposed on the surface of the diaphragm 202 facing the voice coil. One end of the conductive path 203 may be electrically connected to the voice coil 201, and the other end may be electrically connected to the first contact 131 of the conductive element 13. The audio module 200 may include a speaker module or a handset module.

[0052] It is understood that the voice coil 201 of the audio module 200 is formed by winding wires. Therefore, the voice coil 201 typically includes a first lead end 2011 and a second lead end 2012. Thus, in order to electrically connect with the first lead end 2011 and the second lead end 2012 respectively to form a circuit, the conductive path 203 may include a first conductive path 2031 and a second conductive path 2032, and the conductive element 13 may include a first conductive element 133 and a second conductive element 134. The first contact 131 of the first conductive element 133 can be electrically connected to the first lead end 2011 of the voice coil 201 through the first conductive path 2031. Specifically, one end of the first conductive path 2031 can be electrically connected to the first lead end 2011, and the other end can be connected to the first contact 131 of the first conductive element 133. Similarly, the first contact 131 of the second conductive element 134 can be electrically connected to the second lead end 2012 of the voice coil 201 through the second conductive path 2032. Specifically, one end of the second conductive path 2032 can be electrically connected to the second lead end 2012, and the other end can be connected to the first contact 131 of the second conductive element 134. The second contact 132 of the first conductive element 133 can be electrically connected to the positive terminal of the target circuit through the circuit board 2, and the second contact 132 of the second conductive element 134 can be electrically connected to the negative terminal of the target circuit through the circuit board 2.

[0053] In this way, an audio signal can be transmitted from the positive terminal of the target circuit, sequentially through the second contact 132 of the first conductive element 133, the first contact 131 of the first conductive element 133, the first conductive path 2031, the first lead end 2011, the second lead end 2012, the second conductive path 2032, the first contact 131 of the second conductive element 134, and the second contact 132 of the second conductive element 134, to the negative terminal of the target circuit. Of course, in other embodiments, the second contact 132 of the first conductive element 133 can be electrically connected to the negative terminal of the target circuit via the circuit board 2, and the second contact 132 of the second conductive element 134 can be electrically connected to the positive terminal of the target circuit via the circuit board 2. This disclosure does not impose any limitations on this. In this embodiment, the first conductive element 133 and the second conductive element 134 can be symmetrically arranged on the plastic part 12 about the axis of symmetry of the frame body 1. This facilitates the symmetrical arrangement of the first conductive path 2031 and the second conductive path 2032, which are respectively connected to the first conductive element 133 and the second conductive element 134, along the diaphragm 202, thereby ensuring the vibration balance of the audio module 200. Of course, in order to further improve the vibration balance, a third conductive path and a fourth conductive path can also be provided on the diaphragm 202. The third conductive path and the first conductive path 2031 are centrally symmetrically arranged along the center of symmetry of the audio module 200; the fourth conductive path and the second conductive path 2032 are centrally symmetrically arranged along the center of symmetry of the audio module 200.

[0054] The first conductive element 133 and the second conductive element 134 described in the above embodiments can have various structural forms. The following description uses the first conductive element 133 as an example to illustrate the structure of the conductive elements included in the basin frame assembly 100. In one embodiment, for example, the first conductive element 133 can be cylindrical, and the two ends of the cylindrical first conductive element 133 can respectively form a first contact 131 and a second contact 132; in another embodiment, the first conductive element 133 can be elongated, and the two ends of the elongated first conductive element 133 can respectively form a first contact 131 and a second contact 132; in yet another embodiment, such as... Figure 2 As shown, the first conductive element 133 may include a connecting portion, a first extension portion connected to one end of the connecting portion, and a second extension portion connected to the other end of the connecting portion. The connecting portion may be arranged along the axial direction of the basin frame body 1. The first extension portion extends radially from one end of the connecting portion along the basin frame body 1, and the second extension portion extends radially from the other end of the connecting portion along the basin frame body 1. One surface of the first extension portion may be flush with the surface of the plastic portion 12 to form a first contact 131, and one surface of the second extension portion may be flush with the surface of the plastic portion 12 to form a second contact 132. In this way, the radial extension of the first extension portion and the second extension portion helps to increase the contact area of ​​the first contact 131 and the second contact 132, thereby improving the conductivity reliability of the conductive element 13.

[0055] It should be noted that the above description uses the first conductive element 133, which includes a connecting portion, a first extension portion, and a second extension portion, as an example. In fact, in other embodiments, the first conductive element may also include a connecting portion and a first extension portion; or it may include a connecting portion and a second extension portion, in which case the end of the connecting portion can be used as a contact point. The above description only uses the first conductive element 133 as an example. The structure of the second conductive element 134 can refer to the first conductive element 133, and the structure of the second conductive element 134 can be the same as or different from the first conductive element 133. When the basin frame assembly 100 also includes other conductive elements, their structures can also refer to the first conductive element 133, which will not be described in detail here.

