Integrated circuit and method for acquiring baseline chip temperature data

Abstract

The present disclosure relates to integrated circuits and methods for acquiring baseline chip temperature data, the method comprising: in response to powering the IC, self-initializing the IC by asserting a reset signal for a reset period. The step of self-initializing the IC further comprises de-asserting the reset signal in response to the reset period expiring. The step of self-initializing the IC further comprises, in response to de-asserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a chip of the IC and storing the first temperature data in a storage component of the IC.

Description

Technical Field

[0001] This disclosure relates to integrated circuits, and more particularly to integrated circuits and methods for acquiring baseline chip temperature data for temperature calibration. Background Technology

[0002] Integrated circuits (ICs) (such as analog signal ICs, digital signal ICs, or mixed signal ICs) typically consist of a collection of electronic components (such as transistors or other suitable components) inseparably integrated onto a small portion of semiconductor material (e.g., silicon or other suitable material) called a die. Modern ICs can integrate millions or billions of electronic components on a single chip and can be used in a wide range of automotive applications such as engine control units, powertrain systems, and anti-lock braking systems, as well as other types of applications such as desktop computers, laptop computers, mobile computing devices, tablet computers, home appliances, stereo systems, medical devices, and other electronic devices.

[0003] The performance, accuracy, and / or lifespan of components in an IC can depend on the operating temperature. Temperature monitoring circuitry, including one or more thermal sensing devices at appropriate locations on the IC chip, can be incorporated to monitor the temperature at those locations and / or to modify the operation of the IC and / or to determine the integrity of the thermal path from the IC to the printed circuit board assembly (PCBA).

[0004] Calibrate the temperature monitoring circuitry of a given IC by querying the temperature reading of its thermal sensing device and comparing that reading to a reference temperature of the environment holding the IC. However, even though the IC is held at a reference temperature during calibration, self-heating of the IC chip due to the operation of its self-heating components can cause the actual temperature at a location within the IC to be significantly higher than the reference temperature. This can lead to inaccurate calibration. While calibration can be attempted in a highly controlled laboratory environment with the power supply and internal self-heating components within the IC disabled and therefore ineffective against internal self-heating, it is neither possible nor desirable to disable such calibration components for calibration when the IC is deployed in mission mode (i.e., when the IC circuitry for performing the IC's intended function is enabled so that the IC can function as intended in the system, as opposed to test mode, where the IC circuitry for performing the IC's intended function can be intentionally at least partially disabled during test mode for testing the IC). Summary of the Invention

[0005] This disclosure relates generally to integrated circuits, and more specifically to an integrated circuit and method for acquiring chip temperature data for temperature calibration.

[0006] One aspect of the disclosed embodiments is a method for acquiring temperature data of an integrated circuit (IC) chip. The method includes the steps of: in response to powering the IC, self-initializing the IC by asserting a reset signal during a reset period. Self-initialization further includes: deasserting the reset signal in response to the expiration of the reset period. Self-initialization also includes: in response to deasserting the reset signal, automatically acquiring first temperature data from at least one thermal sensing device associated with the IC chip and storing the first temperature data in a memory component of the IC.

[0007] Another aspect of the disclosed embodiments is an integrated circuit (IC). The IC includes at least one thermal sensing device. The IC also includes self-initialization logic configured to: in response to power supply to the IC, enable a reset signal during a reset period and disable the reset signal after the reset period expires. The self-initialization logic is further configured to: in response to the reset signal being disabled, automatically obtain first temperature data from the at least one thermal sensing device and store the first temperature data in a memory component of the IC.

[0008] These and other aspects of this disclosure are set forth in the following detailed description of embodiments, the appended claims and drawings. Attached Figure Description

[0009] This disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, by convention, the various features in the drawings are not to scale. Rather, for clarity, the dimensions of the various features have been arbitrarily enlarged or reduced.

[0010] Figure 1 The vehicle is generally illustrated according to the principles of this disclosure.

[0011] Figure 2 The general illustration shows an integrated circuit configured to receive power from a vehicle's battery, based on the principles of this disclosure.

[0012] Figure 3 The general illustration shows another integrated circuit configured to receive power from a vehicle's battery, based on the principles of this disclosure.

[0013] Figure 4A This is a flowchart illustrating a method for acquiring temperature data of an integrated circuit chip based on the principles of this disclosure.

[0014] Figure 4B This is a general illustration of the principles based on this disclosure. Figure 4A The flowchart shows the self-initialization aspect of the integrated circuit chip temperature data acquisition method. Detailed Implementation

[0015] The following discussion relates to various embodiments of the invention. While one or more of these embodiments may be preferred, the disclosed embodiments should not be construed as or otherwise used to limit the scope of this disclosure (including the claims). Furthermore, those skilled in the art will understand that the following description has broad application, and any discussion of any embodiment is merely meant to be an example of that embodiment and is not intended to imply that the scope of this disclosure, including the claims, is limited to that embodiment.

[0016] As described, an integrated circuit (IC) (such as an analog signal IC, a digital signal IC, or a mixed signal IC) typically comprises a set of electronic components (such as transistors or other suitable components) that are inseparably integrated onto a small portion of semiconductor material (e.g., silicon or other suitable material) called a chip. Modern ICs can integrate millions or billions of electronic components on a single chip and can be used in a wide range of automotive applications such as engine control units, powertrain systems, and anti-lock braking systems, as well as other types of applications such as desktop computers, laptop computers, mobile computing devices, tablet computers, home appliances, stereo systems, medical devices, and other electronic devices.

