A device for eliminating the winding expansion and winding plating of solar cells

Abstract

The present invention provides a device for eliminating the expansion and plating of solar cells, belonging to the technical field of semiconductor devices. The present invention provides a device for eliminating the expansion and plating of solar cells, comprising a wafer boat and a deposition furnace, wherein the wafer boat comprises a boat body, and a plurality of groups of slots are arranged on the boat body, and the width of the slots is greater than the thickness of the silicon wafer; the deposition furnace comprises a furnace tube body, a rotating assembly and a driving member, and the rotating assembly comprises a rotating shaft and a bottom bracket for supporting and fixing the boat body, the rotating shaft is rotatably connected with the furnace tube body, the rotating shaft passes through the bottom of the furnace tube body in a vertical direction, the bottom bracket is arranged on the top of the rotating shaft, and the driving member drives the rotating shaft to rotate. The present invention provides a device for eliminating the expansion and plating of solar cells, wherein the silicon wafer is inserted into the slot, the back of the silicon wafer is pressed against the boat wall on the side of the slot away from the center of the boat body, the wafer boat is arranged on the bottom bracket, the rotating shaft rotates, and the silicon wafer is pressed against the boat wall by centrifugal force to avoid the occurrence of expansion or plating, thereby improving production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to a device for eliminating wrap-around expansion and wrap-around plating of solar cells. Background Art

[0002] Monocrystalline silicon solar cells are a common semiconductor device. Due to their high conversion efficiency and stable power generation, they have gradually become the mainstream product in the current photovoltaic industry. The preparation process of N-type solar cells generally includes: texturing-boron diffusion-etching-LPCVD / PVD-ALD-PECVD-printing sintering and other processes. During the production process of solar cells, the silicon wafer needs to be diffused and doped to form a PN junction, and a layer of aluminum oxide passivation layer is also made on the positive surface to enhance the passivation effect and improve the battery efficiency.

[0003] Boron diffusion is a key step in preparing PN junctions. In the process of preparing PN junctions by boron diffusion, for P-type silicon wafers, phosphorus oxychloride needs to be introduced into the diffusion furnace to cause a substitution reaction on the surface of the silicon wafer to form a phosphorus-doped layer, i.e., an N-type junction; for N-type silicon wafers, boron trichloride needs to be introduced into the diffusion furnace to cause a substitution reaction on the surface of the silicon wafer to form a boron-doped layer, i.e., a P-type junction. When making a P-type junction or an N-type junction, only a substitution reaction needs to occur on the front side of the silicon wafer to complete the diffusion. No substitution reaction needs to occur on the back side of the silicon wafer. Therefore, a certain shielding method needs to be used to cover the back side where no substitution reaction is required to protect the back side from diffusion. The commonly used protection method mainly uses the method of placing two silicon wafers back to back and inserting them into the slot of the wafer carrier, that is, using one silicon wafer as a protective layer for another silicon wafer that is pressed against each other, thereby protecting the back sides of the two silicon wafers that are bonded together. However, this protection method is not strong. The bonding between the silicon wafers is natural, and no external force is applied to press them tightly. The bonding strength is not tight, but the diffusion process needs to be carried out under negative pressure conditions. When air flows in, under the influence of the gas and the negative pressure environment, a certain gap will be separated between the two silicon wafers, causing airflow to enter the gap, resulting in deposition and diffusion on the back of the silicon wafer, forming a doping layer, and causing the circumference expansion phenomenon.

[0004] The ALD process is the main process for preparing the aluminum oxide passivation layer. The gas passed into the furnace tube of the ALD furnace is trimethylaluminum, which reacts on the surface of the silicon wafer to form aluminum oxide deposition. The ALD process needs to be carried out in a furnace tube under negative pressure conditions, and only the front of the silicon wafer needs to be prepared, not the back of the silicon wafer. Therefore, the same shielding method as boron diffusion is generally used, that is, two silicon wafers are placed back to back, naturally fit, and no external force is applied for tight compression. The strength of the fit is not tight, and the two silicon wafers are inserted into the slot of the wafer carrier boat for reaction. Similarly, under the influence of airflow and negative pressure environment, the two silicon wafers will be separated by a certain gap, causing airflow to enter the gap, forming a deposition layer on the back of the silicon wafer, and the phenomenon of wrap-around plating occurs.

