MAGNETIC SENSOR DEVICE, SYSTEM AND METHOD WITH ERROR DETECTION

Abstract

The present application discloses a magnetic sensor device, system and method with error detection. A method (1000) for magnetic sensing using at least two magnetic sensing elements (including a first magnetic sensor element and a second magnetic sensor element), the method comprising: a) measuring a combination of a first signal and a second signal obtained from the two sensors in a first configuration; b) measuring a separate signal obtained only from the first sensor in a second configuration; c) testing the consistency of the combined signal and the separate signal, or testing the consistency of the signal derived therefrom, to detect errors. A sensor device configured to perform the method. A sensor system, the sensor system comprising the sensor device and a second processor optionally connected to the sensor device.

Description

Technical Field

[0001] The present invention relates generally to the field of magnetic sensor devices, systems and methods, and more particularly to magnetic sensor devices, systems and methods having error detection capabilities. Background Art

[0002] Magnetic sensors are known in the art, such as current sensors, proximity sensors, position sensors, etc. They are based on measuring magnetic field characteristics at one or more sensor locations. Depending on the application, the measured magnetic field characteristic(s) can be used to deduct another quantity, such as, for example, the current intensity, the proximity of a so-called target, the relative position of the sensor device to a magnet, etc.

[0003] There are many variations of magnetic sensor devices, systems, and methods to address one or more of the following requirements: use simple or inexpensive magnetic structures, use simple or inexpensive sensor devices, be able to measure over a relatively large range, be able to measure with high accuracy, require only simple arithmetic, be able to measure at high speeds, be highly robust to positioning errors, be highly robust to external interference fields, provide redundancy, be able to detect errors, be able to detect and correct errors, have a good signal-to-noise ratio (SNR), etc. Often, two or more of these requirements conflict with each other, so trade-offs need to be made.

[0004] Magnetic sensors are often used in robotics and automotive applications where fault detection is important for the safety of the machines and the people who use them.

[0005] Magnetic sensor devices with error detection capabilities are known, but they typically involve duplicate hardware, which is less compact and more expensive.

[0006] There is always room for improvement or substitution. Summary of the invention

[0007] An object of embodiments of the present invention is to provide magnetic sensor methods, devices and systems that are capable of measuring magnetic fields and of detecting errors (e.g. errors associated with defective sensor elements or defective transducers, or their defective bias, or their defective readout).

[0008] It is an object of embodiments of the present invention to provide magnetic sensor methods, devices and systems which are able to measure magnetic fields with improved accuracy, for example with an improved signal-to-noise ratio (compared to some prior art).

[0009] It is an object of embodiments of the present invention to provide a magnetic sensor method, device and system which are capable of detecting errors in a relatively simple manner and / or by adding only minimal hardware.

[0010] It is an object of embodiments of the present invention to provide magnetic sensor methods, devices and systems that are capable of measuring magnetic fields and detecting errors with improved performance (eg, requiring only two data acquisition steps instead of three).

[0011] It is an object of embodiments of the present invention to provide a magnetic sensor device which provides accurate measurement data and validity values ​​(or error indications). In this case, there is no need to perform a conformance test external to the sensor device, although it is possible.

[0012] It is an object of embodiments of the present invention to provide a magnetic sensor device which provides accurate measurement data and which also outputs auxiliary data to allow error detection to be performed externally of the sensor device, for example in an ECU.

[0013] It is an object of a particular embodiment of the present invention to provide a method of determining the position of a sensor device relative to a magnet or magnetic structure and to provide additional information indicating an error and / or to provide additional information allowing another processor connected to the sensor device to detect an error. It is also an object of an embodiment of the present invention to provide a sensor device and a system configured to perform the method.

[0014] It is a particular object of embodiments of the invention to provide such systems, devices and methods, in which the position is determined in a manner that is highly insensitive to external interfering fields (also called "stray fields").

[0015] These and other objectives are achieved by embodiments of the present invention.

[0016] According to a first aspect, the present invention provides a method for measuring at least one magnetic quantity in a reliable manner using an integrated circuit, the integrated circuit comprising: a first set of N magnetic sensor elements, N being at least one; a second set of N magnetic sensor elements; a configurable interconnection circuit adapted to selectively connect elements of the second set to or disconnect elements of the first set; and a processing circuit for configuring the interconnection circuit; the method comprising the following steps: a) configuring the interconnection circuit in a first mode, wherein each element of the first set is connected to an associated (or corresponding) element of the second set (e.g., in parallel or in series) to generate N combined signals, and measuring these N combined signals; b) configuring the interconnection circuit in a second mode c) performing a consistency test on the combined signal and the individual signals, and / or performing a consistency test on a first signal derived from the combined signal and a second signal derived from the individual signals; and providing a result of the consistency test as a validity signal; and outputting at least one signal selected from the group consisting of the above-mentioned combined signal, the individual signals, the above-mentioned first signal and the above-mentioned second signal; or outputting at least one of the combined signals and / or one of the first signals derived from the combined signal, and outputting at least one of the individual signals and / or one of the second signals derived from the individual signals, so as to allow an external processor (ECU) to perform a consistency check.

[0017] The method may be performed by a magnetic sensor device including at least two magnetic sensing elements (e.g., Figure 3D ) to execute.

[0018] The inventors unexpectedly found that an error of the first magnetic sensor element or the second magnetic sensor element can be detected by performing a consistency check on the combined signal (e.g. a linear combined signal or a summed signal or an average signal or a weighted average signal) and only one of the individual signals (e.g. either the signal obtained from the first magnetic sensor element or the signal obtained from the second magnetic sensor element). This is one of the basic principles of the invention. Counterintuitively, an error of, for example, the second sensor element can be detected without comparing the signal v2 provided by the second sensor element with the other.

[0019] Note that the individual signal(s) or second signal(s) derived therefrom may (and typically are) not as accurate as the combined signal(s) or first signal(s) derived therefrom, but they are typically found to be good enough, e.g. accurate enough for detecting errors.

[0020] The integrated circuit may include a semiconductor substrate. The semiconductor substrate may include sensor elements, interconnect circuits, and a processor.

[0021] The integrated circuit may further include at least one analog-to-digital converter for digitizing at least one of the combined signal(s), the individual signal(s), the first signal(s) derived from the combined signal(s), and the second signal(s) derived from the individual signal(s).

[0022] The signal from the first magnetic sensor element and the signal from the second magnetic sensor element are "combined" in the analog domain before digitization. In this way, the quantitative noise is reduced and thus the accuracy is improved.

[0023] The combined signal is preferentially a linear combination of the first sensor signal and the second sensor signal, for example using a sum of two strictly positive coefficients different from zero, or an average value, or a weighted average value.

[0024] In an embodiment, the combined signal(s) are generated using active components, such as, for example, a subtraction circuit including an operational amplifier or a summing circuit including an operational amplifier.

[0025] In an embodiment, the combined signal(s) are generated in a passive manner by connecting the first sensor element and the second sensor element in series or in parallel (eg using switches, such as MOSFET switches).

[0026] Preferably, the first sensor element and the second sensor element are substantially identical (eg, manufactured using the same layout symbols and the same dimensions), differing only by production tolerances and imperfections.

[0027] In an embodiment, step c) comprises one of the following options:

[0028] i) outputting N combined signals, testing the consistency of the N combined signals and the N individual signals, and providing the result of the consistency test as a validity signal;

[0029] ii) Output N combined signals and N individual signals to allow an external processor (ECU) to perform conformance testing;

[0030] iii) determining at least one first signal derived from the N combined signals, and determining at least one second signal derived from the N individual signals; and testing the consistency of the N combined signals and the N individual signals, and / or testing the consistency of at least one first signal and at least one second signal, and / or testing the consistency of at least one further first signal derived from the first signal and at least one further second signal derived from the second signal; providing the result of the consistency test as a validity signal; and outputting at least one signal selected from the group consisting of the above-mentioned N combined signals, the above-mentioned N individual signals, the above-mentioned at least one first signal, the above-mentioned at least one second signal, the above-mentioned at least one further first signal and the above-mentioned at least one further second signal;

[0031] iv) determining at least one first signal derived from the N combined signals, and determining at least one second signal derived from the N individual signals; and outputting at least one first signal and at least one second signal, and / or outputting at least one further first signal derived from the first signal and at least one further second signal derived from the second signal, to allow an external processor (ECU) to perform consistency testing.

[0032] Option i) may be considered as a first option, wherein the consistency check is performed within the sensor device and is based on a comparison of the combined signal(s) and the individual signal(s).

[0033] Option ii) may be considered as a second option, where the consistency check would be performed outside the sensor device and based on a comparison of the combined signal(s) and the individual signal(s).

[0034] Option iii) may be considered as a third option, wherein the consistency check is performed within the sensor device and is based on a comparison of the at least one first signal and the at least one second signal.

[0035] Option iv) may be considered as a fourth option, wherein the consistency check is to be performed outside the sensor device and is based on a comparison of the at least one first signal and the at least one second signal.

[0036] In an embodiment, the interconnection circuit comprises N switches adapted for selectively connecting the magnetic sensor elements of the first set in parallel or in series with associated magnetic sensor elements of the second set.

[0037] Depending on the implementation, step a) may include closing the N switches and step b) may include opening the N switches, or vice versa. The inventors unexpectedly discovered that adding switches (one for each magnetic sensor pair) is essentially all that is required to implement the functionality mentioned above (assuming that two identical magnetic sensor elements are already present).

[0038] In an embodiment, the method further includes: determining at least one first difference signal (e.g., Bx_full, By_full) by subtracting two combined signals, and determining at least one second difference signal (e.g., Bx_part, By_part) by subtracting two separate signals; and step iii) includes: testing the consistency of at least one first difference signal (e.g., Bx_full) and at least one second difference signal (e.g., Bx_part); and step iv) includes: outputting at least one first difference signal (e.g., Bx_full), and outputting at least one second difference signal (e.g., Bx_part) to allow an external processor (e.g., ECU) to perform a consistency test.

[0039] Figure 5A , Fig. 7A , Fig. 8A , Fig.9A An example of such an embodiment is shown in , where each “difference signal”, eg Bx_full, By_full, Bx_part, By_part, represents a magnetic field component and where the consistency of the “combined” magnetic field component and the “individual” magnetic field components can be tested.

[0040] Another example of such an embodiment is Fig. 6A As shown, each "difference signal", such as dBz / dx_full, dBz / dy_full, dBz / dx_part, dBz / dy_part, represents a magnetic field gradient, and the consistency of the "combined" magnetic field gradient and the "individual" magnetic field gradient can be tested.