[0017] ICs are typically attached to a printed circuit board (PCB) substrate using solder or other thermally conductive materials that electrically connect to other ICs and electronic components on the PCB. For example, one or more leads of an IC may be soldered (e.g., thermally bonded) to the substrate to electrically connect the IC to other ICs and electronic components on the PCB and / or to each other. Solder, such as lead alloy solder or other suitable solder, provides a conductive path for electrons to flow into and out of the IC via the substrate. Typically, solder and flux (e.g., solder paste that promotes solder flow) are applied to the PCB using suitable manufacturing processes to secure and electrically connect the IC and other electronic components to the PCB (e.g., when ICs and electronic components are secured and electrically connected to the PCB, it is often referred to as a PCB assembly (PCBA)).

[0018] During PCBA manufacturing, insufficient solder application between ICs and / or other electronic components can lead to solder joint failures. Solder joint failures (e.g., solder voids or other solder joint defects) are relatively common and degrade thermal interfaces (e.g., the connection between the IC and / or other electronic components and the substrate). For example, in production environments such as end-user environments, under certain conditions (e.g., increased thermal conditions due to high power applied to the IC and / or electronic components), the solder joint between the IC and the PCB substrate may be insufficient (e.g., due to insufficient solder application). This can cause the IC to overheat or enter thermal shutdown, preventing the IC from interacting with other components on the PCB and / or other system components associated with it. Such solder joint failures can be caused by component tolerance issues, die stamping tolerances, solder printing tolerances, etc., and are often undetectable in production environments.

[0019] Temperature monitoring circuitry, including one or more thermal sensing devices at appropriate locations on the IC chip, can be incorporated to monitor the temperature at those locations and / or use the temperature at those locations to modify the operation of the IC and / or to determine the integrity of the thermal path from the IC to the printed circuit board assembly (PCBA). It can be useful to calibrate the temperature monitoring circuitry of a given IC by querying the IC for temperature readings from its thermal sensing devices and comparing those readings to a reference temperature of the environment holding the IC. However, even though the IC is held in an environment at a reference temperature during calibration, self-heating of the IC chip due to the operation of self-heating components within the IC can cause the actual temperature at a location within the IC to be significantly higher than the reference temperature. This can lead to inaccurate calibration. While calibration can be attempted in a highly controlled laboratory environment while the power supply and internal self-heating components within the IC are disabled and therefore have no effect on internal self-heating, disabling such components for calibration is neither possible nor desirable when the IC is deployed in mission mode.

[0020] Therefore, systems and methods such as those described herein may be desirable, which acquire first temperature data from at least one thermal sensing device associated with the IC chip in response to a reset signal being invalidated, the reset signal being valid in response to power supply to the IC. Acquiring temperature data in response to a reset signal being invalidated allows the first temperature data to be obtained after power has been supplied to components of the IC (including self-heating components) but before any or a great deal of self-heating has occurred. Thus, such first temperature data may reflect little or no self-heating, making the first temperature data acceptable as a sufficiently accurate baseline temperature data.

[0021] Figure 1A vehicle 10 is generally illustrated according to the principles of this disclosure. Vehicle 10 may include any suitable vehicle, such as an automobile, truck, SUV, minivan, forklift, any other passenger vehicle, any suitable commercial vehicle, or any other suitable vehicle. Although vehicle 10 is illustrated as a wheeled passenger vehicle used on roads, the principles of this disclosure can be applied to other vehicles such as airplanes, ships, trains, drones, or other suitable means of transport. Vehicle 10 includes a body 12 and a hood 14. A portion of the body 12 defines a passenger compartment 18. Another portion of the body 12 defines an engine compartment 20. The hood 14 may be movably attached to a portion of the body 12 such that when the hood 14 is in a first or open position, the hood 14 provides access to the engine compartment 20, and when the hood 14 is in a second or closed position, the hood 14 covers the engine compartment 20.

[0022] Passenger compartment 18 is located behind engine compartment 20. Vehicle 10 may include any suitable propulsion system (including internal combustion engine, one or more electric motors (e.g., electric vehicle), one or more fuel cells), hybrid propulsion system (e.g., hybrid vehicle) (including combination of internal combustion engine and one or more electric motors), and / or any other suitable propulsion system. In some embodiments, vehicle 10 may include a gasoline or gasoline-fueled engine, such as a spark-ignition engine. In some embodiments, vehicle 10 may include a diesel-fueled engine, such as a compression-ignition engine. Engine compartment 20 houses and / or encloses at least some components of the propulsion system of vehicle 10. Additionally or alternatively, propulsion controls, such as accelerator actuators (e.g., accelerator pedal), brake actuators (e.g., brake pedal), steering wheel, and other such components, are located in passenger compartment 18 of vehicle 10. The propulsion controls may be actuated or controlled by the driver of vehicle 10 and may be directly connected to corresponding components of the propulsion system, such as throttle, brakes, axles, vehicle transmission, etc. In some implementations, the propulsion control unit can transmit signals to the vehicle computer system (e.g., via wire drive), which in turn can control the corresponding propulsion components of the propulsion system.