[0005] After the wrap-around expansion and wrap-around plating phenomena occur, a subsequent cleaning process is required to use hydrofluoric acid and nitric acid to remove the wrap-around expansion and wrap-around plating, which increases the production cost, increases the complexity of the process, and restricts the development of product technology. Summary of the invention

[0006] The purpose of the present invention is to provide a device for eliminating the wrapping and plating of solar cells, aiming to solve the problem of low reaction rate of hydrofluoric acid and borosilicate glass in the etching process.

[0007] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a device for eliminating the wrapping and plating of solar cells, comprising: a wafer boat, the wafer boat is used to hold silicon wafers, the wafer boat comprises a boat body, the boat body is provided with a wafer insertion slot group, the wafer insertion slot group comprises a plurality of wafer insertion slots suitable for inserting silicon wafers, the wafer insertion slots are arranged parallel to the axis of the boat body, and the width of the wafer insertion slots is greater than the thickness of the silicon wafer; and

[0008] A deposition furnace for loading the wafer boat, the deposition furnace comprising a furnace tube body, a rotating assembly and a driving member, a reaction chamber is arranged inside the furnace tube body, an air inlet is arranged at the bottom of the furnace tube body, and an air outlet is arranged at the top of the furnace tube body, the rotating assembly comprises a rotating shaft and a base support, the rotating shaft is rotatably connected to the furnace tube body, the rotating shaft passes through the bottom of the furnace tube body in a vertical direction and extends to the inside of the reaction chamber, the base support is fixedly installed on the top of the rotating shaft, the base support is used to support and fix the boat body, and the driving member is used to drive the rotating shaft to rotate.

[0009] In a possible implementation, a magnetic fluid seal for sealing is provided between the base and the furnace tube body.

[0010] In a possible implementation, narrow side supports are provided on two groups of opposite narrow side inner walls of the wafer inserting slot, and the narrow side supports are used to support the silicon wafer.

[0011] In a possible implementation, an air guide portion is provided on the base, and the air guide portion is used to conduct gas to the boat body.

[0012] In a possible implementation, the air guide portion includes a plurality of groups of air guide holes, and the air guide holes vertically penetrate the base.

[0013] In a possible implementation, the air guide holes are arranged in a one-to-one correspondence with the insert slots.

[0014] In a possible implementation, a positioning pin and a positioning groove are respectively provided on the top surface and the bottom surface of the boat body, the positioning pin and the positioning groove correspond to each other one by one, and the positioning pin and the positioning groove have the same shape and size.

[0015] In a possible implementation, a fixing pin is provided on the upper end surface of the base, and the fixing pin is installed in cooperation with the positioning groove.

[0016] In a possible implementation, the plurality of insert slot groups are evenly distributed along the circumference of the boat body.

[0017] In a possible implementation, the driving member is a motor, and the motor is fixedly mounted on the bottom of the furnace tube body.

[0018] The beneficial effects of the device for eliminating the wrapping and plating of solar cells provided by the present invention are:

