Light-emitting module and display device

Abstract

The present invention discloses a light-emitting module and a display device, belonging to the field of light-emitting display technology, wherein the light-emitting module comprises a light-emitting panel, wherein the non-light-emitting area of ​​the light-emitting panel comprises a binding area; the light-emitting module further comprises a driving circuit board and a first flexible circuit board, wherein the first flexible circuit board is electrically connected to the light-emitting panel in the binding area, and the driving circuit board is electrically connected to the first flexible circuit board; the first side of the substrate of the light-emitting panel comprises a plurality of light-emitting elements, and the light-emitting surface of the light-emitting panel is located on the first side; the second side of the substrate comprises a plurality of driving modules, wherein the driving modules drive the light-emitting elements to emit light, and the driving modules are electrically connected to the driving circuit board; the driving modules are electrically connected to the substrate on the second side through the second flexible circuit board, and the light-emitting elements are electrically connected to the second flexible circuit board. The display device comprises the above-mentioned light-emitting module. The present invention can not only reduce the size of the driving board of the integrated driving device in the module, but also improve the problem of screen flickering, which is beneficial to improving the light-emitting quality.

Description

Technical Field

[0001] The present invention relates to the field of light-emitting display technology, and more specifically, to a light-emitting module and a display device. Background Art

[0002] Micro LED (Micro Light Emitting Diode) technology and Mini LED (Mini Light Emitting Diode) technology are both emerging branches of LCD display screens. Micro LED technology is a technology that miniaturizes and matrices traditional light-emitting diodes to address and drive each pixel individually, with the individual pixel and pixel pitch reduced to the micron level. The display screen prepared using this technology has the advantages of high brightness, high color gamut, high resolution, power saving, and fast response speed. This technology can also be used to achieve the Local Dimming (regional dimming technology) design of direct backlight to achieve a high dynamic range screen effect, making the picture more delicate, and can also provide a high-brightness surface light source to increase the module brightness. The basic structure of Micro LED panels and Mini LED panels is to mount LED chips on a substrate with wires laid, and then use spraying or film pressing to make protective glue, and control the chip through the circuit on the substrate to achieve the surface light source and Local Dimming effect.

[0003] The driving method of Micro LED panels and Mini LED panels in the prior art generally adopts a lamp-driven separation method, that is, the device that drives the LED to emit light is externally placed on the driver board, and the drive signal is transmitted to the LED through the device on the driver board to control its light emission. However, in order to realize the Local Dimming function, each partition needs to be controlled, so a special driver chip is required to drive each partition. As the resolution of display devices becomes higher and higher, the required pixel size and pixel spacing are getting smaller and smaller, and the number of pixels is also increasing. For high-resolution display devices, the required partitions generally exceed thousands, resulting in more driver chips and corresponding devices, thereby increasing the size of the driver board. In order to reduce the size of the driver board, the current Micro LED and Mini LED driving methods also have a scanning drive method, that is, a high-frequency switching method is used to control the brightness of the LED. Although it can reduce the number of devices and reduce the size of the driver board, the LED is prone to flickering during the switching process, causing the screen of the entire device to flicker.

[0004] Therefore, it is a technical problem that needs to be solved urgently by those skilled in the art to provide a light-emitting module and a display device that can reduce the size of a driving board that integrates a driving device in a module, improve the problem of screen flickering, and improve the light-emitting quality. Summary of the invention

[0005] In view of this, the present invention provides a light emitting module and a display device to solve the problem in the prior art that high-resolution light emitting modules cannot both reduce the size of a driving board and improve the light emitting quality.

[0006] The present invention discloses a light-emitting module, comprising: a light-emitting panel, the light-emitting panel comprising a light-emitting area and a non-light-emitting area at least partially arranged around the light-emitting area, the non-light-emitting area comprising a binding area; the light-emitting module also comprises a driving circuit board and a first flexible circuit board, the first flexible circuit board is bound and electrically connected to the light-emitting panel in the binding area, and the driving circuit board is bound and electrically connected to the first flexible circuit board; the light-emitting panel comprises a substrate, the substrate comprises a first side and a second side, the first side of the substrate comprises a plurality of light-emitting elements, and the light-emitting surface of the light-emitting panel is located on the first side; the second side of the substrate comprises a plurality of driving modules, the driving modules drive the light-emitting elements to emit light, and the driving modules are electrically connected to the driving circuit board; the driving module comprises at least a second flexible circuit board, the driving module is bound and electrically connected to the substrate on the second side through the second flexible circuit board, and the light-emitting elements are electrically connected to the second flexible circuit board.

[0007] Based on the same inventive concept, the present invention also discloses a display device, which includes the above-mentioned light-emitting module.

[0008] Compared with the prior art, the light-emitting module and display device provided by the present invention achieve at least the following beneficial effects:

[0009] The light-emitting module provided by the present invention at least includes a light-emitting panel, a driving circuit board and a first flexible circuit board, wherein a plurality of light-emitting elements are arranged on a substrate in the light-emitting panel. The light-emitting panel includes a light-emitting area and a non-light-emitting area at least partially arranged around the light-emitting area, and the binding area of ​​the non-light-emitting area is used to bind the first flexible circuit board, that is, the first flexible circuit board is bound and electrically connected to the light-emitting panel in the binding area, and the driving circuit board is bound and electrically connected to the first flexible circuit board, so that the driving signal provided by the driving circuit board can be transmitted to the light-emitting panel through the first flexible circuit board, and the light-emitting element obtains the light-emitting current to emit light of different brightness. The substrate of the light-emitting panel can be used as a bearing substrate of the module structure, and the light-emitting element is located on the first side of the substrate. The first side of the substrate can be understood as the light-emitting surface of the light-emitting panel, and the second side of the substrate can be understood as the backlight surface of the light-emitting panel. In the present invention, the driving module that drives the light-emitting element of the light-emitting panel to emit light is arranged on the second side of the substrate, and the driving module at least includes a second flexible circuit board. The driving module on the second side of the substrate is bound and electrically connected to the substrate on the second side through the second flexible circuit board, and the light-emitting element is electrically connected to the second flexible circuit board, so that the signal transmission between the driving module on the second side of the substrate and the light-emitting element in the corresponding partition can be realized. In the present invention, since there is no need to set up light-emitting elements on the backlight side of the light-emitting panel, there is more space to set up more driving modules. Even if the resolution of the light-emitting module is high and the number of partitions is large, a corresponding number of driving modules can be set up to drive the light-emitting elements on the first side of the substrate to emit light. The driving module does not need to occupy the space of the driving circuit board. The driving circuit board only needs to be provided with small electronic components such as resistors and capacitors that provide electrical signals to each driving module. Therefore, the size of the driving circuit board can be greatly reduced, which is conducive to reducing the size of the entire module and realizing the miniaturization design of the module. The light-emitting module can also adopt a direct drive control method for the light-emitting element, directly providing different currents through the driving module to control the brightness of the light-emitting element, without the need for switching action, which is conducive to improving the problem of screen flickering and improving the light-emitting quality of the light-emitting module.