[0023] The vehicle computer system may include various electrical and electronic components for controlling the propulsion components of the propulsion system and other vehicle subsystems such as anti-lock braking, vehicle signals, entertainment, and other subsystems. Such components may be powered by one or more vehicle batteries housed in the engine compartment 20 or another location within the vehicle 10, and may include one or more integrated circuits for handling signal processing, power regulation, and other functions of the various subsystems of the vehicle 10 controlled by the vehicle computer system.

[0024] In some embodiments, vehicle 10 includes a transmission communicated with the crankshaft via a flywheel, clutch, or fluid coupling. In some embodiments, the transmission includes a manual transmission. In some embodiments, the transmission includes an automatic transmission. In the case of an internal combustion engine or hybrid vehicle, vehicle 10 may include one or more pistons that cooperate with the crankshaft to generate force, which is transmitted through the transmission to one or more shafts that rotate the wheels 22. When vehicle 10 includes one or more electric motors, a vehicle battery and / or fuel cell provides energy to the electric motors to rotate the wheels 22. When vehicle 10 includes a vehicle battery to provide energy to one or more electric motors, when the battery is depleted, it can be connected to the power grid (e.g., using a wall socket) to recharge the battery cells. Additionally or alternatively, vehicle 10 may employ regenerative braking, which uses one or more electric motors of vehicle 10 as generators to convert kinetic energy lost due to deceleration back into stored energy in the battery.

[0025] Vehicle 10 may include an autonomous vehicle propulsion system, such as cruise control, adaptive cruise control, automatic braking control, other autonomous vehicle propulsion systems, or combinations thereof. Vehicle 10 may be an autonomous or semi-autonomous vehicle, or other suitable type of vehicle. Vehicle 10 may include more or fewer features than those generally illustrated and / or disclosed herein.

[0026] Figure 2 An integrated circuit (IC) 25 according to the principles of this disclosure is generally illustrated. IC 25 can be configured for suitable applications, such as propulsion systems, anti-lock braking systems, or some other electrical control or processing system. IC 25 may include multiple electronic components inextricably integrated and / or disposed on portions of a semiconductor material (such as silicon or other suitable semiconductor material) (referred to as chip 27). IC 25 may include a microprocessor, microcontroller, memory chip, application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), sensor, power management circuitry, operational amplifier, analog-to-digital converter, digital-to-analog converter, or other suitable IC. Additionally or alternatively, IC 25 may include an analog signal IC, a digital signal IC, or a mixed-signal IC. IC 25 may interact with one or more other ICs on the same PCBA or on another PCBA included as part of a system.

[0027] IC 25 may be configured with logic blocks of components typically assembled as groups on chip 27 to implement the logic sub-functions of IC 25. Figure 2The diagram shows self-initializing logic blocks and components according to this disclosure for resetting and acquiring and retrieving temperature of IC 25. Logic blocks and components for specific application functions (such as power drive functions involving signal processing and / or power management) are not explicitly shown, but should be understood to also be present at corresponding locations on chip 27 of IC 25.

[0028] During the manufacture of a PCBA with an IC having a similar design to IC 25, the IC can be tested to verify the adequacy of the thermal paths associated with it. The IC can be tested via in-circuit testing, mid-line testing, end-line testing, warranty testing, or a combination thereof. The thermal paths associated with the corresponding IC may include solder joints and / or other suitable thermal interfaces or connections between the IC and the associated PCB. If, during testing, the thermal paths associated with the IC are determined to be adequate or insufficient, components of the PCBA can be adjusted or repaired to correct the deficiencies in the thermal paths.

[0029] In some implementations, IC 25 may include self-initialization logic configured to self-initialize in response to power supply from a vehicle battery or other power source 28. During self-initialization, IC 25 prepares to operate with or by other components of vehicle 10, including acquiring its own baseline chip temperature data, as described herein. Power source 28 may include a current source, a voltage source, or other suitable power source. Power source 28 may include power supply circuitry including a voltage source, one or more resistors, one or more capacitors, and / or one or more other suitable electrical components. When power (e.g., voltage and / or current) is supplied by power source 28, the power flows through the components of IC 25 and into the substrate of a PCB (not shown) via a thermal connection between IC 25 and the substrate.

[0030] In some implementations, the self-initialization logic may include reset logic (RL) 30 configured to enable the reset signal RS. RL 30 is configured to enable the reset signal RS during a reset period following power supply to IC 25 from power supply 28. Other logic blocks of IC 25 can signal by enabling the reset signal RS, and in response to the enabling of the reset signal RS, can enter a reset state during the reset period, during which the internal logic state of the logic blocks can be set to a known logic start condition. After the reset period, RL 30 can deactivate the reset signal RS. Logic blocks of IC 25 can signal by deactivating the reset signal RS. In response to the deactivation of the reset signal RS, the logic blocks can exit the reset state.

[0031] In some embodiments, IC 25 includes one or more thermal sensing devices, such as one or more thermal sensing devices 50a-50f at corresponding locations on chip 27. Thermal sensing devices 50a-50f can sense the temperature of chip 27 at their respective locations. In some embodiments, each thermal sensing device 50a-50f is a thermal sensing diode. In some embodiments, analog-to-digital converter (ADC) 60 can be configured to digitally sample the electrical characteristics of thermal sensing devices 50a-50f according to a sampling period (i.e., cyclically), thereby obtaining temperature data from each thermal sensing device 50a-50f via ADC 60. In other embodiments, each ADC can be associated with a corresponding thermal sensing device, thereby simultaneously obtaining temperature data from the thermal sensing device. In some embodiments, the electrical characteristic of the thermal sensing device is the voltage across the thermal sensing device, wherein the voltage across the thermal sensing device varies according to a temperature change of the thermal sensing device. In some embodiments, the electrical characteristic is the resistance of the thermal sensing device, wherein the resistance of the thermal sensing device varies according to a temperature change of the thermal sensing device.