[0019] Compared with the prior art, the present invention comprises a wafer boat and a deposition furnace. The wafer boat comprises a boat body, the boat body is used for carrying silicon wafers, the boat body is placed in the deposition furnace for performing a boron diffusion process or an ALD process on the silicon wafers, a plurality of wafer slot groups are arranged on the boat body, the plurality of wafer slot groups are distributed in a circumference on the boat body, the wafer slot groups are distributed around the central circumference of the boat body, the wafer slot groups comprise a plurality of wafer slots, the width of the wafer slots is greater than the thickness of the silicon wafers, and the wafer slots in the same wafer slot group are arranged parallel to each other; the deposition furnace comprises a furnace tube body, a rotating assembly and a driving part, a reaction chamber for loading the boat body is arranged inside the furnace tube body, an air inlet for discharging reaction gas is arranged at the bottom of the furnace tube body, an air outlet suitable for discharging final reaction gas is arranged at the top of the furnace tube body, the rotating assembly is arranged at the bottom of the furnace tube body, the rotating assembly comprises a bottom support and a rotating shaft, the bottom support is arranged at the rotating shaft At the upper end, a rotating shaft is arranged through the furnace bottom, a bottom support is arranged in the reaction chamber, a silicon wafer is inserted into the wafer slot of the wafer carrier boat, and the back side of the silicon wafer is arranged on the boat wall away from the center of the wafer carrier boat. The silicon wafer is inserted into the wafer slot, and the back side of the silicon wafer is pressed against the boat wall on the side of the wafer slot away from the center of the boat body, and the boat body is arranged on the center of the bottom support. The driving part rotates the rotating shaft, and the rotating shaft drives the bottom support and the boat body to rotate, and the centrifugal force is used instead of the natural adsorption force to greatly increase the adhesion between the silicon wafer and the boat wall of the wafer carrier boat. Under the action of centrifugal force, the silicon wafer is tightly attached to the boat wall of the wafer carrier boat, and there is a gap between the front side of the silicon wafer and the boat wall on the side of the wafer slot close to the center of the boat body. The front side of the silicon wafer reacts with the airflow, and the back side of the silicon wafer will not contact with the airflow, thereby avoiding the occurrence of wrapping or wrapping plating, and increasing the carrying capacity of the silicon wafer, increasing the production capacity, and eliminating the need to use hydrofluoric acid or nitric acid to remove wrapping and wrapping plating, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 Schematic diagram of the structure of the wafer boat used in the embodiment of the present invention Figure 1 ;

[0022] Figure 2 Schematic diagram of the structure of the wafer boat used in the embodiment of the present invention Figure 1 ;

[0023] Figure 3 for Figure 1 A schematic diagram of a top view structure;

[0024] Figure 4 Schematic diagram of a combination of multiple wafer boats used in an embodiment of the present invention

[0025] Figure 5 A schematic diagram of the internal structure of a deposition furnace used in an embodiment of the present invention;

[0026] Figure 6 The structure of the rotating assembly used in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0027] Figure 7 The structure of the rotating assembly used in the embodiment of the present invention is shown in FIG. Figure 2 .

[0028] In the figure: 1. furnace bottom; 2. furnace wall; 3. furnace top cover; 4. air inlet; 5. air outlet; 6. bottom support; 7. rotating shaft; 8. magnetic fluid seal; 9. motor; 10. air guide hole; 11. fixing pin; 21. boat body; 22. insert slot; 23. narrow side support; 24. positioning pin; 25. positioning slot. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] Please refer to Figures 1 to 7 , a specific embodiment of a device for eliminating the winding expansion and winding plating of solar cells provided by the present invention is now described, including: a wafer boat and a deposition furnace, the wafer boat is used to hold silicon wafers, the wafer boat includes a boat body 21, and a wafer insertion slot group is arranged on the boat body 21, the wafer insertion slot group includes a plurality of wafer insertion slots 22 suitable for inserting silicon wafers, the wafer insertion slots 22 are arranged parallel to the axis of the boat body 21, and the width of the wafer insertion slots 22 is greater than the thickness of the silicon wafer; the deposition furnace is used to load the wafer boat, the deposition furnace includes a furnace tube body, a rotating assembly and a driving member, a reaction chamber is arranged inside the furnace tube body, an air inlet 4 is arranged at the bottom of the furnace tube body, and an air outlet 5 is arranged at the top of the furnace tube body, the rotating assembly includes a rotating shaft 7 and a bottom bracket 6, the rotating shaft 7 is rotatably connected to the furnace tube body, the rotating shaft 7 passes through the bottom of the furnace tube body in a vertical direction and extends to the inside of the reaction chamber, the bottom bracket 6 is fixedly installed on the top of the rotating shaft 7, the bottom bracket 6 is used to support and fix the boat body 21, and the driving member is used to drive the rotating shaft 7 to rotate.