[0041] In an embodiment, the method further includes: determining at least one first sum signal (e.g., Bz_full) by adding two combined signals, and determining at least one second sum signal (e.g., Bz_part) by adding two separate signals; and step iii) includes: testing the consistency of at least one first sum signal (e.g., Bz_full) and at least one second sum signal (e.g., Bz_part); and step iv) includes: outputting at least one first sum signal (e.g., Bz_full), and outputting at least one second sum signal (e.g., Bz_part) to allow an external processor (e.g., ECU) to perform a consistency test.

[0042] Figure 5A , Fig. 7A , Fig. 8A and Fig.9A An example of such an embodiment is shown in , where Bz_full, Bz_part, Bz_avg represent magnetic field components and where the consistency of the “combined” magnetic field component and the “individual” magnetic field components can be tested.

[0043] In an embodiment, the method further comprises: determining at least one first difference signal (e.g. Bx_full, By_full) by subtracting the two combined signals, and determining at least one second difference signal (e.g. Bx_part, By_part) by subtracting the two individual signals, and calculating a first angle value (e.g. ), and calculating a second angle value (eg, ); and step iii) comprises: testing the first angle value (eg ) and the second angle value (e.g. ) consistency; and step iv) comprises: outputting a first angle value (eg ) and the second angle value (e.g. ) to allow an external processor (such as an ECU) to perform conformance testing. Figure 5A and Fig. 6A and Fig.9A An example of this embodiment is shown in FIG.

[0044] In an embodiment, the method further comprises: determining at least one first difference signal (e.g., Bx_full) by subtracting the two combined signals, and determining at least one second difference signal (e.g., Bx_part) by subtracting the two individual signals, and determining at least one first sum signal (e.g., Bz_full) by adding or averaging the two combined signals, and determining at least one second sum signal (e.g., Bz_part) by adding or averaging the two individual signals, and calculating a first angle value (e.g., Bx_full) based on a ratio of the first difference signal to the first sum signal. ) and calculating a second angle value (eg, ); and step iii) comprises: testing the first angle value (eg ) and the second angle value (e.g. ) consistency; and step iv) comprises: outputting a first angle value (eg ) and the second angle value (e.g. ) to allow an external processor (such as an ECU) to perform conformance testing. Figure 5A and Fig.9A An example of this embodiment is shown in FIG.

[0045] In one embodiment, the method further comprises: determining at least one first difference signal (e.g. Bxa_full, Bya_full) by subtracting two combined signals, and determining at least one second difference signal (e.g. Bxa_part, Bya_part) by subtracting two individual signals, and / or determining at least one first sum signal (e.g. Bz_full) by adding or averaging the two combined signals, and determining at least one second sum signal (e.g. Bz_part) by adding or averaging the two individual signals, and determining at least one third difference signal (e.g. dBx / dx_full, dBy / dx_full) by subtracting the two first difference signals or by subtracting the two first sum signals. _full), and determining at least one fourth difference signal (e.g. dBx / dx_part, dBy / dx_part) by subtracting the two second difference signals or by subtracting the two second sum signals; and step iii) includes: testing the consistency of at least one third difference signal (e.g. dBx / dx_full; dBz / dx_full) and at least one fourth difference signal (e.g. dBx / dx_part; dBz / dx_part); and step iv) includes: outputting at least one third difference signal (e.g. dBx / dx_full) and at least one fourth difference signal (e.g. dBx / dx_part) to allow an external processor (e.g. ECU) to perform a consistency test. Fig. 7A and Fig. 8A An example of this embodiment is shown in FIG.

[0046] In an embodiment, the method further comprises: determining at least one first difference signal (e.g., Bxa_full, Bya_full) by subtracting two combined signals, and determining at least one second difference signal (e.g., Bxa_part, Bya_part) by subtracting two individual signals, and / or determining at least one first sum signal (e.g., Bz_full) by adding or averaging the two combined signals, and determining at least one second sum signal (e.g., Bz_part) by adding or averaging the two individual signals, and determining at least one third difference signal (e.g., dBx / dx_full, dBy / dx_full) by subtracting the two first difference signals or by subtracting the two first sum signals, and determining at least one fourth difference signal (e.g., dBx / dx_part, dBy / dx_part) by subtracting the two second difference signals or by subtracting the two second sum signals; and calculating a first angle value (e.g., dBx / dx_part) based on the ratio of the two third difference signals. ), and calculating a second angle value (eg, ); and step iii) comprises: testing the first angle value (eg ) and the second angle value (e.g. ) consistency; Step iv) includes: outputting the first angle value (eg ) and the second angle value (e.g. ) to allow an external processor (such as an ECU) to perform conformance testing. Fig. 7A and Fig. 8A An example of this embodiment is shown in FIG.

[0047] According to a second aspect, the invention also provides a method for determining a linear or angular position of a sensor device and detecting errors, the sensor device being movable relative to a magnetic source and vice versa, the method comprising: a) determining at least one angular value (e.g. ) and detecting the error using a method according to an embodiment of the first aspect, wherein an angular value is calculated; b) the angular value is converted into a linear or angular position.

[0048] Step b) can be performed in a known manner and therefore does not need to be explained in detail here. It can be said that in the case of a linear system, step b) may include, for example, an offset correction and a scaling using a predefined constant (for example in the case of a multi-pole magnet) and optionally an integer number of complete turns. In the case of a linear system, step b) may include, for example, an offset correction and a conversion of the angular value into a linear value, the conversion of the angular value into a linear value being performed by scaling using a predefined constant and optionally an integer number of pole pitches.

[0049] According to a third aspect, the present invention also provides a sensor device, which includes an integrated circuit and a processing circuit; the integrated circuit includes: a first set of N magnetic sensor elements, N is an integer value of at least 1; a second set of N magnetic sensor elements, and a configurable interconnection circuit, which is used to selectively connect each element of the second set to an associated element of the first set, or disconnect it from the associated element of the first set; the processing circuit is configured to perform the method according to the first aspect or the second aspect.

[0050] The sensor device may be a "linear Hall" device, a linear or angular position sensor device, a current sensor device, a proximity sensor device, or the like.

[0051] In an embodiment, each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises a vertical Hall element, such as Figure 3A shown.

[0052] In an embodiment, each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements includes two perpendicular Hall elements oriented in orthogonal directions, for example Figure 4A shown.

[0053] In an embodiment, each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises four horizontal Hall elements arranged near a periphery of a circular IMC, wherein the Hall elements of the first set are spaced at substantially multiples of 90°, and wherein the Hall elements of the second set are spaced at substantially multiples of 90°, and wherein the Hall elements of the second set are positioned at a distance of less than 80 μm relative to an associated Hall element of the first set, e.g., as Figure 5A , Fig. 6A shown.

[0054] In an embodiment, each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements includes four horizontal Hall elements arranged near the periphery of the first circular IMC and four horizontal Hall elements arranged near the periphery of the second circular IMC, for example, Fig. 7A shown.

[0055] In an embodiment, each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements includes two horizontal Hall elements arranged near the periphery of the first circular IMC and two horizontal Hall elements arranged near the periphery of the second circular IMC, for example, Fig. 8A shown.

[0056] In an embodiment, a first set of N magnetic sensor elements comprises two horizontal Hall elements arranged near the periphery of the first integrated magnetic concentrator and spaced substantially 180° apart, and a second set of N magnetic sensor elements comprises two horizontal Hall elements arranged near the periphery of the second integrated magnetic concentrator and spaced substantially 180° apart, e.g. Fig. 9B shown.

[0057] In an embodiment, the sensor device is a linear Hall device configured to measure a magnetic field component.

[0058] In an embodiment, the sensor device is a current sensor device configured to measure a current flowing through an electrical conductor (eg a bus).

[0059] In an embodiment, the sensor device is a proximity sensor device configured to detect the presence or absence of a target within a predefined range.

[0060] In an embodiment, the sensor device is an angular position sensor device configured to provide an angular position of the sensor device relative to the magnetic source;

[0061] In an embodiment, the sensor device is a linear position sensor device configured for providing a linear position of the sensor device relative to a magnetic structure having a plurality of alternating poles.

[0062] According to a fourth aspect, the present invention also provides a magnetic sensor system, the magnetic sensor system comprising: a sensor device according to the third aspect; and a second processor (e.g., an ECU) communicatively connected to the sensor device and configured to receive at least some of the signals output by the sensor device, and in the case of option ii) and option iv), further configured to perform a consistency test. Note that the second processor may ignore some of the signals sent by the sensor device.

[0063] In an embodiment, the magnetic sensor system further comprises a magnetic source, such as a permanent magnet, such as an axially or radially magnetized two-pole magnet, or an axially or radially magnetized multi-pole magnet with at least four poles, such as in the form of a ring magnet or a disk magnet, or an elongated structure comprising a plurality of at least two or at least four or at least six alternating poles.

[0064] According to a fifth aspect, the present invention also provides a method for measuring at least one magnetic quantity in a reliable manner using a system according to the fourth aspect, the system comprising a sensor device communicatively coupled to a second processor (e.g., an ECU); wherein the sensor device executes the method according to the first aspect; and wherein at least one of the sensor device and the second device performs a consistency check to detect errors.

[0065] Particular and preferred aspects of the invention are set out in the accompanying independent and dependent claims. Features from the dependent claims may be combined with features of the independent claims and with features of other dependent claims as appropriate and not just as explicitly set out in a claim.

[0066] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment(s) described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Fig. 1 is a schematic block diagram of a sensor circuit known in the art. The sensor circuit comprises a first sensor structure at a first position X1 along the X-axis, and a second sensor structure at a second position X2; each sensor structure comprises an integrated magnetic concentrator (IMC) and two horizontal Hall elements arranged on opposite sides of the IMC.

[0068] Fig. 2 is a schematic block diagram of a sensor circuit known in the art and a variant of Fig. 1. The sensor circuit comprises a first sensor structure at a first position X1 and a second sensor structure at a second position X2 along the X-axis; each sensor structure comprises an integrated magnetic concentrator (IMC) and four horizontal Hall elements arranged at the periphery of the IMC.

[0069] Figure 3A and Figure 3B is a schematic representation of a circuit including two vertical Hall elements. Figure 3A A first mode of operation is shown in which a combination (eg, a linear combination, such as a sum, weighted sum, or average) of the signals from two perpendicular Hall elements is measured. Figure 3B A second mode of operation is shown in which the signal from only one of the vertical Hall elements is measured.