[0010] Of course, any product implementing the present invention does not necessarily need to achieve all of the above-mentioned technical effects at the same time.

[0011] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0013] Figure 1 is a schematic diagram of the planar structure of a light-emitting module provided by an embodiment of the present invention;

[0014] Figure 2 yes Figure 1 A schematic diagram of the planar structure of the back side of the light emitting module;

[0015] Figure 3 yes Figure 1 A side view structural schematic diagram of;

[0016] Figure 4 It is a schematic diagram of the planar structure of a light-emitting module provided in the prior art;

[0017] Figure 5 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0018] Figure 6 yes Figure 5 A schematic diagram of the side structure of the light-emitting module;

[0019] Figure 7 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0020] Figure 8 yes Figure 7 A schematic diagram of the side structure of the light-emitting module;

[0021] Fig. 9 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0022] Fig.10 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0023] Fig.11 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0024] Fig.12 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0025] Fig.13 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0026] Fig.14 is another schematic diagram of the planar structure of the light-emitting module provided by an embodiment of the present invention;

[0027] Fig.15 is another schematic diagram of the planar structure of the light-emitting module provided by an embodiment of the present invention;

[0028] Fig.16is another schematic diagram of the planar structure of the light-emitting module provided by an embodiment of the present invention;

[0029] Fig.17 yes Fig.16 A schematic diagram of the planar structure of the back side of the light emitting module;

[0030] Fig.18 yes Fig.16 A side view structural schematic diagram of;

[0031] Fig.19 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module;

[0032] Fig. 20 It is a schematic diagram of the planar structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0035] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0036] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0037] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] Please refer to Figure 1-Figure 3 , Figure 1 is a schematic diagram of the planar structure of a light-emitting module provided by an embodiment of the present invention, Figure 2 yes Figure 1 A schematic diagram of the planar structure of the back side of the light emitting module in FIG. Figure 3 yes Figure 1, the light-emitting module 000 provided in this embodiment includes: a light-emitting panel 10, the light-emitting panel 10 includes a light-emitting area FA and a non-light-emitting area NFA at least partially arranged around the light-emitting area FA, the non-light-emitting area NFA includes a binding area BA;

[0039] The light emitting module 000 further includes a driving circuit board 20 and a first flexible circuit board 30. The first flexible circuit board 30 is bound and electrically connected to the light emitting panel 10 in the binding area BA. The driving circuit board 20 is bound and electrically connected to the first flexible circuit board 30.

[0040] The light emitting panel 10 includes a substrate 101, the substrate 101 includes a first side 101A and a second side 101B, the first side 101A of the substrate 101 includes a plurality of light emitting elements 102, and a light emitting surface 10E of the light emitting panel 10 is located on the first side 101A;

[0041] The second side 101B of the substrate 101 includes a plurality of driving modules 40, the driving modules 40 drive the light emitting elements 102 to emit light, and the driving modules 40 are electrically connected to the driving circuit board 20;

[0042] The driving module 40 at least includes a second flexible circuit board 401 . The driving module 40 is bound and electrically connected to the substrate 10 on the second side 101B via the second flexible circuit board 401 . The light emitting element 102 is electrically connected to the second flexible circuit board 401 .

[0043] Specifically, the light-emitting module 000 provided in this embodiment at least includes a light-emitting panel 10, a driving circuit board 20 and a first flexible circuit board 30, wherein a plurality of light-emitting elements 102 are arranged on a substrate 101 in the light-emitting panel 10 as the light-emitting body of the light-emitting module 000. The light-emitting panel 10 includes a light-emitting area FA and a non-light-emitting area NFA at least partially arranged around the light-emitting area FA. Optionally, the light-emitting element 102 of this embodiment is located in the light-emitting area FA, and the light-emitting element 102 may include any one of a micro light-emitting diode or a sub-millimeter light-emitting diode. The binding area BA of the non-luminous area NFA in the light-emitting panel 10 is used to bind the first flexible circuit board 30, that is, the first flexible circuit board 30 is bound and electrically connected to the light-emitting panel 10 in the binding area BA, and the driving circuit board 20 is bound and electrically connected to the first flexible circuit board 30, so that the driving signal provided by the driving circuit board 20 can be transmitted to the light-emitting panel 10 through the first flexible circuit board 30, so that the light-emitting element 102 on the substrate 101 obtains the light-emitting current to emit light of different brightness. After the light-emitting module 000 process is completed, the driving circuit board 20 can be bent to the backlight side of the light-emitting panel 10 through the flexibility of the first flexible circuit board 30, thereby not affecting the overall size of the light-emitting module 000. The light-emitting panel 10 in this embodiment includes a substrate 101, which can be used as a bearing substrate of the module structure. The substrate 101 can be a hard substrate, or the substrate 101 can be a substrate 101 with a circuit structure integrated inside, which is not limited in this embodiment. The substrate 101 includes a first side 101A and a second side 101B. The first side 101A of the substrate 101 includes a plurality of light-emitting elements 102, i.e., the light-emitting elements 102 that emit light are located on the first side 101A of the substrate 101. The first side 101A of the substrate 10 can be understood as the light-emitting surface 10E of the light-emitting panel 10, and the second side 101B of the substrate 10 can be understood as the backlight surface of the light-emitting panel 10.