[0031] The present invention provides a device for eliminating the winding expansion and winding plating of solar cells. Compared with the prior art, the device comprises a wafer boat and a deposition furnace. The wafer boat comprises a boat body 21. The boat body 21 is used to carry silicon wafers. The boat body 21 is placed in the deposition furnace for performing a boron diffusion process or an ALD process on the silicon wafers. A plurality of groups of insert slot groups are arranged on the boat body 21. The plurality of groups of insert slot groups are distributed in a circumference on the boat body 21. The insert slot groups are distributed around the central circumference of the boat body 21. The insert slot groups comprise a plurality of groups of insert slots 22. The width of the insert slots 22 is greater than the thickness of the silicon wafer. The insert slots 22 in the same group of insert slot groups are arranged parallel to each other. The deposition furnace comprises a furnace tube body, a rotating assembly and a driving part. A reaction chamber for loading the boat body 21 is arranged inside the furnace tube body. An air inlet 4 for discharging reaction gas is arranged at the bottom of the furnace tube body. An air outlet 5 suitable for discharging the final reaction gas is arranged at the top of the furnace tube body. The rotating assembly is arranged at the bottom of the furnace tube body. The rotating assembly comprises a bottom support 6 and a rotating shaft 7. The bottom bracket 6 is arranged at the upper end of the rotating shaft 7, the rotating shaft 7 is arranged through the furnace bottom 1, the bottom bracket 6 is arranged in the reaction chamber, the silicon wafer is inserted into the inserting slot 22 of the boat body 21, the back of the silicon wafer is arranged on the boat wall away from the center of the boat body 21, the silicon wafer is inserted into the inserting slot 22, the back of the silicon wafer is close to the boat wall on the side of the inserting slot 22 away from the center of the boat body 21, the boat body 21 is arranged on the center of the bottom bracket 6, the driving part rotates the rotating shaft 7, the rotating shaft 7 drives the bottom bracket 6 and the boat body 21 to rotate, and the centrifugal force is used to replace Instead of natural adsorption force, the adhesion between the silicon wafer and the wall of the boat body 21 is greatly increased. The silicon wafer is tightly attached to the wall of the boat body 21 under the action of centrifugal force. There is a gap between the front of the silicon wafer and the boat wall on the side of the insert slot 22 close to the center of the boat body 21. The front of the silicon wafer reacts with the airflow, and the back of the silicon wafer will not contact the airflow, avoiding the occurrence of wrapping or wrapping plating, and increasing the carrying capacity of the silicon wafer, increasing production capacity, and eliminating the need to use hydrofluoric acid or nitric acid to remove wrapping and wrapping plating, thereby improving production efficiency.

[0032] For details, please refer to Figures 1 to 7, including a wafer carrier boat and a deposition furnace, the wafer carrier boat including a boat body 21 for carrying silicon wafers, a plurality of wafer slot groups are arranged on the boat body 21, the wafer slot groups include a plurality of wafer slots 22, silicon wafers are inserted into the wafer slots 22, the plurality of wafer slot groups are distributed in a circle on the boat body 21, the center of the circle of the wafer slot groups coincides with the vertical axis of the boat body 21, the wafer slots 22 vertically penetrate the boat body 21, the wafer slots 22 of the same wafer slot group are parallel to each other and arranged in a row, the wafer slot groups are arranged on a symmetry axis passing through the center of the upper end face of the boat body 21, the back side of the silicon wafer is pressed against the boat wall on the side of the wafer slots 22 away from the center of the boat body 21, the boat body 21 is rotated, and under the action of centrifugal force, the silicon wafer The back of the wafer is tightly attached to the boat wall of the boat body 21 to avoid a gap between the back of the silicon wafer and the boat wall of the boat body 21. The back of the silicon wafer will not contact the airflow to avoid the occurrence of winding or plating. There are multiple groups of wafer slots 22. Multiple groups of boat bodies 21 can be stacked in sequence and placed in a diffusion furnace or a tube furnace together, which increases the carrying capacity of the silicon wafer and the production capacity. There is no need to use hydrofluoric acid or nitric acid to remove winding and plating, thereby improving production efficiency. The deposition furnace includes a furnace tube body, a rotating component and a driving part. The furnace tube body is vertically arranged. The furnace tube body includes a furnace top head 3, a furnace wall 2 and a furnace bottom 1 arranged in sequence from top to bottom. The furnace tube body is provided with a rotating component to accommodate the rotating component. The furnace bottom 1 is provided with an air inlet 4 suitable for the discharge of the reaction gas, and the furnace top cover 3 is provided with an air outlet 5 suitable for the discharge of the final reaction gas. The rotating assembly includes a base 6 and a rotating shaft 7. The rotating shaft 7 is arranged at the center of the lower end surface of the base 6. The base 6 is located in the reaction chamber. The lower end of the rotating shaft 7 away from the base 6 penetrates the furnace bottom 1, and the lower end of the rotating shaft 7 away from the base 6 is located outside the furnace tube body. The silicon wafer is inserted into the insert slot 22 of the boat body 21, and the back of the silicon wafer is attached to the boat wall away from the insert slot 22 away from the center of the boat body 21. The boat body 21 is arranged on the base 6, and the center of the boat body 21 coincides with the center of the base 6. The driving member rotates the rotating shaft 7. The shaft 7 drives the bottom bracket 6 to rotate, and the boat body 21 rotates with the bottom bracket 6. The silicon wafer is subjected to the centrifugal force in the wafer insertion slot 22, which greatly increases the adhesion between the silicon wafer and the boat wall. The silicon wafer is tightly attached to the boat wall under the action of centrifugal force, avoiding the formation of gaps between the back side of the silicon wafer and the boat wall. The back side of the silicon wafer will not contact the airflow, avoiding the occurrence of wrapping or wrapping plating. There is no need to use hydrofluoric acid or nitric acid to remove wrapping and wrapping plating, thereby improving production efficiency. Multiple groups of boat bodies 21 are stacked on the bottom bracket 6 in sequence, and more boat bodies 21 can be accommodated in the reaction chamber, thereby increasing production capacity. The deposition furnace used in the boron diffusion process is a diffusion furnace, and the deposition furnace used in the ALD process is an ALD furnace.