[0070] Figure 3C It is available with Figure 3A A schematic representation of an illustrative configurable interconnect circuit for use in conjunction with a sensor element that allows measurement of a combined signal when configured in a first mode (where the switch is closed) and allows measurement of only one individual signal when configured in a second mode (where the switch is open).

[0071] Figure 3D Yes Figure 3A Sensors and Figure 3C A schematic representation of a sensor device having interconnected circuits (together forming a "front end"), and further including an analog-to-digital converter (ADC) and a processing circuit with a programmable controller, the programmable controller being used to selectively configure the interconnected circuits in a first mode and obtain data from the ADC (referred to as a "combined signal") and configure the interconnected circuits in a second mode and obtain data from the ADC (referred to as a "separate signal").

[0072] Figure 4A and Figure 4B is a schematic representation of a circuit including four vertical Hall elements. Figure 4A A first mode of operation is shown in which the signals from the two sensor elements are combined before being measured. Figure 4B A second mode of operation is shown, in which only two separate signals are measured.

[0073] Figure 4C It is available with Figure 4A A schematic representation of an illustrative configurable interconnect circuit for use in conjunction with the sensor elements shown.

[0074] Figure 5A and Figure 5B is a schematic representation of a circuit containing only one integrated magnetic concentrator disk and eight horizontal Hall elements. Figure 5A A first mode of operation is shown in which signals from the sensor elements are combined in pairs (eg, added or averaged) before being measured and further processed (eg, pairwise subtracted). Figure 5B A second mode of operation is shown, in which the signals are not combined before being measured, but in which four separate signals are measured and further processed (eg, pairwise subtraction).

[0075] Figure 5C It is available with Figure 5A Schematic representation of an illustrative configurable interconnect circuit used in conjunction with a sensor element for selectively providing signals Bx_full and By_full (in Mode 1 ), and signals Bx_part and By_part (in Mode 2 ).

[0076] Figure 5D Shows that Figure 5A The sensor element is used in conjunction with another configurable interconnect circuit.

[0077] Fig. 6A and Figure 6B is a schematic representation of a circuit comprising eight horizontal Hall elements arranged on an imaginary circle, but without an IMC. Fig. 6A A first mode of operation is shown (in which signals from associated sensor elements are combined in pairs). Figure 6B A second mode of operation is shown.

[0078] Fig. 7A and Figure 7B It includes two Figure 5A Schematic representation of a circuit of two sensor structures is shown, the two sensor structures being spaced apart by a predefined distance ΔX. Fig. 7A A first mode of operation is shown (in which signals from associated sensor elements are combined in pairs prior to readout). Figure 7B A second mode of operation is shown.

[0079] Fig. 8A and Figure 8B is with Fig. 7A and Figure 7B Schematic representation of a similar circuit with two IMC disks but with only four horizontal Hall elements at the periphery of each IMC. Fig. 8A A first mode of operation is shown (in which signals from associated sensor elements are combined in pairs prior to readout). Figure 8B A second mode of operation is shown.

[0080] Fig.9A and Fig. 9Bis a schematic representation of a circuit similar to that of FIG. 1 , with two IMC disks and only two horizontal Hall elements at the periphery of each IMC. Fig.9A A first mode of operation is shown. Fig. 9B A second mode of operation is shown.

[0081] Fig.10 A flow chart of a method according to an embodiment of the present invention is shown.

[0082] Fig.11 A flow chart of a method that may be performed by a sensor device described herein is shown.

[0083] The drawings are schematic and non-limiting. In the drawings, for illustrative purposes, the size of some of the elements may be exaggerated and not drawn to scale. Any reference numerals in the claims should not be interpreted as limiting the scope. In different drawings, the same reference numerals refer to the same or similar elements. DETAILED DESCRIPTION

[0084] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims.

[0085] The terms first, second, etc. in the specification and in the claims are used to distinguish between similar elements and not necessarily to describe a sequence in time, space, level, or in any other manner. It should be understood that the terms so used are interchangeable where appropriate, and that the embodiments of the invention described herein are capable of operating in a different sequence than described or illustrated herein.

[0086] Furthermore, the terms top, bottom, etc. in the specification and claims are used for descriptive purposes and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances, and that the embodiments of the invention described herein are capable of operation in orientations other than those described or illustrated herein.

[0087] It is to be noted that the term "comprising" used in the claims should not be interpreted as being limited to the means listed thereafter; it does not exclude other elements or steps. Therefore, the term should be interpreted as specifying the presence of the stated features, integers, steps or components as mentioned, but does not exclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Therefore, the scope of the expression "a device comprising means A and B" should not be limited to devices consisting only of components A and B. It means that for the present invention, the only relevant components of the device are A and B.

[0088] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment, but may refer to the same embodiment. Furthermore, in one or more embodiments, as will be apparent to one of ordinary skill in the art from this disclosure, the particular features, structures, or characteristics may be combined in any suitable manner.

[0089] Similarly, it should be understood that in the description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and assisting in understanding one or more of the various inventive aspects. However, this disclosure method should not be interpreted as reflecting an intention that the claimed invention requires more features than those expressly recited in each claim. On the contrary, as reflected in the appended claims, inventive aspects reside in fewer features than all of the features of a single preceding disclosed embodiment. Therefore, the claims appended after the detailed description are hereby expressly incorporated into this detailed description, with each claim itself representing a separate embodiment of the present invention.

[0090] In addition, although some embodiments described herein include some features included in other embodiments but do not include other features included in other embodiments, as will be understood by those skilled in the art, the combination of features of different embodiments is intended to fall within the scope of the present invention and form different embodiments. For example, in the appended claims, any of the claimed embodiments can be used in any combination.

[0091] In the description provided herein, numerous specific details are set forth. However, it should be understood that embodiments of the present invention may be practiced without these specific details. In other examples, well-known methods, structures, and techniques are not shown in detail to avoid confusing the understanding of this description.

[0092] In this document, unless explicitly mentioned otherwise, the term "magnetic sensor device" or "sensor device" refers to a device comprising at least two magnetic sensor elements, preferably integrated in a semiconductor substrate. The sensor device may be included in a package (also referred to as a "chip"), but this is not absolutely necessary.

[0093] In this document, the term “sensor element” or “magnetic sensor element” refers to a single vertical Hall element or a single horizontal Hall element or a single magnetoresistive element (eg a GMR element or an XMR element).

[0094] In this document, the term "magnetic sensor" or "magnetic sensor structure" may refer to a set of components or subcircuits or structures capable of measuring magnetic quantities, such as, for example, a set of at least two magnetic sensor elements, or a Wheatstone bridge comprising four MR elements.

[0095] In certain embodiments of the present invention, the term "magnetic sensor" or "magnetic sensor structure" may refer to an arrangement including one or more integrated magnetic concentrators (IMCs) (also referred to as integrated flux concentrators) and two, four, or eight horizontal Hall elements arranged near the periphery of the IMCs, for example, as shown in FIG. 1, or FIG. 2, or Figure 5A or Fig. 8A shown.

[0096] In this document, the expressions "in-plane component of the magnetic field vector" and "orthogonal projection of the magnetic field vector in the sensor plane" have the same meaning. If the sensor device is or comprises a semiconductor substrate, this also means "the magnetic field component is parallel to the semiconductor substrate".

[0097] In this document, the expressions "out-of-plane component of a vector" and "Z-component of a vector" and "orthogonal projection of the vector onto the axis perpendicular to the sensor plane" have the same meaning.

[0098] Embodiments of the present invention are generally described using an orthogonal coordinate system fixed to the sensor device and having three axes X, Y, Z, wherein the X-axis and the Y-axis are parallel to the substrate and the Z-axis is perpendicular to the substrate.

[0099] In this document, the expressions "spatial derivative" or "derivative" or "spatial gradient" or "gradient" are used as synonyms. In the context of the present invention, the gradient is usually determined as the difference between two values ​​measured at two different positions, which may be separated by a distance in the range of 1.0 mm to 3.0 mm. In theory, the gradient is calculated as the difference between the two values ​​divided by the distance "dx" between the sensor positions, but in practice, the division by "dx" is usually omitted, since the measured signal needs to be scaled anyway.

[0100] In this application, horizontal Hall plates are generally referred to as H1, H2, etc., and signals from these horizontal Hall plates are generally referred to as h1, h2, etc.; vertical Hall plates are generally referred to as V1, V2, etc.; and signals from these vertical Hall plates are generally referred to as v1, v2, etc.

[0101] In the context of the present invention, the formulas arctan(x / y), atan2(x,y), arccot(y / x) are considered equivalent.

[0102] Where reference is made in this document to a "signal provided by a sensor element", this may be a current signal or a voltage signal, unless explicitly mentioned or the context makes clear otherwise.

[0103] In the context of the present invention, "two associated sensor elements" or "two corresponding sensor elements" mean the same, i.e. they are interconnected by a configurable interconnection circuit so that the combined signal from these sensor elements can be measured in a first mode and the individual signals from these sensor elements can be measured in a second mode.

[0104] The present invention relates generally to the field of magnetic sensor devices, systems and methods, and more particularly to magnetic sensor devices, systems and methods having error detection capabilities.

[0105] Refer to the attached drawings.

[0106] FIG1 is a schematic block diagram of a sensor circuit known in the art. The sensor device includes a first sensor structure S1 located at a first position X1 along the X-axis and a second sensor structure S2 located at a second position X2. Each sensor structure S1, S2 includes an integrated magnetic concentrator IMC1, IMC2 and two horizontal Hall elements, which are arranged on opposite sides of the above-mentioned IMC and are located on the X-axis. It can be understood from the formula shown in FIG1 that each IMC with two horizontal Hall elements allows the measurement of an in-plane magnetic field component Bx oriented in the X-direction (parallel to the semiconductor substrate in which the Hall element is implemented), and an out-of-plane magnetic field component Bz oriented in the Z-direction (perpendicular to the semiconductor substrate). The sensor device has two such IMC structures spaced apart by a distance Δx of about 1.0 mm to about 3.0 mm, and the sensor device allows the determination of four magnetic field components Bx1, Bz1, Bx2, Bz2, from which two magnetic field gradients dBx / dx and dBz / dx can be derived. Depending on the application, these magnetic field values ​​or these gradient values ​​can be converted in a known manner into a current, a linear or angular position, etc. However, if one of the Hall elements is defective, one or more component values ​​and one or more gradient values ​​may be incorrect and thus also the current or position value derived therefrom, which is undesirable.