[0056] In the above embodiments, the basin frame assembly 100, including the basin frame body 1 and the circuit board 2, is used as an example for description. In other embodiments, such as Figure 9 and Figure 10 As shown, the basin frame assembly 100 may also exclude the circuit board 2, which can be subsequently connected to the basin frame body 1 as a separate component and connected to the first contact 131 and the second contact 132 of the conductive element 13.

[0057] This disclosure also provides an audio module that may include... Figure 9 and Figure 10 The basin stand assembly 100 shown.

[0058] Based on the above embodiments, this disclosure also provides an electronic device, which may include a housing and the audio module 200 described in any of the above embodiments. The housing may include a sound outlet, the audio module 200 may be disposed inside the housing, and the diaphragm 202 is disposed facing the sound outlet so that when the diaphragm 202 vibrates, it causes air vibration, and sound can be transmitted through the sound outlet.

[0059] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0060] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A basin stand assembly, characterized in that, For use in audio modules with voice coils, the frame assembly includes a frame body, the frame body comprising: Metal Department; A plastic part, which is connected to the metal part; A conductive component is embedded within the plastic portion, and the conductive component forms a first contact and a second contact exposed in the plastic portion. The first contact is used to electrically connect to the voice coil of the audio module, and the second contact is used to electrically connect to a target circuit, the target circuit including an audio signal input circuit or an audio signal output circuit. The metal part includes a notch, and the plastic part is at least partially embedded in the notch to form the ring-shaped main body of the basin stand; The plastic part includes a first surface and a second surface that is axially opposite to the first surface along the main body of the basin frame. The first contact is flush with the first surface, and the second contact is flush with the second surface.

2. The basin stand assembly according to claim 1, characterized in that, The metal part includes a first metal part and a second metal part, and the notch includes a first notch and a second notch. The first notch is formed by the first metal part and the second metal part cooperating at their opposite first ends, and the second notch is formed by the first metal part and the second metal part cooperating at their opposite second ends. The plastic part includes a first plastic part and a second plastic part arranged symmetrically. The first plastic part is at least partially embedded in the first notch, and the second plastic part is at least partially embedded in the second notch. The conductive element is embedded in the first plastic part or the second plastic part.

3. The basin stand assembly according to claim 1, characterized in that, The conductive component includes a first conductive component and a second conductive component. The first contact of the first conductive component is used to connect to the first lead end of the voice coil, and the first contact of the second conductive component is used to connect to the second lead end of the voice coil. The second contact of one of the first conductive component and the second conductive component is connected to the positive terminal of the target circuit, and the second contact of the other is connected to the negative terminal of the target circuit.

4. The basin stand assembly according to claim 3, characterized in that, The metal part and the plastic part are connected to form the basin frame body arranged in a ring shape, and the first conductive element and the second conductive element are symmetrically arranged about the axis of symmetry of the basin frame body.

5. The basin stand assembly according to claim 1, characterized in that, The plastic portion is partially disposed outside the notch and stacked with the metal portion along the axial direction of the basin frame body. The basin frame assembly further includes: The circuit board is connected to the portion of the plastic part located outside the notch, the second contact is connected to the circuit board, and the circuit board is connected to the target circuit.

6. The basin stand assembly according to claim 1, characterized in that, The conductive element includes at least one of a first extension and a second extension and a connecting portion. The connecting portion is arranged along the axial direction of the basin frame body. The first extension extends radially from one end of the connecting portion along the basin frame body, and the second extension extends radially from the other end of the connecting portion along the basin frame body. The surface of the first extension is flush with the plastic portion to form the first contact point, and the surface of the second extension is flush with the plastic portion to form the second contact point.

7. The basin stand assembly according to claim 1, characterized in that, The conductive component and the plastic part are injection molded together.

8. An audio module, characterized in that, include: Voice coil; The basin frame assembly as described in any one of claims 1-7, wherein the basin frame body of the basin frame assembly is disposed around the voice coil; The diaphragm is connected on the same side to the frame body and the voice coil, respectively. A conductive path is provided on the surface of the diaphragm facing the voice coil. One end of the conductive path is electrically connected to the voice coil, and the other end is connected to the first contact of the conductive element.

9. The audio module according to claim 8, characterized in that, The conductive element includes a first conductive element and a second conductive element. The conductive path includes a first conductive path and a second conductive path spaced apart from each other on the surface of the diaphragm. The first conductive path connects the first lead end of the voice coil to the first contact of the first conductive element. The second conductive path connects the second lead end of the voice coil to the first contact of the second conductive element. The second contact of one of the first conductive element and the second conductive element is connected to the positive terminal of the target circuit, and the second contact of the other is connected to the negative terminal of the target circuit.

10. The audio module according to claim 8, characterized in that, The audio module includes a speaker module or a handset module.

11. An electronic device, characterized in that, Includes the audio module as described in any one of claims 8-10.

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