[0032] In some implementations, the self-initialization logic may include baseline temperature acquisition logic (BTCL) 40, which is configured to respond to the invalidation of a reset signal RS from RL 30 after the reset period has expired. In response to the invalidation of the reset signal RS, BTCL 40 can automatically acquire first temperature data from each of the thermal sensing devices 50a-50f. BTCL 40 can be configured to store the first temperature data in the storage component 70 of IC 25. By automatically acquiring the first temperature data from the thermal sensing devices 50a-50f in response to the invalidation of the reset signal RS and storing the first temperature data in the storage component 70, IC 25 can acquire the first temperature data before significant self-heating of IC 25 has been allowed to occur, without intervention from a device external to IC 25 (e.g., device 500). Therefore, the first temperature data can be considered as baseline temperature data from each of the thermal sensing devices 50a-50f of IC 25. As used herein, device 500 can be any device that communicates with IC 25, such as a main control unit (MCU), engine control unit (ECU), another IC, or some other device arranged within vehicle 10 to communicate with IC 25. Reference to device 500 that communicates with and / or receives information from IC 25 is not intended to limit IC 25 to communicating with only a single device or a class of devices. For example, depending on how the vehicle control system is configured, different devices having characteristics similar to device 500 can communicate with and / or receive information from IC 25, as described herein. However, for ease of explanation, only a single device 500 is shown and described.

[0033] In some embodiments, the storage component 70 includes separate registers 72a-72f for storing first temperature data of the respective thermal sensing devices 50a-50f.

[0034] In some implementations, the self-initialization logic of IC 25 includes Built-in Self-Test (BISTL) 100, which also performs a BIST in response to the invalidation of the reset signal RS. BIST is a routine performed by BISTL 100 after IC 25 has exited the reset state and before IC 25 enters a normal (or operating) state. BIST is used to test the logic blocks and components of IC 25 to ensure they function correctly. Performing BIST may cause some heating of components at various locations on chip 27. Therefore, in some implementations, BISTL 100 may be configured to perform BIST only after BTCL 40 stores the first temperature data. However, in other implementations, BISTL 100 may be configured to perform BIST before the first temperature data is obtained from BTCL 40, provided that performing BIST itself does not cause significant heating of the components.

[0035] In some implementations, IC 25 includes Baseline Temperature Retrieval Logic (BTRL) 80 and Temperature Readout Logic (TRL) 90. In some implementations, BTRL 80 is configured to receive a baseline temperature retrieval request from a device, such as device 500. In this document, the device making the request to IC 25 may be referred to as the requesting device. BTRL 80 is configured to, in response to the baseline temperature retrieval request, retrieve first temperature data from storage component 70 and provide the retrieved first temperature data to device 500. Therefore, a device, such as device 500, can continue to access IC 25 long after power is first applied and after IC 25 has self-initialized, to retrieve the baseline temperature acquired by BTRL 40 during self-initialization.

[0036] In some embodiments, TRL 90 is configured to obtain at least a second temperature data from each of the thermal sensing devices 50a-50f in response to receiving a temperature readout request from, for example, device 500, and to provide the second temperature data to device 500. In some embodiments, TRL 90 may enable ADC 60 to digitally sample the electrical characteristics of the thermal sensing devices 50a-50f in a manner similar to that described herein for obtaining the first temperature data via BTCL40. The second temperature data obtained in response to an additional temperature readout request from device 500, and any third or additional temperature data, can be considered as the current temperature data at the time of the temperature readout request. Thus, for example, device 500 can continue to access the current temperature data, i.e., the corresponding temperature at various locations within chip 27, via TRL 90.

[0037] In some implementations, when determining the rate of temperature rise at various locations within chip 27 along with second and subsequent temperature data, a device such as device 500 may use first temperature data retrieved from storage component 70 as baseline temperature data. This determination can be used to determine whether a thermal path is sufficient. In addition to the first temperature data being available as described herein, in some implementations, the first temperature data may also be available for one or more logic blocks of IC 25, which may retrieve and use the first temperature data during the initialization and / or operation of one or more logic blocks of IC 25.

[0038] In some implementations, the self-initialization logic may include a logic block or other configuration of a single logic block for performing a reset and obtaining and storing the temperature of at least one thermal sensing device. In some implementations, the self-initialization logic may include a logic block or other configuration of a single logic block for performing a built-in self-test. In some implementations, the self-initialization logic may not include any logic block for performing a built-in self-test. In some implementations, the activating and deactivating of the reset signal may be performed by logic on a device external to the IC, such that the IC responds to the activation and deactivation of a reset signal controlled by reset logic on another device and transmitted to the IC, such that the IC itself does not generate a reset signal or activates / deactivates the reset signal itself. Variations are possible.