[0107] FIG. 2 is a schematic block diagram of another sensor circuit of a variant of FIG. 1 , known in the art. The sensor circuit includes a first sensor structure at a first position X1 along the X-axis and a second sensor structure at a second position X2; each sensor structure includes an integrated magnetic concentrator (IMC) and four horizontal Hall elements arranged at the periphery of the IMC. Two of the horizontal Hall elements of each IMC are located on the X-axis, and the other two horizontal Hall elements are arranged along the Y-axis perpendicular to the X-axis. Each of these IMCs with four horizontal Hall elements allows the measurement of three orthogonal magnetic field components Bx, By and Bz. The sensor device has two such IMC structures spaced at a distance Δx of about 1.0 mm to about 3.0 mm, and the sensor device allows the determination of six magnetic field components Bx1, By1, Bz1, Bx2, By2, Bz2, from which three magnetic field gradients dBx / dx, dBy / dx and dBz / dx can be derived. Depending on the application, these magnetic field values ​​or these gradient values ​​can be converted into current, linear or angular position, etc. in a known manner. However, if one of the Hall elements is defective, one or more component values ​​and one or more gradient values ​​may be incorrect, and thus the current or position values ​​derived therefrom may also be incorrect, which is undesirable.

[0108] The inventors of the present invention wished to find a magnetic sensor device which is not only able to measure magnetic field properties, such as magnetic field components and / or magnetic field gradients, but is also able to detect errors, in particular errors related to the proper functioning of the magnetic sensor element itself and / or a bias circuit and / or a readout circuit of the magnetic sensor element.

[0109] Existing solutions typically address this problem at the system level by duplicating the entire hardware chain, from the sensor, bias and readout circuits, optional demodulator circuits, analog-to-digital converters (ADCs), up to and including processing circuits. Such solutions work, but are less compact, consume more power, and are more expensive.

[0110] Figure 3A and Figure 3B is a schematic representation of a circuit comprising two vertical Hall elements V1 , V2 , each having an axis of maximum sensitivity oriented in the X direction (as schematically indicated by a black arrow). Preferably, these sensor elements are of the same size and layout, but they are spaced apart from each other.

[0111] In the classic circuit, sensor element V1 provides a signal v1 indicating magnetic field component Bx1, and sensor element V2 provides a signal v2 indicating magnetic field component Bx2. As mentioned above, and in order to keep the description simple, the scaling factor is omitted from the description, so it can be written as Bx1=v1 and Bx2=v2. The value of v1 can be read using a first ADC (not shown), and the value of v2 can be read using a second ADC (not shown). In order to test whether each of the vertical Hall elements is operating correctly, the values ​​of v1 and v2 can be compared, and if they deviate by no more than a predefined threshold, it can be determined that the sensor is operating correctly, and if they deviate by more than the above threshold, it can be determined that an error exists.

[0112] However, the inventors of the present invention have proposed another readout scheme, in which a combined signal of two vertical Hall elements is measured in a first mode (e.g., at a first moment in time), for example, a linear combination of v1 and v2 using only positive coefficients different from zero, such as a sum, an average or a weighted average. Such a combined signal can be mathematically written as: combined = A*v1+B*v2, where A and B are predefined constants greater than 0.0, such as A=1 and B=1 for a simple sum; or A=0.5 and B=0.5 for a simple average; or A=0.25 and B=0.75 as an example of a weighted average, and in which one of the individual signals, such as v1, is measured in a second mode (e.g., at a second moment in time).

[0113] The inventors unexpectedly discovered that a consistency check of the combined signal (e.g., v1+v2) and only one of the individual signals (e.g., v1) is sufficient to detect defects in either V1 or V2. This is counter-intuitive because one would expect that in order to detect whether V1 is functioning correctly, V1 must be compared to the combined signal, and in order to detect whether V2 is functioning correctly, V2 must be compared to the combined signal, but the inventors discovered that this is not necessary.

[0114] In fact, it is assumed (case i) that during normal operation, both V1 and V2 will provide the correct signal V (e.g., a specific voltage or current), and it is assumed that the combined signal is realized as a sum. In this case, the "combined signal" will be measured as 2V, while the individual signals will be measured as V, and the "combined signal" (2V) and the "individual signals" (V) are consistent because the sum should be approximately twice the individual values ​​within a predefined tolerance range.

[0115] Now assume (case ii) that V1 operates correctly and provides the correct value v1=V, but V2 is defective and provides an erroneous value v2=V+E (where E can be considered an error signal). In this case, the "combined signal" and the "individual signals" are not consistent, because the combined signal (2V+E) is usually not twice the signal v1 (2V).

[0116] Now assume (case iii) that V2 operates correctly and provides the correct value v2 = V, but V1 is defective and provides an erroneous value v1 = V + E. In this case, the "combined signal" and the "individual signals" are also inconsistent, because the combined signal (2V + E) is usually not twice the signal v1 (i.e. (2V + 2E)).

[0117] Therefore, the comparison of (v1) and the "combined signal" (e.g., v1+v2) allows the detection of errors in either of the elements V1 and V2, and the same applies to the comparison of (v2) and the "combined signal". Or in other words, the "individual signal" (e.g., v1) and the "combined signal" (e.g., v1+v2) are consistent only when both sensor elements V1 and V2 are functioning correctly. This is one of the basic principles of the present invention.

[0118] The associated elements V1 and V2 are preferably located closely together, for example at a distance Δx of less than 250 μm, or less than 150 μm, or less than 100 μm, so that substantially the same magnetic field values ​​are measured in many applications.

[0119] In an embodiment, the combined signal is the sum of signal v1 and signal v2, which can be implemented in hardware, for example, by (e.g. temporarily) connecting the differential outputs of the vertical Hall elements in series or in parallel (e.g., depending on whether they are biased using a current source or a voltage source), or using an active circuit including an amplifier, or in any other way. If both Hall elements are working correctly, the "sum signal" will have twice the amplitude of the individual signals and will therefore have an improved signal-to-noise ratio (SNR).

[0120] In another preferred embodiment, the combined signal is the average of v1 and v2, which can be implemented in hardware by (e.g. temporarily) connecting vertical Hall elements in parallel or in series, or using active circuits including amplifiers, or in any other way. If both Hall elements are working correctly, this will typically reduce the internal resistance by 1 / 2, thereby reducing noise and thus improving the signal-to-noise ratio.

[0121] Figure 3C is a schematic representation of an illustrative front end 391 that includes Figure 3A The sensor elements V1, V2 and the configurable interconnection circuit 399. Figure 3CThe interconnection circuit shown includes or consists of switches (e.g. MOSFETs) and "summers" or "averagers" and wiring. For example, the addition or averaging can be implemented using one or more physical components or using a subcircuit including an amplifier, but this is not absolutely necessary, and the "summing" or "averaging" can also be performed passively, for example by connecting the output nodes of the two Hall elements V1, V2 in series or in parallel with the aid of one or more switches (e.g. MOSFET transistors).

[0122] By way of example only, one or more switches may be arranged to selectively short the output node of the Hall element (or not short), or may be arranged to selectively short the input of a differential amplifier, or may be arranged to selectively connect the node to a reference voltage (e.g., ground), or may be arranged to disconnect one of the terminals of the amplifier, and so on.

[0123] The interconnection circuit 399 can be viewed as a schematic or conceptual representation of such a circuit, which allows the measurement of a "combined signal" (e.g., v1+v2) when configured in a first mode in which the switch SW is closed; and allows the measurement of a "separate signal" (e.g., v1) when configured in a second mode in which the switch SW is open, but the present invention is not limited to this, and a person skilled in the art can easily find a circuit that allows the measurement of a "combined signal" when the switch is open, and a circuit that allows the measurement of an "separate signal" when the switch is closed.

[0124] Figure 3D Yes Figure 3A The sensor elements V1, V2 and Figure 3C A schematic representation of a sensor device 390 having a configurable interconnection circuit 399, and further comprising an analog-to-digital converter (ADC) 392, followed by a processing circuit 393 including a programmable controller CPU, the processing circuit 393 being used to obtain a digitized version of a "combined signal" or a signal derived therefrom, and for obtaining a digital version of a "separate signal" or a signal derived therefrom, and a switch adapted to configure the interconnection circuit. Figure 3A The expression "or a signal derived therefrom" is not necessary for the sensor circuit, but will become clear further on, e.g. in the discussion of Figure 5C hour.

[0125] The sensor device can work as follows:

[0126] In the first mode, for example at the first moment, the CPU configures the interconnection circuit in the first mode by closing the switch SW, and measures and digitizes the combined signal, for example the sum or average of v1 and v2. Figure 3AThe "combined measurement" is schematically illustrated in FIG by coloring both sensor elements black, meaning that the signals from the associated sensor elements V1 and V2 are combined in pairs, in this case the signals from V1 and V2 are combined in pairs. Therefore, the processor will measure (v1+v2), which is a low-noise measurement of the magnetic field component Bx, denoted as Bx_full.

[0127] In the second mode, for example at a second time, the CPU configures the interconnection circuit in the second mode by opening the switch SW and measures and digitizes one of the individual signals. Figure 3B In the example of , only the signal v1 is measured, which is schematically shown by painting V1 black while leaving V2 white. The individual measurement signals are denoted Bx_part.

[0128] After measuring the combined signal Bx_full and the individual signals Bx_part, a consistency check of the “combined signal” and the “individual signals” may then be performed to detect errors. The result of the consistency test may then be output in the form of a validity signal or an error signal.

[0129] The consistency test can be implemented in several ways. For example, if the combined signal is a sum, the consistency check can test whether |Bx_full-2*Bx_part|<ε, where |...| refers to the absolute value and ε is a predefined tolerance margin, and / or test whether the ratio of (Bx_full / Bx_part) is approximately equal to 2.00 within a predefined tolerance margin (e.g., ±10% or ±5% or ±2%), and / or test whether (Bx_part / Bx_full) is approximately equal to 0.50 within the above tolerance margin. If the combined signal is implemented as the average of v1 and v2 instead of the sum, the consistency check may include testing whether |Bx_full-Bx_part|<ε, or testing whether (Bx_avg / Bx_part)≈1, where ≈ means "approximately equal" within a predefined tolerance range. Depending on the result of the consistency test, a validity signal or an error signal can be output.