[0044] In the prior art, such as Figure 4 As shown, Figure 4 It is a schematic diagram of a planar structure of a light-emitting module provided in the prior art, such as Figure 4As shown, the multiple light-emitting elements 102' on the driving light-emitting panel 10' of the light-emitting module 000' in the prior art are arranged in partitions, and the light-emitting elements 102' in the multiple partitions can be controlled to emit light by a driving chip 40', and one partition corresponds to one driving chip 40'. Each driving chip 40' and electronic components 201' such as resistors and capacitors for providing electrical signals to each driving chip 40' are arranged on a driving circuit board 20'. The driving circuit board 20' can be understood as a printed circuit board structure. The driving circuit board 20' is bound to the non-light-emitting area NFA' of the light-emitting panel 10', such as the frame position, through the first flexible circuit board 30', so that the driving chips 40' integrated on the driving circuit board 20' provide driving current for the light-emitting elements 102' in each partition on the light-emitting panel 10' to control the light-emitting elements 102' to emit light. Due to the improvement of resolution, the number of partitions on the light-emitting panel 10' will increase, and the number of driver chips 40' on the driver circuit board 20' will also increase. The driver circuit board 20' itself also integrates a large number of electronic components 201' such as resistors and capacitors that provide electrical signals to each driver chip 40'. Therefore, the larger the resolution, the larger the area required to arrange the driver chips 40' on the driver circuit board 20', resulting in the driver circuit board 20' becoming larger and larger, which will affect the overall size of the light-emitting module 000' and is not conducive to the miniaturization design of the module.

[0045] In order to solve the above problem, in this embodiment, the second side 101B of the substrate 101 includes a plurality of driving modules 40, and the driving modules 40 drive the light-emitting elements 102 to emit light, that is, the driving modules 40 that drive the light-emitting elements 102 of the light-emitting panel 10 to emit light are arranged on the second side 101B of the substrate 101 (the side of the backlight surface of the light-emitting panel 10), such as Figure 3As shown. The driving module 40 is electrically connected to the driving circuit board 20, that is, the driving signal (such as power signal, etc.) required by the driving module 40 still needs to be provided by the driving circuit board 20 to realize the transmission of some driving signals. The driving module 40 for driving the light-emitting element 102 of the light-emitting panel 10 to emit light in this embodiment includes at least a second flexible circuit board 401, and the driving module 40 on the second side 101B of the substrate 101 is bound and electrically connected to the substrate 10 on the second side 101B through the second flexible circuit board 401, and the light-emitting element 102 is electrically connected to the second flexible circuit board 401, so that the signal transmission between the driving module 40 on the second side 101B of the substrate 101 and the light-emitting element 102 in the corresponding partition can be realized. In this embodiment, since the light-emitting element 102 does not need to be set on the backlight side of the light-emitting panel 10, there is more space to set a larger number of driving modules 40. One driving module 40 can be understood as a module that controls the light-emitting element 102 of one partition, and one driving module 40 can be understood as a module that controls the light-emitting elements 102 of multiple partitions. This embodiment does not specifically limit this. Even if the resolution of the light-emitting module 000 is high and the number of partitions is large, a corresponding number of driving modules 40 can be set to drive the light-emitting elements 102 on the first side 101A of the substrate 101 to emit light. In addition, the driving modules 40 in this embodiment do not need to occupy the space of the driving circuit board 20. The driving circuit board 20 only needs to be set to provide each driving module 40 with small electronic components 201 such as resistors and capacitors that provide electrical signals. Therefore, the size of the driving circuit board 20 can be greatly reduced, which is conducive to reducing the size of the entire module and realizing the miniaturization design of the module. The light-emitting module 000 of the present embodiment can also adopt a direct drive control method for the light-emitting element 102, and directly provide currents of different sizes through the driving module 40 to control the brightness of the light-emitting element 102 without switching action, which is beneficial to improving the problem of screen flickering and improving the light-emitting quality of the light-emitting module 000. In addition, by setting the driving module 40 on the backlight side of the light-emitting panel 10 through a COF (Chip On Flex, or, Chip On Film) structure, it is beneficial to reduce the number of devices on the driving circuit board 20, reduce the size of the driving circuit board 20, and further realize the miniaturization design of the module.

[0046] Optionally, the electrical connection structure between the light emitting element 102 and the second flexible circuit board 401 in this embodiment can realize signal transmission between the light emitting element 102 on the first side 101A of the substrate 101 and the second flexible circuit board 401 on the second side 101B by punching holes in the substrate 101. It can be understood that, in specific implementation, the electrical connection method between the light emitting element 102 and the second flexible circuit board 401 includes but is not limited to this, and can also be other electrical connection structures, which will not be described in detail in this embodiment.

[0047] It should be noted that the light-emitting module 000 of this embodiment can be used as a direct-type backlight for a liquid crystal display panel, which can not only realize local dimming technology, but also help to reduce the module size while improving the display effect. This embodiment does not specifically limit the use of the light-emitting module 000. During specific implementation, the settings can be selected according to actual needs.

[0048] It should be further explained that the light-emitting module 000 in this embodiment may also include other structures. The figure of this embodiment only illustrates the structure related to the technical solution of this embodiment. When implemented specifically, the structure of the light-emitting module 000 includes but is not limited to this. It may also include signal routing in the light-emitting panel 10, etc. For details, please refer to the structure of the light-emitting module used for backlight in the related technology for understanding, which will not be elaborated in this embodiment.

[0049] In some optional embodiments, please refer to Figure 1 and Figure 5 , Figure 5 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Figure 5 In this embodiment, a light-emitting driving chip 402 is disposed on the second flexible circuit board 401 , and the light-emitting driving chip 402 is bound and electrically connected to the second flexible circuit board 401 .

[0050] This embodiment explains that the driving module 40 arranged on the backlight side of the light-emitting panel 10 may include a second flexible circuit board 401 and a light-emitting driving chip 402, and the light-emitting driving chip 402 is bound and electrically connected to the second flexible circuit board 401, that is, the driving module 40 located on the second side 101B of the substrate 101 is bound and electrically connected to the substrate 101 through the second flexible circuit board 401, and the driving current for driving the light-emitting element 102 can be provided by the light-emitting driving chip 402, and the signal for the light-emitting driving chip 402 to drive the light-emitting element 102 to emit light can be provided by the second flexible circuit board 401 bound and electrically connected thereto, so that the light-emitting element 102 emits different brightness. Optionally, a plurality of light-emitting driver chips 402 may be bound to a second flexible circuit board 401 in the present embodiment, that is, a COF structure is arranged on the backlight surface of the light-emitting panel 10, and a light-emitting driver chip 402 may control a corresponding light-emitting element 102 of a partition. Compared with directly arranging the light-emitting driver chip 402 on the backlight surface of the light-emitting panel 10, that is, the second side 101B of the substrate 101, the partitions can be increased by adding the light-emitting driver chip 402 to improve the resolution, and the number of second flexible circuit boards 401 can be reduced, thereby reducing the area with a large thickness of the entire module (that is, the area where the second flexible circuit board 401 is located), which is beneficial to reducing the overall thickness of the module.