[0039] Figure 3 An integrated circuit (IC) 125 according to the principles of this disclosure is generally illustrated. IC 125 can be configured for suitable applications, such as propulsion systems, anti-lock braking systems, or some other electrical control or processing system. IC 125 may include multiple electronic components inextricably integrated and / or disposed on portions (referred to as chip 127) of a semiconductor material (such as silicon or other suitable semiconductor material). IC 125 may include a microprocessor, microcontroller, memory chip, application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), sensor, power management circuitry, operational amplifier, analog-to-digital converter, digital-to-analog converter, or other suitable IC. Additionally or alternatively, IC 125 may include an analog signal IC, a digital signal IC, or a mixed-signal IC. IC 125 may interact with one or more other ICs on the same PCBA or on another PCBA included as part of a system.

[0040] IC 125 may be configured with logic blocks of components typically assembled as groups on chip 127 to implement the logic sub-functions of IC 125. Figure 3The diagram shows self-initializing logic blocks and components according to this disclosure for reset and temperature acquisition and temperature retrieval of IC 125. Logic blocks and components for specific application functions (such as power drive functions involving signal processing and / or power management) are not explicitly shown, but should be understood to also be present at corresponding locations on chip 127 of IC 125.

[0041] During the manufacture of a PCBA with an IC having a similar design to IC 125, the IC can be tested to verify the adequacy of the thermal paths associated with it. The IC can be tested via in-circuit testing, mid-line testing, end-line testing, warranty testing, or a combination thereof. The thermal paths associated with the corresponding IC may include solder joints and / or other suitable thermal interfaces or connections between the IC and the associated PCB. If, during testing, the thermal paths associated with the IC are determined to be adequate or insufficient, PCBA components can be adjusted or repaired to correct the deficiencies in the thermal paths.

[0042] In some implementations, IC 125 may include self-initialization logic configured to self-initialize in response to power supply from a vehicle battery or other power source 128. During self-initialization, IC 125 prepares to operate with or by other components of vehicle 10, including acquiring its own baseline chip temperature data, as described herein. Power source 128 may include a current source, a voltage source, or other suitable power source. Power source 128 may include power supply circuitry including a voltage source, one or more resistors, one or more capacitors, and / or one or more other suitable electrical components. When power (e.g., voltage and / or current) is supplied by power source 128, the power flows through the components of IC 125 and into the substrate of a PCB (not shown) via a thermal connection between IC 125 and the substrate.

[0043] In some implementations, the self-initialization logic may include reset logic (RL) 130 configured to enable the reset signal RS. RL 130 is configured to enable the reset signal RS during a reset period following power supply to IC 125 from power supply 128. Other logic blocks of IC 125 can signal by enabling the reset signal RS, and in response to the enablement of the reset signal RS, can enter a reset state during the reset period, during which the internal logic state of the logic blocks can be set to a known logic start condition. After the reset period, RL 130 can deactivate the reset signal RS. Logic blocks of IC 125 can signal by deactivating the reset signal RS. In response to the deactivation of the reset signal RS, the logic blocks can exit the reset state.

[0044] In some embodiments, IC 125 includes one or more thermal sensing devices, such as one or more thermal sensing devices 150a-150f at corresponding locations on chip 127. Thermal sensing devices 150a-150f can sense the temperature of chip 127 at their respective locations. In some embodiments, each thermal sensing device 150a-150f is a thermal sensing diode. In some embodiments, analog-to-digital converter (ADC) 160 can be configured to digitally sample the electrical characteristics of thermal sensing devices 150a-150f according to a sampling period (i.e., cyclically), thereby obtaining temperature data from each thermal sensing device 150a-150f via ADC 160. In other embodiments, each ADC can be associated with a corresponding thermal sensing device, thereby simultaneously obtaining temperature data from the thermal sensing device. In some embodiments, the electrical characteristic of the thermal sensing device is the voltage across the thermal sensing device, wherein the voltage across the thermal sensing device varies according to a temperature change of the thermal sensing device. In some embodiments, the electrical characteristic is the resistance of the thermal sensing device, wherein the resistance of the thermal sensing device varies according to a temperature change of the thermal sensing device.

[0045] In some implementations, the self-initialization logic may include baseline temperature acquisition logic (BTCL) 140, which is configured to respond to the invalidation of a reset signal RS from RL 130 after the reset period has expired. In response to the invalidation of the reset signal RS, BTCL 140 can automatically acquire first temperature data from each of the thermal sensing devices 150a-150f. BTCL 140 can be configured to store the first temperature data in the storage component 170 of IC 125. By automatically acquiring the first temperature data from the thermal sensing devices 150a-150f in response to the invalidation of the reset signal RS and storing the first temperature data in the storage component 170, IC 125 can acquire the first temperature data before significant self-heating of IC 125 has been allowed to occur, without intervention from a device external to IC 125 (e.g., device 600). Therefore, the first temperature data can be considered as baseline temperature data for each of the thermal sensing devices 150a-150f of IC 125. As used herein, device 600 can be any device that communicates with IC 125, such as a main control unit (MCU), engine control unit (ECU), another IC, or some other device arranged within vehicle 10 to communicate with IC 125. Reference to device 600 that communicates with and / or receives information from IC 125 is not intended to limit IC 125 to communicating with only a single device or a class of devices. For example, depending on how the vehicle control system is configured, different devices having characteristics similar to device 600 can communicate with and / or receive information from IC 125, as described herein. However, for ease of explanation, only a single device 600 is shown and described.

[0046] In some embodiments, the storage component 170 includes separate registers 172a-172f for storing first temperature data of the respective thermal sensing devices 150a-150f.