[0033] Furthermore, the rotation speed of the boat body 21 can be adjusted by the motor 9. The rotation speed should ensure the adhesion of the silicon wafer to the boat wall under the action of centrifugal force. The higher the rotation speed, the greater the centrifugal force and the tighter the adhesion. However, too high a rotation speed will cause greater disturbance to the airflow source.

[0034] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figure 5 A magnetic fluid seal 8 for sealing is provided between the base 6 and the furnace tube body.

[0035] For details, please refer to Figure 5 The inner diameter of the bottom bracket 6 matches the inner diameter of the furnace tube body, and a magnetic fluid seal 8 is arranged between the bottom bracket 6 and the furnace tube body to further enhance the sealing effect between the bottom bracket 6 and the furnace tube body, thereby preventing the reaction gas from diffusing from the gap between the bottom bracket 6 and the furnace tube body, thereby causing waste of the reaction gas.

[0036] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 1 to 4 Narrow side supports 23 are provided on two groups of opposite narrow side inner walls of the wafer inserting slot 22, and the narrow side supports 23 are used to support the silicon wafer.

[0037] For details, please refer to Figures 1 to 4 A narrow side support 23 is provided on the inner wall of the wafer slot 22. The narrow side support 23 is relatively arranged on the inner wall of the narrow side of the wafer slot 22. Two groups of narrow side supports 23 are relatively arranged. The silicon wafer is inserted into the wafer slot 22. The two groups of narrow side supports 23 limit the side edges of the silicon wafer to prevent the silicon wafer from falling off from the wafer slot 22 during operation. The narrow side support 23 is a hemispherical column. The hemispherical column is protruded toward the inner cavity of the wafer slot 22. The hemispherical column uses the arc side wall to limit the side edge of the silicon wafer, restricts the silicon wafer in the wafer slot 22, and prevents the silicon wafer from falling off from the wafer slot 22 during operation.

[0038] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 5 to 7 The bottom support 6 is provided with an air guide portion, which is used to conduct gas to the boat body 21.

[0039] For details, please refer to Figures 5 to 7 The bottom support 6 is provided with a gas guide portion for conducting the reaction gas to the boat 21. A plurality of gas guide portions are distributed in a circle with the center of the bottom support 6 as the center, and the gas guide portions are evenly distributed along the same circle. The gas is evenly guided to the boat 21, and the silicon wafers in all directions of the boat 21 react synchronously, thereby improving the efficiency of the replacement reaction.