[0051] In some optional embodiments, please refer to Figure 1 , Figure 5 and Figure 6 , Figure 6 yes Figure 5 Schematic diagram of the side structure of the light-emitting module. In this embodiment, the light-emitting driving chip 402 is located on the side of the second flexible circuit board 401 facing the substrate 101.

[0052] This embodiment explains that when the driving module 40 that drives the light-emitting element 102 to emit light is arranged on the second side 101B of the substrate 101, the light-emitting driving chip 402 can be arranged on the side of the second flexible circuit board 401 facing the substrate 101, that is, the light-emitting driving chip 402 is closer to the substrate 101 than the second flexible circuit board 401, so that the distance between the light-emitting element 102 on the first side 101A of the substrate 101 and the light-emitting driving chip 402 is closer, and the light-emitting driving chip 402 that drives each light-emitting element 102 to emit light can be protected by the second flexible circuit board 401, and then the light-emitting driving chip 402 and other structures arranged on the side of the second flexible circuit board 401 facing the substrate 101 can be protected during the assembly process of the module.

[0053] In some optional embodiments, please refer to Figure 1 , Figure 7 and Figure 8 , Figure 7 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Figure 7 Transparency filling is performed), Figure 8 yes Figure 7 A schematic diagram of the side structure of the light-emitting module, in this embodiment, the substrate 101 includes a driving circuit layer 1011, the driving circuit layer 1011 includes a plurality of signal lines 1011A, the second side 101B of the substrate 101 includes a plurality of first pins 103, and the light-emitting element 102 is electrically connected to the first pins 103 through the signal lines 1011A;

[0054] The second flexible circuit board 401 includes a plurality of first pads 403 , and the first pads 403 are bound and electrically connected to the first pins 103 .

[0055] This embodiment explains that the substrate 101 of the light-emitting panel 10 can be a substrate including a driving circuit layer 1011, that is, the substrate 101 can be a printed circuit board, and the light-emitting element 102 arranged on the first side 101A of the substrate 101 can be formed by directly punching on the printed circuit board. The driving circuit layer 1011 of this embodiment can include a plurality of signal lines 1011A, and the signal lines 1011A can be any one of metal conductive materials or transparent conductive materials, which is not limited in this embodiment. The second side 101B of the substrate 101 of this embodiment includes a plurality of first pins 103, and the first pins 103 can be coated with a conductive film layer on the second side 101B of the substrate 101 and patterned. The light-emitting element 102 is electrically connected to the first pins 1011A through the signal lines 1011A. Optionally, the substrate 101 can include a through hole 101K that penetrates the thickness of the substrate 101, and the first pins 103 located on the second side 101B of the substrate 101 can be electrically connected to the signal line 1011A of the driving circuit layer 1011 through the conductive connection portion penetrating the through hole 101K. The driving module 40 of this embodiment needs to provide a driving current for the light-emitting element 102 to make it emit light. In order to make the light-emitting driving chip 402 of the driving module 40 electrically connected to the light-emitting element 102 and provide a driving current for the light-emitting element 102, a second flexible circuit board 401 can be provided to include a plurality of first pads 403. The first pads 403 are electrically connected to the light-emitting driving chip 402 through the internal circuit of the second flexible circuit board 401. The first pads 403 provided on the second flexible circuit board 401 are bound and electrically connected to the first pins 103 on the second side 101B of the substrate 101. The optional first pads 403 and the first pins 103 can be fixed and connected by conductive structures such as solder. The contact electrical connection can be further bound to the first pin 103 on the second side 101B of the substrate 101 through the first solder pad 403 set on the second flexible circuit board 401, so as to realize the signal transmission between the light-emitting driver chip 402 and the first pin 103, and the transmission of the driving current signal between the light-emitting driver chip 402 on the second side 101B of the substrate 101 and the light-emitting element 102 on the first side 101A of the substrate 101 is realized through the first pin 103 and the signal line 1011A of the driving circuit layer 1011, so as to ensure the overall driving effect of the light-emitting module 000 and the light-emitting quality after the driving module 40 is set on the backlight surface of the light-emitting panel 10 and the size of the driving circuit board 20 is reduced.

[0056] Optional, such as Figure 1 , Figure 7 and Figure 8In this embodiment, the first pad 403 on the second flexible circuit board 401 is located on the side of the second flexible circuit board 401 facing the substrate 101, which is beneficial to reducing the distance between the first pin 103 on the second side 101B of the substrate 101 and the first pad 403, and is beneficial to improving the electrical connection stability between the first pin 103 and the first pad 403.

[0057] It is understandable that this embodiment does not specifically limit the number of light-emitting driver chips 402 included in the second side 101B of the substrate 101 and the number of first pins 103 on the second flexible circuit board 401. The figure is only for illustration. During specific implementation, the settings can be selected according to actual needs.

[0058] It can be understood that the figure of this embodiment only takes the example that multiple first pads 403 are located on the side of the second flexible circuit board 401 away from the binding area BA of the light-emitting panel 10. In specific implementation, the setting position of the second flexible circuit board 401 provided with the light-emitting driver chip 402 includes but is not limited to this. It can also be that multiple first pads 403 are located on the side of the binding area BA of the second flexible circuit board 401 close to the light-emitting panel 10, or it can also be that the first pads 403 in the second flexible circuit board 401 partially provided with the light-emitting driver chip 402 are located on the side of the binding area BA of the second flexible circuit board 401 away from the light-emitting panel 10, and the first pads 403 in the second flexible circuit board 401 provided with the light-emitting driver chip 402 are located on the side of the binding area BA of the second flexible circuit board 401 close to the light-emitting panel 10, or it can also be other settings. This embodiment does not make specific limitations on this. In specific implementation, the position of the second flexible circuit board 401 can be designed according to the actual circuit of the module. It should be noted that the present embodiment does not specifically limit the number of the second flexible circuit boards 401 included in the light-emitting module 000 , and during specific implementation, it can be set according to the size of the module and actual design requirements.