[0047] In some implementations, the self-initialization logic of IC 125 includes Built-in Self-Test (BISTL) 200, which also performs a BIST in response to the invalidation of the reset signal RS. BIST is a routine performed by BISTL 200 after IC 125 has exited the reset state and before IC 125 enters a normal (or operating) state. BIST is used to test the logic blocks and components of IC 125 to ensure they function correctly. Performing BIST may cause some heating of components at various locations on chip 127. Therefore, in some implementations, BISTL 200 may be configured to perform BIST only after BTCL 140 stores the first temperature data. However, in other implementations, BISTL 200 may be configured to perform BIST before the first temperature data is obtained from BTCL 140, provided that performing BIST itself does not cause significant heating of the components.

[0048] In some implementations, IC 125 includes Baseline Temperature Retrieval Logic (BTRL) 180 and Temperature Readout Logic (TRL) 190. In some implementations, BTRL 180 is configured to receive a baseline temperature retrieval request from a device, such as device 600. Hereinafter, the device making the request to IC 125 may be referred to as the requesting device. BTRL 180 is configured to retrieve first temperature data from storage component 170 in response to a baseline temperature retrieval request and provide the retrieved first temperature data to device 600. Therefore, a device, such as device 600, can continue to access IC 125 long after power is first applied and after IC 125 has self-initialized to retrieve the baseline temperature acquired by BTRL 140 during self-initialization.

[0049] In some embodiments, TRL 190 is configured to obtain at least a second temperature data from each of the thermal sensing devices 150a-150f and provide the second temperature data to device 600 in response to receiving a temperature readout request from, for example, device 600. In some embodiments, TRL 190 may enable ADC 160 to digitally sample the electrical characteristics of the thermal sensing devices 150a-150f in a manner similar to that described herein in conjunction with BTCL 140 for obtaining the first temperature data. The second temperature data obtained in response to an additional temperature readout request from device 600 and any third or additional temperature data can be considered as the current temperature data at the time of the temperature readout request. Therefore, device 600, for example, can continue to access the current temperature data, i.e., the corresponding temperature at various locations within chip 127, via TRL 190.

[0050] In some implementations, when determining the rate of temperature rise at various locations within chip 127 along with second and subsequent temperature data, a device such as device 600 may use first temperature data retrieved from storage component 170 as baseline temperature data. This determination can be used to determine whether a thermal path is sufficient. In addition to the first temperature data being available as described herein for devices such as device 600, in some implementations, the first temperature data may also be available for one or more logic blocks of IC 125, which may retrieve and use the first temperature data during the initialization and / or operation of one or more logic blocks of IC 125.

[0051] In some implementations, the self-initialization logic may include a logic block or other configuration of a single logic block for performing a reset and obtaining and storing the temperature of at least one thermal sensing device. In some implementations, the self-initialization logic may include a logic block or other configuration of a single logic block for performing a built-in self-test. In some implementations, the self-initialization logic may not include any logic block for performing a built-in self-test. In some implementations, the activating and deactivating of the reset signal may be performed by logic on a device external to the IC, such that the IC responds to the activation and deactivation of a reset signal controlled by reset logic on another device and transmitted to the IC, such that the IC itself does not generate a reset signal or activates / deactivates the reset signal itself. Variations are possible.

[0052] In some implementations, IC 125 may include Temporary Temperature Acquisition Logic (ITCL) 220, which is configured to automatically acquire third temperature data from thermal sensing devices 150a-150f at some point after initialization when self-heating may occur due to the operation of IC 125. ITCL 220 may be configured to store the third temperature data in storage component 210 of IC 125. By automatically acquiring the third temperature data from thermal sensing devices 150a-150f and storing it in storage component 210, IC 125 can acquire the third temperature data after self-heating of IC 125 without intervention from a device such as device 600. The third temperature data can therefore be considered temporary temperature data of the thermal sensing devices 150a-150f of IC 125. The acquisition and storage of this temporary temperature data can be used in conjunction with the baseline temperature data described herein to determine the rate of temperature rise at the location of chip 127, or to enable IC 125 to automatically detect temperatures rising above a threshold temperature and / or multiple threshold temperatures without intervention or requests from devices such as device 600. IC 125 may include logic blocks to enable IC 125 to self-regulate its operation based on this automatic detection of temperature rises associated with the threshold temperature and / or multiple threshold temperatures. As used herein, device 600 can be any device communicating with IC 125, such as a main control unit (MCU), engine control unit (ECU), another IC, or other devices arranged within vehicle 10 to communicate with IC 125. Reference to device 600 communicating with and / or receiving information from IC 125 is not intended to limit IC 125 to communicating with only a single device or a class of devices. For example, depending on how the vehicle control system is configured, different devices with characteristics similar to device 600 can communicate with and / or receive information from IC 125, as described herein. However, for ease of explanation, only a single device 600 is shown and described.

[0053] In some implementations, storage component 210 includes separate registers 172a'-172f' for storing first temperature data of the respective thermal sensing devices 150a-150f.

[0054] In some implementations, IC 125 includes Temporary Temperature Retrieval Logic (ITRL) 230. In some implementations, ITRL 230 is configured to receive a temporary temperature retrieval request from a device such as device 600. Hereinafter, the device making the request for IC 125 may be referred to as the requesting device. ITRL 230 is configured to retrieve third temperature data from storage component 210 in response to the temporary temperature retrieval request and provide the retrieved third temperature data to device 600. Thus, a device such as device 600 can continue to access IC 125 long after power is first applied and after IC 125 self-initialization to retrieve the temporary temperature acquired by ITRL 220 during self-initialization.