[0130] The consistency check may be performed inside the sensor device 390 itself. In this case, the sensor device 390 may output a (low noise) combined signal Bx_full, as well as a validity signal or an error signal. However, the invention is not limited thereto, and it is also feasible that the consistency test is performed outside the sensor device 390, for example by an external processor, such as an electronic control unit (ECU) communicatively connected to the sensor device 390. In this case, in order to allow the consistency check to be performed outside the sensor device, the sensor device 390 would need to output the combined signal Bx_full as well as the separate signal Bx_part, and would not have to perform the consistency check internally, although it could.

[0131] In a practical implementation, the switch SW may be periodically operated to alternately configure the interconnection circuit 399 to a first mode for measuring the combined signal and a second mode for measuring the individual signals. However, depending on the application, it may not be necessary to perform a consistency check on every measurement, and for example, it may be sufficient to test consistency only once every two measurements, or only once every three measurements, or only once every ten measurements, or at other fractions.

[0132] exist FIG. 3A to FIG. 3D In , a very simple example of an embodiment of the invention is shown, wherein the sensor device comprises two vertical Hall elements V1, V2, each measuring a magnetic field component Bx, but the invention is of course not limited to this example and works equally well for other sensor devices with other sensor structures, such as horizontal Hall elements, which can measure one or more magnetic field components and / or one or more magnetic field gradients and can calculate one or more angles derived from the above components and / or gradients. The same principles described above can also be applied here mutatis mutandis, which in their simplest form can be summarized as follows: i) measuring a "combined signal" by combining the signals from two associated sensor elements in pairs, for example by connecting the two associated sensor elements in parallel or in series; ii) measuring "individual signals" by disconnecting the above associated sensor elements; iii) outputting the combined measurement; and iv) performing a consistency check and outputting a validity signal or an error signal. However, as mentioned above, it is also feasible to perform the consistency check outside the sensor device, in which case the sensor device can output a measurement of the combined signal and a measurement of the individual signals. However, if multiple magnetic field components are measured, a consistency check does not need to be performed on the actual measurements of the combined signal and the individual signals themselves, but the consistency check can be based on quantities derived from the measured signals, such as for example a comparison of magnetic field gradients, or on a comparison of two angular values ​​derived from the combined signal(s) and the individual signal(s), as will be explained further. Such a sensor device can have a configuration similar to Figure 3D , but it will include another front end 391 (see e.g. Figure 4C ), and the CPU will be configured to process the signal in different ways (e.g., according to Figure 4A and Figure 4B ), but other block diagrams may also be used. For example, Figure 3DThe block diagram of shows only one ADC, but the invention is not limited thereto and the sensor device may comprise multiple ADCs. It should also be noted that the signals derived from the combined signal(s) and the individual signal(s) may be further processed in the analog domain (e.g. sum or subtraction) or in the digital domain (e.g. inverse tangent), or partly in the analog domain and partly in the digital domain. This is for Figure 3A The circuit is not very relevant, but for 4A to 9A The circuit shown in is more relevant.

[0133] Figure 4A and Figure 4B is a schematic representation of a circuit 400 including four vertical Hall elements V1 to V4.

[0134] The circuit is Figure 3A and Figure 3B , and most of what was explained above also applies here mutatis mutandis. Only the main differences will be described.

[0135] from Figure 4A It can be seen that the two vertical Hall elements V1 and V2 have their axes of maximum sensitivity oriented in the X direction and form a first pair of associated sensor elements. The other two elements, V3 and V4, have their axes of maximum sensitivity oriented in the Y direction and form a second pair of associated sensor elements. The distance Δx between V1 and V2, and the distance Δy between V3 and V4 are preferably less than 250 μm, or less than 150 μm, or less than 100 μm.

[0136] Figure 4A A first mode of operation is shown in which the signals from associated pairs are combined before being measured. Figure 4A In the example of , the signal v1 and the signal v2 originating from the sensor elements V1 and V2 are combined, e.g. summed, and the sum (v1+v2) (referred to herein as “Bx_full”) is measured. Similarly, the signal v3 and the signal v4 originating from the sensor elements V3 and V4 are combined, e.g. summed, and the sum (v3+v4) (referred to herein as “By_full”) is measured. Depending on the implementation, the measurements of Bx_full and By_full may occur simultaneously in parallel, in which case two ADCs are required, or may occur sequentially, in which case only one ADC is sufficient. Optionally, the angular value may be calculated based on the two combined signals Bx_full and By_full. For example, by calculating the arctangent of the ratio of the two combined signals.

[0137] Figure 4BA second mode of operation (also referred to herein as "diagnostic mode") is shown. In this mode, a single signal in each associated pair (V1, V2) and (V3, V4) is measured. Figure 4B In the specific example of , a separate signal v1 is measured for the associated sensor pair (V1, V2), and a separate signal v3 is measured for the associated sensor pair (V3, V4). Signal v1 is referred to herein as Bx_part, and signal v3 is referred to as By_part. Again, depending on the implementation, the measurements of Bx_part and By_part may occur simultaneously in parallel, or may also occur sequentially. Optionally, the angle value may be calculated based on the two separate signals Bx_part and By_part. For example, by calculating the arctangent of the ratio of two separate signals.

[0138] Figure 4C It is available with Figure 4A Schematic representation of a configurable interconnect circuit 499 used in combination with the sensor elements V1 to V4 shown. It can be seen that in this case, the interconnect circuit 499 includes two switches SW1, SW2, one switch for each pair of signals that need to be combined. As explained above, the number of switches required to selectively measure (in the first mode) paired combined signals and (in the second mode) individual signals may be half the number of sensor elements. The interconnect circuit 499 further includes two "adders" or "summers", but as mentioned above, summing or averaging or linear combination does not necessarily require active components (such as amplifiers), but can be performed passively by connecting the differential outputs of the vertical Hall elements in series or in parallel.

[0139] As mentioned above, the consistency check can be performed inside the sensor device or outside the sensor device. Figure 4B , the consistency check may include: i) testing the consistency of Bx_full and Bx_part, and testing the consistency of Bx_full and Bx_part; or ii) testing and The consistency of the angles can be checked, for example, by testing whether these angle values ​​are the same within a predefined tolerance range (e.g. ±5°, or ±2°, or ±1°). Depending on the application, the values ​​Bx_full, Bx_part, By_full, By_part, If a consistency check is performed inside the sensor device, only the However, the consistency check can be performed outside the sensor device, for example by an external processor (e.g. ECU) connected to the sensor device. If the consistency check is based on a comparison of the combined signal and the individual signals, the sensor device must output Bx_full, Bx_part, Bx_full and Bx_part. If the consistency check is based on two angles and , then the sensor device must output these angular values. Of course, it is also feasible to perform consistency checks inside and outside the sensor device by comparing components and / or by comparing angles. A skilled person having benefit of the present disclosure can easily select one of these options, for example, depending on the available communication bandwidth and / or the available functions and processing power of an external processor (e.g., ECU).

[0140] For ease of description, the total number of sensor elements V1, V2, V3, V4 ( Figure 4A In the embodiment of FIG. 1 , N=4) can be divided into a first set SET1 with N / 2=2 sensor elements (including V1 and V3), and a second set of two sensor elements V2 and V4. The first set SET1 of sensor elements are elements whose outputs are used in both the first mode and the second mode of operation. Figure 4B In FIG. 5 , these sensor elements are painted black. The second set of sensor elements SET2 are elements whose outputs are used only in the first mode of operation and not in the second mode of operation. Figure 4B A good understanding of this division may help to better understand the principles of the present invention, especially in the following figures with a relatively large number of sensor elements.

[0141] Figure 5A and Figure 5B is a schematic representation of a circuit 500 including an integrated magnetic concentrator IMC1 and eight horizontal Hall elements H1 to H8 arranged about the periphery of the IMC. The IMC may have a circular shape with a diameter d5 of about 150 μm to about 250 μm. The Hall elements may have a square shape with a length and width of about 15 μm to about 25 μm. As can be seen, the eight horizontal Hall elements are not evenly distributed around the periphery of the IMC, but are arranged in four groups, each group including two horizontal Hall elements that are closely positioned together (e.g., less than 50 μm apart). The groups are located on the periphery of the IMC, in a circle formed by Figure 5A The black dots in the figure are at positions L1 to L4 and are spaced 90° apart.

[0142] Adjacent Hall elements form four associated pairs. Odd-numbered Hall elements H1, H3, H5 and H7 form a first set (set1) of sensor elements, and even-numbered Hall elements H2, H4, H6, H8 form a second set (set2) of sensor elements.

[0143] In the first mode of operation, four "combined signals" can be measured. Specifically:

[0144] Combine signals h1 and h2 and measure the combined signal (h1+h2), and

[0145] combining signals h3 and h4 and measuring the combined signal (h3+h4), and

[0146] combining signals h5 and h6 and measuring the combined signal (h5+h6), and

[0147] Signals h7 and h8 are combined, and the combined signal (h7+h8) is measured.

[0148] Depending on the hardware implementation (eg number of ADCs), all combined signals may be measured or captured simultaneously, but this is not absolutely necessary and it is also feasible to measure or capture the combined signals sequentially, in four steps or in two of two combined signals.

[0149] From these "combined signals", other signals can be derived. For example, by subtracting the combined signals (h3+h4) and (h1+h2) in the analog domain or the digital domain, the signal Bx_full can be generated. Similarly, by subtracting the combined signals (h5+h6) and (h7+h8) in the analog domain or the digital domain, the signal By_full can be generated, and by adding the combined signals (h3+h4) and (h1+h2) in the analog domain or the digital domain, the signal Bz_full can be generated. The signals Bx_full and By_full can be referred to as "first difference signals", where the word "first" refers to the first mode. The signal Bz_full can be referred to as the "first sum signal".

[0150] Optionally, further signals or values ​​may be derived from the first difference signal and / or the first sum signal. For example, a "first angle value" It can be calculated based on the “first difference” signals Bx_full and By_full, for example according to the following formula: Another first angle value can be calculated based on the first difference signal Bx_full and the first sum signal Bz_full For example, according to the following formula:

[0151] Figure 5BA second mode of operation is shown, in which the signals from the first and second sets are not combined, but in which the individual signals from the horizontal Hall elements H1, H3, H5, H7 of the first set (set1) are measured individually. Figure 5B In the specific example of , the following "individual signals" are measured in the second mode of operation: h1, h3, h5, h7. Similar to the combined signal, these measurements may all occur at the same time, or occur consecutively, in multiple steps, such as in two steps or four steps.