[0059] In some optional embodiments, please refer to Figure 1 and Fig. 9 , Fig. 9 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Fig. 9 In this embodiment, the light-emitting area FA includes at least one sub-area FA1. It can be understood that in some other optional embodiments, the number of sub-areas FA1 included in the light-emitting area FA may be two, three, four or more; Optionally, in this embodiment, the light-emitting area FA includes three sub-areas FA1 as an example, and the three sub-areas FA1 are arranged in sequence along a direction parallel to the plane where the light-emitting panel 10 is located;

[0060] At least one driving module 40 is correspondingly disposed in one sub-area FA1 .

[0061] This embodiment explains that the light emitting area FA of the light emitting panel 10 can be divided into a plurality of sub-areas FA1, such as Fig. 9 As shown, the three sub-areas FA1 are arranged in sequence along a direction parallel to the plane where the light-emitting panel 10 is located. Optionally, in the second direction Y, the binding area BA is located on one side of the light-emitting area FA, and the three sub-areas FA1 can be set to be arranged in sequence along the first direction X, wherein the second direction Y and the first direction X intersect or are perpendicular to each other in a direction parallel to the plane where the light-emitting panel 10 is located; further optionally, the three sub-areas FA1 can be understood as the left, middle and right areas of the light-emitting panel 10, and in the first direction X, two of the three sub-areas FA1 are close to the frame position of the light-emitting panel 10. In the present embodiment, at least one driving module 40 is correspondingly provided for one sub-area FA1. Optionally, one driving module 40 corresponding to one sub-area FA1 can be located in the middle of the sub-area FA1 as much as possible, so that the light-emitting elements 102 in all directions of the light-emitting area FA can correspond to the driving module 40, which is conducive to uniformly arranging the driving modules 40 on the second side 101B of the substrate 101, so that the winding length of the signal line of the driving circuit layer that electrically connects the light-emitting element 102 to the driving module 40 in different sub-areas FA1 can be as consistent as possible, so as to reduce the impedance difference when the driving signal is transmitted on the signal line.

[0062] It can be understood that the three sub-areas FA1 included in the light-emitting area FA of the light-emitting panel 10 in this embodiment can be understood as at least three areas that are equally divided along the first direction X into the light-emitting area FA of the light-emitting panel 10. Each sub-area FA1 can include multiple light-emitting units, and each light-emitting unit can include at least one or more light-emitting elements 102, that is, one driving module 40 can control the light-emitting elements 102 in at least one or more light-emitting units to emit light. In specific implementation, the division method of at least three sub-areas FA1 includes but is not limited to this, and can also be other unequal division methods, which are not specifically limited in this embodiment. It is only necessary to meet the requirement that at least three sub-areas FA1 are located in the left, middle and right areas in the first direction X and at least one driving module 40 is correspondingly set for one sub-area FA1, so as to reduce the winding of the connection between the driving module 40 and the light-emitting element 102, so that the connection impedance between different driving modules 40 and the light-emitting element 102 driven by them is as consistent as possible.

[0063] In some optional embodiments, please refer to Figure 1 and Fig.10 , Fig.10 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Fig.10Transparency filling is performed), in this embodiment, the light-emitting area FA includes at least three sub-areas FA1, the three sub-areas FA1 are arranged along the first direction X, and one sub-area FA1 is correspondingly provided with two driving modules 40;

[0064] The two driving modules 40 in one sub-area FA1 are arranged along the second direction Y; wherein the first direction X and the second direction Y intersect.

[0065] This embodiment explains that the light emitting area FA of the light emitting panel 10 can be divided into a plurality of sub-areas FA1, such as Fig.10 As shown, the three sub-areas FA1 are arranged in sequence along the first direction X. Optionally, in the second direction Y, the binding area BA is located on one side of the light-emitting area FA, wherein the second direction Y and the first direction X intersect or are perpendicular to each other in a direction parallel to the plane where the light-emitting panel 10 is located; further optionally, the three sub-areas FA1 can be understood as the left, middle and right areas of the light-emitting panel 10, and in the first direction X, two of the three sub-areas FA1 are close to the frame position of the light-emitting panel 10. In the present embodiment, one sub-area FA1 is provided with two driving modules 40 corresponding thereto. Optionally, the two driving modules 40 corresponding to one sub-area FA1 can be located in the middle position of the sub-area FA1 as far as possible, so that the light-emitting elements 102 in the upper and lower positions in each sub-area FA1 of the light-emitting area FA can correspond to one driving module 40, which is conducive to the uniform arrangement of the driving modules 40 on the second side 101B of the substrate 101, so that the winding of the signal line of the driving circuit layer that electrically connects the light-emitting element 102 to the driving module 40 in different sub-areas FA1 can be as consistent as possible in length, so as to reduce the impedance difference when the driving signal is transmitted on the signal line. At the same time, in the present embodiment, two driving modules 40 in one sub-area FA1 are arranged along the second direction Y, so that the number of light-emitting driving chips 402 can be increased by setting two driving modules 40 in one sub-area FA1, and then for the same light-emitting module 000, more partitions of the light-emitting element 102 can be added to minimize the partitions adjusted in the local area, which is conducive to a more delicate light-emitting picture, thereby improving the light-emitting effect.

[0066] In some optional embodiments, please refer to Figure 1 , Fig.11 and Fig.12 , Fig.11 yes Figure 1 Another schematic diagram of the planar structure of the back side of the light emitting module in FIG. Fig.12 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Fig.11 and Fig.12Transparency filling is performed), in this embodiment, the orthographic projection of at least part of the driving module 40 on the plane where the substrate 101 is located is located in the non-luminous area NFA.

[0067] This embodiment explains that when the driving module 40 for driving the light emitting element 102 on the first side 101A of the substrate 101 to emit light is arranged on the second side 101B of the substrate 101, the orthographic projection of at least part of the driving module 40 on the plane where the substrate 101 is located can be arranged in the non-light emitting area NFA. Optionally, Fig.11 As shown, when the number of driving modules 40 included in the light-emitting module 000 is small, the driving modules 40 included in all the light-emitting modules 000 can be arranged in the non-light-emitting area NFA; optionally, as Fig.12 As shown, when the resolution of the light-emitting panel 10 of the light-emitting module 000 is high and the number of partitions of the light-emitting element 10 is large, that is, the number of driving modules 40 included is large, at least part of the driving modules 40 included in the light-emitting module 000 can be set in the non-light-emitting area NFA, that is, if there is space at the frame position of the light-emitting module 000, the driving module 40 should be placed in the frame area of ​​the light-emitting module 000 as much as possible to reduce the influence of the driving module 40 on the light-emitting performance when it is placed on the second side 101B of the substrate 101 in the light-emitting area FA, which is beneficial to improve the overall light-emitting quality of the light-emitting module 000.