[0055] In some implementations, such as device 600, when determining the rate of temperature rise at various locations within chip 127, may use first temperature data retrieved from memory component 170 as baseline temperature data, along with third temperature data retrieved from memory component 210 as provisional temperature data, and any additional temperature data retrieved via TRL 190. This determination can be used to determine whether a thermal path is sufficient. In addition to the third temperature data being available in devices such as device 600 as described herein, in some implementations, the third temperature data may also be available in one or more logic blocks of IC 125, which may retrieve and use the third temperature data during operation of one or more logic blocks of IC 125.

[0056] Figure 4A This is a flowchart illustrating an integrated circuit (IC) chip temperature acquisition method 300 according to the principles of this disclosure. In some embodiments, at 310, power is supplied to the IC, and at 320, in response to the power supply to the IC, the IC self-initializes.

[0057] Figure 4B This provides a more detailed illustration of the principles based on this disclosure. Figure 4A A flowchart of a general aspect of self-initialization at point 320 is provided. In some embodiments, self-initialization includes activating a reset signal during a reset period at point 322. At point 324, self-initialization includes deactivating the reset signal in response to the expiration of the reset period. At point 326, self-initialization includes automatically acquiring first temperature data from at least one thermal sensing device associated with the chip of the IC in response to the reset signal being deactivated. At point 326, self-initialization also includes storing the first temperature data in a memory component of the IC.

[0058] In some embodiments, self-initialization further includes performing a built-in self-test (BIST) of the IC in response to invalidating a reset signal. In some embodiments, performing BIST includes performing BIST after storage. Performing BIST after storage ensures that the first temperature data is unaffected by component self-heating caused by BIST, where BIST itself may cause component self-heating and thus chip self-heating. However, in some embodiments, performing BIST includes performing BIST before obtaining the first temperature data. In some embodiments, performing BIST includes performing BIST simultaneously with obtaining the first temperature data.

[0059] In some implementations, the step of storing the first temperature data in the storage component of the IC includes storing the first temperature data obtained from at least one thermal sensing device in a corresponding register in the IC.

[0060] In some implementations, the step of obtaining first temperature data from at least one thermal sensing device associated with the IC chip includes digitally sampling the electrical characteristics of the at least one thermal sensing device.

[0061] In some embodiments, the at least one thermal sensing device includes a plurality of thermal sensing devices, and digital sampling includes digitally sampling the electrical characteristics of each of the plurality of thermal sensing devices according to a sampling period using an analog-to-digital converter (ADC).

[0062] In some embodiments, the method includes the steps of: receiving a temperature read request from a requesting device; obtaining second temperature data from at least one thermal sensing device in response to receiving the temperature read request; and providing the second temperature data to the requesting device. In some embodiments, obtaining the second temperature data from the at least one thermal sensing device includes digitally sampling the electrical characteristics of the at least one thermal sensing device.

[0063] In some implementations, the method includes the steps of: receiving a baseline temperature retrieval request from a requesting device; retrieving first temperature data from a storage component of an IC in response to receiving the baseline temperature retrieval request; and providing the first temperature data retrieved from the storage component of the IC to the requesting device.

[0064] In some embodiments, the at least one thermal sensing device includes a thermal sensing diode.

[0065] In some implementations, at a certain time after initialization, and in response to elapsed time or in response to the satisfaction of another threshold condition, third temperature data can be automatically obtained by the IC from at least one thermal sensing device. In some implementations, the third temperature data can be stored as temporary temperature data in the IC's storage component. In some implementations, storing the third temperature data in the IC's storage component includes storing the third temperature data obtained from at least one thermal sensing device in a corresponding register in the IC, different from the register storing the corresponding first temperature data. Therefore, the IC can simultaneously store first temperature data or baseline temperature data and third temperature data or temporary temperature data, and can provide the device with access to the stored baseline temperature data and / or temporary temperature data.

[0066] In some implementations, the step of obtaining third temperature data from at least one thermal sensing device associated with the IC chip includes digitally sampling the electrical characteristics of at least one thermal sensing device.

[0067] In some implementations, the method includes the steps of: receiving a temporary temperature retrieval request from a requesting device; retrieving third temperature data from a storage component of an IC in response to receiving the temporary temperature retrieval request; and providing the third temperature data retrieved from the storage component of the IC to the requesting device.

[0068] The foregoing discussion is intended to illustrate the principles and various embodiments of the invention. Many variations and modifications will become apparent to those skilled in the art once the foregoing disclosure is fully understood. The appended claims are intended to be construed as covering all such variations and modifications.

[0069] The word “example” is used herein to mean used as an example, instance, or illustration. Any aspect or design described herein as an “example” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the word “example” is intended to present the concept in a specific manner. As used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise stated or clearly apparent from the context, “X comprises A or B” is intended to mean any natural substitution of inclusion. That is, “X comprises A or B” is satisfied in any of the foregoing cases if X comprises A; X comprises B; or X comprises both A and B. Additionally, the articles “a” and “an” used in this application and the appended claims should generally be interpreted as meaning “one or more” unless otherwise stated or clearly indicated from the context. Furthermore, the use of the terms “implementation” or “an implementation” throughout the text is not intended to indicate the same implementation or mode of execution unless such a description is made.