[0040] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 5 to 7 The air guide portion includes a plurality of air guide holes 10 , and the air guide holes 10 vertically penetrate the bottom bracket 6 .

[0041] For details, please refer to Figures 5 to 7The air guide portion includes a plurality of air guide holes 10 vertically penetrating the bottom support 6. The reaction gas discharged from the air inlet 4 of the furnace bottom 1 enters the wafer inserting slot 22 of the boat body 21 through the air guide holes 10, and undergoes a replacement reaction with the front side of the silicon wafer, thereby improving the replacement reaction efficiency. The air guide holes 10 are rectangular holes. The air guide holes 10 of the same air guide portion are arranged in a row. The air guide holes 10 of the same air guide portion are arranged parallel to each other, which is beneficial to increasing the number of the air guide holes 10. The center lines of the air guide holes 10 of the same air guide portion coincide with each other, and coincide with the diameter of the bottom support 6, which is beneficial to increasing the number of the air guide holes 10 and improving the replacement reaction efficiency.

[0042] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 1 to 7 The air guide holes 10 and the insert slots 22 are arranged in a one-to-one correspondence.

[0043] For details, please refer to Figures 1 to 7 The gas guide holes 10 are arranged in one-to-one correspondence with the insert slots 22 , and the gas guide holes 10 guide the reaction gas into the insert slots 22 to improve the replacement reaction efficiency.

[0044] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 1 to 4 The top surface and the bottom surface of the boat body 21 are respectively provided with positioning pins 24 and positioning grooves 25, the positioning pins 24 and the positioning grooves 25 correspond to each other one by one, and the positioning pins 24 and the positioning grooves 25 have the same shape and size.

[0045] For details, please refer to Figures 1 to 4 The boat body 21 is provided with a positioning pin 24 and a positioning groove 25 for connecting with other boat bodies 21. The positioning pin 24 is arranged on the upper end surface of the boat body 21, and the positioning groove 25 is arranged on the lower end surface of the boat body 21. The positioning pin 24 on the upper end surface of one boat body 21 corresponds to the positioning groove 25 on the lower end surface of the boat body 21. The axis of the positioning pin 24 coincides with the axis of the positioning groove 25, which is convenient for assembling the boat body 21. The positioning pin 24 on the upper end surface of one boat body 21 is inserted into the lower end surface of another boat body 21. The two boat bodies 21 are combined together with the help of the positioning pins 24 and the positioning slots 25. The positioning pins 24 are arranged between two adjacent groups of inserting slots, and the positioning slots 25 are arranged between two adjacent groups of inserting slots to avoid the arrangement of the positioning pins 24 and the positioning slots 25 affecting the insertion of the silicon wafer. The positioning pins 24 are evenly distributed in a circle with the center of the upper end surface of the boat body 21 as the center, and the positioning slots 25 are evenly distributed in a circle with the center of the lower end surface of the boat body 21 as the center, so as to facilitate the assembly of the boat body 21.

[0046] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 1 to 7A fixing pin 11 is provided on the upper end surface of the bottom bracket 6 , and the fixing pin 11 is installed in cooperation with the positioning groove 25 .

[0047] For details, please refer to Figures 1 to 7 A fixing pin 11 for fixing the boat body 21 is provided on the upper end surface of the bottom bracket 6. The fixing pin 11 is vertically arranged on the bottom bracket 6 and inserted into the positioning groove 25 on the lower end surface of the boat body 21 to increase the stability of the fixing of the boat body 21 and prevent the boat body 21 from falling off during the reaction process.

[0048] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figures 1 to 4 The plurality of insert slot groups are evenly distributed along the circumference of the boat body 21 .