[0152] Other signals can be derived from these "individual signals". For example, by subtracting individual signals (h3) and (h1) in the analog or digital domain, a signal Bx_part can be generated. Similarly, by subtracting individual signals (h5) and (h7) in the analog or digital domain, a signal By_part can be generated. By adding individual signals (h3) and (h1) in the analog or digital domain, a signal Bz_part can be generated. The brackets around the individual signals are used to show the similarity with the operations performed on the combined signal, but for the first item. The signals Bx_part and By_part can be referred to as "second difference signals", where the word "second" refers to the second mode. The signal Bz_part can be referred to as the "second sum signal".

[0153] Optionally, further signals or values ​​may be derived from the second difference signal and / or the second sum signal. For example, a “second angle value” It can be calculated based on the “second difference” signals Bx_part and By_part, for example according to the following formula: Another second angle value It can be calculated based on the second difference signal Bx_part and the second sum signal Bz_part, for example, according to the following formula:

[0154] Figure 5C It is available with Figure 5A Schematic representation of an illustrative configurable interconnect circuit 599 used in conjunction with the illustrated sensor structure. In the example shown, two subtraction circuits SUB1, SUB2 are used to generate a first difference signal Bx_full, By_full and a second difference signal Bx_part, By_part in the analog domain. The outputs of these subtraction circuits can be input to amplifiers and ADCs, etc.

[0155] To test the correct functioning of the sensor device or to detect errors, a consistency check may be performed by doing one or more of the following:

[0156] By comparing the "combined signal" with the corresponding "individual signals", for example by testing whether (h1+h2)≈(2*h1), and by testing whether (h3+h4)≈(2*h3), etc.; and / or

[0157] By comparing the "first difference signal" with the corresponding "second difference signal", for example by testing whether Bx_full≈2*Bx_part, and by testing whether By_full≈2*By_part; and / or

[0158] By comparing the first angle and the corresponding second angle For example, by testing whether where ψ is Figure 5B , and ε is a predefined threshold (e.g., 5° or 2° or 1°), and / or by comparing and

[0159] If the consistency test is performed in the sensor device, the valid signal or the error signal is preferably output by the sensor device and, of course, also one or more of the following signals, preferably in digital form, depending on the application: Bx_full, By_full, Bz_full,

[0160] As mentioned above, it is also feasible to perform the consistency check outside the sensor device, in which case the sensor device needs to output the values ​​to be compared to an external processor (such as an ECU), for example via a high-speed bus (such as a LAN bus), to allow the external processor to perform the consistency check.

[0161] Figure 5D It is available with Figure 5A Schematic representation of another illustrative configurable interconnect circuit 598 used in conjunction with the sensor structure shown. It can be seen that the circuit has an additional adding block ADD5. When in the first mode, the interconnect circuit 598 allows the first difference signal Bx_full, By_full and the first sum signal Bz_full to be generated in the analog domain, and when in the second mode, the second difference signal Bx_part, By_part and the second sum signal Bz_part to be generated in the analog domain.

[0162] As mentioned above, it is also feasible to generate the derived signal in the digital domain, in which case blocks SUB1 , SUB2 and ADD5 can be omitted.

[0163] Although Figure 5BIt may be suggested that the sensor elements of each set must be spaced exactly 90° apart and that "black elements" (i.e., elements measured in the second mode) must be interleaved with "white elements" (i.e., elements not measured in the second mode), but this is not actually required, and the invention will also work if any of the individual sensor elements are measured in the second mode, and / or if the spacing angles between elements are within the range of about 80° to about 100°, for example by using a less stringent consistency check.

[0164] Fig. 6A and Figure 6B is a schematic representation of a circuit 600 including eight horizontal Hall elements arranged on a virtual circle but without an IMC or flux concentrator. Fig. 6A Similar to Figure 5A , but their sizes are very different, and they measure very different properties.

[0165] Fig. 6A The diameter d6 of the virtual circle is usually a value in the range of about 1.5 mm to about 2.5 mm, which is usually larger than Figure 5A The diameter d5 is 10 times larger;

[0166] Fig. 6A Each of the sensor elements H1 to H8 measures a magnetic field component Bz oriented in a Z direction perpendicular to the semiconductor substrate;

[0167] Each of the combined signals (h1+h2), (h3+h4), (h5+h6) and (h7+h8) is proportional to the magnetic field component Bz to be measured at the positions L1, L3, L2 and L4;

[0168] The difference signal (h3+h4)-(h1+h2) represents the magnetic field gradient dBz / dx of the magnetic field component Bz along the X direction, and the difference signal (h5+h6)-(h7+h8) represents the magnetic field gradient dBz / dy of the magnetic field component Bz along the Y direction;

[0169] and Fig. 6A The angle value in It is based on the magnetic field gradient and is highly insensitive to external interfering fields.

[0170] Despite these differences, the same principles described above may be applied mutatis mutandis for the purpose of detecting errors.

[0171] Fig. 6A A first mode of operation is shown, in which the signals from the associated elements are combined and a "combined signal" is measured. Two first difference signals dBz / dx_full and dBz / dy_full can be derived from these combined signals in the analog or digital domain, and the angle values ​​can be calculated based on these first difference signals

[0172] Figure 6B A second mode of operation is shown, in which "individual signals" h1, h3, h5, h7 are measured and two "second difference signals" dBz / dx_part and dBz / dy_part can be derived from these individual signals in the analog or digital domain and the angle values ​​can be calculated based on these second difference signals

[0173] With Figure 5A In the same manner as in the above, the first angle value can be compared with the first angle value by comparing the corresponding "combined signal" and the "individual signal", and / or by comparing the corresponding "first difference signal" and the "second difference signal", and / or by comparing the first angle value and the second angle value If the consistency test is performed inside the sensor device, the sensor device preferably outputs a valid signal or an error signal, and preferably also outputs one or more of the following signals in digital form: dBz / dx_full, dBz / dy_full,

[0174] As mentioned above, it is also feasible to perform the consistency check externally to the sensor device, in which case the values ​​to be compared are output by the sensor device to an external processor (e.g., an ECU), for example via a high-speed bus (e.g., a LAN bus), to allow the external processor to perform the consistency check.

[0175] For completeness, it is worth mentioning that if Fig. 6A and Figure 6B The horizontal Hall elements are not located on a single imaginary circle, but if for example H1, H3, H5 and H7 are located on a first circle with a first radius R1, and if elements H2, H4, H6, H8 are located on a second circle with a radius R2 that is slightly larger or slightly smaller than R1, Fig. 6A and Figure 6B The sensor device will also work. It is sufficient that each of the elements H2, H4, H6, H8 is arranged closely to its associated element H1, H3, H5, H7, respectively (for example, at a distance of less than 80 μm).

[0176] And for the sake of completeness, it is worth mentioning that Figure 6B In the embodiment of the present invention, if any element of a pair is selected as a single element, the present invention will still work; they do not need to be as Figure 6B In fact, in the second mode, it is not even necessary to always measure the same individual signals, but it may be easier to achieve.

[0177] Fig. 7A and Figure 7B is a schematic representation of a circuit 700, which includes Figure 5A The two sensor structures shown are separated by a predefined distance Δx (eg, in the range of 1.0 mm to 3.0 mm or 1.5 mm to 2.5 mm).

[0178] Fig. 7A The first mode of operation is shown. In this mode, a plurality of "combination signals" can be measured, namely: (h1a+h2a), (h3a+h4a), (h5a+h6a), (h7a+h8a), (h1b+h2b), (h3b+h4b), (h5b+h6b), (h7b+h8b). From these "combination signals" four "first difference signals" and two "first sum signals" can be derived, namely:

[0179] Bxa_full=(h3a+h4a)-(h1a+h2a)

[0180] Bya_full=(h5a+h6a)-(h7a+h8a)

[0181] Bxb_full=(h3b+h4b)-(h1b+h2b)

[0182] Byb_full=(h5b+h6b)-(h7b+h8b)

[0183] Bza_full=(h1a+h2a)+(h3a+h4a)

[0184] Bzb_full=(h1b+h2b)+(h3b+h4b)

[0185] For example, in the simulation domain, using Figure 5D Similar to two interconnected circuits, or in the digital domain.

[0186] It is feasible to derive further signals from these “first difference signals” and “first sum signals”, for example, three “first magnetic field gradients” can be calculated using one or more of the following formulas:

[0187] dBx / dx_full=Bxb_full-Bxa_full

[0188] dBy / dx_full=Byb_full-Bya_full

[0189] dBz / dx_full=Bzb_full-Bza_full

[0190] And one or more “first angle values” can be derived from these gradient signals, for example using one or more of the following formulas:

[0191]

[0192]

[0193]

[0194] The advantage is that these angular values ​​are highly insensitive to external interference fields.

[0195] Figure 7B The second mode of operation is shown. In this mode, a plurality of "individual signals" can be measured, namely: (h1a), (h3a), (h5a), (h7a), (h1b), (h3b), (h5b) and (h7b). From these "individual signals", four "second difference signals" and two "second sum signals" can be derived, namely:

[0196] Bxa_part = (h3a)-(h1a)

[0197] Bya_part=(h5a)-(h7a)

[0198] Bxb_part = (h3b) - (h1b)

[0199] Byb_part=(h5b)-(h7b)

[0200] Bza_part=(h1a)+(h3a)

[0201] Bzb_part=(h1b)+(h3b)

[0202] For example, in the simulation domain, using Figure 5D Similar to two interconnected circuits, or in the digital domain.

[0203] It is feasible to derive further signals from these “second difference signals” and “second sum signals”, for example, three “second magnetic field gradients” can be determined in the analog or digital domain according to one or more of the following formulas:

[0204] dBx / dx_part=Bxb_part-Bxa_part

[0205] dBy / dx_part=Byb_part-Bya_part

[0206] dBz / dx_part=Bzb_part-Bza_part,

[0207] And one or more "second angle values" may be derived from these "second gradient signals", preferably in the digital domain, for example using one or more of the following formulas:

[0208]

[0209]

[0210]

[0211] The advantage is that these angular values ​​are also highly insensitive to external interference fields.

[0212] With Figure 5A In a similar manner, a consistency check can then be performed by comparing the corresponding "combined signal" and the "individual signals", and / or by comparing the corresponding "first difference signal" and the "second difference signal" (representing the magnetic field components in the example of FIG. 7 ), and / or by comparing the corresponding magnetic field gradients, and / or by comparing the corresponding first angular values ​​and the second angular values.

[0213] If a consistency test is performed within the sensor device, a valid signal or an error signal (and, for example, also one or more of the combined signal, or signals derived from the combined signal (e.g., one or more component signals), and / or one or more gradient signals, and / or one or more angle values, preferably in digital form) is preferably output by the sensor device.