[0070] The systems, algorithms, methods, instructions, etc., described herein can be implemented in hardware, software, or any combination thereof. Hardware may include, for example, a computer, intellectual property (IP) core, application-specific integrated circuit (ASIC), programmable logic array, optical processor, programmable logic controller, microcode, microcontroller, server, microprocessor, digital signal processor, or any other suitable circuit. In the claims, the term "processor" should be understood to encompass any of the aforementioned hardware, individually or in combination. The terms "signal" and "data" are used interchangeably.

[0071] As used herein, the term "module" can include a packaged functional hardware unit designed for use with other components, an instruction set executable by a controller (e.g., a processor executing software or firmware), processing circuitry configured to perform a specific function, and a separate hardware or software component that interfaces with a larger system. For example, a module can include application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), circuits, digital logic circuits, analog circuits, combinations of discrete circuits, gates, logic blocks, and other types of hardware or combinations thereof. In other embodiments, a module can include memory storing instructions executable by a controller to implement the features of the module.

[0072] The above-described embodiments, implementations, and aspects have been provided to facilitate understanding of the invention without limiting it. Rather, the invention is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims, which should be interpreted in the broadest sense to cover all such modifications and equivalent structures permitted by law.

Claims

1. A method for acquiring temperature data of an integrated circuit (IC) chip, the method comprising the following steps: In response to powering the IC, the IC is self-initialized through the following steps: Make the reset signal valid during the reset period; In response to the expiration of the reset period, the reset signal is invalidated; as well as In response to invalidating the reset signal, automatically: First temperature data is obtained from at least one thermal sensing device associated with the chip of the IC; and The first temperature data is stored in the storage component of the IC.

2. The method according to claim 1, wherein, The steps for enabling the IC to self-initialize also include: In response to invalidating the reset signal, the built-in self-test BIST is performed.

3. The method according to claim 2, wherein, The steps for performing the BIST include: The BIST is performed after the storage.

4. The method according to claim 1, wherein, The step of storing the first temperature data in the storage component of the IC includes: The first temperature data obtained from the at least one thermal sensing device is stored in a corresponding register in the IC.

5. The method according to claim 1, wherein, The step of obtaining the first temperature data from the at least one thermal sensing device associated with the chip of the IC includes: The electrical characteristics of the at least one thermal sensing device are digitally sampled.

6. The method according to claim 5, wherein, The at least one thermal sensing device includes multiple thermal sensing devices, wherein digital sampling includes: The electrical characteristics of each of the plurality of thermal sensing devices are digitally sampled according to a sampling period using an analog-to-digital converter (ADC).

7. The method according to claim 1, further comprising the following steps: Receive a temperature read request from the requesting device; In response to receiving the temperature reading request, second temperature data is obtained from the at least one thermal sensing device; as well as The second temperature data is provided to the requesting device.

8. The method according to claim 7, wherein, The step of obtaining the second temperature data from the at least one thermal sensing device includes: The electrical characteristics of the at least one thermal sensing device are digitally sampled.

9. The method according to claim 1, further comprising the following steps: Receive a baseline temperature retrieval request from the requesting device; In response to receiving the baseline temperature retrieval request, the first temperature data is retrieved from the storage component of the IC; as well as The first temperature data retrieved from the storage component of the IC is provided to the requesting device.

10. The method according to claim 1, wherein, The at least one thermal sensing device includes a thermal sensing diode.

11. An integrated circuit IC, the IC comprising: At least one thermal sensing device; as well as Self-initialization logic, configured to respond to supplying power to the IC: The reset signal is made valid during the reset period and invalidated after the reset period expires. and In response to the reset signal being invalidated, first temperature data is automatically obtained from the at least one thermal sensing device and the first temperature data is stored in the storage component of the IC.

12. The IC according to claim 11, wherein, The self-initialization logic is also configured to respond to the reset signal being invalidated: Perform the built-in self-test BIST.

13. The IC according to claim 12, wherein, The self-initialization logic is configured to perform the BIST after the first temperature data is stored.

14. The IC according to claim 11, wherein, The self-initialization logic is configured to store the first temperature data from the at least one thermal sensing device in a corresponding register in the IC.

15. The IC according to claim 11, wherein, The self-initialization logic is configured to digitally sample the electrical characteristics of the at least one thermal sensing device.

16. The IC according to claim 15, wherein, The at least one thermal sensing device includes a plurality of thermal sensing devices, wherein the self-initialization logic is configured to digitally sample the electrical characteristics of each of the plurality of thermal sensing devices according to a sampling period using an analog-to-digital converter (ADC).

17. The IC according to claim 11, further comprising: Temperature reading logic, wherein the temperature reading logic is configured to: Receive a temperature read request from the requesting device; In response to the temperature read request, second temperature data is obtained from the at least one thermal sensing device; and The second temperature data is provided to the requesting device.

18. The IC according to claim 17, wherein, The temperature reading logic is configured to digitally sample the electrical characteristics of the at least one thermal sensing device.

19. The IC according to claim 11, further comprising: Baseline temperature retrieval logic, wherein the baseline temperature retrieval logic is configured to: Receive a baseline temperature retrieval request from the requesting device; In response to the baseline temperature retrieval request, the first temperature data is retrieved from the storage component of the IC; and The first temperature data retrieved from the storage component of the IC is provided to the requesting device.

20. The IC according to claim 11, wherein, The at least one thermal sensing device includes a thermal sensing diode.

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