[0049] For details, please refer to Figures 1 to 4 The boat body 21 is a regular hexagonal prism, and the horizontal cross section of the boat body 21 is a regular hexagon. Compared with a regular quadrilateral, more silicon wafers can be stored. Compared with a circle, the positioning pin 24 is easy to insert into the positioning groove 25, which is convenient for the assembly of the boat body 21. There are six groups of insert slot groups, which are evenly distributed on the boat body 21 in the circumferential direction with the axis of the boat body 21 as the center. The insert slots 22 of each insert slot group are parallel to one of the side walls of the adjacent boat body 21, and the angle between the midlines of adjacent insert slot groups is 60°. There are six groups of insert slot groups, which is an even number. The boat body 21 is subjected to balanced force during rotation. Compared with the four groups of insert slot groups, when the outer diameter of the boat body 21 is consistent, the distance between adjacent insert slot groups in the six groups of insert slot groups is smaller, and more silicon wafers can be carried. Compared with the eight groups of insert slot groups, the distance between the insert slot 22 closest to the axis of the boat body 21 in the six groups of insert slot groups and the axis of the boat body 21 is smaller. When the outer diameter of the boat body 21 is consistent, the six groups of insert slot groups can carry more silicon wafers.

[0050] For further information, please refer to Figures 1 to 4 The center line of the wafer slot group coincides with the axis of the upper end surface of the boat body 21, so that the silicon wafers are subjected to more uniform force during the rotation of the boat body 21.

[0051] For further information, please refer to Figures 1 to 4 There are 6 groups of positioning pins 24 and 6 groups of positioning grooves 25. The positioning pins 24 are arranged between two adjacent groups of insert slots and on the axis of the upper end surface of the boat body 21. The positioning grooves 25 are arranged between two adjacent groups of insert slots and on the axis of the lower end surface of the boat body 21, so as to facilitate the combination of the two groups of boat bodies 21.

[0052] For further information, please refer to Figures 1 to 7 The maximum outer diameter of the boat body 21 should not exceed 95% of the maximum inner diameter of the furnace tube body.

[0053] For further information, please refer to Figures 1 to 7The height of the boat body 21 is 1 to 1.05 times the length of the silicon wafer, and the silicon wafer can be completely inserted into the boat body 21; the length between the two narrow side inner walls of the inserting slot 22 (excluding the narrow side support 23) is 1 to 1.05 times the width of the silicon wafer, ensuring the margin for inserting the silicon wafer and avoiding damage to the silicon wafer during the insertion process; the width of the inserting slot 22 is 10 to 15 times the thickness of the silicon wafer, ensuring the margin for inserting the silicon wafer.

[0054] For details, please refer to Figures 1 to 7 The inner diameter of the furnace tube of the current mainstream diffusion furnace or ALD furnace is 480mm, that is, the maximum outer diameter of the boat body 21 can be designed to be 450mm. The thickness of the current mainstream silicon wafer is 0.16mm, that is, the spacing of a single insert slot 22 can be set to 2mm. At this time, the number of insert slots 22 in a single direction of the boat body 21 can reach 40, and the number of insert slots 22 of the entire boat body 21 can reach 240, which is much higher than the number of insert slots 22 of the existing rectangular wafer boat.

[0055] For further information, please refer to Figures 1 to 4 The height of the positioning pin 24 is between 5 and 20 mm, and the diameter is between 10 and 15 mm; the depth of the positioning groove 25 is between 5 and 20 mm, and the diameter is between 10 and 15 mm.

[0056] As a specific implementation of the device for eliminating the wrapping and plating of solar cells provided by the present invention, please refer to Figure 5 The driving member is a motor 9, and the motor 9 is fixedly installed at the bottom of the furnace tube body.

[0057] For details, please refer to Figure 5 A motor 9 is provided at one end of the rotating shaft 7 away from the bottom support 6. The motor 9 is arranged at the bottom of the furnace tube body and located outside the furnace tube body. The motor 9 drives the rotating shaft 7 to rotate and applies centrifugal force to the silicon wafers in the boat body 21.

[0058] A method for using a device for eliminating solar cell expansion and plating provided by the present invention comprises the following steps:

[0059] S1. The manipulator first inserts the silicon wafer into the wafer slot 22 until the entire boat 21 is filled. When inserting the wafer, ensure that the front side of the silicon wafer that needs to react faces the center of the boat 21, and the back side that does not need to react faces outward and sticks to the boat wall;

[0060] S2, the robot stacks the boats 21 filled with silicon wafers together, and each positioning pin 24 is inserted into the corresponding positioning hole. The number or height of the stacked boats 21 should not exceed the height of the furnace top cover 3 of the deposition furnace;