[0214] As mentioned above, it is also feasible to perform the consistency check externally to the sensor device, in which case the sensor device outputs the values ​​to be compared to an external processor (e.g., an ECU), for example via a high-speed bus (e.g., a LAN bus), to allow the external processor to perform the consistency check.

[0215] exist Fig. 7A and Figure 7B In a variation (not shown), each of the first sensor structure and the second sensor structure may include a horizontal Hall element surrounded by four vertical Hall elements, two vertical Hall elements having a maximum sensitivity axis oriented in the X direction and two vertical Hall elements having a maximum sensitivity axis oriented in the Y direction, for example, in a manner similar to Figure 4A and Figure 4B The same approach as shown, but with the addition of a horizontal Hall element in the center. Each of these sensor structures is able to measure three magnetic field components: Bx, By, Bz (although using different formulas), and calculate up to three magnetic field gradients, as well as up to three angles. Therefore, the same principles apply to this embodiment as well.

[0216] Fig. 8A and Figure 8B is with Fig. 7A and Figure 7B A similar schematic representation of circuit 800 also has two circular IMC disks, but only four horizontal Hall elements are present around the periphery of each IMC disk instead of eight. Fig. 8A shows a first mode of operation, and Figure 8B A second mode of operation is shown. Fig. 8A and Figure 8B The signals shown in Fig. 7A and Figure 7B , but the principle of operation is the same. Therefore, no further explanation is needed.

[0217] exist Fig. 8A and Figure 8B In a variation (not shown), each of the first sensor structure and the second sensor structure may include a horizontal Hall element located between two vertical Hall elements, each vertical Hall element having an axis of maximum sensitivity oriented in the X direction, for example, in a manner similar to Figure 3A and Figure 3B The same approach as shown, but with a horizontal Hall element added between the two. Each sensor structure is able to measure two magnetic field components: Bx, Bz (although using different formulas), and it is also possible to calculate up to two magnetic field gradients, from which the angle can be calculated. The same principles apply to this embodiment mutatis mutandis.

[0218] In a further variation (not shown), the two vertical Hall elements are not Figure 3A and Figure 3B The arrangement shown in is for measuring the Bx component, but the arrangement is for measuring the By component. In this case, each structure will be able to measure By and Bz, from which two magnetic field gradients dBy / dx and dBz / dx can be derived, and from which the angle can be derived. The same principle applies to this embodiment with necessary modifications.

[0219] Fig.9A and Fig. 9B is a schematic representation of a circuit that at first glance is similar to FIG. 1 in that it also has two IMC disks spaced apart by a distance Δx of approximately 1.0 mm to 3.0 mm or 1.5 mm to 2.5 mm, and there are also two horizontal Hall elements at the periphery of each IMC that are spaced apart by an angle of 180°, but the circuit operates differently.

[0220] Note that despite the relatively large distance between Hall elements H1a and H1b, they are "associated" in the sense described above, and note that Hall elements H2a and H2b are "associated", and that the first set of sensor elements set1 includes H1a, H2a, and the second set of sensor elements set2 includes H1b, H2b.

[0221] Fig.9A A first mode of operation is shown. In the first configuration mode (where the switch is closed), the Figure 4C The configurable interconnect circuit shown can measure the following combined signals: (h1a+h1b) and (h2a+h2b). It is shown that the difference of the combined signals, denoted as Bx_avg, can be considered as twice the measured magnetic field component Bx between the two IMC disks, and the sum of the combined signals, denoted as Bz_avg, can be considered as twice the measured magnetic field component Bz between the two IMC disks. The first angle It can be calculated as the inverse tangent of the ratio of the values ​​Bx_avg and Bz_avg.

[0222] Fig. 9B In the second configuration mode (where the switch is open), the switch is used, for example, Figure 4C The configurable interconnect circuit shown can measure the following individual signals: (h1a) and (h2a). It is shown that the difference of these individual signals, denoted Bx_part, corresponds to the magnetic field component Bx measured at IMC1, and the sum of these individual signals, denoted Bz_part, corresponds to the magnetic field component Bz measured at IMC1. As mentioned above, it is possible to measure the magnetic field component Bx measured at IMC1 in the analog domain (e.g., Figure 5C The difference and sum are generated in the digital domain (e.g., in a digital processor). It can be calculated as the inverse tangent of the ratio of the values ​​Bx_avg and Bz_avg.

[0223] The consistency check can be performed by comparing the corresponding "combined signal" and "individual signal", and / or by comparing the corresponding magnetic field components, and / or by comparing the first angle value and the second angle value The latter can be performed, for example, by testing whether , where ψ is a predefined value and ε is a predefined threshold (e.g. 5° or 2° or 1°). Note that the value of ψ may be different from 0° and may depend on the application (e.g. on the size of the magnet used in conjunction with the sensor device, or the pole pitch of the magnet), and may be determined during a calibration process and stored in a non-volatile memory and retrieved during normal operation. As mentioned above, it is also feasible to perform the consistency check outside the sensor device, in which case the value to be compared is output by the sensor device to an external processor. Of course, it is also feasible to perform the consistency check inside the sensor device as well as outside.

[0224] Fig.10 A flow chart of a method 1000 is shown, as may be performed by a sensor system according to an embodiment of the present invention. At the system level, it does not matter whether the consistency test is performed inside or outside the sensor device, and whether there is a second processor, as long as at least one consistency check is performed. The method 1000 comprises the following steps:

[0225] a) configuring (1002) interconnect circuitry of a sensor device as described above, for example the sensor device having a first set N (≥1) of magnetic sensor elements; and a second set of N magnetic sensors; and a configurable interconnect circuitry for selectively connecting or disconnecting each magnetic sensor element in the second set to or from an associated magnetic sensor element in the first set; and a processing circuitry for configuring the interconnect circuitry in a first mode, wherein each element of the first set is connected to an associated element of the second set to generate N combined signals, and measuring the N combined signals;

[0226] b) configuring (1003) the interconnect circuit in a second mode, wherein each element of the first set is disconnected from its associated element of the second set, and measuring N individual signals provided by the magnetic sensor elements of the first set;

[0227] c) Testing the consistency of the N combined signals and the N individual signals or signals derived therefrom (1004).

[0228] The method may comprise the additional step a) of providing (1001) a sensor device as described above.

[0229] As explained above, all steps of the method may be performed by the sensor device itself, or partially by the sensor device (e.g., steps a and b) and partially by a second device (e.g., an ECU) communicatively connected to the sensor device (e.g., the consistency check of step c). In this case, the sensor device will provide the second device with N combined signals and N individual signals and / or signals derived therefrom, such as a signal selected from the group consisting of: a first difference signal derived from the combined signal, a first sum signal derived from the individual signals, a first angle value derived from the combined signal or the first difference signal, a second angle value derived from the individual signals or the second difference signal,

[0230] In case the consistency check is performed by the sensor device itself as well as by the second device, a system with a high confidence level or a high degree of integrity can be built.Embodiments of the invention are particularly useful in robotic, industrial or automotive applications.

[0231] Many specific embodiments of the method are possible, depending not only on which combination is used (e.g., summing or averaging or weighted averaging), but also on which processor performs the consistency check (e.g., internal or external processor), and / or which sensor structure is implemented in the sensor device:

[0232] -exist FIG. 3A to FIG. 9B In all embodiments of the present invention, at least one combined signal and at least one individual signal are measured. The value may represent a magnetic field component;

[0233] - In some embodiments, at least two orthogonal magnetic field components (eg, Bx and By) are measured, and the angle can be calculated based on the ratio of these components.

[0234] - In some embodiments, at least one magnetic field component (eg Bx) is measured at two different locations, allowing calculation of at least one magnetic field gradient (eg dBx / dx).

[0235] - In some embodiments, two orthogonal magnetic field components or two orthogonal magnetic field gradients (eg dBx / dx and dBz / dx) are determined and the angle is calculated based on the ratio of these components or gradients.

[0236] The sensor device as described above can be used in various sensor systems, such as, for example, a linear Hall device (essentially only one or two Hall elements without IMC); a linear position sensor system, comprising a sensor device as described above and a magnetic structure with multiple alternating poles; or an angular position sensor system such as further comprising a permanent magnet, which can rotate relative to the sensor device and vice versa. The magnet can be an axial or radial bipolar ring magnet or a disk magnet, or an axially or radially magnetized ring or disk magnet with at least four poles, at least six poles, or at least eight poles. The sensor device can be located in an "on-axis" position or an "off-axis" position (i.e., at a non-zero radial distance from the rotation axis), or a "satellite position" (i.e., at a radial position greater than the outer radius of the magnet, and preferably at an axial position intermediate the bottom surface and the top surface). However, the present invention is not limited to position sensor devices and systems, but can also be used in other applications, such as, for example, current sensors with diagnostic capabilities, proximity sensors, etc.

[0237] Fig.11 A flow chart of a method 1100 that may be performed by a sensor device as described above is shown. The sensor device comprises a first set (set1) of N magnetic sensor elements, N being at least one; a second set (set2) of N magnetic sensor elements; a configurable interconnect circuit comprising at least one switch for selectively connecting elements of the second set (set2) to or disconnecting elements of the associated elements of the first set (set1); and a processing circuit for configuring the interconnect circuit. The method comprises the following steps:

[0238] a) configuring (1102) an interconnect circuit in a first mode, wherein each element of a first set (set1) is connected (e.g., in parallel or in series) to an associated element of a second set (set2) to generate N combined signals, and measuring these N combined signals;

[0239] b) configuring (1103) the interconnection circuit in a second mode, wherein each element of the first set (set1) is disconnected from an associated element of the second set (set2), and N individual signals from the N magnetic sensor elements of the first set (set1) are measured;

[0240] c1) performing a consistency test on the combined signal and the individual signals, and / or performing a consistency test on a first signal derived from the combined signal and a second signal derived from the individual signals; and providing a result of the consistency test as a validity signal; and outputting at least one of the combined signal, the individual signal, the first signal, and the second signal;

[0241] or

[0242] c2) outputting at least one of the combined signals and / or one of the first signals derived from the combined signals, and outputting at least one of the individual signals and / or one of the second signals derived from the individual signals to allow an external processor to perform a consistency check.

[0243] Can be targeted FIG. 3A to FIG. 9B Each specific embodiment shown in illustrative embodiments explains the method in more detail.