[0068] Optional, such as Fig.11 and Fig.12 As shown, when the orthographic projection of at least part of the driving module 40 in this embodiment on the plane where the substrate 101 is located is located in the non-luminous area NFA, the driving module 40 located on the second side 101B of the substrate 101 in the non-luminous area NFA can be arranged as close to the side of the driving circuit board 20 as possible, which is beneficial to reduce the length of the signal routing when the driving module 40 is electrically connected to the driving circuit board 20, and is beneficial to reduce the overall wiring difficulty of the module.

[0069] Optionally, in some other optional embodiments, such as Fig.13 As shown, Fig.13 yes Figure 1 Another planar structural diagram of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Fig.13Transparency filling is performed), a plurality of second flexible circuit boards 401 may be arranged, and the orthographic projections of the plurality of first pads 403 in a portion of the second flexible circuit boards 401 on the plane where the substrate 101 is located are located in the non-luminous area NFA, and the orthographic projections of the remaining structures of the portion of the second flexible circuit boards 401 on the plane where the substrate 101 is located may not overlap with the light-emitting panel 10 (not shown in the figure), so as to ensure the connection effect between the second flexible circuit boards 401 and the circuit structure in the light-emitting panel 10, while also helping to reduce the space occupied by the driving module 40 on the backlight side of the light-emitting panel 10.

[0070] In some alternative embodiments, please refer to Fig.14 , Fig.14 It is another planar structural schematic diagram of the light-emitting module provided in an embodiment of the present invention. In this embodiment, the first side 101A of the substrate 101 includes a plurality of capacitor devices 2011 and a plurality of resistor devices 2012, and both the capacitor devices 2011 and the resistor devices 2012 are electrically connected to the driving circuit board 20.

[0071] This embodiment explains that some electronic components in the light-emitting module 000, such as some capacitor devices 2011 and some resistor devices 2012, can be arranged on the first side 101A of the substrate 101 of the light-emitting panel 10. If the substrate 101 is a printed circuit board, the capacitor device 2011 and the resistor device 2012 arranged on the first side 101A of the substrate 101 can be directly mounted on the substrate 101, and the capacitor device 2011 and the resistor device 2012 are both electrically connected to the driving circuit board 20 bound to the binding area BA, that is, the electronic components arranged on the substrate 101 still transmit signals between the driving circuit boards 20. Using more free space on the substrate 101 of the light-emitting panel 10 to arrange the electronic components originally integrated on the driving circuit board 20 is beneficial to further reduce the size of the driving circuit board 20, and then can further reduce the overall volume of the module, and better realize the design of miniaturized modules.

[0072] It can be understood that the structure of the capacitor device 2011 and the resistor device 2012 in the electronic components 201 connected to the driving circuit board 20 in the figure of this embodiment is only an example and does not represent the actual number and shape. In specific implementation, the overall layout of the electronic components 201 and the design of the included capacitor devices 2011 and resistor devices 2012 can be set according to the functional requirements of the driving circuit board 20. The electronic components 201 can also include other electronic devices, not limited to only capacitor devices 2011 and resistor devices 2012, and this embodiment is not limited here.

[0073] Optional, such as Fig.14As shown, the capacitor device 2011 and the resistor device 2012 are located in the non-luminous area NFA, that is, they are arranged on the first side 101A of the substrate 101. Part of the capacitor device 2011 and the resistor device 2012 directly mounted on the substrate 101 can be arranged within the non-luminous area NFA of the light-emitting panel 10. The remaining space in the non-luminous area NFA of the light-emitting panel 10 can be used to place the electronic components originally integrated on the driving circuit board 20 as much as possible. While reducing the size of the driving circuit board 20, it can also avoid affecting the light-emitting effect of the light-emitting element 102 on the first side 101A of the substrate 101.

[0074] In some alternative embodiments, please refer to Fig.15 , Fig.15 2 is another schematic diagram of a planar structure of a light emitting module provided in an embodiment of the present invention. In this embodiment, the capacitor device 2011 and the resistor device 2012 are located between two adjacent light emitting elements 102 in the light emitting area FA.

[0075] This embodiment explains that some electronic components in the light-emitting module 000, such as some capacitor devices 2011 and some resistor devices 2012, can be arranged on the first side 101A of the substrate 101 of the light-emitting panel 10. When the substrate 101 is a printed circuit board, the capacitor devices 2011 and the resistor devices 2012 arranged on the first side 101A of the substrate 101 can be directly mounted on the substrate 101. If the size of the light-emitting panel 10 is large and the gap between adjacent light-emitting elements 102 is large, some capacitor devices 2011 and resistor devices 2012 directly mounted on the substrate 101 can also be arranged between two adjacent light-emitting elements 102 in the light-emitting area FA. Therefore, the free space on the substrate 101 in the light-emitting area FA can be used to arrange the electronic components originally integrated on the driving circuit board 20. While reducing the size of the driving circuit board 20, the frame size of the light-emitting module 000 can also be reduced, thereby realizing a narrow frame design of the light-emitting module 000.

[0076] It can be understood that the figure of this embodiment only exemplarily shows the position of some capacitor devices 2011 and resistor devices 2012 when they are arranged between two adjacent light-emitting elements 102 in the light-emitting area FA, and does not represent the number, shape and arrangement of the electronic components 201 actually located in the light-emitting area FA. In specific implementation, the overall layout of the electronic components 201 and the design of the included capacitor devices 2011 and resistor devices 2012 can be set according to the functional requirements of the driving circuit board 20. The electronic components 201 can also include other electronic devices, not limited to only capacitor devices 2011 and resistor devices 2012, and this embodiment is not limited here.

[0077] In some optional embodiments, please continue to refer to Figure 1 and Figure 2 In this embodiment, the substrate 101 includes a printed circuit board, and the light emitting element 102 is fixedly electrically connected to the first side 101A of the substrate 101 through soldering.