[0061] S3, after the boat 21 is stacked, the manipulator moves it into the furnace tube body and places it on the bottom bracket 6, and the positioning pin 24 is connected to the positioning hole at the bottom end of the boat 21 to support the boat 21;

[0062] S4, the motor 9 drives the shaft 7 to rotate, the shaft 7 drives the bottom bracket 6 to rotate, and the bottom bracket 6 drives the boat body 21 to rotate through the positioning pin 24;

[0063] S5, the reaction gas enters the furnace tube body from the air inlet 4, passes through the air guide hole 10 of the bottom support 6, enters the inserting slot 22 of each boat body 21, reacts on the surface of the silicon wafer, and the reaction gas moves from bottom to top. Finally, the reaction gas that has completed the reaction is discharged from the air outlet 5;

[0064] S6. After the reaction is finished, the boat 21 is taken out from the furnace tube body, and the silicon wafer in the wafer inserting slot 22 is removed to proceed to the next step.

[0065] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for eliminating the wrapping and plating of solar cells, characterized in that: include: A wafer boat, the wafer boat is used to hold silicon wafers, the wafer boat comprises a boat body, the boat body is provided with a wafer insertion slot group, the wafer insertion slot group comprises a plurality of wafer insertion slots suitable for inserting silicon wafers, the wafer insertion slots are arranged parallel to the axis of the boat body, and the width of the wafer insertion slots is greater than the thickness of the silicon wafer; as well as A deposition furnace, used for loading the wafer boat, the deposition furnace comprises a furnace tube body, a rotating assembly and a driving member, a reaction chamber is arranged inside the furnace tube body, an air inlet is arranged at the bottom of the furnace tube body, and an air outlet is arranged at the top of the furnace tube body, the rotating assembly comprises a rotating shaft and a bottom bracket, the rotating shaft is rotatably connected to the furnace tube body, the rotating shaft passes through the bottom of the furnace tube body in a vertical direction and extends to the inside of the reaction chamber, the bottom bracket is fixedly installed on the top of the rotating shaft, the bottom bracket is used to support and fix the boat body, and the driving member is used to drive the rotating shaft to rotate; Among them, when the silicon wafer is inserted into the wafer insertion slot, the back side of the silicon wafer is attached to the boat wall of the wafer insertion slot on the side away from the center of the boat body, and the rotating shaft drives the bottom support and the boat body to rotate. The silicon wafer is tightly attached to the boat wall of the boat body under the action of centrifugal force, and there is a gap between the front side of the silicon wafer and the boat wall of the wafer insertion slot close to the center of the boat body. The front side of the silicon wafer reacts with the airflow, and the back side of the silicon wafer will not contact the airflow, thereby avoiding the occurrence of winding expansion or winding plating.

2. A device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: A magnetic fluid seal for sealing is arranged between the base and the furnace tube body.

3. A device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: Narrow side supports are arranged on the opposite narrow side inner walls of the wafer inserting slot, and the narrow side supports are used to support the silicon wafer.

4. The device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: The bottom support is provided with an air guide portion, and the air guide portion is used for conducting gas to the boat body.

5. A device for eliminating the wrapping and plating of solar cells as claimed in claim 4, characterized in that: The air guide portion includes a plurality of groups of air guide holes, and the air guide holes vertically penetrate the base.

6. A device for eliminating the wrapping and plating of solar cells as claimed in claim 5, characterized in that: The air guide holes are arranged in one-to-one correspondence with the insert slots.

7. The device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: A positioning pin and a positioning groove are respectively arranged on the top surface and the bottom surface of the boat body. The positioning pin and the positioning groove correspond to each other one by one, and the positioning pin and the positioning groove have the same shape and size.

8. The device for eliminating the wrapping and plating of solar cells as claimed in claim 7, characterized in that: The upper end surface of the bottom bracket is provided with a fixing pin, and the fixing pin is installed in cooperation with the positioning groove.

9. The device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: The plurality of insert slot groups are evenly distributed along the circumference of the boat body.

10. The device for eliminating the wrapping and plating of solar cells as claimed in claim 1, characterized in that: The driving member is a motor, and the motor is fixedly installed at the bottom of the furnace tube body.

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