Claims

1. A method (1100) for measuring at least one magnetic quantity in a reliable manner using an integrated circuit, the integrated circuit comprising: a first set (set1) of N magnetic sensor elements, N being at least one; a second set (set2) of N magnetic sensor elements; Configurable interconnect circuit (399; 499; 599; 598), said interconnection circuit (399; 499; 599； 598) is adapted to selectively connect or disconnect elements of the second set (set2) to or from associated elements of the first set (set1); as well as processing circuitry (393), the processing circuitry (393) configured to configure the interconnection circuitry; The method comprises the following steps: a) configuring the interconnection circuit in a first mode, wherein each element of the first set (set1) is connected to an associated element of the second set (set2) for generating N combined signals, and measuring these N combined signals; b) configuring the interconnection circuit in a second mode, wherein each element of the first set (set1) is disconnected from an associated element of the second set (set2) and measuring N individual signals from the N magnetic sensor elements of the first set (set1); c) performing a consistency test based on a comparison of the combined signal with the individual signals, and / or performing a consistency test based on a comparison of a first signal derived from the combined signal with a second signal derived from the individual signal; and providing a result of the consistency test as a validity signal; and outputting at least one signal selected from the group consisting of the combined signal, the individual signal, the first signal and the second signal.

2. The method according to claim 1, wherein: Step c) includes one of the following options: i) outputting the N combined signals, and performing a consistency test based on a comparison of the N combined signals with the N individual signals, and providing a result of the consistency test as a validity signal; ii) determining at least one first signal derived from the N combined signals, and determining at least one second signal derived from the N individual signals; and performing a consistency test based on a comparison of the N combined signals with the N individual signals, and / or performing a consistency test based on a comparison of the at least one first signal with the at least one second signal, and / or performing a consistency test based on a comparison of at least one further first signal derived from the first signal with at least one further second signal derived from the second signal; providing a result of the consistency test as a validity signal; and outputting at least one signal selected from the group consisting of the N combined signals, the N individual signals, the at least one first signal, the at least one second signal, the at least one further first signal and the at least one further second signal.

3. The method according to claim 1 or 2, in, The first set of N magnetic sensor elements and the second set of N magnetic sensor elements form N sensor pairs; wherein N is at least one, and step a) comprises: measuring an average of a signal (sA) obtained from an element of the first set and a signal (sB) obtained from an associated element of the second set, and step b) comprises: measuring a signal (sA) from an element of the first set, and step c) comprises: testing whether a combined signal of a sensor pair is substantially equal to the individual signals of the sensor pair; and / or wherein N is at least one, and step a) comprises: measuring the sum of a signal (sA) obtained from an element of said first set and a signal (sB) obtained from an associated element of said second set, and step c) comprises: testing whether the combined signal of the sensor pair is substantially equal to twice the individual signals of the sensor pair; and / or wherein N is at least one, and step a) comprises: measuring the difference between a signal (sA) obtained from an element of said first set and a signal (sB) obtained from an associated element of said second set, and step c) comprises: testing whether the combined signal of the sensor pair is substantially equal to twice the individual signals of the sensor pair; And / or wherein N is at least two, and the method further comprises: determining a first signal derived from a combined signal obtained from at least two sensor pairs, and a second signal derived from individual signals obtained from the at least two sensor pairs, and wherein step c) comprises: testing whether the first signal is substantially equal to the second signal, or whether the first signal is approximately twice the second signal.

4. The method according to claim 3, wherein: The first signal includes a first magnetic field component (Bx_full) or a first magnetic field gradient (dBx / dx_full) or a first angle (φfull).

5. The method according to claim 3, wherein: The second signal includes a second magnetic field component (Bx_part) or a second magnetic field gradient (dBx / dx_part) or a second angle (φpart).

6. The method according to claim 1 or 2, in, The interconnection circuit comprises N switches (SW), each switch being adapted for selectively connecting the magnetic sensor elements of the first set (set1) in parallel or in series with an associated magnetic sensor element of the second set (set2).

7. The method according to claim 6, in, The first set of N magnetic sensor elements and the second set of N magnetic sensor elements form N sensor pairs; And wherein the processing circuit is configured to periodically perform only two measurements, the two measurements comprising a first measurement in which the signals from the sensors in each sensor pair are combined in step a) by operating the switch in the first mode and comprising a second measurement in which the individual signals from only one sensor in each sensor pair are measured in step b) by operating the switch in the second mode.

8. The method according to claim 1 or 2, Further including: determining at least one first difference signal (Bx_full, By_full) by subtracting the two combined signals, and determining at least one second difference signal (Bx_part, By_part) by subtracting the two individual signals; And wherein step c) comprises: testing the consistency of the at least one first difference signal (Bx_full) and the at least one second difference signal (Bx_part).

9. The method according to claim 1 or 2, Further including: determining at least one first sum signal (Bz_full) by adding the two combined signals, and determining at least one second sum signal (Bz_part) by adding the two individual signals; And wherein step c) comprises: testing the consistency of the at least one first sum signal (Bz_full) and the at least one second sum signal (Bz_part).

10. The method according to claim 1 or 2, Further including: determining at least one first difference signal (Bx_full, By_full) by subtracting the two combined signals, and determining at least one second difference signal (Bx_part, By_part) by subtracting the two individual signals, and calculating a first angle value based on the ratio of the two first difference signals and calculating a second angle value based on the ratio of the two second difference signals And wherein step c) comprises: testing the first angle value and the second angle value consistency.

11. The method according to claim 1 or 2, Further including: determining at least one first difference signal (Bx_full) by subtracting the two combined signals, and determining at least one second difference signal (Bx_part) by subtracting the two individual signals, and determining at least one first sum signal (Bz_full) by adding or averaging the two combined signals and at least one second sum signal (Bz_part) by adding or averaging the two individual signals, and calculating a first angle value based on a ratio of the first difference signal to the first sum signal and calculating a second angle value based on a ratio of the second difference signal to the second sum signal And wherein step c) comprises: testing the first angle value and the second angle value consistency.

12. The method according to claim 1 or 2, Further including: determining at least one first difference signal (Bxa_full, Bya_full) by subtracting two combined signals and determining at least one second difference signal (Bxa_part, Bya_part) by subtracting two individual signals and / or determining at least one first sum signal (Bz_full) by adding or averaging two combined signals and determining at least one second sum signal (Bz_part) by adding or averaging two individual signals, and determining at least one third difference signal (dBx / dx_full, dBy / dx_full) by subtracting the two first difference signals or by subtracting the two first sum signals, and determining at least one fourth difference signal (dBx / dx_part, dBy / dx_part) by subtracting the two second difference signals or by subtracting the two second sum signals; And wherein step c) comprises: testing the consistency of the at least one third difference signal (dBx / dx_full; dBz / dx_full) and the at least one fourth difference signal (dBx / dx_part; dBz / dx_part).

13. The method according to claim 1 or 2, Further including: determining at least one first difference signal (Bxa_full, Bya_full) by subtracting two combined signals and determining at least one second difference signal (Bxa_part, Bya_part) by subtracting two individual signals and / or determining at least one first sum signal (Bz_full) by adding or averaging two combined signals and determining at least one second sum signal (Bz_part) by adding or averaging two individual signals, and determining at least one third difference signal (dBx / dx_full, dBy / dx_full) by subtracting the two first difference signals or by subtracting the two first sum signals, and determining at least one fourth difference signal (dBx / dx_part, dBy / dx_part) by subtracting the two second difference signals or by subtracting the two second sum signals; and calculating a first angle value based on the ratio of the two third difference signals and calculating a second angle value based on the ratio of the two fourth difference signals And wherein step c) comprises: testing the first angle value and the second angle value consistency.

14. A method of determining a linear or angular position of a sensor device and detecting errors, the sensor device being movable relative to a magnetic source, or the magnetic source being movable relative to the sensor device, the method comprising: a) Determine at least one angle value and detecting errors using a method according to any one of claims 6 to 13; and b) Converting the angle value into a linear position or an angular position.

15. A sensor device, the sensor device comprising an integrated circuit, the integrated circuit comprising: a first set of N magnetic sensor elements, N being an integer value of at least 1; a second set of N magnetic sensor elements; Configurable interconnect circuitry for selectively connecting each element of the second set (set2) to or disconnecting each element of the first set (set1) from an associated element of the first set (set1) A processing circuit configured to perform the method according to any one of claims 1 to 14.

16. The sensor device according to claim 15, in, each of said first set of N magnetic sensor elements and said second set of N magnetic sensor elements comprises a vertical Hall element; or wherein each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises two perpendicular Hall elements, the two perpendicular Hall elements being oriented in orthogonal directions; or wherein each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises four horizontal Hall elements, the four horizontal Hall elements being arranged near the periphery of a circular integrated magnetic concentrator (IMC), wherein the Hall elements of the first set (set1) are spaced at multiples of 90°, and wherein the Hall elements of the second set (set2) are spaced at multiples of 90°, and wherein the Hall elements of the second set (set2) are positioned at a distance of less than 80 μm relative to the associated Hall elements of the first set; or wherein each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises four horizontal Hall elements arranged near a periphery of a first circular integrated magnetic concentrator and four horizontal Hall elements arranged near a periphery of a second circular integrated magnetic concentrator; or wherein each of the first set of N magnetic sensor elements and the second set of N magnetic sensor elements comprises two horizontal Hall elements arranged near a periphery of a first circular integrated magnetic concentrator and two horizontal Hall elements arranged near a periphery of a second circular integrated magnetic concentrator; Or wherein the first set of N magnetic sensor elements includes two horizontal Hall elements arranged near the periphery of the first integrated magnetic concentrator (IMC1) and spaced 180° apart, and the second set of N magnetic sensor elements includes two horizontal Hall elements arranged near the periphery of the second integrated magnetic concentrator (IMC2) and spaced 180° apart.

17. The sensor device according to claim 15 or 16, in, The sensor device is a linear Hall device configured to measure a magnetic field component; or wherein the sensor device is a current sensor device configured to measure a current flowing through a conductor; or wherein the sensor device is a proximity sensor device configured to detect the presence or absence of a target within a predefined range; or wherein the sensor device is an angular position sensor device configured to provide an angular position of the sensor device relative to a magnetic source; Or wherein the sensor device is a linear position sensor device configured to provide a linear position of the sensor device relative to a magnetic structure having a plurality of alternating poles.

18. A magnetic sensor system comprising: The sensor device according to any one of claims 15 to 17, and a second processor (ECU) communicatively connected to the sensor device and configured to receive at least some of the signals output by the sensor device. The magnetic sensor system of claim 18 , further comprising a magnetic source.

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