[0078] This embodiment explains that the substrate 101 of the light-emitting panel 10 used to make the light-emitting element 102 can be a printed circuit board. The printed circuit board (PCB circuit board) is a provider of electrical connections for electronic components. Through the layout design of electronic components, the wiring between the light-emitting element 102 and the driving signal line and the assembly errors of the light-emitting element 102 itself can be greatly reduced, which is conducive to improving the automation level and process efficiency. The substrate 101 of the printed circuit board itself includes a circuit layer, which can be directly taken out for binding connection of the light-emitting element 102. The light-emitting element 102 can be fixedly electrically connected to the first side 101A of the substrate 101 through solder, which is conducive to reducing the layout process of the driving circuit layer in the substrate 101. Furthermore, the substrate 101 adopts a printed circuit board. Since the number of circuit board layers included in the printed circuit board itself can be divided into single-sided boards, double-sided boards or other multi-layer circuit boards, the substrate 101 of the double-sided printed circuit board can be directly adopted. There is no need to punch holes on the substrate 101 to connect the first side 101A and the second side 101B of the substrate 101, thereby reducing the process steps of connecting the two sides of the substrate 101 of the module, ensuring the design structure of the light-emitting module 000 of this embodiment, and can also greatly improve the process efficiency of the module.

[0079] In some optional embodiments, please refer to Fig.16 and Fig.17 , Fig.16 is another schematic diagram of a planar structure of a light-emitting module provided by an embodiment of the present invention, Fig.17 yes Fig.16 A schematic diagram of the planar structure of the back side of the light emitting module in FIG. 1 (in order to clearly illustrate the structure of this embodiment, Fig.17 Transparency filling is performed), in this embodiment, the light-emitting area FA of the light-emitting panel 10 includes a plurality of light-emitting units 00, and the light-emitting unit 00 includes a plurality of light-emitting elements 102;

[0080] One driving module 40 correspondingly drives a plurality of light emitting elements 102 of at least one light emitting unit 00 to emit light.

[0081] This embodiment explains that when the light-emitting panel 10 in the light-emitting module 000 is driven to emit light, the regional dimming technology can be used to divide the light-emitting area FA of the light-emitting panel 10 into multiple light-emitting units 00, each light-emitting unit 00 includes multiple light-emitting elements 102, and a driving module 40 is correspondingly set for each light-emitting unit 00 to control the multiple light-emitting elements 102 in the light-emitting unit 00 to drive the light. The driving module 40 is set on the second side 101B of the substrate 101 to reduce the size of the driving circuit board 20, and at the same time, a high dynamic range screen effect can be achieved, so that the picture of the display device with the light-emitting module 000 as the backlight is more delicate, thereby improving the light quality and display effect.

[0082] It can be understood that the figure of this embodiment only illustrates the number of light-emitting units 00 included in the light-emitting panel 10 and the number of light-emitting elements 102 included in one light-emitting unit 00. This embodiment does not specifically limit the number of light-emitting units 00 included in the light-emitting panel 10 and the number of light-emitting elements 102 included in one light-emitting unit 00. During specific implementation, it can be set according to the actual size of the light-emitting module 000 and the lighting requirements.

[0083] In some optional embodiments, please refer to Fig.16 , Fig.17 and Fig.18 , Fig.18 yes Fig.16 , in this embodiment, the side of the light emitting element 102 away from the substrate 101 includes a sealing layer 104 , and the sealing layer 104 covers the light emitting element 102 .

[0084] This embodiment explains that the side of the light-emitting element 102 of the light-emitting panel 10 away from the substrate 101 can be coated with a sealing layer 104 to protect the multiple light-emitting elements 102 on the substrate 101. Optionally, the sealing layer 104 can be made of a material with high transparency and firmness such as UV glue (photosensitive glue, ultraviolet light curing glue) or silicone, which can protect the light-emitting element 102 while improving the structural stability of the entire light-emitting panel 10.

[0085] In some optional embodiments, please refer to Figure 1 and Fig.19 , Fig.19 yes Figure 1 Another planar structural schematic diagram of the back side of the light emitting module in the embodiment, in this embodiment, the light emitting module 000 further includes a third flexible circuit board 50, and the driving module 40 is electrically connected to the driving circuit board 20 through the third flexible circuit board 50.

[0086] This embodiment explains that the driving module 40 for driving the light-emitting element 102 on the first side 101A of the substrate 101 to emit light is arranged on the second side 101B of the substrate 101. The driving module 40 needs to be provided with a driving signal by the driving circuit board 20 so as to be transmitted to the light-emitting element 102 on the first side 101A of the substrate 101 on the second side 101B of the substrate 101. Therefore, a third flexible circuit board 50 can be arranged so that the driving module 40 on the second side 101B of the substrate 101 is electrically connected to the driving circuit board 20 bound to the binding area BA through the third flexible circuit board 50. The optional third flexible circuit board 50 can be bound within the binding area BA of the second side 101B of the substrate 101 so as to realize the transmission of the driving signal between the third flexible circuit board 50 on the second side 101B of the substrate 101 and the driving circuit board 20, thereby ensuring that the driving module 40 on the second side 101B of the substrate 101 provides the light-emitting element 102 of the light-emitting panel 10 with a driving signal to emit light, thereby ensuring the luminous performance of the entire module.

[0087] It should be noted that this embodiment is only an exemplary drawing of the setting position of the third flexible circuit board 50. In specific implementation, the position of the third flexible circuit board 50 can be set according to the connection requirements between the driving module 40 and the driving circuit board 20, and this embodiment is not limited here. It can be understood that the electrical connection structure between the driving module 40 and the driving circuit board 20 is not illustrated in the figure of this embodiment. In specific implementation, the driving module 40 and the third flexible circuit board 50 can be electrically connected by setting a connecting line on the second side 101B of the substrate 101, and the third flexible circuit board 50 is bound to the driving circuit board 20 to realize the signal transmission between the driving module 40 and the driving circuit board 20. This embodiment is not repeated here.

[0088] In some alternative embodiments, please refer to Fig. 20 , Fig. 20 1 is a schematic diagram of the planar structure of a display device provided in an embodiment of the present invention. The display device 111 provided in this embodiment includes the light-emitting module 000 provided in the above embodiment of the present invention. Optionally, the display device 111 may be a liquid crystal display device, in which case the light-emitting module 000 of this embodiment may be used as a direct-type backlight. This embodiment does not specifically limit the type of the display device 111, and during specific implementation, it may be set according to actual needs. Fig. 20 The embodiment only takes a mobile phone as an example to illustrate the display device 111. It can be understood that the display device 111 provided in the embodiment of the present invention can be a computer, a television, a car display device or other display device 111 with a display function, and the present invention does not specifically limit this. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the light-emitting module 000 provided in the embodiment of the present invention. For details, please refer to the specific description of the light-emitting module 000 in the above embodiments, and this embodiment will not be repeated here.

[0089] It can be seen from the above embodiments that the light-emitting module and the display device provided by the present invention achieve at least the following beneficial effects:

[0090] The light-emitting module provided by the present invention at least includes a light-emitting panel, a driving circuit board and a first flexible circuit board, wherein a plurality of light-emitting elements are arranged on a substrate in the light-emitting panel. The light-emitting panel includes a light-emitting area and a non-light-emitting area at least partially arranged around the light-emitting area, and the binding area of ​​the non-light-emitting area is used to bind the first flexible circuit board, that is, the first flexible circuit board is bound and electrically connected to the light-emitting panel in the binding area, and the driving circuit board is bound and electrically connected to the first flexible circuit board, so that the driving signal provided by the driving circuit board can be transmitted to the light-emitting panel through the first flexible circuit board, and the light-emitting element obtains the light-emitting current to emit light of different brightness. The substrate of the light-emitting panel can be used as a bearing substrate of the module structure, and the light-emitting element is located on the first side of the substrate. The first side of the substrate can be understood as the light-emitting surface of the light-emitting panel, and the second side of the substrate can be understood as the backlight surface of the light-emitting panel. In the present invention, the driving module that drives the light-emitting element of the light-emitting panel to emit light is arranged on the second side of the substrate, and the driving module at least includes a second flexible circuit board. The driving module on the second side of the substrate is bound and electrically connected to the substrate on the second side through the second flexible circuit board, and the light-emitting element is electrically connected to the second flexible circuit board, so that the signal transmission between the driving module on the second side of the substrate and the light-emitting element in the corresponding partition can be realized. In the present invention, since there is no need to set up light-emitting elements on the backlight side of the light-emitting panel, there is more space to set up more driving modules. Even if the resolution of the light-emitting module is high and the number of partitions is large, a corresponding number of driving modules can be set up to drive the light-emitting elements on the first side of the substrate to emit light. The driving module does not need to occupy the space of the driving circuit board. The driving circuit board only needs to be provided with small electronic components such as resistors and capacitors that provide electrical signals to each driving module. Therefore, the size of the driving circuit board can be greatly reduced, which is conducive to reducing the size of the entire module and realizing the miniaturization design of the module. The light-emitting module can also adopt a direct drive control method for the light-emitting element, directly providing different currents through the driving module to control the brightness of the light-emitting element, without the need for switching action, which is conducive to improving the problem of screen flickering and improving the light-emitting quality of the light-emitting module.

[0091] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A light emitting module, characterized in that: The light-emitting module is used as a direct-type backlight of a liquid crystal display panel, and comprises: a light-emitting panel, the light-emitting panel comprising a light-emitting area and a non-light-emitting area at least partially arranged around the light-emitting area, the non-light-emitting area comprising a binding area; The light-emitting module further includes a driving circuit board and a first flexible circuit board, wherein the first flexible circuit board is bound and electrically connected to the light-emitting panel in the binding area, and the driving circuit board is bound and electrically connected to the first flexible circuit board; The light emitting panel comprises a substrate, the substrate comprises a first side and a second side opposite to each other, the first side of the substrate comprises a plurality of light emitting elements, and the light emitting surface of the light emitting panel is located on the first side; The second side of the substrate includes a plurality of driving modules, the driving modules drive the light-emitting elements to emit light, and the driving modules are electrically connected to the driving circuit board; The driving module at least includes a second flexible circuit board, the driving module is bound and electrically connected to the substrate on the second side through the second flexible circuit board, and the light emitting element is electrically connected to the second flexible circuit board.

2. The light emitting module according to claim 1, characterized in that: A light-emitting driving chip is disposed on the second flexible circuit board, and the light-emitting driving chip is bound and electrically connected to the second flexible circuit board.

3. The light emitting module according to claim 2, characterized in that: The light-emitting driving chip is located on a side of the second flexible circuit board facing the substrate.

4. The light emitting module according to claim 1, characterized in that: The substrate includes a driving circuit layer, the driving circuit layer includes a plurality of signal lines, the second side of the substrate includes a plurality of first pins, and the light emitting element is electrically connected to the first pins through the signal lines; The second flexible circuit board includes a plurality of first pads, and the first pads are bound and electrically connected to the first pins.

5. The light emitting module according to claim 4, characterized in that: The first pad is located on a side of the second flexible circuit board facing the substrate.

6. The light emitting module according to claim 1, characterized in that: The light-emitting area includes at least three sub-areas, and the three sub-areas are arranged in sequence along a direction parallel to the plane where the light-emitting panel is located; At least one of the driving modules is correspondingly arranged in one of the sub-areas.

7. The light emitting module according to claim 6, characterized in that: The three sub-areas are arranged along the first direction, and one sub-area is correspondingly provided with two driving modules; The two driving modules in one of the sub-areas are arranged along a second direction; wherein the first direction intersects with the second direction.

8. The light emitting module according to claim 1, characterized in that: Orthographic projections of at least part of the driving modules on the plane where the substrate is located are located in the non-luminous area.

9. The light emitting module according to claim 1, characterized in that: The first side of the substrate includes a plurality of capacitors and a plurality of resistors, and both the capacitors and the resistors are electrically connected to the driving circuit board.

10. The light emitting module according to claim 9, characterized in that: The capacitive device and the resistive device are located in the non-light emitting area.

11. The light emitting module according to claim 9, characterized in that: The capacitor and the resistor are located between two adjacent light emitting elements in the light emitting area.

12. The light emitting module according to claim 1, characterized in that: The substrate comprises a printed circuit board, and the light emitting element is fixedly and electrically connected to the first side of the substrate through soldering.

13. The light emitting module according to claim 1, characterized in that: The light-emitting area includes a plurality of light-emitting units, and the light-emitting units include a plurality of the light-emitting elements; One of the driving modules drives the plurality of light-emitting elements of at least one of the light-emitting units to emit light.

14. The light emitting module according to claim 1, characterized in that: The side of the light emitting element away from the substrate comprises a sealing layer, and the sealing layer covers the light emitting element.

15. The light emitting module according to claim 1, characterized in that: The light emitting module further includes a third flexible circuit board, and the driving module is electrically connected to the driving circuit board via the third flexible circuit board.

16. A display device, characterized in that: A light-emitting module comprising any one of claims 1-15.

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